JP2008117884A - Fpc substrate - Google Patents
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- JP2008117884A JP2008117884A JP2006298682A JP2006298682A JP2008117884A JP 2008117884 A JP2008117884 A JP 2008117884A JP 2006298682 A JP2006298682 A JP 2006298682A JP 2006298682 A JP2006298682 A JP 2006298682A JP 2008117884 A JP2008117884 A JP 2008117884A
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Abstract
Description
本発明は、ＦＰＣ（Flexible Printed Circuits）基板に関し、特に、歪みゲージ式ロードセルの起歪体表面に設けられた複数の歪み検出素子同士を接続するＦＰＣ基板に関する。 The present invention relates to an FPC (Flexible Printed Circuits) substrate, and more particularly to an FPC substrate that connects a plurality of strain detection elements provided on a strain generating body surface of a strain gauge type load cell.
歪みゲージ式ロードセルの起歪体の表面に設けられた複数の歪みゲージ同士を接続するために、ＦＰＣ基板が使用されている。ＦＰＣ基板は、ポリイミド等の絶縁基板上に、配線用の銅箔パターンを形成したものである。従来、作業性や耐久性の向上のためにＦＰＣ基板の強度を補強するためには、絶縁基板や銅箔パターンの厚みを全面的に増すことが一般的であった。 In order to connect a plurality of strain gauges provided on the surface of the strain generating body of the strain gauge type load cell, an FPC board is used. The FPC board is obtained by forming a copper foil pattern for wiring on an insulating board such as polyimide. Conventionally, in order to reinforce the strength of the FPC board in order to improve workability and durability, it has been common to increase the thickness of the insulating board and the copper foil pattern.
なお、ＦＰＣ基板を備えたロードセルは、例えば下記特許文献１に開示されている。 In addition, the load cell provided with the FPC board is disclosed by the following patent document 1, for example.
しかしながら、ＦＰＣ基板の強度を補強するために絶縁基板や銅箔パターンの厚みを増したのでは、それに伴って製造コストの上昇を招く。 However, if the thickness of the insulating substrate or the copper foil pattern is increased to reinforce the strength of the FPC substrate, the manufacturing cost increases accordingly.
また、ロードセルに用いられる各種ＦＰＣ基板の中には、起歪体の荷重変形に対応して高い可撓性が要求される領域が部分的に存在するものがある。例えば、同一面内で並設する歪みゲージ間ではＦＰＣ基板が空中に浮いた状態となっており、これにより、荷重に起因する起歪体の変形に応じてＦＰＣが伸縮するものがある。このようなタイプのＦＰＣ基板において、ＦＰＣ基板の強度を補強するために絶縁基板や銅箔パターンの厚みを全面的に増したのでは、歪みゲージ間の部位におけるＦＰＣ基板も可撓性が低下するため、その部位の拘束力が増してロードセルのクリープ特性に大きな影響を与えてしまう。このように、要求される可撓性がＦＰＣ基板の部位によって異なる場合には、絶縁基板や銅箔パターンの厚みを全面的に増すことは得策ではない。 Further, among various types of FPC boards used in the load cell, there is a part where a region requiring high flexibility corresponding to the load deformation of the strain generating body partially exists. For example, the FPC board floats in the air between strain gauges arranged side by side in the same plane, and this causes the FPC to expand and contract in accordance with deformation of the strain generating body caused by the load. In such a type of FPC board, if the thickness of the insulating board or the copper foil pattern is entirely increased in order to reinforce the strength of the FPC board, the flexibility of the FPC board in the region between the strain gauges also decreases. For this reason, the restraining force of the part is increased and the creep characteristics of the load cell are greatly affected. Thus, when the required flexibility differs depending on the portion of the FPC board, it is not a good idea to increase the thickness of the insulating board or the copper foil pattern entirely.
本発明はこのような事情に鑑みて成されたものであり、コストの上昇を招くことなく、しかも、要求される可撓性がＦＰＣ基板の部位によって異なる場合であっても、所望の領域のみの強度を補強することが可能なＦＰＣ基板を得ることを目的とする。 The present invention has been made in view of such circumstances, and does not cause an increase in cost, and even if the required flexibility differs depending on the portion of the FPC board, only a desired region is obtained. An object of the present invention is to obtain an FPC board that can reinforce the strength.
