JP2008077436A5 - - Google Patents
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- JP2008077436A5 JP2008077436A5 JP2006256430A JP2006256430A JP2008077436A5 JP 2008077436 A5 JP2008077436 A5 JP 2008077436A5 JP 2006256430 A JP2006256430 A JP 2006256430A JP 2006256430 A JP2006256430 A JP 2006256430A JP 2008077436 A5 JP2008077436 A5 JP 2008077436A5
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- JP
- Japan
- Prior art keywords
- electronic device
- air
- cooling
- cooled
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (11)
前記冷却対象とは異なる他の冷却対象を備え、
前記筐体は、
当該筐体の一方の面にそれぞれ形成され、当該筐体の外部の空気を内部に導入する第1導入口、及び、当該筐体内部を冷却した空気を外部に排出する排気口と、
当該筐体の外部の空気を導入する第2導入口とを有し、
前記筐体内には、当該筐体内における前記第1導入口が形成された側の第1空間と、前記排気口が形成された側の第2空間とを仕切る仕切部材が設けられ、
前記筐体における前記一方の面とは反対側の面と、前記仕切部材との間には隙間が形成され、
前記冷却手段は、前記第2空間内に配置され、
当該冷却手段は、
前記筐体内に導入した空気を吸気する吸気口と、
当該吸気口から吸気した空気を、前記排気口に向かって吐出する吐出口とを有し、
前記冷却対象は、前記第1導入口から前記冷却手段に至る空気の流路上に配置され、
前記他の冷却対象は、前記冷却対象を冷却した空気が前記冷却手段に吸引されるまでの流路上に配置され、
前記第1空間を流通した空気は、前記冷却手段により吸引されて、前記隙間を介して前記第2空間に流入し、
前記第2導入口から導入された空気は、前記冷却手段により吸引される過程で、前記冷却対象を冷却した空気と混合されて、前記他の冷却対象に送風されることを特徴とする電子機器。 An electronic device comprising: a cooling target; a cooling unit that cools the cooling target; and a casing that houses the cooling target and the cooling unit.
Provided with another cooling object different from the cooling object,
The housing,
A first introduction port that is formed on one surface of the housing and introduces air outside the housing to the inside ; and an exhaust port that discharges air that has cooled the inside of the housing to the outside ;
A second inlet for introducing air outside the housing;
In the casing, a partition member is provided that partitions the first space on the side where the first introduction port is formed in the casing and the second space on the side where the exhaust port is formed,
A gap is formed between the surface of the housing opposite to the one surface and the partition member,
The cooling means is disposed in the second space;
The cooling means is
An air inlet for sucking air introduced into the housing;
A discharge port for discharging air sucked from the intake port toward the exhaust port;
The object to be cooled is disposed on an air flow path from the first inlet to the cooling means,
The other cooling object is disposed on the flow path until the air that has cooled the cooling object is sucked into the cooling means,
Air flows through the first space is sucked by the cooling means, flows into the second space through the gap,
The air introduced from the second introduction port is mixed with the air that has cooled the cooling target in the process of being sucked by the cooling means, and is blown to the other cooling target. .
前記冷却対象は、前記隙間近傍に配置されていることを特徴とする電子機器。 The electronic device according to claim 1,
The electronic device, wherein the object to be cooled is disposed in the vicinity of the gap.
前記冷却対象は、当該電子機器を構成する電子部品に電力を供給する電源装置であることを特徴とする電子機器。 The electronic device according to claim 1 or 2,
The electronic device characterized in that the object to be cooled is a power supply device that supplies electric power to an electronic component constituting the electronic device.
前記冷却対象は、前記第1空間内に配置され、
前記他の冷却対象は、前記第2空間内に配置されていることを特徴とする電子機器。 In the electronic device in any one of Claims 1-3 ,
The object to be cooled is disposed in the first space,
The other cooling object is disposed in the second space.
前記他の冷却対象は、前記隙間近傍に配置されていることを特徴とする電子機器。 The electronic device according to claim 4 ,
The other cooling object is disposed in the vicinity of the gap.
前記冷却対象は、前記第1導入口から前記冷却手段に至る空気の流路上に配置され、
前記筐体には、当該筐体の外部の空気を導入する第3導入口が形成され、
前記仕切部材における前記冷却手段が設けられる側には、所定の処理を実行する集積回路が実装された回路基板が設けられ、
前記冷却手段は、
前記集積回路に当接する当接部と、
前記当接部に接続され、当該当接部を介して前記集積回路から伝導された熱を放熱する放熱部と、
前記吸気口から吸引した空気を前記放熱部に送風する送風部とを備え、
前記吸気口には、前記冷却対象を冷却した空気に加えて、前記第3導入口から導入された空気が吸引されることを特徴とする電子機器。 The electronic device according to any one of claims 1 to 5 ,
The object to be cooled is disposed on an air flow path from the first inlet to the cooling means,
The casing is formed with a third inlet for introducing air outside the casing.
On the side of the partition member on which the cooling means is provided, a circuit board on which an integrated circuit that performs a predetermined process is mounted is provided,
The cooling means is
A contact portion that contacts the integrated circuit;
A heat dissipating part connected to the abutting part and dissipating heat conducted from the integrated circuit through the abutting part; and
An air blower that blows air sucked from the air intake to the heat radiating part;
The electronic apparatus according to claim 1, wherein air introduced from the third introduction port is sucked into the intake port in addition to air that has cooled the object to be cooled.
