JP2008078213A - Device for assembling precision component - Google Patents

Device for assembling precision component Download PDF

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JP2008078213A
JP2008078213A JP2006253068A JP2006253068A JP2008078213A JP 2008078213 A JP2008078213 A JP 2008078213A JP 2006253068 A JP2006253068 A JP 2006253068A JP 2006253068 A JP2006253068 A JP 2006253068A JP 2008078213 A JP2008078213 A JP 2008078213A
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suction head
precision
frame
distance
head body
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JP4954652B2 (en
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Toshio Yoshioka
寿夫 吉岡
Hisanori Sasaki
久昇 佐々木
Norio Kiyono
憲男 清野
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Sanwa System Engineering Co Ltd
Panasonic Holdings Corp
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Sanwa System Engineering Co Ltd
Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To efficiently assemble a precision component by preventing hooking in mounting the component. <P>SOLUTION: A suction head body 20 is supported with it floated for an ascending/descending frame 22 via a balancing mechanism 23, and a distance change detecting means 27 detects a change in a distance d between the ascending/descending frame 22 and the suction head body 20 and a shock means 24 such as a piezoelectric element is operated. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子回路基板等の精密部品を他の精密部品の所定の位置に位置決めして組み付ける精密部品の組み付け装置に関する。   The present invention relates to a precision component assembling apparatus that positions and assembles a precision component such as an electronic circuit board at a predetermined position of another precision component.

例えば１ｍｍ角で厚さ0.5 ｍｍの水晶発振子や電子回路基板等の精密部品を互いに積み重ねたり、台座等の他の精密部品の所定位置に貼りつけたりするマウント作業のため、組立セルとも呼ばれる組み付け装置が使用されている。
マウント作業の一例を特許文献１の記載を引用して説明する。図２は組み付けを行う電子部品の一例を示す（ａ）は平面図、（ｂ）は正面図で、Ｓはマウントベースとなるステム、ＣはステムＳ上の所定位置にマウントされる半導体等の固体素子のチップ（ワーク）である。 For example, an assembly device called an assembly cell for mounting work that stacks precision parts such as quartz oscillators and electronic circuit boards with a thickness of 1 mm square and 0.5 mm in thickness, and attaches them to other precision parts such as pedestals. Is used.
An example of the mounting operation will be described with reference to the description in Patent Document 1. FIGS. 2A and 2B show examples of electronic components to be assembled. FIG. 2A is a plan view, FIG. 2B is a front view, S is a stem serving as a mount base, C is a semiconductor mounted at a predetermined position on the stem S, and the like. A chip (work) of a solid element.

図３はマウントを行う手順を説明する従来の組立セルのレイアウトを示す平面図で、ウエハからダイシングにより切り出されたチップＣを載置した第１のトレイ3aから、ロボットアームが１個のチップＣを取り出し、水平移動してそのチップＣを位置決め装置４に置き、位置決めを行ったのち、ステムＳを所定位置に整列させた第２のトレイ3bに移動してステムＳ上の所定位置にそのチップＣをマウントする。ここで位置決め装置によりロボットアームに対してチップＣを位置決めすることにより、ステムＳ上の所定位置に正確にチップＣをマウントすることができるのである。   FIG. 3 is a plan view showing the layout of a conventional assembly cell for explaining the mounting procedure. The robot arm has one chip C from the first tray 3a on which chips C cut out from the wafer by dicing are placed. The chip C is horizontally moved to place the chip C on the positioning device 4, and after positioning, the stem S is moved to the second tray 3b aligned at a predetermined position, and the chip is moved to a predetermined position on the stem S. Mount C. Here, the chip C can be accurately mounted at a predetermined position on the stem S by positioning the chip C with respect to the robot arm by the positioning device.