第１の発明に係るＦＰＣ基板は、歪みゲージ式ロードセルの起歪体表面に設けられた複数の歪み検出素子同士を接続するＦＰＣ基板であって、絶縁基板と、前記絶縁基板上に形成され、前記複数の歪み検出素子同士を接続するための配線用導体パターンと、前記絶縁基板上で前記配線用導体パターンが形成されていない領域に形成された、ベタ膜状の補強用パターンとを備える。 An FPC board according to a first aspect of the present invention is an FPC board that connects a plurality of strain detection elements provided on a strain generating body surface of a strain gauge type load cell, and is formed on the insulating board and the insulating board. A wiring conductor pattern for connecting the plurality of strain detection elements; and a solid film-shaped reinforcing pattern formed in a region where the wiring conductor pattern is not formed on the insulating substrate.
第２の発明に係るＦＰＣ基板は、第１の発明に係るＦＰＣ基板において特に、前記補強用パターンは、前記配線用導体パターンを形成する工程において、前記配線用導体パターンと電気的に分離されつつ併せて形成された導体パターンであることを特徴とする。 An FPC board according to a second invention is the FPC board according to the first invention, and in particular, the reinforcing pattern is electrically separated from the wiring conductor pattern in the step of forming the wiring conductor pattern. It is the conductor pattern formed together, It is characterized by the above-mentioned.
第３の発明に係るＦＰＣ基板は、第１の発明に係るＦＰＣ基板において特に、前記ＦＰＣ基板は、前記起歪体の荷重変形に対応して高い可撓性が要求される第１領域と、前記第１領域以外の第２領域とを有し、前記補強用パターンは、前記第２領域内のみに形成されていることを特徴とする。 The FPC board according to a third invention is the FPC board according to the first invention, in particular, the FPC board has a first region where high flexibility is required in response to load deformation of the strain body, A second area other than the first area, and the reinforcing pattern is formed only in the second area.
第４の発明に係るＦＰＣ基板は、第３の発明に係るＦＰＣ基板において特に、前記第１領域内における前記配線用導体パターンの線幅は、前記第２領域内における前記配線用導体パターンの線幅よりも狭いことを特徴とする。 The FPC board according to a fourth invention is the FPC board according to the third invention, in particular, the line width of the wiring conductor pattern in the first region is the line of the wiring conductor pattern in the second region. It is characterized by being narrower than the width.
第１の発明に係るＦＰＣ基板によれば、配線用導体パターンが形成されていない領域にベタ膜状の補強用パターンを形成することにより、ＦＰＣ基板の強度を補強することができる。従って、強度の補強のために絶縁基板や配線用導体パターンの厚みを増す必要がないため、コストの上昇を回避することができる。 According to the FPC board of the first invention, the strength of the FPC board can be reinforced by forming the solid film-like reinforcing pattern in the region where the wiring conductor pattern is not formed. Therefore, it is not necessary to increase the thickness of the insulating substrate and the wiring conductor pattern for reinforcing the strength, so that an increase in cost can be avoided.
第２の発明に係るＦＰＣ基板によれば、配線用導体パターンの形成工程において、エッチング用のマスクパターンを変更するだけで補強用パターンを併せて形成できるため、コストの上昇を回避することができる。 According to the FPC board of the second invention, in the process of forming the wiring conductor pattern, it is possible to form the reinforcing pattern only by changing the etching mask pattern, so that an increase in cost can be avoided. .
第３の発明に係るＦＰＣ基板によれば、起歪体の荷重変形に対応して高い可撓性が要求される第１領域には、補強用パターンが形成されていない。従って、第２領域においてＦＰＣ基板の強度の補強を実現しながら、第１領域における拘束力が増してロードセルのクリープ特性に影響を与えてしまうという事態を回避できる。 According to the FPC board according to the third aspect of the present invention, the reinforcing pattern is not formed in the first region where high flexibility is required corresponding to the load deformation of the strain generating body. Therefore, it is possible to avoid a situation in which the restraining force in the first region increases and affects the creep characteristics of the load cell while realizing the reinforcement of the strength of the FPC board in the second region.
