JP2007333661A - Method and apparatus for visual inspection of electronic component - Google Patents

Method and apparatus for visual inspection of electronic component Download PDF

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JP2007333661A
JP2007333661A JP2006168324A JP2006168324A JP2007333661A JP 2007333661 A JP2007333661 A JP 2007333661A JP 2006168324 A JP2006168324 A JP 2006168324A JP 2006168324 A JP2006168324 A JP 2006168324A JP 2007333661 A JP2007333661 A JP 2007333661A
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inspection
image
appearance
illumination means
inspection object
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Tokuya Umada
督也 馬田
Takao Okamoto
孝雄 岡本
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a visual inspection method and a visual inspection apparatus therefor that enable quick and accurate geometric and visual inspections by easily extracting areas to be inspected of inspection objects. <P>SOLUTION: The method for visual inspection of an electronic component comprises a first step of capturing a first inspection image including an inspection object 2 placed on an inspection mount 1 as lighting all the sides of the inspection object 2 with a first lighting means 3, a second step of extracting only the contours of the inspection object 2 from the first inspection image to produce a second inspection image, a third step of measuring the geometry of the contours on the second inspection image to inspect it for conformity, a fourth step of capturing a third inspection image as lighting the top of the inspection object 2 with a second lighting means 4, a fifth step of matching the second and third inspection images against each other and extracting only the image inside the contours on the second inspection image from the third inspection image to produce a fourth inspection image, and a sixth step of inspecting the inspection object on the fourth inspection image for visual conformity. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子部品の外観検査方法およびそれに用いる外観検査装置に関するものである。   The present invention relates to an appearance inspection method for an electronic component and an appearance inspection apparatus used therefor.

被検査物である電子部品の検査対象面を撮像した画像から形状寸法や割れ、欠けなどの欠陥を検出する際には、撮像した画像の中から電子部品が占める領域を検査領域として抽出し決定する必要がある。従来は外観検査装置のオペレータが撮像した画像に対し手入力で指定をしていた。   When detecting defects such as shape dimensions, cracks, and chips from an image of an inspection target surface of an electronic component that is an object to be inspected, the area occupied by the electronic component is extracted from the captured image and determined There is a need to. Conventionally, an image picked up by an operator of the visual inspection apparatus is manually specified.

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献１が知られている。
特許第３６７９４７１号公報 As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent No. 3679471

上記従来例では、手入力では検査領域を指定する精度が低く、特に電子部品の形状寸法にばらつきが大きいものでは、個々に検査領域を入力して指定する必要があり、検査精度が低かった。   In the above-described conventional example, the accuracy of specifying the inspection area by manual input is low, and particularly when there is a large variation in the shape and size of the electronic component, it is necessary to input and specify the inspection area individually, and the inspection accuracy is low.

そこで、検査対象面を撮像した画像情報から検査領域を自動的に決定する外観検査方法および外観検査装置が開発された。被検査物を中心に対称な位置に設けた２台のカメラと１台の照明手段からなり、透過光による画像情報から検査領域を抽出して決定し、反射光による画像情報から外観検査を行う手法である。   Therefore, an appearance inspection method and an appearance inspection apparatus that automatically determine an inspection area from image information obtained by imaging an inspection target surface have been developed. It consists of two cameras and one illuminating means provided symmetrically with the object to be inspected as the center, extracts and determines the inspection area from the image information by transmitted light, and performs an appearance inspection from the image information by reflected light It is a technique.

しかしながら上記従来の技術によれば、透過光および反射光の両方の画像を撮像するため被検査対象物を中心として同軸上の対称位置に少なくとも２台以上のカメラが必要となり、透過光による画像と反射光による画像の位置をモニタ上で正確に一致させることが難しいため、検査精度が低かった。   However, according to the above-described conventional technique, in order to capture both transmitted light and reflected light images, at least two cameras are required at symmetrical positions on the same axis about the object to be inspected. Inspection accuracy is low because it is difficult to accurately match the position of the reflected light image on the monitor.

そこで本発明は上記従来の課題を解決するもので、検査精度を高めることを目的とする。   SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems and aims to increase inspection accuracy.

