JP2008128935A - Rack in burn-in device vessel - Google Patents

Rack in burn-in device vessel Download PDF

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JP2008128935A
JP2008128935A JP2006316715A JP2006316715A JP2008128935A JP 2008128935 A JP2008128935 A JP 2008128935A JP 2006316715 A JP2006316715 A JP 2006316715A JP 2006316715 A JP2006316715 A JP 2006316715A JP 2008128935 A JP2008128935 A JP 2008128935A
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board
light receiving
inspection
plane
rack frame
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JP4646037B2 (en
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Shinichi Oe
慎一 大江
Kazuhiro Takeuchi
一広 武内
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To carry out burn-in (electrify a device in a high-temperature oven to remove a defective object indicating an initial failure mode) for a large number of LD elements under a stable condition, while keeping an inspection board and device compact. <P>SOLUTION: This rack in a burn-in device vessel is provided with the inspection board 9 mounted with the plurality of LD elements on a plane, and built in with a heat sink, a photoreception detecting board 2 provided opposedly to the plane mounted with the LD elements of the inspection board 9, and provided, in an inside of the plane, with a photoreception element for detecting an output of the LD element corresponding to each of the LD elements, a fixed rack frame 1 for attaching the photoreception detecting board 2, a moving rack frame 7 for mounting the inspection board, a pressurizing mechanism part 5 for elevating vertically the moving rack frame 7, and for imparting a load between a face of each LD element and the plane of the detecting board 2, and a connector board 3 attached with a connector joined to the photoreception detecting board 2 for supplying a current to the LD element, and a connector joined to the inspection board. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

この発明は、ＬＤ素子をエージングボードに装着して所定条件下で駆動させ評価試験（バーイン：ＢＩ）するＢＩ装置内に設置される槽内ラックの改良に関する。   The present invention relates to an improvement of an in-tank rack installed in a BI apparatus that is mounted on an aging board and is driven under a predetermined condition to perform an evaluation test (burn-in: BI).

電子デバイスの製造分野では、デバイスを製品に組み付ける前にそれらを製品の初期故障を低減させる目的で高温のオーブン内でデバイスに通電を行い、初期故障モードを示す不具合品を除去するバーイン（以下、ＢＩと記述）と呼ばれるスクリーニングテストを実施している。   In the field of manufacturing electronic devices, before assembling the devices into the product, the burn-in (hereinafter referred to as “the failure of the initial failure mode”) is performed by energizing the devices in a high-temperature oven to reduce the initial failures of the products. A screening test called BI is described.

ＬＤ素子においても初期故障品を事前に排除するために恒温槽内で一定時間ＬＤ素子に一定のパワーで発光するように通電を行い、その発光量を受光（ＰＤ）素子で確認している。すなわち、オートパワーコントロール（ＡＰＣ制御）によりＬＤ素子の発光量が小さくなってくると装置から通電される電流を増やして一定の発光量になるように制御している。そして、この電流値がある範囲内に入っていない素子については初期故障モードを示す不具合品として除去される。このスクリーニングテストで重要なことは、ＬＤ素子を通電させながらＬＤ素子の温度を一定に保つことである。ＬＤ素子は発光すると自己発熱するため、ＬＤ素子の温度が上昇し、それにともない特性が変化してしまい、正しい試験ができなくなる。   Also in the LD element, in order to eliminate the initial failure product in advance, the LD element is energized so that the LD element emits light at a constant power for a certain period of time, and the light emission amount is confirmed by the light receiving (PD) element. That is, when the light emission amount of the LD element is reduced by auto power control (APC control), the current supplied from the apparatus is increased so that the light emission amount becomes constant. An element that does not fall within a certain current range is removed as a defective product indicating the initial failure mode. What is important in this screening test is to keep the temperature of the LD element constant while energizing the LD element. Since the LD element self-heats when it emits light, the temperature of the LD element rises, and the characteristics change accordingly, and a correct test cannot be performed.