第４の発明に係るＦＰＣ基板によれば、第１領域内における配線用導体パターンの線幅は、第２領域内における配線用導体パターンの線幅よりも狭い。従って、第２領域においては線幅の太い配線用導体パターンによってＦＰＣ基板の強度を補強しつつ、第１領域においては線幅の細い導体パターンを採用することで、クリープ特性に与える影響を回避できる。 According to the FPC board of the fourth invention, the line width of the wiring conductor pattern in the first region is narrower than the line width of the wiring conductor pattern in the second region. Therefore, by adopting a conductor pattern with a thin line width in the first region while reinforcing the strength of the FPC board with a conductor pattern for wiring with a large line width in the second region, the influence on the creep characteristics can be avoided. .
以下、本発明の実施の形態について、図面を用いて詳細に説明する。なお、異なる図面において同一の符号を付した要素は、同一又は相応する要素を示すものとする。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the element which attached | subjected the same code | symbol in different drawing shall show the same or corresponding element.
図１は、本発明の実施の形態に係るロードセル１の構成を概略的に示す斜視図である。図１に示すように本実施の形態に係るロードセル１は、４個の歪み発生部３Ａ〜３Ｄが設けられた中空直方体状の起歪体２と、各歪み発生部３Ａ〜３Ｄに対応する箇所の起歪体２の表面（外面）にそれぞれ設けられた歪み検出素子（ストレインゲージ）４Ａ〜４Ｄとを備えて構成されている。但し、図１には歪み検出素子４Ａ，４Ｂは表れていない。なお、以降の説明において、歪み検出素子４Ａ〜４Ｄを総称して歪み検出素子４と称する。また、ロードセル１は、ホイートストンブリッジ回路を構成するように歪み検出素子４Ａ〜４Ｄを互いに接続するとともに、これらと外部回路とを接続するためのＦＰＣ（Flexible Printed Circuits）基板５を備えている。 FIG. 1 is a perspective view schematically showing a configuration of a load cell 1 according to an embodiment of the present invention. As shown in FIG. 1, the load cell 1 according to the present embodiment includes a hollow rectangular parallelepiped strain generating body 2 provided with four strain generating portions 3A to 3D, and locations corresponding to the strain generating portions 3A to 3D. The strain detecting elements (strain gauges) 4A to 4D provided on the surface (outer surface) of the strain generating body 2 are provided. However, the strain detection elements 4A and 4B do not appear in FIG. In the following description, the strain detection elements 4A to 4D are collectively referred to as a strain detection element 4. In addition, the load cell 1 includes an FPC (Flexible Printed Circuits) substrate 5 for connecting the strain detection elements 4A to 4D to each other so as to constitute a Wheatstone bridge circuit and for connecting these to an external circuit.
図２は、本実施の形態に係るＦＰＣ基板５の構成を概略的に示す平面図である。図１，２に示すように、ＦＰＣ基板５は、歪み検出素子４Ａ〜４Ｄにそれぞれ接続される部分であるゲージ接続部分５Ａ〜５Ｄと、ゲージ接続部分５Ａ，５Ｂを繋ぐ連結部分５Ｅと、ゲージ接続部分５Ｃ，５Ｄを繋ぐ連結部分５Ｆと、ゲージ接続部分５Ａ，５Ｃを繋ぐ連結部分５Ｇと、ゲージ接続部分５Ｃと外部回路とを繋ぐ連結部分５Ｈとを有している。ゲージ接続部分５Ａ〜５Ｄ及び連結部分５Ｇは、接着等によって起歪体２の表面に固定される。また、図１を参照して、連結部分５Ｅ，５Ｆは、ある程度撓みながら空中に浮いた状態となることによって高い可撓性を有しており、荷重に起因する起歪体の変形に追随して伸縮自在である。つまり、ゲージ接続部分５Ａ〜５Ｄ及び連結部分５Ｇは可撓性が要求されない領域であり、一方、連結部分５Ｅ，５Ｆは高い可撓性が要求される領域である。 FIG. 2 is a plan view schematically showing the configuration of the FPC board 5 according to the present embodiment. As shown in FIGS. 1 and 2, the FPC board 5 includes gauge connection portions 5A to 5D that are portions connected to the strain detection elements 4A to 4D, a connection portion 5E that connects the gauge connection portions 5A and 5B, and a gauge. A connecting portion 5F that connects the connecting portions 5C and 5D, a connecting portion 5G that connects the gauge connecting portions 5A and 5C, and a connecting portion 5H that connects the gauge connecting portion 5C and an external circuit are provided. The gauge connecting portions 5A to 5D and the connecting portion 5G are fixed to the surface of the strain generating body 2 by adhesion or the like. In addition, referring to FIG. 1, the connecting portions 5E and 5F have high flexibility by being bent to some extent while being bent to some extent, and follow the deformation of the strain generating body caused by the load. It is flexible. That is, the gauge connecting portions 5A to 5D and the connecting portion 5G are regions where flexibility is not required, while the connecting portions 5E and 5F are regions where high flexibility is required.
