JP2007327976A - Pressure sensor - Google Patents

Pressure sensor Download PDF

Info

Publication number
JP2007327976A
JP2007327976A JP2007239077A JP2007239077A JP2007327976A JP 2007327976 A JP2007327976 A JP 2007327976A JP 2007239077 A JP2007239077 A JP 2007239077A JP 2007239077 A JP2007239077 A JP 2007239077A JP 2007327976 A JP2007327976 A JP 2007327976A
Authority
JP
Japan
Prior art keywords
pressure
diaphragm
pressure sensor
sensor chip
static
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007239077A
Other languages
Japanese (ja)
Inventor
Takaharu Miyazawa
敬治 宮沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azbil Corp
Original Assignee
Azbil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azbil Corp filed Critical Azbil Corp
Priority to JP2007239077A priority Critical patent/JP2007327976A/en
Publication of JP2007327976A publication Critical patent/JP2007327976A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Measuring Fluid Pressure (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easily-manufacturable pressure sensor capable of providing an excellent temperature characteristic and a wide measuring pressure range, and miniaturizing a package. <P>SOLUTION: A differential pressure sensor chip 4 includes a diaphragm for differential pressure measurement, and a detection part for converting a pressure received by the diaphragm for differential pressure measurement into an electric signal. A static pressure sensor chip 5 includes a diaphragm for static pressure measurement, and a detection part for converting a pressure received by the diaphragm for static pressure measurement into an electric signal. The sensor chips 4, 5 are each bonded to one end face of pedestals 2, 3. Each other end face of the pedestals 2, 3 is bonded to a header 1 so that each one surface of the sensor chips 4, 5 is exposed to the inside of a common pressure introduction chamber 17. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、圧力センサに係り、特に差圧測定用の差圧センサチップと静圧測定用の静圧センサチップとを同一のパッケージ内に収納した圧力センサに関するものである。   The present invention relates to a pressure sensor, and more particularly to a pressure sensor in which a differential pressure sensor chip for differential pressure measurement and a static pressure sensor chip for static pressure measurement are housed in the same package.

従来、流体の流量を測定する方法として、流路に絞りを設け、絞りの上流と下流の圧力差が流速に比例することを利用して、絞りの上流と下流の圧力差を測定して流量に変換する方法がある。また、液位計では、タンク上下の圧力差を測り、この圧力差より液体密度を勘案した液位を測定することも行われる。このような場合、通常は差圧センサが用いられる。差圧センサは、２種類の被測定圧力をセンサチップに同時に受け、その差圧を検出するセンサである。一方、以上のような差圧測定がなされるとき、静圧、すなわち大気圧を基準としたゲージ圧、又は真空状態を基準とした絶対圧を測定し、監視や制御を同時に行うことがある。前述のとおり、差圧センサは、２点間の圧力差を測るものなので、静圧自体を測ることはできない。   Conventionally, as a method of measuring the flow rate of fluid, a flow path is provided by measuring the pressure difference between the upstream and downstream of the throttle by using a restriction in the flow path, and the fact that the pressure difference between the upstream and downstream of the throttle is proportional to the flow velocity. There is a way to convert to. In addition, the liquid level meter measures the pressure difference between the upper and lower tanks, and measures the liquid level in consideration of the liquid density from this pressure difference. In such a case, a differential pressure sensor is usually used. The differential pressure sensor is a sensor that receives two types of pressures to be measured simultaneously on a sensor chip and detects the differential pressure. On the other hand, when the differential pressure measurement as described above is performed, the static pressure, that is, the gauge pressure based on the atmospheric pressure, or the absolute pressure based on the vacuum state may be measured and monitored and controlled at the same time. As described above, since the differential pressure sensor measures the pressure difference between two points, it cannot measure the static pressure itself.

そこで、差圧測定用のセンサチップと静圧測定用のセンサチップとを組み合わせた圧力センサが提案されている（例えば、特許文献１参照）。特許文献１に開示された圧力センサでは、差圧測定用のセンサチップを内蔵したセンサ用ハウジングと、静圧測定用のセンサチップを内蔵したセンサ用ハウジングと、一対のバリアダイアフラムで封止され、内部に封入液が注入されたボディ本体とを別個に製作して、これらを接合するようにしている。   Therefore, a pressure sensor in which a sensor chip for measuring differential pressure and a sensor chip for measuring static pressure are combined has been proposed (for example, see Patent Document 1). The pressure sensor disclosed in Patent Document 1 is sealed with a sensor housing incorporating a sensor chip for differential pressure measurement, a sensor housing incorporating a sensor chip for static pressure measurement, and a pair of barrier diaphragms. The body main body into which the sealing liquid is injected is manufactured separately, and these are joined.