上記目的を達成するために本発明は、検査台に載置した被検査物の側面全周側より第一の照明手段を照射して前記被検査物を含む第一の検査画像を撮像する第一の工程と、前記第一の検査画像から前記被検査物の輪郭のみを抽出して第二の検査画像とする第二の工程と、前記第二の検査画像から輪郭の形状寸法を測定し良否を判定する第三の工程と、前記被検査物の上面側より第二の照明手段を照射して第三の検査画像を撮像する第四の工程と、前記第二、第三の検査画像を照合し、第三の検査画像から前記第二の検査画像の輪郭の内側のみの画像を抽出して第四の検査画像とする第五の工程と、前記第四の検査画像から被検査物の外観の良否を判定する第六の工程とからなる電子部品の外観検査方法であって、この外観検査方法によれば、１台のみのカメラで撮像した検査画像から被検査物の検査対象領域を正確に抽出して特定できるため、外観検査の精度を高めることができる。   In order to achieve the above object, the present invention provides a first inspection image including the inspection object by irradiating the first illuminating means from the entire circumference of the side surface of the inspection object placed on the inspection table. A first step, a second step of extracting only the contour of the object to be inspected from the first inspection image to obtain a second inspection image, and measuring a shape dimension of the contour from the second inspection image. A third step of determining pass / fail, a fourth step of capturing a third inspection image by irradiating the second illumination means from the upper surface side of the inspection object, and the second and third inspection images. A fifth step of extracting an image only inside the contour of the second inspection image from the third inspection image to obtain a fourth inspection image, and an object to be inspected from the fourth inspection image Electronic component external appearance inspection method comprising the sixth step of determining the quality of the external appearance, according to this visual inspection method, Because can be identified to accurately extract the inspection area of the object to be inspected from the inspection image captured by only a camera platform, it is possible to improve the accuracy of the visual inspection.

以上のように本発明の電子部品の外観検査方法および外観検査装置によれば、第一の照明手段で被検査物の側面全周方向から照明するため、検査対象領域が被検査物の天面の場合、その輪郭を抽出して特定することが容易である。さらに被検査物の上方より第二の照明手段で照明して撮像した検査画像と、前記輪郭を照合することで、輪郭の内側の画像データのみを検査対象領域とすることができる。そのため、輪郭から形状寸法を、輪郭内の画像データから外観の良否を判定できるため、外観検査の精度を高めることができる。さらに上記方法を、１台のカメラのみで実現することができるため、複数のカメラ間の光軸調整が不要となり、その結果、外観検査の精度を高めることができる作用効果も同時に奏するものである。   As described above, according to the appearance inspection method and the appearance inspection apparatus for an electronic component of the present invention, the first illumination unit illuminates from the entire circumference of the side surface of the object to be inspected. In this case, it is easy to extract and specify the contour. Furthermore, by collating the outline with the inspection image illuminated by the second illumination means from above the inspection object, only the image data inside the outline can be set as the inspection target area. Therefore, since the shape dimension can be determined from the outline and the appearance quality can be determined from the image data in the outline, the accuracy of the appearance inspection can be increased. Furthermore, since the above method can be realized with only one camera, it is not necessary to adjust the optical axis between a plurality of cameras, and as a result, the effect of improving the accuracy of appearance inspection can be achieved simultaneously. .

以下、本発明の一実施の形態における電子部品の外観検査方法および外観検査装置を、図面を参照しながら説明する。   Hereinafter, an appearance inspection method and an appearance inspection apparatus for an electronic component according to an embodiment of the present invention will be described with reference to the drawings.

図１は、本発明の一実施の形態における電子部品の外観検査装置の構成図である。   FIG. 1 is a configuration diagram of an electronic component appearance inspection apparatus according to an embodiment of the present invention.

検査台１に載置された被検査物２は、第一の照明手段３および第二の照明手段４により照明され、対物レンズ５を介して撮像手段６により撮像され、画像情報は後段の画像処理器８で保存される。   The inspection object 2 placed on the inspection table 1 is illuminated by the first illuminating means 3 and the second illuminating means 4, and is imaged by the imaging means 6 through the objective lens 5, and the image information is the subsequent image. It is stored in the processor 8.