図２を参照して、ＦＰＣ基板５は、ポリイミド等の絶縁基板９と、絶縁基板９の上面上に形成された配線用の導体パターン（以降「配線パターン」と称す）１１とを備えている。配線パターン１１は、歪み検出素子４Ａ〜４Ｄがホイートストンブリッジ回路を構成するように、図２中で太線で示すように所定の回路パターンに形成されている。配線パターン１１は、端子１０を介して各歪み検出素子４に接続される。また、ＦＰＣ基板５は、絶縁基板９の上面上で配線パターン１１が形成されていない領域に形成された、ベタ膜状の導体パターン（以降「ベタパターン」と称す）１２を備えている。ベタパターン１２は、ＦＰＣ基板５の強度を補強するためのものであり、配線パターン１１とは電気的に分離されている。図２に示すように、ベタパターン１２は、ゲージ接続部分５Ａ〜５Ｄ内及び連結部分５Ｇ内には形成されているが、連結部分５Ｅ，５Ｆ内には形成されていない。従って、ゲージ接続部分５Ａ〜５Ｄ及び連結部分５ＧにおいてＦＰＣ基板５の強度の補強を実現しながら、高い可撓性が要求される連結部分５Ｅ，５Ｆ内にはベタパターン１２を形成しないことにより、連結部分５Ｅ，５Ｆにおける拘束力が増してロードセル１のクリープ特性に影響を与えてしまうという事態を回避できる。 Referring to FIG. 2, the FPC board 5 includes an insulating substrate 9 such as polyimide, and a wiring conductor pattern (hereinafter referred to as “wiring pattern”) 11 formed on the upper surface of the insulating substrate 9. . The wiring pattern 11 is formed in a predetermined circuit pattern as shown by a thick line in FIG. 2 so that the strain detection elements 4A to 4D constitute a Wheatstone bridge circuit. The wiring pattern 11 is connected to each strain detection element 4 via the terminal 10. The FPC board 5 includes a solid film-like conductor pattern (hereinafter referred to as “solid pattern”) 12 formed in a region where the wiring pattern 11 is not formed on the upper surface of the insulating substrate 9. The solid pattern 12 is for reinforcing the strength of the FPC board 5 and is electrically separated from the wiring pattern 11. As shown in FIG. 2, the solid pattern 12 is formed in the gauge connecting portions 5A to 5D and the connecting portion 5G, but is not formed in the connecting portions 5E and 5F. Therefore, by realizing the reinforcement of the strength of the FPC board 5 in the gauge connecting portions 5A to 5D and the connecting portion 5G, the solid pattern 12 is not formed in the connecting portions 5E and 5F that require high flexibility. It is possible to avoid a situation in which the restraining force at the connecting portions 5E and 5F increases and the creep characteristics of the load cell 1 are affected.
図３は、図２に示したラインＬ１−Ｌ１に沿った位置に関して、配線パターン１１及びベタパターン１２の形成方法を示す断面図である。まず、図３（Ａ）に示すように、絶縁基板９の上面上に、銅等の導電膜２０を全面的に形成する。次に、図３（Ｂ）に示すように、所定のエッチングマスクを用いて導電膜２０をエッチングすることにより、配線パターン１１及びベタパターン１２を形成する。このように、配線パターン１１を形成する工程において、エッチングマスクのパターンを変更するだけでベタパターン１２を併せて形成できるため、コストの上昇を回避することができる。 FIG. 3 is a cross-sectional view showing a method of forming the wiring pattern 11 and the solid pattern 12 with respect to the position along the line L1-L1 shown in FIG. First, as shown in FIG. 3A, a conductive film 20 such as copper is entirely formed on the upper surface of the insulating substrate 9. Next, as shown in FIG. 3B, the conductive pattern 20 is etched using a predetermined etching mask to form the wiring pattern 11 and the solid pattern 12. As described above, in the process of forming the wiring pattern 11, the solid pattern 12 can be formed together by simply changing the pattern of the etching mask, so that an increase in cost can be avoided.
