JP2008159908A - Bending structure of flexible circuit board - Google Patents

Bending structure of flexible circuit board Download PDF

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JP2008159908A
JP2008159908A JP2006347966A JP2006347966A JP2008159908A JP 2008159908 A JP2008159908 A JP 2008159908A JP 2006347966 A JP2006347966 A JP 2006347966A JP 2006347966 A JP2006347966 A JP 2006347966A JP 2008159908 A JP2008159908 A JP 2008159908A
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flexible circuit
circuit board
bending
substrate fixing
inter
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Kumo Cho
雲 趙
Yuji Ohira
裕二 大平
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Teikoku Tsushin Kogyo Co Ltd
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Teikoku Tsushin Kogyo Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a bending structure of a flexible circuit board capable of easily and surely bending it at a desired position. <P>SOLUTION: Both sides 11a and 11b, facing each other, of a flexible circuit board 10 include inter-board fixing parts 13a and 13b as well as bending positioning parts 15a and 15b. The flexible circuit board 10 is bent along the line connecting both bending positioning parts 15a and 15b, and overlapped inter-board fixing parts 13a and 13b are secured. A reinforcing plate 60 is interposed between overlapping parts of the flexible circuit board 10, and a board fixing tape 50 is fitted to the outer periphery of the overlapping part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明はフレキシブル回路基板の折り曲げ構造に関するものである。   The present invention relates to a flexible circuit board folding structure.

従来、フレキシブル回路基板は、可撓性を有する合成樹脂フイルム上に所望の回路パターンを形成して構成されている。この種のフレキシブル回路基板は容易に撓むので、このフレキシブル回路基板を撓めることで、硬質基板では設置できない空間にも容易に設置することができる。またフレキシブル回路基板を帯状（ケーブル状）に形成すれば、このフレキシブル回路基板を他の回路基板への接続用の連結部として使用することもでき、その際このフレキシブル回路基板を屈曲させることで、折れ曲がったスペースを容易に通過させたり、フレキシブル回路基板上に形成した回路パターンの表裏を逆転させたりすることもできる。   Conventionally, a flexible circuit board is configured by forming a desired circuit pattern on a flexible synthetic resin film. Since this type of flexible circuit board is easily bent, the flexible circuit board can be easily installed in a space that cannot be installed with a hard board. Also, if the flexible circuit board is formed in a strip shape (cable shape), this flexible circuit board can also be used as a connecting portion for connection to another circuit board, and in this case, by bending the flexible circuit board, The bent space can be easily passed, or the front and back of the circuit pattern formed on the flexible circuit board can be reversed.

これらのことから従来、フレキシブル回路基板を所定の位置で容易且つ確実に屈曲させることが望まれていた。
特開平７−９４８３５号公報 For these reasons, it has been conventionally desired to bend the flexible circuit board easily and reliably at a predetermined position.
JP-A-7-94835

本発明は上述の点に鑑みてなされたものでありその目的は、フレキシブル回路基板を所望の位置で容易且つ確実に折り曲げることができるフレキシブル回路基板の折り曲げ構造を提供することにある。   The present invention has been made in view of the above points, and an object of the present invention is to provide a flexible circuit board folding structure capable of easily and reliably folding a flexible circuit board at a desired position.

本願請求項１に記載の発明は、フレキシブル回路基板の対向する両辺にそれぞれ基板間固定部を設け、前記基板間固定部が重ね合わさるように前記フレキシブル回路基板を折り曲げ、前記重ね合わせた基板間固定部を固定することを特徴とするフレキシブル回路基板の折り曲げ構造にある。   According to the first aspect of the present invention, an inter-substrate fixing part is provided on each of opposite sides of the flexible circuit board, the flexible circuit board is bent so that the inter-substrate fixing part is overlapped, and the superposed inter-substrate fixing is performed. The flexible circuit board bend structure is characterized in that the portion is fixed.

本願請求項２に記載の発明は、前記フレキシブル回路基板の対向する両辺にそれぞれ折曲用位置決め部を設け、前記両折曲用位置決め部を結ぶ線に沿って前記フレキシブル回路基板を折り曲げたことを特徴とする請求項１に記載のフレキシブル回路基板の折り曲げ構造にある。   In the invention according to claim 2 of the present invention, a bending positioning part is provided on each of opposite sides of the flexible circuit board, and the flexible circuit board is bent along a line connecting the both bending positioning parts. The flexible circuit board folding structure according to claim 1, wherein the flexible circuit board is folded.

