JP2007294004A - Optical pickup device - Google Patents

Optical pickup device Download PDF

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JP2007294004A
JP2007294004A JP2006120617A JP2006120617A JP2007294004A JP 2007294004 A JP2007294004 A JP 2007294004A JP 2006120617 A JP2006120617 A JP 2006120617A JP 2006120617 A JP2006120617 A JP 2006120617A JP 2007294004 A JP2007294004 A JP 2007294004A
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adhesive
laser
optical
pickup device
optical pickup
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Koichiro Nishikawa
浩一郎 西川
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Victor Company of Japan Ltd
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Victor Company of Japan Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical pickup device in which the number of components is reduced, adjustment is easy and productivity is raised. <P>SOLUTION: In the optical pickup device 1 at least having: a laser holder part 3 which stores a semiconductor laser element 2; an optical base 12 having at least three areas for bonding the laser holder part 3 and an objective lens 8 which condenses a laser beam emitted from the semiconductor laser element 2 to the loaded optical disk, it has: a first adhesion part 18 in which one of the three areas and an area of the laser holder part opposite to the one area are bonded together by using an adhesive with flat viscoelasticity variation to temperature and a second adhesion part 19 in which two other areas among the three areas and areas of the laser holder part 3 opposite to the two other areas are bonded together by using an adhesive in which the viscoelasticity is reduced in accordance with temperature rise. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、組み立て部品点数を低減した光ピックアップ装置に関するものである。   The present invention relates to an optical pickup device with a reduced number of assembly parts.

光ディスクへ情報を記録又は光ディスクから情報を再生するための光ピックアップ装置は、光ディスクの高密度化に伴い、高い組み立て調整精度が要求されている。こうした光ピックアップ装置は、特許文献１に記載されている。   2. Description of the Related Art An optical pickup device for recording information on an optical disk or reproducing information from an optical disk is required to have high assembly adjustment accuracy as the density of the optical disk increases. Such an optical pickup device is described in Patent Document 1.

図５は、特許文献１に記載されている光ピックアップ装置を示す概略図である。
図５に示すように、光ピックアップ装置２０は、半導体レーザ素子２を収納したレーザホルダ部２１と、半導体レーザ素子２から出射されるレーザ光を平行光にするコリメータレンズ４と、コリメータレンズ４で平行にされた平行光を整形し円形ビームにして光ディスクＤ方向とモニター用フォトダイオード２２方向に２分割方向に反射させると共に、光ディスクＤの情報記録面で反射された戻り光を反射させて受光用フォトダイオード２３方向に反射させる整形プリズム２４と、整形プリズム２４から出射する円形ビームを光ディスクＤ方向に反射させる反射ミラー２５と、反射ミラー２５で反射された円形ビームを光ディスクＤの情報記録面に集光する対物レンズ８と、整形プリズム２４で反射された光ディスクＤからの戻り光を受光用フォトダイオード２３に集光させる検出レンズ１０とを備えている。上記した各光学部品は光学ベース１２上に載置されている。 FIG. 5 is a schematic diagram showing an optical pickup device described in Patent Document 1. As shown in FIG.
As shown in FIG. 5, the optical pickup device 20 includes a laser holder portion 21 that houses the semiconductor laser element 2, a collimator lens 4 that collimates laser light emitted from the semiconductor laser element 2, and a collimator lens 4. The collimated parallel light is shaped into a circular beam and reflected in two split directions in the direction of the optical disc D and the direction of the monitoring photodiode 22, and the return light reflected on the information recording surface of the optical disc D is reflected to receive light. A shaping prism 24 that reflects in the direction of the photodiode 23, a reflection mirror 25 that reflects a circular beam emitted from the shaping prism 24 in the direction of the optical disk D, and a circular beam reflected by the reflection mirror 25 is collected on the information recording surface of the optical disk D. The return light from the optical disk D reflected by the objective lens 8 and the shaping prism 24 is received. And a detection lens 10 for condensing the photodiode 23. Each optical component described above is placed on the optical base 12.

