JP2007519215A - 柔軟な半導体デバイス及び識別ラベル - Google Patents
柔軟な半導体デバイス及び識別ラベル Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Details Of Aerials (AREA)
- Support Of Aerials (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
基板と、相互接続構造における所望のパターンに従い相互接続される複数の半導体素子と共に与えられる集積回路を有する半導体デバイスであって、そのデバイスは第1の面と、反対にある第2の面とを持ち、第1の面に相互接続構造が存在し、第2の面に基板が存在する、その半導体デバイスを少なくとも1つ与えるステップと、
そのデバイスを柔軟にするために、デバイスの第2の面から基板を薄くするステップとを有する。
Claims (20)
- アクティブ領域に横方向に広がる半導体基板と、
前記半導体基板の表面に規定される複数の半導体素子を備え、柔軟であるために適切な厚さで存在する集積回路であって、前記素子が相互接続構造における所望のパターンに従い相互接続される集積回路と、
電気的に絶縁する物質の支持層と、
前記支持層に隣接する電気的に導電性のある層における前記アクティブ領域の外側に横方向に規定され、前記相互接続構造に電気的に接続されるアンテナであって、前記半導体基板が該アンテナと前記集積回路との間の非基板領域に存在しないアンテナとを有し、
少なくとも1つの導体が、前記電気的相互接続を構成するため前記相互接続構造から前記アンテナへ横方向に広がることを特徴とする柔軟な半導体デバイス。 - 前記集積回路が、いずれのボンドパッド構造をも持たない、請求項1に記載の柔軟な半導体デバイス。
- 前記集積回路が、パシベーションと共に与えられ、前記相互接続構造は、前記パシベーションと前記半導体基板との間に挟まれ、
前記支持層が、前記集積回路の前記パシベーションの一部である、請求項1に記載の柔軟な半導体デバイス。 - 前記基板の前記アクティブ領域が、メサ形状であることを特徴とする請求項1に記載の柔軟なデバイス。
- 前記半導体基板が、前記アクティブ領域にのみ存在することを特徴とする請求項1又は2に記載の柔軟なデバイス。
- 前記アンテナが、無線通信に適したインダクタであることを特徴とする請求項1に記載の柔軟なデバイス。
- 前記集積回路が、前記インダクタ内に横方向に配置される、請求項6に記載の柔軟なデバイス。
- 互いに間隔をあけて離れ、前記相互接続構造を介して相互接続される複数の回路ブロックに、前記集積回路が分割される、請求項7に記載の柔軟なデバイス。
- 前記デバイスは、前記回路ブロックに対応するアクティブ領域を有し、非基板領域が前記アクティブ領域間及び前記アクティブ領域の周囲に横方向に規定され、前記半導体基板は前記非基板領域にはない、請求項8に記載のデバイス。
- 前記電気的に導電性のある層の前記アンテナ上への前記集積回路の垂直投影が、少なくとも実質的に該アンテナとの重なりを持つことを特徴とする請求項6に記載のデバイス。
- 請求項1乃至10のいずれかに記載の前記柔軟な半導体デバイスを有するセキュリティペーパ。
- キャリアと請求項1乃至10のいずれかに記載の前記柔軟な半導体デバイスとを有する識別ラベル。
- 更に、無線エネルギー送信を改善するよう導電素子を有する請求項12に記載の識別ラベル。
- 前記キャリアがセキュリティペーパを含み、該ペーパは前記柔軟なデバイスをカプセル化する、請求項12又は13に記載の識別ラベル。
- 紙幣又はセキュリティペーパに適している、請求項14に記載の識別ラベル。
- 請求項11に記載の前記セキュリティペーパを有する識別文書。
- 請求項1乃至10のいずれかに記載の柔軟な半導体デバイス、又は請求項12、13若しくは14に記載の識別ラベルを有する装置。
- リーダと請求項1乃至10のいずれかに記載の柔軟な半導体デバイスの少なくとも1つとの間での通信の方法であって、
前記リーダから前記柔軟なデバイスの前記アンテナに第1の信号を与えるステップと、
前記第1の信号のエネルギーと情報とを用いて、前記柔軟なデバイスの前記メモリの少なくとも一部を読み出し、第2の信号を与えるステップと、
前記柔軟なデバイスから前記リーダに前記第2の信号を送信するステップとを有する方法。 - 前記第2の信号は、前記柔軟なデバイスを一部に含む前記ラベル、文書又は装置の同一性を確認する又は真偽を検証するため前記リーダで比較される、請求項18に記載の方法。
- 柔軟な半導体デバイスを製造する方法であって、
半導体基板の表面に規定される複数の半導体素子を持つ少なくとも1つの集積回路を備える本体であって、前記素子が、相互接続構造において所望のパターンに従い相互接続され、該相互接続構造はパシベーションと共に与えられる本体を与えるステップと、
前記本体の前記パシベーションに一時的なキャリアを付けるステップと、
前記半導体基板を少なくとも部分的に除去するステップと、
前記柔軟な半導体デバイスを得るために前記一時的なキャリアを除去するステップとを有し、
前記相互接続構造が、前記集積回路から横方向にずらされて規定されるアンテナへ第1の導体を伴い広がり、該アンテナは前記パシベーションに覆われ、
前記基板が、前記アンテナと前記集積回路との間の非基板領域において完全に除去されることを特徴とする方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03102020A EP1494167A1 (en) | 2003-07-04 | 2003-07-04 | Flexible semiconductor device and identification label |
PCT/IB2004/051080 WO2005004049A1 (en) | 2003-07-04 | 2004-07-01 | Flexible semiconductor device and identification label |
Publications (1)
Publication Number | Publication Date |
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JP2007519215A true JP2007519215A (ja) | 2007-07-12 |
