JP2008055478A - Method for finishing process - Google Patents

Method for finishing process Download PDF

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JP2008055478A
JP2008055478A JP2006236465A JP2006236465A JP2008055478A JP 2008055478 A JP2008055478 A JP 2008055478A JP 2006236465 A JP2006236465 A JP 2006236465A JP 2006236465 A JP2006236465 A JP 2006236465A JP 2008055478 A JP2008055478 A JP 2008055478A
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laser beam
wall
picosecond laser
pilot hole
picosecond
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Takashi Kobayashi
崇 小林
Hiroaki Yamagishi
弘昭 山岸
Masanobu Ishikawa
正信 石川
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Honda Motor Co Ltd
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Honda Motor Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To perform finishing process in a shorter time while finishing process accuracy is enhanced for the inner wall of a prepared hole. <P>SOLUTION: After a prepared hole 23L is drilled in a workpiece 23, the inner wall (solidification part 23k) of this prepared hole 23L is irradiated with a picosecond laser beam 17 to make a smooth finish on the inner wall. In the picosecond laser beam 17, energy density can be made greater compared with a conventional finishing process by electric discharge machining. When the picosecond laser beam 17 is emitted to the workpiece 23, the temperature of the irradiation part of the workpiece 23 becomes high instantaneously, enabling the finishing process to be performed in a shorter time. In addition, the pulse width T4 of the picosecond laser beam 17 is very small, that is, the irradiation time of the picosecond laser beam 17 is very short, which tends to suppress rise in temperature in a part near the irradiation part of the picosecond laser beam 17. As a result, there is less tendency of causing a heat-affected zone, which improves finishing accuracy of the inner wall of the prepared hole 23L to make the inner wall smoother. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、仕上げ加工方法の改良に関するものである。   The present invention relates to an improvement in a finishing method.

従来の仕上げ加工方法として、レーザー光線によってワークに過***を開けた後、この過***を放電加工で仕上げ加工することが知られている（例えば、特許文献１参照。）。
特許第２６２３２９６号公報 As a conventional finishing method, it is known that after forming an under hole in a workpiece with a laser beam, the under hole is finished by electric discharge machining (see, for example, Patent Document 1).
Japanese Patent No. 2623296

特許文献１の第４Ａ図及び第４Ｂ図を以下の図４（ａ），（ｂ）で説明する。なお、符号は振り直した。
図４（ａ），（ｂ）は従来の仕上げ加工方法を示す作用図である。
（ａ）はレーザーヘッド１０１から発射されたレーザー光線１０２でノズル部品１０３に過***１０４を開けた状態を示す。 4A and 4B of Patent Document 1 will be described with reference to FIGS. 4A and 4B below. In addition, the code | symbol was reassigned.
4A and 4B are operation diagrams showing a conventional finishing method.
(A) shows a state in which an underhole 104 is formed in the nozzle component 103 with a laser beam 102 emitted from the laser head 101.

（ｂ）は過***１０４に放電加工用のワイヤ電極１０６を挿入しながら過***１０４の壁１０７を仕上げ加工することを示す。放電加工であるから、壁１０７の仕上げ精度は高い。   FIG. 6B shows that the wall 107 of the underhole 104 is finished while the wire electrode 106 for electric discharge machining is inserted into the underhole 104. Since it is electric discharge machining, the finishing accuracy of the wall 107 is high.

上記した過***１０４の壁１０７の仕上げ加工を更に短時間に行い、生産性を向上させるためには、高い仕上げ精度を確保しつつ放電加工よりも更に高速な加工方法が望まれる。   In order to finish the above-described finishing of the wall 107 of the under hole 104 in a shorter time and improve productivity, a processing method that is faster than electric discharge machining is desired while ensuring high finishing accuracy.

本発明の目的は、下穴内壁の仕上げ加工精度を高めつつ、仕上げ加工をより短時間に行うことにある。   An object of the present invention is to perform finishing in a shorter time while improving the finishing accuracy of the inner wall of the prepared hole.

請求項１に係る発明は、部材に下穴を開けた後、この下穴の内壁にピコ秒レーザ光を照射して内壁を平滑に仕上げ加工することを特徴とする。
作用として、部材に予め下穴を開け、次に、下穴の内壁にピコ秒レーザ光を照射する。
ピコ秒レーザ光では、従来のような放電加工で仕上げ加工するのに比べてエネルギー密度を大きくすることが可能であり、ピコ秒レーザ光が部材に照射された時には部材の照射部分の温度が瞬時に高温になり、仕上げ加工をより短時間で行える。 The invention according to claim 1 is characterized in that after preparing a pilot hole in a member, the inner wall of the pilot hole is irradiated with picosecond laser light to finish the inner wall smoothly.
As an action, a pilot hole is made in the member in advance, and then the inner wall of the pilot hole is irradiated with a picosecond laser beam.
With picosecond laser light, it is possible to increase the energy density as compared with conventional finishing by electrical discharge machining. When the member is irradiated with picosecond laser light, the temperature of the irradiated part of the member is instantaneous. The temperature becomes extremely high and finishing can be performed in a shorter time.

また、ピコ秒レーザ光のパルス幅が非常に小さい、即ち、ピコ秒レーザ光の照射時間が非常に短いため、ピコ秒レーザ光の照射部分に近い部分の温度が上昇しにくく、熱影響部が生じにくいから、下穴内壁の仕上げ精度が向上し、下穴内壁がより平滑になる。   Also, the pulse width of the picosecond laser beam is very small, that is, the irradiation time of the picosecond laser beam is very short, so the temperature of the portion near the irradiated portion of the picosecond laser beam is difficult to rise, and the heat affected zone Since it does not occur easily, the finishing accuracy of the inner wall of the pilot hole is improved, and the inner wall of the pilot hole becomes smoother.

請求項２に係る発明は、ピコ秒レーザ光を下穴の内径よりも小さく集光させ、下穴の内壁を蒸発除去加工することを特徴とする。
作用として、ピコ秒レーザ光を下穴の内径よりも小さく集光させ、下穴の内壁に照射して内壁を溶融、そして蒸発させる蒸発除去加工で徐々に除去すれば、下穴内壁の仕上げ精度が向上する。更に、ピコ秒レーザ光による熱影響部が生じにくいことからも、下穴内壁の仕上げ精度がより一層向上し、下穴内壁がより平滑になる。 The invention according to claim 2 is characterized in that the picosecond laser beam is condensed smaller than the inner diameter of the pilot hole, and the inner wall of the pilot hole is evaporated and removed.
As a function, if the picosecond laser beam is focused to be smaller than the inner diameter of the pilot hole, the inner wall of the pilot hole is irradiated to melt and evaporate the inner wall, and then removed gradually, the finishing accuracy of the inner wall of the pilot hole Will improve. Furthermore, since the heat-affected zone due to the picosecond laser beam is hardly generated, the finishing accuracy of the inner wall of the pilot hole is further improved, and the inner wall of the pilot hole becomes smoother.

