JP2008098560A - Connection method of lead wire to substrate, connection structure of lead wire and substrate, and illumination apparatus - Google Patents

Connection method of lead wire to substrate, connection structure of lead wire and substrate, and illumination apparatus Download PDF

Info

Publication number
JP2008098560A
JP2008098560A JP2006281308A JP2006281308A JP2008098560A JP 2008098560 A JP2008098560 A JP 2008098560A JP 2006281308 A JP2006281308 A JP 2006281308A JP 2006281308 A JP2006281308 A JP 2006281308A JP 2008098560 A JP2008098560 A JP 2008098560A
Authority
JP
Japan
Prior art keywords
lead wire
substrate
land
end surface
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006281308A
Other languages
Japanese (ja)
Inventor
Toshio Hiratsuka
利男 平塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MIRAI KK
Original Assignee
MIRAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MIRAI KK filed Critical MIRAI KK
Priority to JP2006281308A priority Critical patent/JP2008098560A/en
Publication of JP2008098560A publication Critical patent/JP2008098560A/en
Pending legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection method of a lead wire to a substrate, a connection structure of a lead wire and a substrate, and an illumination apparatus capable of connecting the lead wire and the substrate without the use of other components with high electric reliability, and ensure inexpensive assembling automation. <P>SOLUTION: The connection method of a lead wire 35 to a substrate solders and fixes the lead wire 35 with a core wire 31 the circumference of which is covered with an outer skin 33 to a land 39 on the substrate 37. The method comprises: a step of forming a core wire exposed part from which an outer skin 33 is cut on the tip of the lead wire 35 into a predetermined length L; a step of making the end surface 33a of the outer skin 33 of the lead wire 35 abut on the end surface 37a of the substrate 37 where the land 39 is formed extending from the end surface 37a to the predetermined length L; and a step of soldering the core wire 31 of the lead wire 35 to the land 39 of the substrate 37. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、リード線の基板接続方法及びリード線と基板の接続構造並びに照明装置に関する。   The present invention relates to a lead wire substrate connection method, a lead wire-substrate connection structure, and an illumination device.

従来、印刷基板とリード線との電気的な接続は、図９、図１０に示すように、基板１上に形成されたランド３に、外被５を切除して露出させた芯線７を、半田９によって接合することが一般的に行われている。この場合、基板１上にリード線１１の先端部分が載ることとなるため、外皮５から導出された芯線７は、下部外被５の厚み分、屈曲部１３で下方へクランク状に曲げられてランド３と平行に配置される。   Conventionally, as shown in FIG. 9 and FIG. 10, the electrical connection between the printed circuit board and the lead wire is performed by connecting the core wire 7 that is exposed by cutting out the outer cover 5 to the land 3 formed on the substrate 1. Joining by solder 9 is generally performed. In this case, since the tip end portion of the lead wire 11 is placed on the substrate 1, the core wire 7 led out from the outer skin 5 is bent downward in a crank shape by the bent portion 13 by the thickness of the lower outer sheath 5. Arranged in parallel with the land 3.

近年、電送部品組立の自動化が益々進む傾向にあり、上記のような印刷基板とリード線との半田接続も自動化により行われることが多くなってきた。ところが、図例の接続構造では、平坦な基板１上に形成したランド３に、芯線７を高精度に配置しなければならないため、撮像手段、画像処理装置を備えた位置決め装置が必要となり、設備コストが増大し、自動化が困難となる。   In recent years, there has been a tendency for automation of assembling of electric parts to be increasingly advanced, and solder connection between a printed board and a lead wire as described above is often performed by automation. However, in the connection structure shown in the figure, since the core wire 7 must be arranged with high accuracy on the land 3 formed on the flat substrate 1, a positioning device including an imaging means and an image processing device is required. Cost increases and automation becomes difficult.

また、基板１にリード線１１を接続するには、スルーホールにリード線１１を差し込み、基板１の裏側で半田付け処理する等の方法が採られることもあった。しかしリード線１１の取りだしが上方に湾曲することとなり、リード線１１が無駄に多く消費されたり、基板１上でリード線１１が邪魔になった。これに対し、図９に示すように、基板１の端部でリード線１１を接続すると、リード線の消費は少なくなるが、リード線１１が動き易くなるため、絶縁強度や接続強度が余分に必要とされる不利が生じる。これらの不利は専用のコネクタを用いれば解決できるが、リード線１１に印加される電圧が高い場合には、絶縁強度を維持するために、大型のコネクタを用いることとなり、他の電子部品等に干渉したり、設置スペースの限られた場合に、コネクタを基板１に実装できないことがあり、その結果、設計自由度を低下させた。   Further, in order to connect the lead wire 11 to the substrate 1, a method of inserting the lead wire 11 into the through hole and soldering on the back side of the substrate 1 may be employed. However, the lead wire 11 is bent upward, and the lead wire 11 is consumed unnecessarily, or the lead wire 11 becomes an obstacle on the substrate 1. On the other hand, as shown in FIG. 9, when the lead wire 11 is connected at the end portion of the substrate 1, the lead wire consumption is reduced, but the lead wire 11 is easy to move, so that the insulation strength and the connection strength are extra. The necessary disadvantage arises. These disadvantages can be solved by using a dedicated connector. However, when the voltage applied to the lead wire 11 is high, a large connector is used to maintain the insulation strength, and other electronic components are used. When there is interference or the installation space is limited, the connector may not be mounted on the board 1, and as a result, the degree of freedom in design is reduced.

このような問題の解消を狙ったものに例えば特許文献１に開示されるプリント配線基板へのリード線半田付け方法が提案されている。この方法では、図１１に示すように、リード線挿入部１５を備えるとともに一端が窄んだ可撓性を有する接続金具１７を用いて、リード線１１の先端近傍１１ａを、プリント配線基板１に設けた貫通孔１９の周縁に形成したランド２１へ固定してから、リード線１１とランド２１とを半田付けする。すなわち、リード線１１の先端１１ａを接続金具１７のリード線挿入部１５へ挿入した後、接続金具１７を貫通孔１９に圧入してリード線挿入部１５の幅を貫通孔１９によって狭めるとともにリード線挿入部１５に挿入されたリード線１１の先端近傍をランド２１へ固定し、その後リード線１１の先端近傍とランド２１とを半田付けしていた。   In order to solve such problems, for example, a lead wire soldering method to a printed wiring board disclosed in Patent Document 1 has been proposed. In this method, as shown in FIG. 11, the vicinity of the tip 11 a of the lead wire 11 is attached to the printed wiring board 1 by using a flexible metal fitting 17 having a lead wire insertion portion 15 and having one end narrowed. After fixing to the land 21 formed in the periphery of the provided through-hole 19, the lead wire 11 and the land 21 are soldered. That is, after the leading end 11a of the lead wire 11 is inserted into the lead wire insertion portion 15 of the connection fitting 17, the connection fitting 17 is press-fitted into the through hole 19 so that the width of the lead wire insertion portion 15 is narrowed by the through hole 19 and the lead wire. The vicinity of the distal end of the lead wire 11 inserted into the insertion portion 15 is fixed to the land 21, and then the vicinity of the distal end of the lead wire 11 and the land 21 are soldered.

特開平６−１４０７５１号公報JP-A-6-140751

しかしながら、図１１に示した従来のプリント配線基板へのリード線半田付け方法は、確実な接続は行えるものの、自動アセンブリーラインでの自動挿入工程において接続金具が必要となるため、部品コストが増大するとともに、接続金具の把持手段を備えた専用の自動機器が必要となり、設備コストが増大する不利があった。また、リード線を基板上に配置しなければならないのに加え、接続金具の上部が基板上から突出するため、リード線と基板の接続構造を薄厚にすることができない。一方、接続構造の観点から見れば、図９に示すリード線と基板の接続構造は、接続金具を使用しない分、薄厚な接続が可能となる。ところが、この場合においても、外皮が基板上に配置されるため、その分、リード線接続部の基板上高さが大きくなるとともに、下部の外皮の分、芯線を屈曲させなければならないため、屈曲部の下側では半田が流入し難く、凹状や中空状のボイド２３（図１０参照）の生じ易い問題があった。そして、芯線とランドとの半田接続部にボイドがあると、リード線のばたつき度合いが大きくなる。このため、可動範囲が広くなり、リード線の動きに伴ってボイド付近の半田付け部分に大きな応力を発生させる。このような繰り返し応力が負荷されると、応力集中が起こり、疲労により半田接合部にクラックが発生する可能性が高くなる。また、加熱を繰り返し行う場合にも、熱履歴によりボイドが増大する傾向があり、これにより半田剥離、断線などの欠陥を発生させる不利がある。このような不利は、結果的にリード線と基板の接続構造における電気的性能の安定性を低減させた。   However, although the lead wire soldering method to the conventional printed wiring board shown in FIG. 11 can be reliably connected, a connection fitting is required in the automatic insertion process in the automatic assembly line, which increases the component cost. At the same time, a dedicated automatic device having a gripping means for the connection fitting is required, which disadvantageously increases the equipment cost. In addition to the fact that the lead wire must be arranged on the substrate, the upper part of the connection fitting protrudes from the substrate, so that the connection structure between the lead wire and the substrate cannot be made thin. On the other hand, from the viewpoint of the connection structure, the lead wire and substrate connection structure shown in FIG. 9 enables a thin connection because no connection fitting is used. However, even in this case, since the outer skin is arranged on the substrate, the height of the lead wire connection portion on the substrate is increased accordingly, and the core wire must be bent by the lower outer skin, There is a problem that the solder is difficult to flow under the part, and a concave or hollow void 23 (see FIG. 10) is likely to occur. If there is a void in the solder connection portion between the core wire and the land, the degree of fluttering of the lead wire increases. For this reason, the movable range is widened, and a large stress is generated in the soldered portion near the void as the lead wire moves. When such repeated stress is applied, stress concentration occurs, and there is a high possibility that cracks will occur in the solder joint due to fatigue. In addition, when heating is repeated, voids tend to increase due to the thermal history, which has the disadvantage of causing defects such as solder peeling and disconnection. Such disadvantages resulted in a reduction in the stability of electrical performance in the lead wire-substrate connection structure.