図４は、本実施の形態に係るＦＰＣ基板５の変形例を部分的に示す平面図である。図２に示したように配線パターン１１とベタパターン１２とを互いに分離して形成するのではなく、図４に示すように、配線パターン１１（図４における符号１１１〜１１３）自体をベタ膜状に形成しても良い。これによっても、コストの上昇を回避しつつＦＰＣ基板５の強度の補強を実現できる。 FIG. 4 is a plan view partially showing a modification of the FPC board 5 according to the present embodiment. The wiring pattern 11 and the solid pattern 12 are not formed separately from each other as shown in FIG. 2, but the wiring pattern 11 (reference numerals 11 1 to 11 3 in FIG. 4) itself is solid as shown in FIG. You may form in a film | membrane form. This also makes it possible to reinforce the strength of the FPC board 5 while avoiding an increase in cost.
図５は、本実施の形態に係るＦＰＣ基板５の一部を抜き出して示す平面図である。図５に示した例では、ゲージ接続部分５Ｄ及び連結部分５Ｆに、３本の配線パターン１１１〜１１３が形成されている。そして、連結部分５Ｆ内における配線パターン１１１〜１１３の線幅Ｗ１１〜Ｗ１３は、ゲージ接続部分５Ｄ内における配線パターン１１１〜１１３の線幅Ｗ１〜Ｗ３よりも狭くなっている。図５にはゲージ接続部分５Ｄ及び連結部分５Ｆの例のみを示したが、他のゲージ接続部分５Ａ〜５Ｃ及び連結部分５Ｅに関しても同様である。これにより、ゲージ接続部分５Ａ〜５Ｄにおいては線幅の太い配線パターン１１によってＦＰＣ基板５の強度を補強しつつ、連結部分５Ｅ，５Ｆにおいては線幅の細い導体パターン１１を採用することで、クリープ特性に与える影響を回避できる。 FIG. 5 is a plan view showing a part of the FPC board 5 according to the present embodiment. In the example shown in FIG. 5, three wiring patterns 11 1 to 11 3 are formed in the gauge connection portion 5D and the connection portion 5F. The line widths W11 to W13 of the wiring patterns 11 1 to 11 3 in the connection portion 5F are narrower than the line widths W1 to W3 of the wiring patterns 11 1 to 11 3 in the gauge connection portion 5D. Although FIG. 5 shows only the example of the gauge connecting portion 5D and the connecting portion 5F, the same applies to the other gauge connecting portions 5A to 5C and the connecting portion 5E. Accordingly, the strength of the FPC board 5 is reinforced by the wiring pattern 11 having a large line width in the gauge connection portions 5A to 5D, and the conductor pattern 11 having a small line width is employed in the connection portions 5E and 5F, thereby creeping. The influence on the characteristics can be avoided.
このように本実施の形態に係るＦＰＣ基板５によれば、絶縁基板９の上面のうち配線パターン１１が形成されていない領域にベタパターン１２を形成するという手法によって、ＦＰＣ基板５の強度を補強することができる。従って、強度の補強のために絶縁基板９や配線パターン１１の厚みを増す必要がないため、コストの上昇を回避することができる。 As described above, according to the FPC board 5 according to the present embodiment, the strength of the FPC board 5 is reinforced by the method of forming the solid pattern 12 in the region where the wiring pattern 11 is not formed on the upper surface of the insulating board 9. can do. Therefore, it is not necessary to increase the thickness of the insulating substrate 9 and the wiring pattern 11 for reinforcing the strength, so that an increase in cost can be avoided.
１ ロードセル
２ 起歪体
４，４Ａ〜４Ｄ 歪み検出素子
５ ＦＰＣ基板
５Ａ〜５Ｄ ゲージ接続部分
５Ｅ，５Ｆ 連結部分
１１ 配線パターン
１２ ベタパターン
DESCRIPTION OF SYMBOLS 1 Load cell 2 Strain body 4, 4A-4D Strain detection element 5 FPC board 5A-5D Gauge connection part 5E, 5F Connection part 11 Wiring pattern 12 Solid pattern
Claims (4)
絶縁基板と、
前記絶縁基板上に形成され、前記複数の歪み検出素子同士を接続するための配線用導体パターンと、
前記絶縁基板上で前記配線用導体パターンが形成されていない領域に形成された、ベタ膜状の補強用パターンと
を備える、ＦＰＣ基板。 An FPC (Flexible Printed Circuits) substrate for connecting a plurality of strain detection elements provided on the surface of a strain generating body of a strain gauge type load cell,
An insulating substrate;
A conductor pattern for wiring formed on the insulating substrate for connecting the plurality of strain detection elements; and
An FPC board comprising: a solid film-like reinforcing pattern formed in a region where the wiring conductor pattern is not formed on the insulating substrate.