図６に示すように、レーザホルダ部２１は、第１ホルダ２６と第２ホルダ２７とがネジによって貼り合わされている。そして、第１ホルダ２６は、基台２９の中央部に形成された凸部２９Ａに半導体レーザ素子２を固定するための貫通孔３０と、バネ３５及びその付勢用ネジ３６を通すための貫通孔３１と、この貫通孔３１以外の領域に形成された３つの孔３２Ａ，３２Ｂ，３２Ｃと、半導体レーザ素子２から出射されるレーザ光の放射角ずれの調整を行うための２つの調整孔３３Ａ，３３Ｂとを有している。
更に、第２ホルダ２７は、基台３４の中央部に形成された第１ホルダ２６の貫通孔３０に対応して形成された貫通孔（不図示）と、第１ホルダ２６の貫通孔３０に嵌め込まれる凸部（不図示）と、第１ホルダ２６の３つの孔３２Ａ，３２Ｂ，３２Ｃ及び２つの調整孔３３Ａ，３３Ｂにそれぞれ対応した複数の孔とを有している。 As shown in FIG. 6, in the laser holder portion 21, a first holder 26 and a second holder 27 are bonded together with screws. The first holder 26 has a through hole 30 for fixing the semiconductor laser element 2 to a convex portion 29A formed at the center of the base 29, a through hole for passing the spring 35 and its biasing screw 36. The hole 31, three holes 32A, 32B, 32C formed in a region other than the through hole 31, and two adjustment holes 33A for adjusting the radiation angle deviation of the laser light emitted from the semiconductor laser element 2 , 33B.
Further, the second holder 27 is formed in a through hole (not shown) formed corresponding to the through hole 30 of the first holder 26 formed in the central portion of the base 34 and the through hole 30 of the first holder 26. A projection (not shown) to be fitted and a plurality of holes respectively corresponding to the three holes 32A, 32B, 32C and the two adjustment holes 33A, 33B of the first holder 26 are provided.

第１ホルダ２６の貫通孔３０には半導体レーザ素子２を固定すると共に、第１、第２ホルダ２６，２７の調整孔３３Ａ，３３Ｂに嵌め込まれたそれぞれネジ３７，３８によって第１ホルダ２６と第２ホルダ２７を固定し、第１ホルダ２６の貫通孔３０及び第２ホルダ２７の凸部（不図示）に巻回されたバネ３５とそのバネ３５に付勢力を持たせるためのネジ３６を挿入し、更に第１ホルダ２６の調整孔３３Ａ，３３Ｂに放射角調整用ネジ３７，３８を取り付けて、この放射角調整用ネジ３７，３８を締め付けたり緩めたりしてレーザ光の出射角度を調整している。
特開平９−２１９０３３号公報 The semiconductor laser element 2 is fixed to the through-hole 30 of the first holder 26, and the first holder 26 and the first holder 26 and the second holder 26, 27 are fitted to the first holder 26 and the adjustment holes 33A, 33B by screws 37, 38, respectively. 2 The holder 27 is fixed, and a spring 35 wound around the through hole 30 of the first holder 26 and a convex portion (not shown) of the second holder 27 and a screw 36 for imparting a biasing force to the spring 35 are inserted. Further, the radiation angle adjusting screws 37 and 38 are attached to the adjustment holes 33A and 33B of the first holder 26, and the radiation angle adjusting screws 37 and 38 are tightened or loosened to adjust the emission angle of the laser beam. ing.
JP-A-9-219033

しかしながら、レーザホルダ部２１を組み立てる際、第１ホルダ２６と第２ホルダ２７を複数のネジ３６，３７，３８を用いて組み立てる必要があり、ネジ等の部品点数が多いので、位置調整した後、固定するまでに大幅な工数を必要とし、生産性が低かった。また、レーザ光の出射角度をネジ調整で行っているので、調整が難しかった。
そこで、本発明は、上記のような問題点を解消するためになされたもので、部品点数を低減し、調整が容易で、生産性が向上する光ピックアップ装置を提供するものである。 However, when assembling the laser holder portion 21, it is necessary to assemble the first holder 26 and the second holder 27 using a plurality of screws 36, 37, 38, and the number of parts such as screws is large. It took a lot of man-hours to fix, and the productivity was low. Further, since the laser beam emission angle is adjusted by screw adjustment, adjustment is difficult.
Accordingly, the present invention has been made to solve the above-described problems, and provides an optical pickup device that reduces the number of components, is easy to adjust, and improves productivity.