本発明は上記状況に鑑みてなされたもので、その第１の目的は、他部品を用いずに、リード線と基板とを高い電気的信頼性の下で接続することができるリード線の基板接続方法及びリード線と基板の接続構造並びに照明装置を提供し、もって、低コストでの自動化の実現を図ることを目的とする。また、その第２の目的は、半田付け部分において芯線が屈曲しないリード線の基板接続方法及びリード線と基板の接続構造並びに照明装置を提供し、もって、電気的性能の安定化を図ることを目的とする。   The present invention has been made in view of the above situation, and a first object thereof is a lead wire substrate capable of connecting a lead wire and a substrate with high electrical reliability without using other components. It is an object of the present invention to provide a connection method, a connection structure between a lead wire and a substrate, and an illumination device, and to achieve automation at a low cost. A second object of the present invention is to provide a lead wire substrate connecting method, a lead wire and substrate connecting structure and a lighting device in which the core wire is not bent in the soldered portion, and to stabilize electrical performance. Objective.

本発明に係る上記目的は、下記構成により達成される。
（１） 芯線の周囲が外皮で覆われたリード線を基板上のランドに半田付けして固定するリード線の基板接続方法であって、
前記リード線の先端部に前記外皮を切除した芯線露出部を所定の長さに形成するステップと、
端面から前記所定の長さまでの間にランドが形成された前記基板の端面に、前記リード線の前記外皮の端面を当接させるステップと、
前記リード線の芯線を前記基板のランドに半田付けするステップと、
を有することを特徴とするリード線の基板接続方法。 The above object of the present invention is achieved by the following configuration.
(1) A method for connecting a lead wire to a substrate, wherein a lead wire whose core wire is covered with a shell is soldered and fixed to a land on the substrate,
Forming a core wire exposed portion with a predetermined length by cutting off the outer skin at the tip of the lead wire; and
Contacting the end surface of the outer skin of the lead wire with the end surface of the substrate on which lands are formed between the end surface and the predetermined length;
Soldering the core wire of the lead wire to the land of the substrate;
A method for connecting a lead wire to a substrate.

このリード線の基板接続方法によれば、外皮の端面が、基板の端面に当接することで、ランドに対する芯線露出部の半田付け位置が正確に位置決めされ、接続場所のバラツキが低減される。また、自動機械により半田付け作業を自動化する場合にも、基板の端面と外皮の端面とが突き合わせて位置決めされることで、撮像手段や位置出し装置等を用いることなく、位置合わせが簡単且つ確実に行えるようになる。   According to this substrate connecting method for lead wires, the end surface of the outer skin abuts on the end surface of the substrate, whereby the soldering position of the core wire exposed portion with respect to the land is accurately positioned, and the variation in the connection location is reduced. In addition, when the soldering operation is automated by an automatic machine, the end face of the substrate and the end face of the outer skin are abutted and positioned so that the positioning is simple and reliable without using an imaging means or a positioning device. Will be able to do.

（２） 前記基板の一部で形成され、表面にランドが設けられた突片に対し、前記リード線を請求項１記載のリード線の基板接続方法に基づいて前記ランドに半田付けし、
前記突片及び前記リード線を内包するように熱収縮性部材で覆い、
前記熱収縮部材を加熱して前記突片と前記リード線とを固着することを特徴とする（１）項記載のリード線の基板接続方法。 (2) The lead wire is soldered to the land based on the substrate connecting method of the lead wire according to claim 1, wherein the lead wire is formed on a part of the substrate and has a land on the surface.
Cover with a heat-shrinkable member so as to enclose the protruding piece and the lead wire,
The lead wire board connecting method according to (1), wherein the heat shrinkable member is heated to fix the projecting piece and the lead wire together.

このリード線の基板接続方法によれば、芯線をランドに半田接続したリード線が、突片と共に熱収縮性部材によって覆われ、その状態で熱収縮性部材が加熱されることで、収縮した熱収縮性部材によって、芯線とランドとの半田接合部、及びリード線が固着され、基板とリード線とが簡単な加熱処理によって、短時間で且つ連続して固着される。   According to this substrate connection method for lead wires, the lead wire in which the core wire is solder-connected to the land is covered with the heat shrinkable member together with the projecting piece, and the heat shrinkable member is heated in this state, so that the contracted heat The solder joint between the core wire and the land and the lead wire are fixed by the shrinkable member, and the substrate and the lead wire are fixed in a short time and continuously by a simple heat treatment.

（３） 芯線の周囲が外皮で覆われたリード線を基板上のランドに半田付けして固定するリード線と基板の接続構造であって、
前記リード線の先端部に、前記外皮を切除した芯線露出部が所定の長さで形成され、
端面から前記所定の長さまでの間にランドが形成された前記基板の端面に、前記リード線の前記外皮の端面が当接され、
前記リード線の芯線が前記基板のランドに半田付けされた
ことを特徴とするリード線と基板の接続構造。 (3) A lead wire-substrate connection structure in which a lead wire whose core wire is covered with a skin is soldered to a land on the substrate and fixed.
At the tip of the lead wire, a core wire exposed portion obtained by excising the outer skin is formed with a predetermined length,
The end surface of the outer skin of the lead wire is in contact with the end surface of the substrate on which lands are formed between the end surface and the predetermined length,
The lead wire and substrate connection structure, wherein the lead wire core wire is soldered to the land of the substrate.

このリード線と基板の接続構造によれば、リード線の芯線が、ランドと平行に且つ接して配置され、半田付け部分において芯線が屈曲しなくなる。また、屈曲が生じないことにより、隙間が少なくなり、リード線自体のばたつきが小さくなるとともに、ボイドが発生し難くなり、特殊な環境下で使用する製品であっても、ボイドの存在に起因する故障が最低限に抑えられるようになる。   According to the connection structure of the lead wire and the substrate, the core wire of the lead wire is arranged in parallel with and in contact with the land, and the core wire is not bent at the soldered portion. In addition, since the bending does not occur, the gap is reduced, the lead wire itself is less fluttered, and voids are less likely to occur. Even products that are used in special environments are caused by the presence of voids. Failure will be minimized.

（４） 前記基板の一部で形成され、表面にランドが設けられた突片に対し、前記リード線が請求項３記載のリード線と基板の接続構造に基づいて前記ランドに半田付けされ、
前記突片及び前記リード線が内包されるように熱収縮性部材で覆われ、
加熱によって収縮された前記熱収縮部材によって前記突片と前記リード線とが固着されたことを特徴とする（３）項記載のリード線と基板の接続構造。 (4) The lead wire is soldered to the land based on the connection structure of the lead wire and the substrate according to claim 3 with respect to the projecting piece formed of a part of the substrate and provided with a land on the surface,
Covered with a heat-shrinkable member so that the protruding piece and the lead wire are contained,
The lead wire and board connecting structure according to (3), wherein the protruding piece and the lead wire are fixed by the heat shrinkable member shrunk by heating.

このリード線と基板の接続構造によれば、芯線をランドに半田接続したリード線が、突片と共に熱収縮性部材によって覆われ、その状態で熱収縮性部材が加熱されることで、収縮した熱収縮性部材によって、ランドと半田、及び突片とリード線が被覆される。これにより、ランドと半田の接合強度が高まる。そして、突片とリード線外皮とが熱収縮性部材によって包囲固定されることで、ランドと芯線の半田接合部に、リード線の引っ張りによる外力が作用し難くなり、電気的信頼性が高まる。   According to this lead wire-substrate connection structure, the lead wire in which the core wire is solder-connected to the land is covered with the heat shrinkable member together with the projecting piece, and the heat shrinkable member is heated in this state, and thus contracted. The land and solder, and the protrusion and the lead wire are covered with the heat-shrinkable member. This increases the bonding strength between the land and the solder. Then, since the projecting piece and the lead wire outer shell are surrounded and fixed by the heat-shrinkable member, an external force due to the lead wire pulling hardly acts on the solder joint portion between the land and the core wire, and the electrical reliability is increased.

（５） 前記基板のランド形成面に、前記突片の端面を含む該ランドの一部分を切り欠いた段部が前記外被の厚みに相当する深さで形成され、
該段部の段差端面に、前記リード線の前記外皮の端面が当接されたことを特徴とする（４）項記載のリード線と基板の接続構造。 (5) On the land forming surface of the substrate, a stepped portion in which a part of the land including the end surface of the protruding piece is cut out is formed at a depth corresponding to the thickness of the jacket.
The lead wire and substrate connection structure according to (4), wherein an end surface of the outer skin of the lead wire is in contact with a step end surface of the step portion.

このリード線と基板の接続構造によれば、リード線の芯線が、ランドと平行に且つ接して配置され、半田付け部分において芯線が屈曲しなくなる。さらに、突片上の段部に載置されたリード線の外皮が熱収縮性部材によって突片に直接包囲固定され、突片とリード線外皮の接合強度が大幅に高まる。これにより、ランドと芯線との接合部に、リード線の引っ張りによる外力が作用し難くなり、電気的信頼性が一層高まる。   According to the connection structure of the lead wire and the substrate, the core wire of the lead wire is arranged in parallel with and in contact with the land, and the core wire is not bent at the soldered portion. Further, the outer shell of the lead wire placed on the stepped portion on the projecting piece is directly surrounded and fixed to the projecting piece by the heat-shrinkable member, and the joint strength between the projecting piece and the lead wire outer coat is greatly increased. This makes it difficult for an external force due to the pulling of the lead wire to act on the joint between the land and the core wire, further increasing the electrical reliability.

