JP2008124306A - Hole filler defect inspection system of printed board and defect inspection method - Google Patents
Hole filler defect inspection system of printed board and defect inspection method Download PDFInfo
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- JP2008124306A JP2008124306A JP2006307711A JP2006307711A JP2008124306A JP 2008124306 A JP2008124306 A JP 2008124306A JP 2006307711 A JP2006307711 A JP 2006307711A JP 2006307711 A JP2006307711 A JP 2006307711A JP 2008124306 A JP2008124306 A JP 2008124306A
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Abstract
Description
本発明は、電子機器や電子機器等に使用される、スルーホール等の穴を樹脂等の充填材料で充填したプリント基板における、その穴充填部の充填状態の良・不良を検査する、プリント基板の穴充填部欠陥検査システム及び欠陥検査方法に関する。 The present invention relates to a printed circuit board that is used for electronic equipment, electronic equipment, etc., and inspects whether the hole filling portion is good or defective in a printed circuit board in which holes such as through holes are filled with a filling material such as resin. The present invention relates to a defect inspection system and a defect inspection method.
プリント基板には、所望の回路パターンを設けるために、スルーホールが形成される。スルーホールは、例えば、樹脂を用いて構成された多層プリント基板をドリル加工により、例えば、穴径が０．３５〜０．８ｍｍ等の所定の径の大きさに設けられる。そして、その壁面にメッキを施すことで、隣接する回路パターン間を導通させることができるようになっている。 A through hole is formed in the printed board in order to provide a desired circuit pattern. The through-hole is provided in a predetermined diameter such as a hole diameter of 0.35 to 0.8 mm, for example, by drilling a multilayer printed board formed using a resin. Then, by plating the wall surface, it is possible to conduct between adjacent circuit patterns.
ところで、スルーホールの加工時には、基板を構成する樹脂が壁面に付着したり、ドリル加工による穴の形状に大きな歪みが生じることがある。そのような場合、壁面をメッキし難くなって、メッキの欠損部が生じたり、同じ厚さでメッキできなかったり、或いは、樹脂で穴が遮蔽されたりして、回路パターンの導通不良を招き易い。
このため、プリント基板の品質検査においては、配線パターンの検査とともにスルーホールの検査が必要とされる。
By the way, at the time of processing the through hole, the resin constituting the substrate may adhere to the wall surface, or a large distortion may occur in the shape of the hole by drilling. In such a case, it becomes difficult to plate the wall surface, a defective portion of the plating is generated, the plating cannot be performed with the same thickness, or the hole is shielded by the resin, and the circuit pattern is likely to be poorly conductive. .
For this reason, in the quality inspection of the printed circuit board, the inspection of the through hole is required together with the inspection of the wiring pattern.
しかるに、従来、プリント基板のスルーホールの検査装置としては、例えば、次の特許文献１〜３に記載のものがある。
これらのスルーホール検査装置は、いずれも、スルーホールの軸上に配置された光センサやカメラを介してスルーホールを通過する光量やスルーホールの形状を感知することによって、スルーホールの欠陥を判定するように構成されている。 All of these through-hole inspection devices determine through-hole defects by sensing the amount of light passing through the through-hole and the shape of the through-hole via an optical sensor or camera located on the through-hole axis. Is configured to do.
ところで、プリント基板によっては、導電性金属層をプリント基板の内部に絶縁層に挟まれるようにして設け、用途に応じて絶縁層の上部及び下部に設けられている配線のうちその一方の配線とその中間部に位置する所望の導電性金属層を導通させ、他方の配線やその他の導電性金属層を導通させないでおくようにすることができるようにしたものがある。 By the way, depending on the printed circuit board, a conductive metal layer is provided inside the printed circuit board so as to be sandwiched between the insulating layers, and one of the wirings provided on the upper and lower parts of the insulating layer according to the application. There is one in which a desired conductive metal layer located in the middle portion can be made conductive and the other wiring and other conductive metal layers can be kept nonconductive.
しかるに、このようなプリント基板において、スルーホールを形成したままの状態にしておくと、所望の配線と導電性金属層とを接続する際に、接続を所望しない反対側の配線やその他の導電性金属層までもが半田で接続されてしまうおそれがある。
また、接続を所望しない反対側の配線やその他の導電性金属層が半田で接続されなくても、その部位に穴が開いたままの状態となっていると、プリント基板に電子素子等を搭載するときに、不必要な接触を起こし、或いは、搭載の安定性を欠いて、回路パターンの導通不良を招く原因となり易い。
However, in such a printed circuit board, if a through hole is left as it is, when connecting a desired wiring and a conductive metal layer, a wiring on the opposite side that does not want to be connected or other conductivity Even the metal layer may be connected by solder.
Also, even if the other side of the wiring and other conductive metal layers that do not require connection are not connected by solder, if the hole remains open at that part, an electronic device or the like is mounted on the printed circuit board. In such a case, unnecessary contact is caused, or the mounting stability is lacking, and the circuit pattern is likely to cause poor conduction.
そこで、このようなプリント基板では、スルーホールを形成後に、接続を所望しない反対側の配線側から所定の導電性金属層までの穴を絶縁性の樹脂等の充填材料で充填している。 Therefore, in such a printed board, after forming the through hole, the hole from the opposite wiring side where connection is not desired to the predetermined conductive metal layer is filled with a filling material such as an insulating resin.
また、その他のプリント基板としては、例えば、スルーホールを形成しないで、一方の配線部から他方の配線部の中間に位置する所望の導電性金属層までに所定の微***をあけたものがある。 In addition, as other printed boards, for example, there is one in which a predetermined minute hole is formed from one wiring part to a desired conductive metal layer located in the middle of the other wiring part without forming a through hole. .
このようなプリント基板の微***の検査装置としては、例えば、次の特許文献４に記載のものがある。
上述したこれらのプリント基板のうち、スルーホールを形成した後に充填材料が充填されるプリント基板においては、スルーホールへ充填材料が充分に充填されないで、接続を所望しない反対側の配線側に凹部が形成されてしまうことがある。その様な場合に、凹部の深さが大きいと、上述したように、プリント基板に電子素子等を搭載するときに、不必要な接触を起こし、或いは、搭載の安定性を欠いて、回路パターンの導通不良を招く原因となり易い。
このため、スルーホールの充填部に凹部が形成されているプリント基板の場合には、その凹部の深さを検出することが欠陥検査において重要となる。
Among these printed circuit boards described above, in the printed circuit board in which the filling material is filled after the through hole is formed, the filling material is not sufficiently filled into the through hole, and there is a recess on the opposite wiring side where connection is not desired. May be formed. In such a case, if the depth of the concave portion is large, as described above, when an electronic element or the like is mounted on a printed circuit board, unnecessary contact occurs, or the circuit pattern lacks mounting stability. This is likely to cause poor conduction.
For this reason, in the case of a printed circuit board in which a recess is formed in the filling portion of the through hole, it is important in defect inspection to detect the depth of the recess.
しかし、従来のプリント基板欠陥検査においては、プリント基板の穴充填部に凹部が形成されている場合に凹部の深さを検出するという着想がなかった。
このため、従来のプリント基板検査装置では、スルーホールに充填材料を充填したタイプのプリント基板の穴充填部に形成される凹部の深さを高精度に検出することができず、プリント基板の欠陥の判定に誤りを生じ易い。
However, in the conventional printed circuit board defect inspection, there is no idea of detecting the depth of the concave portion when the concave portion is formed in the hole filling portion of the printed circuit board.
For this reason, in the conventional printed circuit board inspection apparatus, the depth of the concave portion formed in the hole filling part of the type of printed circuit board in which the filling material is filled in the through hole cannot be detected with high accuracy, and the defect of the printed circuit board is detected. It is easy to make an error in the determination.
本発明は、上記従来の問題点に鑑みてなされたものであり、スルーホールに充填材料が充填されたプリント基板に対し、プリント基板の穴充填部に形成される凹部の深さを高精度に検出して、欠陥の有無を高精度に判定可能な、プリント基板の穴充填部欠陥検査システム及び欠陥検査方法を提供することを目的としている。 The present invention has been made in view of the above-mentioned conventional problems, and with respect to a printed circuit board in which a through hole is filled with a filling material, the depth of the concave portion formed in the hole filling part of the printed circuit board is highly accurate. An object of the present invention is to provide a defect inspection system and a defect inspection method for a hole filling portion of a printed circuit board that can detect and determine the presence or absence of a defect with high accuracy.
上記目的を達成するため、本発明によるプリント基板の穴充填部欠陥検査システムは、プリント基板を載置する載置手段と、前記載置手段に載置された前記プリント基板を所定速度で検査位置を通過するように搬送する搬送手段と、前記プリント基板の前記検査位置に位置する部位をライン状に照射するライン状照射手段と、前記ライン状照射手段を介して照射された前記プリント基板の前記検査位置に位置する部位の像をライン状に撮像するライン状撮像手段を有し、該ライン状撮像手段で撮像した画像を用いて前記プリント基板に設けられている穴充填部の良・不良を検査するプリント基板の欠陥検査システムであって、前記ライン状照射手段は、入射光軸が前記検査位置に位置する前記穴充填部の中心軸方向に対して所定角度傾斜するように配置され、前記ライン状撮像手段は、前記穴充填部に凹部が存在する場合に、前記ライン状照射手段から出射し前記プリント基板で反射される光のうち、該凹部の側面を経て底面で反射される光の少なくとも一部が撮像面に入射し、それ以外の光が該撮像面から外れるように配置され、さらに、前記プリント基板における前記穴充填部の位置を予め記憶した記憶手段と、前記ライン状撮像手段で得られた画像のうち前記記憶手段を介して記憶されている前記プリント基板における前記穴充填部の位置に対応する範囲についての光量を該プリント基板の搬送方向に所定単位ごとの領域に区分けして検出し、該穴充填部の位置に対応する範囲において区分けされた隣り合う領域同士の光量の変化が最終領域に至るまで所定値を上回らない場合には、該穴充填部を良と判定し、該光量の変化が所定値を上回る場合には、その所定値を上回る所定領域の位置から該穴充填部における凹部の深さを検出し、検出した凹部の深さに基づいて、該穴充填部の良・不良の判定を行う判定手段を有することを特徴としている。 In order to achieve the above object, a printed circuit board hole filling portion defect inspection system according to the present invention includes a mounting means for mounting a printed circuit board, and an inspection position of the printed circuit board placed on the mounting means at a predetermined speed. A conveying means for conveying so as to pass through, a line-shaped irradiation means for irradiating a portion located at the inspection position of the printed circuit board in a line, and the printed circuit board irradiated through the line-shaped irradiation means It has line-shaped image pickup means for picking up an image of a part located at the inspection position in a line shape, and using the image picked up by the line-like image pickup means, the quality of the hole filling portion provided on the printed circuit board is determined as good / bad. A defect inspection system for a printed circuit board to be inspected, wherein the line-shaped irradiation means is inclined at a predetermined angle with respect to a central axis direction of the hole filling portion where the incident optical axis is located at the inspection position. The line-shaped image pickup means is arranged such that when there is a concave portion in the hole filling portion, the light emitted from the line-shaped irradiation means and reflected by the printed circuit board passes through the side surface of the concave portion at the bottom surface. A storage unit that is arranged so that at least a part of the reflected light is incident on the imaging surface and other light is removed from the imaging surface, and further stores in advance the position of the hole filling portion on the printed circuit board; The amount of light in a range corresponding to the position of the hole filling portion in the printed circuit board stored in the printed circuit board among the images obtained by the line-shaped imaging unit is determined for each predetermined unit in the transport direction of the printed circuit board. If the change in the amount of light between adjacent areas divided in the range corresponding to the position of the hole filling portion does not exceed a predetermined value until the final area is detected. The hole filling portion is determined to be good, and when the change in the light amount exceeds a predetermined value, the depth of the recess in the hole filling portion is detected from the position of the predetermined region exceeding the predetermined value, and is detected. It has a determining means for determining whether the hole filling portion is good or bad based on the depth of the recessed portion.