例えば、特許文献1では、検査ボードにＬＤ素子をセットするコネクタ部に発光による発熱を効率よく放熱させる工夫をして素子を一定温度に保つようにしたものがあり、また、例えば、特許文献２では、ヒートシンクを設けてヒートシンクにヒートパイプを接続して発熱を効率よく放熱させている。   For example, in Patent Document 1, there is one in which a device for setting an LD element on an inspection board is devised to efficiently dissipate heat generated by light emission so as to keep the element at a constant temperature. Then, a heat sink is provided and a heat pipe is connected to the heat sink to efficiently dissipate heat.

特開２００６−１５３５８４号公報（第６−第１０頁、図１−図６）JP 2006-153584 A (page 6-10, FIGS. 1-6) 特開２００６−１４５３９６号公報（第５−第６頁、図１−図４）JP 2006-145396 A (Page 5-6, FIGS. 1-4)

上記のように、従来の発明では検査ボードやヒートシンクの構造を工夫することでＬＤ素子の自己発熱を効率よく放熱する対策をほどこしている。しかしながら、ＬＤ素子をバーインする装置において効率よく試験するためには１つの検査ボードに多数個のＬＤ素子を搭載し、その検査ボードを複数段一挙にテストすることが望まれる。このような場合、上記のような従来の発明では、ヒートシンクやＬＤ素子をセットするコネクタ部に対して個々のＬＤ素子にたいしてその対策をする必要であることから、多数個を一挙に実施する場合、その個数分の機構が必要となり、検査ボードの寸法が大きくなったり、ＢＩ装置自体が巨大なものになるといった問題がある。   As described above, the conventional invention takes measures to efficiently dissipate the self-heating of the LD element by devising the structure of the inspection board and the heat sink. However, in order to test efficiently in an apparatus that burns in LD elements, it is desirable to mount a large number of LD elements on one inspection board and test the inspection boards in a plurality of stages. In such a case, in the conventional invention as described above, since it is necessary to take countermeasures for each LD element with respect to the connector part for setting the heat sink and the LD element, There are problems that the number of mechanisms is required, the size of the inspection board becomes large, and the BI apparatus itself becomes huge.

また、検査ボードやヒートシンク部の構造が複雑になるといった問題がある。   There is also a problem that the structure of the inspection board and the heat sink is complicated.

この発明は、上記のような問題点を解決するためになされたものであり、検査ボードやヒートシンク個々に対策を施すのでなく、ＢＩ装置の槽内ラック構造を見直すことで、検査ボード及び装置をコンパクトに保ちつつ、多数のＬＤ素子を安定した状態でＢＩできるようにすることを目的としている。   The present invention has been made to solve the above-mentioned problems. Instead of taking measures for each inspection board and heat sink, the inspection board and apparatus are improved by reviewing the rack structure in the tank of the BI apparatus. The object is to enable a large number of LD elements to be BI in a stable state while maintaining compactness.

この発明に係るバーイン装置槽内ラックは、
ＬＤ素子を平面に複数個搭載し、ヒートシンクを内蔵した検査ボードと、
上記検査ボードの上記ＬＤ素子を搭載した平面と対向して設けられ、上記ＬＤ素子それぞれに対応する上記ＬＤ素子の出力を検知する受光素子を平面内部に備えた受光検知ボードと、
上記検査ボードまたは受光検知ボードのいずれか一方を取り付ける固定ラックフレーム及び上記検査ボードまたは受光検知ボードのいずれか他方を取り付ける移動ラックフレームと、
上記移動ラックフレームを上記平面と垂直な方向へ昇降させ、上記ＬＤ素子の面と上記受光検知ボードの平面との間に荷重を付加するための加圧機構部と、
上記ＬＤ素子に電流を供給するための上記受光検知ボードに接続されたコネクタ及び上記検査ボードに接続されたコネクタが取り付けられたコネクタボードと、
を備えたものである。 The rack in the burn-in device tank according to the present invention is:
An inspection board with multiple LD elements mounted on a flat surface and a built-in heat sink,
A light receiving detection board provided inside the plane with a light receiving element provided facing the plane on which the LD element of the inspection board is mounted, and detecting the output of the LD element corresponding to each of the LD elements;
A fixed rack frame to which one of the inspection board or the light reception detection board is attached, and a movable rack frame to which either the inspection board or the light reception detection board is attached;
A pressure mechanism for raising and lowering the movable rack frame in a direction perpendicular to the plane, and applying a load between the surface of the LD element and the plane of the light receiving detection board;
A connector connected to the light receiving detection board for supplying current to the LD element and a connector board to which a connector connected to the inspection board is attached;
It is equipped with.