本願請求項３に記載の発明は、前記フレキシブル回路基板の一方の辺に設ける前記基板間固定部と前記折曲用位置決め部の配列と、他方の辺に設ける前記基板間固定部と前記折曲用位置決め部の配列とが、逆向きであることを特徴とする請求項２に記載のフレキシブル回路基板の折り曲げ構造にある。   The invention according to claim 3 is an arrangement of the inter-substrate fixing portion and the bending positioning portion provided on one side of the flexible circuit board, and the inter-substrate fixing portion and the bending provided on the other side. 3. The flexible circuit board folding structure according to claim 2, wherein the arrangement of the positioning portions for use is opposite.

本願請求項４に記載の発明は、フレキシブル回路基板の対向する両辺にそれぞれ折曲用位置決め部を設け、前記両折曲用位置決め部を結ぶ線に沿って前記フレキシブル回路基板を折り曲げたことを特徴とするフレキシブル回路基板の折り曲げ構造にある。   The invention according to claim 4 of the present application is characterized in that a bending positioning part is provided on each of opposite sides of the flexible circuit board, and the flexible circuit board is bent along a line connecting the both bending positioning parts. The flexible circuit board is bent.

本願請求項５に記載の発明は、前記折り曲げによってフレキシブル回路基板を重ね合わせた部分に、基板固定用テープを取り付けたことを特徴とする請求項１乃至４の内の何れかに記載のフレキシブル回路基板の折り曲げ構造にある。   5. The flexible circuit according to claim 1, wherein a tape for fixing the substrate is attached to a portion where the flexible circuit substrates are overlapped by the bending. The substrate is bent.

本願請求項６に記載の発明は、前記フレキシブル回路基板の重ね合わさる部分の間に、補強板を設置したことを特徴とする請求項１乃至５の内の何れかに記載のフレキシブル回路基板の折り曲げ構造にある。   The invention according to claim 6 of the present application is characterized in that a reinforcing plate is provided between the overlapping portions of the flexible circuit boards, wherein the flexible circuit board is bent according to any one of claims 1 to 5. In the structure.

請求項１に記載の発明によれば、フレキシブル回路基板を折り曲げることで重ね合わせた一対の基板間固定部間を固定するので、フレキシブル回路基板の所定の位置を容易且つ確実に折り曲げることができる。   According to the first aspect of the present invention, the pair of inter-substrate fixing portions that are overlapped are fixed by bending the flexible circuit board, so that the predetermined position of the flexible circuit board can be easily and reliably bent.

請求項２に記載の発明によれば、一対の折曲用位置決め部を結ぶ線に沿ってフレキシブル回路基板を折り曲げるだけで、フレキシブル回路基板の折り曲げようとする位置を容易且つ確実に折り曲げることができる。   According to the second aspect of the present invention, it is possible to easily and reliably bend the position where the flexible circuit board is to be folded by simply folding the flexible circuit board along the line connecting the pair of folding positioning portions. .

請求項３に記載の発明によれば、一対の折曲用位置決め部を結ぶ線に沿ってフレキシブル回路基板を折り曲げるだけで、容易に一対の基板間固定部を重ね合わせることができる。   According to the third aspect of the present invention, the pair of inter-substrate fixing portions can be easily overlapped simply by bending the flexible circuit board along a line connecting the pair of bending positioning portions.

請求項４に記載の発明によれば、一対の折曲用位置決め部を結ぶ線に沿ってフレキシブル回路基板を折り曲げるだけで、フレキシブル回路基板の折り曲げようとする位置を容易且つ確実に折り曲げることができる。   According to the fourth aspect of the present invention, it is possible to easily and reliably bend the position of the flexible circuit board by simply folding the flexible circuit board along the line connecting the pair of bending positioning portions. .

請求項５に記載の発明によれば、基板固定用テープを取り付けたので、折り曲げによってフレキシブル回路基板を重ね合わせた部分を容易に固定することができる。また折り曲げた部分を基板固定用テープによって保護することもできる。   According to the fifth aspect of the present invention, since the substrate fixing tape is attached, it is possible to easily fix the portion where the flexible circuit boards are overlapped by bending. Further, the bent portion can be protected by a substrate fixing tape.

請求項６に記載の発明によれば、重ね合わせるフレキシブル回路基板の間に補強板を設置したので、折り曲げた部分の強度を補強できるばかりか、補強板の外周辺を利用して容易にフレキシブル回路基板を折り曲げることができる。   According to the invention described in claim 6, since the reinforcing plate is installed between the flexible circuit boards to be overlapped, the strength of the bent portion can be reinforced, and the flexible circuit can be easily used by utilizing the outer periphery of the reinforcing plate. The substrate can be bent.

以下、本発明の実施形態を図面に基づいて詳細に説明する。
図１は本発明の１実施形態に用いるフレキシブル回路基板の折り曲げ前の各部品の分解斜視図である。同図に示すようにこの実施形態にかかるフレキシブル回路基板の折り曲げ構造は、折り曲げようとするフレキシブル回路基板１０と、基板固定用テープ５０と、補強板６０とを具備して構成されている。以下各構成部品について説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an exploded perspective view of components before bending of a flexible circuit board used in one embodiment of the present invention. As shown in the figure, the flexible circuit board folding structure according to this embodiment includes a flexible circuit board 10 to be bent, a board fixing tape 50, and a reinforcing plate 60. Each component will be described below.

