JP2007335754A

JP2007335754A - Multilayer capacitor

Info

Publication number: JP2007335754A
Application number: JP2006167840A
Authority: JP
Inventors: Satoshi Kazama; 智風間; Masayuki Shimizu; 政行清水; Kenji Saito; 賢二斉藤
Original assignee: Taiyo Yuden Co Ltd
Current assignee: Taiyo Yuden Co Ltd
Priority date: 2006-06-16
Filing date: 2006-06-16
Publication date: 2007-12-27

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer capacitor which can perform ESR setting simply and exactly. <P>SOLUTION: The resistivity of coupling electrodes 104, 105 of different polarity in a multilayer capacitor 100 is higher than the resistivity of external electrodes 102, 103 of different polarity, and the equivalent series resistance of the multilayer capacitor 100 itself is defined based on the resistivity of the coupling electrodes 104, 105 of the different polarity. Therefore, by properly varying the resistivity of the coupling electrodes 104,105, it is possible to set exactly the ESR suitable for suppressing resonance generated by packaging positions and surrounding environments, etc. to the multilayer capacitor 100. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、デカップリングの用途に適した積層コンデンサに関する。 The present invention relates to a multilayer capacitor suitable for decoupling applications.

特開２００５−７９２３７号公報（特許文献１）には、誘電体層と異極性の内部導体層とを所定の順序で積層して一体化した構造を有する直方体形状の積層体と、積層体の下面に設けられた異極性の外部電極と、積層体の上面に設けられた異極性の連結電極とを備えた積層コンデンサが開示されている。 In JP-A-2005-79237 (Patent Document 1), a rectangular parallelepiped laminated body having a structure in which a dielectric layer and a different polarity internal conductor layer are laminated and integrated in a predetermined order, A multilayer capacitor including a different polarity external electrode provided on the lower surface and a different polarity connection electrode provided on the upper surface of the multilayer body is disclosed.

一方の極性の内部導体層は、一方の極性の外部電極に接続された外部電極用引出し部と一方の極性の連結電極に接続された連結電極用引出し部とを有する２種類の内部導体層と、一方の極性の連結電極に接続された連結電極用引出し部を有する１種類の内部導体層とを含み、また、他方の極性の内部導体層は、他方の極性の外部電極に接続された外部電極用引出し部と他方の極性の連結電極に接続された連結電極用引出し部とを有する２種類の内部導体層と、他方の極性の連結電極に接続された連結電極用引出し部を有する１種類の内部導体層とを含んでいる。 One polarity inner conductor layer has two types of inner conductor layers each having an outer electrode lead portion connected to one polarity outer electrode and a connecting electrode lead portion connected to one polarity connecting electrode; One internal conductor layer having a connection electrode lead portion connected to one polarity connection electrode, and the other polarity internal conductor layer is connected to the other polarity external electrode. Two types of internal conductor layers having an electrode lead portion and a connecting electrode lead portion connected to the other polarity connecting electrode, and one type having a connecting electrode lead portion connected to the other polarity connecting electrode And an inner conductor layer.

この積層コンデンサは、各内部導体層の層数選定によってデカップリングに必要な静電容量を得ることができると共に、極性が異なる内部導体層相互に電流の流れ方向が逆になる部分を確保することによる磁界相殺作用によって等価直列インダクタンス（以下ＥＳＬと言う）を低下させることができる。つまり、この積層コンデンサによればデカップリングに必要とされる基本条件、即ち、高静電容量と低ＥＳＬを満足できる。
特開２００５−７９２３７号公報 In this multilayer capacitor, the capacitance required for decoupling can be obtained by selecting the number of layers of each internal conductor layer, and a portion in which the direction of current flow is reversed between the internal conductor layers having different polarities is ensured. The equivalent series inductance (hereinafter referred to as ESL) can be reduced by the magnetic field canceling action of. That is, this multilayer capacitor can satisfy the basic conditions required for decoupling, that is, high capacitance and low ESL.
JP 2005-79237 A

デカップリングに関して言えば積層コンデンサの等価直列抵抗（以下ＥＳＲと言う）は低い方が好ましいが、実用上ではＥＳＲが低すぎると積層コンデンサの実装位置や周囲環境等によって不要な共振、例えば電源電圧のリップル発生及びリップルに基づくノイズ発生や電磁障害（ＥＭＩ）によるノイズ発生を引き起こしてしまう。 In terms of decoupling, it is preferable that the equivalent series resistance (hereinafter referred to as ESR) of the multilayer capacitor is low. However, if the ESR is too low in practical use, an unnecessary resonance, such as a power supply voltage, depending on the mounting position of the multilayer capacitor and the surrounding environment. Ripple generation, noise generation based on ripples, and noise generation due to electromagnetic interference (EMI) are caused.

積層コンデンサにおけるＥＳＲは固有のものであるが、該ＥＳＲを実装位置や周囲環境等に適したものに設定できれば、先に述べた不要な共振を抑制して所期のデカップリングをより効果的に行うことができる。 ESR in multilayer capacitors is unique, but if the ESR can be set to be suitable for the mounting position and the surrounding environment, the above-described decoupling is suppressed more effectively by suppressing unnecessary resonance described above. It can be carried out.

積層コンデンサのＥＳＲは、内部導体層及び引出し部の形状及び寸法の変更や、外部電極の形状及び寸法の変更や、連結電極の形状及び寸法の変更等によって調整できるが、このような基本構造の変更によるＥＳＲ調整は簡単なことではなくコスト面から考えても実用的とは言えないし、変更バリエーションが限られてしまうため要求に適合したＥＳＲを持つ積層コンデンサを提供することも難しい。 The ESR of the multilayer capacitor can be adjusted by changing the shape and dimensions of the inner conductor layer and the lead part, changing the shape and dimensions of the external electrode, changing the shape and dimensions of the connecting electrode, etc. ESR adjustment by modification is not simple and is not practical from the viewpoint of cost, and it is difficult to provide a multilayer capacitor having ESR that meets the requirements because variation variations are limited.

本発明は前記事情に鑑みて創作されたもので、その目的とするところは、ＥＳＲ設定を簡単且つ的確に行える積層コンデンサを提供することにある。 The present invention was created in view of the above circumstances, and an object of the present invention is to provide a multilayer capacitor in which ESR setting can be easily and accurately performed.

前記目的を達成するため、本発明は、誘電体層と異極性の内部導体層とを所定の順序で積層して一体化した構造を有する直方体形状の積層体と、積層体の表面に設けられた異極性の外部電極と、積層体の表面に設けられた異極性の連結電極とを備え、一方の極性の内部導体層は、一方の極性の外部電極に接続された外部電極用引出し部と一方の極性の連結電極に接続された連結電極用引出し部とを有する第１の内部導体層と、一方の極性の連結電極に接続された連結電極用引出し部を有する第２の内部導体層とを含み、また、他方の極性の内部導体層は、他方の極性の外部電極に接続された外部電極用引出し部と他方の極性の連結電極に接続された連結電極用引出し部とを有する第３の内部導体層と、他方の極性の連結電極に接続された連結電極用引出し部を有する第４の内部導体層とを含む積層コンデンサであって、前記異極性の連結電極の抵抗率は前記異極性の外部電極の抵抗率よりも高く、積層コンデンサそれ自体の等価直列抵抗は該異極性の連結電極の抵抗率に基づいて定められている、ことをその特徴とする。 In order to achieve the above object, the present invention is provided in a rectangular parallelepiped laminate having a structure in which a dielectric layer and a different polarity internal conductor layer are laminated and integrated in a predetermined order, and provided on the surface of the laminate. The external electrode having the different polarity and the linking electrode having the different polarity provided on the surface of the laminate, the internal conductor layer having one polarity is connected to the external electrode lead portion connected to the external electrode having the one polarity. A first inner conductor layer having a connecting electrode lead portion connected to one polarity connecting electrode, and a second inner conductor layer having a connecting electrode lead portion connected to one polarity connecting electrode; And the other polar inner conductor layer has a third outer electrode lead portion connected to the other polar outer electrode and a third connecting electrode lead portion connected to the other polar connecting electrode. Connected to the inner conductor layer and the other polarity connecting electrode A multilayer capacitor including a fourth inner conductor layer having a lead portion for a pole, wherein the resistivity of the heteropolar connecting electrode is higher than the resistivity of the heteropolar external electrode, and is equivalent to the multilayer capacitor itself The series resistance is characterized by being determined based on the resistivity of the connecting electrode of different polarity.

この積層コンデンサによれば、連結電極の抵抗率を外部電極の抵抗率よりも高くして積層コンデンサそれ自体のＥＳＲを連結電極の抵抗率に基づいて定めているので、連結電極の抵抗率を適宜可変するだけで、実装位置や周囲環境等によって生じる共振を抑制するのに適したＥＳＲを積層コンデンサに的確に設定できる。また、連結電極の抵抗率によって積層コンデンサのＥＳＲを調整して設定できるので、積層コンデンサの基本構造を変更することなくそのＥＳＲを調整して設定できる。 According to this multilayer capacitor, since the resistivity of the connection electrode is made higher than the resistivity of the external electrode and the ESR of the multilayer capacitor itself is determined based on the resistivity of the connection electrode, the resistivity of the connection electrode is appropriately set. By simply changing the ESR, it is possible to accurately set an ESR suitable for suppressing resonance caused by the mounting position, the surrounding environment, and the like in the multilayer capacitor. In addition, since the ESR of the multilayer capacitor can be adjusted and set according to the resistivity of the connection electrode, the ESR can be adjusted and set without changing the basic structure of the multilayer capacitor.

本発明によれば、ＥＳＲ設定を簡単且つ的確に行える積層コンデンサを提供できる。 ADVANTAGE OF THE INVENTION According to this invention, the multilayer capacitor which can perform ESR setting simply and accurately can be provided.

本発明の前記目的とそれ以外の目的と、構成特徴と、作用効果は、以下の説明と添付図面によって明らかとなる。 The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

［第１実施形態］
図１〜図６は本発明の第１実施形態を示す。図１は積層コンデンサを上面側から見た斜視図、図２は図１に示した積層コンデンサの上面図、図３は図１に示した積層体の内部構造を示す図、図４は図２のａ１−ａ１線断面図、図５は図２のａ２−ａ２線断面図、図６は図２のａ３−ａ３線断面図である。 [First Embodiment]
1 to 6 show a first embodiment of the present invention. 1 is a perspective view of the multilayer capacitor as viewed from the upper surface side, FIG. 2 is a top view of the multilayer capacitor shown in FIG. 1, FIG. 3 is a diagram showing the internal structure of the multilayer body shown in FIG. 1, and FIG. FIG. 5 is a sectional view taken along line a2-a2 in FIG. 2, and FIG. 6 is a sectional view taken along line a3-a3 in FIG.