ここで第一の照明手段３としては、ＬＥＤや蛍光灯などの照射源をリング状に複数配置したもの、光ファイバをリング状に複数配置し、外部光源から光ファイバを介して光を照射させる照明手段である。光ファイバの先端にはレンズ等の光学手段を有しており、光ファイバからの光がリングの中心方向に指向するように設計されている。また、第一の照明手段３には、被検査物２に対して略垂直方向に上下動可能な機構が設けられており、外観検査時には被検査物２の側面全周より光を照射できる高さに第一の照明手段３を移動させる。被検査物２の画像を撮像後、第一の照明手段３は、インデックス機能付の搬送テーブル７の移動に同期し干渉しないように上方に移動して回避する。第二の照明手段４は被検査物２の表面で光が反射するように蛍光灯やＬＥＤをリング状に配置したものや、ハロゲンランプなどによる照射源とした。検査台１の色は、被検査物２の色に対して補色の関係となる色を選択することで、被検査物２と検査台１とのコントラスト差を大きくできるため、後に詳細を述べる被検査物２の輪郭を抽出するときに有利となる。一例を挙げると、被検査物２がチップ抵抗の場合、その色は白色となるため、検査台１の色は黒色を選択すればよい。   Here, as the first illumination means 3, a plurality of irradiation sources such as LEDs and fluorescent lamps are arranged in a ring shape, a plurality of optical fibers are arranged in a ring shape, and light is irradiated from an external light source through the optical fiber. Illumination means. An optical means such as a lens is provided at the tip of the optical fiber and is designed so that light from the optical fiber is directed toward the center of the ring. The first illumination means 3 is provided with a mechanism that can move up and down in a direction substantially perpendicular to the object to be inspected 2. Then, the first illumination means 3 is moved. After taking an image of the object 2 to be inspected, the first illuminating means 3 moves upward so as not to interfere with the movement of the transport table 7 with the index function to avoid it. The second illuminating means 4 is an irradiation source such as a fluorescent lamp or LED arranged in a ring shape so that light is reflected on the surface of the inspection object 2 or a halogen lamp. The color of the inspection table 1 can increase the contrast difference between the inspection object 2 and the inspection table 1 by selecting a color that is complementary to the color of the inspection object 2. This is advantageous when the contour of the inspection object 2 is extracted. As an example, when the object to be inspected 2 is a chip resistor, its color is white, so that the color of the inspection table 1 may be black.

第一の照明手段３により被検査物２は、その側面全周方向より照明される。そのため、第一の照明手段３による照明は、被検査物２の周辺を照明し、また被検査物の天面の稜線のみが強調して照明されることになる。したがって、検査対象領域が被検査物２の天面である場合、前記被検査物２の天面の稜線のみ輪郭として強調して撮像することが可能である。さらに第二の照明手段４により、被検査物２はその上方より照明される。そのため、検査対象面を含む全面が照明されることになる。   The inspection object 2 is illuminated by the first illumination means 3 from the entire circumferential direction of the side surface. Therefore, the illumination by the 1st illumination means 3 illuminates the periphery of the to-be-inspected object 2, and only the ridgeline of the top | upper surface of an to-be-inspected object is emphasized and illuminated. Therefore, when the inspection target area is the top surface of the inspection object 2, it is possible to emphasize and image only the ridge line of the top surface of the inspection object 2 as an outline. Further, the inspection object 2 is illuminated from above by the second illumination means 4. Therefore, the entire surface including the inspection target surface is illuminated.

上記の第一、第二の照明手段３、４で照明されて撮像された検査画像は、画像処理器８で演算処理される。例えば、第一の照明手段３により照明されて撮像された検査画像は、２値化などの手法でエッジ強調され、被検査物２の検査対象領域の輪郭を抽出する。その輪郭の形状寸法を測定し、形状不良の有無を判定する。この抽出された輪郭と、第二の照明手段４により照明されて撮像された検査画像とを照合し、前記輪郭の内側のみを検査対象領域として抽出し、外観不良の有無を判定する。判定結果は、画像処理器８に接続されたＰＣなどのモニタ９に表示される。   The inspection image illuminated and imaged by the first and second illumination means 3 and 4 is subjected to arithmetic processing by the image processor 8. For example, an inspection image illuminated and imaged by the first illumination means 3 is edge-enhanced by a technique such as binarization, and the contour of the inspection target area of the inspection object 2 is extracted. The shape of the contour is measured to determine the presence or absence of a shape defect. The extracted contour and the inspection image illuminated and imaged by the second illuminating means 4 are collated, and only the inside of the contour is extracted as a region to be inspected to determine the presence or absence of an appearance defect. The determination result is displayed on a monitor 9 such as a PC connected to the image processor 8.