フレキシブル回路基板１０はこの実施形態では長尺帯状の可撓性を有する合成樹脂フイルム１１の一方の表面に、平行な複数本（この実施形態では６本）の回路パターン２１をスクリーン印刷等の印刷によって形成し、両端に形成されるリードアウト部２３となる部分及び下記する基板間固定部１３ａ，１３ｂと折曲用位置決め部１５ａ，１５ｂの部分を除いて回路パターン２１の表面を絶縁層２５で覆って構成されている。つまりリードアウト部２３の部分だけに回路パターン２１が露出し、この部分がリードアウトパターン２１ａとなる。なお合成樹脂フイルム１１のリードアウトパターン２１ａを設けた面の裏面には、リードアウト部２３の硬度を高める樹脂フイルムからなる補強板２７が貼り付けられている。   In this embodiment, the flexible circuit board 10 has a plurality of parallel (six in this embodiment) circuit patterns 21 printed on one surface of a synthetic resin film 11 having a long belt-like flexibility such as screen printing. The surface of the circuit pattern 21 is covered with an insulating layer 25 except for the portions to be the lead-out portions 23 formed at both ends and the portions between the inter-substrate fixing portions 13a and 13b and the bending positioning portions 15a and 15b described below. It is configured to cover. That is, the circuit pattern 21 is exposed only in the lead-out portion 23, and this portion becomes the lead-out pattern 21a. A reinforcing plate 27 made of a resin film for increasing the hardness of the lead-out portion 23 is attached to the back surface of the surface of the synthetic resin film 11 provided with the lead-out pattern 21a.

合成樹脂フイルム１１は絶縁性であって可撓性を有し、この実施形態では厚み７５μｍの熱可塑性のポリエチレンテレフタレート（ＰＥＴ）フイルムを用いている。なお合成樹脂フイルム１１の材質としては、ＰＥＴフイルム以外にも、各種熱可塑性樹脂，熱硬化性樹脂フイルム、例えばポリフェニレンスルフイド（ＰＰＳ）フイルム、ポリイミド（ＰＩ）フィルム、ポリエチレンナフタレート（ＰＥＮ）フイルム、ポリエーテルイミド（ＰＥＩ）フイルム、ポリエーテルエーテルケトン（ＰＥＥＫ）フイルム、ポリエーテルケトン（ＰＥＫ）フイルム、ポリカーボネート（ＰＣ）フイルム、ポリブチレンナフタレート（ＰＢＮ）フイルム、ポリブチレンテレフタレート（ＰＢＴ）フイルム等、各種材質のものが使用でき、さらにＵＶ硬化フイルム等を用いてもよい。   The synthetic resin film 11 is insulative and flexible. In this embodiment, a thermoplastic polyethylene terephthalate (PET) film having a thickness of 75 μm is used. In addition to the PET film, the synthetic resin film 11 may be made of various thermoplastic resins, thermosetting resin films such as polyphenylene sulfide (PPS) film, polyimide (PI) film, polyethylene naphthalate (PEN) film. , Polyetherimide (PEI) film, polyetheretherketone (PEEK) film, polyetherketone (PEK) film, polycarbonate (PC) film, polybutylene naphthalate (PBN) film, polybutylene terephthalate (PBT) film, etc. Various materials can be used, and a UV curable film or the like may be used.

