JP2008133526A

JP2008133526A - Plating tool

Info

Publication number: JP2008133526A
Application number: JP2006321960A
Authority: JP
Inventors: Tsunayoshi Aoki; 綱芳青木; Kenichiro Haruki; 健一郎春木
Original assignee: Fujikura Ltd
Current assignee: Fujikura Ltd
Priority date: 2006-11-29
Filing date: 2006-11-29
Publication date: 2008-06-12
Anticipated expiration: 2026-11-29
Also published as: JP4892326B2

Abstract

PROBLEM TO BE SOLVED: To provide a plating tool which can control the pressing force against a wafer and attach or detach the wafer rapidly. SOLUTION: The plating tool 1 is constituted of a tool body 3 equipped with a plurality of feeding electrodes 11 installed along the peripheral edge of a plating hole part 9, a first annular seal member 17 arranged on the tool body 3 along the peripheral edge of the plating hole part 9 for mounting a wafer 7 in such a manner that the surface of the wafer 7 is connected to the feeding electrodes 11, a pressing member 25 for abutting on the rear surface of the wafer 7 to press the wafer 7 to the first seal member 17, a cover member 31 for covering the whole of the rear surface of the wafer 7 through an energizing means 33 for energizing the pressing member 25 toward the first seal member 17, a second seal member 27 arranged along the outer circumference of the pressing member 25 between the cover member 31 and the tool body 3, and a catch device 39 for positioning the cover member 31 relative to the tool body 3 to tightening the cover member 31 and the tool body 3 against the energizing force of the energizing means 33. COPYRIGHT: (C)2008,JPO&INPIT

Description

この発明は、メッキ治具に関し、特にメッキすべきウェハなどの電子回路基板を保持し、前記電子回路基板の表面にメッキするメッキ治具に関する。なお、このメッキ治具は、半導体パッケージ分野におけるウェハメッキプロセスに関するもので、製品を左右するものである。 The present invention relates to a plating jig, and more particularly to a plating jig for holding an electronic circuit board such as a wafer to be plated and plating the surface of the electronic circuit board. The plating jig relates to a wafer plating process in the semiconductor package field, and affects the product.

一般的に、半導体を実装する電子回路基板としての例えばウェハの表面には銅メッキが施される。そのために、メッキ治具にウェハをセット保持してから、このメッキ治具の全体を例えばメッキ槽内の銅メッキ液に没入することで銅メッキが施される。 Generally, for example, the surface of a wafer as an electronic circuit board on which a semiconductor is mounted is plated with copper. For this purpose, after the wafer is set and held on the plating jig, the entire plating jig is immersed in, for example, a copper plating solution in a plating tank to perform copper plating.

図９を参照するに、従来のメッキ治具１０１としては、例えば、特許文献１に示されているように、板状のベース部材１０３が上下に貫通した開口１０５の開口周縁に沿って設けた複数の給電電極１０７を有している。第１シール部材１０９は、前記ベース部材１０３の開口１０５の開口周縁に沿って配置されるリング状をなすもので、板状に形成されたウェハ１１１の表面１１１Ａが前記給電電極１０７と電気的に接続し合うように載置セットされる構成である。なお、図９では第１シール部材１０９の外周側に、前記給電電極１０７の水平部を載置して上方からの荷重に対して弾性反力を備えた弾性体１０９Ａが設けられている。 Referring to FIG. 9, as a conventional plating jig 101, for example, as shown in Patent Document 1, a plate-like base member 103 is provided along the opening periphery of an opening 105 that penetrates vertically. A plurality of power supply electrodes 107 are provided. The first seal member 109 has a ring shape arranged along the opening periphery of the opening 105 of the base member 103, and the surface 111 A of the wafer 111 formed in a plate shape is electrically connected to the power supply electrode 107. It is the structure set and mounted so that it may connect. In FIG. 9, an elastic body 109 A is provided on the outer peripheral side of the first seal member 109.

また、カバー部材１１３は、前記第１シール部材１０９にセットされるウェハ１１１の裏面１１１Ｂの全体を覆うものである。押さえ部材１１５は、前記カバー部材１１３とウェハ１１１の裏面１１１Ｂとの間でそれぞれに接触して前記ウェハ１１１を前記第１シール部材１０９へ向けて押さえつけるものである。押さえ部材１１５とウェハ１１１の間はリング状の弾性部材１１７を介して接触しており、押さえ部材１１５のほぼ中央にはねじ式の突起体１１９が前記カバー部材１１３の側に突出する方向に高さ調整可能に設けられており、押さえ部材１１５とカバー部材１１３の間は前記突起体１１９を介して接触している。 The cover member 113 covers the entire back surface 111B of the wafer 111 set on the first seal member 109. The pressing member 115 contacts between the cover member 113 and the back surface 111B of the wafer 111 to press the wafer 111 toward the first seal member 109. The pressing member 115 and the wafer 111 are in contact with each other via a ring-shaped elastic member 117, and a screw-type projection 119 is formed in the center of the pressing member 115 so as to protrude toward the cover member 113. The presser member 115 and the cover member 113 are in contact with each other via the protrusion 119.

また、第２シール部材１２１は、前記押さえ部材１１５の外周に沿って配置されるリング状をなすものである。前記カバー部材１１３とベース部材１０３は前記第２シール部材１２１を挟んで複数の締結具としての例えばねじ１２３で締結される構成である。 The second seal member 121 has a ring shape arranged along the outer periphery of the pressing member 115. The cover member 113 and the base member 103 are configured to be fastened with, for example, screws 123 as a plurality of fasteners with the second seal member 121 interposed therebetween.

したがって、前記カバー部材１１３とベース部材１０３が複数の締結具のねじ１２３で締結されると、カバー部材１１３の押圧力Ｗにより突起体１１９を介して前記押さえ部材１１５がリング状の弾性部材１１７を経てウェハ１１１を前記第１シール部材１０９へ向けて押さえつける方向に押圧するので、ウェハ１１１のメッキ液が接触する表面１１１Ａの周辺に配置されたリング状の第１シール部材１０９でシールされる。また、ウェハ１１１の裏面１１１Ｂ側は前記カバー部材１１３とベース部材１０３との間に挟まれる第２シール部材１２１でシールされる。その結果、メッキ治具１０１にセット保持されたウェハ１１１に銅メッキを行う場合は、メッキ液はウェハ１１１の裏面１１１Ｂに確実に漏れないようにできる。 Therefore, when the cover member 113 and the base member 103 are fastened by a plurality of fastener screws 123, the pressing member 115 causes the ring-shaped elastic member 117 to move through the protrusion 119 due to the pressing force W of the cover member 113. Then, the wafer 111 is pressed in the direction of pressing toward the first seal member 109, so that the wafer 111 is sealed by the ring-shaped first seal member 109 disposed around the surface 111A with which the plating solution contacts. Further, the back surface 111 B side of the wafer 111 is sealed with a second seal member 121 sandwiched between the cover member 113 and the base member 103. As a result, when copper plating is performed on the wafer 111 set and held on the plating jig 101, the plating solution can be surely prevented from leaking to the back surface 111B of the wafer 111.

また、特許文献２のメッキ治具では、ヒンジで開閉可能な２つの保持部材でウェハを保持する構成であり、ウェハを保持した２つの保持部材の両側縁側をクランパで挟み込む構成である。 Further, the plating jig of Patent Document 2 is configured to hold the wafer with two holding members that can be opened and closed by a hinge, and is configured to sandwich both side edges of the two holding members that hold the wafer with clampers.