この発明に係るバーイン装置槽内ラックによれば、ＬＤ素子の面と受光検知ボードの平面と均一な接触状態になり、ＬＤ素子が安定した動作になるとともに、各ボードの構造が簡易化されバーイン装置槽内ラックがコンパクトになる。   According to the rack in the burn-in apparatus tank according to the present invention, the surface of the LD element and the plane of the light receiving detection board are in uniform contact, the LD element operates stably, the structure of each board is simplified, and the burn-in The rack in the equipment tank becomes compact.

実施の形態１．
図１は、この発明に係るＢＩ装置槽内ラックの実施の形態１を示す側面の断面図、図２は、図１の矢視Ａからの検査ボード及び受光検知ボード２段分を拡大した正面図、図３は、上下機構部の詳細構成図、図４は、ＬＤ素子と受光素子の位置関係を示す図、図５は、コネクタボードの正面図、図６は、コネクタボードの側面図である。 Embodiment 1 FIG.
FIG. 1 is a side sectional view showing Embodiment 1 of a rack in a BI apparatus tank according to the present invention, and FIG. 2 is an enlarged front view of the inspection board and the light receiving detection board from the arrow A in FIG. 3 is a detailed configuration diagram of the vertical mechanism, FIG. 4 is a diagram showing the positional relationship between the LD element and the light receiving element, FIG. 5 is a front view of the connector board, and FIG. 6 is a side view of the connector board. is there.

図１に示したように、この発明に係るＢＩ装置槽内ラックは、固定ラックフレーム１に複数枚の受光検知ボード２が搭載されている。受光検知ボード２は、コネクタボード３に設置されている受光検知ボード用コネクタ４を介してＢＩ装置本体と電気的に接続されている。また、ヒートシンクを内蔵する検査ボード９は、移動ラックフレーム７に受光検知ボード２と同数枚だけ搭載され、受光検知ボード２同様、コネクタボード３に設置されている検査ボード用コネクタ１０を介してＢＩ装置本体と電気的に接続されている。受光検知ボード２と検査ボード９とは、平面が対向して対をなし、複数個の対が構成される。コネクタボード３は移動ラックフレーム７に取り付けられおり、上下機構８を用いて、コネクタ部に応力が加わらないように移動ラックフレーム７と同期して上下する。また、図３に示したように、移動ラックフレーム７は、上下機構部８にある角度（例えば２度）に傾斜して取り付けたＬＭ（昇降機構）ガイド１２を介して上下機構部８の可動ステージ１１と接続されている。図３において、上下機構部８は可動ステージ１１を左に移動量ＬだけスライドさせることでＬＭガイド１２が可動ステージ１１とともに移動量Ｌだけスライドして、移動ラックフレーム７全体を昇降量Ｘだけ上下させる。また、図２に示したように、受光検知ボード２上部と固定ラックフレーム１との間には複数のコイルバネ６が設置され、上下機構部８とコイルバネ６との作用による加圧機構５により、受光検知ボード２と検査ボード９のＬＤ素子との間に荷重を与える。   As shown in FIG. 1, in the BI apparatus tank rack according to the present invention, a plurality of light receiving detection boards 2 are mounted on a fixed rack frame 1. The light reception detection board 2 is electrically connected to the main body of the BI apparatus via a light reception detection board connector 4 installed on the connector board 3. In addition, the same number of inspection boards 9 with a built-in heat sink are mounted on the movable rack frame 7 as many as the light reception detection boards 2, and like the light reception detection boards 2, the inspection boards 9 are connected via the inspection board connectors 10 installed on the connector board 3. It is electrically connected to the device body. The light-receiving detection board 2 and the inspection board 9 are paired with their planes facing each other to form a plurality of pairs. The connector board 3 is attached to the movable rack frame 7 and is moved up and down in synchronization with the movable rack frame 7 so that no stress is applied to the connector portion by using the vertical mechanism 8. In addition, as shown in FIG. 3, the movable rack frame 7 can move the vertical mechanism unit 8 via an LM (elevating mechanism) guide 12 attached to the vertical mechanism unit 8 at an angle (for example, 2 degrees). It is connected to the stage 11. In FIG. 3, the vertical mechanism unit 8 slides the movable stage 11 to the left by the movement amount L, so that the LM guide 12 slides by the movement amount L together with the movable stage 11, and moves the entire movable rack frame 7 up and down by the vertical movement amount X. Let Also, as shown in FIG. 2, a plurality of coil springs 6 are installed between the upper part of the light receiving detection board 2 and the fixed rack frame 1, and the pressurizing mechanism 5 by the action of the vertical mechanism portion 8 and the coil spring 6 A load is applied between the light receiving detection board 2 and the LD element of the inspection board 9.