第一、第二の照明手段３、４は、照明切替装置１０に接続され、照明切替装置１０は画像処理器８に相互に接続されている。画像処理器８からの命令信号により、第一の照明手段３の照明による検査画像と、第二の照明手段４の照明による検査画像とを順次画像処理器８で演算処理してもよいし、ＬＥＤなどの高速応答の光源を選択することにより、第一、第二の照明手段３、４による撮像を瞬時に行い、その両方の検査画像を演算処理して良否判定してもよい。   The first and second illumination means 3 and 4 are connected to the illumination switching device 10, and the illumination switching device 10 is connected to the image processor 8. According to a command signal from the image processor 8, the inspection image by the illumination of the first illumination unit 3 and the inspection image by the illumination of the second illumination unit 4 may be sequentially processed by the image processor 8, By selecting a light source of high-speed response such as an LED, imaging by the first and second illumination means 3 and 4 may be performed instantaneously, and both inspection images may be arithmetically processed to determine pass / fail.

このとき、照明切替装置１０と搬送テーブル７とを同期させることで、高速に外観検査を行うことが可能となる。   At this time, it is possible to perform an appearance inspection at a high speed by synchronizing the illumination switching device 10 and the transport table 7.

図２は被検査物２の一例の外観形状を示す斜視図である。１１ａおよび１１ｂは被検査物２の側面、１２は被検査物２の天面、１３は天面１２に形成されたパターンをそれぞれ示している。本実施例では、チップ抵抗やチップコンデンサなどの電子部品を想定したものである。   FIG. 2 is a perspective view showing an external shape of an example of the inspection object 2. Reference numerals 11a and 11b denote side surfaces of the inspection object 2, reference numeral 12 denotes a top surface of the inspection object 2, and reference numeral 13 denotes a pattern formed on the top surface 12, respectively. In this embodiment, electronic parts such as a chip resistor and a chip capacitor are assumed.

次に図３に示す処理フローを用いて本発明の外観検査方法の詳細を説明する。   Next, the details of the appearance inspection method of the present invention will be described using the processing flow shown in FIG.

まず初めに検査スタート（１４）を実行する。次に検査台の背景色の選択（１５）を実行し、被検査物２の色を参照して検査台１の色が補色となるように選択する。このように検査台を被検査物の色に応じて適宜変更することにより、検査台１と被検査物２とのコントラスト差を大きくでき、後段での画像処理における輪郭抽出が容易となる。次に外観検査のスタート操作（１６）を行い、搬送テーブル７のインデックス機能を作動させて検査する部品の搬入（１７）を行い位置決めして停止する。次に照明手段の選択（１８）を実施し、第一の照明手段３を選択する。このとき、第一の照明手段３に設けられている上下動可能な機構により被検査物２の側面全周方向より光を照射するように第一の照明手段３の位置が調整される。同時に撮像手段６の焦点位置を調整し、ホワイトバランスやゲイン調整の後に撮像を行い、第一の検査画像として画像処理器８内にあるメモリへ保存する。次に検査領域の抽出（１９）を画像処理器８で行う。   First, an inspection start (14) is executed. Next, the background color of the inspection table is selected (15), and the color of the inspection table 1 is selected to be a complementary color with reference to the color of the inspection object 2. Thus, by appropriately changing the inspection table according to the color of the object to be inspected, the contrast difference between the inspection table 1 and the object to be inspected 2 can be increased, and the contour extraction in the subsequent image processing becomes easy. Next, an appearance inspection start operation (16) is performed, the index function of the transport table 7 is activated, parts to be inspected are loaded (17), and positioning is stopped. Next, the illumination means is selected (18), and the first illumination means 3 is selected. At this time, the position of the 1st illumination means 3 is adjusted so that light may be irradiated from the perimeter of the side surface of the to-be-inspected object 2 with the mechanism which can be moved up and down provided in the 1st illumination means 3. FIG. At the same time, the focal position of the image pickup means 6 is adjusted, the image is taken after white balance and gain adjustment, and is stored in a memory in the image processor 8 as a first inspection image. Next, extraction (19) of the inspection area is performed by the image processor 8.