また、特許文献３のメッキ治具では、ヒンジで開閉可能な２つの保持部材と、２つの保持部材の間で挟まれる軟質ゴムからなるシール部材と、からなり、前記シール部材が内部に空間を有し、かつウェハを保持する構成であり、ウェハを保持したシール部材が２つの保持部材で挟み込まれる構成である。
特開２００６−１６６４９号公報特許第３６２９３９６号公報特開平５−２４７６９２号公報 In addition, the plating jig of Patent Document 3 includes two holding members that can be opened and closed by hinges, and a sealing member made of soft rubber sandwiched between the two holding members, and the sealing member has a space inside. And holding the wafer, and the sealing member holding the wafer is sandwiched between the two holding members.
JP 2006-16649 A Japanese Patent No. 3629396 JP-A-5-247692

ところで、特許文献１の従来のメッキ治具１０１においては、上記の押さえ部材１１５をクランパなどの締結具で押さえる場合は、ウェハ１１１に対する押圧力Ｗの制御ができず、ウェハ１１１の脱着にも時間がかかる。また、複数のねじ１２３の締結具を使って押さえる場合も、ウェハ１１１に対する押圧力Ｗの制御にも多くの調整時間がかかり、複数のねじ１２３を締め付けたり緩めて取り外したりするので、ウェハ１１１の脱着に時間がかかるという問題点があった。 By the way, in the conventional plating jig 101 of Patent Document 1, when the pressing member 115 is pressed by a fastener such as a clamper, the pressing force W on the wafer 111 cannot be controlled, and it takes time to attach and detach the wafer 111. It takes. In addition, when pressing using the fasteners of the plurality of screws 123, it takes a lot of adjustment time to control the pressing force W on the wafer 111, and the plurality of screws 123 are tightened or loosened and removed. There was a problem that it took time to desorb.

また、特許文献２及び特許文献３のメッキ治具では、ウェハヘの押圧力の制御ができないために、給電ピン部にレジストが形成されているウェハには適応が難しいという問題点があった。さらに、ヒンジとクランパ方式の両方を使用していることから、ウェハの脱着に時間がかかってしまうという問題点があった。 Further, the plating jigs of Patent Document 2 and Patent Document 3 have a problem that it is difficult to adapt to a wafer in which a resist is formed on the power supply pin portion because the pressing force on the wafer cannot be controlled. Furthermore, since both the hinge and the clamper system are used, there is a problem that it takes time to remove and attach the wafer.

上記発明が解決しようとする課題を達成するために、この発明のメッキ治具は、メッキ用穴部を備えると共に前記メッキ用穴部の周縁に沿って設けた複数の給電電極を備えた治具本体と、
メッキすべき電子回路基板の表面が前記給電電極と接続すべく載置セット可能に、前記メッキ用穴部の周縁に沿って前記治具本体に配置されたリング状の第１シール部材と、
前記電子回路基板の裏面に当接して当該電子回路基板を前記第１シール部材に押さえつける押さえ部材と、
この押さえ部材を前記第１シール部材に向けて付勢する付勢手段を介して前記電子回路基板の裏面全体を覆うカバー部材と、
このカバー部材と治具本体との間で前記押さえ部材の外周に沿って配置されたリング状の第２シール部材と、
前記カバー部材と治具本体とを前記付勢手段の付勢力に抗して前記カバー部材と治具本体との間を位置決めして締結するキャッチ装置と、で構成されていることを特徴とするものである。 In order to achieve the problem to be solved by the invention, a plating jig according to the invention includes a plating hole portion and a plurality of feeding electrodes provided along the periphery of the plating hole portion. The body,
A ring-shaped first seal member disposed on the jig body along the periphery of the plating hole so that the surface of the electronic circuit board to be plated can be placed and set to be connected to the power supply electrode;
A pressing member that contacts the back surface of the electronic circuit board and presses the electronic circuit board against the first seal member;
A cover member that covers the entire back surface of the electronic circuit board via biasing means that biases the pressing member toward the first seal member;
A ring-shaped second seal member disposed along the outer periphery of the pressing member between the cover member and the jig body;
A catch device that positions and fastens the cover member and the jig main body between the cover member and the jig main body against the biasing force of the biasing means. Is.

また、この発明のメッキ治具は、前記メッキ治具において、前記キャッチ装置が、前記治具本体に、前記第２シール部材より外周に位置して配置した複数の頭付き割りピンと、前記カバー部材に、前記複数の各頭付き割りピンに対応して係合可能に配置した複数の係合穴部であって、前記各頭付き割りピンを撓ませて小さくした状態の頭部を挿通可能な径である複数の係合穴部と、で構成されていることが好ましい。 Further, the plating jig of the present invention is the plating jig, wherein the catch device has a plurality of head split pins arranged on the jig body at an outer periphery than the second seal member, and the cover member In addition, a plurality of engagement holes arranged so as to be able to engage with the plurality of split pins with heads, and the heads in a state where the split pins with heads are bent to be small can be inserted. It is preferable that it is comprised with the some engagement hole part which is a diameter.

また、この発明のメッキ治具は、前記メッキ治具において、前記キャッチ装置が、前記治具本体に、前記第２シール部材より外周に位置する同心円上に配置した複数の頭付きピンと、
前記カバー部材に、前記複数の各頭付きピンに対応して係合可能に配置した複数の係合穴部であって、前記頭付きピンの頭部を挿通可能な第１穴部を備えると共に前記第１穴部に連通して前記複数の頭付きピンと同じ同心円上に長く、かつ前記頭付きピンの基部を挿通可能で前記第１穴部より小さい短径の長穴部を備えた複数の係合穴部と、で構成されていることが好ましい。 Further, the plating jig of the present invention is the plating jig, wherein the catch device is arranged on the jig body on a concentric circle located on the outer periphery from the second seal member,
The cover member includes a plurality of engagement holes arranged to be engageable with each of the plurality of headed pins, and having a first hole through which the head of the headed pin can be inserted. A plurality of long holes with a short diameter smaller than the first hole, which are in communication with the first hole and are long on the same concentric circle as the plurality of headed pins, and can be inserted through the base of the headed pin. And an engagement hole.

また、この発明のメッキ治具は、前記メッキ治具において、前記各頭付きピンが割りピンであると共に前記各係合穴部の第１穴部が前記各頭付きピンを撓ませて小さくした状態の頭部を挿通可能な径であることが好ましい。 In the plating jig of the present invention, in the plating jig, each of the headed pins is a split pin, and the first hole portion of each of the engaging hole portions is bent to reduce each of the headed pins. The diameter is preferably such that the head in the state can be inserted.

また、この発明のメッキ治具は、前記メッキ治具において、前記カバー部材に複数の椀状凹み部を設け、かつ前記各椀状凹み部に前記係合穴部を設けることが好ましい。 Moreover, the plating jig of this invention WHEREIN: It is preferable in the said plating jig to provide the said cover member with a some ridge-shaped dent part, and to provide the said engagement hole part in each said ridge-shaped dent part.