この積層コンデンサ１００は、所定の長さＬ，幅Ｗ及び高さＨを有する直方体形状の積層体１０１と、積層体１０１の幅方向の両端部それぞれに設けられた異極性の外部電極１０２，１０３と、積層体１０１の長さ方向の両端面それぞれに設けられた異極性の連結電極１０４，１０５とを備える。 The multilayer capacitor 100 includes a rectangular parallelepiped multilayer body 101 having a predetermined length L, width W, and height H, and different polarity external electrodes 102 and 103 provided at both ends in the width direction of the multilayer body 101. And connection electrodes 104 and 105 of different polarities provided on both end faces in the length direction of the laminate 101.

各外部電極１０２，１０３は積層体１０１の上面及び下面に回り込む部分（回り込み部１０２ａ，１０３ａ）それぞれ有するコ字形状を成しており、積層体１０１の幅方向の両端部にはそれぞれ４個の外部電極１０２，１０３，１０２，１０３が長さ方向に間隔をおいて交互に並ぶように配されている。一端部側の４個の外部電極１０２，１０３，１０２，１０３と他端部側の４個の外部電極１０２，１０３，１０２，１０３は積層体１０１の幅方向で異なる極性が向き合う位置関係となっている。また、各連結電極１０４，１０５は積層体１０１の長さ方向の端面全体を覆うように設けられており、各連結電極１０４，１０５は積層体１０１の上面及び下面に回り込む部分を有していない。因みに、各外部電極１０２，１０３と各連結電極１０４，１０５はニッケルや銅等の卑金属から成る。 Each of the external electrodes 102 and 103 has a U-shape having portions (around portions 102 a and 103 a) that wrap around the upper and lower surfaces of the multilayer body 101, and four end portions in the width direction of the multilayer body 101, respectively. The external electrodes 102, 103, 102, 103 are arranged so as to be alternately arranged at intervals in the length direction. The four external electrodes 102, 103, 102, 103 on one end side and the four external electrodes 102, 103, 102, 103 on the other end side have a positional relationship in which different polarities face each other in the width direction of the laminate 101. ing. Further, each of the connection electrodes 104 and 105 is provided so as to cover the entire end surface in the length direction of the multilayer body 101, and each of the connection electrodes 104 and 105 does not have a portion that goes around the upper surface and the lower surface of the multilayer body 101. . Incidentally, the external electrodes 102 and 103 and the connecting electrodes 104 and 105 are made of a base metal such as nickel or copper.

積層体１０１は、誘電体層１０６と６種類の内部導体層１０７〜１１２とを図３に示す順序で積層体１０１の幅方向に積層して一体化した構造を有している。図２での図示を省略したが、積層体１０１の幅方向両側にはマージンを確保するために誘電体層１０６のみが所定層数配されている。因みに、誘電体層１０６はチタン酸バリウム等の誘電体から成り、内部導体層１０７〜１１２はニッケルや銅等の卑金属から成る。 The multilayer body 101 has a structure in which a dielectric layer 106 and six types of internal conductor layers 107 to 112 are laminated and integrated in the width direction of the multilayer body 101 in the order shown in FIG. Although not shown in FIG. 2, only a predetermined number of dielectric layers 106 are arranged on both sides of the stacked body 101 in the width direction in order to ensure a margin. Incidentally, the dielectric layer 106 is made of a dielectric such as barium titanate, and the inner conductor layers 107 to 112 are made of a base metal such as nickel or copper.

６種類の内部導体層１０７〜１１２のうち、内部導体層１０７，１０８及び１０９は一方の極性の内部導体層を構成し、内部導体層１１０，１１１及び１１２は他方の極性の内部導体層を構成する。図２からも分かるように、積層体１０１の幅方向の一側には所定層数（図面では２層）の内部導体層１０７と所定層数（図面では２層）の内部導体層１１０が交互に配され、幅方向の他側には所定層数（図面では２層）の内部導体層１０８と所定層数（図面では２層）の内部導体層１１１が交互に配され、これらの内側に所定層数（図面では６層）の内部導体層１０９と所定層数（図面では６層）の内部導体層１１２が交互に配されている。 Among the six types of inner conductor layers 107 to 112, the inner conductor layers 107, 108 and 109 constitute one polarity inner conductor layer, and the inner conductor layers 110, 111 and 112 constitute the other polarity inner conductor layer. To do. As can be seen from FIG. 2, a predetermined number (two in the drawing) of internal conductor layers 107 and a predetermined number of layers (two in the drawing) of internal conductor layers 110 alternate on one side in the width direction of the multilayer body 101. A predetermined number (two in the drawing) of internal conductor layers 108 and a predetermined number of layers (two in the drawing) of internal conductor layers 111 are alternately arranged on the other side in the width direction, A predetermined number (six in the drawing) of internal conductor layers 109 and a predetermined number of layers (six in the drawing) of internal conductor layers 112 are alternately arranged.

内部導体層１０７は矩形状を成し、高さ方向の上端縁と下端縁のそれぞれに長さ方向に間隔をおいて２個の外部電極用引出し部１０７ａを上下対称に有し、長さ方向の一端縁中央に１個の連結電極用引出し部１０７ｂを有する。この内部導体層１０７は請求範囲で言うところの「第１の内部導体層」に相当する。 The inner conductor layer 107 has a rectangular shape, and has two external electrode lead portions 107a symmetrically in the vertical direction at intervals in the length direction at the upper end edge and the lower end edge in the height direction. One connecting electrode lead-out portion 107b is provided at the center of one end edge of each. The inner conductor layer 107 corresponds to the “first inner conductor layer” in the claims.

内部導体層１０８は矩形状を成し、高さ方向の上端縁と下端縁のそれぞれに長さ方向に間隔をおいて２個の外部電極用引出し部１０８ａを上下対称に有し、長さ方向の一端縁中央（引出し部１０７ｂと同じ側の端縁中央）に１個の連結電極用引出し部１０８ｂを有する。外部電極用引出し部１０８ａの位置は内部導体層１０７の外部電極用引出し部１０７ａの位置と積層体１０１の長さ方向でずれており幅方向で交錯していない。また、連結電極用引出し部１０８ｂの位置は内部導体層１０７の連結電極用引出し部１０７ｂの位置と積層体１０１の高さ方向で一致している。この内部導体層１０８は請求範囲で言うところの「第１の内部導体層」に相当する。 The inner conductor layer 108 has a rectangular shape, and has two external electrode lead portions 108a symmetrically in the vertical direction at intervals between the upper and lower edges in the height direction. One connection electrode lead part 108b is provided at the center of one end edge (center of the edge on the same side as the lead part 107b). The position of the external electrode lead-out portion 108a is shifted from the position of the external electrode lead-out portion 107a of the internal conductor layer 107 in the length direction of the multilayer body 101 and is not crossed in the width direction. Further, the position of the connection electrode lead-out portion 108 b matches the position of the connection electrode lead-out portion 107 b of the internal conductor layer 107 in the height direction of the multilayer body 101. The inner conductor layer 108 corresponds to the “first inner conductor layer” in the claims.

内部導体層１０９は矩形状を成し、長さ方向の一端縁中央（引出し部１０７ｂと同じ側の端縁中央）に１個の連結電極用引出し部１０９ａを有する。連結電極用引出し部１０９ａの位置は内部導体層１０７の連結電極用引出し部１０７ｂの位置と積層体１０１の高さ方向で一致している。この内部導体層１０９は請求範囲で言うところの「第２の内部導体層」に相当する。 The internal conductor layer 109 has a rectangular shape, and has one connecting electrode lead portion 109a at the center of one end edge in the length direction (center of the end edge on the same side as the lead portion 107b). The position of the connecting electrode lead portion 109 a coincides with the position of the connecting electrode lead portion 107 b of the internal conductor layer 107 in the height direction of the multilayer body 101. The inner conductor layer 109 corresponds to the “second inner conductor layer” in the claims.

内部導体層１１０は矩形状を成し、高さ方向の上端縁と下端縁のそれぞれに長さ方向に間隔をおいて２個の外部電極用引出し部１１０ａを上下対称に有し、長さ方向の他端縁中央（引出し部１０７ｂ，１０８ｂ，１０９ａとは反対側の端縁中央）に１個の連結電極用引出し部１１０ｂを有する。外部電極用引出し部１１０ａの位置は内部導体層１０８の外部電極用引出し部１０８ａの位置と積層体１０１の長さ方向で一致している。この内部導体層１１０は請求範囲で言うところの「第３の内部導体層」に相当する。 The inner conductor layer 110 has a rectangular shape, and has two outer electrode lead portions 110a symmetrically in the vertical direction at intervals between the upper end edge and the lower end edge in the height direction. One connecting electrode lead portion 110b is provided at the center of the other end edge (center of the edge opposite to the lead portions 107b, 108b, 109a). The position of the external electrode lead portion 110 a coincides with the position of the external electrode lead portion 108 a of the internal conductor layer 108 in the length direction of the multilayer body 101. The inner conductor layer 110 corresponds to the “third inner conductor layer” in the claims.

内部導体層１１１は矩形状を成し、高さ方向の上端縁と下端縁のそれぞれに長さ方向に間隔をおいて２個の外部電極用引出し部１１１ａを上下対称に有し、長さ方向の他端縁中央（引出し部１１０ｂと同じ側の端縁中央）に１個の連結電極用引出し部１１１ｂを有する。外部電極用引出し部１１１ａの位置は内部導体層１０７の外部電極用引出し部１０７ａの位置と積層体１０１の長さ方向で一致している。また、連結電極用引出し部１１１ｂの位置は内部導体層１１０の連結電極用引出し部１１０ｂの位置と積層体１０１の高さ方向で一致している。この内部導体層１１１は請求範囲で言うところの「第３の内部導体層」に相当する。 The inner conductor layer 111 has a rectangular shape, and has two external electrode lead portions 111a vertically symmetrically spaced apart in the length direction at each of an upper end edge and a lower end edge in the height direction. One connecting electrode lead part 111b is provided at the center of the other end edge (the edge center on the same side as the lead part 110b). The position of the external electrode lead portion 111 a coincides with the position of the external electrode lead portion 107 a of the internal conductor layer 107 in the length direction of the multilayer body 101. Further, the position of the connection electrode lead-out portion 111 b coincides with the position of the connection electrode lead-out portion 110 b of the internal conductor layer 110 in the height direction of the multilayer body 101. The inner conductor layer 111 corresponds to the “third inner conductor layer” in the claims.