（６） 前記リード線の先端部に、前記外皮を切除した芯線露出部が所定の長さで形成されるとともに、該外被の円周方向一部分が前記芯線の外周に接する平面と前記外皮の端面に平行な切欠端面とで切除され、
前記突片の端面に、前記リード線の前記外皮の該切欠端面が当接されたことを特徴とする（４）項記載のリード線と基板の接続構造。 (6) A core wire exposed portion obtained by cutting the outer skin is formed at a predetermined length at a tip portion of the lead wire, and a part of the outer circumferential direction of the outer sheath is in contact with the outer periphery of the core wire and the outer skin. It is excised with a notch end face parallel to the end face,
The lead wire and board connection structure according to (4), wherein the notch end surface of the outer skin of the lead wire is in contact with the end surface of the protruding piece.

このリード線と基板の接続構造によれば、リード線の芯線が、ランドと平行に且つ接して位置され、半田付け部分において芯線が屈曲しなくなる。さらに、芯線が半田付けされたランドの一部分に、下部外皮の切除されたリード線が平行に載置され、このリード線が外皮ごと熱収縮性部材によって突片に直接包囲固定され、基板とリード線の接合強度が大幅に高まる。これにより、ランドと芯線との接合部に、リード線の引っ張りによる外力が作用し難くなり、電気的信頼性が一層高まる。   According to the connection structure of the lead wire and the substrate, the core wire of the lead wire is positioned in parallel with and in contact with the land, and the core wire is not bent at the soldered portion. Further, the lead wire with the lower outer skin cut out is placed in parallel on a part of the land to which the core wire is soldered, and the lead wire and the outer skin are directly surrounded and fixed to the projecting piece by the heat-shrinkable member. The joint strength of the wire is greatly increased. This makes it difficult for an external force due to the pulling of the lead wire to act on the joint between the land and the core wire, further increasing the electrical reliability.

（７） （３）項〜（６）項のいずれか１項記載のリード線と基板の接続構造によって前記リード線と接続された前記基板を備える照明装置であって、
取付基部に反射部及び係合部の設けられた反射鏡部材と、
前記係合部に係合するロック爪を有する後板と、を具備し、
前記係合部と前記ロック爪とを係合した前記反射鏡部材と前記後板とによって前記基板が厚み方向で挟持されたことを特徴とする照明装置。 (7) A lighting device including the substrate connected to the lead wire by the lead wire-substrate connection structure according to any one of the items (3) to (6),
A reflecting mirror member provided with a reflecting portion and an engaging portion on the mounting base;
A rear plate having a locking claw that engages with the engaging portion,
An illuminating device, wherein the substrate is sandwiched in the thickness direction by the reflecting mirror member and the rear plate engaging the engaging portion and the lock claw.

この照明装置によれば、リード線の芯線が基板面と平行となり、基板上からのリード線の高さが低く抑えられ、反射鏡部材と後板との離間寸法が小さくなる。また、芯線が屈曲することなく基板から導出されるので、反射鏡部材と後板とで基板が挟持されても、芯線に屈曲部が存在する場合のように、挟持により屈曲部に応力が集中しなくなる。   According to this illuminating device, the core wire of the lead wire is parallel to the substrate surface, the height of the lead wire from above the substrate is kept low, and the distance between the reflecting mirror member and the rear plate is reduced. In addition, since the core wire is led out from the substrate without bending, even if the substrate is sandwiched between the reflector member and the rear plate, stress is concentrated on the bent portion due to the clamping as in the case where the core wire has a bent portion. No longer.

本発明に係るリード線の基板接続方法によれば、リード線の先端部に外皮を切除した芯線露出部を所定の長さに形成し、端面からこの所定の長さまでの間にランドが形成された基板の端面に、リード線の外皮の端面を当接させ、リード線の芯線を基板のランドに半田付けするので、半田付け位置が正確に位置決めされ、接続場所のバラツキを低減することができ、リード線と基板とを高い電気的信頼性の下で接続することができる。また、自動機械により半田付け作業を自動化する場合にも、基板の端面と外皮の端面とを突き合わせて位置決めすることができ、位置合わせが簡単且つ確実に行えるようになり、ランド及び導線を撮像手段で検出する等の位置決め方法に比べ、低コストでの自動化が可能となる。   According to the lead wire substrate connection method of the present invention, the core wire exposed portion obtained by cutting the outer skin is formed at a predetermined length at the leading end portion of the lead wire, and a land is formed between the end surface and the predetermined length. Since the end surface of the lead wire is brought into contact with the end surface of the printed circuit board and the lead wire core wire is soldered to the land of the circuit board, the soldering position can be accurately positioned and variations in the connection location can be reduced. The lead wire and the substrate can be connected with high electrical reliability. Also, when the soldering operation is automated by an automatic machine, the end face of the substrate and the end face of the outer skin can be abutted and positioned so that the positioning can be performed easily and reliably. Compared to the positioning method such as detecting by the method, it is possible to automate at a low cost.

本発明に係るリード線と基板の接続構造によれば、リード線の先端部に、外皮を切除した芯線露出部が所定の長さで形成され、端面からこの所定の長さまでの間にランドが形成された基板の端面に、リード線の外皮の端面が当接され、リード線の芯線が基板のランドに半田付けされたので、リード線の芯線が基板面と平行となり、半田付け部分において芯線が屈曲することがなく、半田付け強度が向上し、電気的性能の安定化を図ることができる。また、隙間が少なくなり、リード線自体のばたつきが小さくなるので、応力集中の発生を低減できる。さらに、ボイドが発生し難いので、特殊な環境下で使用する製品であっても、故障を最低限に抑えることができ、例えば、塩素、硫黄、酸等の腐食成分に晒される場合において、ボイドが存在することによる表面積の増大が無いことから、その影響を少なくすることができる。   According to the connecting structure of the lead wire and the substrate according to the present invention, the core wire exposed portion obtained by cutting the outer skin is formed at a predetermined length at the leading end portion of the lead wire, and the land is formed between the end surface and the predetermined length. Since the end surface of the lead wire is in contact with the end surface of the formed board and the core wire of the lead wire is soldered to the land of the substrate, the core wire of the lead wire is parallel to the substrate surface, and the core wire is at the soldered portion. Is not bent, the soldering strength is improved, and the electrical performance can be stabilized. Further, since the gap is reduced and the flapping of the lead wire itself is reduced, the occurrence of stress concentration can be reduced. In addition, since voids are unlikely to occur, even products that are used in special environments can minimize failure, for example, when exposed to corrosive components such as chlorine, sulfur, and acids. Since there is no increase in surface area due to the presence of, the influence can be reduced.

本発明に係る照明装置によれば、係合部とロック爪とを係合した反射鏡部材と後板とによって、（３）項〜（６）項のいずれか１項記載の接続構造による基板が厚み方向で挟持されたので、リード線の芯線が基板面と平行となり、基板上からのリード線の高さが低く抑えられ、反射鏡部材と後板との離間寸法を小さくできる。また、芯線が屈曲することなく基板から導出されるので、反射鏡部材と後板とで基板が挟持されても、芯線に屈曲部が存在する場合のように応力集中の発生することがない。この結果、リード線の接続が省スペースで行え、且つ電気的信頼性の高い照明装置を得ることができる。   According to the illuminating device of the present invention, the board having the connection structure according to any one of the items (3) to (6), by the reflecting mirror member and the rear plate that engage the engaging portion and the lock claw. Is sandwiched in the thickness direction, the core wire of the lead wire is parallel to the substrate surface, the height of the lead wire from the substrate is kept low, and the distance between the reflecting mirror member and the rear plate can be reduced. Further, since the core wire is led out from the substrate without being bent, even if the substrate is sandwiched between the reflecting mirror member and the rear plate, stress concentration does not occur as in the case where a bent portion exists in the core wire. As a result, a lead wire can be connected in a space-saving manner, and an illumination device with high electrical reliability can be obtained.

以下、本発明に係るリード線の基板接続方法及びリード線と基板の接続構造並びに照明装置の好適な実施の形態を図面を参照して説明する。
図１は本発明に係るリード線と基板の接続構造を表す要部断面図である。
本実施の形態によるリード線と基板の接続構造は、芯線３１の周囲が外皮３３で覆われたリード線３５を、基板３７上のランド３９に半田４１によって接合して固定する場合に好適に用いられる。 Preferred embodiments of a lead wire substrate connecting method, a lead wire and substrate connecting structure, and a lighting device according to the present invention will be described below with reference to the drawings.
FIG. 1 is a cross-sectional view of an essential part showing a connection structure between a lead wire and a substrate according to the present invention.
The connection structure between the lead wire and the substrate according to the present embodiment is suitably used when the lead wire 35 whose core wire 31 is covered with the outer skin 33 is joined and fixed to the land 39 on the substrate 37 with the solder 41. It is done.

すなわち、リード線３５の先端部には、外皮３３を切除した芯線露出部４３が所定の長さＬで形成されている。端面３７ａから少なくとも所定の長さＬまでの間にランド３９が形成された基板３７の端面３７ａには、リード線３５の外皮３３の端面３３ａが当接されている。つまり、外皮３３は、芯線３１より下部の厚み分の高さｈだけが端面３７ａに当接している。芯線３１は、このように、外皮の端面３３ａが、基板３７の端面３７ａに当接した状態で、ランド３９に半田４１によって接合（ろう付け）されている。   That is, a core wire exposed portion 43 obtained by cutting the outer skin 33 is formed with a predetermined length L at the distal end portion of the lead wire 35. The end surface 33a of the outer cover 33 of the lead wire 35 is in contact with the end surface 37a of the substrate 37 on which the land 39 is formed between the end surface 37a and at least the predetermined length L. That is, the outer skin 33 is in contact with the end surface 37 a only by a height h corresponding to the thickness below the core wire 31. As described above, the core wire 31 is joined (brazed) to the land 39 by the solder 41 in a state where the end surface 33 a of the outer skin is in contact with the end surface 37 a of the substrate 37.