この圧力センサでは、一対のバリアダイアフラムに対応してボディ本体内を少なくとも２つの内室に仕切り、各内室にそれぞれ封入液を注入して、一方のバリアダイアフラムに加えられた高圧の被測定用圧力と他方のバリアダイアフラムに加えられた低圧の被測定用圧力とをそれぞれ対応する封入液を介して差圧測定用のセンサチップに伝達すると共に、高圧あるいは低圧のいずれか一方の被測定用圧力を対応する封入液を介して静圧測定用のセンサチップに伝達していた。よって、特許文献１に開示された圧力センサでは、構造が複雑となり、パッケージが大型になるという問題点があった。   In this pressure sensor, the body body is partitioned into at least two inner chambers corresponding to a pair of barrier diaphragms, and a filled liquid is injected into each inner chamber, and the high pressure to be measured applied to one barrier diaphragm. The pressure and the low pressure to be measured applied to the other barrier diaphragm are transmitted to the sensor chip for differential pressure measurement via the corresponding sealing liquid, and either the high pressure or the low pressure is measured. Is transmitted to the sensor chip for static pressure measurement via the corresponding sealing liquid. Therefore, the pressure sensor disclosed in Patent Document 1 has a problem that the structure becomes complicated and the package becomes large.

また、各センサ用ハウジングとボディ本体が別個に製作されているので、バリアダイアフラムと２つのセンサチップとの間の距離が遠くなり、２つのセンサチップ間の距離も遠くなる。したがって、特許文献１に開示された圧力センサでは、封入液の量が多くなるため、測定可能な圧力範囲が狭くなり、温度特性が悪化するという問題点があった。   Further, since each sensor housing and the body main body are manufactured separately, the distance between the barrier diaphragm and the two sensor chips is increased, and the distance between the two sensor chips is also increased. Therefore, the pressure sensor disclosed in Patent Document 1 has a problem in that the amount of sealed liquid increases, so that the measurable pressure range becomes narrow and the temperature characteristics deteriorate.

このような問題点を解決する方法として、差圧センサと静圧センサを同一チップ上に集積化する方法が考えられる。この圧力センサを製作するには、同一の半導体基板をエッチングして差圧測定用のダイアフラムと静圧測定用のダイアフラムとを形成し、それぞれのダイアフラム上に歪ゲージ（ピエゾ式圧力センサの場合）又は電極（静電容量式圧力センサの場合）を形成すればよい。   As a method for solving such a problem, a method of integrating the differential pressure sensor and the static pressure sensor on the same chip can be considered. To manufacture this pressure sensor, the same semiconductor substrate is etched to form a differential pressure measurement diaphragm and a static pressure measurement diaphragm, and a strain gauge (in the case of a piezo pressure sensor) on each diaphragm. Alternatively, an electrode (in the case of a capacitive pressure sensor) may be formed.

特開昭６３−８５２４号公報JP-A 63-8524

しかしながら、差圧センサと静圧センサを同一チップ上に集積化すると、製造が困難となって、コストが高くなり、これらの問題を解決しようすると、圧力センサとしての性能が低下するという問題点があった。何故ならば、差圧センサと静圧センサでは測定レンジが異なるため、静圧測定用のダイアフラムは、大きな圧力に耐えられるように、差圧測定用のダイアフラムと比べて肉厚を厚くし、外径を小さくする必要がある。同一半導体基板上で差圧センサと静圧センサのダイアフラムの厚さを変えることは、製造工程が複雑になることを意味し、ダイアフラムの外径が小さくなると、ダイアフラム上に歪ゲージや電極を形成する工程が難しくなる。また、ダイアフラムを同一の厚さにし、静圧測定用ダイアフラムの外径を大きくすると、製造工程を容易にできるが、差圧測定用ダイアフラムの外径も大きくしないと差圧センサの感度が低下し、大きくするとチップサイズが大きくなり、コストが高くなる。
本発明は、上記課題を解決するためになされたもので、製造が容易となり、良好な温度特性と広い測定圧力範囲が得られ、パッケージを小型化することができる圧力センサを提供することを目的とする。 However, if the differential pressure sensor and the static pressure sensor are integrated on the same chip, the manufacturing becomes difficult and the cost becomes high. If these problems are solved, the performance as a pressure sensor is lowered. there were. Because the differential pressure sensor and the static pressure sensor have different measurement ranges, the diaphragm for static pressure measurement is thicker than the diaphragm for differential pressure measurement so that it can withstand a large pressure. It is necessary to reduce the diameter. Changing the thickness of the differential pressure sensor and static pressure sensor diaphragms on the same semiconductor substrate means that the manufacturing process becomes complicated. When the outer diameter of the diaphragm is reduced, strain gauges and electrodes are formed on the diaphragm. The process to do becomes difficult. In addition, if the diaphragms have the same thickness and the outer diameter of the static pressure measurement diaphragm is increased, the manufacturing process can be facilitated. However, if the outer diameter of the differential pressure measurement diaphragm is not increased, the sensitivity of the differential pressure sensor decreases. Increasing the size increases the chip size and the cost.
The present invention has been made in order to solve the above-described problems, and has an object to provide a pressure sensor that can be easily manufactured, has good temperature characteristics and a wide measurement pressure range, and can downsize the package. And