本願発明は、半導体レーザ素子を収納したレーザホルダ部と、前記レーザホルダ部を接着する少なくとも３箇所の領域を有する光学ベースと、前記半導体レーザ素子から出射されたレーザ光を装着された光ディスクに集光する対物レンズとを少なくとも備えた光ピックアップ装置において、温度に対する粘弾性の変化が平坦な接着剤を用いて、前記３箇所の領域のうちの１箇所と前記１箇所に対向する前記レーザホルダ部の領域とが接着された第１接着部と、温度の増加と共に粘弾性の低下する接着剤を用いて、前記３箇所の領域のうちの他の２箇所と前記他の２箇所に対向する前記レーザホルダ部の領域とが接着された第２接着部と、を備えたことを特徴する光ピックアップ装置を提供する。   The present invention relates to a laser holder portion housing a semiconductor laser element, an optical base having at least three regions for adhering the laser holder portion, and an optical disk on which a laser beam emitted from the semiconductor laser element is mounted. In the optical pickup device including at least an objective lens that emits light, an adhesive having a flat viscoelasticity with respect to temperature is used, and one of the three regions and the laser holder unit facing the one region Using the first adhesive part to which the region is bonded and the adhesive whose viscoelasticity decreases with increasing temperature, the other two portions of the three regions and the other two portions are opposed to each other. There is provided an optical pickup device comprising a second adhesive portion to which a region of a laser holder portion is adhered.

本発明によれば、温度に対する粘弾性の変化が平坦な接着剤を用いて、前記３箇所の領域のうちの１箇所と前記１箇所に対向する前記レーザホルダ部の領域とが接着された第１接着部と、温度の増加と共に粘弾性の変化が低下する接着剤を用いて、前記３箇所の領域のうちの他の２箇所と前記他の２箇所に対向する前記レーザホルダ部の領域とが接着された第２接着部と、を備えているので、部品点数を低減し、調整が容易で、生産性が向上する光ピックアップ装置を提供できる。   According to the present invention, using an adhesive having a flat viscoelasticity with respect to temperature, one of the three regions and the region of the laser holder portion facing the one region are bonded. 1 adhesive part, and the adhesive of which the change in viscoelasticity decreases with an increase in temperature, the other two places in the three areas and the area of the laser holder part facing the other two places And an optical pickup device that reduces the number of components, is easy to adjust, and improves productivity.

以下に本発明の実施の形態に係る光ピックアップ装置について図面を参照しながら説明する。
従来と同一構成には同一符号を付す。
図１は、本発明の実施の形態の光ピックアップ装置を示す図である。図２は、レーザホルダ部を載置したベース近傍の拡大図である。図３は、レーザホルダ部の断面図である。図４は、第１，第２接着剤の硬化後の粘弾性の温度依存性を示す図である。 Hereinafter, an optical pickup device according to an embodiment of the present invention will be described with reference to the drawings.
The same reference numerals are given to the same components as those in the prior art.
FIG. 1 is a diagram showing an optical pickup device according to an embodiment of the present invention. FIG. 2 is an enlarged view of the vicinity of the base on which the laser holder portion is placed. FIG. 3 is a cross-sectional view of the laser holder portion. FIG. 4 is a diagram showing the temperature dependence of the viscoelasticity of the first and second adhesives after curing.