ここで合成樹脂フイルム１１の対向する平行な両辺１１ａ，１１ｂの内の一方の辺１１ａには基板間固定部１３ａと折曲用位置決め部１５ａとが１つずつ設けられ、同様に他方の辺１１ｂにも基板間固定部１３ｂと折曲用位置決め部１５ｂとが１つずつ設けられている。これら各基板間固定部１３ａ，１３ｂと折曲用位置決め部１５ａ，１５ｂは、それぞれの辺１１ａ，１１ｂから舌片状に外方（辺に垂直な方向）に向けて突出している。そして一方の辺１１ａに設ける基板間固定部１３ａと折曲用位置決め部１５ａの配列と、他方の辺１１ｂに設ける基板間固定部１３ｂと折曲用位置決め部１５ｂの配列とは逆向き（互い違い、又はたすき掛けの位置）になっている。さらにこの実施形態では一方の基板間固定部１３ａの辺１１ａに垂直な方向の辺１１ｂの位置に折曲用位置決め部１５ｂを設け、一方の折曲用位置決め部１５ａの辺１１ａに垂直な方向の辺１１ｂの位置に基板間固定部１３ｂを設けている。つまり一対の基板間固定部１３ａ，１３ｂと、一対の折曲用位置決め部１５ａ，１５ｂは、長方形（正方形を含む）の各頂点に位置するように設置されている。   Here, one of the opposing parallel sides 11a and 11b of the synthetic resin film 11 is provided with one inter-substrate fixing portion 13a and one bending positioning portion 15a, and similarly, the other side 11b. In addition, one inter-substrate fixing portion 13b and one bending positioning portion 15b are provided. These inter-substrate fixing portions 13a and 13b and the bending positioning portions 15a and 15b protrude outward (in a direction perpendicular to the sides) in a tongue shape from the respective sides 11a and 11b. And the arrangement of the inter-substrate fixing portion 13a and the bending positioning portion 15a provided on one side 11a and the arrangement of the inter-substrate fixing portion 13b and the bending positioning portion 15b provided on the other side 11b are in opposite directions (alternately, Or the position of the tack. Furthermore, in this embodiment, a bending positioning portion 15b is provided at a position of a side 11b in a direction perpendicular to the side 11a of one inter-substrate fixing portion 13a, and a direction perpendicular to the side 11a of the one bending positioning portion 15a is provided. An inter-substrate fixing portion 13b is provided at the position of the side 11b. That is, the pair of inter-substrate fixing portions 13a and 13b and the pair of bending positioning portions 15a and 15b are installed so as to be positioned at the vertices of a rectangle (including a square).

回路パターン２１はこの実施形態では導電ペーストをスクリーン印刷によって塗布して構成されている。導電ペーストとしてこの実施形態では銀ペースト〔溶剤に溶かしたウレタン系，フェノール系等の樹脂材に銀粉を混練したもの〕を用いているが、カーボンペースト〔溶剤に溶かしたウレタン系，フェノール系等の樹脂材にカーボン粉を混練したもの〕等の金属粉以外の導電粉を用いた導電ペーストを用いても良い。また導電ペーストの印刷以外に、銅箔をエッチングしたり、蒸着膜などによる回路パターン２１であってもよい。   In this embodiment, the circuit pattern 21 is formed by applying a conductive paste by screen printing. In this embodiment, a silver paste (a urethane-based, phenol-based resin material kneaded with silver powder) is used as the conductive paste, but a carbon paste (a urethane-based, phenol-based, etc. dissolved in a solvent) is used. A conductive paste using conductive powder other than metal powder, such as a resin material in which carbon powder is kneaded, may be used. In addition to the printing of the conductive paste, the circuit pattern 21 may be formed by etching a copper foil or a deposited film.

絶縁層２５はこの実施形態では、絶縁塗料（ウレタン系樹脂や紫外線硬化型の合成樹脂等）を塗布することで形成されているが、絶縁塗料の代わりに、絶縁性の合成樹脂フイルムを貼り付けてもよい。   In this embodiment, the insulating layer 25 is formed by applying an insulating paint (such as urethane resin or UV curable synthetic resin), but an insulating synthetic resin film is attached instead of the insulating paint. May be.

次に基板固定用テープ５０は、可撓性を有する帯状の薄い合成樹脂フイルムの一方の面に粘着層を設けて構成されている。この実施形態では合成樹脂フイルムとして厚み２５μｍのＰＥＴフイルムを使用しているが、前記合成樹脂フイルム１１と同様に他の各種材質及び厚みの合成樹脂フイルムを用いてもよい。   Next, the substrate fixing tape 50 is configured by providing an adhesive layer on one surface of a flexible belt-like thin synthetic resin film. In this embodiment, a PET film having a thickness of 25 μm is used as the synthetic resin film, but synthetic resin films having various materials and thicknesses may be used in the same manner as the synthetic resin film 11.

補強板６０は、比較的硬質の合成樹脂（例えばＡＢＳ樹脂やポリカーボネート樹脂等）製の板を略三角形状（直角三角形状）に形成して構成されている。この形状は、フレキシブル回路基板１０を折り曲げた際にフレキシブル回路基板１０が重なり合う基板重畳部分とほぼ同一の形状である。また補強板６０の一辺（斜辺）６０ａは、下記するフレキシブル回路基板１０を折り曲げる折り曲げ線１７に一致する折り曲げ補助辺となっている。   The reinforcing plate 60 is configured by forming a plate made of a relatively hard synthetic resin (for example, ABS resin or polycarbonate resin) into a substantially triangular shape (right-angled triangular shape). This shape is almost the same shape as the substrate overlapping portion where the flexible circuit board 10 overlaps when the flexible circuit board 10 is bent. One side (slanted side) 60a of the reinforcing plate 60 is a folding auxiliary side that coincides with a folding line 17 for folding the flexible circuit board 10 described below.