以上のごとき課題を解決するための手段から理解されるように、この発明によれば、押さえ部材とその外側に設けたカバー部材との間にバネなどの付勢手段を設けたことで、このバネの付勢力により押さえ部材を介してウェハに対して調整無しに一定の押圧荷重をかけることができる。また、カバー部材はキャッチ装置による脱着構造とすることで、ウェハの脱着を迅速に行うことができ、大幅な脱着時間の低減を図ることができる。 As can be understood from the means for solving the problems as described above, according to the present invention, the biasing means such as a spring is provided between the pressing member and the cover member provided on the outside thereof. A constant pressing load can be applied to the wafer through the pressing member by the biasing force of the spring without adjustment. In addition, since the cover member has a detachable structure using the catch device, the wafer can be quickly detached and the detachment time can be greatly reduced.

また、上記のバネなどの付勢手段を交換することで、押圧荷重の制御を容易に行うことができる。 Further, the pressure load can be easily controlled by exchanging the biasing means such as the spring.

以下、この発明の実施の形態について図面を参照して説明する。 Embodiments of the present invention will be described below with reference to the drawings.

図１ないしは図３を参照するに、この実施の形態に係るメッキ治具１は、治具本体３を備えており、この治具本体３は矩形の平板状で、塩化ビニル製からなっており、治具本体３の図１、図２において左部、図３において右上方部にはクランプ用穴部５が設けられており、前記治具本体３のほぼ中央部にはメッキすべき電子回路基板としての例えばウェハ７の表面７Ａに銅メッキするための図２において上下に貫通したメッキ用穴部９が設けられている。さらに、メッキ用穴部９の周縁に沿ってほぼ均等な配置で少なくとも３箇所にウェハ７に通電するための給電電極１１が、この実施の形態では、３つの給電電極１１Ａ，１１Ｂ，１１Ｃが突出している。 Referring to FIGS. 1 to 3, the plating jig 1 according to this embodiment includes a jig body 3, which is a rectangular flat plate made of vinyl chloride. 1 and 2, the clamp body 5 is provided with a clamping hole 5 in the left part of FIG. 1 and FIG. 2 and in the upper right part of FIG. For example, a plating hole 9 penetrating vertically in FIG. 2 for plating copper on a surface 7A of a wafer 7 as a substrate is provided. Furthermore, the feed electrode 11 for energizing the wafer 7 in at least three locations with a substantially uniform arrangement along the peripheral edge of the plating hole portion 9, and in this embodiment, the three feed electrodes 11 A, 11 B, and 11 C protrude. ing.

また、上記のクランプ用穴部５より図３において左側には内部のウェハ７に給電するための少なくとも３つの給電端子部としての例えば電極ピン１３が露出されており、各電極ピン１３と上記の給電電極１１Ａ，１１Ｂ，１１Ｃ間を導通するための導電線１５が配線されている。 Further, for example, electrode pins 13 as at least three power supply terminal portions for supplying power to the internal wafer 7 are exposed on the left side of the clamp hole portion 5 in FIG. 3. Conductive wires 15 are provided for electrical connection between the feeding electrodes 11A, 11B, and 11C.

また、第１シール部材１７は、メッキ用穴部９の周縁に沿って治具本体３に配置されたリング状をなすもので、ウェハ７の表面７Ａが給電電極１１と接続すべく載置セット可能に設けられている。なお、第１シール部材１７の外周側には図２（Ｂ）に示されているように段付部１９が設けられている。 The first seal member 17 has a ring shape arranged on the jig body 3 along the peripheral edge of the plating hole 9, and the mounting set is set so that the surface 7 A of the wafer 7 is connected to the power supply electrode 11. It is provided as possible. A stepped portion 19 is provided on the outer peripheral side of the first seal member 17 as shown in FIG.

給電電極１１は、図２（Ｂ）に示されているように、帯板状に形成された水平部２１とこの水平部２１から垂直に立ち上がる垂直部２３とで構成され、前記水平部２１はリング状の第１シール部材１７の段付部１９の上面に載置され、前記垂直部２３が前記段付部１９の垂直面に沿って立ち上がっており、垂直部２３の垂直先端は例えば複数の山形形状となって前記第１シール部材１７に載置セットされるウェハ７に対して確実に突き刺さるようになっている。 As shown in FIG. 2B, the power supply electrode 11 is composed of a horizontal portion 21 formed in a strip shape and a vertical portion 23 rising vertically from the horizontal portion 21, and the horizontal portion 21 is It is mounted on the upper surface of the stepped portion 19 of the ring-shaped first seal member 17, the vertical portion 23 rises along the vertical surface of the stepped portion 19, and the vertical tip of the vertical portion 23 has, for example, a plurality of It has a chevron shape so that it can pierce the wafer 7 placed and set on the first seal member 17 with certainty.

さらに、押さえ部材２５は、ウェハ７の裏面７Ｂに当接して当該ウェハ７を上記の第１シール部材１７に向けて押さえつけるものである。より詳しくは、所定の板厚により面剛性を備えた円板２７と、この円板２７の裏面の外周縁に沿って配置されたリング状の弾性部材２９とで構成されている。リング状の弾性部材２９は、第１シール部材１７に載置セットされるウェハ７の裏面７Ｂの外周縁に沿って弾接されている。 Further, the pressing member 25 is in contact with the back surface 7 B of the wafer 7 and presses the wafer 7 toward the first seal member 17. More specifically, it is composed of a disk 27 having surface rigidity with a predetermined plate thickness, and a ring-shaped elastic member 29 arranged along the outer peripheral edge of the back surface of the disk 27. The ring-shaped elastic member 29 is elastically contacted along the outer peripheral edge of the back surface 7B of the wafer 7 placed and set on the first seal member 17.

また、カバー部材３１は塩化ビニル製でほぼ丸い板状に形成され、上記の押さえ部材２５を前記第１シール部材１７に向けて付勢する付勢手段としての例えばバネ３３を介してウェハ７の裏面７Ｂの全体を覆うものである。上記のバネ３３は、この実施の形態では押さえ部材２５のほぼ中央を押圧する位置でカバー部材３１の下面に直接固定されている。また、カバー部材３１の上面には補強用板材３５が前記バネ３３に対応する位置に一体的に取り付けられている。 The cover member 31 is made of vinyl chloride and is formed in a substantially round plate shape. The cover member 31 is formed on the wafer 7 via, for example, a spring 33 as an urging unit that urges the pressing member 25 toward the first seal member 17. The entire back surface 7B is covered. In this embodiment, the spring 33 is directly fixed to the lower surface of the cover member 31 at a position where the substantially center of the pressing member 25 is pressed. A reinforcing plate 35 is integrally attached to the upper surface of the cover member 31 at a position corresponding to the spring 33.

なお、上記のバネ３３はカバー部材３１の下面に取り付けられているが、別の例としては押さえ部材２５の上面に取り付けられても良い。あるいは、押さえ部材２５のほぼ中央を押圧する位置に位置決めされればバネ３３を単独で設けることもできる。さらに、上記の付勢手段としてはバネ３３が用いられているが、弾性部材などのような他の付勢手段であっても良い。 The spring 33 is attached to the lower surface of the cover member 31, but may be attached to the upper surface of the pressing member 25 as another example. Or the spring 33 can also be provided independently if it positions in the position which presses the substantially center of the pressing member 25. FIG. Further, although the spring 33 is used as the biasing means, other biasing means such as an elastic member may be used.