内部導体層１１２は矩形状を成し、長さ方向の他端縁中央（引出し部１１０ｂと同じ側の端縁中央）に１個の連結電極用引出し部１１２ａを有する。連結電極用引出し部１１２ａの位置は内部導体層１１０の連結電極用引出し部１１０ｂの位置と積層体１０１の高さ方向で一致している。この内部導体層１１２は請求範囲で言うところの「第４の内部導体層」に相当する。 The internal conductor layer 112 has a rectangular shape, and has one connecting electrode lead portion 112a at the center of the other end edge in the length direction (center of the end edge on the same side as the lead portion 110b). The position of the connection electrode lead-out portion 112 a coincides with the position of the connection electrode lead-out portion 110 b of the internal conductor layer 110 in the height direction of the multilayer body 101. The inner conductor layer 112 corresponds to the “fourth inner conductor layer” in the claims.

積層体１０１の幅方向一側に位置する２層の内部導体層１０７の上縁側の２個の外部電極用引出し部１０７ａは積層体１０１の幅方向一端部側の２個の外部電極１０２の上側回り込み部１０２ａにそれぞれ接続され、下縁側の２個の外部電極用引出し部１０７ａは同じ外部電極１０２の下側回り込み部１０２ａにそれぞれ接続され、連結電極用引出し部１０７ｂは一方の連結電極１０４に接続されている。また、積層体１０１の幅方向他側に位置する２層の内部導体層１０８の上縁側の２個の外部電極用引出し部１０８ａは積層体１０１の幅方向他端部側の２個の外部電極１０２の上側回り込み部１０２ａにそれぞれ接続され、下縁側の２個の外部電極用引出し部１０８ａは同じ外部電極１０２の下側回り込み部１０２ａにそれぞれ接続され、連結電極用引出し部１０８ｂは一方の連結電極１０４に接続されている。さらに、積層体１０１の幅方向中央に位置する６層の内部導体層１０９の連結電極用引出し部１０９ａは一方の連結電極１０４に接続されている。 Two external electrode lead-out portions 107a on the upper edge side of the two internal conductor layers 107 positioned on one side in the width direction of the multilayer body 101 are above the two external electrodes 102 on one end side in the width direction of the multilayer body 101. The two outer electrode lead portions 107a on the lower edge side are connected to the lower wrap portion 102a, respectively, and the connection electrode lead portion 107b is connected to one of the connection electrodes 104. Has been. The two outer electrode lead portions 108a on the upper edge side of the two internal conductor layers 108 located on the other side in the width direction of the multilayer body 101 are two external electrodes on the other end side in the width direction of the multilayer body 101. 102, the two outer electrode lead portions 108a on the lower edge side are respectively connected to the lower wrap portion 102a of the same external electrode 102, and the connecting electrode lead portion 108b is connected to one connecting electrode. 104 is connected. Further, the connecting electrode lead-out portion 109 a of the six inner conductor layers 109 located at the center in the width direction of the multilayer body 101 is connected to one connecting electrode 104.

一方、積層体１０１の幅方向一側に位置する２層の内部導体層１１０の上縁側の２個の外部電極用引出し部１１０ａは積層体１０１の幅方向一端部側の２個の外部電極１０３の上側回り込み部１０３ａにそれぞれ接続され、下縁側の２個の外部電極用引出し部１１０ａは同じ外部電極１０３の下側回り込み部１０３ａにそれぞれ接続され、連結電極用引出し部１１０ｂは他方の連結電極１０５に接続されている。また、積層体１０１の幅方向他側に位置する２層の内部導体層１１１の上縁側の２個の外部電極用引出し部１１１ａは積層体１０１の幅方向他端部側の２個の外部電極１０３の上側回り込み部１０３ａにそれぞれ接続され、下縁側の２個の外部電極用引出し部１１１ａは同じ外部電極１０３の下側回り込み部１０３ａにそれぞれ接続され、連結電極用引出し部１１１ｂは他方の連結電極１０５に接続されている。さらに、積層体１０１の幅方向中央に位置する６層の内部導体層１１２の連結電極用引出し部１１２ａは他方の連結電極１０４に接続されている。 On the other hand, the two outer electrode lead portions 110 a on the upper edge side of the two inner conductor layers 110 located on one side in the width direction of the multilayer body 101 are two external electrodes 103 on one end side in the width direction of the multilayer body 101. The two outer electrode lead portions 110a on the lower edge side are respectively connected to the lower wrap portion 103a of the same external electrode 103, and the connecting electrode lead portion 110b is connected to the other connecting electrode 105. It is connected to the. The two outer electrode lead portions 111a on the upper edge side of the two inner conductor layers 111 positioned on the other side in the width direction of the multilayer body 101 are two external electrodes on the other end side in the width direction of the multilayer body 101. 103, the two outer electrode lead portions 111a on the lower edge side are respectively connected to the lower wrap portion 103a of the same external electrode 103, and the connecting electrode lead portion 111b is connected to the other connecting electrode. 105 is connected. Further, the connecting electrode lead-out portion 112 a of the six inner conductor layers 112 located in the center in the width direction of the multilayer body 101 is connected to the other connecting electrode 104.

即ち、一方の連結電極１０４に接続された２層の内部導体層１０７と２層の内部導体層１０８と６層の内部導体層１０９の極性は同じであり、他方の連結電極１０５に接続された２層の内部導体層１１０と２層の内部導体層１１１と６層の内部導体層１１２の極性は同じである。 That is, the two inner conductor layers 107 connected to one connecting electrode 104, the two inner conductor layers 108, and the six inner conductor layers 109 have the same polarity, and are connected to the other connecting electrode 105. The polarities of the two inner conductor layers 110, the two inner conductor layers 111, and the six inner conductor layers 112 are the same.

前述の積層コンデンサ１００にあっては、連結電極１０４，１０５の抵抗率（単位はΩｍ）は外部電極１０２，１０３の抵抗率よりも高く、積層コンデンサ１００それ自体の等価直列抵抗（以下ＥＳＲと言う）は連結電極１０４，１０５の抵抗率に基づいて定められている。以下、この点について詳述する。 In the multilayer capacitor 100 described above, the resistivity (unit: Ωm) of the connecting electrodes 104 and 105 is higher than the resistivity of the external electrodes 102 and 103, and the multilayer capacitor 100 itself has an equivalent series resistance (hereinafter referred to as ESR). ) Is determined based on the resistivity of the connecting electrodes 104 and 105. Hereinafter, this point will be described in detail.

連結電極１０４，１０５と外部電極１０２，１０３は、何れも、予め用意した電極ペーストをディップ法やローラ塗布法等の手法により焼成後の積層体１０１の所定位置に所定形状で塗布しこれを乾燥して所定温度で焼き付けることによって、或いは、予め用意した電極ペーストをディップ法やローラ塗布法等の手法により焼成前の積層体１０１の所定位置に所定形状で塗布しこれを乾燥して所定温度で積層体１０１と同時焼成することによって形成されるが、ここでは外部電極１０２，１０３用の電極ペーストに抵抗率増加のための組成調整を施したものを連結電極１０４，１０５用の電極ペーストとして用いて連結電極１０４，１０５を形成する。 Each of the connecting electrodes 104 and 105 and the external electrodes 102 and 103 is applied by applying a predetermined electrode paste in a predetermined shape to a predetermined position of the laminated body 101 after baking by a technique such as a dipping method or a roller coating method. The electrode paste prepared in advance is applied in a predetermined shape to a predetermined position of the laminate 101 before firing by a method such as a dipping method or a roller coating method, and dried, and then dried at a predetermined temperature. It is formed by simultaneous firing with the laminate 101, but here, an electrode paste for the external electrodes 102 and 103 that has been subjected to composition adjustment for increasing resistivity is used as the electrode paste for the connection electrodes 104 and 105. Thus, the connecting electrodes 104 and 105 are formed.

例えば、外部電極１０２，１０３用の電極ペーストがニッケルや銅等の卑金属粉末と有機バインダと有機溶剤等を含むものである場合には、前記組成調整方法として、（１）外部電極１０２，１０３用の電極ペーストに誘電体粉末を添加する方法、（２）外部電極１０２，１０３用の電極ペーストにガラスフリットを添加する方法、（３）外部電極１０２，１０３用の電極ペーストの有機バインダの含有割合を増加させる方法、の少なくとも１つが好ましく採用できる。 For example, when the electrode paste for the external electrodes 102 and 103 contains a base metal powder such as nickel or copper, an organic binder, an organic solvent, etc., (1) electrodes for the external electrodes 102 and 103 A method of adding dielectric powder to the paste, (2) a method of adding glass frit to the electrode paste for the external electrodes 102 and 103, and (3) increasing the organic binder content in the electrode paste for the external electrodes 102 and 103. Preferably, at least one of the above methods can be employed.

前記（１）の方法は、例えば誘電体層１０５に含まれる誘電体材料がチタン酸バリウム或いはこれと同系の誘電体、具体的にはＡＢＯ₃で表される誘電体（ＡサイトはＢａ，Ｂａ＋Ｓｒ，Ｂａ＋Ｃａ，Ｂａ＋Ｃａ＋Ｓｒ等、ＢサイトはＴｉ，Ｔｉ＋Ｚｒ等）にＭｎ，Ｖ，Ｃｒ，Ｍｏ，Ｆｅ，Ｎｉ，Ｃｕ，Ｃｏ等の遷移元素とＳｃ，Ｙ，Ｇｄ，Ｄｙ，Ｈｏ，Ｅｒ，Ｙｂ，Ｔｂ，Ｔｍ，Ｌｕ等の希土類元素の少なくとも１種以上を含む同系の誘電体である場合に、チタン酸バリウム粉末または前記同系の誘電体粉末を外部電極１０２，１０３用の電極ペーストに添加することによって組成調整を施す方法である。連結電極１０４，１０５は組成調整によって得た電極ペーストを用いて形成される。組成調整後の電極ペーストに含まれる誘電体粉末及び／または同系の誘電体粉末の重量は卑金属粉末の重量に対して２０〜７０重量％が適正範囲であり、２０重量％未満であると所期の抵抗率低減が効果的に行えず、また、７０重量％を越えると電気伝導が著しく阻害されて電極としての役割が果たせなくなる。 In the method (1), for example, the dielectric material contained in the dielectric layer 105 is a dielectric material represented by barium titanate or a similar dielectric material, specifically, ABO ₃ (A site is Ba, Ba + Sr). , Ba + Ca, Ba + Ca + Sr, etc., B site is Ti, Ti + Zr, etc.) and transition elements such as Mn, V, Cr, Mo, Fe, Ni, Cu, Co and the like, and Sc, Y, Gd, Dy, Ho, Er, Yb, Tb. By adding barium titanate powder or the same dielectric powder to the electrode paste for the external electrodes 102 and 103 in the case of a similar dielectric containing at least one kind of rare earth elements such as Tm, Lu, etc. This is a method of adjusting the composition. The connecting electrodes 104 and 105 are formed using an electrode paste obtained by adjusting the composition. The weight of the dielectric powder and / or the dielectric powder of the same type contained in the electrode paste after the composition adjustment is 20 to 70% by weight with respect to the weight of the base metal powder, and is expected to be less than 20% by weight. The resistivity cannot be effectively reduced, and if it exceeds 70% by weight, the electric conduction is remarkably hindered and cannot serve as an electrode.