次にフレキシブル回路基板１０を折り曲げる手順を説明する。図２，図３はフレキシブル回路基板１０の折り曲げ方法説明図、図４は折り曲げが完了したフレキシブル回路基板１０の折り曲げ構造を示す斜視図である。フレキシブル回路基板１０を折り曲げるには、まず図２に示すように、フレキシブル回路基板１０の上面に補強板６０を接着材によって取り付ける。このとき補強板６０の折り曲げ補助辺６０ａが、一対の折曲用位置決め部１５ａ，１５ｂを結ぶ線の方向を向くようにする。   Next, a procedure for bending the flexible circuit board 10 will be described. 2 and 3 are explanatory views of a bending method of the flexible circuit board 10, and FIG. 4 is a perspective view showing a bending structure of the flexible circuit board 10 after the bending is completed. In order to bend the flexible circuit board 10, first, as shown in FIG. 2, a reinforcing plate 60 is attached to the upper surface of the flexible circuit board 10 with an adhesive. At this time, the bending auxiliary side 60a of the reinforcing plate 60 is set to face the direction of the line connecting the pair of bending positioning portions 15a and 15b.

次に図３に示すように、フレキシブル回路基板１０を、前記一対の折曲用位置決め部１５ａ，１５ｂを結ぶ線（折り曲げ線）１７に沿って（略この線１７に沿って、の意味）折り曲げる。この実施形態では一対の折曲用位置決め部１５ａ，１５ｂが設けられているので、フレキシブル回路基板１０の折り曲げ位置が容易且つ正確にわかる。さらにこの実施形態においては、補強板６０の折り曲げ補助辺６０ａがフレキシブル回路基板１０の折り曲げ線１７に沿うように設置されているので、さらに容易且つ確実に、折り曲げようとする位置でフレキシブル回路基板１０を折り曲げることができる。   Next, as shown in FIG. 3, the flexible circuit board 10 is bent along a line (bending line) 17 connecting the pair of bending positioning portions 15a and 15b (substantially along the line 17). . In this embodiment, since the pair of bending positioning portions 15a and 15b are provided, the bending position of the flexible circuit board 10 can be easily and accurately known. Furthermore, in this embodiment, since the folding auxiliary side 60a of the reinforcing plate 60 is installed along the folding line 17 of the flexible circuit board 10, the flexible circuit board 10 can be more easily and reliably positioned at the position where it is to be folded. Can be bent.

そして前記フレキシブル回路基板１０の折り曲げによって、図３に示すように、一対の基板間固定部１３ａ，１３ｂを重ね合わせる（言い換えれば基板間固定部１３ａ，１３ｂが重なり合うようにフレキシブル回路基板１０を折り曲げる）。そして重ね合わせた基板間固定部１３ａ，１３ｂを熱溶着（この実施形態では超音波熱溶着）によって一体に固定する。もちろん他の各種固定方法（例えば接着材、機械的挟持手段等）によって固定しても良い。   Then, by bending the flexible circuit board 10, as shown in FIG. 3, the pair of inter-substrate fixing parts 13a and 13b are overlapped (in other words, the flexible circuit board 10 is bent so that the inter-substrate fixing parts 13a and 13b overlap). . Then, the stacked inter-substrate fixing portions 13a and 13b are integrally fixed by heat welding (in this embodiment, ultrasonic heat welding). Of course, you may fix by other various fixing methods (for example, an adhesive material, a mechanical clamping means, etc.).

次に図４に示すように、前記折り曲げによってフレキシブル回路基板１０を重ね合わせた重畳部分に基板固定用テープ５０を巻き回して取り付ける。基板固定用テープ５０の幅寸法は、フレキシブル回路基板１０を折り曲げた際の両折曲用位置決め部１５ａ，１５ｂ間の幅寸法と略同一としており、これによって両折曲用位置決め部１５ａ，１５ｂをガイドとして容易に基板固定用テープ５０を所定の位置に取り付けることができる。なおこの実施形態では基板固定用テープ５０を巻き回すことによってフレキシブル回路基板１０の重畳部分を固定したが、基板固定用テープ５０を一方の面のみに貼り付けたり、巻き回した基板固定用テープ５０間を溶着（超音波熱溶着。この場合、粘着層は不用）したりする等、他の各種取付方法によって取り付けてもよい。   Next, as shown in FIG. 4, the substrate fixing tape 50 is wound around and attached to the overlapping portion where the flexible circuit boards 10 are overlapped by the bending. The width dimension of the substrate fixing tape 50 is substantially the same as the width dimension between the bending position portions 15a and 15b when the flexible circuit board 10 is bent. The substrate fixing tape 50 can be easily attached at a predetermined position as a guide. In this embodiment, the overlapping portion of the flexible circuit board 10 is fixed by winding the substrate fixing tape 50. However, the substrate fixing tape 50 is attached to only one surface or wound. You may attach by various other attachment methods, such as carrying out welding (ultrasonic heat welding. In this case, an adhesion layer is unnecessary).