上記構成において、まずＬＤ素子１１を複数個（例えば１００個）搭載した検査ボード９を複数枚（例えば１０枚）を移動ラックフレーム７の各段に搭載する。検査ボードをＢＩ装置槽内ラックにセットする作業は、検査ボード９の作業性を考え、荷重が検査ボード９にかからない位置で行う。すなわち、図１において、移動ラックフレーム７が下に降りた位置で検査ボード９をセットする。所定の位置に検査ボード９を搭載した後、移動ラックフレーム７の下部にある上下機構部８を用いて検査ボード９を受光検知ボード２の下面に一挙に押し付ける。   In the above configuration, first, a plurality of (for example, 10) inspection boards 9 on which a plurality of (for example, 100) LD elements 11 are mounted are mounted on each stage of the movable rack frame 7. The operation of setting the inspection board on the rack in the BI apparatus tank is performed at a position where the load is not applied to the inspection board 9 in consideration of the workability of the inspection board 9. That is, in FIG. 1, the inspection board 9 is set at the position where the movable rack frame 7 is lowered. After mounting the inspection board 9 at a predetermined position, the inspection board 9 is pressed against the lower surface of the light receiving detection board 2 at once using the up-and-down mechanism portion 8 below the movable rack frame 7.

複数の検査ボード９と受光検知ボード２の対のそれぞれにおいて、一挙に、図４に示したように、検査ボード９が受光検知ボード２の下面に押し付けられ、各ＬＤ素子１５に対応して設置され、受光検知ボード２の下面からＬＤ素子１５の発光方向軸の方向に一定量凹んだ位置に表面を有する各受光素子１６が各ＬＤ素子１５の光量を受光することにより、ＢＩを実施することができる。上下機構８の動作は、手動で実施してもモータやエアシリンダを用いて自動で行ってもよい。   In each of a plurality of pairs of the inspection board 9 and the light reception detection board 2, the inspection board 9 is pressed against the lower surface of the light reception detection board 2 as shown in FIG. Then, each light receiving element 16 having a surface at a position recessed by a certain amount in the direction of the light emitting direction of the LD element 15 from the lower surface of the light receiving detection board 2 receives the light amount of each LD element 15 to perform BI. Can do. The operation of the vertical mechanism 8 may be performed manually or automatically using a motor or an air cylinder.

このように、この実施の形態1によれば、複数のＬＤ素子１５（今回の例では１０００個）と受光検知ボード２との加圧・接触状態を安定にし、複数のＬＤ素子１５の発熱を一つの検査ボード９で安定に放熱することができるので、複数のＬＤ素子１５を一挙に安定に作動させてＢＩを実施することができ、かつ、従来に比べて機構部が簡単にできるとともにＢＩ装置槽内ラックやＢＩ装置自体をコンパクトにすることができる。   Thus, according to the first embodiment, the pressurization / contact state between the plurality of LD elements 15 (1000 in this example) and the light receiving detection board 2 is stabilized, and the heat generation of the plurality of LD elements 15 is prevented. Since one inspection board 9 can stably dissipate heat, a plurality of LD elements 15 can be operated stably at a time to perform BI, and the mechanism can be simplified and BI can be made compared to the prior art. The rack in the apparatus tank and the BI apparatus itself can be made compact.

