JP2007305772A5 - - Google Patents

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Publication number
JP2007305772A5
JP2007305772A5 JP2006132471A JP2006132471A JP2007305772A5 JP 2007305772 A5 JP2007305772 A5 JP 2007305772A5 JP 2006132471 A JP2006132471 A JP 2006132471A JP 2006132471 A JP2006132471 A JP 2006132471A JP 2007305772 A5 JP2007305772 A5 JP 2007305772A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006132471A
Other languages
Japanese (ja)
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JP2007305772A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2006132471A priority Critical patent/JP2007305772A/en
Priority claimed from JP2006132471A external-priority patent/JP2007305772A/en
Publication of JP2007305772A publication Critical patent/JP2007305772A/en
Publication of JP2007305772A5 publication Critical patent/JP2007305772A5/ja
Pending legal-status Critical Current

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JP2006132471A 2006-05-11 2006-05-11 Semiconductor device and manufacturing method thereof Pending JP2007305772A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006132471A JP2007305772A (en) 2006-05-11 2006-05-11 Semiconductor device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006132471A JP2007305772A (en) 2006-05-11 2006-05-11 Semiconductor device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JP2007305772A JP2007305772A (en) 2007-11-22
JP2007305772A5 true JP2007305772A5 (en) 2009-05-07

Family

ID=38839452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006132471A Pending JP2007305772A (en) 2006-05-11 2006-05-11 Semiconductor device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP2007305772A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5003451B2 (en) * 2007-12-11 2012-08-15 株式会社デンソー Resin mold package type electronic device and manufacturing method thereof
US8450845B2 (en) * 2008-04-09 2013-05-28 Fuji Electric Co., Ltd. Semiconductor device
JP5246143B2 (en) * 2009-11-24 2013-07-24 富士電機株式会社 SEMICONDUCTOR MODULE, ITS MANUFACTURING METHOD, AND ELECTRIC DEVICE
DE112012004593B4 (en) * 2011-11-02 2020-10-01 Fuji Electric Co., Ltd. Power converter
JP2014007294A (en) * 2012-06-25 2014-01-16 Mitsubishi Electric Corp Semiconductor device and manufacturing method of the same
JP6024750B2 (en) 2012-07-17 2016-11-16 富士電機株式会社 Semiconductor module
JP6155060B2 (en) * 2013-03-14 2017-06-28 日本碍子株式会社 Manufacturing method of heat dissipation board
WO2017150572A1 (en) 2016-03-01 2017-09-08 新日鐵住金株式会社 Ceramic laminate
JP6203307B2 (en) * 2016-03-10 2017-09-27 三菱電機株式会社 Semiconductor device and manufacturing method thereof
JP6855804B2 (en) 2017-01-17 2021-04-07 富士電機株式会社 Semiconductor devices and methods for manufacturing semiconductor devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2934421B2 (en) * 1997-09-02 1999-08-16 株式会社後藤製作所 Resin encapsulated semiconductor device with heat sink
JP2003078101A (en) * 2001-09-06 2003-03-14 Hitachi Ltd Semiconductor device, lead frame provided to the same, and its manufacturing method
JP4023397B2 (en) * 2003-04-15 2007-12-19 富士電機機器制御株式会社 Semiconductor module and manufacturing method thereof

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