前記（２）の方法は、例えば誘電体層１０５に含まれる誘電体材料がチタン酸バリウム或いはこれと前記同系の誘電体である場合に、Ｌｉ₂Ｏ，ＳｉＯ₂，ＢａＯ，Ｂ₂Ｏ₃，Ａｉ₂Ｏ₃，ＣａＯ，ＺｎＯ，ＰｂＯ等の酸化物のうちの少なくとも２種以上を含むガラスフリットを外部電極１０２，１０３用の電極ペーストに添加することによって組成調整を施す方法である。連結電極１０４，１０５は組成調整によって得た電極ペーストを用いて形成される。組成調整後の電極ペーストに含まれるガラスフリットの重量は卑金属粉末の重量に対して１０〜３０重量％が適正範囲であり、１０重量％未満であると所期の抵抗率低減が効果的に行えず、また、３０重量％を越えると電気伝導が著しく阻害されて電極としての役割が果たせなくなる。 In the method (2), for example, when the dielectric material contained in the dielectric layer 105 is barium titanate or a dielectric similar to the same, Li ₂ O , SiO ₂ , BaO, B ₂ O ₃ , Ai ₂ O ₃ , CaO, ZnO, glass frit containing at least two of oxides such as PbO is added to the electrode paste for the external electrodes 102 and 103 This is a method for adjusting the composition. The connecting electrodes 104 and 105 are formed using an electrode paste obtained by adjusting the composition. The weight of the glass frit contained in the electrode paste after composition adjustment is 10 to 30% by weight relative to the weight of the base metal powder, and if it is less than 10% by weight, the desired resistivity can be effectively reduced. Further, if it exceeds 30% by weight, the electric conduction is remarkably hindered and the role as an electrode cannot be achieved.

前記（３）の方法は、例えば外部電極１０２，１０３用の電極ペーストに含まれる有機バインダがエチルセルロース，ヒドロキシエチルセルロース，ニトロセルロース等のセルロース系樹脂、ポリビニルブチラール等のブチラール系樹脂、アクリル樹脂、エポキシ樹脂、フェノール樹脂、ロジン等の少なくとも１種である場合に、これらのうち少なくとも１種以上の有機バインダを外部電極１０２，１０３用の電極ペーストにさらに添加することによって組成調整を施す方法である。連結電極１０４，１０５は組成調整によって得た電極ペーストを用いて形成される。組成調整後の電極ペーストに含まれる有機バインダの重量は卑金属粉末の重量に対して１０〜３０重量％が適正範囲であり、１０重量％未満であると所期の抵抗率低減が効果的に行えず、また、３０重量％を越えると電気伝導が著しく阻害されて電極としての役割が果たせなくなる。 In the method (3), for example, the organic binder contained in the electrode paste for the external electrodes 102 and 103 is a cellulose resin such as ethyl cellulose, hydroxyethyl cellulose, and nitrocellulose, a butyral resin such as polyvinyl butyral, an acrylic resin, and an epoxy resin. In the case of at least one of phenol resin, rosin and the like, at least one of these organic binders is further added to the electrode paste for the external electrodes 102 and 103 to adjust the composition. The connecting electrodes 104 and 105 are formed using an electrode paste obtained by adjusting the composition. The weight of the organic binder contained in the electrode paste after composition adjustment is 10 to 30% by weight relative to the weight of the base metal powder, and if it is less than 10% by weight, the desired resistivity can be effectively reduced. Further, if it exceeds 30% by weight, the electric conduction is remarkably hindered and the role as an electrode cannot be achieved.

前記（１）〜（３）の方法の少なくとも１つによって組成調整された連結電極１０４，１０５用の電極ペーストを用いて形成された連結電極１０４，１０５には、基本的には連結電極１０４，１０５に含まれる金属粒子の連続率に準じた抵抗率が現れる。連結電極１０４，１０５における電流の流れ易さはこの抵抗率によって主に支配されるが、前記の金属粒子の連続率に応じて連結電極１０４，１０５と内部導体層１０７〜１１２の連結電極用引出し部１０７ｂ，１０８ｂ，１０９ａ，１１０ｂ，１１１ｂ，１１２ａとのコンタクト率が変化することもある程度関係する。 The connection electrodes 104 and 105 formed by using the electrode paste for the connection electrodes 104 and 105 whose composition is adjusted by at least one of the methods (1) to (3) basically include the connection electrode 104, The resistivity according to the continuity rate of the metal particles contained in 105 appears. The ease of current flow in the connection electrodes 104 and 105 is mainly governed by this resistivity, but the connection electrode lead-out of the connection electrodes 104 and 105 and the inner conductor layers 107 to 112 depends on the continuity rate of the metal particles. The contact rate with the parts 107b, 108b, 109a, 110b, 111b, and 112a also changes to some extent.

依って、前記（１）〜（３）の方法の少なくとも１つによって組成調整された連結電極１０４，１０５用の電極ペーストを用いて連結電極１０４，１０５を形成すれば、従前と同じ電極形成方法によって、外部電極１０２，１０３よりも抵抗率の高い連結電極１０４，１０５を形成できるし、該抵抗率に基づいて連結電極１０４，１０５の電流の流れ易さを制御して積層コンデンサ１００それ自体のＥＳＲを所望の値に設定できることになる。 Therefore, if the connection electrodes 104 and 105 are formed using the electrode paste for the connection electrodes 104 and 105 whose composition is adjusted by at least one of the methods (1) to (3), the same electrode formation method as before is used. Thus, the connection electrodes 104 and 105 having higher resistivity than the external electrodes 102 and 103 can be formed, and the ease of flow of current through the connection electrodes 104 and 105 is controlled based on the resistivity to control the multilayer capacitor 100 itself. The ESR can be set to a desired value.

因みに、積層コンデンサ１００それ自体のＥＳＲ設定は外部電極１０２，１０３の抵抗率を可変することによっても行うことは可能であるが、外部電極１０２，１０３の抵抗率を高めると積層コンデンサ１００の入出力に影響が出て積層コンデンサ１００本来の機能に支障を生じる可能性が高くなることから、ここでは連結電極１０４，１０５の抵抗率を可変することによって積層コンデンサ１００それ自体のＥＳＲ設定を行うようにしている。 Incidentally, the ESR of the multilayer capacitor 100 itself can be set by changing the resistivity of the external electrodes 102 and 103. However, if the resistivity of the external electrodes 102 and 103 is increased, the input / output of the multilayer capacitor 100 is increased. In this case, the ESR setting of the multilayer capacitor 100 itself is performed by varying the resistivity of the connecting electrodes 104 and 105. ing.

このように、前述の積層コンデンサ１００によれば、６種類の内部導体層１０７〜１１２のうち主に外部電極用引出し部を有しない内部導体層１０９，１１２の層数選定によって所定の静電容量を得ることができる。しかも、誘電体層１０６を介して隣り合う内部導体層１０７の外部電極用引出し部１０７ａと内部導体層１１０の外部電極層用引出し部１１０ａに逆方向に電流が流れ、この電流の流れによって内部電極１０７，１１０にも逆方向に電流が流れるようにすることにより、且つ、誘電体層１０６を介して隣り合う内部導体層１０８の外部電極用引出し部１０８ａと内部導体層１１１の外部電極層用引出し部１１１ａに逆方向に電流が流れ、この電流の流れによって内部電極１０８，１１１にも逆方向に電流が流れるようにすることにより、磁界相殺作用に基づくＥＳＬ低下を図ることができる。つまり、前述の積層コンデンサ１００によれば、デカップリングに必要とされる基本条件、即ち、高静電容量と低ＥＳＬを満足できる。 As described above, according to the multilayer capacitor 100 described above, a predetermined capacitance is selected by selecting the number of the inner conductor layers 109 and 112 that mainly do not have the lead portions for the outer electrodes among the six types of inner conductor layers 107 to 112. Can be obtained. In addition, a current flows in the opposite direction to the external electrode lead-out portion 107a of the internal conductor layer 107 and the external electrode layer lead-out portion 110a of the internal conductor layer 110 that are adjacent to each other via the dielectric layer 106. 107 and 110 are made to flow in the opposite direction, and the external electrode lead portion 108a of the internal conductor layer 108 and the external conductor layer 111 of the internal conductor layer 111 that are adjacent to each other through the dielectric layer 106 are provided. By causing the current to flow in the reverse direction in the portion 111a and causing the current to flow in the reverse direction also in the internal electrodes 108 and 111 by this flow of current, ESL reduction based on the magnetic field canceling action can be achieved. That is, according to the above-described multilayer capacitor 100, the basic conditions required for decoupling, that is, high capacitance and low ESL can be satisfied.

また、前述の積層コンデンサ１００によれば、連結電極１０４，１０５の抵抗率を外部電極１０２，１０３の抵抗率よりも高くして積層コンデンサ１００それ自体のＥＳＲを連結電極１０４，１０５の抵抗率に基づいて定めているので、連結電極１０４，１０５の抵抗率を適宜可変することによって、実装位置や周囲環境等によって生じる共振を抑制するのに適したＥＳＲを積層コンデンサ１００に的確に設定できる。 Further, according to the multilayer capacitor 100 described above, the resistivity of the connection electrodes 104 and 105 is made higher than the resistivity of the external electrodes 102 and 103 so that the ESR of the multilayer capacitor 100 itself becomes the resistivity of the connection electrodes 104 and 105. Therefore, by appropriately changing the resistivity of the connection electrodes 104 and 105, an ESR suitable for suppressing resonance caused by the mounting position, the surrounding environment, and the like can be accurately set in the multilayer capacitor 100.