また、ＬＤ素子１５への加圧力は移動ラックフレーム７の上昇量Ｘと受光検知ボード２の背面にある加圧機構５のコイルバネ６のバネ定数Ｋで定義され、必要な加圧力（Ｋ×Ｘ）を設定している。この加圧力は移動ラックフレーム７の昇降量を変えることで微調整できるとともに、加圧力は、コイルバネ６自体を変更（バネ定数を変更）することにより変えることができるので、種々の素子に対応した加圧力を簡単に変更することが可能である。また、図３に示したように、移動ラックフレーム７の昇降量Ｘと上下機構の移動量Ｌの比率を大きくすることで（例えば２０：１）上下機構８の移動量Ｌにバラツキが発生しても移動ラックフレーム７の昇降量Ｘのバラツキは抑制することができ、加圧力のバラツキは無視してよい量にすることができる。   The pressure applied to the LD element 15 is defined by the amount X of the moving rack frame 7 and the spring constant K of the coil spring 6 of the pressurizing mechanism 5 on the back surface of the light receiving detection board 2, and the necessary pressure (K × X ) Is set. The applied pressure can be finely adjusted by changing the moving amount of the movable rack frame 7, and the applied pressure can be changed by changing the coil spring 6 itself (changing the spring constant). It is possible to easily change the applied pressure. In addition, as shown in FIG. 3, by increasing the ratio of the moving amount L of the moving rack frame 7 to the moving amount L of the vertical mechanism (for example, 20: 1), the moving amount L of the vertical mechanism 8 varies. Even in this case, the variation in the lift amount X of the movable rack frame 7 can be suppressed, and the variation in the applied pressure can be ignored.

また、図５に示したように、受光検知ボード用コネクタ４は長孔でコネクタボード３に支持されるようにしているので、図６に示したように、検査ボード用コネクタ１０及び受光検知ボード用コネクタ４のうち、検査ボード用コネクタ１０は移動ラックフレーム７の上下動と同期して上下し、受光検知ボード用コネクタ４は受光検知ボード２の加圧機構５のコイルバネ６の撓み分と同期して動くことができ、各ボードの基板に不要な曲げ応力がかかるのを防ぐことができる。また、検査ボード用コネクタ１０と受光検知ボード４とを接続するケーブルを柔軟に変形するフレキシブルケーブルを用いて構成してもよい。   Further, as shown in FIG. 5, the light receiving detection board connector 4 is supported by the connector board 3 with a long hole. Therefore, as shown in FIG. 6, the inspection board connector 10 and the light receiving detection board are used. Among the connectors 4 for inspection, the inspection board connector 10 moves up and down in synchronization with the vertical movement of the movable rack frame 7, and the light receiving detection board connector 4 synchronizes with the deflection of the coil spring 6 of the pressurizing mechanism 5 of the light receiving detection board 2. Thus, unnecessary bending stress can be prevented from being applied to the substrate of each board. Moreover, you may comprise using the flexible cable which deform | transforms the cable which connects the connector 10 for test | inspection boards, and the light reception detection board 4 flexibly.

また、各受光素子１６が、受光検知ボード２の下面からＬＤ素子１５の発光方向軸の方向に一定量凹んだ位置に表面を有するので、各ＬＤ素子１５と受光検知ボード２とが確実に加圧・接触し、各受光素子１６は各ＬＤ素子１５の発光を検知することができる。   Further, each light receiving element 16 has a surface at a position recessed by a certain amount in the direction of the light emitting direction of the LD element 15 from the lower surface of the light receiving detection board 2, so that each LD element 15 and the light receiving detection board 2 are surely added. Each light receiving element 16 can detect light emission of each LD element 15 under pressure and contact.