請求項３に係る発明は、ピコ秒レーザ光を部材と相対的に旋回させながら照射することを特徴とする。
作用として、ピコ秒レーザ光が下穴内壁の各部に均等に照射され、内壁の仕上げ精度がより向上する。また、ピコ秒レーザ光が下穴に局部的に照射されることがないため、熱影響部がより一層生じにくい。 The invention according to claim 3 is characterized in that a picosecond laser beam is irradiated while rotating relative to the member.
As an effect, picosecond laser light is evenly applied to each part of the inner wall of the prepared hole, and the finishing accuracy of the inner wall is further improved. In addition, since the picosecond laser beam is not locally irradiated to the pilot hole, the heat affected zone is less likely to occur.

請求項４に係る発明は、ピコ秒レーザ光を内壁に照射したときに内壁が溶融し蒸発して発生する蒸気を蒸気除去装置で吸引又は圧送することを特徴とする。
作用として、発生した蒸気が蒸気除去装置で吸引又は圧送されるため、蒸気によってピコ秒レーザ光が遮られることがない。 The invention according to claim 4 is characterized in that when the inner wall is irradiated with picosecond laser light, the inner wall is melted and evaporated to suck or pump the vapor generated by the vapor removing device.
As an effect, the generated steam is sucked or pumped by the steam removing device, so that the picosecond laser beam is not blocked by the steam.

請求項５に係る発明は、ピコ秒レーザ光を発振するレーザ発振器のピーク出力は、３００ｋＷ〜１ＭＷであることを特徴とする。
作用として、レーザ発振器のピーク出力が３００ｋＷ未満では、例えば、部材を金属とした場合には、金属蒸発が発生しにくくなり、蒸発除去加工に多くの時間を要する。
レーザ発振器のピーク出力が１ＭＷを超えると、下穴の内壁に熱影響部が生じやすくなる。 The invention according to claim 5 is characterized in that the peak output of the laser oscillator that oscillates the picosecond laser beam is 300 kW to 1 MW.
As an effect, when the peak output of the laser oscillator is less than 300 kW, for example, when the member is made of metal, metal evaporation hardly occurs and much time is required for evaporation removal processing.
When the peak output of the laser oscillator exceeds 1 MW, a heat affected zone is likely to occur on the inner wall of the prepared hole.

請求項６に係る発明は、ピコ秒レーザ光のパルス繰返し周期のうちの非照射時間を、パルス繰返し周期のうちのパルス幅の５００倍以上としたことを特徴とする。
作用として、ピコ秒レーザ光のパルス繰返し周期のうちの非照射時間が、パルス繰返し周期のうちのパルス幅の５００倍未満であると、部材への入熱量が大きくなり、下穴内壁で熱影響部が生じやすくなる。 The invention according to claim 6 is characterized in that the non-irradiation time in the pulse repetition period of the picosecond laser beam is 500 times or more of the pulse width in the pulse repetition period.
As an effect, if the non-irradiation time in the pulse repetition period of the picosecond laser beam is less than 500 times the pulse width of the pulse repetition period, the amount of heat input to the member is increased, and the heat effect on the inner wall of the pilot hole Part tends to occur.

請求項１に係る発明では、部材に下穴を開けた後、この下穴の内壁にピコ秒レーザ光を照射して内壁を平滑に仕上げ加工するので、下穴内壁に熱影響部が生じにくくなり、下穴内壁を精度良く平滑に仕上げることができるとともに、ピコ秒レーザ光の高エネルギー密度によって下穴内壁をより短時間に仕上げることができる。   In the invention according to claim 1, since the inner wall of the pilot hole is irradiated with a picosecond laser beam to finish the inner wall smoothly after the pilot hole is made in the member, a heat-affected zone is hardly generated on the inner wall of the pilot hole. Thus, the inner wall of the pilot hole can be finished with high accuracy and smoothness, and the inner wall of the pilot hole can be finished in a shorter time due to the high energy density of the picosecond laser beam.

請求項２に係る発明では、ピコ秒レーザ光を下穴の内径よりも小さく集光させ、下穴の内壁を蒸発除去加工するので、下穴の内壁の小さな範囲を徐々に蒸発除去加工することができ、下穴の内壁をより精度よく平滑に加工することができる。   In the invention according to claim 2, since the picosecond laser beam is condensed to be smaller than the inner diameter of the pilot hole and the inner wall of the pilot hole is evaporated and removed, the small area of the inner wall of the pilot hole is gradually evaporated and removed. And the inner wall of the pilot hole can be processed more accurately and smoothly.

請求項３に係る発明では、ピコ秒レーザ光を部材と相対的に旋回させながら照射するので、ピコ秒レーザ光を下穴の内壁の各部により均等に照射することができ、下穴の内壁をより平滑に仕上げることができる。また、下穴に局部的に照射されることがないため、熱影響部をより一層生じにくくすることができる。   In the invention according to claim 3, since the picosecond laser beam is irradiated while being rotated relative to the member, the picosecond laser beam can be evenly emitted from each part of the inner wall of the pilot hole. Smoother finish. Moreover, since the pilot hole is not locally irradiated, the heat affected zone can be made more difficult to occur.

請求項４に係る発明では、ピコ秒レーザ光を内壁に照射したときに内壁が溶融し蒸発して発生する蒸気を蒸気除去装置で吸引又は圧送するので、蒸気によってピコ秒レーザ光が遮られることがなく、良好に仕上げ加工することができる。   In the invention according to claim 4, since the vapor generated when the inner wall is melted and evaporated when the inner wall is irradiated with the picosecond laser beam is sucked or pumped by the vapor removing device, the picosecond laser beam is blocked by the vapor. There is no, and it can finish well.