以上説明したように、この実施形態によれば、フレキシブル回路基板１０の対向する両辺１１ａ，１１ｂにそれぞれ基板間固定部１３ａ，１３ｂを設け、基板間固定部１３ａ，１３ｂが重ね合わさるようにフレキシブル回路基板１０を折り曲げ、重ね合わせた基板間固定部１３ａ，１３ｂを固定したので、フレキシブル回路基板１０の所定の位置を容易且つ確実に折り曲げることができる。また同時にフレキシブル回路基板１０の対向する両辺１１ａ，１１ｂにそれぞれ折曲用位置決め部１５ａ，１５ｂを設けたので、両折曲用位置決め部１５ａ，１５ｂを結ぶ線に沿ってフレキシブル回路基板１０を折り曲げるだけで、フレキシブル回路基板１０の折り曲げようとする位置を容易且つ確実に折り曲げることができる。   As described above, according to this embodiment, the flexible circuit board 10 is provided with the inter-substrate fixing portions 13a and 13b on the opposite sides 11a and 11b, respectively, and the inter-substrate fixing portions 13a and 13b are overlapped. Since the board-to-board fixing portions 13a and 13b are fixed by bending the board 10, the predetermined position of the flexible circuit board 10 can be easily and reliably bent. At the same time, since the bending positioning portions 15a and 15b are provided on the opposite sides 11a and 11b of the flexible circuit board 10, respectively, the flexible circuit board 10 is simply bent along the line connecting the both bending positioning portions 15a and 15b. Thus, the position where the flexible circuit board 10 is to be bent can be easily and reliably bent.

また上記実施形態によれば、フレキシブル回路基板１０の一方の辺１１ａに設ける基板間固定部１３ａと折曲用位置決め部１５ａの配列と、他方の辺１１ｂに設ける基板間固定部１３ｂと折曲用位置決め部１５ｂの配列とを逆向きとしたので、一対の折曲用位置決め部１５ａ，１５ｂを結ぶ線に沿ってフレキシブル回路基板１０を折り曲げるだけで、容易に一対の基板間固定部１３ａ，１３ｂを重ね合わせることができる。また折り曲げによってフレキシブル回路基板１０を重ね合わせた部分に基板固定用テープ５０を取り付けたので、この重ね合わせた部分を容易に固定することができる。また折り曲げた部分を基板固定用テープ５０によって保護することもできる。またフレキシブル回路基板１０の重ね合わさる部分の間に補強板６０を設置したので、折り曲げた部分の強度を補強することができるばかりか、補強板６０の折り曲げ補助辺（外周辺）６０ａを利用して容易にフレキシブル回路基板１０を折り曲げることができる。   Moreover, according to the said embodiment, the board | substrate fixing | fixed part 13a provided in one side 11a of the flexible circuit board 10, and the arrangement | positioning of the positioning part 15a for bending, and the board | substrate fixing | fixed part 13b provided in the other side 11b and bending Since the arrangement of the positioning portions 15b is reversed, the pair of inter-substrate fixing portions 13a and 13b can be easily formed simply by bending the flexible circuit board 10 along a line connecting the pair of bending positioning portions 15a and 15b. Can be overlapped. In addition, since the substrate fixing tape 50 is attached to the portion where the flexible circuit board 10 is overlapped by bending, the overlapped portion can be easily fixed. Further, the bent portion can be protected by the substrate fixing tape 50. Further, since the reinforcing plate 60 is installed between the overlapping portions of the flexible circuit board 10, not only can the strength of the bent portion be reinforced, but also the auxiliary bending side (outer periphery) 60a of the reinforcing plate 60 is used. The flexible circuit board 10 can be easily bent.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載のない何れの形状・構造・材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば上記実施形態では基板間固定部１３ａ，１３ｂと折曲用位置決め部１５ａ，１５ｂの両方をフレキシブル回路基板１０に設けたが、何れか一方のみを設けてもよい。折曲用位置決め部１５ａ，１５ｂのみを設けた場合の折り曲げたフレキシブル回路基板１０の固定は、基板固定用テープ５０等の他の各種手段によって行えばよい。また上記実施形態では帯状のフレキシブル回路基板１０に本発明を適用した例を示したが、各種電子部品を搭載したフレキシブル回路基板から帯状に引き出される部分や、帯状以外の各種形状のフレキシブル回路基板に本発明を適用しても良い。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in the above-described embodiment, both the inter-substrate fixing portions 13a and 13b and the bending positioning portions 15a and 15b are provided on the flexible circuit board 10, but only one of them may be provided. The flexible circuit board 10 that is bent when only the positioning portions 15a and 15b for bending are provided may be fixed by various other means such as the tape 50 for fixing the board. Moreover, although the example which applied this invention to the strip | belt-shaped flexible circuit board 10 was shown in the said embodiment, the part pulled out in strip | belt shape from the flexible circuit board carrying various electronic components, or the flexible circuit board | substrate of various shapes other than a strip | belt shape is shown. The present invention may be applied.