また、本発明のプリント基板の穴充填部欠陥検査システムにおいては、前記判定手段は、プリント基板の穴充填部が良と判定される場合の、前記ライン状撮像手段で得られた画像のうち前記記憶手段を介して記憶されている前記プリント基板における前記穴充填部の位置に対応する範囲において区分けされた隣り合う領域同士の光量の変化量を前記所定値として予めテーブル状に記憶させておいたサンプル情報に基づいて、該穴充填部の位置に対応する範囲において区分けされた隣り合う領域同士の光量の変化が該所定値を上回るか否かを判定するのが好ましい。 Further, in the printed circuit board hole filling portion defect inspection system according to the present invention, the determination unit includes the image obtained by the line-shaped imaging unit when the hole filling unit of the printed circuit board is determined to be good. The amount of change in the amount of light between adjacent regions divided in a range corresponding to the position of the hole filling portion in the printed circuit board stored via the storage means was stored in advance as a predetermined value in a table shape. Based on the sample information, it is preferable to determine whether or not the change in the amount of light between adjacent regions divided in the range corresponding to the position of the hole filling portion exceeds the predetermined value.
また、本発明のプリント基板の穴充填部欠陥検査システムにおいては、前記判定手段は、前記サンプル情報として、さらにプリント基板の穴充填部が不良と判定される場合の、前記ライン状撮像手段で得られた画像のうち前記記憶手段を介して記憶されている前記プリント基板における前記穴充填部の位置に対応する範囲において区分けされた隣り合う領域の光量の変化が前記所定値を上回る所定領域の位置に対する該穴充填部の凹部の深さを予めテーブル状に記憶させておき、該所定値を上回る場合において、該テーブル状に記憶させておいた該穴充填部の凹部の深さ情報を用いて、該所定値を上回る所定領域の位置から該穴充填部の凹部の深さを検出するのが好ましい。 Further, in the printed circuit board hole filling portion defect inspection system according to the present invention, the determination unit obtains, as the sample information, the line-shaped imaging unit when it is determined that the hole filling portion of the printed circuit board is defective. The position of the predetermined area where the change in the light quantity of the adjacent area divided in the range corresponding to the position of the hole filling part in the printed circuit board stored in the storage means in the stored image exceeds the predetermined value The depth of the concave portion of the hole filling portion is stored in advance in a table shape, and when the predetermined value is exceeded, the depth information of the concave portion of the hole filling portion stored in the table shape is used. It is preferable to detect the depth of the concave portion of the hole filling portion from the position of the predetermined region exceeding the predetermined value.
また、本発明のプリント基板の穴充填部欠陥検査システムにおいては、前記判定手段は、前記所定値を上回る場合における、その所定値を上回る所定領域の位置から前記穴充填部の凹部の深さを算出するのが好ましい。 Further, in the printed circuit board hole filling portion defect inspection system according to the present invention, when the determination means exceeds the predetermined value, the depth of the concave portion of the hole filling portion is determined from the position of the predetermined region exceeding the predetermined value. It is preferable to calculate.
また、本発明のプリント基板の穴充填部欠陥検査システムにおいては、前記搬送手段は、前記撮像手段で得られる前記プリント基板の穴充填部の像が搬送方向に延びるように、搬送速度を調整することができるのが好ましい。 In the printed circuit board hole filling portion defect inspection system of the present invention, the conveying means adjusts the conveying speed so that an image of the printed board hole filling portion obtained by the imaging means extends in the conveying direction. It is preferred that it be possible.
また、本発明によるプリント基板の穴充填部欠陥検査方法は、プリント基板を載置する載置手段と、前記載置手段に載置された前記プリント基板を所定速度で検査位置を通過するように搬送する搬送手段と、前記プリント基板の前記検査位置に位置する部位をライン状に照射するライン状照射手段と、前記ライン状照射手段を介して照射された前記プリント基板の前記検査位置に位置する部位の像をライン状に撮像するライン状撮像手段を有した装置を介して、該ライン状撮像手段で撮像した画像を用いて前記プリント基板に設けられている穴充填部の良・不良を検査するプリント基板の欠陥検査方法であって、記憶手段を備えて、前記プリント基板における前記穴充填部の位置を予め記憶させておき、前記搬送手段を介して、前記プリント基板を所定速度で前記検査位置を通過するように搬送し、前記ライン状照射手段を介して、前記検査位置に位置する前記プリント基板の前記穴充填部の中心軸方向に対して入射光軸が所定角度傾斜するようにしてライン状に照射するとともに、前記ライン状撮像手段を介して、前記穴充填部に凹部が形成されている場合に、前記ライン状照射手段から出射し前記プリント基板で反射される光のうち、該凹部の側面を経て底面で反射される光の少なくとも一部が撮像面に入射し、それ以外の光が該撮像面から外れるように、前記プリント基板の前記検査位置に位置する部位の像をライン状に撮像し、前記ライン状撮像手段で得られた画像のうち前記記憶手段を介して記憶しておいた前記プリント基板における前記穴充填部の位置に対応する範囲についての光量を該プリント基板の搬送方向に所定単位ごとの領域に区分けして検出し、該穴充填部の位置に対応する範囲において区分けされた隣り合う領域同士の光量の変化が最終領域に至るまで所定値を上回らない場合には、該穴充填部を良と判定し、該光量の変化が前記所定値を上回る場合には、その所定値を上回る所定領域の位置から該穴充填部における凹部の深さを検出し、検出した凹部の深さに基づいて、該穴充填部の良・不良の判定を行うことを特徴としている。 According to the printed circuit board hole filling portion defect inspection method of the present invention, the mounting means for mounting the printed circuit board and the printed circuit board mounted on the mounting means pass through the inspection position at a predetermined speed. It is located at the inspection position of the printed circuit board irradiated via the conveying means for transporting, the line-shaped irradiation means for irradiating the part located at the inspection position of the printed circuit board in a line shape, and the line-shaped irradiation means Inspecting the quality of the hole filling part provided on the printed circuit board using the image picked up by the line-like image pickup means through the apparatus having the line-like image pickup means for picking up the image of the part in a line shape A defect inspection method for a printed circuit board, comprising: a storage unit, wherein a position of the hole filling portion in the printed circuit board is stored in advance, and the print unit is connected via the transport unit. The plate is transported at a predetermined speed so as to pass through the inspection position, and the incident optical axis is directed to the central axis direction of the hole filling portion of the printed circuit board located at the inspection position via the line-shaped irradiation means. Irradiates in a line so as to incline at a predetermined angle, and when the concave portion is formed in the hole filling portion via the line-shaped imaging unit, the light is emitted from the line-shaped irradiation unit and reflected by the printed circuit board. Of the light that is reflected from the bottom surface through the side surface of the recess and enters the imaging surface, and other light is removed from the imaging surface at the inspection position of the printed circuit board. A range corresponding to the position of the hole filling portion in the printed circuit board, which is captured through the storage unit, of the image obtained by the line-shaped imaging unit, in which the image of the position portion is captured in a line shape The light quantity of the adjacent areas divided into areas in predetermined units in the conveyance direction of the printed circuit board is detected, and the change in the light quantity between the adjacent areas divided in the range corresponding to the position of the hole filling portion reaches the final area. The hole filling portion is determined to be good, and if the change in the amount of light exceeds the predetermined value, the concave portion in the hole filling portion from the position of the predetermined region exceeding the predetermined value. The depth is detected, and the quality of the hole filling portion is determined based on the detected depth of the concave portion.
また、本発明のプリント基板の穴充填部欠陥検査方法においては、プリント基板の穴充填部が良と判定される場合の、得られた画像のうち前記記憶されている前記プリント基板における前記穴充填部の位置に対応する範囲において区分けされた隣り合う領域同士の光量の変化量を前記所定値として予めテーブル状に記憶させておいたサンプル情報に基づいて、該穴充填部の位置に対応する範囲において区分けされた隣り合う領域同士の光量の変化が所定値を上回るか否かを判定するのが好ましい。 In the printed circuit board hole filling portion defect inspection method of the present invention, when the hole filling portion of the printed circuit board is determined to be good, the hole filling in the stored printed circuit board among the obtained images. The range corresponding to the position of the hole filling portion based on the sample information stored in advance in the form of a table as the predetermined value the amount of change in the amount of light between adjacent areas divided in the range corresponding to the position of the portion It is preferable to determine whether or not the change in the amount of light between the adjacent areas divided in FIG.
また、本発明のプリント基板の穴充填部欠陥検査方法においては、前記サンプル情報として、さらにプリント基板の穴充填部が不良と判定される場合の、得られた画像のうち前記記憶されている前記プリント基板における前記穴充填部の位置に対応する範囲において区分けされた隣り合う領域の光量の変化が前記所定値を上回る所定領域の位置に対する該穴充填部の凹部の深さを予めテーブル状に記憶させておき、該所定値を上回る場合において、該テーブル状に記憶させておいた該穴充填部の凹部の深さ情報を用いて、該所定値を上回る所定領域の位置から該穴充填部の凹部の深さを検出するのが好ましい。 In the printed circuit board hole filling portion defect inspection method of the present invention, as the sample information, the stored image among the obtained images when the hole filling portion of the printed circuit board is determined to be defective is stored. The depth of the concave portion of the hole filling portion with respect to the position of the predetermined region where the change in the light amount of the adjacent region divided in the range corresponding to the position of the hole filling portion on the printed board exceeds the predetermined value is stored in a table shape in advance. In the case where the predetermined value exceeds the predetermined value, the depth information of the concave portion of the hole filling portion stored in the table shape is used to detect the hole filling portion from the position of the predetermined region exceeding the predetermined value. It is preferable to detect the depth of the recess.