請求項５に係る発明では、ピコ秒レーザ光を発振するレーザ発振器のピーク出力を、３００ｋＷ〜１ＭＷとしたので、下穴内壁の蒸発除去加工を短時間で行うことができるとともに下穴内壁に熱影響部を生じにくくすることができる。   In the invention according to claim 5, since the peak output of the laser oscillator that oscillates the picosecond laser beam is set to 300 kW to 1 MW, evaporation removal processing of the inner wall of the prepared hole can be performed in a short time and the inner wall of the prepared hole is heated. The affected part can be made difficult to occur.

請求項６に係る発明では、ピコ秒レーザ光のパルス繰返し周期のうちの非照射時間を、パルス繰返し周期のうちのパルス幅の５００倍以上としたので、ピコ秒レーザ光の非照射時間を大きくすることで、下穴内壁に熱影響部を生じにくくすることができる。   In the invention according to claim 6, since the non-irradiation time in the pulse repetition period of the picosecond laser beam is set to 500 times or more of the pulse width in the pulse repetition period, the non-irradiation time of the picosecond laser beam is increased. By doing so, it is possible to make it difficult to produce a heat affected zone on the inner wall of the prepared hole.

本発明を実施するための最良の形態を添付図に基づいて以下に説明する。なお、図面は符号の向きに見るものとする。
図１は本発明に係るレーザ加工装置の説明図であり、レーザ加工装置１０は、ナノ秒レーザ光１１を発振するナノ秒レーザ発振器１２と、ピコ秒レーザ光１３を発振する超短パルスレーザ発振器１４と、この超短パルスレーザ発振器１４から発振されたピコ秒レーザ光１３を増幅する増幅器１６と、この増幅器１６から出力されたピコ秒レーザ光１７を反射させるミラー１８と、ピコ秒レーザ光１７を透過させるとともにナノ秒レーザ発振器１２で発振されたナノ秒レーザ光１１を反射させるミラー２１と、これらのナノ秒レーザ光１１又はピコ秒レーザ光１７の集光位置を変化させるビームローテータ２２と、ナノ秒レーザ光１１又はピコ秒レーザ光１７をワーク２３（例えば、鋼材）に集光させる集光レンズ２４と、ワーク２３を載せるテーブル２６と、ワーク２３にナノ秒レーザ光１１又はピコ秒レーザ光１７を照射したときにワーク２３から発生する蒸気を吸引する吸引装置２７と、ナノ秒レーザ発振器１２、超短パルスレーザ発振器１４、ビームローテータ２２の作動及びテーブル２６の水平移動を制御する制御装置２８とからなる。なお、３１は吸引装置２７に備える吸引ダクトである。 The best mode for carrying out the present invention will be described below with reference to the accompanying drawings. The drawings are viewed in the direction of the reference numerals.
FIG. 1 is an explanatory diagram of a laser processing apparatus according to the present invention. A laser processing apparatus 10 includes a nanosecond laser oscillator 12 that oscillates a nanosecond laser beam 11 and an ultrashort pulse laser oscillator that oscillates a picosecond laser beam 13. 14, an amplifier 16 that amplifies the picosecond laser light 13 oscillated from the ultrashort pulse laser oscillator 14, a mirror 18 that reflects the picosecond laser light 17 output from the amplifier 16, and a picosecond laser light 17 And a mirror 21 that reflects the nanosecond laser light 11 oscillated by the nanosecond laser oscillator 12, a beam rotator 22 that changes a condensing position of the nanosecond laser light 11 or the picosecond laser light 17, and A condenser lens 24 for condensing the nanosecond laser beam 11 or the picosecond laser beam 17 onto a workpiece 23 (for example, a steel material), and the workpiece 23 are mounted. A suction device 27 for sucking vapor generated from the work 23 when the work 23 is irradiated with the nanosecond laser light 11 or the picosecond laser light 17, a nanosecond laser oscillator 12, an ultrashort pulse laser oscillator 14, It comprises a control device 28 for controlling the operation of the beam rotator 22 and the horizontal movement of the table 26. Reference numeral 31 denotes a suction duct provided in the suction device 27.

ナノ秒レーザ光１１は、ナノ秒レーザ発振器１２でパルス発振により生成されたパルスレーザ光であり、そのパルス幅がナノ秒のオーダー、即ち１０−９秒のオーダーのものである。
ナノ秒レーザ発振器１２は、レーザ媒質（即ち、発光物質）としてＹＡＧ等を用いたものである。 The nanosecond laser beam 11 is a pulse laser beam generated by pulse oscillation with the nanosecond laser oscillator 12 and has a pulse width of the order of nanoseconds, that is, the order of 10 −9 seconds.
The nanosecond laser oscillator 12 uses YAG or the like as a laser medium (that is, a light emitting substance).

ピコ秒レーザ光１３は、超短パルスレーザ発振器１４でパルス発振により生成されたパルスレーザ光であり、そのパルス幅がピコ秒のオーダー、即ち１０−１２秒のオーダーのものである。 The picosecond laser beam 13 is a pulse laser beam generated by pulse oscillation in the ultrashort pulse laser oscillator 14 and has a pulse width on the order of picoseconds, that is, on the order of 10-12 seconds.

超短パルスレーザ発振器１４は、レーザ媒質としてイットリビウム（Ｙｔｔｅｒｂｉｕｍ）を用いたものであり、例えば、パルス繰返し周波数が５００ｋＨｚ〜１００ＭＨｚのシード光（種光）用レーザを発振することができるシード光用レーザ発振器である。このようなシード光用レーザ発振器は市販されているため、安価に入手することができる。   The ultrashort pulse laser oscillator 14 uses ytterbium as a laser medium. For example, a seed light laser capable of oscillating a seed light (seed light) laser having a pulse repetition frequency of 500 kHz to 100 MHz. It is an oscillator. Since such a laser oscillator for seed light is commercially available, it can be obtained at low cost.

まず、以上に述べたナノ秒レーザ光１１によってワーク２３に下穴を開ける下穴加工工程を次に説明する。
図２（ａ）〜（ｅ）は本発明に係るレーザ加工装置による下穴加工工程を示す作用図である。
（ａ）において、ワーク２３の上面２３ａに集光レンズの焦点が一致するように調整してワーク２３の上面２３ａにナノ秒レーザ光１１を照射する。なお、Ｄ０は焦点におけるナノ秒レーザ光１１の集光径（即ち、スポット径）であり、例えば、集光径Ｄ０＝約１００μｍである。
これにより、ワーク２３の上面２３ａは融点に達して溶融し始める。２３ｂは溶融部である。 First, a pilot hole machining process for making a pilot hole in the work 23 with the nanosecond laser beam 11 described above will be described next.
2 (a) to 2 (e) are operational views showing a prepared hole machining step by the laser machining apparatus according to the present invention.
In (a), adjustment is made so that the focal point of the condenser lens coincides with the upper surface 23 a of the work 23, and the upper surface 23 a of the work 23 is irradiated with the nanosecond laser beam 11. Note that D0 is a condensing diameter (that is, a spot diameter) of the nanosecond laser beam 11 at the focal point, for example, a condensing diameter D0 = about 100 μm.
Thereby, the upper surface 23a of the work 23 reaches the melting point and starts to melt. 23b is a melting part.