さらに、前述の積層コンデンサ１００によれば、連結電極１０４，１０５の抵抗率可変によって積層コンデンサ１００のＥＳＲを調整して設定できるので、積層コンデンサ１００の基本構造を変更することなくそのＥＳＲを所望の値に設定できる。詳しくは、外部電極１０２，１０３用の電極ペーストに抵抗率増加のための組成調整を施したもの、具体的には前記（１）〜（３）の方法の少なくとも１つによって組成調整された電極ペーストを連結電極１０４，１０５用の電極ペーストとして用いることにより連結電極１０４，１０５の抵抗率の可変を行うので、積層コンデンサ１００それ自体のＥＳＲ設定が簡単に行える。 Furthermore, according to the multilayer capacitor 100 described above, the ESR of the multilayer capacitor 100 can be adjusted and set by varying the resistivity of the connection electrodes 104 and 105, so that the ESR can be set to a desired value without changing the basic structure of the multilayer capacitor 100. Can be set to a value. Specifically, the electrode paste for the external electrodes 102 and 103 is subjected to composition adjustment for increasing the resistivity, specifically, the electrode whose composition is adjusted by at least one of the methods (1) to (3). Since the resistivity of the connection electrodes 104 and 105 is varied by using the paste as an electrode paste for the connection electrodes 104 and 105, the ESR setting of the multilayer capacitor 100 itself can be easily performed.

さらにまた、前述の積層コンデンサ１００によれば、積層体１０１の幅方向の両端部それぞれにコ字形状を成す異極性の外部電極１０２，１０３を設けているので、積層体１０１の長さ方向の両端面それぞれに異極性の連結電極１０４，１０５を設けたことも相俟って、基板等への実装時には積層コンデンサ１００の下面と上面の何れか一方を実装面として用いることができる。つまり、積層コンデンサ１００を基板等に実装するときにはその下面と上面を実装面として選択的に用いることができるので、実装面が１つしかないものに比べて実装性を向上できる。 Furthermore, according to the multilayer capacitor 100 described above, the opposite-polarity external electrodes 102 and 103 having a U-shape are provided at both end portions in the width direction of the multilayer body 101, so In combination with the connection electrodes 104 and 105 having different polarities on the both end faces, either the lower surface or the upper surface of the multilayer capacitor 100 can be used as the mounting surface when mounted on a substrate or the like. That is, when the multilayer capacitor 100 is mounted on a substrate or the like, the lower surface and the upper surface can be selectively used as the mounting surface, so that the mountability can be improved as compared with the one having only one mounting surface.

さらにまた、前述の積層コンデンサ１００によれば、積層体１０１の幅方向の両端部それぞれにコ字形状を成す異極性の外部電極１０２，１０３を設け、積層体１０１の長さ方向の両端面それぞれに異極性の連結電極１０４，１０５を設けているので、積層体１０１に外部電極１０２，１０３及び連結電極１０４，１０５を形成する際における電極ペーストの塗布作業をローラ塗布法やディップ法等の既知の方法を用いて簡単に行うことができ、これにより積層コンデンサ１００の製造コストの低減を図ることができる。 Furthermore, according to the multilayer capacitor 100 described above, the opposite-polarity external electrodes 102 and 103 having U-shapes are provided at both ends in the width direction of the multilayer body 101, respectively. Since the connection electrodes 104 and 105 having different polarities are provided, the electrode paste application work when forming the external electrodes 102 and 103 and the connection electrodes 104 and 105 on the laminate 101 is known, such as a roller application method or a dipping method. Thus, the manufacturing cost of the multilayer capacitor 100 can be reduced.

図７と図８は図１に示した積層コンデンサの部分変形例をそれぞれ示す、積層コンデンサを上面側から見た斜視図である。 7 and 8 are perspective views of the multilayer capacitor as viewed from the upper surface side, each showing a modification of the multilayer capacitor shown in FIG.

図７は連結電極の変形例を示すもので、同図に示す連結電極１０４’，１０５’は各連結電極用引出し部と接続できる程度の大きさ及び形状で積層体１０１の長さ方向の両端面それぞれに局部的に設けられている。 FIG. 7 shows a modified example of the connecting electrode. The connecting electrodes 104 ′ and 105 ′ shown in FIG. 7 are of a size and shape that can be connected to the connecting electrode lead-out portions, and both ends in the longitudinal direction of the laminate 101. Each surface is provided locally.

図８は外部電極の変形例を示すもので、同図に示し外部電極１０２’，１０３’は図１に示した積層コンデンサ１００の外部電極１０２，１０３から上側及び下側回り込み部１０２ａ，１０３ａ以外を除外した形状を成し、積層体１０１の上面と下面にそれぞれ設けられている。 FIG. 8 shows a modified example of the external electrode. The external electrodes 102 ′ and 103 ′ shown in FIG. 8 are other than the upper and lower wrap-around portions 102a and 103a from the external electrodes 102 and 103 of the multilayer capacitor 100 shown in FIG. Are formed on the upper surface and the lower surface of the laminated body 101, respectively.

［第２実施形態］
図９〜図１３は本発明の第２実施形態を示す。図９は積層コンデンサを上面側から見た斜視図、図１０は図９に示した積層コンデンサの上面図、図１１は図９に示した積層体の内部構造を示す図、図１２は図１０のｂ１−ｂ１線断面図、図１３は図１０のｂ２−ｂ２線断面図である。 [Second Embodiment]
9 to 13 show a second embodiment of the present invention. 9 is a perspective view of the multilayer capacitor as viewed from the top surface side, FIG. 10 is a top view of the multilayer capacitor shown in FIG. 9, FIG. 11 is a diagram showing the internal structure of the multilayer body shown in FIG. 9, and FIG. FIG. 13 is a cross-sectional view taken along line b1-b1, and FIG. 13 is a cross-sectional view taken along line b2-b2 in FIG.

この積層コンデンサ２００は、所定の長さＬ，幅Ｗ及び高さＨを有する直方体形状の積層体２０１と、積層体２０１の長さ方向の両端部それぞれに設けられた異極性の外部電極２０２，２０３と、積層体２０１の幅方向の両端面中央それぞれに設けられた異極性の連結電極２０４，２０５とを備える。 The multilayer capacitor 200 includes a rectangular parallelepiped multilayer body 201 having a predetermined length L, width W, and height H, and external electrodes 202 having different polarities provided at both ends in the length direction of the multilayer body 201, 203 and connecting electrodes 204 and 205 of different polarities provided at the centers of both end faces of the laminate 201 in the width direction.

各外部電極２０２，２０３はキャップ形状を成している。また、各連結電極２０４，２０５は積層体２０１の幅方向の両端面中央を部分的に覆うように設けられており、各連結電極２０４，２０５は積層体２０１の上面及び下面に回り込む部分を有していない。因みに、各外部電極２０２，２０３と各連結電極２０４，２０５はニッケル等の卑金属から成る。 Each external electrode 202, 203 has a cap shape. Each of the connection electrodes 204 and 205 is provided so as to partially cover the center of both end surfaces in the width direction of the multilayer body 201, and each of the connection electrodes 204 and 205 has a portion that goes around the upper surface and the lower surface of the multilayer body 201. Not done. Incidentally, each external electrode 202, 203 and each connection electrode 204, 205 are made of a base metal such as nickel.

積層体２０１は、誘電体層２０６と４種類の内部導体層２０７〜２１０とを図１１に示す順序で積層体２０１の高さ方向に積層して一体化した構造を有している。図１１での図示を省略したが、積層体２０１の高さ方向両側にはマージンを確保するために誘電体層２０６のみが所定層数配されている。因みに、誘電体層２０６はチタン酸バリウム等の誘電体から成り、内部導体層２０７〜２１０はニッケル等の卑金属から成る。 The multilayer body 201 has a structure in which a dielectric layer 206 and four types of internal conductor layers 207 to 210 are laminated and integrated in the height direction of the multilayer body 201 in the order shown in FIG. Although not shown in FIG. 11, only a predetermined number of dielectric layers 206 are arranged on both sides of the stacked body 201 in the height direction in order to ensure a margin. Incidentally, the dielectric layer 206 is made of a dielectric such as barium titanate, and the inner conductor layers 207 to 210 are made of a base metal such as nickel.

４種類の内部導体層２０７〜２１０のうち、内部導体層２０７及び２０８は一方の極性の内部導体層を構成し、内部導体層２０９及び２１０は他方の極性の内部導体層を構成する。図１２及び図１３からも分かるように、４種類の内部導体層２０７〜２１０は内部導体層２０７〜２１０の並びが積層体２０１の高さ方向で所定数（図面では３回）繰り返されるように該積層体２０１内に配されている。つまり、図面における内部導体層２０７〜２１０の層数はそれぞれ３である。 Of the four types of internal conductor layers 207 to 210, the internal conductor layers 207 and 208 constitute an internal conductor layer of one polarity, and the internal conductor layers 209 and 210 constitute an internal conductor layer of the other polarity. As can be seen from FIGS. 12 and 13, the four types of inner conductor layers 207 to 210 are arranged such that the arrangement of the inner conductor layers 207 to 210 is repeated a predetermined number (three times in the drawing) in the height direction of the multilayer body 201. The laminated body 201 is disposed. That is, the number of inner conductor layers 207 to 210 in the drawing is three.

内部導体層２０７は矩形状を成し、長さ方向一端縁に１個の外部電極用引出し部２０７ａを有し、幅方向の一端縁中央に１個の連結電極用引出し部２０７ｂを有する。この内部導体層２０７は請求範囲で言うところの「第１の内部導体層」に相当する。 The internal conductor layer 207 has a rectangular shape, and has one external electrode lead portion 207a at one end edge in the length direction and one connection electrode lead portion 207b at the center of one end edge in the width direction. The inner conductor layer 207 corresponds to the “first inner conductor layer” in the claims.