また、本発明のプリント基板の穴充填部欠陥検査方法においては、前記所定値を上回る場合において、その所定値を上回る所定領域の位置から前記穴充填部の凹部の深さを算出するのが好ましい。 In the hole filling portion defect inspection method for a printed circuit board according to the present invention, it is preferable to calculate the depth of the concave portion of the hole filling portion from the position of the predetermined region exceeding the predetermined value when the predetermined value is exceeded. .
また、本発明のプリント基板の穴充填部欠陥検査方法においては、前記搬送手段の搬送速度を、前記撮像手段で得られる前記プリント基板の穴充填部の像が搬送方向に延びるように調整するのが好ましい。 In the printed circuit board hole filling portion defect inspection method of the present invention, the conveyance speed of the conveyance means is adjusted so that the image of the hole filling portion of the printed circuit board obtained by the imaging means extends in the conveyance direction. Is preferred.
本発明によれば、スルーホールに充填材料が充填されたプリント基板に対し、プリント基板の穴充填部に形成される凹部の深さを高精度に検出して、欠陥の有無を高精度に判定可能な、プリント基板の穴充填部欠陥検査システム及び方法が得られる。 According to the present invention, the depth of the recess formed in the hole filling portion of the printed circuit board is detected with high accuracy and the presence or absence of a defect is determined with high accuracy for the printed circuit board in which the through hole is filled with the filling material. A possible printed circuit board hole filling defect inspection system and method is obtained.
図１は本発明の一実施形態にかかるプリント基板の穴充填部欠陥検査システムの概略構成を示す概念図、図２は図１のプリント基板の穴充填部欠陥検査システムにおける照明手段及び撮像手段の配置構成を示す説明図であり、(a)はライン状照明手段及びライン状撮像手段の配置を示す概念図、(b)は(a)における検査位置Ｓに位置するプリント基板の穴充填部に形成されている凹部の側面を照射し底面で反射する照明光の一光路を模式的に示す説明図である。なお、図２(a)においては、説明の便宜上、プリント基板は省略してある。 FIG. 1 is a conceptual diagram showing a schematic configuration of a hole filling portion defect inspection system for a printed circuit board according to an embodiment of the present invention, and FIG. 2 is a diagram of illumination means and imaging means in the hole filling portion defect inspection system for a printed circuit board of FIG. It is explanatory drawing which shows arrangement | positioning structure, (a) is a conceptual diagram which shows arrangement | positioning of a linear illumination means and a linear imaging means, (b) is a hole filling part of the printed circuit board located in the test | inspection position S in (a). It is explanatory drawing which shows typically one optical path of the illumination light which irradiates the side surface of the formed recessed part and reflects on a bottom face. In FIG. 2 (a), the printed circuit board is omitted for convenience of explanation.
図１において、Ａはプリント基板の穴充填部撮像部署、Ｂは検査されるプリント基板の搬入部署、Ｃは検査後のプリント基板の良品と不良品との選別回収部署である。
本実施形態のプリント基板の穴充填部欠陥検査システムは、載置手段１と、搬送手段２と、ライン状照射手段３と、ライン状撮像手段４を有している。
載置手段１は、搬入部署Ｂに設けられた検査テーブル１ａで構成されている。検査テーブル１ａへのプリント基板１０の搬入は、搬送部署Ｂに設けられた搬入ロボット１ｂを介して行うことができるように構成されている。搬入ロボット１ｂは、所定枚数積重ねられて準備された検査対象のプリント基板１０を検査テーブル１に載置することができるように構成されている。
搬送手段２は、公知のローダーや単軸ロボット２ａを用いて、載置手段１に載置されたプリント基板１０を所定速度で検査位置Ｓを通過するように搬送することができるように構成されている。
In FIG. 1, A is an imaging section for the hole filling portion of the printed circuit board, B is a section for carrying in the printed circuit board to be inspected, and C is a section for selecting and collecting non-defective and defective printed circuit boards.
The printed circuit board hole filling portion defect inspection system of the present embodiment includes a mounting unit 1, a transport unit 2, a line-shaped irradiation unit 3, and a line-shaped imaging unit 4.
The placing means 1 is composed of an inspection table 1a provided in the carry-in department B. The loading of the printed circuit board 10 to the inspection table 1a is configured to be performed via a loading robot 1b provided in the conveyance department B. The carry-in robot 1b is configured such that a predetermined number of printed circuit boards 10 to be inspected can be placed on the inspection table 1 by being stacked.
The transport means 2 is configured to be able to transport the printed circuit board 10 placed on the placement means 1 so as to pass the inspection position S at a predetermined speed using a known loader or single-axis robot 2a. ing.
ライン状照射手段３は、ハロゲン光源などの照明光源と照明光源から出射した光を平行にするためのコリメートレンズを有してなる光源装置（図示省略）を、検査位置Ｓに位置するプリント基板に形成された横一列の穴充填部を照射するように、検査位置Ｓにおける横一列の穴充填部の中心軸（Ｙ軸）方向に対して光軸が所定角度α傾斜した向きにして（図２(a)参照）、横一列に複数配置して構成されている。
なお、照明光源としては、例えばＬＥＤなど、ハロゲン光源以外の指向性の高い光源を用いることもできる。
また、光源装置における照明光源とコリメートレンズとの間にファイバーを備えて構成しても良い。
The line-shaped irradiation means 3 includes a light source device (not shown) having an illumination light source such as a halogen light source and a collimating lens for collimating light emitted from the illumination light source on a printed circuit board located at the inspection position S. The optical axis is inclined at a predetermined angle α with respect to the central axis (Y-axis) direction of the horizontal row of hole filling portions at the inspection position S so as to irradiate the formed horizontal row of hole filling portions (FIG. 2). (Refer to (a)), and a plurality are arranged in a horizontal row.
As the illumination light source, a light source with high directivity other than a halogen light source such as an LED can be used.
Further, a fiber may be provided between the illumination light source and the collimating lens in the light source device.
ライン状撮像手段４は、プリント基板１０の穴充填部１０ｃに凹部１０ｄが存在する場合に、ライン状照射手段３から出射しプリント基板１０で反射される光のうち、凹部１０ｄの側面を経て底面で反射される光の少なくとも一部が撮像面に入射し、それ以外の光（例えば、ライン状照射手段３から出射し凹部１０ｄの底面に直接入射し底面で反射した光など）が撮像面から外れるように、プリント基板１０に対してライン状照射手段３と同じ側において、撮像面に対して垂直な軸がライン状照射手段３の光軸とほぼ平行となる向きであって、搬送方向からみてライン状照明手段３よりも検査位置Ｓから離れた位置に配置されており、撮像面に対して垂直な軸と検査位置Ｓにおける横一列の穴充填部の中心軸（Ｙ軸）方向とのなす角度α’が角度αとほぼ同じ程度になっている。そして、横一列に複数配置されたラインセンサーカメラを用いて、プリント基板１０に設けられた穴充填部１０ｃを横一列ごとに所定間隔で走査して撮像するように構成されている。なお、図２(b)において、１０ａはプリント基板１０における配線を有する表面層部、１０ｂは絶縁層部である。 The line-shaped imaging unit 4 has a bottom surface through the side surface of the concave portion 10d out of the light emitted from the line-shaped irradiation unit 3 and reflected by the printed circuit board 10 when the concave portion 10d exists in the hole filling portion 10c of the printed board 10. At least part of the light reflected by the light enters the imaging surface, and other light (for example, light emitted from the line irradiation unit 3 and directly incident on the bottom surface of the recess 10d and reflected by the bottom surface) is reflected from the imaging surface. In such a way that the axis perpendicular to the imaging surface is substantially parallel to the optical axis of the line-shaped irradiation means 3 on the same side as the line-shaped irradiation means 3 with respect to the printed circuit board 10 and from the transport direction Thus, it is arranged at a position farther from the inspection position S than the line illumination means 3, and the axis perpendicular to the imaging surface and the central axis (Y-axis) direction of the horizontal row of hole filling portions at the inspection position S. The angle α ' It has become almost the same degree as the degree α. A plurality of line sensor cameras arranged in a horizontal row are used to scan and image the hole filling portion 10c provided in the printed circuit board 10 at a predetermined interval for each horizontal row. In FIG. 2B, 10a is a surface layer portion having wiring in the printed board 10, and 10b is an insulating layer portion.
さらに、本実施形態のプリント基板の穴充填部欠陥検査システムは、図１に示すように、記憶手段５と、穴充填部の良・不良の判定を行う判定手段６を有している。
記憶手段５は、例えば、コンピュータの記憶装置等で構成され、検査対象となるプリント基板１０における穴充填部１０ｃの位置を記憶している。
判定手段６は、例えば、コンピュータの演算制御装置等を介して駆動するように構成されており、ライン状撮像手段４で得られた画像（の全領域）のうち、記憶手段５を介して記憶されているプリント基板１０における穴充填部１０ｃの位置に対応する範囲についての光量をプリント基板１０の搬送方向に所定単位ごとの領域に区分けして検出し、穴充填部１０ｃの位置に対応する範囲において区分けされた隣り合う領域同士の光量の変化が最終領域に至るまで所定値を上回らない場合には、穴充填部１０ｃを良と判定し、光量の変化が所定値を上回る場合には、その所定値を上回る所定領域の位置から穴充填部１０ｃにおける凹部１０ｄの深さを検出し、検出した凹部１０ｄの深さに基づいて、穴充填部１０ｃの良・不良の判定を行うように構成されている。
Furthermore, as shown in FIG. 1, the printed circuit board hole filling portion defect inspection system of the present embodiment includes a storage unit 5 and a determination unit 6 that determines whether the hole filling unit is good or defective.
The storage means 5 is composed of, for example, a computer storage device or the like, and stores the position of the hole filling portion 10c in the printed circuit board 10 to be inspected.
The determination unit 6 is configured to be driven through, for example, a computer control device or the like, and stores the image (all areas) obtained by the line-shaped imaging unit 4 via the storage unit 5. The amount of light in a range corresponding to the position of the hole filling portion 10c in the printed circuit board 10 is detected by dividing the light amount into regions of predetermined units in the conveyance direction of the printed circuit board 10, and the range corresponding to the position of the hole filling portion 10c. If the change in the amount of light between the adjacent areas separated in step 1 does not exceed a predetermined value until reaching the final region, it is determined that the hole filling portion 10c is good, and if the change in the amount of light exceeds a predetermined value, The depth of the concave portion 10d in the hole filling portion 10c is detected from the position of the predetermined region exceeding the predetermined value, and the quality of the hole filling portion 10c is determined based on the detected depth of the concave portion 10d. It is configured.
ここで、本実施形態の穴充填部欠陥検査システムにおいてライン状照射手段３を介して穴充填部１０ｃを照射する光とライン状撮像手段４により撮像される像との位置関係について説明する。 Here, the positional relationship between the light that irradiates the hole filling portion 10c via the line-shaped irradiation means 3 and the image captured by the line-shaped imaging means 4 in the hole filling portion defect inspection system of the present embodiment will be described.