ナノ秒レーザ光１１は、その横断面形状が円形でない場合には、その光軸を回転させることで横断面を円形にすることがある。しかし、光軸を回転させると、回転させる装置の精度によりナノ秒レーザ光のワークへの照射部分が広がり、加工径が大きくなる。   When the cross-sectional shape of the nanosecond laser beam 11 is not circular, the cross-section may be circular by rotating its optical axis. However, when the optical axis is rotated, the portion irradiated with the nanosecond laser light on the workpiece is widened by the accuracy of the rotating device, and the processing diameter is increased.

本実施形態では、ナノ秒レーザ光１１の光軸を回転させないので、照射範囲を小さくすることができる。ただし、ワーク２３への照射部分は円形でなくなる場合があるので、後工程である仕上げ加工工程で仕上げ加工と共に円形となるように加工する。従って、特別に円形に加工する工程は設けていない。   In this embodiment, since the optical axis of the nanosecond laser beam 11 is not rotated, the irradiation range can be reduced. However, since the irradiated portion of the work 23 may not be circular, it is processed so as to be circular together with finishing in the finishing process, which is a subsequent process. Therefore, there is no special process for processing into a circle.

（ｂ）において、ナノ秒レーザ光１１が照射されたワーク２３には（ａ）のときよりも大きな溶融部２３ｄが出来る。
溶融部２３ｄの中央部は、周囲よりも温度が高いために、沸点に達して蒸気２３ｅが盛んに発生するため、蒸気２３ｅの圧力で外側に押し退けられる。この蒸気２３ｅがナノ秒レーザ光１１を遮ると、ワーク２３の穴開けに支障をきたすので、吸引装置の吸引ダクト３１から吸引する。 In (b), the workpiece 23 irradiated with the nanosecond laser beam 11 has a larger melted part 23d than in (a).
Since the temperature of the central part of the melting part 23d is higher than that of the surroundings, the boiling point reaches the boiling point, and the steam 23e is actively generated. Therefore, the melt part 23d is pushed outward by the pressure of the steam 23e. When the vapor 23e blocks the nanosecond laser beam 11, the hole 23 in the workpiece 23 is obstructed, so that the suction is performed from the suction duct 31 of the suction device.

（ｃ）は、ナノ秒レーザ光が照射されない非照射時間での状態を示す。（ｂ）に示した溶融部２３ｄの母材に近い部分は凝固して凝固部２３ｆとなり、この凝固部２３ｆの内側に未凝固状態にある溶融部２３ｇが残る。
以降は、（ｂ）及び（ｃ）と同様な照射と非照射とを繰り返す。 (C) shows the state in the non-irradiation time when the nanosecond laser beam is not irradiated. The part close to the base material of the melted part 23d shown in (b) is solidified to become a solidified part 23f, and an unsolidified melted part 23g remains inside the solidified part 23f.
Thereafter, irradiation and non-irradiation similar to (b) and (c) are repeated.

（ｄ）は、ワーク２３の上面２３ａから下面２３ｊに貫通する下穴２３Ｌが開けられた状態を示す。２３ｋは加工中に一旦溶融し、そして凝固して下穴２３Ｌの表層に出来た筒状の凝固部、２３ｍは凝固部２３ｋの周囲に出来た熱影響部（複数の点で示される層状の部分）、３３は下穴２３Ｌの内面である。   (D) shows a state in which a pilot hole 23L penetrating from the upper surface 23a to the lower surface 23j of the work 23 is opened. 23k is a cylindrical solidified portion which is once melted during processing and solidified to form a surface layer of the pilot hole 23L, and 23m is a heat affected zone (layered portions indicated by a plurality of points) formed around the solidified portion 23k. , 33 is an inner surface of the pilot hole 23L.

熱影響部２３ｍは、凝固部２３ｋと、ワーク２３の熱影響を受けていない部分（即ち、母材原質域）との間の部分で、母材に対して組織が変化している部分である。
ここで、下穴２３Ｌの内径（即ち、凝固部２３ｋの内径）をＤ１、凝固部２３ｋの外径をＤ２、熱影響部２３ｍの外径をＤ３、下穴２３Ｌの穴深さ（ここでは、ワーク２３の厚さに一致する。）をｄｅとする。下穴２３Ｌの穴深さｄｅは、例えば、小さくとも１ｍｍである。
上記した凝固部２３ｋの層厚さ（Ｄ２−Ｄ１）／２は、下穴２３Ｌの内径Ｄ１の１０〜４０％である。 The heat-affected zone 23m is a portion between the solidified portion 23k and a portion not affected by the heat of the work 23 (that is, a base material raw material region), and is a portion where the structure is changed with respect to the base material. is there.
Here, the inner diameter of the pilot hole 23L (that is, the inner diameter of the solidified portion 23k) is D1, the outer diameter of the solidified portion 23k is D2, the outer diameter of the heat affected zone 23m is D3, and the hole depth of the lower hole 23L (here, De equals the thickness of the work 23). The hole depth de of the lower hole 23L is, for example, at least 1 mm.
The layer thickness (D2-D1) / 2 of the solidified portion 23k described above is 10 to 40% of the inner diameter D1 of the pilot hole 23L.