本発明の圧力センサは、差圧測定用ダイアフラムとこの差圧測定用ダイアフラムで受けた圧力を電気信号に変換する検出部とを備えた差圧センサチップと、静圧測定用ダイアフラムとこの静圧測定用ダイアフラムで受けた圧力を電気信号に変換する検出部とを備えた静圧センサチップと、一方の端面に前記差圧センサチップが接合された第１の台座と、一方の端面に前記静圧センサチップが接合された第２の台座と、前記第１の台座の他方の端面及び前記第２の台座の他方の端面と接合され、前記第１の台座内に形成された圧力導入路を経由して前記差圧測定用ダイアフラムの第１の面に第１の圧力を導く第１の圧力導入路と前記第２の台座内に形成された圧力導入路を経由して前記静圧測定用ダイアフラムの第１の面に第２の圧力を導く第２の圧力導入路とが配設されたヘッダとを有し、前記ヘッダは、前記差圧センサチップと前記静圧センサチップと前記第１、第２の台座とを収容し、前記差圧測定用ダイアフラムの第２の面及び前記静圧測定用ダイアフラムの第２の面に第３の圧力を共通に導く圧力導入室を備えることを特徴とするものである。前記検出部は、ピエゾ式圧力センサの場合は歪みゲージ、静電容量式圧力センサの場合は電極である。   The pressure sensor of the present invention includes a differential pressure sensor chip including a differential pressure measurement diaphragm and a detection unit that converts a pressure received by the differential pressure measurement diaphragm into an electrical signal, a static pressure measurement diaphragm, and the static pressure. A static pressure sensor chip comprising a detector for converting the pressure received by the measurement diaphragm into an electrical signal, a first pedestal having the differential pressure sensor chip joined to one end face, and the static pressure sensor chip to one end face. A second pedestal to which a pressure sensor chip is joined, a pressure introduction path formed in the first pedestal, joined to the other end face of the first pedestal and the other end face of the second pedestal. Via the first pressure introduction path for guiding the first pressure to the first surface of the differential pressure measurement diaphragm and the pressure introduction path formed in the second pedestal. A second pressure directing a second pressure to the first surface of the diaphragm And a header in which the pressure introduction path is disposed, the header accommodating the differential pressure sensor chip, the static pressure sensor chip, and the first and second pedestals, and for measuring the differential pressure. A pressure introduction chamber for guiding a third pressure in common to the second surface of the diaphragm and the second surface of the static pressure measurement diaphragm is provided. The detection unit is a strain gauge in the case of a piezo-type pressure sensor, and an electrode in the case of a capacitance-type pressure sensor.

また、本発明の圧力センサの１構成例は、さらに、前記圧力導入室の底部に固定され、前記第１、第２の台座が貫通して前記第１、第２の台座上の前記差圧測定用ダイアフラムの第２の面及び前記静圧測定用ダイアフラムの第２の面を前記圧力導入室に露出させる貫通孔を有するセラミックボードと、前記セラミックボード上に形成されたセンサ出力ピンを含む電気回路とを備えるものである。
また、本発明の圧力センサの１構成例は、さらに、前記第１、第２の圧力導入路の開口及び前記圧力導入室の開口のそれぞれに設けられたバリアダイアフラムと、各バリアダイアフラムによって封止された第１、第２の圧力導入路内及び圧力導入室内にそれぞれ注入された封入液とを備えるものである。 The pressure sensor according to an embodiment of the present invention may further include a pressure sensor fixed to a bottom portion of the pressure introduction chamber, the first and second pedestals passing through the differential pressure on the first and second pedestals. A ceramic board having a through hole for exposing the second surface of the diaphragm for measurement and the second surface of the diaphragm for static pressure measurement to the pressure introduction chamber, and an electricity including a sensor output pin formed on the ceramic board And a circuit.
In addition, according to one configuration example of the pressure sensor of the present invention, a barrier diaphragm provided in each of the openings of the first and second pressure introduction paths and the opening of the pressure introduction chamber, and sealing by each barrier diaphragm The first and second pressure introduction passages and the sealed liquid injected into the pressure introduction chamber are provided.