内部導体層２０８は矩形状を成し、幅方向の一端縁中央（引出し部２０７ｂと同じ側の端縁中央）に１個の連結電極用引出し部２０８ａを有する。連結電極用引出し部２０８ａの位置は内部導体層２０７の連結電極用引出し部２０７ｂの位置と積層体１０１の長さ方向で一致している。この内部導体層２０８は請求範囲で言うところの「第２の内部導体層」に相当する。 The internal conductor layer 208 has a rectangular shape and has one connection electrode lead portion 208a at the center of one end edge in the width direction (center of the end edge on the same side as the lead portion 207b). The position of the connection electrode lead-out portion 208 a coincides with the position of the connection electrode lead-out portion 207 b of the internal conductor layer 207 in the length direction of the multilayer body 101. The inner conductor layer 208 corresponds to the “second inner conductor layer” in the claims.

内部導体層２０９は矩形状を成し、長さ方向他端縁に１個の外部電極用引出し部２０９ａを有し、幅方向の他端縁中央（引出し部２０７ｂ，２０８ａとは反対側の端縁中央）に１個の連結電極用引出し部２０９ｂを有する。この内部導体層２０７は請求範囲で言うところの「第３の内部導体層」に相当する。 The inner conductor layer 209 has a rectangular shape, and has one lead-out portion 209a for the external electrode at the other end in the length direction. The center of the other end edge in the width direction (the end opposite to the lead-out portions 207b and 208a) One connecting electrode lead-out portion 209b is provided at the center of the edge. The inner conductor layer 207 corresponds to the “third inner conductor layer” in the claims.

内部導体層２１０は矩形状を成し、幅方向の他端縁中央（引出し部２０９ｂと同じ側の端縁中央）に１個の連結電極用引出し部２１０ａを有する。連結電極用引出し部２１０ａの位置は内部導体層２０９の連結電極用引出し部２０９ｂの位置と積層体２０１の長さ方向で一致している。この内部導体層２０８は請求範囲で言うところの「第４の内部導体層」に相当する。 The inner conductor layer 210 has a rectangular shape and has one connecting electrode lead portion 210a at the center of the other end edge in the width direction (center of the end edge on the same side as the lead portion 209b). The position of the connection electrode lead-out portion 210 a coincides with the position of the connection electrode lead-out portion 209 b of the internal conductor layer 209 in the length direction of the multilayer body 201. The inner conductor layer 208 corresponds to the “fourth inner conductor layer” in the claims.

各内部導体層２０７の外部電極用引出し部２０７ａは積層体２０１の長さ方向一端部側の外部電極２０２にそれぞれ接続され、連結電極用引出し部２０７ｂは積層体２０１の幅方向一端面側の連結電極２０４にそれぞれ接続されている。また、各内部導体層２０８の連結電極用引出し部２０８ａは積層体２０１の幅方向一端面側の連結電極２０４にそれぞれ接続されている。 The external electrode lead-out portion 207a of each internal conductor layer 207 is connected to the external electrode 202 at one end in the length direction of the multilayer body 201, and the connection electrode lead-out portion 207b is connected to one end surface in the width direction of the multilayer body 201. Each is connected to an electrode 204. Further, the connection electrode lead-out portion 208 a of each internal conductor layer 208 is connected to the connection electrode 204 on the one end surface side in the width direction of the multilayer body 201.

一方、各内部導体層２０９の外部電極用引出し部２０９ａは積層体２０１の長さ方向他端部側の外部電極２０３にそれぞれ接続され、連結電極用引出し部２０９ｂは積層体２０１の幅方向他端面側の連結電極２０５にそれぞれ接続されている。また、各内部導体層２１０の連結電極用引出し部２１０ａは積層体２０１の幅方向他端面側の連結電極２０５にそれぞれ接続されている。 On the other hand, the lead-out portion 209a for the external electrode of each internal conductor layer 209 is connected to the external electrode 203 on the other end side in the length direction of the multilayer body 201, and the lead-out portion 209b for the connection electrode is the other end surface in the width direction of the multilayer body 201. Are connected to the connecting electrode 205 on the side. Further, the connecting electrode lead-out portion 210 a of each inner conductor layer 210 is connected to the connecting electrode 205 on the other end surface side in the width direction of the multilayer body 201.

即ち、一方の連結電極２０４に接続された３層の内部導体層２０７と３層の内部導体層２０８の極性は同じであり、他方の連結電極２０５に接続された３層の内部導体層２０９と３層の内部導体層２１０の極性は同じである。 That is, the polarities of the three inner conductor layers 207 and the three inner conductor layers 208 connected to one connecting electrode 204 are the same, and the three inner conductor layers 209 connected to the other connecting electrode 205 The polarities of the three inner conductor layers 210 are the same.

前述の積層コンデンサ２００にあっては、連結電極２０４，２０５の抵抗率（単位はΩｍ）は外部電極２０２，２０３の抵抗率よりも高く、積層コンデンサ２００それ自体の等価直列抵抗（以下ＥＳＲと言う）は連結電極２０４，２０５の抵抗率に基づいて定められている。以下、この点について詳述する。 In the multilayer capacitor 200 described above, the resistivity (unit: Ωm) of the connecting electrodes 204 and 205 is higher than the resistivity of the external electrodes 202 and 203, and the multilayer capacitor 200 itself has an equivalent series resistance (hereinafter referred to as ESR). ) Is determined based on the resistivity of the connecting electrodes 204 and 205. Hereinafter, this point will be described in detail.

連結電極２０４，２０５と外部電極２０２，２０３は、何れも、予め用意した電極ペーストをディップ法やローラ塗布法等の手法により積層体２０１の所定位置に所定形状で塗布しこれを乾燥して所定温度で焼き付けることによって、或いは、予め用意した電極ペーストをディップ法やローラ塗布法等の手法により焼成前の積層体１０１の所定位置に所定形状で塗布しこれを乾燥して所定温度で積層体１０１と同時焼成することによって形成されるが、ここでは外部電極２０２，２０３用の電極ペーストに抵抗率増加のための組成調整を施したものを連結電極２０４，２０５用の電極ペーストとして用いて連結電極２０４，２０５を形成する。 Each of the connecting electrodes 204 and 205 and the external electrodes 202 and 203 is applied by applying a predetermined electrode paste in a predetermined shape to a predetermined position of the laminated body 201 by a method such as a dipping method or a roller coating method, and drying it. By baking at a temperature, or by applying a prepared electrode paste in a predetermined shape to a predetermined position of the laminated body 101 before firing by a method such as a dipping method or a roller coating method, the laminated body 101 is dried at a predetermined temperature. In this example, the electrode paste for the external electrodes 202 and 203, which is prepared by adjusting the composition for increasing the resistivity, is used as the electrode paste for the connection electrodes 204 and 205. 204, 205 are formed.

例えば、外部電極２０２，２０３用の電極ペーストがニッケル等の卑金属粉末と有機バインダと有機溶剤等を含むものである場合には、前記組成調整方法として、（１）外部電極２０２，２０３用の電極ペーストに誘電体粉末を添加する方法、（２）外部電極２０２，２０３用の電極ペーストにガラスフリットを添加する方法、（３）外部電極２０２，２０３用の電極ペーストの有機バインダの含有割合を増加させる方法、の少なくとも１つが好ましく採用できる。 For example, when the electrode paste for the external electrodes 202 and 203 includes a base metal powder such as nickel, an organic binder, an organic solvent, and the like, the composition adjustment method includes (1) the electrode paste for the external electrodes 202 and 203 A method of adding a dielectric powder, (2) a method of adding glass frit to the electrode paste for the external electrodes 202 and 203, and (3) a method of increasing the content of the organic binder in the electrode paste for the external electrodes 202 and 203. At least one of can be preferably employed.

前記（１）の方法は、例えば誘電体層２０５に含まれる誘電体材料がチタン酸バリウム或いはこれと同系の誘電体、具体的にはＡＢＯ₃で表される誘電体（ＡサイトはＢａ，Ｂａ＋Ｓｒ，Ｂａ＋Ｃａ，Ｂａ＋Ｃａ＋Ｓｒ等、ＢサイトはＴｉ，Ｔｉ＋Ｚｒ等）にＭｎ，Ｖ，Ｃｒ，Ｍｏ，Ｆｅ，Ｎｉ，Ｃｕ，Ｃｏ等の遷移元素とＳｃ，Ｙ，Ｇｄ，Ｄｙ，Ｈｏ，Ｅｒ，Ｙｂ，Ｔｂ，Ｔｍ，Ｌｕ等の希土類元素の少なくとも１種以上を含む同系の誘電体である場合に、チタン酸バリウム粉末または前記同系の誘電体粉末を外部電極２０２，２０３用の電極ペーストに添加することによって組成調整を施す方法である。連結電極２０４，２０５は組成調整によって得た電極ペーストを用いて形成される。組成調整後の電極ペーストに含まれる誘電体粉末及び／または同系の誘電体粉末の重量は卑金属粉末の重量に対して２０〜７０重量％が適正範囲であり、２０重量％未満であると所期の抵抗率低減が効果的に行えず、また、７０重量％を越えると電気伝導が著しく阻害されて電極としての役割が果たせなくなる。 In the method (1), for example, the dielectric material contained in the dielectric layer 205 is a dielectric material represented by barium titanate or a similar dielectric material, specifically, ABO ₃ (A site is Ba, Ba + Sr). , Ba + Ca, Ba + Ca + Sr, etc., B site is Ti, Ti + Zr, etc.) and transition elements such as Mn, V, Cr, Mo, Fe, Ni, Cu, Co and the like, and Sc, Y, Gd, Dy, Ho, Er, Yb, Tb. By adding a barium titanate powder or the same dielectric powder to the electrode paste for the external electrodes 202 and 203 in the case of a similar dielectric containing at least one rare earth element such as Tm, Lu, etc. This is a method of adjusting the composition. The connecting electrodes 204 and 205 are formed using an electrode paste obtained by adjusting the composition. The weight of the dielectric powder and / or the dielectric powder of the same type contained in the electrode paste after the composition adjustment is 20 to 70% by weight with respect to the weight of the base metal powder, and is expected to be less than 20% by weight. The resistivity cannot be effectively reduced, and if it exceeds 70% by weight, the electric conduction is remarkably hindered and cannot serve as an electrode.