（ｅ）は、（ａ）〜（ｃ）に示したナノ秒レーザ光の発振器であるナノ秒レーザ発振器１２（図１参照）の出力と時間との関係を示すグラフであり、縦軸は出力、横軸は時間を表す。
ナノ秒レーザ発振器の出力はゼロからピーク出力Ｐ１までパルス状に変化する。図中のＴ１はパルス幅、即ちナノ秒レーザ光の照射時間（即ち、パルス幅Ｔ１は１０−９秒のオーダーである。）、Ｔ２はナノ秒レーザ光の非照射時間、Ｔ０はパルス繰返し周期である。このパルス繰返し周期Ｔ０から求められるパルス繰返し周波数（発振周波数）は、例えば、１ｋＨｚ〜５０ｋＨｚである。 (E) is a graph which shows the relationship between the output of nanosecond laser oscillator 12 (refer FIG. 1) which is an oscillator of the nanosecond laser beam shown to (a)-(c), and time, and a vertical axis | shaft is output. The horizontal axis represents time.
The output of the nanosecond laser oscillator changes in a pulse shape from zero to the peak output P1. In the figure, T1 is the pulse width, that is, the irradiation time of the nanosecond laser beam (that is, the pulse width T1 is on the order of 10-9 seconds), T2 is the non-irradiation time of the nanosecond laser beam, and T0 is the pulse repetition period. It is. The pulse repetition frequency (oscillation frequency) obtained from this pulse repetition period T0 is, for example, 1 kHz to 50 kHz.

このように、パルスレーザ光であるナノ秒レーザ光をワークにパルス繰返し周期Ｔ０毎に照射時間Ｔ１だけ照射することで、段階的に母材を溶融・蒸発させて下穴加工することができる。   In this way, by irradiating the workpiece with the nanosecond laser beam, which is a pulsed laser beam, for the irradiation time T1 at each pulse repetition period T0, the base material can be melted and evaporated stepwise to form the pilot hole.

ナノ秒レーザ光では、照射時間がピコ秒レーザ光に比べて長いため、パルスエネルギーを大きくすることができ、蒸発除去加工量を多くすることができて、下穴をより高速で開けることができる。   With nanosecond laser light, the irradiation time is longer than with picosecond laser light, so the pulse energy can be increased, the amount of evaporation removal can be increased, and the pilot hole can be opened at a higher speed. .

次に、以上に述べたピコ秒レーザ光１７によってワーク２３の下穴２３Ｌの内壁を仕上げる仕上げ加工工程を説明する。
図３（ａ）〜（ｄ）は本発明に係るレーザ加工装置による下穴の仕上げ加工工程を示す作用図である。
（ａ）において、前工程である下穴加工工程では、下穴２３Ｌの表層に精度を低下させる凝固部２３ｋが残っているので、この凝固部２３ｋ（あるいは凝固部２３ｋとこの周囲の熱影響部２３ｍ）をピコ秒レーザ光１７で除去する。本実施形態では下穴２３Ｌに出来ている凝固部２３ｋを厚さを有する内壁とし、この内壁にピコ秒レーザ光１７を照射して除去し、内面の精度が高い平滑な穴を形成する。 Next, the finishing process for finishing the inner wall of the pilot hole 23L of the work 23 with the picosecond laser beam 17 described above will be described.
3 (a) to 3 (d) are operational views showing a finishing process of the prepared hole by the laser processing apparatus according to the present invention.
In (a), in the pilot hole machining step, which is the previous process, the solidified portion 23k that reduces the accuracy remains on the surface layer of the pilot hole 23L, so this solidified portion 23k (or the solidified portion 23k and the surrounding heat affected zone) 23 m) is removed by the picosecond laser beam 17. In the present embodiment, the solidified portion 23k formed in the prepared hole 23L is used as an inner wall having a thickness, and the inner wall is removed by irradiating the picosecond laser beam 17 to form a smooth hole with high accuracy on the inner surface.

まず、ワーク２３の凝固部２３ｋの上端面に集光レンズの焦点が一致するように調整して、ビームローテータによってピコ秒レーザ光１７が筒状の凝固部２３ｋの端面に常に照射されるように渦巻き状に照射される位置を変更する。（凝固部２３ｋと熱影響部２３ｍとを除去する場合は、凝固部２３ｋと熱影響部２３ｍとの両端面にピコ秒レーザ光１７を照射する。）
これにより、ワーク２３の凝固部２３ｋは渦巻き状に除去される。 First, adjustment is made so that the focal point of the condensing lens coincides with the upper end surface of the solidified part 23k of the work 23, and the end face of the cylindrical solidified part 23k is always irradiated by the beam rotator. Change the position of the spiral irradiation. (When removing the solidified part 23k and the heat affected part 23m, the picosecond laser beam 17 is irradiated to both end faces of the solidified part 23k and the heat affected part 23m.)
Thereby, the solidified part 23k of the workpiece 23 is removed in a spiral shape.

（ｂ）は凝固部２３ｋの除去の途中の状態を示す。ピコ秒レーザ光１７を照射中は、凝固部２３ｋが沸点に達して蒸気２３ｐが発生するため、この蒸気２３ｐを吸引装置の吸引ダクト３１（吸引ダクト３１は吸引ダクト３１ａ，３１ｂからなる。）で吸引し、蒸気２３ｐによって仕上げ加工が阻害されるのを防止する。   (B) shows the state in the middle of removal of the solidification part 23k. During the irradiation with the picosecond laser beam 17, the solidification part 23k reaches the boiling point and the vapor 23p is generated. Therefore, the vapor 23p is generated by the suction duct 31 of the suction device (the suction duct 31 includes suction ducts 31a and 31b). Suction is performed to prevent the finishing process from being hindered by the steam 23p.

仕上げ加工が進むにつれて、ピコ秒レーザ１７の入光側とは反対側の吸引ダクト３１ｂで吸引する方がよい。レーザ光を遮ることなく加工することができるからである。例えば、入光側から焦点位置までの距離に比して、吸引ダクト３１ｂの負圧を上げるように図示しない制御手段で制御してもよいし、また、吸引ダクト３１ａを利用して、吸引ダクト３１ａから気体を噴出させて気流を作り、入光側とは反対側から吸引ダクト３１ｂで気体と共に蒸気２３ｐを吸引してもよい。   As the finishing process progresses, it is better to suck by the suction duct 31b on the side opposite to the light incident side of the picosecond laser 17. This is because processing can be performed without blocking the laser beam. For example, it may be controlled by a control means (not shown) so as to increase the negative pressure of the suction duct 31b as compared with the distance from the light incident side to the focal position, or by using the suction duct 31a. Gas may be ejected from 31a to create an air flow, and the vapor 23p may be sucked together with the gas by the suction duct 31b from the side opposite to the light incident side.

凝固部２３ｋの除去は、引き続きワーク２３の下面まで行う。なお、３５は下穴２３Ｌの仕上げ加工が完了した仕上げ完了穴であり、仕上げ完了穴３５の内面３６は精度良く平滑に仕上げられている。   The removal of the solidified portion 23k is continued up to the lower surface of the work 23. Reference numeral 35 denotes a finishing completion hole in which the finishing process of the pilot hole 23L is completed, and the inner surface 36 of the finishing completion hole 35 is finished with high accuracy and smoothness.