前記回路基板における前記仕切部材とは反対側には、当該仕切部材とともに前記回路基板を挟持するフレーム部材を備えることを特徴とする電子機器。 The electronic device according to claim 6 ,
An electronic apparatus comprising a frame member that sandwiches the circuit board together with the partition member on the side of the circuit board opposite to the partition member.
前記筐体と前記冷却対象との間には、隙間を封止する封止部材が設けられていることを特徴とする電子機器。 The electronic device claimed in any of claims 7,
An electronic device, wherein a sealing member that seals a gap is provided between the casing and the object to be cooled.
前記冷却手段の吐出口と、前記排気口とを接続する接続部材が設けられていることを特徴とする電子機器。 The electronic device according to any one of claims 1 to 8 ,
An electronic device comprising a connection member for connecting the discharge port of the cooling means and the exhaust port.
前記筐体の互いに交差する2つの面には、所定の設置面に当接する脚部がそれぞれ設けられ、
前記第1導入口及び前記排気口が形成された前記一方の面は、前記2つの面とは異なる面であることを特徴とする電子機器。 The electronic device according to any one of claims 1 to 9 ,
The two surfaces of the casing that intersect each other are provided with leg portions that contact a predetermined installation surface, respectively.
The electronic device according to claim 1, wherein the one surface on which the first introduction port and the exhaust port are formed is a surface different from the two surfaces.
前記2つの面のうちいずれかの面に設けられた前記脚部を前記設置面に当接させて、当該電子機器を載置させた際に、前記第1導入口及び前記排気口が形成された前記一方の面は、上方に対向することを特徴とする電子機器。 The electronic device according to claim 10 ,
The first introduction port and the exhaust port are formed when the electronic device is placed with the leg provided on one of the two surfaces in contact with the installation surface. Further, the electronic device is characterized in that the one surface faces upward.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006256430A JP4686427B2 (en) | 2006-09-21 | 2006-09-21 | Electronics |
PCT/JP2007/068157 WO2008035699A1 (en) | 2006-09-21 | 2007-09-19 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006256430A JP4686427B2 (en) | 2006-09-21 | 2006-09-21 | Electronics |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008077436A JP2008077436A (en) | 2008-04-03 |
JP2008077436A5 true JP2008077436A5 (en) | 2009-11-05 |
JP4686427B2 JP4686427B2 (en) | 2011-05-25 |
Family
ID=39200524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006256430A Expired - Fee Related JP4686427B2 (en) | 2006-09-21 | 2006-09-21 | Electronics |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4686427B2 (en) |
WO (1) | WO2008035699A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5378863B2 (en) | 2009-04-02 | 2013-12-25 | 株式会社ソニー・コンピュータエンタテインメント | Electronics |
JP5329282B2 (en) * | 2009-04-02 | 2013-10-30 | 株式会社ソニー・コンピュータエンタテインメント | Electronics |
JP2011141859A (en) * | 2010-01-08 | 2011-07-21 | Chang Hwan Seo | Cooling device making cooling air flow in computer body for cooling |
JP5383740B2 (en) | 2011-04-18 | 2014-01-08 | 株式会社ソニー・コンピュータエンタテインメント | Electronics |
BR112013026340B1 (en) * | 2011-04-18 | 2021-03-23 | Sony Computer Entertainment, Inc | ELECTRONIC DEVICE |
JP5730653B2 (en) * | 2011-04-18 | 2015-06-10 | 株式会社ソニー・コンピュータエンタテインメント | Electronics |
JP5236771B2 (en) * | 2011-04-18 | 2013-07-17 | 株式会社ソニー・コンピュータエンタテインメント | Electronics |
JP2015079560A (en) * | 2015-01-07 | 2015-04-23 | 株式会社バッファロー | Network attached storage |
JP2015122778A (en) * | 2015-02-05 | 2015-07-02 | 株式会社リコー | Dedicated terminal |
US11092986B2 (en) * | 2017-06-30 | 2021-08-17 | Dell Products L.P. | Multi-fan sealed boost dock |
CN114173505B (en) * | 2021-11-10 | 2023-08-11 | 宜昌测试技术研究所 | Double-layer contact type heat conduction high-power supply pressure-bearing shell for large water depth |
WO2023199388A1 (en) * | 2022-04-11 | 2023-10-19 | 株式会社ソニー・インタラクティブエンタテインメント | Cooling fan, electronic device, and method for producing electronic device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0497441U (en) * | 1991-01-21 | 1992-08-24 | ||
JPH0795771A (en) * | 1993-09-20 | 1995-04-07 | Sansha Electric Mfg Co Ltd | Cooling structure of power unit |
JP4123594B2 (en) * | 1998-09-28 | 2008-07-23 | 松下電器産業株式会社 | Cooling structure for information equipment |
JP3106892U (en) * | 1999-09-06 | 2005-01-27 | 株式会社ソニー・コンピュータエンタテインメント | Entertainment equipment |
JP2007095771A (en) * | 2005-09-27 | 2007-04-12 | Koa Corp | Method of manufacturing multiple chip resistor |
-
2006
- 2006-09-21 JP JP2006256430A patent/JP4686427B2/en not_active Expired - Fee Related
-
2007
- 2007-09-19 WO PCT/JP2007/068157 patent/WO2008035699A1/en active Application Filing
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