このようなマウント作業を行なう従来の組み付け装置として、特許文献２に記載のものを図面により簡単に説明する。
図４は特許文献２に記載の平板状精密部品の組み付け装置を示す斜視図で、１はベース、20は先端でワークを吸着する吸着ヘッド、21は吸着ヘッド20をＺ軸方向（上下方向）に移動させるＺ軸駆動部（昇降機構）、３はチップ、ステムなどの精密部品を上面に載置して水平移動するワークステージ、34はワークステージ３においてワークを保持するホルダ、４は位置決め装置であるセンタリングチャック、５はこれらを操作する操作スイッチや制御盤を含む操作盤である。 As a conventional assembling apparatus for performing such mounting work, the apparatus described in Patent Document 2 will be briefly described with reference to the drawings.
4 is a perspective view showing a flat precision component assembling apparatus described in Patent Document 2, wherein 1 is a base, 20 is a suction head that sucks a workpiece at the tip, and 21 is a suction head 20 in the Z-axis direction (vertical direction). Z-axis drive unit (elevating mechanism) to be moved 3, 3 is a work stage that horizontally moves by placing precision parts such as a chip and a stem on the upper surface, 34 is a holder for holding the work on the work stage 3, 4 is a positioning device The centering chuck 5 is an operation panel including an operation switch and a control panel for operating these.

つぎに図５の説明図により組立セル各部の動作と位置関係を説明する。吸着ヘッド２は上下の垂直方向のみ、ワークステージ３は左右の水平方向のみに移動するものとし、前者がＺ軸、後者がＸ軸である。両軸は同一垂直平面内にあり、直交している。さらに下方のセンタリングチャック４の中心もＺ軸位置にあり、吸着ヘッド２はその直上から上方にかけてＺ軸に沿って昇降する。またワークステージ３は吸着ヘッド２の昇降ストロークの中間高さで水平移動しながらセンタリングチャック４の直上をかわす退避位置ならびに上面に搭載した複数のホルダ34のそれぞれが前記Ｚ軸位置、すなわち吸着ヘッド２の真下になる位置で停止させることができる。ワークステージ３のホルダ34はＸ軸上に１列に並んでいる。またかりに、図５に符号Ａで示したようにワークステージ３にＸ軸上のもの以外にもホルダを設け、複数列とするのであれば、Ｚ軸、Ｘ軸のほかに前後方向のＹ軸を想定し、ワークステージ３を同一水平面内でＸＹ両方向に移動させるようにすればよい。
特開昭６３−２６６８４９号公報 特開２００３−１３３３３９号公報 Next, the operation and positional relationship of each part of the assembly cell will be described with reference to FIG. The suction head 2 moves only in the vertical direction, and the work stage 3 moves only in the horizontal direction on the left and right. The former is the Z axis and the latter is the X axis. Both axes are in the same vertical plane and are orthogonal. Further, the center of the lower centering chuck 4 is also at the Z-axis position, and the suction head 2 moves up and down along the Z-axis from directly above to above. Further, the work stage 3 moves horizontally at the intermediate height of the lifting / lowering stroke of the suction head 2, and the retreat position where the work stage 3 moves directly above the centering chuck 4 and the plurality of holders 34 mounted on the upper surface are the Z-axis positions, that is, the suction head 2. It can be stopped at a position directly below. The holders 34 of the work stage 3 are arranged in a line on the X axis. In addition, if the work stage 3 is provided with a holder in addition to the one on the X axis as shown by the symbol A in FIG. 5 to form a plurality of rows, in addition to the Z axis and the X axis, the Y axis in the front-rear direction And the work stage 3 may be moved in both the XY directions within the same horizontal plane.
JP-A 63-266849 JP 2003-133339 A

以上説明したような従来の精密部品の組み付け装置においては、ワークを平面上に載置したり、平面上で重ねたりするのにはとくに問題がなかったが、たとえば超小型カメラ用レンズの鏡胴内にレンズやレンズ押えを挿入するような作業の場合、鏡胴の内径が約３ｍｍ、レンズとの隙間が１〜３μｍしかない。ほんのわずかセンターがずれても挿入の途中でレンズが鏡胴の壁に引っかかり、ずれたまま曲がって挿入されたり、割れてしまうなどの不具合が発生する。   In the conventional precision component assembling apparatus as described above, there is no particular problem in placing a workpiece on a plane or stacking on a plane, but for example, a lens barrel of a micro camera lens. In the operation of inserting a lens or a lens presser inside, the inner diameter of the lens barrel is about 3 mm, and the gap with the lens is only 1 to 3 μm. Even if the center is slightly displaced, the lens will be caught on the wall of the lens barrel during insertion, causing problems such as bending and inserting while being displaced, or cracking.