実施の形態２．
図７及び図８は、この発明に係るＢＩ装置槽内ラックの実施の形態２を示す正面図、図９は、この実施の形態２の動作を説明する図である。 Embodiment 2. FIG.
7 and 8 are front views showing a second embodiment of the BI apparatus tank rack according to the present invention, and FIG. 9 is a diagram for explaining the operation of the second embodiment.

上記実施の形態1では、複数のコイルバネの加圧力が一枚板の受光検知ボード２に加わるようにしていた（図２参照）が、この実施の形態２では、図７に示したように受光検知ボード２を複数に分割して、図８に示したように、固定ラックフレーム１と分割した各受光検知ボード２との間を接続ピン１４で接続し、接続ピン１４を中心に数度傾くことができるようにしている。   In the first embodiment, the pressurizing force of the plurality of coil springs is applied to the single light receiving detection board 2 (see FIG. 2). In the second embodiment, as shown in FIG. As shown in FIG. 8, the detection board 2 is divided into a plurality of parts, and the fixed rack frame 1 and each of the divided light receiving detection boards 2 are connected by connection pins 14 and tilted several degrees around the connection pins 14. To be able to.

コイルバネによる加圧のために検査ボードに撓みが生じ、その結果、ＬＤ素子と受光検知ボードとの加圧の不均一が生じるおそれがあるが、この実施の形態２によれば、ＬＤ素子と受光検知ボードとの加圧の不均一を解消することができる。   The inspection board is bent due to the pressurization by the coil spring, and as a result, there is a possibility that the pressurization of the LD element and the light receiving detection board may be uneven. According to the second embodiment, the LD element and the light receiving Unevenness of pressure with the detection board can be eliminated.

すなわち、図９に示したように、受光検知ボード２の分割を検査ボード９の撓み角度（ω）が大きくなる両端部分は分割面積を細かくして、受光検知ボード２が撓み角度（ω）傾くことにより検査ボード９と全面均一に接触し、撓み角度が小さくなる（０°に近くなる）検査ボード９の中央部は分割面積を大きくすること検査ボード９と全面均一に接触にして、ＬＤ素子の放熱が効率的に行われるようにすることができる。但し、分割数を増やせば増やすほど機構が複雑になってくるので、放熱の効率と装置の大きさを考慮に入れて分割数は決める必要がある。   That is, as shown in FIG. 9, when the light receiving detection board 2 is divided, both end portions where the bending angle (ω) of the inspection board 9 becomes large are made finer, and the light receiving detection board 2 is inclined by the bending angle (ω). Therefore, the central portion of the inspection board 9 that contacts the inspection board 9 uniformly and has a small deflection angle (close to 0 °) increases the divided area. Can be efficiently radiated. However, since the mechanism becomes more complex as the number of divisions increases, it is necessary to determine the number of divisions taking into consideration the efficiency of heat dissipation and the size of the device.

実施の形態３．
また、上記実施の形態１においては、検査ボードを上下機構で受光検知ボードに押し付ける構成としたが、受光検知ボードを検査ボードに押し付ける構成としても同様の効果が得られる。 Embodiment 3 FIG.
In the first embodiment, the inspection board is pressed against the light receiving detection board by the vertical mechanism, but the same effect can be obtained by pressing the light receiving detection board against the inspection board.

この場合、検査ボードをコイルバネを介して固定ラックフレームに取り付け、受光検知ボードを移動ラックフレームに取り付ける。   In this case, the inspection board is attached to the fixed rack frame via the coil spring, and the light receiving detection board is attached to the movable rack frame.