本発明によれば、差圧センサチップ、静圧センサチップをそれぞれ第１、第２の台座の一方の端面に接合し、差圧センサチップ及び静圧センサチップの他面が共通の圧力導入室内に露出するよう、第１、第２の台座の他方の端面を同一のヘッダに接合したので、差圧センサチップと静圧センサチップとを近接して配置することが可能となり、差圧センサチップ用のハウジングと静圧センサチップ用のハウジングとボディ本体とを別個に製作して接合する従来の圧力センサよりも封入液の量を減らすことができる。その結果、良好な温度特性と広い測定圧力範囲が得られる。また、差圧センサチップと静圧センサチップとを近接して配置でき、圧力センサの構造が簡単になることから、パッケージの小型化が可能となる。また、圧力センサの製造工程を簡略化でき、製造コストの低減が可能となる。さらに、差圧センサチップと静圧センサチップとをそれぞれ別個の製造工程で製作し、それぞれの用途にあった最適なダイアフラムをチップ内に形成することができるので、差圧センサと静圧センサを同一チップ上に集積化する場合に比べて、製造が容易となり、コストを低減することができる。   According to the present invention, the differential pressure sensor chip and the static pressure sensor chip are respectively joined to one end surfaces of the first and second pedestals, and the other surfaces of the differential pressure sensor chip and the static pressure sensor chip are shared. Since the other end faces of the first and second pedestals are joined to the same header so as to be exposed to each other, the differential pressure sensor chip and the static pressure sensor chip can be disposed close to each other, and the differential pressure sensor chip The amount of the sealed liquid can be reduced as compared with the conventional pressure sensor in which the housing for the static pressure sensor, the housing for the static pressure sensor chip, and the body main body are separately manufactured and joined. As a result, good temperature characteristics and a wide measurement pressure range can be obtained. Further, the differential pressure sensor chip and the static pressure sensor chip can be arranged close to each other, and the structure of the pressure sensor is simplified, so that the package can be reduced in size. In addition, the manufacturing process of the pressure sensor can be simplified, and the manufacturing cost can be reduced. In addition, the differential pressure sensor chip and the static pressure sensor chip can be manufactured in separate manufacturing processes, and an optimum diaphragm suitable for each application can be formed in the chip. Compared with the case of integration on the same chip, the manufacturing becomes easier and the cost can be reduced.

次に、本発明の実施の形態について図面を参照して詳細に説明する。図１（ａ）は本発明の実施の形態となる圧力センサの断面図、図１（ｂ）はこの圧力センサの下面図である。この圧力センサは、基台となるヘッダ１と、ヘッダ１上に接合された第１、第２の台座２，３と、第１の台座２上に接合された、差圧測定用の差圧センサチップ４と、第２の台座３上に接合された、静圧測定用の静圧センサチップ５と、センサチップ４，５からの電気信号を外部に導くためのセンサ出力ピン６と、センサチップ４，５とセンサ出力ピン６とを電気的に接続するための配線パターン９が形成されたセラミックボード７と、センサチップ４，５とセンサ出力ピン６との間、あるいはセンサチップ４，５と配線パターン９との間を接続するワイヤ８とを有している。   Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1A is a cross-sectional view of a pressure sensor according to an embodiment of the present invention, and FIG. 1B is a bottom view of the pressure sensor. This pressure sensor includes a header 1 as a base, first and second pedestals 2 and 3 joined on the header 1, and a differential pressure for differential pressure measurement joined on the first pedestal 2. A sensor chip 4, a static pressure sensor chip 5 for static pressure measurement, which is joined to the second pedestal 3, a sensor output pin 6 for guiding an electrical signal from the sensor chips 4, 5 to the outside, and a sensor The ceramic board 7 on which the wiring pattern 9 for electrically connecting the chips 4 and 5 and the sensor output pins 6 is formed, and between the sensor chips 4 and 5 and the sensor output pins 6 or the sensor chips 4 and 5 And a wire 8 for connecting the wiring pattern 9 to each other.

図２はセンサチップ４，５の１例を示す拡大断面図である。センサチップ４，５としては、従来よりピエゾ式の圧力センサチップが知られている。ピエゾ式圧力センサチップは、半導体ダイアフラム４１上にピエゾ抵抗効果を有する歪ゲージ４２を形成して、ダイアフラム４１に加わる圧力によって歪ゲージ４２を変形させ、ピエゾ抵抗効果による歪ゲージ４２の抵抗値の変化を検出して圧力を測定するものである。   FIG. 2 is an enlarged sectional view showing an example of the sensor chips 4 and 5. As the sensor chips 4 and 5, piezoelectric pressure sensor chips are conventionally known. The piezo-type pressure sensor chip forms a strain gauge 42 having a piezoresistive effect on a semiconductor diaphragm 41, deforms the strain gauge 42 by the pressure applied to the diaphragm 41, and changes the resistance value of the strain gauge 42 due to the piezoresistive effect. Is used to measure the pressure.