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ID=33427235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2006516786A Withdrawn JP2007519215A (ja) | 2003-07-04 | 2004-07-01 | 柔軟な半導体デバイス及び識別ラベル |
Country Status (8)
Country | Link |
---|---|
US (2) | US7816774B2 (ja) |
EP (2) | EP1494167A1 (ja) |
JP (1) | JP2007519215A (ja) |
CN (1) | CN100524351C (ja) |
AT (1) | ATE347149T1 (ja) |
DE (1) | DE602004003498T2 (ja) |
TW (1) | TWI354937B (ja) |
WO (1) | WO2005004049A1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
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US7566971B2 (en) | 2005-05-27 | 2009-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
CN100361150C (zh) * | 2005-06-24 | 2008-01-09 | 清华大学 | 带有硅基集成天线的射频识别标卡 |
US7687327B2 (en) * | 2005-07-08 | 2010-03-30 | Kovio, Inc, | Methods for manufacturing RFID tags and structures formed therefrom |
US7690105B2 (en) | 2005-08-19 | 2010-04-06 | Coilcraft, Incorporated | Method for conserving space in a circuit |
EP2002508A1 (en) * | 2006-03-17 | 2008-12-17 | Nxp B.V. | Antenna device and rf communication equipment |
US8232621B2 (en) * | 2006-07-28 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8816484B2 (en) * | 2007-02-09 | 2014-08-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
GB2452732A (en) * | 2007-09-12 | 2009-03-18 | Seiko Epson Corp | Smart-card chip with organic conductive surface layer for detecting invasive attack |
US8106474B2 (en) * | 2008-04-18 | 2012-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8879276B2 (en) | 2011-06-15 | 2014-11-04 | Power Gold LLC | Flexible circuit assembly and method thereof |
WO2012173654A2 (en) * | 2011-06-15 | 2012-12-20 | Power Gold LLC | Flexible circuit assembly and method thereof |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
WO2014121300A2 (en) * | 2013-02-04 | 2014-08-07 | American Semiconductor, Inc. | Photonic data transfer assembly |
US20140264938A1 (en) * | 2013-03-14 | 2014-09-18 | Douglas R. Hackler, Sr. | Flexible Interconnect |
US10102697B2 (en) * | 2015-10-31 | 2018-10-16 | Disney Enterprises, Inc. | High-Q and over-coupled near-field RFID reader antenna for improved tag read range |
US10542619B2 (en) * | 2017-12-12 | 2020-01-21 | Eastman Kodak Company | Electronic element with embedded information |
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JPH07176752A (ja) * | 1993-12-17 | 1995-07-14 | Semiconductor Energy Lab Co Ltd | 薄膜半導体装置およびその作製方法 |
JPH07176753A (ja) * | 1993-12-17 | 1995-07-14 | Semiconductor Energy Lab Co Ltd | 薄膜半導体装置およびその作製方法 |
JPH08264804A (ja) * | 1996-01-20 | 1996-10-11 | Semiconductor Energy Lab Co Ltd | 薄膜トランジスタ |
JP2004282050A (ja) * | 2003-02-24 | 2004-10-07 | Semiconductor Energy Lab Co Ltd | 薄膜集積回路装置、icラベル、薄膜集積回路が搭載された容器、それらの作製方法、及び当該容器を有する商品の管理方法 |
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US5370766A (en) * | 1993-08-16 | 1994-12-06 | California Micro Devices | Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices |
DE19601358C2 (de) | 1995-01-20 | 2000-01-27 | Fraunhofer Ges Forschung | Papier mit integrierter Schaltung |
US6342434B1 (en) * | 1995-12-04 | 2002-01-29 | Hitachi, Ltd. | Methods of processing semiconductor wafer, and producing IC card, and carrier |
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NL1008929C2 (nl) | 1998-04-20 | 1999-10-21 | Vhp Ugchelen Bv | Uit papier vervaardigd substraat voorzien van een geïntegreerde schakeling. |
JP4062728B2 (ja) * | 2002-07-02 | 2008-03-19 | コニカミノルタホールディングス株式会社 | Icカード |
US8067802B2 (en) | 2002-11-08 | 2011-11-29 | Koninklijke Philips Electronics N.V. | Flexible device and method of manufacturing the same |
JP2007514987A (ja) | 2003-05-26 | 2007-06-07 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 半導体デバイス、認証方法およびシステム |
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2003
- 2003-07-04 EP EP03102020A patent/EP1494167A1/en not_active Withdrawn
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2004
- 2004-07-01 JP JP2006516786A patent/JP2007519215A/ja not_active Withdrawn
- 2004-07-01 WO PCT/IB2004/051080 patent/WO2005004049A1/en active IP Right Grant
- 2004-07-01 DE DE602004003498T patent/DE602004003498T2/de active Active
- 2004-07-01 AT AT04744449T patent/ATE347149T1/de not_active IP Right Cessation
- 2004-07-01 EP EP04744449A patent/EP1644874B1/en active Active
- 2004-07-01 US US10/563,416 patent/US7816774B2/en not_active Expired - Fee Related
- 2004-07-01 CN CN200480018675.3A patent/CN100524351C/zh not_active Expired - Fee Related
- 2004-07-02 TW TW093120096A patent/TWI354937B/zh not_active IP Right Cessation
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2010
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07176752A (ja) * | 1993-12-17 | 1995-07-14 | Semiconductor Energy Lab Co Ltd | 薄膜半導体装置およびその作製方法 |
JPH07176753A (ja) * | 1993-12-17 | 1995-07-14 | Semiconductor Energy Lab Co Ltd | 薄膜半導体装置およびその作製方法 |
JPH08264804A (ja) * | 1996-01-20 | 1996-10-11 | Semiconductor Energy Lab Co Ltd | 薄膜トランジスタ |
JP2004282050A (ja) * | 2003-02-24 | 2004-10-07 | Semiconductor Energy Lab Co Ltd | 薄膜集積回路装置、icラベル、薄膜集積回路が搭載された容器、それらの作製方法、及び当該容器を有する商品の管理方法 |
Also Published As
Publication number | Publication date |
---|---|
US20070108521A1 (en) | 2007-05-17 |
DE602004003498D1 (de) | 2007-01-11 |
EP1494167A1 (en) | 2005-01-05 |
US8105873B2 (en) | 2012-01-31 |
TWI354937B (en) | 2011-12-21 |
CN100524351C (zh) | 2009-08-05 |
US7816774B2 (en) | 2010-10-19 |
EP1644874B1 (en) | 2006-11-29 |
TW200516505A (en) | 2005-05-16 |
DE602004003498T2 (de) | 2007-10-04 |
WO2005004049A1 (en) | 2005-01-13 |
EP1644874A1 (en) | 2006-04-12 |
ATE347149T1 (de) | 2006-12-15 |
US20100328028A1 (en) | 2010-12-30 |
CN1816817A (zh) | 2006-08-09 |
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