このリード線３５と基板３７の接続構造では、リード線３５の芯線３１が、ランド３９と平行に且つ接して配置され、半田付け部分において芯線３１が屈曲しなくなる。屈曲が生じないことにより、隙間が少なくなり、リード線３５自体のばたつきが小さくなるとともに、ボイド２３（図１０参照）が発生し難くなり、特殊な環境下で使用する製品であっても、ボイドの存在に起因する故障が最低限に抑えられるようになっている。   In the connection structure of the lead wire 35 and the substrate 37, the core wire 31 of the lead wire 35 is disposed in parallel with and in contact with the land 39, and the core wire 31 is not bent at the soldered portion. Since the bending does not occur, the gap is reduced, the fluttering of the lead wire 35 itself is reduced, and the void 23 (see FIG. 10) is less likely to occur. Even if the product is used in a special environment, the void Failures due to the presence of the can be minimized.

また、基板３７上には、芯線３１の直径長φＡと、外皮３３の厚み長ｈの合計高さでリード線３５が突出することとなる。つまり、リード線３５と基板３７の接続構造における総厚Ｈは、直径長φＡと、外皮３３の厚み長ｈと、基板３７の厚みＴとの総和となり、図１０に示したように、リード線３５の外皮３３を基板３７上に載置する構造より薄厚となる。   On the substrate 37, the lead wire 35 protrudes with a total height of the diameter length φA of the core wire 31 and the thickness length h of the outer skin 33. That is, the total thickness H in the connection structure between the lead wire 35 and the substrate 37 is the sum of the diameter length φA, the thickness length h of the outer skin 33, and the thickness T of the substrate 37. As shown in FIG. It is thinner than the structure in which the outer skin 33 of 35 is placed on the substrate 37.

図２は図１の断面方向をＢ−Ｂ矢視で示したリード線接続前の一例としての平面図である。
図２においては、上記のリード線３５と基板３７の接続部が、基板３７の一部で形成され表面にランド３９が設けられた突片４５に対して採用された様子を示している。この場合、突片４５及びリード線３５は、内包されるように熱収縮性部材（熱収縮性を有する軟質ポリ塩化ビニル系樹脂チューブ等）４７で覆われ、加熱によって収縮された熱収縮性部材４７によって包囲が固定される。突片４５は、例えば基板３７の直交する２辺部４９ａ，４９ｂに挟まれた隅部に、一方の辺部４９ａと平行なスリット５１を切り込むことで形成できる。 FIG. 2 is a plan view as an example before connecting lead wires, showing the cross-sectional direction of FIG.
FIG. 2 shows a state in which the connecting portion between the lead wire 35 and the substrate 37 is adopted for the projecting piece 45 formed by a part of the substrate 37 and provided with a land 39 on the surface. In this case, the projecting piece 45 and the lead wire 35 are covered with a heat-shrinkable member (such as a soft polyvinyl chloride resin tube having heat-shrinkability) 47 so as to be contained, and the heat-shrinkable member shrunk by heating. The enclosure is fixed by 47. The projecting piece 45 can be formed, for example, by cutting a slit 51 parallel to one side 49a in a corner between two orthogonal sides 49a, 49b of the substrate 37.

熱収縮性部材４７は、熱収縮性を有する軟質ポリ塩化ビニル系樹脂チューブとした例について述べたが、これに限ることはなく、例えば、ポリエチレンフィルムやポリプロピレンフィルム，ポリスチレンフィルム，ポリエステルフィルムなどとしてもよい。   The heat-shrinkable member 47 has been described as an example of a heat-shrinkable soft polyvinyl chloride resin tube. However, the heat-shrinkable member 47 is not limited to this. For example, a polyethylene film, a polypropylene film, a polystyrene film, a polyester film, etc. Good.

このように、芯線３１をランド３９に半田接続したリード線３５が、突片４５と共に熱収縮性部材４７によって覆われ、その状態で熱収縮性部材４７が加熱されることで、収縮した熱収縮性部材４７によって、ランド３９と半田４１、及び突片４５とリード線３５が被覆される。これにより、ランド３９と半田４１の接合強度が高まる。そして、突片４５とリード線外皮３３とが熱収縮性部材４７によって包囲固定されることで、ランド３９と芯線３１の半田接合部に、リード線３５の引っ張りによる外力が作用し難くなり、電気的信頼性が高まるようになっている。   Thus, the lead wire 35 in which the core wire 31 is solder-connected to the land 39 is covered with the heat shrinkable member 47 together with the protruding piece 45, and the heat shrinkable member 47 is heated in this state, thereby shrinking the heat shrinkage. The land 39 and the solder 41, and the projecting piece 45 and the lead wire 35 are covered with the conductive member 47. As a result, the bonding strength between the land 39 and the solder 41 is increased. Then, the projecting piece 45 and the lead wire outer skin 33 are surrounded and fixed by the heat-shrinkable member 47, so that an external force due to the pulling of the lead wire 35 hardly acts on the solder joint between the land 39 and the core wire 31. Reliability is increasing.

次に、上記の接続構造におけるリード線３５と基板３７との接続手順について説明する。
図３は図１に示した構造におけるリード線と基板との接続方法の手順を（ａ）〜（ｅ）で表した説明図である。
リード線の基板接続方法には、例えば図示しない電線加工機が用いられる。電線加工機は、長尺のリード線３５を引出しながら測長して所定の長さに切断する。所定の長さに切断されたリード線３５は、電線クリップにより挟持され、端末が整えられる。つまり、電線クリップによるクリップ位置が、所定の基準位置（把持位置）となり、電線端末の外皮除去（皮剥き）が行われる。 Next, a connection procedure between the lead wire 35 and the substrate 37 in the above connection structure will be described.
FIG. 3 is an explanatory view showing the procedure of the method of connecting the lead wire and the substrate in the structure shown in FIG. 1 by (a) to (e).
For example, an unillustrated electric wire processing machine is used as the lead wire board connecting method. The electric wire processing machine measures the length while drawing out the long lead wire 35 and cuts it to a predetermined length. The lead wire 35 cut to a predetermined length is sandwiched between electric wire clips, and the terminal is arranged. That is, the clip position by the electric wire clip becomes a predetermined reference position (gripping position), and the outer sheath removal (peeling) of the electric wire terminal is performed.

皮剥きは、上刃及び下刃にて、リード線３５の先端から所定の長さＬの位置に切り込み、上刃及び下刃をリード線３５から離反方向へ移動させることで、リード線３５の外皮３３を除去する。リード線３５は、これにより、所定の長さＬの芯線３１が表出される。   Peeling is performed by cutting the lead wire 35 with a predetermined length L from the tip of the lead wire 35 with the upper blade and the lower blade, and moving the upper blade and the lower blade away from the lead wire 35. The outer skin 33 is removed. Thereby, the lead wire 35 exposes the core wire 31 having a predetermined length L.

所定の長さＬで外皮除去が行われたリード線３５は、図示しない移動台に保持される。移動台は、架台上に設けられたリニアガイドを介して往復動自在に支持されている。移動台に保持されたリード線３５の先端には熱収縮性部材４７が外挿される。移動台は、図３（ａ）に示すように、保持したリード線３５を基板３７の端面３７ａに接近する方向へ移動させる。   The lead wire 35 from which the outer skin has been removed with a predetermined length L is held on a movable table (not shown). The moving table is supported so as to reciprocate through a linear guide provided on the gantry. A heat-shrinkable member 47 is extrapolated at the tip of the lead wire 35 held on the moving table. As shown in FIG. 3A, the moving table moves the held lead wire 35 in a direction approaching the end surface 37 a of the substrate 37.

図３（ｂ）に示すように、リード線３５の外皮端面３３ａが、基板３７の端面３７ａに当接すると、移動台は反力を受ける。移動台は、その反力を圧力センサによって検出することで、基板３７への接近動が停止される。この状態で、リード線３５の芯線３１は、ランド３９上の正規位置に配置されることとなる。   As shown in FIG. 3B, when the outer end surface 33 a of the lead wire 35 comes into contact with the end surface 37 a of the substrate 37, the moving table receives a reaction force. The moving table detects the reaction force by the pressure sensor, and the approaching movement to the substrate 37 is stopped. In this state, the core wire 31 of the lead wire 35 is disposed at a regular position on the land 39.

移動台は、電線切断手段を有し、芯線３１がランド３９上の正規位置に配置されたことの検出信号によって、リード線３５の他端側をカッタによって切断する。電線加工機は、これらの皮剥き、芯線３１の位置決め、リード線３５の切断の処理動作を繰り返す。なお、他端側の切断は、予め切断されたリード線を用いる場合には不要である。   The moving table has electric wire cutting means, and cuts the other end side of the lead wire 35 with a cutter in accordance with a detection signal indicating that the core wire 31 is disposed at the normal position on the land 39. The electric wire processing machine repeats these stripping, core wire 31 positioning, and lead wire 35 cutting operations. Note that cutting at the other end is not necessary when a lead wire cut in advance is used.

芯線３１が載置されたランド３９上には、図３（ｃ）に示すように、例えばクリーム半田４１等が半田ディスペンサー等によって供給塗布される。塗布された半田４１は、局所的な加熱手段（高周波加熱手段等）によって加熱され、芯線３１をランド３９に半田付け（ろう付け）する。   On the land 39 on which the core wire 31 is placed, as shown in FIG. 3C, for example, cream solder 41 or the like is supplied and applied by a solder dispenser or the like. The applied solder 41 is heated by local heating means (high frequency heating means or the like), and the core wire 31 is soldered (brazed) to the land 39.