図３は本発明のシステムにおいてプリント基板の穴充填部に形成された凹部の深さを検出する基本原理を示す説明図であり、(a)は凹部が比較的浅い場合の穴充填部１０ｃにライン状照明手段３を介して指向性のある光を照射した場合の光の経路及びライン状撮像手段４を介して撮像した穴充填部１０ｃの像、(b)は凹部が比較的浅い場合の穴充填部１０ｃにライン状照明手段３を介して指向性のある光を照射した場合の光の経路及びライン状撮像手段４を介して撮像した穴充填部１０ｃの像を示している。 FIG. 3 is an explanatory view showing the basic principle of detecting the depth of the recess formed in the hole filling portion of the printed circuit board in the system of the present invention. FIG. 3 (a) shows the hole filling portion 10c when the recess is relatively shallow. The path of light when directional light is irradiated via the line-shaped illumination means 3 and the image of the hole filling portion 10c imaged via the line-shaped imaging means 4, (b) is the case where the recess is relatively shallow. The light path and the image of the hole filling part 10c imaged via the line-shaped imaging means 4 when the directional light is irradiated to the hole filling part 10c via the line-shaped illumination means 3 are shown.
本発明の穴充填部欠陥検査システムでは、ライン状照明手段３に備わる光源からの光が穴充填部１０ｃに形成された凹部１０ｄの側面（内壁）で反射され、凹部１０ｄの底面に到達して反射した光が、一定の角度に設置されたライン状撮像手段４で撮像される。
このとき、ライン状撮像手段４は、所定の搬送方向Ａに搬送されるプリント基板１０に対し、常に検査位置Ｓに固定されているため、撮像面は、凹部１０ｄ側面、底面のうちの側面で反射された光が照射される部位、底面のうちの側面で反射された光が照射されない部位を順に撮像することになる。
In the hole filling portion defect inspection system of the present invention, light from the light source provided in the line illumination means 3 is reflected by the side surface (inner wall) of the recess 10d formed in the hole filling portion 10c and reaches the bottom surface of the recess 10d. The reflected light is imaged by the line-shaped imaging means 4 installed at a certain angle.
At this time, since the line-shaped imaging unit 4 is always fixed at the inspection position S with respect to the printed circuit board 10 conveyed in the predetermined conveyance direction A, the imaging surface is the side surface of the side surface of the recess 10d and the bottom surface. The site where the reflected light is irradiated and the site where the light reflected by the side surface of the bottom surface is not irradiated are sequentially imaged.
このとき、図３に示すように、穴充填部１０ｃに形成された凹部１０ｄの深さが深いほど、凹部１０ｄ側面が長く撮像され、浅いほど短くなる。従って、撮像された画像における穴充填部１０ｃの開始位置から反射光で明るく撮像される底面部の開始位置までの直線距離を測長することで、凹部１０ｄの深さ（即ち、側面部の長さ）を求めることができる。 At this time, as shown in FIG. 3, as the depth of the concave portion 10d formed in the hole filling portion 10c is deeper, the side surface of the concave portion 10d is imaged longer and becomes shorter as the depth is shallower. Therefore, by measuring the linear distance from the start position of the hole filling portion 10c in the captured image to the start position of the bottom surface portion that is brightly imaged with reflected light, the depth of the concave portion 10d (that is, the length of the side surface portion). )).
なお、厳密には、穴充填部１０ｃの凹部１０ｄの側面等、ライン状照射手段３からの光の照射を受けるプリント基板１０上のいずれの部位も乱反射の影響を受けるため、穴充填部１０ｃの凹部１０ｄを撮像した画像において暗部となる側面部においても多少の光量が受光される。しかし、暗部は明部に比べて著しい受光レベルの差異があるため、撮像後の画像を所定量を単位とする単位で区分けした場合（例えば、画素単位）、その区分けした領域における光量レベルの変化量を所定のしきい値で判定することで、明部と暗部との境界を判定することができる。 Strictly speaking, since any part on the printed circuit board 10 that is irradiated with light from the line-shaped irradiation means 3 such as the side surface of the recess 10d of the hole filling part 10c is affected by irregular reflection, the hole filling part 10c Some amount of light is also received at the side portion which is a dark portion in the image obtained by imaging the concave portion 10d. However, since the dark part has a significant difference in light reception level compared to the bright part, when the captured image is divided in units of a predetermined amount (for example, in units of pixels), the change in the light amount level in the divided area By determining the amount with a predetermined threshold value, the boundary between the bright part and the dark part can be determined.
なお、ライン状照明手段３の入射角、ライン状撮像手段４の撮像面に対し垂直な軸とプリント基板１０の平面（又は穴充填部１０ｃの凹部１０ｄ底面とのなす角度（カメラ角度）、及び、凹部１０ｃの径の大きさによっては、凹部１０ｃの側面で反射し、底面で反射した光が撮像面に入射されない場合が生ずる。本発明では、そのような関係となる径の凹部１０ｃが形成されるプリント基板１０は検査対象外とする。 Note that the incident angle of the line-shaped illumination unit 3, the angle (camera angle) formed by the axis perpendicular to the imaging surface of the line-shaped imaging unit 4 and the plane of the printed circuit board 10 (or the bottom surface of the recess 10 d of the hole filling unit 10 c), Depending on the size of the diameter of the recess 10c, the light reflected from the side surface of the recess 10c and reflected from the bottom surface may not enter the imaging surface.In the present invention, the recess 10c having such a diameter is formed. The printed circuit board 10 to be processed is not subject to inspection.
ライン状照射手段３を介して穴充填部１０ｃを照射する光とライン状撮像手段４により撮像される像との位置関係に関し、更に詳しく説明する。
図４〜図６はプリント基板の穴充填部１０ｃにライン状照明手段３を介して指向性のある光を照射した場合の光の経路及びライン状撮像手段４を介して撮像した穴充填部１０ｃの像を示す説明図であり、(a)は光の経路、(b)は穴充填部１０ｃの像を夫々示している。また、図４は穴充填部１０ｃに凹部１０ｄが形成されていない場合、図４は凹部１０ｄが形成されている場合、図６は穴充填部に図４よりさらに大きい深さで凹部１０ｄが形成されている場合を示している。なお、図４(a)、図５(a)、図６(a)では、説明の便宜上、ほぼ理想的な配置として、ライン状照射手段３とライン状撮像手段４の光軸が互いにほぼ平行になるものとして示してある。また、図４〜図６中、Ｘ１及びＸ４はライン状撮像手段４を介して撮像される穴充填部１０ｃを搬送方向に沿ってみたときの撮像範囲の両端位置を示している。そして、図４〜図６の例では、ライン状撮像手段４におけるプリント基板１０との相対的位置は、プリント基板１０が搬送されるにしたがって、Ｘ１からＸ４へと所定の搬送量ごとに変化する。
The positional relationship between the light that irradiates the hole filling portion 10c via the line-shaped irradiation unit 3 and the image captured by the line-shaped imaging unit 4 will be described in more detail.
4 to 6 show the light path when the hole filling portion 10c of the printed circuit board is irradiated with directional light via the line-shaped illumination means 3, and the hole filling portion 10c imaged via the line-shaped imaging means 4. FIG. FIG. 6A is an explanatory diagram showing the image of the hole filling portion 10c. FIG. 5A is an optical path, and FIG. 4 shows a case where the concave portion 10d is not formed in the hole filling portion 10c, FIG. 4 shows a case where the concave portion 10d is formed, and FIG. 6 shows a case where the concave portion 10d is formed in the hole filling portion at a greater depth than FIG. Shows the case. 4 (a), 5 (a), and 6 (a), the optical axes of the line irradiation unit 3 and the line imaging unit 4 are substantially parallel to each other as a substantially ideal arrangement for convenience of explanation. It is shown as 4 to 6, X <b> 1 and X <b> 4 indicate both end positions of the imaging range when the hole filling unit 10 c imaged via the line-shaped imaging unit 4 is viewed along the transport direction. 4 to 6, the relative position of the line imaging unit 4 with respect to the printed circuit board 10 changes from X1 to X4 for each predetermined transport amount as the printed circuit board 10 is transported. .
図４(a)に示すように、プリント基板１０の穴充填部１０ｃに凹部が形成されていない場合は、ライン状照明手段３から穴充填部１０ｃ及びその周辺の表面層部１０ａに照射された光（ここでは照射光Ｌ１〜Ｌ５をサンプルとして示してある。）は、いずれも穴充填部１０ｃ及び表面層部１０ａに形成されている平坦な面で反射されてライン状撮像手段４の撮像面から外れる方向に偏向される。このため、ライン状撮像手段４は、矢印Ａ方向に搬送されるプリント基板１０の穴充填部１０ｃに対する撮像領域がＸ１からＸ４までの間のいずれの位置に位置するときも、穴充填部１０ｃからの反射光を受光しない。その結果、図４(b)に示すように、得られた画像は穴充填部１０ｃ全体が暗くなる。 As shown in FIG. 4 (a), when the concave portion is not formed in the hole filling portion 10c of the printed circuit board 10, the hole filling portion 10c and the surrounding surface layer portion 10a are irradiated from the line illumination means 3. The light (here, the irradiation lights L1 to L5 are shown as samples) is reflected by the flat surfaces formed in the hole filling portion 10c and the surface layer portion 10a, and the imaging surface of the line-shaped imaging means 4 Deflected away from For this reason, the line-shaped image pickup means 4 moves from the hole filling portion 10c when the image pickup region for the hole filling portion 10c of the printed board 10 conveyed in the direction of arrow A is located at any position between X1 and X4. Does not receive the reflected light. As a result, as shown in FIG. 4B, in the obtained image, the entire hole filling portion 10c becomes dark.
これに対し、例えば、図５(a)に示すように、プリント基板１０の穴充填部１０ｃに凹部１０ｄが形成されている場合は、ライン状照明手段３から穴充填部１０ｃ及びその周辺に照射された光（ここでは照射光Ｌ１’〜Ｌ５’をサンプルとして示してある。）のうち、穴充填部１０ｃの凹部１０ｄの側面に入射した照明光Ｌ２’〜Ｌ４’（ここで、Ｌ２’は凹部１０ｄの側面上端、Ｌ３’は凹部１０ｄの側面中間部、Ｌ４’は凹部１０ｄの側面下端にそれぞれ入射する光である。）が、その側面で反射され、さらに穴充填部１０ｃの凹部１０ｄの底面で反射されてライン状撮像手段４の撮像面に入射する方向に偏向される。また、穴充填部１０ｃの凹部１０ｄの手前の表面層部１０ａに入射した照明光Ｌ１’は、表面層部１０ａの平坦な面で反射されてライン状撮像手段４の撮像面から外れる方向に偏向される。また、穴充填部１０ｃの凹部１０ｄの底面に直接入射した照明光Ｌ５’は、その底面で反射されてライン状撮像手段４の撮像面から外れる方向に偏向される。 On the other hand, for example, as shown in FIG. 5A, when the concave portion 10d is formed in the hole filling portion 10c of the printed circuit board 10, the line illumination means 3 irradiates the hole filling portion 10c and its periphery. Of the emitted light (here, the irradiation lights L1 ′ to L5 ′ are shown as samples), illumination lights L2 ′ to L4 ′ (here, L2 ′ is incident on the side surface of the recess 10d of the hole filling portion 10c) The upper end of the side surface of the recess 10d, L3 ′ is light incident on the intermediate portion of the side surface of the recess 10d, and L4 ′ is incident on the lower end of the side surface of the recess 10d. It is reflected by the bottom surface and deflected in the direction of incidence on the imaging surface of the line-shaped imaging means 4. Further, the illumination light L1 ′ incident on the surface layer portion 10a before the concave portion 10d of the hole filling portion 10c is reflected by the flat surface of the surface layer portion 10a and deflected in a direction away from the imaging surface of the line-shaped imaging means 4. Is done. Further, the illumination light L5 'that is directly incident on the bottom surface of the recess 10d of the hole filling portion 10c is reflected on the bottom surface and deflected in a direction away from the imaging surface of the line-shaped imaging means 4.