ピコ秒レーザ１７による蒸発除去加工中は、後述するように加工部分に近い部分、即ち、仕上げ完了穴３５に熱影響部が生じにくい。仕上げ完了穴３５の内壁３６はもともと熱影響部２３ｍであるが、この熱影響部２３ｍの熱影響度合がピコ秒レーザ１７による加工を行っても更に大きくなりにくい。
凝固部２３ｋと熱影響部２３ｍとの両方をピコ秒レーザ１７で蒸発除去加工した場合には、熱影響部２３ｍに隣接していた母材には熱影響部が生じにくい。 During evaporation removal processing by the picosecond laser 17, a heat-affected zone is unlikely to occur in a portion close to the processing portion, that is, the finish completion hole 35 as described later. The inner wall 36 of the finish completion hole 35 is originally the heat affected zone 23m. However, even if the degree of heat affected by the heat affected zone 23m is processed by the picosecond laser 17, the inner wall 36 is hardly increased.
When both the solidified part 23k and the heat affected part 23m are evaporated and removed by the picosecond laser 17, the heat affected part hardly occurs in the base material adjacent to the heat affected part 23m.

（ｃ）は凝固部２３ｋの平面図であり、この凝固部２３ｋに集光径Ｄ４のピコ秒レーザ光１７を矢印の向きに回転させながら照射する状態を示す。ピコ秒レーザ光１７の集光径Ｄ４は、例えば、５μｍである。   (C) is a plan view of the coagulation part 23k, and shows a state in which the coagulation part 23k is irradiated with the picosecond laser light 17 having a condensed diameter D4 rotated in the direction of the arrow. The condensing diameter D4 of the picosecond laser beam 17 is, for example, 5 μm.

（ｄ）は、（ａ），（ｂ）に示したピコ秒レーザ光の発振器である超短パルスレーザ発振器１４（図１参照）の出力と時間との関係を示すグラフであり、縦軸は出力、横軸は時間を表す。
超短パルスレーザ発振器の出力はゼロからピーク出力Ｐ２までパルス状に変化する。図中のＴ４はパルス幅、即ちピコ秒レーザ光の照射時間（即ち、パルス幅Ｔ４は１０−１２秒のオーダーである。）、Ｔ５はピコ秒レーザ光の非照射時間、Ｔ３はパルス繰返し周期である。 (D) is a graph showing the relationship between the output and time of the ultrashort pulse laser oscillator 14 (see FIG. 1) which is an oscillator of the picosecond laser beam shown in (a) and (b), and the vertical axis is Output, horizontal axis represents time.
The output of the ultrashort pulse laser oscillator changes in a pulse shape from zero to the peak output P2. In the figure, T4 is the pulse width, that is, the irradiation time of the picosecond laser beam (that is, the pulse width T4 is on the order of 10-12 seconds), T5 is the non-irradiation time of the picosecond laser beam, and T3 is the pulse repetition period. It is.

上記の非照射時間Ｔ５は、例えば、パルス幅Ｔ４の５００倍以上の時間である。
パルス繰返し周期Ｔ３から求められるパルス繰返し周波数（発振周波数）は、例えば、１００ｋＨｚ〜１．１ＭＨｚである。 The non-irradiation time T5 is, for example, a time that is 500 times or more the pulse width T4.
The pulse repetition frequency (oscillation frequency) obtained from the pulse repetition period T3 is, for example, 100 kHz to 1.1 MHz.

このように、エネルギー密度を高くすることが可能なピコ秒レーザ光をワークにパルス繰返し周期Ｔ３毎に照射時間Ｔ４だけ照射することで、段階的に瞬時に母材を溶融・蒸発させて下穴２３Ｌの凝固部２３ｋを削除して高速で仕上げ加工することができる。   In this way, by irradiating the workpiece with the picosecond laser beam capable of increasing the energy density for the irradiation time T4 every pulse repetition period T3, the base material is instantaneously melted and evaporated step by step. The 23L solidified part 23k can be deleted and finished at high speed.

また、ピコ秒レーザ光で仕上げ加工を行う場合には、パルス繰返し周期Ｔ３に非照射時間Ｔ５を有するから、この非照射時間Ｔ５でワークへの入熱をコントロールすることができ、連続発振によるレーザ光に比べて、ワークの照射箇所近傍での温度上昇を抑えることができ、熱影響部を生じにくくすることができる。   In addition, when finishing with picosecond laser light, the pulse repetition period T3 has a non-irradiation time T5. Therefore, the heat input to the workpiece can be controlled by this non-irradiation time T5, and laser by continuous oscillation is used. Compared with light, the temperature rise in the vicinity of the irradiated part of the workpiece can be suppressed, and the heat-affected zone can be made difficult to occur.

以上の図３（ａ）〜（ｄ）に示したように、本発明は第１に、部材としてのワーク２３に下穴２３Ｌを開けた後、この下穴２３Ｌの内壁（凝固部２３ｋ）にピコ秒レーザ光１７を照射して内壁を平滑に仕上げ加工することを特徴とする。   As shown in FIGS. 3A to 3D above, according to the present invention, first, after preparing a pilot hole 23L in the work 23 as a member, an inner wall (solidified portion 23k) of the pilot hole 23L is formed. The inner wall is smoothly finished by irradiating the picosecond laser beam 17.

ピコ秒レーザ光１７では、従来のような放電加工で仕上げ加工するのに比べてエネルギー密度を大きくすることができ、ピコ秒レーザ光１７がワーク２３に照射された時にはワーク２３の照射部分の温度が瞬時に高温になり、仕上げ加工をより短時間で行うことができる。   The picosecond laser beam 17 can increase the energy density as compared with the conventional finish processing by electric discharge machining. When the workpiece 23 is irradiated with the picosecond laser beam 17, the temperature of the irradiated portion of the workpiece 23 is increased. Becomes a high temperature instantly, and finishing can be performed in a shorter time.

また、ピコ秒レーザ光１７のパルス幅Ｔ４が非常に小さいため、ピコ秒レーザ光１７の照射部分に近い部分の温度が上昇しにくく、熱影響部が生じにくいから、下穴２３Ｌの内壁の仕上げ精度が向上し、下穴２３Ｌの内壁をより平滑にすることができる。   Further, since the pulse width T4 of the picosecond laser beam 17 is very small, the temperature near the irradiated portion of the picosecond laser beam 17 is unlikely to rise, and a heat affected zone is unlikely to occur, so the inner wall of the pilot hole 23L is finished. The accuracy is improved, and the inner wall of the prepared hole 23L can be made smoother.