次いで、図３（ｄ）に示すように、リード線３５に外挿しておいた熱収縮性部材４７を、半田４１による芯線３１とランド３９との接続部に移動する。すなわち、突片４５及びリード線３５を内包するように熱収縮性部材４７で覆う。その後、図３（ｅ）に示すように、温風供給手段等によって高温空気等を吹き付けることで、熱収縮性部材４７を加熱して突片４５とリード線３５とを固着する。   Next, as shown in FIG. 3D, the heat-shrinkable member 47 that has been extrapolated to the lead wire 35 is moved to the connecting portion between the core wire 31 and the land 39 by the solder 41. That is, the heat shrinkable member 47 is covered so as to enclose the protruding piece 45 and the lead wire 35. Thereafter, as shown in FIG. 3 (e), high-temperature air or the like is blown by hot air supply means or the like to heat the heat-shrinkable member 47 and fix the projecting piece 45 and the lead wire 35.

このように、本実施の形態によるリード線の基板接続方法では、外皮の端面３３ａが、基板３７の端面３７ａに当接することで、ランド３９に対する芯線露出部の半田付け位置が正確に位置決めされ、接続場所のバラツキが低減される。また、自動機械により半田付け作業を自動化する場合にも、基板３７の端面３７ａと外皮の端面３３ａとが突き合わせて位置決めされることで、撮像手段や位置出し装置等を用いることなく、位置合わせが簡単且つ確実に行えるようになる。   Thus, in the lead wire board connecting method according to the present embodiment, the end surface 33a of the outer skin abuts on the end surface 37a of the board 37, so that the soldering position of the core wire exposed portion with respect to the land 39 is accurately positioned, Variations in connection location are reduced. Further, when the soldering operation is automated by an automatic machine, the end surface 37a of the substrate 37 and the end surface 33a of the outer skin 33 are abutted and positioned so that the alignment can be performed without using an imaging means or a positioning device. It becomes easy and reliable.

また、芯線３１をランド３９に半田接続したリード線３５が、突片４５と共に熱収縮性部材４７によって覆われ、その状態で熱収縮性部材４７が加熱されることで、収縮した熱収縮性部材４７によって、芯線３１とランド３９との半田接合部、及びリード線３５が固着され、基板３７とリード線３５とが簡単な加熱処理によって短時間で且つ熱収縮性部材４７を介して連続した状態に固着される。   Further, the lead wire 35 in which the core wire 31 is solder-connected to the land 39 is covered with the heat shrinkable member 47 together with the projecting piece 45, and the heat shrinkable member 47 is heated in this state, so that the heat shrinkable member shrunk. 47, the solder joint between the core wire 31 and the land 39, and the lead wire 35 are fixed, and the substrate 37 and the lead wire 35 are continuous through the heat-shrinkable member 47 in a short time by a simple heat treatment. It is fixed to.

次に、上記のリード線と基板の接続方法により接続した一例を以下に示す。
図４は本発明を適用した照明ユニットの構成図、図５は図４における照明ユニットの側面視を（ａ）、下面視を（ｂ）で表した説明図、図６は図４における照明ユニットの分解斜視図である。
上記のリード線３５と基板３７の接続構造は、基板３７が一対の部材によって挟持されて構成される照明装置１００等に好適に採用される。この場合の照明装置１００は、照明ユニット５５と、駆動部５７と、照明ユニット５５と駆動部５７とを電気的に接続するリード線３５とを有して構成されている。 Next, an example of connection using the above-described lead wire and substrate connection method is shown below.
4 is a configuration diagram of a lighting unit to which the present invention is applied, FIG. 5 is an explanatory diagram showing a side view of the lighting unit in FIG. 4 as (a), a bottom view is shown in (b), and FIG. 6 is a lighting unit in FIG. FIG.
The connection structure between the lead wire 35 and the substrate 37 is preferably employed in the lighting device 100 configured by the substrate 37 being sandwiched between a pair of members. The illumination device 100 in this case includes an illumination unit 55, a drive unit 57, and lead wires 35 that electrically connect the illumination unit 55 and the drive unit 57.

駆動部５７は、照明ユニット５５に発光駆動電力を供給するものであり、例えばフルレンジトランス等を用いることができる。駆動部５７は商用電源に接続し、商用電源からの例えばＡＣ１１０Ｖ〜２２０Ｖ、５０Ｈｚ〜６０Ｈｚ等の電力を照明ユニット５５に供給し、定電流駆動を行う。   The drive unit 57 supplies light emission drive power to the illumination unit 55, and for example, a full range transformer or the like can be used. The drive unit 57 is connected to a commercial power source, and supplies power such as AC 110 V to 220 V, 50 Hz to 60 Hz, etc. from the commercial power source to the lighting unit 55 to perform constant current driving.

照明ユニット５５は、後板５９と、多数個の発光ダイオード（ＬＥＤ）６１を基台である配線基板３７上に直線的に配設した発光部６３と、反射鏡部材６５とを有して構成されている。後板５９は、反射鏡部材６５との間に配線基板３７を挟み込んで反射鏡部材６５に着脱自在に組み付けられる。   The illumination unit 55 includes a rear plate 59, a light emitting unit 63 in which a large number of light emitting diodes (LEDs) 61 are linearly arranged on a wiring board 37 as a base, and a reflecting mirror member 65. Has been. The rear plate 59 is detachably assembled to the reflecting mirror member 65 with the wiring board 37 interposed therebetween.

ＬＥＤ６１は、例えば、青色発光ダイオードと、この青色発光ダイオードからの青色光を黄色光に変換する蛍光体とを有するものが利用できる。これにより、ＬＥＤ６１では、青色発光ダイオードから出射された青色光が、蛍光体に吸収されると、蛍光体が黄色光を発し、この黄色光と吸収されなかった青色光とが混ざって、出射光が白色光となる。   As the LED 61, for example, a LED having a blue light emitting diode and a phosphor that converts blue light from the blue light emitting diode into yellow light can be used. Thereby, in the LED 61, when the blue light emitted from the blue light emitting diode is absorbed by the phosphor, the phosphor emits yellow light, and the yellow light and the blue light that has not been absorbed are mixed, and the emitted light is mixed. Becomes white light.

照明ユニット５５は、図５（ａ）に示すように、反射鏡部材６５に後板５９を組み付けた状態で高さＨａを有する。高さＨａは、本実施形態においては概ね２０ｍｍ程度であり、発熱電球や蛍光灯等を光源として用いた場合と比較して大幅に薄型化されている。なお、高さＨａは、小さすぎると反射鏡部材６５の偏向特性が損なわれ、大きすぎると設置スペースを要して本照明ユニット５５の配置自由度が高められない。そのため、高さＨａは１５〜３０ｍｍ程度、特に２０〜２３ｍｍ程度にすることが望ましい。このスペースに基板３７を納めるには、前述のリード線と基板の接続方法が必要となる。   As shown in FIG. 5A, the illumination unit 55 has a height Ha in a state where the rear plate 59 is assembled to the reflecting mirror member 65. The height Ha is approximately 20 mm in this embodiment, and is significantly thinner than when a heat-generating bulb, a fluorescent lamp, or the like is used as a light source. If the height Ha is too small, the deflection characteristics of the reflecting mirror member 65 are impaired. If the height Ha is too large, an installation space is required and the degree of freedom of arrangement of the illumination unit 55 cannot be increased. Therefore, the height Ha is desirably about 15 to 30 mm, particularly about 20 to 23 mm. In order to store the substrate 37 in this space, the above-described method for connecting the lead wire and the substrate is required.

反射鏡部材６５は、長尺板状の取付基部６７（図６参照）と、図５（ｂ）に示すように、取付基部６７に接続され、中心位置に開口を有し光出射側が解放側となる放物面からなる反射面（放物面鏡）６９ａを複数個（本実施形態においては合計１６個）形成した第１反射部６９と、第１反射部６９のさらに光出射側に設けられ、放物面鏡６９ａの並び方向に平行な平板状の反射面（平面板鏡）７１ａを形成した第２反射部７１とを一体に有する。第２反射部７１は、放物面鏡６９ａの並び方向とは直交する方向に平面板鏡７１ａが一対形成されたもので、並び方向両脇は、第１反射部６９の放物面鏡を延長した放物面壁７１ｂで接続されている。反射鏡部材６５は、射出成形により一体成形された樹脂成形品であって、少なくとも第１反射部６９と第２反射部７１の光反射面にはメッキ法やアルミ蒸着法等による鏡面のコーティング加工が施されている。また、光反射面としては、これに限らず、他の常套手段が利用可能である。   As shown in FIG. 5B, the reflecting mirror member 65 is connected to the mounting base 67 as shown in FIG. 5B, and has an opening at the center position. The light emitting side is the release side. A first reflecting portion 69 in which a plurality of reflecting surfaces (parabolic mirrors) 69a (a total of 16 in this embodiment) are formed, and further provided on the light emitting side of the first reflecting portion 69. And a second reflecting portion 71 having a flat reflecting surface (flat plate mirror) 71a parallel to the direction in which the parabolic mirrors 69a are arranged. The second reflecting portion 71 is a pair of plane plate mirrors 71a formed in a direction orthogonal to the direction in which the parabolic mirrors 69a are arranged, and the parabolic mirrors of the first reflecting portion 69 are arranged on both sides in the arranging direction. They are connected by an extended parabolic wall 71b. The reflecting mirror member 65 is a resin molded product integrally formed by injection molding, and at least the light reflecting surfaces of the first reflecting portion 69 and the second reflecting portion 71 are coated with a mirror surface by plating or aluminum vapor deposition. Is given. Further, the light reflecting surface is not limited to this, and other conventional means can be used.

後板５９は、図６に示すように、縦断面が"く"の字状の傘部７３と、傘部７３の内側面に配線基板３７の背面側を支持するリブ７５と、傘部７３の長手方向の複数箇所に反射鏡部材６５と係合するロック爪７７が配設されてなる。ロック爪７７は、図中上下一対の縦断面が"コ"の字状のフック形状に形成されている。   As shown in FIG. 6, the rear plate 59 includes an umbrella portion 73 having a “<” shape in the longitudinal section, a rib 75 that supports the back side of the wiring board 37 on the inner surface of the umbrella portion 73, and the umbrella portion 73. The lock claw 77 which engages with the reflecting mirror member 65 is disposed at a plurality of locations in the longitudinal direction. The lock claw 77 is formed in a hook shape in which a pair of upper and lower vertical sections in the drawing has a “U” shape.