なお、穴充填部１０ｃの凹部１０ｄの底面に照明光を直接入射する位置であり、かつ、照明光Ｌ２’〜Ｌ４’が穴充填部１０ｃの凹部１０ｄの側面及び底面で反射される反射光の位置から照明光を照射した場合には、穴充填部１０ｃの凹部１０ｄの底面で反射され、さらに穴充填部１０ｃの凹部１０ｄの側面で反射されて、照明光Ｌ２’〜Ｌ４’とは逆の経路を辿るように偏向されるが、ライン状撮像手段４は、その逆の経路を辿る光が撮像面に入射しない位置に配置されている。 Note that the illumination light is directly incident on the bottom surface of the concave portion 10d of the hole filling portion 10c, and the reflected light reflected by the side surfaces and the bottom surface of the concave portion 10d of the hole filling portion 10c is reflected by the illumination lights L2 ′ to L4 ′. When the illumination light is irradiated from the position, the light is reflected on the bottom surface of the concave portion 10d of the hole filling portion 10c and further reflected on the side surface of the concave portion 10d of the hole filling portion 10c, which is opposite to the illumination lights L2 ′ to L4 ′. Although it is deflected so as to follow the path, the line-shaped imaging means 4 is arranged at a position where light following the opposite path does not enter the imaging surface.
このため、図５(a)に示す例の場合には、ライン状撮像手段４は、矢印Ａ方向に搬送されるプリント基板１０の穴充填部１０ｃに対する撮像領域がＸ２’からＸ３’までの位置に位置したときに、穴充填部１０ｃからの反射光を受光する。その結果、図５(b)に示すように、得られた画像は穴充填部１０ｃの凹部１０ｄの側面で反射して底面に入射した部位（ここでは領域ｂとする。）が明るくなり、他の部位は暗くなる。 For this reason, in the case of the example shown in FIG. 5 (a), the line-shaped imaging means 4 has a position where the imaging region for the hole filling portion 10c of the printed board 10 conveyed in the direction of arrow A is from X2 ′ to X3 ′. When it is located, the reflected light from the hole filling portion 10c is received. As a result, as shown in FIG. 5 (b), the obtained image is reflected on the side surface of the recess 10d of the hole filling portion 10c and becomes incident on the bottom surface (here, referred to as region b), and the other is bright. The part of becomes dark.
また、図６(a)に示すように、例えば、プリント基板１０の穴充填部１０ｃに形成された凹部１０ｄの深さが図５(a)よりも深い場合も、図５の場合と同様に、ライン状照明手段３から穴充填部１０ｃ及びその周辺に照射された光（ここでは照射光Ｌ１”〜Ｌ４”をサンプルとして示してある。）のうち、穴充填部１０ｃの凹部１０ｄの側面に入射した照明光Ｌ２”〜Ｌ４”（ここで、Ｌ２”は凹部１０ｄの側面上端、Ｌ３”は凹部１０ｄの側面中間部、Ｌ４”は凹部１０ｄの側面下端にそれぞれ入射する光である。）が、その側面で反射され、さらに穴充填部１０ｃの凹部１０ｄの底面で反射されてライン状撮像手段４の撮像面に入射する方向に偏向される。また、穴充填部１０ｃの凹部１０ｄの手前の表面層部１０ａに入射した照明光Ｌ１”は、表面層部１０ａの平坦な面で反射されてライン状撮像手段４の撮像面から外れる方向に偏向される。また、穴充填部１０ｃの凹部１０ｄの底面に直接入射した照明光（図示省略）は、その底面で反射されてライン状撮像手段４の撮像面から外れる方向に偏向される。 Further, as shown in FIG. 6A, for example, the case where the depth of the recess 10d formed in the hole filling portion 10c of the printed board 10 is deeper than that in FIG. Of the light irradiated to the hole filling portion 10c and its periphery from the line illumination means 3 (here, the irradiation lights L1 "to L4" are shown as samples), the side surface of the concave portion 10d of the hole filling portion 10c Incident illumination lights L2 ″ to L4 ″ (where L2 ″ is light incident on the upper side surface of the concave portion 10d, L3 ″ is intermediate surface portions of the concave portion 10d, and L4 ″ is light incident on the lower side surface of the concave portion 10d). , Reflected on the side surface, further reflected on the bottom surface of the concave portion 10d of the hole filling portion 10c, and deflected in a direction to enter the imaging surface of the line-shaped imaging means 4. Also, the front side of the concave portion 10d of the hole filling portion 10c. Illumination light L1 "incident on the surface layer portion 10a Is deflected in the direction reflected by the flat surface of the surface layer portion 10a and disengaged from the imaging surface of the line-shaped imaging means 4. Illumination light (not shown) that is directly incident on the bottom surface of the recess 10 d of the hole filling portion 10 c is reflected by the bottom surface and deflected in a direction away from the imaging surface of the line-shaped imaging unit 4.
なお、穴充填部１０ｃの凹部１０ｄの底面に照明光を直接入射する位置であり、かつ、照明光Ｌ２”〜Ｌ４”が穴充填部１０ｃの凹部１０ｄの側面及び底面で反射される反射光の位置から照明光を照射した場合には、穴充填部１０ｃの凹部１０ｄの底面で反射され、さらに穴充填部１０ｃの凹部１０ｄの側面で反射されて、照明光Ｌ２”〜Ｌ４”とは逆の経路を辿るように偏向されるが、ライン状撮像手段４は、その逆の経路を辿る光が撮像面に入射しない位置に配置されている。 Note that the illumination light is directly incident on the bottom surface of the concave portion 10d of the hole filling portion 10c, and the reflected light reflected by the side surfaces and the bottom surface of the concave portion 10d of the hole filling portion 10c is reflected by the illumination light L2 ″ to L4 ″. When the illumination light is irradiated from the position, the light is reflected on the bottom surface of the concave portion 10d of the hole filling portion 10c, and further reflected on the side surface of the concave portion 10d of the hole filling portion 10c, which is opposite to the illumination lights L2 ″ to L4 ″. Although it is deflected so as to follow the path, the line-shaped imaging means 4 is arranged at a position where light following the opposite path does not enter the imaging surface.
このため、図６(a)に示す例の場合には、ライン状撮像手段４は、矢印Ａ方向に搬送されるプリント基板１０の穴充填部１０ｃに対する撮像領域がＸ２”からＸ３”までの位置に位置したときに、穴充填部１０ｃからの反射光を受光する。その結果、図６(b)に示すように、得られた画像は穴充填部１０ｃの凹部１０ｄの側面で反射して底面に入射した部位（ここでは領域ｂ’とする。）が明るくなり、他の部位は暗くなる。 For this reason, in the case of the example shown in FIG. 6A, the line-shaped imaging unit 4 has a position where the imaging region for the hole filling portion 10c of the printed board 10 conveyed in the direction of arrow A is from X2 ″ to X3 ″. When it is located, the reflected light from the hole filling portion 10c is received. As a result, as shown in FIG. 6 (b), the obtained image is reflected at the side surface of the recess 10d of the hole filling portion 10c and incident on the bottom surface (here, referred to as region b ') becomes brighter. Other parts become dark.
このように、穴充填部１０ｃに凹部１０ｄが形成されていない場合には、ライン状撮像手段４を介して得られる穴充填部１０ｃの画像領域全体で光量の変化がほとんどないのに対し、穴充填部１０に凹部１０ｄが形成されている場合には、ライン状撮像手段４を介して得られる穴充填部１０ｃの画像領域内において光量が大きく変化する部位が存在する。
また、穴充填部１０ｃに凹部１０ｄが形成されている場合において、凹部１０ｄの深さの違いによって、ライン状撮像手段４を介して得られる穴充填部１０ｃの画像領域内における明部の位置、範囲及びその明るさが異なる。
As described above, when the concave portion 10d is not formed in the hole filling portion 10c, there is almost no change in the amount of light in the entire image region of the hole filling portion 10c obtained through the line-shaped imaging unit 4. When the concave portion 10d is formed in the filling portion 10, there is a portion where the light amount changes greatly in the image region of the hole filling portion 10c obtained through the line-shaped imaging unit 4.
Further, in the case where the concave portion 10d is formed in the hole filling portion 10c, the position of the bright portion in the image region of the hole filling portion 10c obtained through the line-shaped imaging unit 4 due to the difference in the depth of the concave portion 10d, Range and its brightness are different.
そして、ライン状撮像手段４を介して得られる画像は、矢印Ａ方向に搬送されるプリント基板１０の穴充填部１０ｃに対する撮像領域が、充填穴部１０ｃの凹部１０ｄの側面上端に対応する位置Ｘ１から側面下端に対応する位置Ｘ２’及びＸ２”までの間に位置するときに暗い画像となり、位置Ｘ２’又はＸ２”を過ぎて位置Ｘ３’又はＸ３”までの凹部１０ｄの底面に対応する位置に位置するときに、明るい画像となる。 The image obtained via the line-shaped imaging means 4 has a position X1 in which the imaging region for the hole filling portion 10c of the printed board 10 conveyed in the direction of arrow A corresponds to the upper end of the side surface of the recess 10d of the filling hole 10c. Becomes a dark image when positioned between the position X2 ′ and X2 ″ corresponding to the lower end of the side surface, and the position corresponding to the bottom surface of the concave portion 10d past the position X2 ′ or X2 ″ to the position X3 ′ or X3 ″ When positioned, the image is bright.
ここで、ライン状撮像手段４を介して得られる穴充填部１０ｃの画像において光量が変化する境界となる位置Ｘ２’と位置Ｘ１との間の距離は、穴充填部に形成される凹部の側面の大きさに対応する。 Here, in the image of the hole filling portion 10c obtained via the line-shaped imaging means 4, the distance between the position X2 ′ and the position X1 that becomes the boundary where the light amount changes is the side surface of the recess formed in the hole filling portion. Corresponds to the size of.