前記（２）の方法は、例えば誘電体層２０５に含まれる誘電体材料がチタン酸バリウム或いはこれと前記同系の誘電体である場合に、Ｌｉ₂Ｏ，ＳｉＯ₂，ＢａＯ，Ｂ₂Ｏ₃，Ａｉ₂Ｏ₃，ＣａＯ，ＺｎＯ，ＰｂＯ等の酸化物のうちの少なくとも２種以上を含むガラスフリットを外部電極２０２，２０３用の電極ペーストに添加することによって組成調整を施す方法である。連結電極２０４，２０５は組成調整によって得た電極ペーストを用いて形成される。組成調整後の電極ペーストに含まれるガラスフリットの重量は卑金属粉末の重量に対して１０〜３０重量％が適正範囲であり、１０重量％未満であると所期の抵抗率低減が効果的に行えず、また、３０重量％を越えると電気伝導が著しく阻害されて電極としての役割が果たせなくなる。 In the method (2), for example, when the dielectric material included in the dielectric layer 205 is barium titanate or a dielectric similar to the same, Li ₂ O , SiO ₂ , BaO, B ₂ O ₃ , Ai ₂ O ₃ , CaO, ZnO, glass frit containing at least two of oxides such as PbO is added to the electrode paste for the external electrodes 202 and 203 This is a method for adjusting the composition. The connecting electrodes 204 and 205 are formed using an electrode paste obtained by adjusting the composition. The weight of the glass frit contained in the electrode paste after composition adjustment is 10 to 30% by weight relative to the weight of the base metal powder, and if it is less than 10% by weight, the desired resistivity can be effectively reduced. Further, if it exceeds 30% by weight, the electric conduction is remarkably hindered and the role as an electrode cannot be achieved.

前記（３）の方法は、例えば外部電極２０２，２０３用の電極ペーストにに含まれる有機バインダがエチルセルロース，ヒドロキシエチルセルロース，ニトロセルロース等のセルロース系樹脂、ポリビニルブチラール等のブチラール系樹脂、アクリル樹脂、エポキシ樹脂、フェノール樹脂、ロジン等の少なくとも１種である場合に、これらのうち少なくとも１種以上の有機バインダを外部電極２０２，２０３用の電極ペーストにさらに添加することによって組成調整を施す方法である。連結電極２０４，２０５は組成調整によって得た電極ペーストを用いて形成される。組成調整後の電極ペーストに含まれる有機バインダの重量は卑金属粉末の重量に対して１０〜３０重量％が適正範囲であり、１０重量％未満であると所期の抵抗率低減が効果的に行えず、また、３０重量％を越えると電気伝導が著しく阻害されて電極としての役割が果たせなくなる。 In the method (3), for example, the organic binder contained in the electrode paste for the external electrodes 202 and 203 is a cellulose resin such as ethyl cellulose, hydroxyethyl cellulose, and nitrocellulose, a butyral resin such as polyvinyl butyral, an acrylic resin, and an epoxy. When at least one of resin, phenol resin, rosin and the like is used, the composition is adjusted by further adding at least one organic binder among these to the electrode paste for the external electrodes 202 and 203. The connecting electrodes 204 and 205 are formed using an electrode paste obtained by adjusting the composition. The weight of the organic binder contained in the electrode paste after composition adjustment is 10 to 30% by weight relative to the weight of the base metal powder, and if it is less than 10% by weight, the desired resistivity can be effectively reduced. Further, if it exceeds 30% by weight, the electric conduction is remarkably hindered and the role as an electrode cannot be achieved.

前記（１）〜（３）の方法の少なくとも１つによって組成調整された連結電極２０４，２０５用の電極ペーストを用いて形成された連結電極２０４，２０５には、基本的には連結電極２０４，２０５に含まれる金属粒子の連続率に準じた抵抗率が現れる。連結電極２０４，２０５における電流の流れ易さはこの抵抗率によって主に支配されるが、前記の金属粒子の連続率に応じて連結電極２０４，２０５と内部導体層２０７〜２１０の連結電極用引出し部２０７ｂ，２０８ａ，２０９ｂ，２１０ａとのコンタクト率が変化することもある程度関係する。 The connection electrodes 204 and 205 formed using the electrode paste for the connection electrodes 204 and 205 whose composition is adjusted by at least one of the methods (1) to (3) basically include the connection electrode 204, The resistivity according to the continuity rate of the metal particles contained in 205 appears. The ease of current flow in the connection electrodes 204 and 205 is mainly governed by this resistivity, but the connection electrode lead-out of the connection electrodes 204 and 205 and the inner conductor layers 207 to 210 depends on the continuity rate of the metal particles. The contact rate with the parts 207b, 208a, 209b, and 210a also changes to some extent.

依って、前記（１）〜（３）の方法の少なくとも１つによって組成調整された連結電極２０４，２０５用の電極ペーストを用いて連結電極２０４，２０５を形成すれば、従前と同じ電極形成方法によって、外部電極２０２，２０３よりも抵抗率の高い連結電極２０４，２０５を形成できるし、該抵抗率に基づいて連結電極２０４，２０５の電流の流れ易さを制御して積層コンデンサ２００それ自体のＥＳＲを所望の値に設定できることになる。 Therefore, if the connection electrodes 204 and 205 are formed using the electrode paste for the connection electrodes 204 and 205 whose composition is adjusted by at least one of the methods (1) to (3), the same electrode formation method as before is used. Thus, the connection electrodes 204 and 205 having a higher resistivity than the external electrodes 202 and 203 can be formed, and the ease of current flow through the connection electrodes 204 and 205 is controlled based on the resistivity to control the multilayer capacitor 200 itself. The ESR can be set to a desired value.

因みに、積層コンデンサ２００それ自体のＥＳＲ設定は外部電極２０２，２０３の抵抗率を可変することによっても行うことは可能であるが、外部電極２０２，２０３の抵抗率を高めると積層コンデンサ１００の入出力に影響が出て積層コンデンサ２００本来の機能に支障を生じる可能性が高くなることから、ここでは連結電極２０４，２０５の抵抗率を可変することによって積層コンデンサ２００それ自体のＥＳＲ設定を行うようにしている。 Incidentally, the ESR of the multilayer capacitor 200 itself can be set by changing the resistivity of the external electrodes 202 and 203. However, if the resistivity of the external electrodes 202 and 203 is increased, the input / output of the multilayer capacitor 100 is increased. Therefore, the ESR setting of the multilayer capacitor 200 itself is performed by changing the resistivity of the connection electrodes 204 and 205. ing.

このように、前述の積層コンデンサ２００によれば、４種類の内部導体層２０７〜２１０のうち主に外部電極用引出し部を有しない内部導体層２０８，２１０の層数選定によって所定の静電容量を得ることができる。しかも、誘電体層２０６を介して向き合う内部導体層２０７の連結電極用引出し部２０７ｂと内部導体層２０８の連結電極層用引出し部２０８ａに逆方向に電流が流れ、この電流の流れによって内部電極２０７，２０８にも逆方向に電流が流れるようにすることにより、且つ、誘電体層２０６を介して向き合う内部導体層２０９の連結電極用引出し部２０９ｂと内部導体層２１０の連結電極層用引出し部２１０ａに逆方向に電流が流れ、この電流の流れによって内部電極２０９，２１０にも逆方向に電流が流れるようにすることにより、磁界相殺作用に基づくＥＳＬ低下を図ることができる。つまり、前述の積層コンデンサ２００によれば、デカップリングに必要とされる基本条件、即ち、高静電容量と低ＥＳＬを満足できる。 As described above, according to the multilayer capacitor 200 described above, a predetermined capacitance is selected by selecting the number of the inner conductor layers 208 and 210 that mainly do not have the lead portion for the outer electrode among the four types of inner conductor layers 207 to 210. Can be obtained. In addition, a current flows in the opposite direction to the connecting electrode lead-out portion 207b of the internal conductor layer 207 and the connecting electrode layer lead-out portion 208a of the internal conductor layer 208 facing each other through the dielectric layer 206, and this current flow causes the internal electrode 207 to flow. , 208 so that the current flows in the opposite direction, and the connecting electrode lead portion 209b of the internal conductor layer 209 and the connecting electrode layer lead portion 210a of the internal conductor layer 210 face each other through the dielectric layer 206. The current flows in the reverse direction, and the current flows in the reverse direction to the internal electrodes 209 and 210 by this current flow, so that the ESL can be lowered based on the magnetic field canceling action. That is, the multilayer capacitor 200 described above can satisfy the basic conditions required for decoupling, that is, high capacitance and low ESL.

また、前述の積層コンデンサ２００によれば、連結電極２０４，２０５の抵抗率を外部電極２０２，２０３の抵抗率よりも高くして積層コンデンサ２００それ自体のＥＳＲを連結電極２０４，２０５の抵抗率に基づいて定めているので、連結電極２０４，２０５の抵抗率を適宜可変することによって、実装位置や周囲環境等によって生じる共振を抑制するのに適したＥＳＲを積層コンデンサ２００に的確に設定できる。 Further, according to the multilayer capacitor 200 described above, the resistivity of the connection electrodes 204 and 205 is made higher than that of the external electrodes 202 and 203 so that the ESR of the multilayer capacitor 200 itself becomes the resistivity of the connection electrodes 204 and 205. Therefore, by appropriately changing the resistivity of the connection electrodes 204 and 205, an ESR suitable for suppressing resonance caused by the mounting position, the surrounding environment, and the like can be accurately set in the multilayer capacitor 200.

さらに、前述の積層コンデンサ２００によれば、連結電極２０４，２０５の抵抗率によって積層コンデンサ２００のＥＳＲを調整して設定できるので、積層コンデンサ２００の基本構造を変更することなくそのＥＳＲを調整して設定できる。詳しくは、外部電極２０２，２０３用の電極ペーストに抵抗率増加のための組成調整を施したもの、具体的には前記（１）〜（３）の方法の少なくとも１つによって組成調整された電極ペーストを連結電極２０４，２０５用の電極ペーストとして用いることにより連結電極２０４，２０５の抵抗率の可変を行うので、積層コンデンサ２００それ自体のＥＳＲ設定が簡単に行える。 Furthermore, according to the multilayer capacitor 200 described above, the ESR of the multilayer capacitor 200 can be adjusted and set by the resistivity of the connecting electrodes 204 and 205. Therefore, the ESR can be adjusted without changing the basic structure of the multilayer capacitor 200. Can be set. Specifically, the electrode paste for the external electrodes 202 and 203 is subjected to composition adjustment for increasing the resistivity, specifically, the electrode whose composition is adjusted by at least one of the methods (1) to (3). By using the paste as the electrode paste for the connection electrodes 204 and 205, the resistivity of the connection electrodes 204 and 205 is changed, so that the ESR setting of the multilayer capacitor 200 itself can be easily performed.