したがって、前記バネ３３が押さえ部材２５のほぼ中央を押圧することで上方からの押圧荷重Ｗは前記円板２７を介して弾性部材２９にほぼ均一に伝達され、ウェハ７の外周縁は第１シール部材１７に均一な荷重で押圧される構成である。これに伴って、上記の第１シール部材１７に載置セットされたウェハ７が給電電極１１Ａ，１１Ｂ，１１Ｃへ均等に押圧されて導通される。 Accordingly, when the spring 33 presses substantially the center of the pressing member 25, the pressing load W from above is transmitted almost uniformly to the elastic member 29 via the disk 27, and the outer peripheral edge of the wafer 7 is the first seal. In this configuration, the member 17 is pressed with a uniform load. Along with this, the wafer 7 placed and set on the first seal member 17 is evenly pressed and conducted to the power supply electrodes 11A, 11B, and 11C.

また、第２シール部材３７は、カバー部材３１と治具本体３との間で前記押さえ部材２５の外周に沿って配置されたリング状をなすものであり、カバー部材３１と治具本体３との間で上記のリング状の第２シール部材３７を挟んで確実にシールする構成である。 The second seal member 37 has a ring shape arranged along the outer periphery of the pressing member 25 between the cover member 31 and the jig body 3, and the cover member 31, the jig body 3, The ring-shaped second seal member 37 is sandwiched between the two so as to be surely sealed.

また、カバー部材３１と治具本体３を締結する締結装置としては、前記カバー部材３１と治具本体３とを前記付勢手段としての例えばバネ３３の付勢力に抗して前記カバー部材３１と治具本体３との間を位置決めしてワンタッチで締結可能なキャッチ装置３９の構造である。 Further, as a fastening device for fastening the cover member 31 and the jig main body 3, the cover member 31 and the jig main body 3 are opposed to the cover member 31 against the urging force of, for example, a spring 33 as the urging means. This is a structure of a catch device 39 that can be positioned between the jig body 3 and fastened with one touch.

より詳しくは、第１の実施の形態のキャッチ装置３９としては、複数の頭付き割りピン４１が前記第２シール部材３７より外周に位置する前記治具本体３に配置されている。前記頭付き割りピン４１は、治具本体３に固定された基部４３と、この基部４３の先端に一体的に形成された外周がテーパ状の頭部４５とからなる。さらに、前記カバー部材３１には、前記複数の各頭付き割りピン４１に対応して係合可能に配置した複数の係合穴部４７が設けられており、各係合穴部４７は、前記各頭付き割りピン４１を撓ませて小さくした状態の頭部を挿通可能な径である。 More specifically, as the catch device 39 according to the first embodiment, a plurality of split pins 41 with heads are arranged on the jig body 3 located on the outer periphery from the second seal member 37. The headed split pin 41 includes a base 43 fixed to the jig body 3 and a head 45 having a tapered outer periphery formed integrally with the tip of the base 43. Furthermore, the cover member 31 is provided with a plurality of engagement hole portions 47 arranged so as to be able to engage with the plurality of split pins 41 with the heads. It is a diameter which can insert the head of the state where each split pin 41 with a head was bent and made small.

また、この実施の形態では、上記の各頭付き割りピン４１は割り付き４１Ａを備えた４つ割りピンである。この割り付き４１Ａは２つ割り、３つ割り、あるいは４つ割りなどのように限定されない。 Moreover, in this embodiment, each said split pin 41 with a head is a four split pin provided with 41 A of splits. The allocation 41A is not limited to two, three, four, or the like.

また、上記の頭付き割りピン４１は、頭部４５の先端が小径に形成されていることが望ましい。その理由は、カバー部材３１を治具本体３から取り外す際に、頭部４５の先端が小径に形成されていることで、詳しくは後述する脱着用治具４９を用いて容易に頭付き割りピン４１を撓ませて小さくして前記複数の頭付き割りピン４１をカバー部材３１の係合穴部４７から同時に抜脱することができるからである。 Moreover, as for said split pin 41 with a head, it is desirable for the front-end | tip of the head 45 to be formed in the small diameter. The reason for this is that when the cover member 31 is removed from the jig body 3, the tip of the head 45 is formed with a small diameter. This is because the plurality of headed split pins 41 can be simultaneously withdrawn from the engagement hole portions 47 of the cover member 31 by bending 41 to be small.

なお、この第１の実施の形態では、上記の複数の頭付き割りピン４１は同心円上に等間隔で配置され、且つ、複数の係合穴部４７も同心円上に等間隔で配置されている。これにより、複数の頭付き割りピン４１と複数の係合穴部４７は、どの位置でも互いに対応することになるので、カバー部材３１を治具本体３に取り付け易くなるという効果がある。しかし、基本的には、複数の各係合穴部４７は、前記複数の各頭付き割りピン４１にそれぞれ対応して配置されていれば、同心円上でなくても、あるいは等間隔でなくても構わない。 In the first embodiment, the plurality of split pins with heads 41 are arranged at equal intervals on a concentric circle, and the plurality of engagement hole portions 47 are also arranged at equal intervals on a concentric circle. . As a result, the plurality of split pins 41 with heads and the plurality of engaging hole portions 47 correspond to each other at any position, so that the cover member 31 can be easily attached to the jig body 3. However, basically, as long as the plurality of engaging hole portions 47 are arranged corresponding to the plurality of split pins 41 with heads, they may not be concentric or equidistant. It doesn't matter.

上記構成により、図１及び図２に示されているように、ウェハ７の表面７Ａ側がメッキ治具１の治具本体３のメッキ用穴部９の周縁に沿っている第１シール部材１７に載置セットされる。次いで、押さえ部材２５がリング状の弾性部材２９を介して前記ウェハ７の裏面７Ｂの外周縁に沿って弾接される。さらに、リング状の第２シール部材３７が前記押さえ部材２５の外周に沿って治具本体３の図２（Ａ）において上面の所定の位置に配置される。 With the above configuration, as shown in FIGS. 1 and 2, the surface 7 A side of the wafer 7 is formed on the first seal member 17 along the periphery of the plating hole 9 of the jig body 3 of the plating jig 1. Placed and set. Next, the pressing member 25 is elastically contacted along the outer peripheral edge of the back surface 7 B of the wafer 7 through the ring-shaped elastic member 29. Further, a ring-shaped second seal member 37 is disposed along the outer periphery of the pressing member 25 at a predetermined position on the upper surface of the jig body 3 in FIG.

次いで、カバー部材３１の複数の係合穴部４７と治具本体３の複数の各頭付き割りピン４１が互いに対応する位置で位置決めされてから、各頭付き割りピン４１が互いに対応する各係合穴部４７に挿通するように、前記カバー部材３１を上から押圧する。このとき、カバー部材３１のほぼ中央にあるバネ３３の付勢力により押さえ部材２５のほぼ中央が押圧されると、上方からの押圧荷重Ｗが押さえ部材２５の円板２７を介して弾性部材２９にほぼ均一に伝達され、ウェハ７の外周縁が第１シール部材１７に均一な荷重で押圧される。 Next, after the plurality of engagement hole portions 47 of the cover member 31 and the plurality of split pins 41 with the heads of the jig body 3 are positioned at positions corresponding to each other, the respective split pins 41 with the heads correspond to the corresponding ones. The cover member 31 is pressed from above so as to be inserted into the joint hole portion 47. At this time, when almost the center of the pressing member 25 is pressed by the urging force of the spring 33 at the substantially center of the cover member 31, the pressing load W from above is applied to the elastic member 29 via the disk 27 of the pressing member 25. The outer peripheral edge of the wafer 7 is pressed against the first seal member 17 with a uniform load.