しかるに、本実施形態の穴充填部欠陥検査システムは、記憶部５を介してプリント基板１０における穴充填部１０ｃの位置を予め記憶させておき、判定手段６を介して、記憶手段５に記憶されている位置に基づいてライン状撮像手段４を介して得られたプリント基板１０全体の画像から穴充填部１０ｃに対応する範囲を特定してその画像情報を抽出し、抽出した画像情報における光量を、プリント基板１０の搬送方向に、例えば、１００μ〜１０μ程度の所定単位ごとの領域に区分けして、検出するように構成されている。 However, in the hole filling portion defect inspection system of the present embodiment, the position of the hole filling portion 10 c in the printed circuit board 10 is stored in advance via the storage portion 5, and is stored in the storage means 5 via the determination means 6. A range corresponding to the hole filling portion 10c is extracted from the image of the entire printed circuit board 10 obtained via the line-shaped imaging means 4 based on the position of the image, and the image information is extracted, and the amount of light in the extracted image information is calculated. In the conveyance direction of the printed circuit board 10, for example, it is configured to detect by dividing into regions of predetermined units of about 100 μm to 10 μm.
また、判定手段６は、穴充填部１０ｃの欠陥検査の第１段階として、穴充填部１０ｃの位置に対応する範囲の画像領域において区分けされた隣り合う領域同士の光量の変化が最終領域に至るまで所定値（光量変化のしきい値）を上回らない場合には、穴充填部１０ｃを良と判定するように構成されている。 In addition, as a first stage of the defect inspection of the hole filling portion 10c, the determination unit 6 changes the light amount between adjacent regions divided in the image region in the range corresponding to the position of the hole filling portion 10c to reach the final region. When the predetermined value (threshold value change threshold) is not exceeded, the hole filling portion 10c is determined to be good.
また、判定手段６は、穴充填部１０ｃの欠陥検査の第２段階として、第１段階で良と判定されなかった穴充填部１０ｃについて、光量の変化が所定値（光量変化のしきい値）を上回る所定領域の位置情報に基づいて穴充填部１０ｃにおける凹部１０ｄの深さを検出するように構成されている。 In addition, as a second stage of the defect inspection of the hole filling portion 10c, the determination means 6 has a predetermined light amount change (threshold change threshold) for the hole filling portion 10c that is not determined to be good in the first step. The depth of the concave portion 10d in the hole filling portion 10c is detected based on position information of a predetermined region exceeding the above.
検出方法としては、例えば、図５(a)の例のように、入射光軸と、撮像面に垂直な軸とがほぼ平行である場合には、図５(b)における位置Ｘ１から位置Ｘ２’までの距離と、穴充填部１０ｃに対する入射光の入射角度αとから、凹部１０ｄの深さ（即ち、図４における領域ａの長さ）が次式から求まる。
位置Ｘ１から位置Ｘ２’までの距離をＸ１２、領域ａの長さをｌａとすると、
ｓｉｎα＝Ｘ１２／ｌａ
ｌａ＝Ｘ１２／ｓｉｎα
As a detection method, for example, when the incident optical axis and the axis perpendicular to the imaging surface are substantially parallel as in the example of FIG. 5A, the position X1 to the position X2 in FIG. The depth of the concave portion 10d (that is, the length of the region a in FIG. 4) can be obtained from the following equation from the distance to 'and the incident angle α of the incident light with respect to the hole filling portion 10c.
If the distance from the position X1 to the position X2 ′ is X12 and the length of the region a is la,
sin α = X12 / la
la = X12 / sin α
そして、判定手段６は、検出した凹部１０ｄの深さが所定値（深さのしきい値）を上回るか否かで良・不良の判定を行うように構成されている。
深さのしきい値としては、実際にプリント基板１０に凹部１０ｄが形成されていても配線等に支障のない許容できる深さを設定する。
The determination unit 6 is configured to determine whether the detected recess 10d has a predetermined value (depth threshold) or not.
As the depth threshold, an allowable depth that does not hinder wiring or the like is set even if the concave portion 10d is actually formed on the printed circuit board 10.
なお、穴充填部１０ｃの凹部１０ｄの深さがそれほど深くない場合においては、図５(b)における位置Ｘ２’から位置Ｘ３’までの距離、即ち、ライン状撮像手段４を介して得られた穴充填部１０ｃの画像のうち、穴充填部１０ｃの凹部１０ｄの側面を経て底面で反射されて明るくなる範囲の大きさを求めれば、次式から凹部１０ｄの深さ（即ち、図４における領域ａの長さ）が求まる。
位置Ｘ２’から位置Ｘ３’までの距離をＸ２３、領域ｂの長さをｌｂとすると、
ｃｏｓα＝Ｘ２３／ｌｂ
ｔａｎα＝ｌｂ／ｌａ
ｌａ＝Ｘ２３／（ｃｏｓα・ｔａｎα）＝Ｘ２３／ｓｉｎα
When the depth of the concave portion 10d of the hole filling portion 10c is not so deep, the distance from the position X2 ′ to the position X3 ′ in FIG. In the image of the hole filling portion 10c, the depth of the recess 10d (that is, the region in FIG. 4) can be obtained from the following equation by obtaining the size of the range that is reflected by the bottom surface through the side surface of the recess 10d of the hole filling portion 10c. a) is obtained.
If the distance from the position X2 ′ to the position X3 ′ is X23 and the length of the region b is lb,
cos α = X23 / lb
tan α = lb / la
la = X23 / (cos α · tan α) = X23 / sin α
一方、凹部１０ｄの深さが深くなりすぎると、図７(a)に示すように、穴充填部１０ｃの凹部１０ｄの側面に入射し、底面で反射される照明光Ｌ２”’〜Ｌ５”’ （ここで、Ｌ２”’は凹部１０ｄの側面上端、Ｌ３”’，Ｌ４”’は凹部１０ｄの側面中間部、Ｌ５”は凹部１０ｄの側面下端にそれぞれ入射する光である。）のうち、一部の光Ｌ２”’は凹部１０ｄの側面における入射側とは反対側の部位によって撮像面への入射が遮られる。このため、ライン状撮像手段４は、矢印Ａ方向に搬送されるプリント基板１０の穴充填部１０ｃに対する撮像領域がＸ２”’からＸ４までの位置に位置したときに、穴充填部１０ｃからの反射光を受光する。その結果、図６(b)に示す位置Ｘ２”’からＸ４までの部分の画像には、穴充填部１０ｃの凹部１０ｄの側面で反射して底面に入射した部位（ここでは領域ｂ”’とする）の一部が明るく撮像されない。
従って、凹部１０ｄの深さの度合いが大きい場合には、上述したように、位置Ｘ１から位置Ｘ２”’までの大きさから凹部１０ｄの深さを求めるのがよい。
On the other hand, if the depth of the concave portion 10d becomes too deep, as shown in FIG. 7A, the illumination lights L2 ″ ′ to L5 ″ ′ incident on the side surface of the concave portion 10d of the hole filling portion 10c and reflected by the bottom surface. (Here, L2 ″ ′ is light incident on the side surface upper end of the recess 10d, L3 ″ ′ and L4 ″ ′ are light incident on the side surface middle portion of the recess 10d, and L5 ″ is light incident on the side surface bottom of the recess 10d). The light L2 ″ ′ of the portion is blocked from entering the imaging surface by a portion of the side surface of the concave portion 10d opposite to the incident side. For this reason, the line-shaped imaging means 4 is transferred to the printed board 10 in the arrow A direction. When the imaging region for the hole filling portion 10c is located at a position from X2 ″ ′ to X4, the reflected light from the hole filling portion 10c is received. As a result, the image of the portion from the position X2 ″ ′ to X4 shown in FIG. 6B is reflected by the side surface of the concave portion 10d of the hole filling portion 10c and incident on the bottom surface (here, the region b ″ ′). Part of (Yes) is not brightly imaged.
Therefore, when the depth of the concave portion 10d is large, as described above, the depth of the concave portion 10d is preferably obtained from the size from the position X1 to the position X2 ″ ′.
なお、本発明の穴充填部欠陥検査システムは、入射光軸と撮像面に垂直な軸とのなす角度が比較的大きい場合にも適用可能である。ただし、そのような場合は、上記式を用いたのでは、誤差が大きくなり易い。
そこで、上記式を用いないで穴充填部１０ｃの凹部１０ｄの深さを求める方法としては、プリント基板１０の穴充填部１０ｃが不良と判定される場合の、ライン状撮像手段４を介して得られた画像のうち記憶手段５を介して記憶されているプリント基板１０における穴充填部１０ｃの位置に対応する範囲において区分けされた隣り合う領域の光量の変化が所定値を上回る所定領域の位置に対する穴充填部１０ｃの凹部１０ｄの深さについても記憶部５を介して予めテーブル状に記憶させておく。
このようにすれば、位置Ｘ１からＸ２’までの距離に対応する穴充填部１０ｃの凹部１０ｄの深さを即時に検出することができる。
The hole filling portion defect inspection system of the present invention is also applicable when the angle formed between the incident optical axis and the axis perpendicular to the imaging surface is relatively large. However, in such a case, the error tends to increase if the above equation is used.
Therefore, as a method for obtaining the depth of the concave portion 10d of the hole filling portion 10c without using the above formula, the depth filling portion 10c of the printed circuit board 10 is obtained via the line-shaped imaging means 4 when it is determined that the hole filling portion 10c is defective. Of the obtained images, the change in the amount of light in the adjacent area divided in the range corresponding to the position of the hole filling portion 10c in the printed circuit board 10 stored via the storage means 5 with respect to the position of the predetermined area exceeds the predetermined value. The depth of the concave portion 10d of the hole filling portion 10c is also stored in advance in a table shape via the storage portion 5.
In this way, it is possible to immediately detect the depth of the concave portion 10d of the hole filling portion 10c corresponding to the distance from the position X1 to X2 ′.
その一例を図８を用いて説明する。図８は穴充填部１０ｃに形成された凹部１０ｄの深さとライン状撮像手段４のカメラ角度との相関関係の一例をマトリクス状に示す説明図である。図８に示すように、穴充填部１０ｃの画像の暗部の長さが、穴充填部１０ｃの凹部１０ｄの深さに比例する。ここで、この暗部は図４における位置Ｘ１からＸ２’までの像に対応する。そこで、この暗部の長さと、穴充填部１０ｃの凹部１０ｄの深さを、ライン状撮像手段４のカメラ角度に対応づけてテーブル状に記憶させておけば、暗部の長さを検索キーとして凹部１０ｄの深さを即時に検出することができる。 An example thereof will be described with reference to FIG. FIG. 8 is an explanatory diagram showing an example of the correlation between the depth of the recess 10d formed in the hole filling portion 10c and the camera angle of the line-shaped imaging means 4 in a matrix. As shown in FIG. 8, the length of the dark part of the image of the hole filling part 10c is proportional to the depth of the concave part 10d of the hole filling part 10c. Here, this dark portion corresponds to an image from position X1 to X2 'in FIG. Therefore, if the length of the dark part and the depth of the concave part 10d of the hole filling part 10c are stored in a table shape in correspondence with the camera angle of the line-shaped image pickup means 4, the length of the dark part is used as a search key. A depth of 10d can be detected immediately.