まずは、実施の形態の光ピックアップ装置について図１を用いて説明する。
図１に示すように、光ピックアップ装置１は、半導体レーザ素子２を収納したレーザホルダ部３と、半導体レーザ素子２から出射されるレーザ光を平行光にするコリメータレンズ４と、コリメータレンズ４で平行にされた平行光を整形して円形ビームにして通過させ、光ディスクＤからの戻り光を反射する偏光分離膜５Ａを有するビームスプリッタ一体型整形プリズム５と、この円形ビームを光ディスクＤ方向に反射する反射ミラー６と、この反射ミラー６で立ち上げられた円形ビームを円偏光にする１／４波長板７と、この円偏光にされた円形ビームを光ディスクＤの情報記録面に集光する対物レンズ８とを備えている。 First, an optical pickup device according to an embodiment will be described with reference to FIG.
As shown in FIG. 1, an optical pickup device 1 includes a laser holder portion 3 that houses a semiconductor laser element 2, a collimator lens 4 that collimates laser light emitted from the semiconductor laser element 2, and a collimator lens 4. The collimated parallel light is shaped and passed as a circular beam, and the beam splitter integrated shaping prism 5 having the polarization separation film 5A for reflecting the return light from the optical disk D, and the circular beam is reflected in the direction of the optical disk D. Reflecting mirror 6, a quarter-wave plate 7 that circularly polarizes the circular beam raised by the reflecting mirror 6, and an objective that condenses the circularly polarized circular beam on the information recording surface of the optical disc D. And a lens 8.

更に、この光ピックアップ装置１は、光ディスクＤの情報記録面で反射された戻り光が対物レンズ８、１／４波長板７及び反射ミラー６を介してビームスプリッタ一体型整形プリズム５に戻り、このビームスプリッタ一体型整形プリズム５の偏光分離膜５Ａで反射された際に、この戻り光を光検出器９に集光する検出レンズ１０とを備えている。これらの各光学部品は、筐体１１内に収納されている。
光ピックアップ装置１全体を光ディスクＤの径方向に移動可能にするように光学ベース１２の一端には、ガイド板１３が取り付けられ、更にガイド板１３にガイドシャフト１４が取り付けられ、他端には支持部材を介してガイドシャフト１４が取り付けられ、光学ベース１２がガイドシャフト１４を摺動可能としている。 Further, in this optical pickup device 1, the return light reflected by the information recording surface of the optical disc D returns to the beam splitter integrated shaping prism 5 via the objective lens 8, the quarter wavelength plate 7 and the reflection mirror 6, and this A detection lens 10 is provided which collects the return light on the photodetector 9 when reflected by the polarization separation film 5A of the beam splitter integrated shaping prism 5. Each of these optical components is housed in the housing 11.
A guide plate 13 is attached to one end of the optical base 12, a guide shaft 14 is attached to the guide plate 13, and the other end is supported so that the entire optical pickup device 1 can be moved in the radial direction of the optical disk D. A guide shaft 14 is attached via a member, and the optical base 12 allows the guide shaft 14 to slide.

図２に示すように、光学ベース１２には、光学ベース１２に対して垂直方向に立ち上がった垂直部１２Ａと、この垂直部１２Ａの両端には、光学ベース１２に対して垂直方向に立ち上がった一対の垂直部１２Ｂ，１２Ｃとが形成されている。垂直部１２Ａ，１２Ｂ，１２Ｃには、それぞれに対応して光学ベース１２の外側方向に突き出た突起部１２Ｄ，１２Ｅ，１２Ｆが一体的に形成されている。垂直部１２Ａの中央部には、レーザホルダ部３の凸部１５を挿入するための貫通孔１２Ｇが形成されている。   As shown in FIG. 2, the optical base 12 includes a vertical portion 12 </ b> A that rises in the vertical direction with respect to the optical base 12, and a pair of vertical portions 12 </ b> A that rise in the vertical direction with respect to the optical base 12. The vertical portions 12B and 12C are formed. Projections 12D, 12E, and 12F projecting outward from the optical base 12 are formed integrally with the vertical portions 12A, 12B, and 12C, respectively. A through hole 12G for inserting the convex portion 15 of the laser holder portion 3 is formed in the center portion of the vertical portion 12A.