一方、カバー部材３１が前記バネ３３の上方への反発力に抗して上から押圧されると、４つ割り型の複数の各頭付き割りピン４１が係合穴部４７により撓んで頭部４５が小さい径になって前記係合穴部４７に挿通されて通過した後、４つ割り型の複数の各頭付き割りピン４１が原位置に復帰して係合する。このように、各頭付き割りピン４１と係合穴部４７が係合することで、前記カバー部材３１と治具本体３との間が位置決めされ、キャッチ装置３９による締結が完了する。 On the other hand, when the cover member 31 is pressed from above against the upward repulsive force of the spring 33, the four split-type split pins 41 are bent by the engagement holes 47 and the head After 45 has a small diameter and is inserted through the engagement hole 47 and passes therethrough, the plurality of quadrant-type split pins 41 are returned to their original positions and engaged. In this way, each of the split pins 41 with the head and the engagement hole 47 are engaged, whereby the space between the cover member 31 and the jig body 3 is positioned, and the fastening by the catch device 39 is completed.

このとき、リング状の第２シール部材３７は、図１に示されているようにカバー部材３１と治具本体３との間に挟まれて若干潰されることで確実にシールされる。 At this time, as shown in FIG. 1, the ring-shaped second seal member 37 is sandwiched between the cover member 31 and the jig main body 3 and is crushed slightly to be surely sealed.

再び、図１を参照するに、カバー部材３１を治具本体３の複数の頭付き割りピン４１から同時に抜脱するための脱着用治具４９が設けられている。この脱着用治具４９は、前記複数の各頭付き割りピン４１を撓ませて小さくすべく前記各頭付き割りピン４１の頭部４５を挿入する円筒部５１が前記複数の頭付き割りピン４１に対応した位置で平板状のベース部５３に配置されたものである。なお、円筒部５１の内径は、カバー部材３１の係合穴部４７の直径より僅かに小さく形成されている。 Referring again to FIG. 1, a detaching jig 49 for simultaneously removing the cover member 31 from the plurality of split pins 41 with the head of the jig body 3 is provided. The detachable jig 49 has a cylindrical portion 51 into which the head 45 of each of the headed split pins 41 is inserted in order to bend and reduce the plurality of headed split pins 41. Is disposed on the flat base portion 53 at a position corresponding to. The inner diameter of the cylindrical portion 51 is slightly smaller than the diameter of the engagement hole portion 47 of the cover member 31.

したがって、治具本体３からカバー部材３１を取り外すときは、前記脱着用治具４９の複数の円筒部５１を前記複数の頭付き割りピン４１に対応した位置で同時に押し込むことにより、前記複数の頭付き割りピン４１が同時に前記各円筒部５１の内周面で撓んで小さくされる。 Therefore, when removing the cover member 31 from the jig body 3, the plurality of heads are simultaneously pushed by pressing the plurality of cylindrical portions 51 of the detachment jig 49 at positions corresponding to the plurality of headed split pins 41. The split pin 41 is simultaneously bent and reduced on the inner peripheral surface of each cylindrical portion 51.

すると、バネ３３の反発力によりカバー部材３１が上方へ持ち上げられて前記各頭付き割りピン４１が前記各係合穴部４７から同時に抜脱されることで、簡単にカバー部材３１を取り外すことができ、ウェハ７の交換を迅速に行うことができる。 Then, the cover member 31 is lifted upward by the repulsive force of the spring 33, and the cover pins 31 can be easily removed by simultaneously removing the head-attached split pins 41 from the engagement holes 47. The wafer 7 can be replaced quickly.

以上のことから、この実施の形態によれば、押さえ部材２５とその外側に設けたカバー部材３１との間にバネ３３などの付勢手段を設けたことで、このバネ３３の付勢力により押さえ部材２５を介してウェハ７に対して調整無しに一定の押圧荷重Ｗをかけることができる。また、カバー部材３１はキャッチ装置３９による脱着構造とすることで、ウェハ７の脱着を迅速に行うことができ、大幅な脱着時間の低減を図ることができる。 From the above, according to this embodiment, the biasing means such as the spring 33 is provided between the pressing member 25 and the cover member 31 provided on the outer side thereof, so that the pressing force is applied by the spring 33. A constant pressing load W can be applied to the wafer 7 through the member 25 without adjustment. Further, since the cover member 31 has a detachable structure by the catch device 39, the wafer 7 can be quickly detached, and the detachment time can be greatly reduced.

また、上記のバネ３３などの付勢手段を交換することで、押圧荷重の制御を容易に行うことができる。 Further, the pressure load can be easily controlled by exchanging the biasing means such as the spring 33 described above.

次に、第２の実施の形態のキャッチ装置５５について、前述した実施の形態のキャッチ装置３９と同様の部分は同じ符号で説明し、主として異なる点を説明する。 Next, regarding the catch device 55 of the second embodiment, the same parts as those of the catch device 39 of the above-described embodiment will be described with the same reference numerals, and different points will be mainly described.

このキャッチ装置５５は、図６および図７に示されているように、複数の頭付き割りピン４１が前記第２シール部材３７より外周に位置する同心円上で前記治具本体３に配置されている。前記頭付き割りピン４１は、治具本体３に固定された基部４３と、この基部４３の先端に一体的に形成された頭部４５とからなる。さらに、前記カバー部材３１には、前記複数の各頭付き割りピン４１に対応して係合可能に配置した複数の係合穴部４７が設けられており、各係合穴部４７は、図４に示されているように、前記頭付き割りピン４１の頭部４５を挿通可能な第１穴部５７を備え、かつ、前記第１穴部５７に連通して前記複数の頭付き割りピン４１と同じ同心円上に長く、かつ前記頭付き割りピン４１の基部４３を挿通可能で前記第１穴部５７より小さい短径の長穴部５９と、で構成されている。 As shown in FIGS. 6 and 7, the catch device 55 includes a plurality of headed split pins 41 arranged on the jig body 3 on a concentric circle located on the outer periphery of the second seal member 37. Yes. The headed split pin 41 includes a base portion 43 fixed to the jig body 3 and a head portion 45 formed integrally with the tip of the base portion 43. Further, the cover member 31 is provided with a plurality of engagement hole portions 47 arranged to be able to engage with the plurality of split pins 41 with the heads. As shown in FIG. 4, a first hole portion 57 through which the head 45 of the headed split pin 41 can be inserted is provided, and the plurality of headed split pins communicates with the first hole portion 57. The long hole 59 has a short diameter smaller than that of the first hole 57 and can be inserted through the base 43 of the split pin 41 with the head.

なお、この第２の実施の形態では、上記の長穴部５９が第１穴部５７の両側に設けられており、詳しくは後述するようにカバー部材３１を図５において時計、反時計回りのいずれの方向に回転させても良いので、簡単に操作できるという点で望ましいが、複数の係合穴部４７において各長穴部５９が全て第１穴部５７の同じ方向の片側だけでも良い。 In the second embodiment, the long hole portion 59 is provided on both sides of the first hole portion 57. As will be described in detail later, the cover member 31 is rotated clockwise or counterclockwise in FIG. Since it can be rotated in any direction, it is desirable from the viewpoint that it can be easily operated. However, in each of the plurality of engagement holes 47, all the long holes 59 may be only on one side of the first hole 57 in the same direction.

再び図４及び図５を参照するに、この実施の形態では、上記のカバー部材３１には、前記複数の各係合穴部４７に対応する位置に、複数の椀状凹み部６１が設けられている。しかも、上記の各係合穴部４７が前記各椀状凹み部６１に設けられている。 4 and 5 again, in this embodiment, the cover member 31 is provided with a plurality of hook-shaped recess portions 61 at positions corresponding to the plurality of engagement hole portions 47. ing. Moreover, each of the engagement hole portions 47 is provided in each of the hook-shaped recess portions 61.