その他の圧力センサチップとしては、静電容量式の圧力センサチップがある。この静電容量式圧力センサチップは、所定の空間（容量室）を備えた基板と、その基板の空間上に配置されたダイアフラムと、基板に形成された固定電極と、ダイアフラムに形成された可動電極とを備えている。ダイアフラムが圧力を受けて変形することで、可動電極と固定電極の間隔が変化してその間の静電容量が変化する。この静電容量の変化に基づき、ダイアフラムの受けた圧力を測定する。   As another pressure sensor chip, there is a capacitance type pressure sensor chip. This capacitive pressure sensor chip includes a substrate having a predetermined space (capacitance chamber), a diaphragm disposed on the space of the substrate, a fixed electrode formed on the substrate, and a movable formed on the diaphragm. And an electrode. When the diaphragm is deformed by receiving pressure, the distance between the movable electrode and the fixed electrode is changed, and the capacitance between them is changed. Based on this change in capacitance, the pressure received by the diaphragm is measured.

また、静電容量式の圧力センサチップとしては、その他にダイアフラムの変位ではなく、容量室の構成材料の圧縮による変化を検出するタイプもある。
さらに、その他の圧力センサチップとして、ダイアフラムの変位を光信号に変調して圧力を測定するタイプが知られている。なお、差圧センサチップ４と静圧センサチップ５では、差圧センサチップ４の方がダイアフラムに印加される圧力が小さいので、感度を上げるために、差圧センサチップ４の方が静圧センサチップ５よりもダイアフラム径が大きくなっている。 As another example of the capacitance type pressure sensor chip, there is a type that detects not a displacement of the diaphragm but a change caused by compression of the constituent material of the capacity chamber.
Further, as another pressure sensor chip, there is known a type that measures the pressure by modulating the displacement of the diaphragm into an optical signal. In the differential pressure sensor chip 4 and the static pressure sensor chip 5, since the pressure applied to the diaphragm is smaller in the differential pressure sensor chip 4, the differential pressure sensor chip 4 is more in the static pressure sensor in order to increase sensitivity. The diaphragm diameter is larger than that of the tip 5.

以上のような構造を有するセンサチップ４，５は、台座２，３の一方の端面に静電接合（陽極接合）されている。台座２，３としては、センサチップ４，５を接合するときの熱歪みがセンサチップ４，５に伝わるとセンサチップ４，５の温度特性が低下して零点シフトの原因となるため、センサチップ４，５の熱膨張係数に近似した熱膨張係数を有する材料、例えばパイレックス（登録商標）ガラス、窒化珪素などのセラミックス等によって形成されている。   The sensor chips 4 and 5 having the above structure are electrostatically bonded (anodic bonded) to one end face of the bases 2 and 3. As the pedestals 2 and 3, the sensor chip 4, 5 is bonded to the thermal strain transmitted to the sensor chips 4, 5, and the temperature characteristics of the sensor chips 4, 5 are lowered to cause a zero point shift. It is made of a material having a thermal expansion coefficient approximate to the thermal expansion coefficient of 4 or 5, for example, Pyrex (registered trademark) glass, ceramics such as silicon nitride, or the like.

円柱状のヘッダ１は、耐食性と溶接性のよい材料、例えばステンレス、コバール等によって形成される。ヘッダ１の下面中央部には凹陥部が形成されており、この凹陥部に台座２，３、センサチップ４，５、セラミックボード７等が収められるようになっている。台座２，３のセンサチップ４，５と反対側の端面は、ろう材によってヘッダ１に接合される。   The columnar header 1 is formed of a material having good corrosion resistance and weldability, such as stainless steel and Kovar. A concave portion is formed at the center of the lower surface of the header 1, and the pedestals 2 and 3, the sensor chips 4 and 5, the ceramic board 7 and the like are accommodated in the concave portion. The end surfaces of the pedestals 2 and 3 opposite to the sensor chips 4 and 5 are joined to the header 1 by a brazing material.

セラミックボード７には、台座２，３とセンサ出力ピン６とが貫通する挿通孔が設けられており、さらにセンサチップ側の表面に、センサチップ４，５とセンサ出力ピン６とを電気的に接続するための配線パターン９が形成されている。このセラミックボード７は、ろう材によってヘッダ１に接合される。   The ceramic board 7 is provided with an insertion hole through which the pedestals 2 and 3 and the sensor output pin 6 pass, and the sensor chips 4 and 5 and the sensor output pin 6 are electrically connected to the surface on the sensor chip side. A wiring pattern 9 for connection is formed. The ceramic board 7 is joined to the header 1 by a brazing material.

センサチップ４，５の電源、接地及び検出部（ピエゾ式圧力センサの場合は歪みゲージ、静電容量式圧力センサの場合は電極）用の各端子とセラミックボード７上に形成された配線パターン９との間、あるいはセンサチップ４，５とセンサ出力ピン６との間は、Ａｕ等からなるワイヤ８によって電気的に接続される。さらに、配線パターン９とセンサ出力ピン６との間もワイヤ８によって電気的に接続される。   A wiring pattern 9 formed on the ceramic board 7 and each terminal for the power source, grounding and detection unit (a strain gauge in the case of a piezo type pressure sensor, an electrode in the case of a capacitance type pressure sensor) of the sensor chips 4 and 5 Or between the sensor chips 4 and 5 and the sensor output pin 6 is electrically connected by a wire 8 made of Au or the like. Further, the wiring pattern 9 and the sensor output pin 6 are also electrically connected by the wire 8.