図２及び図３に示すように、レーザホルダ部３は、凸部１５と、この凸部１５に一体的に形成された保持部１６とからなる。保持部１６及び凸部１５の中央部には、貫通孔１７が形成され、この貫通孔１７には、前述した半導体レーザ素子２が収納されている。光学ベース１２に形成されている突起部１２Ｅ，１２Ｆ間の距離は、保持部１６の幅よりも広く形成され、貫通孔１２Ｇに半導体レーザ素子２を挿入した際、レーザホルダ部３がレーザ光の光軸に対して直交する平面内で自在に可動できるようになっている。
レーザホルダ部３の上部とベース２の突起部１２Ｄとの間には、温度上昇による粘弾性の変化が平坦な第１の接着剤により接着された第１接着部１８が形成されている。レーザホルダ部３の両側面とベース２の突起部１２Ｅ，１２Ｆとの間には、温度上昇により粘弾性の低下する第２の接着剤により接着された第２接着部１９，１９が形成されている。第１，第２の接着剤は、それぞれ紫外線反応型エポキシ系熱硬化接着剤，アクリル系紫外線硬化型接着剤である。 As shown in FIGS. 2 and 3, the laser holder portion 3 includes a convex portion 15 and a holding portion 16 formed integrally with the convex portion 15. A through hole 17 is formed at the center of the holding portion 16 and the convex portion 15, and the semiconductor laser element 2 described above is accommodated in the through hole 17. The distance between the projecting portions 12E and 12F formed on the optical base 12 is formed wider than the width of the holding portion 16, and when the semiconductor laser element 2 is inserted into the through hole 12G, the laser holder portion 3 emits laser light. It can be freely moved in a plane perpendicular to the optical axis.
Between the upper part of the laser holder part 3 and the projecting part 12D of the base 2, a first adhesive part 18 is formed which is adhered by a first adhesive having a flat viscoelasticity change due to temperature rise. Between the both side surfaces of the laser holder part 3 and the projecting parts 12E and 12F of the base 2, there are formed second adhesive parts 19 and 19 which are adhered by a second adhesive whose viscoelasticity is reduced by temperature rise. Yes. The first and second adhesives are an ultraviolet-reactive epoxy thermosetting adhesive and an acrylic ultraviolet curable adhesive, respectively.

この光ピックアップ装置１を用いた記録は、外部からの記録信号に基づいて半導体レーザ素子２から出射されるレーザ光を変調し、この変調されたレーザ光をコリメータレンズ４、ビームスプリッタ一体型整形プリズム５、反射ミラー６、１／４波長板７を介して対物レンズ８に入射させた後、この対物レンズ８で光ディスクＤの情報記録面に集光して記録を行う。また、その再生は、半導体レーザ素子２から出射されるレーザ光をコリメータレンズ４、ビームスプリッタ一体型整形プリズム５、反射ミラー６、１／４波長板７を介して対物レンズ８に入射させた後、この対物レンズ８で光ディスクＤの情報記録面に集光し、この光ディスクＤの情報記録面で反射された戻り光を対物レンズ８、１／４波長板７、反射ミラー６を介してビームスプリッター一体型整形プリズム５に入射させ、この一体型整形プリズム５の偏光分離膜５Ａで反射させて検出レンズ１０で光検出器９に入射させて光電変換して再生する。   Recording using the optical pickup device 1 modulates the laser light emitted from the semiconductor laser element 2 based on a recording signal from the outside, and the modulated laser light is used as a collimator lens 4 and a beam splitter integrated shaping prism. 5, after entering the objective lens 8 through the reflection mirror 6 and the quarter wavelength plate 7, the objective lens 8 collects light on the information recording surface of the optical disc D and performs recording. The reproduction is performed after the laser light emitted from the semiconductor laser element 2 is incident on the objective lens 8 through the collimator lens 4, the beam splitter integrated shaping prism 5, the reflection mirror 6, and the quarter wavelength plate 7. The objective lens 8 condenses on the information recording surface of the optical disc D, and the return light reflected by the information recording surface of the optical disc D is passed through the objective lens 8, the quarter wavelength plate 7, and the reflection mirror 6. The light is incident on the integrated shaping prism 5, is reflected by the polarization separation film 5 A of the integrated shaping prism 5, is incident on the photodetector 9 by the detection lens 10, is photoelectrically converted, and is reproduced.