図６及び図７を併せて参照するに、この実施の形態では、上記の各頭付き割りピン４１は、前述した第１の実施の形態と同様に、割り付き４１Ａを備えた４つ割りピンである。この割り付き４１Ａは２つ割り、３つ割り、あるいは４つ割りなどのように限定されない。しかも、図７（Ｂ）に示されているように、前記各係合穴部４７の第１穴部５７は、前記各頭付き割りピン４１が原位置の状態、つまり撓ませない状態では頭部４５が挿通できず、かつ、前記各頭付き割りピン４１を撓ませて小さくした状態の頭部４５を挿通可能な径であることが望ましい。 Referring to FIGS. 6 and 7 together, in this embodiment, each of the above-mentioned split pins 41 with a head is divided into four pins having a split 41A, as in the first embodiment described above. It is. The allocation 41A is not limited to two, three, four, or the like. In addition, as shown in FIG. 7B, the first hole portion 57 of each engagement hole portion 47 has a head when the split pins 41 with heads are in their original positions, that is, when they are not bent. It is desirable that the diameter is such that the head 45 in a state where the portion 45 cannot be inserted and the split pins 41 with heads are bent to be small is inserted.

その理由は、一旦、各頭付き割りピン４１が係合穴部４７の第１穴部５７に挿通された後は、再び外力を加えて頭付き割りピン４１を撓ませて小さくしなければ各頭付き割りピン４１が係合穴部４７の第１穴部５７から抜けず、メッキ工程時にカバー部材３１が治具本体３から簡単に脱落することはないからである。 The reason for this is that once each headed split pin 41 is inserted into the first hole 57 of the engagement hole 47, an external force is applied again to flex the headed split pin 41 to make it smaller. This is because the split pin 41 with the head does not come out of the first hole portion 57 of the engagement hole portion 47 and the cover member 31 is not easily dropped from the jig body 3 during the plating process.

また、上記の頭付き割りピン４１は、前述した第１の実施の形態と同様に、脱着用治具４９を用いて容易に頭付き割りピン４１を撓ませて小さくできるという点で、頭部４５の先端が小径に形成されていることが望ましい。さらに、頭部４５の下部の外周には、図６及び図７に示されているように、例えばＲ形状の丸み部４５Ａを形成していることが、頭付き割りピン４１が頭部４５の丸み部４５Ａで椀状凹み部６１の湾曲面をスライドし易くできるという点で、望ましい。 In addition, the above-mentioned split pin 41 with a head is similar to the first embodiment described above in that the split pin 41 with a head can be easily bent and reduced using the detaching jig 49. It is desirable that the tip of 45 has a small diameter. Further, as shown in FIGS. 6 and 7, for example, an R-shaped round portion 45 A is formed on the outer periphery of the lower portion of the head 45. The rounded portion 45A is desirable in that it can easily slide the curved surface of the bowl-shaped recessed portion 61.

上記構成により、第２の実施の形態のキャッチ装置５５の作用を説明すると、図７（Ａ）に示されているように、カバー部材３１の複数の係合穴部４７の第１穴部５７と治具本体３の複数の各頭付き割りピン４１がそれぞれ対応する位置で位置決めされてから、各頭付き割りピン４１がそれぞれに対応する各係合穴部４７の第１穴部５７に挿通するように、前記カバー部材３１を上から押圧する。このとき、カバー部材３１のほぼ中央にあるバネ３３の付勢力により押さえ部材２５のほぼ中央が押圧されると、上方からの押圧荷重Ｗが押さえ部材２５の円板２７を介して弾性部材２９にほぼ均一に伝達され、ウェハ７の外周縁が第１シール部材１７に均一な荷重で押圧される。 The operation of the catch device 55 according to the second embodiment will be described with the above configuration. As shown in FIG. 7A, the first hole portions 57 of the plurality of engagement hole portions 47 of the cover member 31. And the plurality of head splitting pins 41 of the jig body 3 are positioned at the corresponding positions, and then each head splitting pin 41 is inserted into the first hole 57 of each of the corresponding engagement holes 47. The cover member 31 is pressed from above. At this time, when almost the center of the pressing member 25 is pressed by the urging force of the spring 33 at the substantially center of the cover member 31, the pressing load W from above is applied to the elastic member 29 via the disk 27 of the pressing member 25. The outer peripheral edge of the wafer 7 is pressed against the first seal member 17 with a uniform load.

一方、カバー部材３１が前記バネ３３の上方への反発力に抗して上から押圧されると、図７（Ｂ）に示されているように、４つ割り型の複数の各頭付き割りピン４１が第１穴部５７により撓んで頭部４５が小さい径になって前記第１穴部５７に挿通される。カバー部材３１が図７（Ｃ）の状態まで押圧されて４つ割り型の複数の各頭付き割りピン４１が原位置に復帰してから、カバー部材３１を同心円上で例えば図５において反時計回り方向に回転させると、図７（Ｄ）に示されているように、複数の各頭付き割りピン４１の基部４３が係合穴部４７の長穴部５９に挿入されることになる。 On the other hand, when the cover member 31 is pressed from above against the upward repulsive force of the spring 33, as shown in FIG. The pin 41 is bent by the first hole 57 and the head 45 has a small diameter and is inserted into the first hole 57. After the cover member 31 is pressed to the state shown in FIG. 7C and each of the four split-type split pins 41 is returned to the original position, the cover member 31 is concentrically arranged, for example, counterclockwise in FIG. When rotated in the turning direction, the base portion 43 of each of the plurality of split pins 41 with a head is inserted into the elongated hole portion 59 of the engagement hole portion 47 as shown in FIG.

なお、図５においては、カバー部材３１を回転したときに頭付き割りピン４１が係合穴部４７の各位置でどのような状態になるかを二点鎖線で示したものであり、実際には頭付き割りピン４１の側が移動するわけではない。 In FIG. 5, the state in which the headed split pin 41 is in each position of the engagement hole 47 when the cover member 31 is rotated is indicated by a two-dot chain line. Does not move the headed split pin 41 side.

したがって、カバー部材３１の係合穴部４７に椀状凹み部６１が設けられているので、第１穴部５７の厚さが小さくなるために各頭付き割りピン４１の頭部４５が第１穴部５７を通過する距離が短くなる。つまり、カバー部材３１をより下方へ押圧する必要がないので、操作が簡単になる。この点が、第１の実施の形態のキャッチ装置３９とは異なる第２の実施の形態のキャッチ装置５５の効果である。複数の頭付き割りピン４１に対して複数の係合穴部４７を同時に深く押圧する場合は、係合穴部４７の深さが大きければ大きいほど、あまり偏りなくほぼ均等に押圧する必要があるが、第２の実施の形態の場合は第１穴部５７の深さが小さいので、上記の偏りをそれほど気にすることなくできる。 Accordingly, since the hook-shaped recess 61 is provided in the engagement hole 47 of the cover member 31, the thickness of the first hole 57 is reduced, so that the head 45 of each split pin 41 with the head is the first. The distance passing through the hole 57 is shortened. That is, since it is not necessary to press the cover member 31 downward, the operation is simplified. This is the effect of the catch device 55 of the second embodiment, which is different from the catch device 39 of the first embodiment. When the plurality of engagement hole portions 47 are pressed deeply simultaneously with respect to the plurality of split pins 41 with a head, the greater the depth of the engagement hole portion 47, the more it is necessary to press almost evenly without bias. However, in the case of the second embodiment, since the depth of the first hole portion 57 is small, the above-described bias can be made without much concern.