また上記実施形態では基板間固定部１３ａ，１３ｂをフレキシブル回路基板１０の辺１１ａ，１１ｂから突出する突部によって構成したが、突部を設けず、フレキシブル回路基板１０の辺１１ａ，１１ｂの部分又はその近傍を基板間固定部１３ａ，１３ｂとしてもよい。また上記実施形態では折曲用位置決め部１５ａ，１５ｂをフレキシブル回路基板１０の辺１１ａ，１１ｂから突出する突部によって構成したが、突部を設けず、フレキシブル回路基板１０の辺１１ａ，１１ｂを切り欠いたり、小孔を設けたり、印刷等によってマークを設けたりしてその部分を折曲用位置決め部１５ａ，１５ｂとしてもよい。また上記実施形態では折り曲げたフレキシブル回路基板１０同士が直交する方向を向くように折り曲げたが、本発明は必ずしも直交する方向を向かなくても良く、他の各種角度方向を向くように基板間固定部１３ａ，１３ｂや折曲用位置決め部１５ａ，１５ｂの位置を設置してもよい。   Moreover, in the said embodiment, although the board | substrate fixing | fixed part 13a, 13b was comprised by the protrusion which protrudes from the sides 11a and 11b of the flexible circuit board 10, it does not provide a protrusion but the part of the sides 11a and 11b of the flexible circuit board 10 or The vicinity may be used as the inter-substrate fixing portions 13a and 13b. In the above embodiment, the bending positioning portions 15a and 15b are formed by the protrusions protruding from the sides 11a and 11b of the flexible circuit board 10, but the protrusions are not provided and the sides 11a and 11b of the flexible circuit board 10 are cut. The portions may be used as bending positioning portions 15a and 15b by notching them, providing small holes, or providing marks by printing or the like. In the above embodiment, the folded flexible circuit boards 10 are bent so as to face each other in the orthogonal direction, but the present invention does not necessarily have to face in the orthogonal direction, and between the boards so as to face in various other angular directions. You may install the position of fixing | fixed part 13a, 13b and the positioning part 15a, 15b for bending.

また上記実施形態ではフレキシブル回路基板１０を重ね合わせた部分に基板固定用テープ５０を取り付けたが、基板間固定部１３ａ，１３ｂ間の固定だけで十分な場合や、その他の固定方法を用いた場合は、基板固定用テープ５０を省略してもよい。また上記実施形態ではフレキシブル回路基板１０の重ね合わさる部分の間に補強板６０を設置したが、補強が必要でない場合は省略しても良い。   Moreover, in the said embodiment, although the board | substrate fixing tape 50 was attached to the part which piled up the flexible circuit board 10, when fixing only between board | substrate fixing | fixed part 13a, 13b is enough, When using other fixing methods The substrate fixing tape 50 may be omitted. Moreover, in the said embodiment, although the reinforcement board 60 was installed between the parts to which the flexible circuit board 10 overlaps, you may abbreviate | omit when reinforcement is not required.

フレキシブル回路基板１０の折り曲げ構造を構成する各部品の分解斜視図である。FIG. 3 is an exploded perspective view of each component constituting the bending structure of the flexible circuit board 10. フレキシブル回路基板１０の折り曲げ方法説明図である。FIG. 4 is an explanatory diagram of a bending method of the flexible circuit board 10. フレキシブル回路基板１０の折り曲げ方法説明図である。FIG. 4 is an explanatory diagram of a bending method of the flexible circuit board 10. フレキシブル回路基板１０の折り曲げ構造を示す斜視図である。1 is a perspective view showing a bending structure of a flexible circuit board 10. FIG.

符号の説明Explanation of symbols

１０ フレキシブル回路基板
１１ 合成樹脂フイルム
１１ａ，１１ｂ 辺
１３ａ，１３ｂ 基板間固定部
１５ａ，１５ｂ 折曲用位置決め部
２１ 回路パターン
２５ 絶縁層
５０ 基板固定用テープ
６０ 補強板
６０ａ 折り曲げ補助辺 DESCRIPTION OF SYMBOLS 10 Flexible circuit board 11 Synthetic resin film 11a, 11b Side 13a, 13b Inter-substrate fixing | fixed part 15a, 15b Bending positioning part 21 Circuit pattern 25 Insulating layer 50 Substrate fixing tape 60 Reinforcement board 60a Bending auxiliary side

Claims (6)