ここで、図４に示す検査画像の一例を用いて検査領域の抽出（１９）の詳細を説明する。   Here, details of the inspection area extraction (19) will be described using an example of the inspection image shown in FIG.

図４（ａ）は、第一の照明手段３により照明されて撮像された被検査物２の第一の検査画像の一例の模式図である。   FIG. 4A is a schematic diagram of an example of a first inspection image of the inspection object 2 illuminated and imaged by the first illumination unit 3.

２８は被検査物２の天面の輪郭を示しており、１は被検査物２の背景である検査台を示している。画像処理器８の内部では、前記第一の検査画像を二値化などの演算処理を行い、被検査物２と検査台１との境界を強調して、第二の検査画像として保存する。強調された境界は被検査物２の輪郭２８と認識され外形寸法Ｌ１およびＬ２を測定する。   Reference numeral 28 denotes the outline of the top surface of the inspection object 2, and 1 denotes an inspection table which is the background of the inspection object 2. Inside the image processor 8, the first inspection image is subjected to arithmetic processing such as binarization, and the boundary between the inspection object 2 and the inspection table 1 is emphasized and stored as a second inspection image. The emphasized boundary is recognized as the contour 28 of the inspection object 2, and the outer dimensions L1 and L2 are measured.

測定結果はあらかじめ入力しておいた外形寸法の規格値と比較し（２０）、規格外であれば不良内容の表示（２６）を行い、搬送テーブル７を動作させて部品の搬出（２５）を行う。規格内であれば次の照明手段の選択（２１）へ進む。ここでは、第二の照明手段４を選択し撮像手段６で第三の検査画像を撮像し画像処理器８内のメモリへ保存する。   The measurement result is compared with the standard value of the external dimension inputted in advance (20). If it is out of the standard, the defect content is displayed (26), and the carrying table 7 is operated to carry out the part (25). Do. If it is within the standard, the process proceeds to the next selection of illumination means (21). Here, the second illumination means 4 is selected, and the third inspection image is picked up by the image pickup means 6 and stored in the memory in the image processor 8.

図４（ｂ）は第三の検査画像の一例を示しており、２は被検査物、１３は被検査物２の天面に形成されたパターンをそれぞれ示している。（１９）で決定した検査領域のみの画像データを抽出（２２）するため以下の処理を画像処理器８で行う。   FIG. 4B shows an example of a third inspection image, in which 2 indicates an inspection object and 13 indicates a pattern formed on the top surface of the inspection object 2. The following processing is performed by the image processor 8 in order to extract (22) image data of only the inspection region determined in (19).

図４（ａ）に示す第一の検査画像から抽出した輪郭２８およびその形状寸法データと図４（ｂ）に示す第三の検査画像とを照合し、輪郭２８の内側の領域のみを検査対象領域であると定義し、その他の領域３０の画像データはすべて削除することで、図４（ｃ）に示す第四の検査画像として保存する。そして、図４（ｃ）に示す破線２９の内部のみを検査領域として外観検査を実行する（２３）。そして主にパターン１３形成領域において、割れ、欠け、こぶなど不良部３１の外観品質の良否を判定し、規格外であれば不良内容の表示（２７）を行って搬送テーブル７により被検査物２を搬出する（２５）。規格内であれば、検査合格の表示（２４）を行い、搬送テーブル７により被検査物２を搬出し、次の被検査物２の検査を開始する。この（１４）〜（２７）の工程を繰り返し行って外観検査を実施する。   The contour 28 extracted from the first inspection image shown in FIG. 4A and its shape / dimension data are collated with the third inspection image shown in FIG. 4B, and only the area inside the contour 28 is inspected. It is defined as an area, and all the image data in the other area 30 are deleted, and saved as a fourth inspection image shown in FIG. Then, the appearance inspection is executed with only the inside of the broken line 29 shown in FIG. 4C as the inspection region (23). Then, mainly in the pattern 13 formation region, the quality of the appearance of the defective portion 31 such as cracks, chips, or humps is determined. If it is out of specification, the defect contents are displayed (27) and the inspection table 2 is checked by the transfer table 7. Is carried out (25). If it is within the standard, the inspection pass display (24) is performed, the inspection object 2 is carried out by the transport table 7, and the inspection of the next inspection object 2 is started. The steps (14) to (27) are repeatedly performed to perform an appearance inspection.