上記のカバー部材３１がさらに反時計回り方向に回転されると、カバー部材３１が図７（Ｄ）において右方向へ移動するので、各頭付き割りピン４１の頭部４５の付け根の部分が図６（Ａ）及び図７（Ｄ）に示されているように前記長穴部５９の付近の椀状凹み部６１の湾曲形状に沿うことになり、図７（Ｅ）に示されているようにカバー部材３１の上面が各頭付き割りピン４１の頭部４５の付け根部まで次第に下方へ押し下げられることになる。このとき、頭付き割りピン４１は頭部４５の丸み部４５Ａで椀状凹み部６１の湾曲面を容易にスライドすることができる。そして、最終的に、リング状の第２シール部材３７が、図１に示されているようにカバー部材３１と治具本体３との間に挟まれて若干潰されることで確実にシールされると共に、キャッチ装置５５による締結が完了する。 When the cover member 31 is further rotated in the counterclockwise direction, the cover member 31 moves to the right in FIG. 7D, so that the base part of the head 45 of each split pin 41 with a head is illustrated. 6 (A) and 7 (D), it follows the curved shape of the bowl-shaped recess 61 in the vicinity of the slot 59, as shown in FIG. 7 (E). Further, the upper surface of the cover member 31 is gradually pushed down to the base of the head 45 of each split pin 41 with a head. At this time, the split pin 41 with the head can easily slide on the curved surface of the bowl-shaped recess 61 at the rounded portion 45 A of the head 45. And finally, the ring-shaped second seal member 37 is sandwiched between the cover member 31 and the jig body 3 as shown in FIG. At the same time, the fastening by the catch device 55 is completed.

以上のように、係合穴部４７の周囲に椀状凹み部６１を設けたので、複数の頭付き割りピン４１を複数の係合穴部４７の第１穴部５７に容易に挿通できると共に、カバー部材３１を簡単に回転せしめて締結を終了することができる。しかも、メッキ工程時に、何らかの外力がかかってカバー部材３１が回転したとしても、頭付き割りピン４１が係合穴部４７の第１穴部５７から抜けないので、カバー部材３１が治具本体３から簡単に脱落しない。 As described above, since the hook-shaped recess 61 is provided around the engagement hole 47, the plurality of headed split pins 41 can be easily inserted into the first holes 57 of the plurality of engagement holes 47. The fastening can be completed by simply rotating the cover member 31. Moreover, even if the cover member 31 rotates due to some external force during the plating process, the headed split pin 41 does not come out of the first hole 57 of the engagement hole 47, so that the cover member 31 is fixed to the jig body 3. Do not fall off easily.

なお、この第２の実施の形態のキャッチ装置５５の場合、治具本体３からカバー部材３１を取り外すときは、前述した脱着用治具４９を用いて簡単に行うことができる。なお、この場合は、脱着用治具４９の円筒部５１の内径は、前記係合穴部４７の第１穴部５７の直径より僅かに小さく形成されている。 In the case of the catch device 55 according to the second embodiment, the cover member 31 can be easily removed from the jig body 3 by using the above-described detachment jig 49. In this case, the inner diameter of the cylindrical portion 51 of the attaching / detaching jig 49 is slightly smaller than the diameter of the first hole portion 57 of the engagement hole portion 47.

したがって、治具本体３からカバー部材３１を取り外すときは、カバー部材３１を前記各係合穴部４７の第１穴部５７が前記各頭付き割りピン４１に位置するまで回転させてから、第１の実施の形態と同じように前記脱着用治具４９の複数の円筒部５１を同時に押し込むことにより、前記複数の頭付き割りピン４１が同時に前記各円筒部５１の内周面で撓んで小さくされる。 Therefore, when removing the cover member 31 from the jig main body 3, the cover member 31 is rotated until the first hole portion 57 of each engagement hole portion 47 is positioned at each of the split pins 41 with the head, In the same manner as in the first embodiment, the plurality of head-parting split pins 41 are simultaneously bent on the inner peripheral surface of each of the cylindrical parts 51 to be small by pressing the plurality of cylindrical parts 51 of the detachable jig 49 simultaneously. Is done.

すると、バネ３３の反発力によりカバー部材３１が上方へ持ち上げられて前記各頭付き割りピン４１が前記各係合穴部４７の第１穴部５７から同時に抜脱されることで、簡単にカバー部材３１を取り外すことができ、ウェハ７の交換を迅速に行うことができる。 Then, the cover member 31 is lifted upward by the repulsive force of the spring 33 and the split pins 41 with the heads are simultaneously removed from the first hole portions 57 of the engagement hole portions 47, so that the cover can be easily covered. The member 31 can be removed, and the wafer 7 can be replaced quickly.

次に、第３の実施の形態のキャッチ装置６３について、前述した第２の実施の形態のキャッチ装置５５と同様の部分は同じ符号で説明し、異なる点のみ説明する。 Next, in the catch device 63 of the third embodiment, the same parts as those of the catch device 55 of the second embodiment described above will be described with the same reference numerals, and only different points will be described.

前述した第２の実施の形態のキャッチ装置５５では、治具本体３の複数の各頭付き割りピン４１は割りピンであるが、この第３の実施の形態のキャッチ装置６３では、単なる頭付きピン６５である。さらに、カバー部材３１の係合穴部４７は第２の実施の形態と同様の第１穴部５７と長穴部５９とで構成されているが、椀状凹み部６１は設けられていない。しかし、椀状凹み部６１を設けても良く、特に限定されない。また、単なる頭付きピン６５であるので、第１穴部５７は頭付きピン６５の頭部４５を挿通可能な径であり、長穴部５９は頭付きピン６５の基部４３を挿通可能である。 In the catch device 55 of the second embodiment described above, each of the plurality of head split pins 41 of the jig body 3 is a split pin. However, in the catch device 63 of the third embodiment, a simple head is attached. Pin 65. Further, the engagement hole 47 of the cover member 31 is composed of a first hole 57 and a long hole 59 similar to those of the second embodiment, but the hook-shaped recess 61 is not provided. However, the bowl-shaped dent 61 may be provided and is not particularly limited. Further, since it is a mere headed pin 65, the first hole portion 57 has a diameter that allows the head 45 of the headed pin 65 to be inserted, and the elongated hole portion 59 can pass through the base portion 43 of the headed pin 65. .

したがって、複数の各頭付きピン６５がそれぞれに対応する各係合穴部４７の第１穴部５７に挿通するように、前記カバー部材３１を上から押圧する。複数の各頭付きピン６５が前記各第１穴部５７に挿通されてから、カバー部材３１を同心円上で回転させて、各頭付きピン６５の基部４３を係合穴部４７の長穴部５９の先端まで挿入させることで、キャッチ装置６３による締結が完了する。なお、前述した第２の実施の形態と比較すると操作性が若干低下するが、その他の作用、効果は第２の実施の形態とほぼ同様であり、十分に適用可能である。 Therefore, the cover member 31 is pressed from above so that the plurality of headed pins 65 are inserted into the first hole portions 57 of the corresponding engagement hole portions 47. After the plurality of headed pins 65 are inserted into the first hole portions 57, the cover member 31 is rotated concentrically so that the base portions 43 of the headed pins 65 are elongated holes of the engaging hole portions 47. By inserting the tip of 59, the fastening by the catch device 63 is completed. Although the operability is slightly lowered as compared with the second embodiment described above, other operations and effects are substantially the same as those of the second embodiment, and can be sufficiently applied.