実施の形態４．
また、上記実施の形態１においてコイルバネによる加圧機構を受光検知ボード側に取り付け、上記実施の形態３においてコイルバネによる加圧機構を検査ボード側に取り付けた構成で述べたが、上記実施の形態１において検査ボード側にコイルバネによる加圧機構を持たせた装置構成、あるいは上記実施の形態３において受光検知ボード側にコイルバネによる加圧機構を持たせた装置構成でも同様の効果が得られる。 Embodiment 4 FIG.
In the first embodiment, the pressurizing mechanism by the coil spring is attached to the light receiving detection board side, and in the third embodiment, the pressurizing mechanism by the coil spring is attached to the inspection board side. In the apparatus configuration in which the pressurizing mechanism by the coil spring is provided on the inspection board side, or the apparatus configuration in which the pressurization mechanism by the coil spring is provided on the light receiving detection board side in the third embodiment, the same effect can be obtained.

この場合、コイルバネを設けた検査ボード側または受光検知ボード側に接続された検査ボード用コネクタまたは受光検知ボード用コネクタを図５に示したような長孔でコネクタボードに取り付けてコイルバネの撓みと同期して上下に移動できるようにする。   In this case, the inspection board connector or the light reception detection board connector connected to the inspection board side provided with the coil spring or the light reception detection board side is attached to the connector board with a long hole as shown in FIG. 5 to synchronize with the bending of the coil spring. To be able to move up and down.

本発明に係るＢＩ装置槽内ラックは、ＬＤ素子をエージングボードに装着して所定条件下で駆動させＢＩ評価試験するＢＩ装置に有効に利用することができる。   The rack in the BI apparatus tank according to the present invention can be effectively used for a BI apparatus for performing a BI evaluation test by mounting an LD element on an aging board and driving it under a predetermined condition.

この発明に係るＢＩ装置槽内ラックの実施の形態１を示す側面の断面図である。It is sectional drawing of the side surface which shows Embodiment 1 of the rack in a BI apparatus tank which concerns on this invention. 図１の矢視Ａからの検査ボード及び受光検知ボード２段分を拡大した正面図である。It is the front view which expanded the inspection board and light reception detection board two steps from arrow A of FIG. 実施の形態１における上下機構部の詳細構成図である。2 is a detailed configuration diagram of an up-and-down mechanism unit in Embodiment 1. FIG. 実施の形態１におけるＬＤ素子と受光素子の位置関係を示す図である。3 is a diagram illustrating a positional relationship between an LD element and a light receiving element in Embodiment 1. FIG. 実施の形態１におけるコネクタボードの正面図である。FIG. 3 is a front view of the connector board in the first embodiment. コネクタボードの側面図である。It is a side view of a connector board. この発明に係るＢＩ装置槽内ラックの実施の形態２を示す正面図である。It is a front view which shows Embodiment 2 of the rack in a BI apparatus tank which concerns on this invention. 実施の形態２の受光検知ボード部を拡大して示す正面図である。It is a front view which expands and shows the light reception detection board part of Embodiment 2. FIG. 実施の形態２の動作を説明する図である。10 is a diagram for explaining the operation of the second embodiment.

符号の説明Explanation of symbols

１ 固定ラックフレーム、２ 受光検知ボード、３ コネクタボード、
４ 受光検知ボード用コネクタ、６ コイルバネ、７ 移動ラックフレーム、
８ 上下機構部、９ 検査ボード、１０ 検査ボード用コネクタ、１１ 可動ステージ、
１２ ＬＭガイド１、１３ ＬＭガイド２、１４ 接続ピン、１５ ＬＤ素子、
１６ 受光素子。 1 fixed rack frame, 2 light detection board, 3 connector board,
4 Connector for light detection board, 6 Coil spring, 7 Moving rack frame,
8 Vertical mechanism, 9 Inspection board, 10 Inspection board connector, 11 Movable stage,
12 LM Guide 1, 13 LM Guide 2, 14 Connection Pin, 15 LD Element,
16 Light receiving element.