上記実施例は、検査領域の抽出（１９）、外形寸法の検査（２０）、照明手段の選択（２１）、検査領域のみの画像データを抽出（２２）、外観検査(２３)を順次行っているが、照明手段の選択、点灯（１８）および（２１）を交互に同期させて照明し撮像することで、外形寸法の検査（２０）と外観検査（２３）を同時に行っても良い。   In the above embodiment, inspection area extraction (19), external dimension inspection (20), selection of illumination means (21), image data of only the inspection area is extracted (22), and appearance inspection (23) is sequentially performed. However, the external dimension inspection (20) and the external appearance inspection (23) may be performed at the same time by alternately illuminating and selecting the illumination means and lighting (18) and (21).

本発明に係る電子部品の外観検査方法および外観検査装置は、第一の照明手段で被検査物の側面全周方向から照明するため、検査対象領域が被検査物の天面の場合、その輪郭を抽出して特定することが容易である。さらに被検査物の上方より第二の照明手段で照明して撮像した検査画像と、前記輪郭を照合することで、輪郭の内側の画像データのみを検査対象領域とすることができる。そのため、輪郭から形状寸法を、輪郭内の画像データから外観の良否を判定できるため、外観検査の精度を高めることができる。さらに上記方法を、１台のカメラのみで実現することができるため、複数のカメラ間の光軸調整が不要となり、その結果、外観検査の精度を高めることができる作用効果も同時に奏するものであり、電子部品の外観検査方法やそれに用いる外観検査装置として有用である。   The appearance inspection method and the appearance inspection apparatus for an electronic component according to the present invention illuminate from the entire circumference of the side surface of the object to be inspected by the first illumination means. It is easy to extract and specify. Furthermore, by collating the outline with the inspection image illuminated by the second illumination means from above the inspection object, only the image data inside the outline can be set as the inspection target area. Therefore, since the shape dimension can be determined from the outline and the appearance quality can be determined from the image data in the outline, the accuracy of the appearance inspection can be increased. Furthermore, since the above method can be realized with only one camera, it is not necessary to adjust the optical axis between a plurality of cameras, and as a result, there is an effect that can improve the accuracy of appearance inspection at the same time. It is useful as an appearance inspection method for electronic parts and an appearance inspection apparatus used therefor.

本発明の一実施の形態における外観検査装置の構成図Configuration diagram of an appearance inspection apparatus according to an embodiment of the present invention 被検査物の一例の外観斜視図External perspective view of an example of inspection object 本発明の一実施の形態における外観検査方法の処理フロー図Process flow diagram of appearance inspection method in one embodiment of the present invention 同処理フロー図における処理画像の一例を示す模式図Schematic diagram showing an example of a processed image in the processing flow diagram

符号の説明Explanation of symbols

１ 検査台
２ 被検査物
３ 第一の照明手段
４ 第二の照明手段
６ 撮像手段
８ 画像処理器 DESCRIPTION OF SYMBOLS 1 Inspection table 2 Inspected object 3 1st illumination means 4 2nd illumination means 6 Imaging means 8 Image processor

Claims (4)