ヘッダ１を貫通して圧力センサの外部に引き出されるセンサ出力ピン６は、ヘッダ１とセンサ出力ピン６との電気的絶縁を図り、かつ後述する封入液の漏洩を防止するためにガラスによりハーメチックシールされている。   The sensor output pin 6 that passes through the header 1 and is drawn out of the pressure sensor is hermetically sealed with glass in order to provide electrical insulation between the header 1 and the sensor output pin 6 and to prevent leakage of the encapsulated liquid described later. Has been.

ヘッダ１の凹陥部には、センサチップ４，５の下面に被測定圧力Ｐ１を導くための圧力導入室１７が形成されている。ヘッダ１及び台座２には、差圧センサチップ４の上面に被測定圧力Ｐ２を導くための圧力導入路１８が形成されている。そして、ヘッダ１及び台座３には、静圧センサチップ５の上面に被測定圧力Ｐ３を導くための圧力導入路１９が形成されている。   In the recessed portion of the header 1, a pressure introducing chamber 17 for guiding the measurement pressure P <b> 1 to the lower surfaces of the sensor chips 4 and 5 is formed. In the header 1 and the pedestal 2, a pressure introduction path 18 is formed on the upper surface of the differential pressure sensor chip 4 to guide the pressure P 2 to be measured. The header 1 and the pedestal 3 are formed with a pressure introduction path 19 for guiding the measured pressure P3 to the upper surface of the static pressure sensor chip 5.

被測定圧力Ｐ１，Ｐ２，Ｐ３としては、気体あるいは液体の圧力を直接印加してもよいが、通常は、圧力導入室１７、圧力導入路１８，１９を覆うようにそれぞれバリアダイアフラム（不図示）を設け、各バリアダイアフラムによって封止された圧力導入室１７、圧力導入路１８、圧力導入路１９内にシリコーンオイル等の封入液をそれぞれ注入する。これにより、各バリアダイアフラムに加わる被測定圧力Ｐ１，Ｐ２，Ｐ３を封入液を介してセンサチップ４，５に伝達することができる。   As the measured pressures P1, P2, and P3, a gas or liquid pressure may be directly applied. Usually, a barrier diaphragm (not shown) is provided so as to cover the pressure introduction chamber 17 and the pressure introduction paths 18 and 19, respectively. And a sealing liquid such as silicone oil is injected into the pressure introduction chamber 17, the pressure introduction path 18, and the pressure introduction path 19 sealed by the respective barrier diaphragms. Thereby, the measured pressures P1, P2, and P3 applied to the respective barrier diaphragms can be transmitted to the sensor chips 4 and 5 through the sealing liquid.

以上のような圧力センサにおいて、高圧の被測定圧力Ｐ１を差圧センサチップ４の下面に導き、低圧の被測定圧力Ｐ２を差圧センサチップ４の上面に導くことにより、差圧Ｐ１−Ｐ２に応じて差圧センサチップ４の差圧測定用ダイアフラムが変位するので、このときの差圧センサチップ４の出力電圧をセンサ出力ピン６を介して取り出すことにより、差圧Ｐ１−Ｐ２を測定することができる。   In the pressure sensor as described above, a high measured pressure P1 is guided to the lower surface of the differential pressure sensor chip 4 and a low measured pressure P2 is guided to the upper surface of the differential pressure sensor chip 4 to obtain the differential pressure P1-P2. Accordingly, the differential pressure measuring diaphragm of the differential pressure sensor chip 4 is displaced, and the differential pressure P1-P2 is measured by taking out the output voltage of the differential pressure sensor chip 4 at this time through the sensor output pin 6. Can do.

また、被測定圧力Ｐ１を静圧センサチップ５の下面に導き、大気圧Ｐ３を静圧センサチップ５の上面に導くことにより、差圧Ｐ１−Ｐ３に応じて静圧センサチップ５内の静圧測定用ダイアフラムが変位するので、このときの静圧センサチップ５の出力電圧をセンサ出力ピン６を介して取り出すことにより、差圧Ｐ１−Ｐ３、すなわちゲージ圧を測定することができる。また、圧力導入路１８内を真空状態にすれば、真空状態を基準とする被測定圧力Ｐ１、すなわち絶対圧を測定することができる。   Further, by introducing the pressure P1 to be measured to the lower surface of the static pressure sensor chip 5 and guiding the atmospheric pressure P3 to the upper surface of the static pressure sensor chip 5, the static pressure in the static pressure sensor chip 5 according to the differential pressure P1-P3. Since the measurement diaphragm is displaced, the differential pressure P1-P3, that is, the gauge pressure can be measured by taking out the output voltage of the static pressure sensor chip 5 through the sensor output pin 6 at this time. Further, if the inside of the pressure introduction path 18 is evacuated, the pressure P1 to be measured based on the evacuated state, that is, the absolute pressure can be measured.