さらにまた、前述の積層コンデンサ２００によれば、積層体２０１の長さ方向の両端部それぞれにキャップ形状を成す異極性の外部電極２０２，２０３を設けているので、積層体２０１の幅さ方向の両端面中央それぞれに異極性の連結電極２０４，２０５を設けたことも相俟って、基板等への実装時には積層コンデンサ２００の下面と上面の何れか一方を実装面として用いることができる。つまり、積層コンデンサ２００を基板等に実装するときにはその下面と上面を実装面として選択的に用いることができるので、実装面が１つしかないものに比べて実装性を向上できる。 Furthermore, according to the multilayer capacitor 200 described above, the outer electrodes 202 and 203 having different polarities having cap shapes are provided at both ends in the longitudinal direction of the multilayer body 201. In combination with the connection electrodes 204 and 205 having different polarities at the centers of both end faces, either the lower surface or the upper surface of the multilayer capacitor 200 can be used as a mounting surface when mounted on a substrate or the like. That is, when the multilayer capacitor 200 is mounted on a substrate or the like, the lower surface and the upper surface can be selectively used as the mounting surface, so that the mountability can be improved as compared with the one having only one mounting surface.

さらにまた、前述の積層コンデンサ２００によれば、積層体２０１の長さ方向の両端部それぞれにキャップ形状を成す異極性の外部電極２０２，２０３を設け、積層体２０１の幅方向の両端面中央それぞれに異極性の連結電極２０４，２０５を設けているので、積層体２０１に外部電極２０２，２０３及び連結電極２０４，２０５を形成する際における電極ペーストの塗布作業をローラ塗布法やディップ法等の既知の方法を用いて簡単に行うことができ、これにより積層コンデンサ２００の製造コストの低減を図ることができる。 Furthermore, according to the multilayer capacitor 200 described above, the opposite-polarity external electrodes 202 and 203 having a cap shape are provided at both ends in the length direction of the multilayer body 201, respectively, and the center of both end surfaces in the width direction of the multilayer body 201 is provided. Since the connection electrodes 204 and 205 having different polarities are provided, the electrode paste application operation when forming the external electrodes 202 and 203 and the connection electrodes 204 and 205 on the laminate 201 is known, such as a roller application method or a dip method. This method can be easily performed, and thus the manufacturing cost of the multilayer capacitor 200 can be reduced.

尚、前述の積層コンデンサ２００における連結電極２０４，２０５は各連結電極用引出し部と接続できる程度の大きさ及び形状に変更してもよい。また、外部電極２０２，２０３から幅方向両端面に回り込む部分を除外した形状のものを外部電極２０２，２０３として用いてもよい。 The connecting electrodes 204 and 205 in the multilayer capacitor 200 described above may be changed to a size and shape that can be connected to each connecting electrode lead-out portion. In addition, the external electrodes 202 and 203 may have a shape excluding a portion that wraps around both end surfaces in the width direction from the external electrodes 202 and 203.

本発明の第１実施形態を示す、積層コンデンサを上面側から見た斜視図である。It is the perspective view which looked at the multilayer capacitor from the upper surface side which shows 1st Embodiment of this invention. 図１に示した積層コンデンサの上面図である。FIG. 2 is a top view of the multilayer capacitor illustrated in FIG. 1. 図１に示した積層体の内部構造を示す図である。It is a figure which shows the internal structure of the laminated body shown in FIG. 図２のａ１−ａ１線断面図である。It is the a1-a1 sectional view taken on the line of FIG. 図２のａ２−ａ２線断面図である。FIG. 3 is a cross-sectional view taken along line a2-a2 of FIG. 図２のａ３−ａ３線断面図である。It is the a3-a3 sectional view taken on the line of FIG. 図１に示した積層コンデンサの部分変形例を示す、積層コンデンサを上面側から見た斜視図である。FIG. 7 is a perspective view of the multilayer capacitor as viewed from the upper surface side, showing a partial modification of the multilayer capacitor shown in FIG. 1. 図１に示した積層コンデンサの部分変形例を示す、積層コンデンサを上面側から見た斜視図である。FIG. 7 is a perspective view of the multilayer capacitor as viewed from the upper surface side, showing a partial modification of the multilayer capacitor shown in FIG. 1. 本発明の第２実施形態を示す、積層コンデンサを上面側から見た斜視図である。It is the perspective view which looked at the multilayer capacitor from the upper surface side which shows 2nd Embodiment of this invention. 図９に示した積層コンデンサの上面図である。FIG. 10 is a top view of the multilayer capacitor illustrated in FIG. 9. 図９に示した積層体の内部構造を示す図である。It is a figure which shows the internal structure of the laminated body shown in FIG. 図１０のｂ１−ｂ１線断面図である。It is the b1-b1 sectional view taken on the line of FIG. 図１０のｂ２−ｂ２線断面図である。It is b2-b2 sectional view taken on the line of FIG.

符号の説明Explanation of symbols

１００…積層コンデンサ、１０１…積層体、１０２，１０３，１０２’，１０３’…外部電極、１０４，１０５，１０４’，１０５’…連結電極、１０６…誘電体層、１０７〜１１２…内部導体層、１０７ａ，１０８ａ，１１０ａ，１１１ａ…外部電極用引出し部、１０７ｂ，１０８ｂ，１０９ａ，１１０ｂ，１１１ｂ，１１２ａ…連結電極用引出し部、２００…積層コンデンサ、２０１…積層体、２０２，２０３…外部電極、２０４，２０５…連結電極、２０６…誘電体層、２０７〜２１０…内部導体層、２０７ａ，２０９ａ…外部電極用引出し部、２０７ｂ，２０８ａ，２０９ｂ，２１０ａ…連結電極用引出し部。 DESCRIPTION OF SYMBOLS 100 ... Multilayer capacitor, 101 ... Multilayer body, 102, 103, 102 ', 103' ... External electrode, 104, 105, 104 ', 105' ... Connection electrode, 106 ... Dielectric layer, 107-112 ... Internal conductor layer, 107a, 108a, 110a, 111a ... extracting part for external electrode, 107b, 108b, 109a, 110b, 111b, 112a ... extracting part for connecting electrode, 200 ... multilayer capacitor, 201 ... multilayered body, 202,203 ... external electrode, 204 205, connecting electrodes, 206, dielectric layers, 207 to 210, inner conductor layers, 207a, 209a, lead-out portions for external electrodes, 207b, 208a, 209b, 210a, lead-out portions for connecting electrodes.

Claims

誘電体層と異極性の内部導体層とを所定の順序で積層して一体化した構造を有する直方体形状の積層体と、積層体の表面に設けられた異極性の外部電極と、積層体の表面に設けられた異極性の連結電極とを備え、一方の極性の内部導体層は、一方の極性の外部電極に接続された外部電極用引出し部と一方の極性の連結電極に接続された連結電極用引出し部とを有する第１の内部導体層と、一方の極性の連結電極に接続された連結電極用引出し部を有する第２の内部導体層とを含み、また、他方の極性の内部導体層は、他方の極性の外部電極に接続された外部電極用引出し部と他方の極性の連結電極に接続された連結電極用引出し部とを有する第３の内部導体層と、他方の極性の連結電極に接続された連結電極用引出し部を有する第４の内部導体層とを含む積層コンデンサであって、
前記異極性の連結電極の抵抗率は前記異極性の外部電極の抵抗率よりも高く、積層コンデンサそれ自体の等価直列抵抗は該異極性の連結電極の抵抗率に基づいて定められている、
ことを特徴とする積層コンデンサ。 A rectangular parallelepiped laminate having a structure in which a dielectric layer and a different polarity internal conductor layer are laminated and integrated in a predetermined order; a different polarity external electrode provided on the surface of the laminate; A connecting electrode of different polarity provided on the surface, the inner conductor layer of one polarity is connected to the lead-out portion for the external electrode connected to the outer electrode of one polarity and the connecting electrode of one polarity A first inner conductor layer having an electrode lead portion and a second inner conductor layer having a connecting electrode lead portion connected to one polarity connecting electrode, and the other polar inner conductor. The layer includes a third internal conductor layer having an external electrode lead portion connected to the other polarity external electrode and a connection electrode lead portion connected to the other polarity connection electrode, and the other polarity connection. A fourth internal conductor having a connecting electrode lead portion connected to the electrode; A multilayer capacitor comprising a layer,
The resistivity of the heteropolar connection electrode is higher than the resistivity of the heteropolar external electrode, and the equivalent series resistance of the multilayer capacitor itself is determined based on the resistivity of the heteropolar connection electrode.
A multilayer capacitor characterized by that.

第１の内部導体層は外部電極用引出し部の位置が異なる２種類の内部導体層から成り、第３の内部導体層は外部電極用引出し部の位置が異なる２種類の内部導体層から成り、第２の内部導体層と第４の内部導体層はそれぞれ１種類の内部導体層から成る、
ことを特徴とする請求項１に記載の積層コンデンサ。 The first internal conductor layer is composed of two types of internal conductor layers with different positions of the external electrode lead portions, and the third internal conductor layer is composed of two types of internal conductor layers with different positions of the external electrode lead portions, Each of the second inner conductor layer and the fourth inner conductor layer comprises one type of inner conductor layer.
The multilayer capacitor according to claim 1.

連結電極は、外部電極用の電極ペーストの組成を調整する方法によって得た電極ペーストを連結電極用の電極ペーストとして用いて形成されている、
ことを特徴とする請求項１または２に記載の積層コンデンサ。 The connection electrode is formed using the electrode paste obtained by the method of adjusting the composition of the electrode paste for the external electrode as the electrode paste for the connection electrode.
The multilayer capacitor according to claim 1 or 2, wherein

外部電極用の電極ペーストの組成を調整する方法は、外部電極用の電極ペーストに誘電体粉末を添加する方法である、
ことを特徴とする請求項３に記載の積層コンデンサ。 The method of adjusting the composition of the electrode paste for external electrodes is a method of adding dielectric powder to the electrode paste for external electrodes.
The multilayer capacitor according to claim 3.

外部電極用の電極ペーストの組成を調整する方法は、外部電極用の電極ペーストにガラスフリットを添加する方法である、
ことを特徴とする請求項３に記載の積層コンデンサ。 The method of adjusting the composition of the electrode paste for external electrodes is a method of adding glass frit to the electrode paste for external electrodes.
The multilayer capacitor according to claim 3.

外部電極用の電極ペーストの組成を調整する方法は、外部電極用の電極ペーストの有機バインダの含有割合を増加させる方法である、
ことを特徴とする請求項３に記載の積層コンデンサ。 The method of adjusting the composition of the electrode paste for the external electrode is a method for increasing the content of the organic binder in the electrode paste for the external electrode.
The multilayer capacitor according to claim 3.