配線基板３７は、例えばプリント基板であり、反射鏡部材６５側に長手方向に沿って個々の放物面鏡６９ａに対応して複数個（ここでは１６個）のＬＥＤ６１が直線状に実装されている。そして、配線基板３７の長手方向端部からリード線３５が引き出され、基端となるリード線３５ａは駆動部５７（図４参照）に接続されている。他端側のリード線３５ｂは、隣接配置される他の照明ユニットの配線基板に接続される。複数の照明ユニットの各配線基板は、図４に示すように、複数の照明ユニット５５が列状に配置されるため、チェーン状に順次接続され、駆動部５７からの直流電流が、これら順次接続された各照明ユニット５５の配線基板３７に印加されるようになっている。   The wiring board 37 is, for example, a printed circuit board, and a plurality of (here, 16) LEDs 61 are linearly mounted on the reflecting mirror member 65 side along the longitudinal direction so as to correspond to the individual parabolic mirrors 69a. Yes. And the lead wire 35 is pulled out from the longitudinal direction edge part of the wiring board 37, and the lead wire 35a used as a base end is connected to the drive part 57 (refer FIG. 4). The lead wire 35b on the other end side is connected to the wiring board of another illumination unit arranged adjacently. As shown in FIG. 4, the plurality of lighting units 55 are arranged in a row, and the wiring boards of the plurality of lighting units are sequentially connected in a chain shape, and the direct current from the drive unit 57 is sequentially connected. It is applied to the wiring board 37 of each illumination unit 55.

配線基板３７の長手方向端部から引き出される導線の基板接続構造は、図１から図３で既に説明した基板接続構造を採用する。すなわち、配線基板３７の長手方向端部には、突片４５が形成されており、熱収縮性部材４７により導線であるリード線３５、及び突片４５が締着されている（図１参照）。   The board connection structure of the conductive wire drawn out from the longitudinal end portion of the wiring board 37 employs the board connection structure already described with reference to FIGS. That is, a protruding piece 45 is formed at the longitudinal end of the wiring board 37, and the lead wire 35 and the protruding piece 45, which are conductive wires, are fastened by the heat-shrinkable member 47 (see FIG. 1). .

反射鏡部材６５は、長尺平板状に形成された取付基部６７の両端に照明ユニット５５の固定用のブラケット７９が形成されており、取付基部６７の図６における上下方向に、後板５９のロック爪７７が係合する係合部８１を設けてある。係合部８１は、配線基板３７を後板５９とで挟み込み、後板５９のロック爪７７とのスナップアクションにより脱着自在に組み合わせられる。   The reflecting mirror member 65 is formed with brackets 79 for fixing the illumination unit 55 at both ends of an attachment base 67 formed in a long flat plate shape, and the rear plate 59 of the attachment base 67 in the vertical direction in FIG. An engagement portion 81 with which the lock claw 77 is engaged is provided. The engaging portion 81 is detachably combined by sandwiching the wiring board 37 with the rear plate 59 and snapping with the lock claw 77 of the rear plate 59.

反射鏡部材６５、配線基板３７、後板５９を組み合わせたとき、第１反射部６９の放物面鏡の焦点位置にＬＥＤ６１の発光面が位置することになる。これはつまり、反射鏡部材６５には、配線基板３７表面に当接する面が離散的に配置されており、この当接面を、ＬＥＤ６１の発光面が放物面鏡の焦点位置となる高さに形成している。   When the reflecting mirror member 65, the wiring board 37, and the rear plate 59 are combined, the light emitting surface of the LED 61 is located at the focal position of the parabolic mirror of the first reflecting portion 69. In other words, the reflecting mirror member 65 has discretely arranged surfaces that contact the surface of the wiring board 37, and this contacting surface is a height at which the light emitting surface of the LED 61 becomes the focal position of the parabolic mirror. Is formed.

このように、照明装置１００は、反射鏡部材６５と、ロック爪７７を有する後板５９とを具備し、係合部８１とロック爪７７とを係合した反射鏡部材６５と後板５９とによって基板３７が厚み方向で挟持されるので、リード線３５の芯線３１が基板３７面と平行となり、基板３７上からのリード線３５の高さが低く抑えられ、反射鏡部材６５と後板５９との離間寸法が小さくなる。また、芯線３１が屈曲することなく基板３７から導出されるので、反射鏡部材６５と後板５９とで基板３７が挟持されても、芯線３１に屈曲部が存在する場合のように、挟持により屈曲部に応力が集中しなくなる。   Thus, the illumination device 100 includes the reflecting mirror member 65 and the rear plate 59 having the lock claw 77, and the reflecting mirror member 65 and the rear plate 59 that engage the engaging portion 81 and the locking claw 77. Since the substrate 37 is sandwiched in the thickness direction, the core wire 31 of the lead wire 35 is parallel to the surface of the substrate 37, the height of the lead wire 35 from above the substrate 37 is kept low, and the reflecting mirror member 65 and the rear plate 59 The separation distance from is reduced. Further, since the core wire 31 is led out from the substrate 37 without being bent, even if the substrate 37 is sandwiched between the reflecting mirror member 65 and the rear plate 59, as in the case where the core wire 31 has a bent portion, Stress does not concentrate at the bent part.

したがって、上記のリード線の基板接続方法によれば、リード線３５の先端部に外皮３３を切除した芯線露出部を所定の長さＬに形成し、端面３７ａからこの所定の長さＬまでの間にランド３９が形成された基板３７の端面３７ａに、リード線３５の外皮の端面３３ａを当接させ、リード線３５の芯線３１を基板３７のランド３９に半田付けするので、半田付け位置が正確に位置決めされ、接続場所のバラツキを低減することができ、リード線３５と基板３７とを高い電気的信頼性の下で接続することができる。   Therefore, according to the above-described lead wire substrate connection method, the core wire exposed portion obtained by cutting the outer skin 33 at the tip end portion of the lead wire 35 is formed to a predetermined length L, and the end surface 37a to the predetermined length L is formed. The end surface 33a of the outer surface of the lead wire 35 is brought into contact with the end surface 37a of the substrate 37 between which the lands 39 are formed, and the core wire 31 of the lead wire 35 is soldered to the land 39 of the substrate 37. Positioning can be accurately performed, and variations in the connection location can be reduced, and the lead wire 35 and the substrate 37 can be connected with high electrical reliability.

また、自動機械により半田付け作業を自動化する場合にも、基板３７の端面３７ａと外皮の端面３３ａとを突き合わせて位置決めすることができ、位置合わせが簡単且つ確実に行えるようになり、ランド３９及び芯線３１を撮像手段で検出する等の位置決め方法に比べ、低コストでの自動化が可能となる。   In addition, when the soldering operation is automated by an automatic machine, the end surface 37a of the substrate 37 and the end surface 33a of the outer skin 33 can be brought into contact with each other, positioning can be performed easily and reliably. Compared with a positioning method such as detecting the core wire 31 with an imaging means, automation can be achieved at a low cost.

また、リード線３５と基板３７の接続構造によれば、リード線３５の先端部に、外皮３３を切除した芯線露出部が所定の長さで形成され、端面３７ａからこの所定の長さＬまでの間にランド３９が形成された基板３７の端面３７ａに、リード線３５の外皮の端面３３ａが当接され、リード線３５の芯線３１が基板３７のランド３９に半田付けされたので、リード線３５の芯線３１が基板３７面と平行となり、半田付け部分において芯線３１が屈曲することがなく、半田付け強度が向上し、電気的性能の安定化を図ることができる。また、隙間が少なくなり、リード線自体のばたつきが小さくなるので、応力集中の発生を低減できる。   Further, according to the connecting structure of the lead wire 35 and the substrate 37, the core wire exposed portion obtained by cutting the outer skin 33 is formed at a predetermined length at the tip portion of the lead wire 35, and from the end surface 37a to the predetermined length L. Since the end surface 33a of the outer surface of the lead wire 35 is brought into contact with the end surface 37a of the substrate 37 on which the land 39 is formed, and the core wire 31 of the lead wire 35 is soldered to the land 39 of the substrate 37, the lead wire The 35 core wires 31 are parallel to the surface of the substrate 37, so that the core wire 31 is not bent at the soldered portion, the soldering strength is improved, and the electrical performance can be stabilized. Further, since the gap is reduced and the flapping of the lead wire itself is reduced, the occurrence of stress concentration can be reduced.

さらに、ボイドが発生し難いので、特殊な環境下で使用する製品であっても、故障を最低限に抑えることができ、例えば、塩素、 硫黄、酸等の腐食成分に晒される場合において、ボイドが存在することによる表面積の増大が無いことから、その影響を少なくすることができる。   Furthermore, since voids are unlikely to occur, even products that are used in special environments can minimize failures, and voids are exposed when exposed to corrosive components such as chlorine, sulfur, and acids. Since there is no increase in surface area due to the presence of, the influence can be reduced.

なお、リード線３５の外皮３３を突き当てるということは、元来そのようなことを前提にランド３９が形成されているわけではないので、突き当てた位置はランド３９に届かなかったり、届いても中途半端な位置であったりする。基板端面３７ａとリード線外皮３３との間に隙間がある状態でリード線３５が動かされると、簡単にリード線３５の半田４１が剥離して破壊を生じることとなる。基板端面３７ａにリード線３５を直接半田付けすることは、強度上問題があるのでコネクタを用いるのが通例であった。このため、コネクタを用いたリード線３５と基板３７の接続構造の薄厚化には限界があった。本実施の形態による接続構造では、この問題を解消して大幅な薄厚化を可能としている。   Note that the abutment of the outer skin 33 of the lead wire 35 does not mean that the land 39 is originally formed on the premise of such a situation. Therefore, the abutted position does not reach or reaches the land 39. It is also a halfway position. If the lead wire 35 is moved in a state where there is a gap between the substrate end surface 37a and the lead wire outer skin 33, the solder 41 of the lead wire 35 is easily peeled off and causes destruction. Soldering the lead wire 35 directly to the substrate end surface 37a is problematic in terms of strength, so it is usual to use a connector. For this reason, there is a limit to reducing the thickness of the connection structure between the lead wire 35 and the substrate 37 using a connector. In the connection structure according to the present embodiment, this problem is solved and the thickness can be significantly reduced.