なお、充填穴部１０ｃの凹部１０ｄの穴径に対する深さの度合いが、さらに大きくなり過ぎると、穴充填部１０ｃの凹部１０ｄの側面に入射し、底面で反射される照明光は、すべて凹部１０ｄの側面における入射側とは反対側の部位によって撮像面への入射が遮られてしまう。このため、ライン状撮像手段４を介して得られた画像は、穴充填部１０ｃ全体が暗くなり、凹部の深さを検出することができないことになるが、上述したように、本発明では、このような極端な深さにまで凹部が形成された穴充填部は検査の対象とはしていない。 If the depth of the filling hole portion 10c with respect to the hole diameter of the concave portion 10d is further increased, all of the illumination light incident on the side surface of the concave portion 10d of the hole filling portion 10c and reflected by the bottom surface is the concave portion 10d. The incident on the imaging surface is blocked by a portion of the side surface opposite to the incident side. For this reason, in the image obtained via the line-shaped imaging means 4, the entire hole filling portion 10c becomes dark and the depth of the concave portion cannot be detected, but as described above, in the present invention, The hole filling portion in which the concave portion is formed to such an extreme depth is not an inspection target.
その他、本実施形態のプリント基板の穴充填部欠陥検査システムにおいては、ライン状撮像手段４で得られる穴充填部１０ｃの像が搬送方向に長く延びるように、搬送手段２の速度を調整できるようにするとよい。このようにすれば、ライン撮像手段４を介して得られる画像の分解能が上がって、得られた画像領域をより細分化して光量の変化を検出し易くなり、より高精度に凹部１０ｄの深さを検出することができる。 In addition, in the hole filling portion defect inspection system for the printed circuit board according to the present embodiment, the speed of the conveying means 2 can be adjusted so that the image of the hole filling portion 10c obtained by the line-shaped imaging means 4 extends in the conveying direction. It is good to. In this way, the resolution of the image obtained via the line imaging means 4 is increased, the obtained image area is further subdivided, and the change in the amount of light is easily detected, and the depth of the recess 10d is more accurately determined. Can be detected.
また、プリント基板の穴充填部には、穴部の周囲が研磨等により削れを生じている場合、図９に示すように、その削れ部１０ａ’に照射した光Ｌ１””が反射されて撮像面に入射する可能性がある。この場合、プリント基板の穴充填部の先頭部（最初に撮像面に位置する部位）近傍の画像領域での受光量が大きくなる。このため、穴充填部１０ｃに凹部が形成されていない又は凹部の程度が許容範囲（深さのしきい値を超えない範囲）である場合であっても、不良品と判断されてしまうおそれがある。 Further, in the hole filling portion of the printed circuit board, when the periphery of the hole portion is scraped by polishing or the like, as shown in FIG. 9, the light L1 ″ ″ irradiated to the scraped portion 10a ′ is reflected and imaged. May be incident on the surface. In this case, the amount of light received in the image area near the top of the hole filling portion of the printed circuit board (the part first located on the imaging surface) increases. For this reason, even if the concave portion is not formed in the hole filling portion 10c or the degree of the concave portion is within an allowable range (a range not exceeding the depth threshold value), there is a possibility that it is determined as a defective product. is there.
そこで、本実施形態の穴充填部の欠陥検査システムにおいては、ライン状撮像手段３を介して得られた像のうち記憶手段５により記憶された穴充填部１０ｃの像位置からプリント基板１０の穴充填部１０ｃの先頭部（最初に撮像面に位置する部位）近傍の所定範囲を反射光の検査対象外として除外して、反射光の位置を測定し、検査対象外のデータは測定対象から除外するように、判定手段６を構成するのが好ましい。
このようにすれば、穴充填部１０ｃの周囲に削れ部が存在しても、擬似エラーの発生を抑えて、高精度に穴充填部１０ｃにできた凹部１０ｄの深さを検出することができ、穴充填部欠陥検査の信頼性を格段に向上させることができる。
Therefore, in the defect inspection system for the hole filling portion of the present embodiment, the hole of the printed circuit board 10 is determined from the image position of the hole filling portion 10c stored in the storage means 5 among the images obtained via the line-shaped imaging means 3. The predetermined range in the vicinity of the top portion (the part first located on the imaging surface) of the filling unit 10c is excluded from the inspection target of the reflected light, the position of the reflected light is measured, and the data outside the inspection target is excluded from the measurement target Thus, it is preferable to configure the determination means 6.
In this way, even if there is a shaved portion around the hole filling portion 10c, the occurrence of a pseudo error can be suppressed and the depth of the recess 10d formed in the hole filling portion 10c can be detected with high accuracy. In addition, the reliability of the hole filling portion defect inspection can be remarkably improved.
以上、本発明のプリント基板の穴充填部欠陥検査装置の実施形態について説明したが、これらの実施形態に限られるものではない。
例えば、上記実施形態のプリント基板の穴充填部欠陥検査システムにおいて、ライン状照射手段３を、検査位置Ｓを中心とした対称位置に複数組配置するとともに、ライン状撮像手段４を、検査位置を中心とした対称位置に、複数組のライン状照射手段３を介して照射された穴充填部における異なる複数方向の壁面の像をそれぞれ別個に撮像するように、複数組配置すると好ましい。
このように構成すれば、一度に穴充填部を多方向から検査することができ、検査効率、検査速度が向上する。
As mentioned above, although embodiment of the hole filling part defect inspection apparatus of the printed circuit board of this invention was described, it is not restricted to these embodiment.
For example, in the printed circuit board hole filling portion defect inspection system of the above-described embodiment, a plurality of sets of line-shaped irradiation means 3 are arranged at symmetrical positions with the inspection position S as the center, and the line-shaped imaging means 4 is arranged at the inspection position. It is preferable to arrange a plurality of sets so that images of wall surfaces in different directions in the hole filling portion irradiated through the plurality of sets of line-shaped irradiation means 3 are separately captured at symmetrical positions around the center.
If comprised in this way, a hole filling part can be test | inspected from multiple directions at once, and test | inspection efficiency and test | inspection speed will improve.
このように構成されたプリント基板の穴充填部欠陥検査システムにおける穴充填部の欠陥検査処理の処理手順を図１０を用いて説明する。
まず、記憶手段５にプリント基板１０における穴充填部１０ｃの位置を記憶させておく（ステップＳ１）。
次いで、搬送手段２を介してプリント基板１０を所定速度で検査位置Ｓを通過するように搬送する（ステップＳ２）。
より詳しくは、搬入部署１２において、所定枚数の積重ねの形で準備された検査されるべきプリント基板１０等を搬入ロボットを介して１枚１枚に分離して、検査テーブル上へ置く。検査テーブル上に置かれたプリント基板１０等を、例えばクランプ装置で四隅をクランプされた後、単軸ロボットを介して、検査部署１１から選別回収部署１３へと移動する。
検査位置Ｓを通過する際に検査部署１１に設けられたライン状照明手段３を介して、検査位置Ｓに位置するプリント基板１０の穴充填部１０ｃの中心軸方向に対して入射光軸が所定角度傾斜するようにしてライン状に照射する（ステップＳ３）とともに、ライン状撮像手段４のＣＣＤラインセンサーカメラ等を介して、照射された穴充填部１０ｃに凹部１０ｄが形成されている場合に、ライン状照射手段３から出射しプリント基板１０で反射される光のうち、凹部１０ｃの側面を経て底面で反射される光の少なくとも一部が撮像面に入射し、それ以外の光が撮像面から外れるように、プリント基板１０の検査位置Ｓに位置する部位の像をライン状に撮像する（ステップＳ４）。
A processing procedure of the defect inspection process of the hole filling portion in the hole filling portion defect inspection system of the printed circuit board configured as described above will be described with reference to FIG.
First, the position of the hole filling part 10c in the printed circuit board 10 is stored in the storage means 5 (step S1).
Next, the printed circuit board 10 is transported at a predetermined speed through the transport means 2 so as to pass the inspection position S (step S2).
More specifically, the carry-in department 12 separates the printed circuit boards 10 to be inspected prepared in the form of a predetermined number of stacked sheets into one by one via the carry-in robot and places them on the inspection table. The printed circuit board 10 and the like placed on the inspection table are clamped at four corners by, for example, a clamp device, and then moved from the inspection department 11 to the sorting and collection department 13 via a single-axis robot.
When passing through the inspection position S, the incident optical axis is predetermined with respect to the central axis direction of the hole filling portion 10c of the printed circuit board 10 located at the inspection position S via the line illumination means 3 provided in the inspection section 11. In the case where the recess 10d is formed in the irradiated hole filling portion 10c via the CCD line sensor camera or the like of the linear imaging means 4 while irradiating in a line shape so as to be inclined (step S3), Of the light emitted from the line irradiation means 3 and reflected by the printed circuit board 10, at least a part of the light reflected by the bottom surface through the side surface of the recess 10c is incident on the imaging surface, and other light is incident from the imaging surface. An image of the part located at the inspection position S of the printed circuit board 10 is captured in a line shape so as to be off (step S4).
次いで、撮像された画像情報から穴充填部１０ｃの欠陥検査を判定手段６を介して行う。
まず、ライン状撮像撮像手段４で得られた画像のうち記憶手段５を介して記憶しておいたプリント基板１０における穴充填部１０ｃの位置に対応する範囲についての光量をプリント基板１０の搬送方向に所定単位ごとの領域に区分けして検出する（ステップＳ５）。
次いで、穴充填部１０ｃの位置において区分けされた隣り合う領域同士の光量の変化を検出する（ステップＳ６）。
そして、検出した光量の変化が最終領域に至るまで、所定値（光量変化のしきい値）を上回るか否かをチェックする（ステップＳ７）。
所定値（光量変化のしきい値）を上回らない場合は、良品と判断する（ステップＳ１１）。
所定値（光量変化のしきい値）を上回る場合は、その所定値（光量変化のしきい値）を上回る所定領域の位置情報に基づいて、上述した方法を用いて穴充填部における凹部１０ｄの深さを検出する（ステップＳ８）。
そして、検出した凹部１０ｄの深さが所定値（深さのしきい値）を上回るか否かをチェックする（ステップＳ９）。この深さのしきい値は、プリント基板１０の設計に応じて任意に定めておく。
検出した凹部１０ｄの深さが所定値（深さのしきい値）を上回らない場合、良品と判定し、（ステップＳ１１）、所定値（深さのしきい値）を上回る場合、不良品と判定する（ステップＳ１０）。
Next, a defect inspection of the hole filling portion 10 c is performed through the determination unit 6 from the captured image information.