フレキシブル回路基板の対向する両辺にそれぞれ基板間固定部を設け、
前記基板間固定部が重ね合わさるように前記フレキシブル回路基板を折り曲げ、前記重ね合わせた基板間固定部を固定することを特徴とするフレキシブル回路基板の折り曲げ構造。 Providing inter-substrate fixing parts on opposite sides of the flexible circuit board,
The flexible circuit board bending structure, wherein the flexible circuit board is bent so that the inter-substrate fixing portions are overlapped, and the overlapped inter-substrate fixing portions are fixed. 前記フレキシブル回路基板の対向する両辺にそれぞれ折曲用位置決め部を設け、
前記両折曲用位置決め部を結ぶ線に沿って前記フレキシブル回路基板を折り曲げたことを特徴とする請求項１に記載のフレキシブル回路基板の折り曲げ構造。 Providing bending positioning portions on opposite sides of the flexible circuit board,
2. The flexible circuit board bending structure according to claim 1, wherein the flexible circuit board is bent along a line connecting the both bending positioning portions. 前記フレキシブル回路基板の一方の辺に設ける前記基板間固定部と前記折曲用位置決め部の配列と、他方の辺に設ける前記基板間固定部と前記折曲用位置決め部の配列とが、逆向きであることを特徴とする請求項２に記載のフレキシブル回路基板の折り曲げ構造。   The arrangement of the inter-substrate fixing portion and the bending positioning portion provided on one side of the flexible circuit board, and the arrangement of the inter-substrate fixing portion and the bending positioning portion provided on the other side are reversed. The flexible circuit board folding structure according to claim 2, wherein the flexible circuit board is folded. フレキシブル回路基板の対向する両辺にそれぞれ折曲用位置決め部を設け、
前記両折曲用位置決め部を結ぶ線に沿って前記フレキシブル回路基板を折り曲げたことを特徴とするフレキシブル回路基板の折り曲げ構造。 Provide positioning parts for bending on both sides of the flexible circuit board,
A flexible circuit board bending structure, wherein the flexible circuit board is bent along a line connecting the both folding positioning portions. 前記折り曲げによってフレキシブル回路基板を重ね合わせた部分に、基板固定用テープを取り付けたことを特徴とする請求項１乃至４の内の何れかに記載のフレキシブル回路基板の折り曲げ構造。   5. The flexible circuit board folding structure according to claim 1, wherein a substrate fixing tape is attached to a portion where the flexible circuit boards are overlapped by the bending. 前記フレキシブル回路基板の重ね合わさる部分の間に、補強板を設置したことを特徴とする請求項１乃至５の内の何れかに記載のフレキシブル回路基板の折り曲げ構造。   6. The flexible circuit board folding structure according to claim 1, wherein a reinforcing plate is installed between the overlapping portions of the flexible circuit boards.
JP2006347966A 2006-12-25 2006-12-25 Bending structure of flexible circuit board Pending JP2008159908A (en)

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JP2011134884A (en) * 2009-12-24 2011-07-07 Nippon Mektron Ltd Flexible circuit board and method of manufacturing the same
CN103052263A (en) * 2011-10-11 2013-04-17 株式会社藤仓 Method of manufacturing printed circuit board and printed circuit board
US9347621B2 (en) 2012-10-04 2016-05-24 Samsung Electronics Co., Ltd. Light emitting module and lighting device using the same
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
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US11304308B2 (en) * 2008-02-14 2022-04-12 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
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US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US11304308B2 (en) * 2008-02-14 2022-04-12 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US11690172B2 (en) 2008-02-14 2023-06-27 Metrospec Technology, L.L.C. LED lighting systems and methods
JP2011134884A (en) * 2009-12-24 2011-07-07 Nippon Mektron Ltd Flexible circuit board and method of manufacturing the same
US9024198B2 (en) 2009-12-24 2015-05-05 Nippon Mektron, Ltd. Flexible circuit board and method for production thereof
CN103052263A (en) * 2011-10-11 2013-04-17 株式会社藤仓 Method of manufacturing printed circuit board and printed circuit board
JP2013084777A (en) * 2011-10-11 2013-05-09 Fujikura Ltd Manufacturing method of printed wiring board and printed wiring board
US9006579B2 (en) 2011-10-11 2015-04-14 Fujikura Ltd. Method of manufacturing printed circuit board and printed circuit board
US9347621B2 (en) 2012-10-04 2016-05-24 Samsung Electronics Co., Ltd. Light emitting module and lighting device using the same
US9759405B2 (en) 2012-10-04 2017-09-12 Samsung Electronics Co., Ltd. Light emitting module and lighting device using the same
CN114126196A (en) * 2021-11-26 2022-03-01 昆山国显光电有限公司 Flexible circuit board and display device
WO2023164486A1 (en) * 2022-02-22 2023-08-31 Cellink Corporation Flexible interconnect circuits and methods of fabrication thereof

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