そして、上記の照明装置１００によれば、係合部８１とロック爪７７とを係合した反射鏡部材６５と後板５９とによって、上記の接続構造による基板３７が厚み方向で挟持されたので、リード線３５の芯線３１が基板３７面と平行となり、基板３７上からのリード線３５の高さが低く抑えられ、反射鏡部材６５と後板５９との離間寸法を小さくできる。また、芯線３１が屈曲することなく基板３７から導出されるので、反射鏡部材６５と後板５９とで基板３７が挟持されても、芯線３１に屈曲部が存在する場合のように応力集中の発生することがない。この結果、リード線３５の接続が省スペースで行え、且つ電気的信頼性の高い照明装置１００を得ることができる。   And according to said illuminating device 100, since the board | substrate 37 by said connection structure was clamped in the thickness direction by the reflecting mirror member 65 which engaged the engaging part 81 and the lock nail | claw 77, and the rear board 59. The core wire 31 of the lead wire 35 is parallel to the surface of the substrate 37, the height of the lead wire 35 from above the substrate 37 is kept low, and the distance between the reflecting mirror member 65 and the rear plate 59 can be reduced. Further, since the core wire 31 is led out from the substrate 37 without being bent, even if the substrate 37 is sandwiched between the reflecting mirror member 65 and the rear plate 59, the stress concentration is reduced as in the case where the core wire 31 has a bent portion. It does not occur. As a result, the lead wire 35 can be connected in a space-saving manner, and the lighting device 100 with high electrical reliability can be obtained.

次に、本発明に係るリード線と基板の接続構造の第２の実施の形態について説明する。
図７は基板の端部に段部を形成した本発明に係る接続構造の第２の実施の形態を表す断面図である。
この実施の形態によるリード線３５と基板３７の接続構造は、基板３７のランド３９形成面に、突片４５の端面３７ａを含むランド３９の一部分を切り欠いた段部８３が、外皮３３の厚みｈに相当する深さで形成される。そして、段部８３の段差端面８３ａには、リード線３５の外皮の端面３３ａが当接される。
このリード線と基板の接続構造によれば、リード線３５の芯線３１が、ランド３９と平行に且つ接して配置され、半田付け部分において芯線３１が屈曲しなくなる。さらに、突片４５上の段部８３に載置されたリード線３５の外皮３３が熱収縮性部材４７によって突片４５に直接包囲固定され、突片４５とリード線外皮３３の接合強度が高まる。これにより、ランド３９と芯線３１との接合部に、リード線３５の引っ張りによる外力が作用し難くなり、電気的信頼性が一層高まる。 Next, a second embodiment of the lead wire-substrate connection structure according to the present invention will be described.
FIG. 7 is a cross-sectional view showing a second embodiment of the connection structure according to the present invention in which a step is formed at the end of the substrate.
In the connection structure of the lead wire 35 and the substrate 37 according to this embodiment, a step portion 83 in which a part of the land 39 including the end surface 37 a of the projecting piece 45 is cut out is formed on the land 39 forming surface of the substrate 37. It is formed with a depth corresponding to h. An end surface 33a of the outer skin of the lead wire 35 is brought into contact with the step end surface 83a of the step portion 83.
According to the connection structure of the lead wire and the substrate, the core wire 31 of the lead wire 35 is disposed in parallel with and in contact with the land 39, and the core wire 31 is not bent at the soldered portion. Furthermore, the outer sheath 33 of the lead wire 35 placed on the step portion 83 on the projecting piece 45 is directly surrounded and fixed to the projecting piece 45 by the heat-shrinkable member 47, and the joint strength between the projecting piece 45 and the lead wire outer sheath 33 is increased. . Thereby, it becomes difficult for an external force due to the pulling of the lead wire 35 to act on the joint portion between the land 39 and the core wire 31, and the electrical reliability is further enhanced.

次に、本発明に係るリード線と基板の接続構造の第３の実施の形態について説明する。
図８はリード線外皮の下部を切除した本発明に係る接続構造の第３の実施の形態を表す断面図である。
この実施の形態によるリード線３５と基板３７の接続構造は、リード線３５の先端部に、外皮３３を切除した芯線露出部が所定の長さＬで形成されるとともに、外皮３３の円周方向一部分が芯線３１の外周に接する平面９１と、外皮の端面３３ａに平行な切欠端面９３とで切除されている。そして、突片４５の端面３７ａに、リード線３５の外皮３３の切欠端面９３が当接されている。
したがって、このリード線３５と基板３７の接続構造によれば、リード線３５の芯線３１が、ランド３９と平行に且つ接して位置され、半田付け部分において芯線３１が屈曲しなくなる。さらに、芯線３１が半田付けされたランド３９の一部分に、下部外皮３３の切除されたリード線３５が平行に載置され、このリード線３５が外皮３３ごと熱収縮性部材４７によって突片４５に直接包囲固定され、基板３７とリード線３５の接合強度が大幅に高まる。これにより、ランド３９と芯線３１との接合部に、リード線３５の引っ張りによる外力が作用し難くなり、電気的信頼性が一層高まる。 Next, a description will be given of a third embodiment of the lead wire-substrate connection structure according to the present invention.
FIG. 8 is a cross-sectional view showing a third embodiment of the connection structure according to the present invention in which the lower portion of the lead wire outer skin is cut off.
In the connection structure between the lead wire 35 and the substrate 37 according to this embodiment, a core wire exposed portion obtained by cutting the outer skin 33 is formed at a predetermined length L at the distal end portion of the lead wire 35, and the circumferential direction of the outer skin 33 is A part is cut off by a flat surface 91 in contact with the outer periphery of the core wire 31 and a cut-out end surface 93 parallel to the end surface 33a of the outer skin. The cut end surface 93 of the outer skin 33 of the lead wire 35 is in contact with the end surface 37 a of the protruding piece 45.
Therefore, according to the connection structure of the lead wire 35 and the substrate 37, the core wire 31 of the lead wire 35 is positioned in parallel with and in contact with the land 39, and the core wire 31 is not bent at the soldered portion. Further, a lead wire 35 having the lower outer skin 33 cut out is placed in parallel on a part of the land 39 to which the core wire 31 is soldered. The lead wire 35 and the outer skin 33 are attached to the projecting piece 45 by the heat shrinkable member 47. It is directly surrounded and fixed, and the bonding strength between the substrate 37 and the lead wire 35 is greatly increased. Thereby, it becomes difficult for an external force due to the pulling of the lead wire 35 to act on the joint portion between the land 39 and the core wire 31, and the electrical reliability is further enhanced.

本発明に係るリード線と基板の接続構造を表す要部断面図である。It is principal part sectional drawing showing the connection structure of the lead wire and board | substrate which concerns on this invention. 図１の断面方向をＢ−Ｂ矢視で示したリード線接続前の一例としての平面図である。It is a top view as an example before the lead wire connection which showed the cross-sectional direction of FIG. 1 by the BB arrow. 図１に示した構造におけるリード線と基板との接続方法の手順を（ａ）〜（ｅ）で表した説明図である。It is explanatory drawing which represented the procedure of the connection method of the lead wire and board | substrate in the structure shown in FIG. 1 with (a)-(e). 本発明を適用した照明ユニットの構成図である。It is a block diagram of the illumination unit to which this invention is applied. 図４における照明ユニットの側面視を（ａ）、下面視を（ｂ）で表した説明図である。It is explanatory drawing which represented the side view of the illumination unit in FIG. 4 with (a), and represented the bottom view with (b). 図４における照明ユニットの分解斜視図である。It is a disassembled perspective view of the illumination unit in FIG. 基板の端部に段部を形成した本発明に係る接続構造の第２の実施の形態を表す断面図である。It is sectional drawing showing 2nd Embodiment of the connection structure based on this invention which formed the step part in the edge part of a board | substrate. リード線外皮の下部を切除した本発明に係る接続構造の第３の実施の形態を表す断面図である。It is sectional drawing showing 3rd Embodiment of the connection structure which concerns on this invention which excised the lower part of the lead wire outer skin. 従来のリード線と基板の接続構造の斜視図である。It is a perspective view of the connection structure of the conventional lead wire and a board | substrate. 図９のＡ−Ａ断面図である。It is AA sectional drawing of FIG. 従来のプリント配線基板へのリード線半田付け方法の手順を（ａ）〜（ｄ）で表した説明図である。It is explanatory drawing which represented the procedure of the lead wire soldering method to the conventional printed wiring board by (a)-(d).