この発明の実施の形態のメッキ治具の断面図である。It is sectional drawing of the plating jig | tool of embodiment of this invention. （Ａ）は図１の分解断面図で、（Ｂ）は（Ａ）のＩＩＢの拡大図である。(A) is an exploded sectional view of FIG. 1, and (B) is an enlarged view of IIB of (A). 図１の概略的な分解斜視図である。FIG. 2 is a schematic exploded perspective view of FIG. 1. カバー部材における椀型凹み部に設けた係合穴部の斜視図である。It is a perspective view of the engagement hole provided in the saddle-shaped dent part in a cover member. カバー部材の係合穴部と頭付きピンとの係合状態を示す平面図である。It is a top view which shows the engagement state of the engagement hole part of a cover member, and a headed pin. （Ａ）は図５の矢視ＶＩＡ−ＶＩＡ線の断面図で、（Ｂ）は図５の矢視ＶＩＢ−ＶＩＢ線の断面図である。(A) is sectional drawing of the arrow VIA-VIA line of FIG. 5, (B) is sectional drawing of the arrow VIB-VIB line of FIG. （Ａ）〜（Ｅ）は図５の矢視ＶＩＩ−ＶＩＩ線の断面図である。(A)-(E) are sectional drawings of the arrow VII-VII line of FIG. この発明の他の実施の形態を示す概略的な斜視図である。It is a schematic perspective view which shows other embodiment of this invention. 従来のメッキ治具の断面図である。It is sectional drawing of the conventional plating jig.

符号の説明Explanation of symbols

１メッキ治具
３治具本体
５クランプ用穴部
７ウェハ（電子回路基板）
７Ａ表面（ウェハの）
７Ｂ裏面（ウェハの）
９メッキ用穴部
１１給電電極
１７第１シール部材
２５押さえ部材
２７円板
２９弾性部材
３１カバー部材
３３バネ（付勢手段）
３７第２シール部材
３９キャッチ装置（第１の実施の形態の）
４１頭付き割りピン
４１Ａ割り付き
４３基部
４５頭部
４５Ａ丸み部
４７係合穴部
５５キャッチ装置（第２の実施の形態の）
５７第１穴部
５９長穴部
６１椀状凹み部
６３キャッチ装置（第３の実施の形態の）
６５頭付きピン 1 Plating jig 3 Jig body 5 Clamping hole 7 Wafer (electronic circuit board)
7A Surface (of wafer)
7B Back side (wafer)
9 Plating hole 11 Feed electrode 17 First seal member 25 Holding member 27 Disk 29 Elastic member 31 Cover member 33 Spring (biasing means)
37 Second seal member 39 Catch device (of the first embodiment)
41 split pin with head 41A split 43 base 45 head 45A rounded portion 47 engagement hole 55 catch device (of the second embodiment)
57 1st hole part 59 Elongate hole part 61 bowl-shaped recessed part 63 Catch apparatus (3rd Embodiment)
65 headed pin

Claims

メッキ用穴部を備えると共に前記メッキ用穴部の周縁に沿って設けた複数の給電電極を備えた治具本体と、
メッキすべき電子回路基板の表面が前記給電電極と接続すべく載置セット可能に、前記メッキ用穴部の周縁に沿って前記治具本体に配置されたリング状の第１シール部材と、
前記電子回路基板の裏面に当接して当該電子回路基板を前記第１シール部材に押さえつける押さえ部材と、
この押さえ部材を前記第１シール部材に向けて付勢する付勢手段を介して前記電子回路基板の裏面全体を覆うカバー部材と、
このカバー部材と治具本体との間で前記押さえ部材の外周に沿って配置されたリング状の第２シール部材と、
前記カバー部材と治具本体とを前記付勢手段の付勢力に抗して前記カバー部材と治具本体との間を位置決めして締結するキャッチ装置と、で構成されていることを特徴とするメッキ治具。 A jig body provided with a plurality of power supply electrodes provided with a plating hole and along the periphery of the plating hole;
A ring-shaped first seal member disposed on the jig body along the periphery of the plating hole so that the surface of the electronic circuit board to be plated can be placed and set to be connected to the power supply electrode;
A pressing member that contacts the back surface of the electronic circuit board and presses the electronic circuit board against the first seal member;
A cover member that covers the entire back surface of the electronic circuit board via biasing means that biases the pressing member toward the first seal member;
A ring-shaped second seal member disposed along the outer periphery of the pressing member between the cover member and the jig body;
A catch device that positions and fastens the cover member and the jig main body between the cover member and the jig main body against the biasing force of the biasing means. Plating jig.

前記キャッチ装置が、前記治具本体に、前記第２シール部材より外周に位置して配置した複数の頭付き割りピンと、
前記カバー部材に、前記複数の各頭付き割りピンに対応して係合可能に配置した複数の係合穴部であって、前記各頭付き割りピンを撓ませて小さくした状態の頭部を挿通可能な径である複数の係合穴部と、で構成されていることを特徴とする請求項１記載のメッキ治具。 A plurality of split pins with heads arranged on the jig body, located on the outer periphery of the second seal member;
A plurality of engagement holes arranged in the cover member so as to be able to engage with the plurality of split pins with heads, wherein the head in a state in which the split pins with heads are bent and made small The plating jig according to claim 1, comprising a plurality of engagement holes each having a diameter that can be inserted.

前記キャッチ装置が、前記治具本体に、前記第２シール部材より外周に位置する同心円上に配置した複数の頭付きピンと、
前記カバー部材に、前記複数の各頭付きピンに対応して係合可能に配置した複数の係合穴部であって、前記頭付きピンの頭部を挿通可能な第１穴部を備えると共に前記第１穴部に連通して前記複数の頭付きピンと同じ同心円上に長く、かつ前記頭付きピンの基部を挿通可能で前記第１穴部より小さい短径の長穴部を備えた複数の係合穴部と、で構成されていることを特徴とする請求項１記載のメッキ治具。 A plurality of headed pins arranged on a concentric circle located on the outer periphery of the jig body in the jig body;
The cover member includes a plurality of engagement holes arranged to be engageable with each of the plurality of headed pins, and having a first hole through which the head of the headed pin can be inserted. A plurality of long holes with a short diameter smaller than the first hole, which are in communication with the first hole and are long on the same concentric circle as the plurality of headed pins, and can be inserted through the base of the headed pin. The plating jig according to claim 1, comprising an engagement hole portion.

前記各頭付きピンが割りピンであると共に前記各係合穴部の第１穴部が前記各頭付きピンを撓ませて小さくした状態の頭部を挿通可能な径であることを特徴とする請求項３記載のメッキ治具。 Each of the headed pins is a split pin, and the first hole portion of each of the engagement hole portions has a diameter that allows insertion of a head in a state where the headed pin is bent to be small. The plating jig according to claim 3.

前記カバー部材に複数の椀状凹み部を設け、かつ前記各椀状凹み部に前記係合穴部を設けたことを特徴とする請求項３又は４記載のメッキ治具。 5. The plating jig according to claim 3, wherein the cover member is provided with a plurality of bowl-shaped depressions, and the engagement holes are provided in the bowl-like depressions.