なお、本実施の形態の圧力センサでは、台座２，３とセラミックボード７との間に隙間があるので、セラミックボード７上の空間にも封入液が入って圧力導入室１７となる。ただし、通常は、セラミックボード７上の空間には封入液の量を少なくするためにスペーサが配置される。スペーサは、温度変化による体積変化を極力防ぐために、通常、アルミナ等のセラミックスによって形成される。   In the pressure sensor of the present embodiment, since there is a gap between the pedestals 2 and 3 and the ceramic board 7, the filled liquid also enters the space on the ceramic board 7 to form the pressure introducing chamber 17. However, normally, a spacer is arranged in the space on the ceramic board 7 in order to reduce the amount of the filled liquid. The spacer is usually formed of ceramics such as alumina in order to prevent volume change due to temperature change as much as possible.

本発明は、圧力センサに適用することができる。   The present invention can be applied to a pressure sensor.

本発明の実施の形態となる圧力センサの断面図及び下面図である。It is sectional drawing and the bottom view of the pressure sensor which becomes embodiment of this invention. センサチップの１例を示す拡大断面図である。It is an expanded sectional view showing an example of a sensor chip.

符号の説明Explanation of symbols

１…ヘッダ、２、３…台座、４…差圧センサチップ、５…静圧センサチップ、６…センサ出力ピン、７…セラミックボード、８…ワイヤ、９…配線パターン。   DESCRIPTION OF SYMBOLS 1 ... Header 2, 3 ... Base, 4 ... Differential pressure sensor chip, 5 ... Static pressure sensor chip, 6 ... Sensor output pin, 7 ... Ceramic board, 8 ... Wire, 9 ... Wiring pattern.

Claims (3)

差圧測定用ダイアフラムとこの差圧測定用ダイアフラムで受けた圧力を電気信号に変換する検出部とを備えた差圧センサチップと、
静圧測定用ダイアフラムとこの静圧測定用ダイアフラムで受けた圧力を電気信号に変換する検出部とを備えた静圧センサチップと、
一方の端面に前記差圧センサチップが接合された第１の台座と、
一方の端面に前記静圧センサチップが接合された第２の台座と、
前記第１の台座の他方の端面及び前記第２の台座の他方の端面と接合され、前記第１の台座内に形成された圧力導入路を経由して前記差圧測定用ダイアフラムの第１の面に第１の圧力を導く第１の圧力導入路と前記第２の台座内に形成された圧力導入路を経由して前記静圧測定用ダイアフラムの第１の面に第２の圧力を導く第２の圧力導入路とが配設されたヘッダとを有し、
前記ヘッダは、前記差圧センサチップと前記静圧センサチップと前記第１、第２の台座とを収容し、前記差圧測定用ダイアフラムの第２の面及び前記静圧測定用ダイアフラムの第２の面に第３の圧力を共通に導く圧力導入室を備えることを特徴とする圧力センサ。 A differential pressure sensor chip including a differential pressure measurement diaphragm and a detection unit that converts the pressure received by the differential pressure measurement diaphragm into an electrical signal;
A static pressure sensor chip comprising a diaphragm for measuring static pressure and a detection unit for converting the pressure received by the diaphragm for measuring static pressure into an electrical signal;
A first pedestal in which the differential pressure sensor chip is joined to one end face;
A second pedestal in which the static pressure sensor chip is joined to one end face;
The first end of the differential pressure measuring diaphragm is joined to the other end face of the first pedestal and the other end face of the second pedestal, and through a pressure introduction path formed in the first pedestal. A second pressure is guided to the first surface of the static pressure measurement diaphragm via a first pressure introduction path for guiding the first pressure to the surface and a pressure introduction path formed in the second pedestal. And a header provided with a second pressure introduction path,
The header accommodates the differential pressure sensor chip, the static pressure sensor chip, and the first and second pedestals, and a second surface of the differential pressure measurement diaphragm and a second of the static pressure measurement diaphragm. A pressure sensor comprising a pressure introduction chamber for commonly guiding the third pressure on the surface of the pressure sensor. 請求項１記載の圧力センサにおいて、
さらに、前記圧力導入室の底部に固定され、前記第１、第２の台座が貫通して前記第１、第２の台座上の前記差圧測定用ダイアフラムの第２の面及び前記静圧測定用ダイアフラムの第２の面を前記圧力導入室に露出させる貫通孔を有するセラミックボードと、
前記セラミックボード上に形成されたセンサ出力ピンを含む電気回路とを備えることを特徴とする圧力センサ。 The pressure sensor according to claim 1,
Further, the second surface of the differential pressure measuring diaphragm on the first and second pedestals is fixed to the bottom of the pressure introducing chamber and penetrates the first and second pedestals, and the static pressure measurement. A ceramic board having a through hole exposing the second surface of the diaphragm for use in the pressure introducing chamber;
An electrical circuit including a sensor output pin formed on the ceramic board. 請求項１又は２記載の圧力センサにおいて、
さらに、前記第１、第２の圧力導入路の開口及び前記圧力導入室の開口のそれぞれに設けられたバリアダイアフラムと、
各バリアダイアフラムによって封止された第１、第２の圧力導入路内及び圧力導入室内にそれぞれ注入された封入液とを備えることを特徴とする圧力センサ。 The pressure sensor according to claim 1 or 2,
A barrier diaphragm provided in each of the opening of the first and second pressure introduction paths and the opening of the pressure introduction chamber;
A pressure sensor comprising: first and second pressure introduction passages sealed by each barrier diaphragm and a sealed liquid injected into the pressure introduction chamber.
JP2007239077A 2007-09-14 2007-09-14 Pressure sensor Pending JP2007327976A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007239077A JP2007327976A (en) 2007-09-14 2007-09-14 Pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007239077A JP2007327976A (en) 2007-09-14 2007-09-14 Pressure sensor