前記起歪体の荷重変形に対応して高い可撓性が要求される第１領域と、
前記第１領域以外の第２領域と
を有し、
前記補強用パターンは、前記第２領域内のみに形成されている、請求項１に記載のＦＰＣ基板。 The FPC board is
A first region where high flexibility is required in response to load deformation of the strain body;
A second region other than the first region,
The FPC board according to claim 1, wherein the reinforcing pattern is formed only in the second region.
The FPC board according to claim 3, wherein a line width of the wiring conductor pattern in the first region is narrower than a line width of the wiring conductor pattern in the second region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006298682A JP2008117884A (en) | 2006-11-02 | 2006-11-02 | Fpc substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006298682A JP2008117884A (en) | 2006-11-02 | 2006-11-02 | Fpc substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2008117884A true JP2008117884A (en) | 2008-05-22 |
Family
ID=39503599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006298682A Pending JP2008117884A (en) | 2006-11-02 | 2006-11-02 | Fpc substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008117884A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102088818A (en) * | 2009-12-08 | 2011-06-08 | 乐金显示有限公司 | Flexible printed circuit board, backlight unit using the same, and liquid crystal display device comprising the same |
| JP2012225685A (en) * | 2011-04-15 | 2012-11-15 | A & D Co Ltd | Fpc substrate for strain gauge |
| CN112880885A (en) * | 2021-01-11 | 2021-06-01 | 大连理工大学 | Full-flexible bidirectional tension sensor based on Wheatstone bridge principle |
| US11576254B2 (en) | 2020-12-01 | 2023-02-07 | Samsung Electro-Mechanics Co., Ltd. | Cable substrate |
| US11610734B2 (en) | 2018-08-29 | 2023-03-21 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |
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| JPS62242829A (en) * | 1986-04-15 | 1987-10-23 | Ee & D:Kk | Load cell with dampproofing structure |
| JPH0685409A (en) * | 1992-09-01 | 1994-03-25 | Nitto Denko Corp | Flexible board |
| JP2004071562A (en) * | 2002-08-01 | 2004-03-04 | Yazaki Corp | Flexible conductive element |
| JP2005191351A (en) * | 2003-12-26 | 2005-07-14 | Casio Comput Co Ltd | Flexible wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS62242829A (en) * | 1986-04-15 | 1987-10-23 | Ee & D:Kk | Load cell with dampproofing structure |
| JPH0685409A (en) * | 1992-09-01 | 1994-03-25 | Nitto Denko Corp | Flexible board |
| JP2004071562A (en) * | 2002-08-01 | 2004-03-04 | Yazaki Corp | Flexible conductive element |
| JP2005191351A (en) * | 2003-12-26 | 2005-07-14 | Casio Comput Co Ltd | Flexible wiring board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102088818A (en) * | 2009-12-08 | 2011-06-08 | 乐金显示有限公司 | Flexible printed circuit board, backlight unit using the same, and liquid crystal display device comprising the same |
| US8884935B2 (en) | 2009-12-08 | 2014-11-11 | Lg Display Co., Ltd. | Flexible printed circuit board, backlight unit using the same, and liquid crystal display device comprising the same |
| JP2012225685A (en) * | 2011-04-15 | 2012-11-15 | A & D Co Ltd | Fpc substrate for strain gauge |
| US11610734B2 (en) | 2018-08-29 | 2023-03-21 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |
| US11576254B2 (en) | 2020-12-01 | 2023-02-07 | Samsung Electro-Mechanics Co., Ltd. | Cable substrate |
| CN112880885A (en) * | 2021-01-11 | 2021-06-01 | 大连理工大学 | Full-flexible bidirectional tension sensor based on Wheatstone bridge principle |
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