符号の説明Explanation of symbols

３１ 芯線
３３ 外皮
３３ａ 外皮の端面
３５ リード線
３７ 基板
３７ａ 基板の端面
３９ ランド
４５ 突片
４７ 熱収縮性部材
５９ 後板
６５ 反射鏡部材
７７ ロック爪
８１ 係合部
８３ 段部
８３ａ 段差端面
９１ 芯線の外周に接する平面
９３ 外皮の端面に平行な切欠端面
１００ 照明装置
Ｌ 所定の長さ
ｈ 外被の厚み 31 Core wire 33 Outer skin 33a End surface of outer skin 35 Lead wire 37 Substrate 37a End surface of substrate 39 Land 45 Projection piece 47 Heat-shrinkable member 59 Rear plate 65 Reflective mirror member 77 Locking claw 81 Engagement portion 83 Step portion 83a Step end surface 91 Plane in contact with outer periphery 93 Notched end face 100 parallel to end face of outer skin Illumination device L Predetermined length h Thickness of jacket

Claims (7)

芯線の周囲が外皮で覆われたリード線を基板上のランドに半田付けして固定するリード線の基板接続方法であって、
前記リード線の先端部に前記外皮を切除した芯線露出部を所定の長さに形成するステップと、
端面から前記所定の長さまでの間にランドが形成された前記基板の端面に、前記リード線の前記外皮の端面を当接させるステップと、
前記リード線の芯線を前記基板のランドに半田付けするステップと、
を有することを特徴とするリード線の基板接続方法。 A lead wire board connection method for soldering and fixing a lead wire whose core wire is covered with an outer skin to a land on the board,
Forming a core wire exposed portion with a predetermined length by cutting off the outer skin at the tip of the lead wire; and
Contacting the end surface of the outer skin of the lead wire with the end surface of the substrate on which lands are formed between the end surface and the predetermined length;
Soldering the core wire of the lead wire to the land of the substrate;
A method for connecting a lead wire to a substrate. 前記基板の一部で形成され、表面にランドが設けられた突片に対し、前記リード線を請求項１記載のリード線の基板接続方法に基づいて前記ランドに半田付けし、
前記突片及び前記リード線を内包するように熱収縮性部材で覆い、
前記熱収縮部材を加熱して前記突片と前記リード線とを固着することを特徴とする請求項１記載のリード線の基板接続方法。 The lead wire is soldered to the land based on the substrate connecting method of the lead wire according to claim 1, wherein the lead wire is formed on a part of the substrate and has a land on the surface.
Cover with a heat-shrinkable member so as to enclose the protruding piece and the lead wire,
The lead wire board connecting method according to claim 1, wherein the heat shrinkable member is heated to fix the protruding piece and the lead wire together. 芯線の周囲が外皮で覆われたリード線を基板上のランドに半田付けして固定するリード線と基板の接続構造であって、
前記リード線の先端部に、前記外皮を切除した芯線露出部が所定の長さで形成され、
端面から前記所定の長さまでの間にランドが形成された前記基板の端面に、前記リード線の前記外皮の端面が当接され、
前記リード線の芯線が前記基板のランドに半田付けされたことを特徴とするリード線と基板の接続構造。 A lead wire and board connecting structure for soldering and fixing a lead wire whose core wire is covered with a skin to a land on the board,
At the tip of the lead wire, a core wire exposed portion obtained by excising the outer skin is formed with a predetermined length,
The end surface of the outer skin of the lead wire is in contact with the end surface of the substrate on which lands are formed between the end surface and the predetermined length,
A lead wire-substrate connection structure, wherein the core wire of the lead wire is soldered to a land of the substrate. 前記基板の一部で形成され、表面にランドが設けられた突片に対し、前記リード線が請求項３記載のリード線と基板の接続構造に基づいて前記ランドに半田付けされ、
前記突片及び前記リード線が内包されるように熱収縮性部材で覆われ、
加熱によって収縮された前記熱収縮部材によって前記突片と前記リード線とが固着されたことを特徴とする請求項３記載のリード線と基板の接続構造。 The lead wire is soldered to the land based on the connection structure of the lead wire and the substrate according to claim 3, with respect to the projecting piece formed of a part of the substrate and provided with a land on the surface,
Covered with a heat-shrinkable member so that the protruding piece and the lead wire are contained,
4. The lead wire and board connecting structure according to claim 3, wherein the protruding piece and the lead wire are fixed by the heat shrinkable member shrunk by heating. 前記基板のランド形成面に、前記突片の端面を含む該ランドの一部分を切り欠いた段部が前記外被の厚みに相当する深さで形成され、
該段部の段差端面に、前記リード線の前記外皮の端面が当接されたことを特徴とする請求項４記載のリード線と基板の接続構造。 On the land forming surface of the substrate, a stepped portion in which a part of the land including the end surface of the projecting piece is cut out is formed at a depth corresponding to the thickness of the jacket.
The lead wire and substrate connection structure according to claim 4, wherein an end surface of the outer skin of the lead wire is in contact with a step end surface of the step portion. 前記リード線の先端部に、前記外皮を切除した芯線露出部が所定の長さで形成されるとともに、該外被の円周方向一部分が前記芯線の外周に接する平面と前記外皮の端面に平行な切欠端面とで切除され、
前記突片の端面に、前記リード線の前記外皮の該切欠端面が当接されたことを特徴とする請求項４記載のリード線と基板の接続構造。 A core wire exposed portion obtained by cutting the outer skin is formed at a predetermined length at the distal end portion of the lead wire, and a part in the circumferential direction of the outer jacket is parallel to the flat surface contacting the outer periphery of the core wire and the end surface of the outer skin. Cut off with a notched end face,
5. The lead wire and board connection structure according to claim 4, wherein the notch end surface of the outer skin of the lead wire is in contact with the end surface of the protruding piece. 請求項３〜請求項６のいずれか１項記載のリード線と基板の接続構造によって前記リード線と接続された前記基板を備える照明装置であって、
取付基部に反射部及び係合部の設けられた反射鏡部材と、
前記係合部に係合するロック爪を有する後板と、を具備し、
前記係合部と前記ロック爪とを係合した前記反射鏡部材と前記後板とによって前記基板が厚み方向で挟持されたことを特徴とする照明装置。 A lighting device comprising the substrate connected to the lead wire by the lead wire-substrate connection structure according to any one of claims 3 to 6,
A reflecting mirror member provided with a reflecting portion and an engaging portion on the mounting base;
A rear plate having a locking claw that engages with the engaging portion,
An illuminating device, wherein the substrate is sandwiched in the thickness direction by the reflecting mirror member and the rear plate engaging the engaging portion and the lock claw.
JP2006281308A 2006-10-16 2006-10-16 Connection method of lead wire to substrate, connection structure of lead wire and substrate, and illumination apparatus Pending JP2008098560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006281308A JP2008098560A (en) 2006-10-16 2006-10-16 Connection method of lead wire to substrate, connection structure of lead wire and substrate, and illumination apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006281308A JP2008098560A (en) 2006-10-16 2006-10-16 Connection method of lead wire to substrate, connection structure of lead wire and substrate, and illumination apparatus

Publications (1)

Publication Number Publication Date
JP2008098560A true JP2008098560A (en) 2008-04-24

Family

ID=39381056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006281308A Pending JP2008098560A (en) 2006-10-16 2006-10-16 Connection method of lead wire to substrate, connection structure of lead wire and substrate, and illumination apparatus

Country Status (1)

Country Link
JP (1) JP2008098560A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2620690A1 (en) 2012-01-26 2013-07-31 Toshiba Lighting & Technology Corporation Light-emitting circuit, luminaire, and manufacturing method for the light-emitting circuit
JP2017107764A (en) * 2015-12-10 2017-06-15 住友電気工業株式会社 Cable assembly
WO2018022379A1 (en) * 2016-07-28 2018-02-01 3M Innovative Properties Company Electrical cable
JP2018137239A (en) * 2018-05-14 2018-08-30 住友電気工業株式会社 Wiring member
JP2019062112A (en) * 2017-09-27 2019-04-18 京セラ株式会社 Thermoelectric module

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2620690A1 (en) 2012-01-26 2013-07-31 Toshiba Lighting & Technology Corporation Light-emitting circuit, luminaire, and manufacturing method for the light-emitting circuit
US8833965B2 (en) 2012-01-26 2014-09-16 Toshiba Lighting & Technology Corporation Light-emitting circuit, luminaire, and manufacturing method for the light-emitting circuit
JP2017107764A (en) * 2015-12-10 2017-06-15 住友電気工業株式会社 Cable assembly
WO2018022379A1 (en) * 2016-07-28 2018-02-01 3M Innovative Properties Company Electrical cable
US11217918B2 (en) 2016-07-28 2022-01-04 3M Innovative Properties Company Electrical cable
JP2019062112A (en) * 2017-09-27 2019-04-18 京セラ株式会社 Thermoelectric module
JP2018137239A (en) * 2018-05-14 2018-08-30 住友電気工業株式会社 Wiring member

Similar Documents

Publication Publication Date Title
JP5735246B2 (en) Light source support for lighting module
KR100888578B1 (en) Ring type illuminator and method of thereof
TWI383551B (en) Anschlusselement zur elektrischen anbindung einer led
US10638612B2 (en) Carrier for solid-state lighting devices intended for a light bulb
JP2002141555A (en) Led illumination lamp and method for manufacturing led illumination lamp
JP2008098560A (en) Connection method of lead wire to substrate, connection structure of lead wire and substrate, and illumination apparatus
US20190003659A1 (en) Led lighting apparatus
JP2009146841A (en) Led lighting device
US8833965B2 (en) Light-emitting circuit, luminaire, and manufacturing method for the light-emitting circuit
JP2012049367A (en) Semiconductor light-emitting device attachment module, semiconductor light-emitting device module, semiconductor light-emitting device lighting apparatus, and manufacturing method of semiconductor light-emitting device attachment module
US7621782B1 (en) Connector and light source apparatus
US10670221B2 (en) Semiconductor-component device assembled on a heat sink, assembly method, and lighting device for a motor vehicle including such a device
JP2001043715A (en) Planar lighting system
WO2007119908A1 (en) Led module assembly for signboard and method for manufacturing signboard using the same
US9772097B2 (en) Efficient board to board connection
WO2014178366A1 (en) Lighting apparatus
CN106523942A (en) Heatsink with integrated electrical and base contacts
JP2019029073A (en) Light source unit and lighting fixture
CN111059482A (en) Lighting device with lead frame
JP2009170642A (en) Electric device
JP4834792B2 (en) Lighting device
JP2016157534A (en) Led lamp and heat radiation method of led lamp
JP2007066906A (en) Light emitting diode bulb
US10816181B2 (en) Light module providing positioning and fixation of a circuit board in a housing
JP5896125B2 (en) Light emitting device and lighting device

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20090730

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20090806