First, the amount of light in a range corresponding to the position of the hole filling portion 10c in the printed circuit board 10 stored via the storage means 5 among the images obtained by the line-shaped imaging and imaging means 4 is measured in the transport direction of the printed circuit board 10. Then, it is detected by dividing into regions of predetermined units (step S5).
Next, a change in the amount of light between adjacent regions divided at the position of the hole filling portion 10c is detected (step S6).
Then, it is checked whether or not the detected change in light quantity exceeds a predetermined value (threshold change threshold) until reaching the final region (step S7).
If it does not exceed a predetermined value (threshold change threshold), it is determined as a non-defective product (step S11).
When exceeding a predetermined value (threshold change threshold), based on the positional information of a predetermined region exceeding the predetermined value (threshold change threshold), the above-described method is used to determine the depth of the recess 10d in the hole filling portion. The depth is detected (step S8).
Then, it is checked whether or not the detected depth of the recess 10d exceeds a predetermined value (depth threshold) (step S9). The depth threshold is arbitrarily determined according to the design of the printed circuit board 10.
If the detected depth of the recess 10d does not exceed a predetermined value (depth threshold), it is determined to be a non-defective product (step S11). If the detected depth exceeds the predetermined value (depth threshold), Determine (step S10).
検査部署１１で不良品と判定された場合は、その判定信号に基づいて制御される該当するプリント基板１０等が選別回収部署１３へ送り込まれたとき、搬出ロボットにより、不良品置き場に回収される。これに対して、検査部署１１で良品と判定された場合は、搬出ロボットにより良品置き場に回収される。検査が終了すると、検査テーブルは単軸ロボットを介して搬入部署１２におけるもとの位置に戻される。不良品のプリント基板１０については、選別回収部署１３に備えたバーコードプリンターから充填穴部１０ｃの充填の不良情報が出力される。なお、不良品に選別されたプリント基板１０については、ＣＣＤレビュー機等を介して、壁面の状態を個別に詳細に確認する。 If the inspection department 11 determines that the product is defective, when the corresponding printed circuit board 10 or the like controlled based on the determination signal is sent to the sorting and collection department 13, it is collected by the carry-out robot in the defective product storage area. . On the other hand, if the inspection department 11 determines that the product is non-defective, it is collected in the non-defective product storage area by the carry-out robot. When the inspection is completed, the inspection table is returned to the original position in the carry-in department 12 via the single-axis robot. For defective printed circuit boards 10, defective filling information of the filling hole 10 c is output from a bar code printer provided in the sorting and collecting department 13. In addition, about the printed circuit board 10 sorted into inferior goods, the state of a wall surface is confirmed individually in detail via a CCD review machine etc.
本発明は、自動車やサーバー等、高精度で高品質なプリント基板が求められる分野において有用である。 The present invention is useful in fields where high-precision and high-quality printed circuit boards are required, such as automobiles and servers.
１ 載置手段
１ａ 検査テーブル
１ｂ 搬入ロボット
２ 搬送手段
２ａ 単軸ロボット
３ ライン状照明手段
４ ライン状撮像手段
５ 記憶手段
６ 判定手段
１０ プリント基板
１０ａ 表面層部
１０ｂ 絶縁層部
１０ｃ 穴充填部
１０ｄ 穴充填部１０ｃに形成された凹部
Ａ 穴充填部撮像部署
Ｂ 搬入部署
Ｃ プリント基板の良品と不良品との選別回収部署
DESCRIPTION OF SYMBOLS 1 Mounting means 1a Inspection table 1b Carry-in robot 2 Conveying means 2a Single axis robot 3 Line-shaped illumination means 4 Line-shaped imaging means 5 Storage means 6 Judging means 10 Printed circuit board 10a Surface layer part 10b Insulating layer part 10c Hole filling part 10d Hole Concave part A formed in filling part 10c Hole filling part imaging department B Carry-in department C Sorting and collecting department for non-defective and defective printed circuit boards
Claims (10)
前記載置手段に載置された前記プリント基板を所定速度で検査位置を通過するように搬送する搬送手段と、
前記プリント基板の前記検査位置に位置する部位をライン状に照射するライン状照射手段と、
前記ライン状照射手段を介して照射された前記プリント基板の前記検査位置に位置する部位の像をライン状に撮像するライン状撮像手段を有し、該ライン状撮像手段で撮像した画像を用いて前記プリント基板に設けられている穴充填部の良・不良を検査するプリント基板の欠陥検査システムであって、
前記ライン状照射手段は、入射光軸が前記検査位置に位置する前記穴充填部の中心軸方向に対して所定角度傾斜するように配置され、
前記ライン状撮像手段は、前記穴充填部に凹部が存在する場合に、前記ライン状照射手段から出射し前記プリント基板で反射される光のうち、該凹部の側面を経て底面で反射される光の少なくとも一部が撮像面に入射し、それ以外の光が該撮像面から外れるように配置され、
さらに、前記プリント基板における前記穴充填部の位置を予め記憶した記憶手段と、
前記ライン状撮像手段で得られた画像のうち前記記憶手段を介して記憶されている前記プリント基板における前記穴充填部の位置に対応する範囲についての光量を該プリント基板の搬送方向に所定単位ごとの領域に区分けして検出し、該穴充填部の位置に対応する範囲において区分けされた隣り合う領域同士の光量の変化が最終領域に至るまで所定値を上回らない場合には、該穴充填部を良と判定し、該光量の変化が所定値を上回った場合には、その所定値を上回る所定領域の位置から該穴充填部における凹部の深さを検出し、検出した凹部の深さに基づいて、該穴充填部の良・不良の判定を行う判定手段を有することを特徴とするプリント基板の穴充填部欠陥検査システム。 Mounting means for mounting a printed circuit board;
Conveying means for conveying the printed circuit board placed on the placing means so as to pass through an inspection position at a predetermined speed;
A line-shaped irradiation means for irradiating the portion located at the inspection position of the printed circuit board in a line shape;
Using a line-shaped image pickup means for picking up an image of a part located at the inspection position of the printed circuit board irradiated through the line-shaped irradiation means, and using an image picked up by the line-shaped image pickup means; A printed circuit board defect inspection system for inspecting good / bad of the hole filling portion provided in the printed circuit board,
The line-shaped irradiation means is arranged such that an incident optical axis is inclined at a predetermined angle with respect to a central axis direction of the hole filling portion located at the inspection position,
The line-shaped imaging unit is a light that is emitted from the line-shaped irradiation unit and reflected by the printed circuit board and reflected from the bottom surface through the side surface of the concave portion when a concave portion exists in the hole filling portion. Are arranged such that at least a part of the light enters the imaging surface and other light deviates from the imaging surface,
Furthermore, storage means for storing in advance the position of the hole filling portion in the printed circuit board,
The amount of light in a range corresponding to the position of the hole filling portion in the printed circuit board stored in the printed circuit board among the images obtained by the line-shaped imaging unit is determined for each predetermined unit in the transport direction of the printed circuit board. If the change in the amount of light between adjacent regions divided in the range corresponding to the position of the hole filling portion does not exceed a predetermined value until reaching the final region, the hole filling portion If the change in the amount of light exceeds a predetermined value, the depth of the concave portion in the hole filling portion is detected from the position of the predetermined region exceeding the predetermined value, and the detected depth of the concave portion is determined. A printed circuit board hole filling portion defect inspection system comprising: determination means for determining whether the hole filling portion is good or defective.
記憶手段を備えて、前記プリント基板における前記穴充填部の位置を予め記憶させておき、
前記搬送手段を介して、前記プリント基板を所定速度で前記検査位置を通過するように搬送し、
前記ライン状照射手段を介して、前記検査位置に位置する前記プリント基板の前記穴充填部の中心軸方向に対して入射光軸が所定角度傾斜するようにしてライン状に照射するとともに、
前記ライン状撮像手段を介して、前記穴充填部に凹部が形成されている場合に、前記ライン状照射手段から出射し前記プリント基板で反射される光のうち、該凹部の側面を経て底面で反射される光の少なくとも一部が撮像面に入射し、それ以外の光が該撮像面から外れるように、前記プリント基板の前記検査位置に位置する部位の像をライン状に撮像し、
前記ライン状撮像手段で得られた画像のうち前記記憶手段を介して記憶しておいた前記プリント基板における前記穴充填部の位置に対応する範囲についての光量を該プリント基板の搬送方向に所定単位ごとの領域に区分けして検出し、
該穴充填部の位置に対応する範囲において区分けされた隣り合う領域同士の光量の変化が最終領域に至るまで所定値を上回らない場合には、該穴充填部を良と判定し、
該光量の変化が前記所定値を上回った場合には、その所定値を上回る所定領域の位置から該穴充填部における凹部の深さを検出し、検出した凹部の深さに基づいて、該穴充填部の良・不良の判定を行うことを特徴とするプリント基板の穴充填部欠陥検査方法。 A placement means for placing the printed circuit board; a transport means for transporting the printed circuit board placed on the placement means so as to pass through the inspection position at a predetermined speed; and the inspection means on the printed circuit board. Line-shaped irradiation means for irradiating a portion in a line shape, and line-shaped imaging means for picking up an image of the portion located at the inspection position of the printed circuit board irradiated through the line-shaped irradiation means in a line shape A printed circuit board defect inspection method for inspecting good / bad of a hole filling portion provided in the printed circuit board using an image captured by the line-shaped imaging means via an apparatus,
Comprising a storage means, storing in advance the position of the hole filling portion in the printed circuit board;
Via the conveyance means, the printed circuit board is conveyed at a predetermined speed so as to pass through the inspection position,
Through the line irradiation means, the incident optical axis is inclined in a predetermined angle with respect to the central axis direction of the hole filling portion of the printed circuit board located at the inspection position, and is irradiated in a line shape,
In the case where a concave portion is formed in the hole filling portion via the line-shaped imaging unit, out of the light emitted from the line-shaped irradiation unit and reflected by the printed circuit board, on the bottom surface through the side surface of the concave portion. An image of a portion of the printed circuit board located at the inspection position is captured in a line so that at least a part of the reflected light is incident on the imaging surface and other light is removed from the imaging surface,
Of the image obtained by the line-shaped image pickup means, the light quantity for a range corresponding to the position of the hole filling portion in the printed board stored through the storage means is a predetermined unit in the transport direction of the printed board. Detect by dividing each area,
If the change in the amount of light between adjacent areas divided in the range corresponding to the position of the hole filling portion does not exceed a predetermined value until reaching the final region, the hole filling portion is determined to be good,
When the change in the amount of light exceeds the predetermined value, the depth of the concave portion in the hole filling portion is detected from the position of the predetermined region exceeding the predetermined value, and the hole is determined based on the detected depth of the concave portion. A method for inspecting a defect in a hole filling portion of a printed circuit board, comprising: determining whether the filling portion is good or defective.
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