本発明は、このような微妙な作業においても引っかかりをいち早く検知して問題なく挿入ができるような精密部品の組み付け装置を実現することを目的とする。   An object of the present invention is to realize a precision component assembling apparatus that can quickly detect a catch even in such a delicate work and can insert it without any problem.

本発明は、テーブル上の精密部品を取り上げて下方の位置決め装置等へ載置する精密部品の組み付け装置において、精密部品を吸着して昇降する吸着ヘッドが、昇降機構によって垂直に昇降する昇降フレームと、この昇降フレームの上端からバランス機構を介して吊り下げられた衝撃手段と、前記昇降フレームに対して上下スライド可能に取り付けられ、下端に精密部品を吸着する吸着ヘッド本体と、この吸着ヘッド本体を前記昇降フレーム側に吊り上げる引張りばねと、吸着ヘッド本体と昇降フレームとの間の距離の変化を検出する距離変化検出手段とからなることを特徴とする精密部品の組み付け装置であり、好ましくは前記衝撃手段が圧電素子である前記の精密部品の組み付け装置であり、また前記距離変化検出手段により吸着ヘッド本体と昇降フレームとの間の距離の変化を検出して前記衝撃手段を作動させるようにしたことを特徴とする前記の精密部品の組み付け装置である。   The present invention relates to an assembling apparatus for a precision component that picks up a precision component on a table and places it on a lower positioning device or the like. The impact means suspended from the upper end of the lifting frame via a balance mechanism, the suction head body attached to the lifting frame so as to be vertically slidable, and sucking precision parts at the lower end, and the suction head body A precision component assembling apparatus comprising a tension spring suspended on the lifting frame side and a distance change detecting means for detecting a change in distance between the suction head body and the lifting frame, preferably the impact The precision component assembling apparatus, wherein the means is a piezoelectric element, and the suction head is detected by the distance change detecting means. Body to be the assembling device of precision parts, wherein the distance change detecting to the fact that as actuating the impact means between the lift frame.

本発明によれば、引っかかりを即時に解消して精密部品の組み付けを順調に行なうことで能率、歩留りが大きく向上し、生産性が高まるという、すぐれた効果を奏する。   According to the present invention, there is an excellent effect that the efficiency and the yield are greatly improved and the productivity is increased by quickly eliminating the catch and smoothly assembling the precision parts.

本発明の実施例を図面により説明する。図１は実施例の精密部品の組み付け装置における要部、すなわち吸着ヘッド２を示す側面図で、20は吸着ヘッド本体、21は昇降機構、22は昇降フレーム、23はバランス機構、24は衝撃手段、25は引張りばね、26は距離変化検出手段、27はスライドフレーム、28は真空ホースである。
精密部品を吸着して昇降する吸着ヘッド２は、昇降機構21によって垂直に昇降する昇降フレーム22と、この昇降フレーム22の上端からバランス機構23を介して吊り下げられた衝撃手段24と、スライドフレーム27を介して前記昇降フレーム22に対して上下スライド可能に取り付けられ、真空ホース28に連通して下端に精密部品を吸着する吸着ヘッド本体20と、この吸着ヘッド本体20を前記昇降フレーム22側に吊り上げる引張りばね25と、吸着ヘッド本体20と昇降フレーム22との間の距離の変化を検出する距離変化検出手段26とから構成される。 Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view showing a main part of the precision component assembling apparatus of the embodiment, that is, a suction head 2. 20 is a suction head body, 21 is a lifting mechanism, 22 is a lifting frame, 23 is a balance mechanism, and 24 is an impact means. , 25 is a tension spring, 26 is a distance change detecting means, 27 is a slide frame, and 28 is a vacuum hose.
The suction head 2 that lifts and lowers a precision part by suction includes a lift frame 22 that is vertically lifted by a lift mechanism 21, an impact means 24 that is suspended from the upper end of the lift frame 22 via a balance mechanism 23, and a slide frame The suction head body 20 is attached to the lifting frame 22 through the vertical hose 27 so as to be slidable up and down, and communicates with the vacuum hose 28 and sucks precision components at the lower end, and the suction head body 20 is placed on the lifting frame 22 side. The tension spring 25 is lifted, and a distance change detecting means 26 for detecting a change in the distance between the suction head body 20 and the lifting frame 22 is configured.