本発明は第２に、ピコ秒レーザ光１７を下穴２３Ｌの内径Ｄ１（図２（ｄ）参照）よりも小さく集光させ、下穴２３Ｌの内壁を蒸発除去加工することを特徴とする。
ピコ秒レーザ光１７を下穴２３Ｌの内径Ｄ１よりも小さく集光させ、下穴２３Ｌの内壁に照射して内壁を溶融、そして蒸発させる蒸発除去加工で小さな範囲を徐々に除去すれば、下穴２３Ｌの内壁の仕上げ精度を向上させることができる。
更に、ピコ秒レーザ光１７による熱影響部が生じにくいことからも、下穴２３Ｌの内壁の仕上げ精度がより一層向上し、下穴２３Ｌの内壁をより平滑にすることができる。 Second, the present invention is characterized in that the picosecond laser beam 17 is condensed to be smaller than the inner diameter D1 of the pilot hole 23L (see FIG. 2D), and the inner wall of the pilot hole 23L is evaporated and removed.
If the picosecond laser beam 17 is condensed to be smaller than the inner diameter D1 of the pilot hole 23L, the inner wall of the pilot hole 23L is irradiated to melt and evaporate the inner wall, and a small range is gradually removed to remove the pilot hole The finishing accuracy of the inner wall of 23L can be improved.
Furthermore, since the heat affected zone due to the picosecond laser beam 17 is less likely to occur, the finishing accuracy of the inner wall of the pilot hole 23L can be further improved, and the inner wall of the pilot hole 23L can be made smoother.

本発明は第３に、ピコ秒レーザ光１７をワーク２３と相対的に旋回させながら照射することを特徴とする。
これにより、ピコ秒レーザ光１７を下穴２３Ｌの内壁の各部により均等に照射することができ、下穴２３Ｌの内壁をより平滑に仕上げることができる。また、下穴２３Ｌの内壁に局部的に照射されることがないため、熱影響部をより一層生じにくくすることができる。 Third, the present invention is characterized in that the picosecond laser beam 17 is irradiated while turning relative to the work 23.
Thereby, the picosecond laser beam 17 can be evenly irradiated to each part of the inner wall of the pilot hole 23L, and the inner wall of the pilot hole 23L can be finished more smoothly. In addition, since the inner wall of the prepared hole 23L is not locally irradiated, the heat affected zone can be made more difficult to occur.

本発明は第４に、ピコ秒レーザ光１７を内壁に照射したときに内壁が溶融し蒸発して発生する蒸気２３ｅを蒸気除去装置としての吸引装置２７で吸引することを特徴とする。
これにより、蒸気２３ｅによってピコ秒レーザ光１７が遮られることがなく、良好に仕上げ加工することができる。 Fourthly, the present invention is characterized in that a vapor 23e generated by melting and evaporating the inner wall when the inner wall is irradiated with the picosecond laser light 17 is sucked by a suction device 27 as a vapor removing device.
As a result, the picosecond laser beam 17 is not blocked by the vapor 23e, and finish processing can be performed satisfactorily.

本発明は第５に、ピコ秒レーザ光１７を発振する超短パルスレーザ発振器１４（図１参照）のピーク出力は、３００ｋＷ〜１ＭＷであることを特徴とする。
超短パルスレーザ発振器１４のピーク出力が３００ｋＷ未満では、例えば、ワーク２３を金属とした場合には、金属蒸発が発生しにくくなり、蒸発除去加工に多くの時間を要する。
超短パルスレーザ発振器１４のピーク出力が１ＭＷを超えると、下穴２３Ｌの内壁に熱影響部が生じやすくなる。 Fifth, the present invention is characterized in that the peak output of the ultrashort pulse laser oscillator 14 (see FIG. 1) that oscillates the picosecond laser light 17 is 300 kW to 1 MW.
When the peak output of the ultrashort pulse laser oscillator 14 is less than 300 kW, for example, when the workpiece 23 is made of metal, metal evaporation hardly occurs and much time is required for evaporation removal processing.
When the peak output of the ultrashort pulse laser oscillator 14 exceeds 1 MW, a heat affected zone is likely to occur on the inner wall of the prepared hole 23L.

従って、本発明では、超短パルスレーザ発振器１４のピーク出力を、３００ｋＷ〜１ＭＷとしたので、下穴２３Ｌの内壁の蒸発除去加工を短時間で行うことができるとともに下穴２３Ｌの内壁に熱影響部を生じにくくすることができる。   Therefore, in the present invention, since the peak output of the ultrashort pulse laser oscillator 14 is set to 300 kW to 1 MW, evaporation removal processing of the inner wall of the pilot hole 23L can be performed in a short time and the inner wall of the pilot hole 23L is affected by heat. The part can be made difficult to occur.

本発明は第６に、ピコ秒レーザ光１７のパルス繰返し周期Ｔ３のうちの非照射時間Ｔ５を、パルス繰返し周期Ｔ３のうちのパルス幅Ｔ４の５００倍以上としたことを特徴とする。   Sixth, the present invention is characterized in that the non-irradiation time T5 in the pulse repetition period T3 of the picosecond laser beam 17 is 500 times or more the pulse width T4 in the pulse repetition period T3.

ピコ秒レーザ光１７のパルス繰返し周期Ｔ３のうちの非照射時間Ｔ５が、パルス繰返し周期Ｔ３のうちのパルス幅Ｔ４の５００倍未満であると、ワーク２３への入熱量が大きくなり、下穴２３Ｌの内壁で熱影響部が生じやすくなる。   If the non-irradiation time T5 in the pulse repetition period T3 of the picosecond laser beam 17 is less than 500 times the pulse width T4 in the pulse repetition period T3, the amount of heat input to the work 23 increases, and the pilot hole 23L A heat-affected zone is likely to be generated on the inner wall.

従って、本発明では、ピコ秒レーザ光１７の非照射時間Ｔ５をパルス幅Ｔ４の５００倍以上としたので、ピコ秒レーザ光１７の非照射時間Ｔ５を大きくすることができ、下穴２３Ｌの内壁に熱影響部を生じにくくすることができる。   Therefore, in the present invention, the non-irradiation time T5 of the picosecond laser light 17 is set to 500 times or more of the pulse width T4, so the non-irradiation time T5 of the picosecond laser light 17 can be increased, and the inner wall of the pilot hole 23L The heat-affected zone can be made difficult to occur.