Claims (7)

ＬＤ素子を平面に複数個搭載し、ヒートシンクを内蔵した検査ボードと、
上記検査ボードの上記ＬＤ素子を搭載した平面と対向して設けられ、上記ＬＤ素子それぞれに対応する上記ＬＤ素子の出力を検知する受光素子を平面内部に備えた受光検知ボードと、
上記検査ボードまたは受光検知ボードのいずれか一方を取り付ける固定ラックフレーム及び上記検査ボードまたは受光検知ボードのいずれか他方を取り付ける移動ラックフレームと、
上記移動ラックフレームを上記平面と垂直な方向へ昇降させ、上記ＬＤ素子の面と上記受光検知ボードの平面との間に荷重を付加するための加圧機構部と、
上記ＬＤ素子に電流を供給するための上記受光検知ボードに接続されたコネクタ及び上記検査ボードに接続されたコネクタが取り付けられたコネクタボードと、
を備えたことを特徴とするバーイン装置槽内ラック。 An inspection board with multiple LD elements mounted on a flat surface and a built-in heat sink,
A light receiving detection board provided inside the plane with a light receiving element provided facing the plane on which the LD element of the inspection board is mounted, and detecting the output of the LD element corresponding to each of the LD elements;
A fixed rack frame to which one of the inspection board or the light reception detection board is attached, and a movable rack frame to which either the inspection board or the light reception detection board is attached;
A pressure mechanism for raising and lowering the movable rack frame in a direction perpendicular to the plane, and applying a load between the surface of the LD element and the plane of the light receiving detection board;
A connector connected to the light receiving detection board for supplying current to the LD element and a connector board to which a connector connected to the inspection board is attached;
A rack in a burn-in apparatus tank. 上記移動ラックフレーム及び固定ラックフレームに、対向する上記検査ボードと上記受光検知ボードの対を複数個備え、上記加圧機構部は、上記移動ラックフレームを上記平面と垂直な方向へ昇降させることにより上記複数個の対に対して一挙に上記ＬＤ素子の面と上記受光検知ボードの平面との間に荷重を付加することを特徴とする請求項１記載のバーイン装置槽内ラック。 The movable rack frame and the fixed rack frame are provided with a plurality of pairs of the inspection board and the light receiving detection board that face each other, and the pressurizing mechanism unit moves the movable rack frame up and down in a direction perpendicular to the plane. 2. The rack in a burn-in apparatus tank according to claim 1, wherein a load is applied between the surface of the LD element and the plane of the light receiving detection board at once for the plurality of pairs. 上記移動ラックフレームまたは固定ラックフレームに対する上記検査ボードまたは受光検知ボードの一方の取付がコイルバネを介してなされ、上記ＬＤ素子の面と上記受光検知ボードの平面との間の荷重を所定の値にすることを特徴とする請求項１記載のバーイン装置槽内ラック。 One of the inspection board or the light receiving detection board is attached to the movable rack frame or the fixed rack frame via a coil spring, and the load between the surface of the LD element and the plane of the light receiving detection board is set to a predetermined value. The rack in a burn-in apparatus tank according to claim 1. 上記受光検知ボードが複数個に分割されていることを特徴とする請求項１記載のバーイン装置槽内ラック。 2. The rack in a burn-in apparatus tank according to claim 1, wherein the light receiving detection board is divided into a plurality of parts. 上記コネクタボードは、上記移動ラックフレームの昇降と同期して移動することを特徴とする請求項１記載のバーイン装置槽内ラック。 2. The rack in a burn-in apparatus tank according to claim 1, wherein the connector board moves in synchronization with raising and lowering of the movable rack frame. 上記コネクタボードは、上記移動ラックフレームの昇降と同期して移動し、上記コイルバネを介して取り付けられた上記検査ボードまたは受光検知ボードに接続されたコネクタが上記コイルバネの撓み量と同期して移動することを特徴とする請求項１記載のバーイン装置槽内ラック。 The connector board moves in synchronism with the raising and lowering of the movable rack frame, and the connector connected to the inspection board or the light receiving detection board attached via the coil spring moves in synchronism with the deflection amount of the coil spring. The rack in a burn-in apparatus tank according to claim 1. 上記受光素子の表面が、上記受光検知ボードの平面より所定量凹んだ位置にあるように設けられていることを特徴とする請求項１記載のバーイン装置槽内ラック。 2. The rack in a burn-in apparatus tank according to claim 1, wherein the surface of the light receiving element is provided at a position recessed by a predetermined amount from the plane of the light receiving detection board.
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