昇降機構は、たとえばモータでスクリュー軸を回転させ、ボールねじで直線移動するようにしたリニアガイドなどが、隙間による誤差がなく好適である。昇降フレーム22は昇降機構によって昇降するが、吸着ヘッド本体20はこの昇降フレーム22に対して上下スライド可能に取り付けられ、衝撃手段24に当接するように引張りばね25により付勢されている。
バランス機構23は、ピストンの上下で油圧を変えて、下側は、吊り下げられている衝撃手段24、スライドフレーム27、引張りばね25による付勢力の合計の重量に見合う力を上向きに作用させてバランスさせ、いわば浮いた状態としている。 As the elevating mechanism, for example, a linear guide in which a screw shaft is rotated by a motor and linearly moved by a ball screw is suitable because there is no error due to a gap. The elevating frame 22 is raised and lowered by an elevating mechanism. The suction head main body 20 is attached to the elevating frame 22 so as to be slidable up and down and is urged by a tension spring 25 so as to abut against the impact means 24.
The balance mechanism 23 changes the hydraulic pressure at the top and bottom of the piston, and the lower side applies an upward force corresponding to the total weight of the urging force by the suspended impact means 24, slide frame 27, and tension spring 25. They are balanced and are in a floating state.

距離変化検出手段26はこの自重とバランスした状態を基準として、昇降フレーム22と吸着ヘッド本体20との距離ｄを測定し、吸着ヘッド本体20が浮き上がれば距離ｄが大きくなるのでその変化を検出する。したがって、マウント作業において何らかの引っかかりが発生すれば、その抵抗によって吸着ヘッド本体20が浮き上がり、その上にある衝撃手段24を押し上げるから、これをいち早く検知して電気信号により衝撃手段24を作動させることができる。   The distance change detection means 26 measures the distance d between the elevating frame 22 and the suction head body 20 based on the balance with its own weight, and detects the change because the distance d increases when the suction head body 20 floats. To do. Therefore, if any catch occurs in the mounting operation, the suction head main body 20 is lifted by the resistance and pushes up the impact means 24 on it, so this can be detected quickly and the impact means 24 can be activated by an electrical signal. it can.

衝撃手段としては、たとえばピエゾ抵抗効果を利用したＰＺＴ（Piezoelectric transducer）などの名称で知られる圧電素子などがよい。圧電素子は電圧をかけると高速で変形するセラミックスで、衝撃力によって下にある吸着ヘッド本体20を瞬間的に軽い力で叩くので、マウント途中の精密部品の引っかかりがはずれ、首尾よく所定の位置に精密部品をマウントすることができる。   As the impact means, for example, a piezoelectric element known by a name such as PZT (Piezoelectric Transducer) using the piezoresistance effect is preferable. The piezoelectric element is a ceramic that deforms at high speed when a voltage is applied, and because the impacting force strikes the lower suction head body 20 with a light force momentarily, the precision component in the middle of mounting is released and it is successfully placed in place. Precision parts can be mounted.

本発明実施例における精密部品の組み付け装置の要部を示す側面図である。It is a side view which shows the principal part of the assembly | attachment apparatus of the precision components in the Example of this invention. 本発明に係わる電子部品の一例を示す（ａ）は平面図、（ｂ）は正面図である。FIG. 2A is a plan view showing an example of an electronic component according to the present invention, and FIG. 従来の技術における組み立てセルのレイアウトを示す平面図である。It is a top view which shows the layout of the assembly cell in a prior art. 従来の技術における平板状精密部品の組み付け装置を示す斜視図である。It is a perspective view which shows the assembly | attachment apparatus of the flat precision component in a prior art. 従来の技術における組み立てセル各部の動作と位置関係を示す説明図である。It is explanatory drawing which shows operation | movement and positional relationship of each part of the assembly cell in a prior art.