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001233143A Division JP4044307B2 (en) 2001-08-01 2001-08-01 Pressure sensor

Publications (1)

Publication Number Publication Date
JP2007327976A true JP2007327976A (en) 2007-12-20

Family

ID=38928522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007239077A Pending JP2007327976A (en) 2007-09-14 2007-09-14 Pressure sensor

Country Status (1)

Country Link
JP (1) JP2007327976A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112649142A (en) * 2019-10-09 2021-04-13 阿自倍尔株式会社 Pressure sensor
CN112649141A (en) * 2019-10-09 2021-04-13 阿自倍尔株式会社 Sensor element
CN112649139A (en) * 2019-10-09 2021-04-13 阿自倍尔株式会社 Sensor element
CN116295966A (en) * 2023-03-03 2023-06-23 蚌埠市创业电子有限责任公司 Double-chip multi-parameter pressure sensor base

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09502809A (en) * 1994-07-05 1997-03-18 モトローラ・インコーポレーテッド Medium-isolated differential pressure sensor device and method
JPH10197316A (en) * 1997-01-16 1998-07-31 Hitachi Ltd Density correction-type liquid level detecting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09502809A (en) * 1994-07-05 1997-03-18 モトローラ・インコーポレーテッド Medium-isolated differential pressure sensor device and method
JPH10197316A (en) * 1997-01-16 1998-07-31 Hitachi Ltd Density correction-type liquid level detecting device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112649142A (en) * 2019-10-09 2021-04-13 阿自倍尔株式会社 Pressure sensor
CN112649141A (en) * 2019-10-09 2021-04-13 阿自倍尔株式会社 Sensor element
CN112649139A (en) * 2019-10-09 2021-04-13 阿自倍尔株式会社 Sensor element
US11499882B2 (en) 2019-10-09 2022-11-15 Azbil Corporation Pressure sensor
CN116295966A (en) * 2023-03-03 2023-06-23 蚌埠市创业电子有限责任公司 Double-chip multi-parameter pressure sensor base

Similar Documents

Publication Publication Date Title
JP4044307B2 (en) Pressure sensor
EP2189773B1 (en) Design of wet/wet differential pressure sensor based on microelectronic packaging process
US9054222B2 (en) Pressure resistently encapsulated, pressure difference sensor
US7258018B2 (en) High accuracy, high temperature, redundant media protected differential transducers
US4565096A (en) Pressure transducer
US7775117B2 (en) Combined wet-wet differential and gage transducer employing a common housing
US6543291B1 (en) Wet-to-wet pressure sensing assembly
US7562580B2 (en) Ruggedized pressure sensor
EP0165302A1 (en) Pressure sensor with a substantially flat overpressure stop for the measuring diaphragm
US8631707B2 (en) Differential temperature and acceleration compensated pressure transducer
JP6236117B2 (en) Micro mechanical measuring element
US20090314094A1 (en) Compact absolute and gage pressure transducer
US7698951B2 (en) Pressure-sensor apparatus
CN110220636B (en) Capillary communicating pipe type differential pressure sensor and measuring method
JP2007327976A (en) Pressure sensor
US8183975B2 (en) Miniature pressure transducer
JP4540775B2 (en) Servo capacitive vacuum sensor
US6499352B2 (en) Pressure measuring cell
US11359985B2 (en) Oil filled transducers with isolated compensating capsule
JP2010002421A (en) Servo electrostatic capacitance type vacuum sensor
JP2023076912A (en) pressure sensor
CN118089999A (en) Pressure sensor, pressure sensing device and electronic equipment
CN116296051A (en) Capacitive vacuum gauge

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070914

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110104

A02 Decision of refusal

Effective date: 20110506

Free format text: JAPANESE INTERMEDIATE CODE: A02