検査台に載置した被検査物の側面全周側より第一の照明手段を照射して前記被検査物を含む第一の検査画像を撮像する第一の工程と、前記第一の検査画像から前記被検査物の輪郭のみを抽出して第二の検査画像とする第二の工程と、前記第二の検査画像から輪郭の形状寸法を測定し良否を判定する第三の工程と、前記被検査物の上面側より第二の照明手段を照射して第三の検査画像を撮像する第四の工程と、前記第二、第三の検査画像を照合し、第三の検査画像から前記第二の検査画像の輪郭の内側のみの画像を抽出して第四の検査画像とする第五の工程と、前記第四の検査画像から被検査物の外観の良否を判定する第六の工程とからなる電子部品の外観検査方法。 A first step of capturing a first inspection image including the inspection object by irradiating the first illumination means from the entire side surface of the inspection object placed on the inspection table; and the first inspection image. A second step of extracting only the contour of the object to be inspected from the second inspection image, a third step of measuring the shape dimension of the contour from the second inspection image, and determining pass / fail, A fourth step of capturing the third inspection image by irradiating the second illumination means from the upper surface side of the inspection object, the second and third inspection images are collated, and the third inspection image A fifth step of extracting an image only inside the contour of the second inspection image to form a fourth inspection image, and a sixth step of determining the quality of the inspection object from the fourth inspection image A method for inspecting the appearance of electronic components. 検査台の色と被検査物の色とが互いに補色である請求項１に記載の電子部品の外観検査方法。 The method for inspecting the appearance of an electronic component according to claim 1, wherein the color of the inspection table and the color of the inspection object are complementary colors. 検査台に載置した被検査物に照射する複数の照明手段と、これらの照明手段により照明された前記被検査物を撮像するための撮像部と、この撮像部により撮像した前記被検査物の画像から外観形状の不良の有無を判断する画像処理手段とを備えた外観検査装置であって、前記複数の照明手段が、被検査物の側面全周方向から照射する第一の照明手段と、上面方向から照射する第二の照明手段とからなり、前記第一、第二の照明手段による検査画像から前記被検査物の検査領域のみを抽出して外観形状の不良の有無を判断する外観検査装置。 A plurality of illumination means for irradiating the inspection object placed on the inspection table, an imaging part for imaging the inspection object illuminated by these illumination means, and the inspection object imaged by the imaging part An image inspection means for determining the presence or absence of an appearance shape defect from an image, wherein the plurality of illumination means irradiates from the entire circumference of the side surface of the inspection object; Appearance inspection comprising second illumination means for irradiating from the upper surface direction, and extracting only the inspection area of the inspection object from the inspection images by the first and second illumination means to determine the presence or absence of an appearance shape defect apparatus. 検査台の色と被検査物の色が補色の関係にある請求項３に記載の電子部品の外観検査装置。 4. The electronic component appearance inspection apparatus according to claim 3, wherein the color of the inspection table and the color of the object to be inspected have a complementary color relationship.
JP2006168324A 2006-06-19 2006-06-19 Method and apparatus for visual inspection of electronic component Pending JP2007333661A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010107254A (en) * 2008-10-28 2010-05-13 Panasonic Electric Works Co Ltd Device and method for inspecting led chip
JP2018105687A (en) * 2016-12-26 2018-07-05 トヨタ車体株式会社 Work-piece warpage measuring device and warpage measuring method
JP2020076606A (en) * 2018-11-06 2020-05-21 Tdk株式会社 Appearance inspection method and manufacturing method of electronic component
CN114279371A (en) * 2021-12-24 2022-04-05 中国科学院长春光学精密机械与物理研究所 Method and device for measuring coplanarity of chip pins

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010107254A (en) * 2008-10-28 2010-05-13 Panasonic Electric Works Co Ltd Device and method for inspecting led chip
JP2018105687A (en) * 2016-12-26 2018-07-05 トヨタ車体株式会社 Work-piece warpage measuring device and warpage measuring method
JP2020076606A (en) * 2018-11-06 2020-05-21 Tdk株式会社 Appearance inspection method and manufacturing method of electronic component
JP7157380B2 (en) 2018-11-06 2022-10-20 Tdk株式会社 Appearance inspection method and electronic component manufacturing method
CN114279371A (en) * 2021-12-24 2022-04-05 中国科学院长春光学精密机械与物理研究所 Method and device for measuring coplanarity of chip pins

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