符号の説明Explanation of symbols

１ ベース
２ 吸着ヘッド
３ ワークステージ
3a、3b トレイ
４ センタリングチャック（位置決め装置）
５ 操作盤
20 吸着ヘッド本体
21 Ｚ軸駆動部（昇降機構）
22 昇降フレーム
23 バランス機構
24 衝撃手段
25 引張りばね
26 距離変化検出手段
27 スライドフレーム
28 真空ホース
34 ホルダ
Ｓ ステム
Ｃ チップ 1 Base 2 Suction head 3 Work stage
3a, 3b Tray 4 Centering chuck (positioning device)
5 Operation panel
20 Suction head body
21 Z-axis drive unit (elevating mechanism)
22 Lifting frame
23 Balance mechanism
24 Impact means
25 Tension spring
26 Distance change detection means
27 Slide frame
28 Vacuum hose
34 Holder S Stem C Tip

Claims (3)

テーブル上の精密部品を取り上げて下方の位置決め装置等へ載置する精密部品の組み付け装置において、精密部品を吸着して昇降する吸着ヘッド（２）が、昇降機構（21）によって垂直に昇降する昇降フレーム（22）と、この昇降フレーム（22）の上端からバランス機構（23）を介して吊り下げられた衝撃手段（24）と、前記昇降フレーム（22）に対して上下スライド可能に取り付けられ、下端に精密部品を吸着する吸着ヘッド本体（20）と、この吸着ヘッド本体（20）を前記昇降フレーム（22）側に吊り上げる引張りばね（25）と、吸着ヘッド本体（20）と昇降フレーム（22）との間の距離の変化を検出する距離変化検出手段（26）とからなることを特徴とする精密部品の組み付け装置。   In a precision parts assembly device that picks up precision parts on a table and places them on a positioning device below, the suction head (2) that lifts and lowers the precision parts is lifted and lowered vertically by a lifting mechanism (21). A frame (22), an impact means (24) suspended from the upper end of the elevating frame (22) via a balance mechanism (23), and attached to the elevating frame (22) so as to be vertically slidable; A suction head body (20) that sucks precision parts at the lower end, a tension spring (25) that lifts the suction head body (20) toward the lifting frame (22), a suction head body (20), and a lifting frame (22 And a distance change detecting means (26) for detecting a change in the distance between them. 前記衝撃手段（24）が圧電素子である請求項１に記載の精密部品の組み付け装置。   The precision component assembling apparatus according to claim 1, wherein the impact means (24) is a piezoelectric element. 前記距離変化検出手段（26）により吸着ヘッド本体（20）と昇降フレーム（22）との間の距離の変化を検出して前記衝撃手段（24）を作動させるようにしたことを特徴とする請求項１または２に記載の精密部品の組み付け装置。   The distance change detecting means (26) detects a change in the distance between the suction head main body (20) and the lifting frame (22) to operate the impact means (24). Item 3. The precision part assembling apparatus according to Item 1 or 2.
JP2006253068A 2006-09-19 2006-09-19 Precision parts assembly equipment Expired - Fee Related JP4954652B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200473073Y1 (en) * 2012-07-16 2014-06-12 (주)네오하나텍 Apparatus for assembling plastic injection molding lens
KR101734157B1 (en) 2015-02-27 2017-05-12 주식회사 로보스타 Apparatus for assembling lens and vcm actuator

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200473073Y1 (en) * 2012-07-16 2014-06-12 (주)네오하나텍 Apparatus for assembling plastic injection molding lens
KR101734157B1 (en) 2015-02-27 2017-05-12 주식회사 로보스타 Apparatus for assembling lens and vcm actuator

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