尚、本実施形態では、図２に示したように、ナノ秒レーザ光１１でワーク２３の下穴２３Ｌを開けたが、これに限らず、切削加工、塑性加工等のレーザ加工以外の加工で穴２３Ｌを開けてもよい。   In the present embodiment, as shown in FIG. 2, the pilot hole 23 </ b> L is opened with the nanosecond laser beam 11. However, the present invention is not limited to this, and machining other than laser machining such as cutting and plastic machining is performed. The hole 23L may be opened.

本実施形態では、図１に示したように、蒸気除去装置として吸引装置２７を用いたが、これに限らず、蒸気除去装置として、蒸気に圧縮空気を吹き付けて蒸気を圧送することで蒸気がピコ秒レーザ光を遮るのを防止する圧送装置を用いてもよい。   In this embodiment, as shown in FIG. 1, the suction device 27 is used as the vapor removal device. However, the present invention is not limited to this, and the vapor removal device blows compressed air to the vapor to pump the vapor. A pumping device that prevents the picosecond laser light from being blocked may be used.

また、蒸気除去装置として、蒸気に液体窒素を吹き付けて蒸気を圧送してもよい。蒸気が急冷されて固化するので、部材に溶着してバリのように発生することを防止することができる。   Further, as the vapor removing device, the vapor may be pumped by blowing liquid nitrogen onto the vapor. Since the vapor is rapidly cooled and solidified, it is possible to prevent the vapor from being welded to the member and generating like a burr.

更に、図示しない圧送装置の制御装置で、圧送流量を下げる方向に制御し、金属蒸気を多く残るようにさせてレーザ光を遮って、レーザ光から部材への入熱量をコントロールするようにしてもよい。   Further, a control device for the pumping device (not shown) may be used to control the pumping flow rate so that a large amount of metal vapor remains so as to block the laser beam and control the amount of heat input from the laser beam to the member. Good.

本発明の仕上げ加工方法は、部材の穴の仕上げに好適である。   The finishing method of the present invention is suitable for finishing a hole in a member.

本発明に係るレーザ加工装置の説明図である。It is explanatory drawing of the laser processing apparatus which concerns on this invention. 本発明に係るレーザ加工装置による下穴加工工程を示す作用図である。It is an effect | action figure which shows the pilot hole manufacturing process by the laser processing apparatus which concerns on this invention. 本発明に係るレーザ加工装置による下穴の仕上げ加工工程を示す作用図である。It is an effect | action figure which shows the finishing process process of the pilot hole by the laser processing apparatus which concerns on this invention. 従来の仕上げ加工方法を示す作用図である。It is an effect | action figure which shows the conventional finishing method.

符号の説明Explanation of symbols

１４…レーザ発振器（超短パルスレーザ発振器）、１７…ピコ秒レーザ光、２２…ビームローテータ、２３…部材（ワーク）、２３ｐ…蒸気、２３ｋ…内壁（凝固部）、２３Ｌ…下穴、２７…蒸気除去装置（吸引装置）、Ｄ１…下穴の内径（凝固部の内径）、Ｔ３…ピコ秒レーザ光のパルス繰返し周期、Ｔ４…ピコ秒レーザ光のパルス幅、Ｔ５…ピコ秒レーザ光の非照射時間、Ｐ２…レーザ発振器の出力（超短パルスレーザ発振器のピーク出力）。   DESCRIPTION OF SYMBOLS 14 ... Laser oscillator (ultrashort pulse laser oscillator), 17 ... Picosecond laser beam, 22 ... Beam rotator, 23 ... Member (workpiece), 23p ... Steam, 23k ... Inner wall (solidification part), 23L ... Pilot hole, 27 ... Vapor removal device (suction device), D1... Inner diameter of pilot hole (inner diameter of solidified portion), T3... Pulse repetition period of picosecond laser light, T4... Pulse width of picosecond laser light, T5. Irradiation time, P2 ... Output of laser oscillator (peak output of ultrashort pulse laser oscillator).

Claims (6)

部材に下穴を開けた後、この下穴の内壁にピコ秒レーザ光を照射して前記内壁を平滑に仕上げ加工することを特徴とする仕上げ加工方法。   A finishing method comprising: forming a prepared hole in a member; and irradiating an inner wall of the prepared hole with a picosecond laser beam to finish the inner wall smoothly. 前記ピコ秒レーザ光を前記下穴の内径よりも小さく集光させ、前記下穴の内壁を蒸発除去加工することを特徴とする請求項１記載の仕上げ加工方法。   2. The finishing method according to claim 1, wherein the picosecond laser beam is condensed to be smaller than an inner diameter of the pilot hole, and an inner wall of the pilot hole is removed by evaporation. 前記ピコ秒レーザ光を前記部材と相対的に旋回させながら照射することを特徴とする請求項１又は請求項２記載の仕上げ加工方法。   The finishing method according to claim 1 or 2, wherein the picosecond laser light is irradiated while rotating relative to the member. 前記ピコ秒レーザ光を前記内壁に照射したときに内壁が溶融し蒸発して発生する蒸気を蒸気除去装置で吸引又は圧送することを特徴とする請求項１、請求項２又は請求項３記載の仕上げ加工方法。   The vapor | steam which an inner wall melt | dissolves and evaporates when the said picosecond laser beam is irradiated to the said inner wall is attracted | sucked or pumped with a vapor | steam removal apparatus, The Claim 2 or Claim 3 characterized by the above-mentioned. Finishing method. 前記ピコ秒レーザ光を発振するレーザ発振器のピーク出力は、３００ｋＷ〜１ＭＷであることを特徴とする請求項１〜請求項４のいずれか１項記載の仕上げ加工方法。   The finishing method according to any one of claims 1 to 4, wherein a peak output of a laser oscillator that oscillates the picosecond laser beam is 300 kW to 1 MW. 前記ピコ秒レーザ光のパルス繰返し周期のうちの非照射時間は、前記パルス繰返し周期のうちのパルス幅の５００倍以上であることを特徴とする請求項１〜請求項５のいずれか１項記載の仕上げ加工方法。   6. The non-irradiation time in the pulse repetition period of the picosecond laser beam is 500 times or more of the pulse width in the pulse repetition period. 6. Finishing method.
JP2006236465A 2006-08-31 2006-08-31 Method for finishing process Pending JP2008055478A (en)

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