記録再生の際のメイン信号処理、フォーカスエラー信号処理及びトラッキングエラー信号処理は、光検出器９で光電変換された信号に基づいた図示しない信号処理回路により行うことができる。そして、これらの信号処理に基づいて、光学ベース１２を可動させることによりメイン信号検出、フォーカスエラー検出、トラッキングエラー検出を行うことができる。   Main signal processing, focus error signal processing, and tracking error signal processing at the time of recording / reproduction can be performed by a signal processing circuit (not shown) based on a signal photoelectrically converted by the photodetector 9. Based on these signal processes, the main signal detection, focus error detection, and tracking error detection can be performed by moving the optical base 12.

次に、本発明に係る光ピックアップ装置１の組み立て方法について説明する。
光学ベース１２上に反射ミラー６の反射方向に図示しないオートコリメータ装置を設置し、反射ミラー６の光軸の角度を測定できるようにする。
次に、レーザホルダ部３の貫通孔１７に半導体レーザ素子２を収納した後、このレーザホルダ部３の凸部１５を光学ベース２の貫通孔１２Ｇに挿入する。
次に、半導体レーザ素子２のレーザ光の出射方向にコリメータレンズ４を載置し、コリメータレンズ４を半導体レーザ素子２に対して光軸方向に移動して、レーザ光を図示しないオートコリメータ装置に平行光として入射させる。 Next, a method for assembling the optical pickup device 1 according to the present invention will be described.
An autocollimator device (not shown) is installed on the optical base 12 in the reflection direction of the reflection mirror 6 so that the angle of the optical axis of the reflection mirror 6 can be measured.
Next, after the semiconductor laser element 2 is accommodated in the through hole 17 of the laser holder portion 3, the convex portion 15 of the laser holder portion 3 is inserted into the through hole 12 </ b> G of the optical base 2.
Next, the collimator lens 4 is placed in the laser beam emission direction of the semiconductor laser element 2, and the collimator lens 4 is moved in the optical axis direction with respect to the semiconductor laser element 2 so that the laser beam is transferred to an autocollimator device (not shown). Incident light is incident as parallel light.

図示しないオートコリメータ装置の光軸を確認しながら、レーザホルダ部３を図示しない調整冶具により保持した状態で光軸に直交する面内で移動し、光学ベース１２の基準面に対して、レーザ光が図示しない調整冶具に垂直入射するようにする。
次に、ＣＣＤカメラ等により、レーザ光の光量分布を確認しながら、光学ベース１２の入射瞳の略中心に光量分布の中心が位置するように、図示しない調整冶具を用いて、半導体レーザ素子２を発光点を中心にしてレーザホルダ部３を回転させて調整する。レーザホルダ部３の回転方向は、レーザ光の放射角度の狭い方向である。これは、光ディスクＤの径方向の調整になる。 While confirming the optical axis of an autocollimator device (not shown), the laser holder unit 3 is moved in a plane perpendicular to the optical axis while being held by an adjustment jig (not shown), and the laser beam is moved relative to the reference surface of the optical base 12. Is vertically incident on an adjustment jig (not shown).
Next, while confirming the light quantity distribution of the laser beam with a CCD camera or the like, the semiconductor laser element 2 is used by using an adjustment jig (not shown) so that the center of the light quantity distribution is positioned at the approximate center of the entrance pupil of the optical base 12. Is adjusted by rotating the laser holder 3 around the light emitting point. The rotation direction of the laser holder portion 3 is a direction in which the laser beam emission angle is narrow. This is an adjustment in the radial direction of the optical disc D.

次に、光学ベース１２と突起部１２Ｄとレーザホルダ部３の保持部１６の上部との間に第１の接着剤を充填すると共に、光学ベース１２の突起部１２Ｅ，１２Ｆとレーザホルダ部３の保持部１６の両側面との間に第２の接着剤を充填した後、紫外線を照射する。更に、レーザホルダ部３が接着された光学ベース２全体を高温槽に入れて完全硬化する。こうして、第１，第２接着部１８，１９を形成する。   Next, the first adhesive is filled between the optical base 12, the protrusion 12 </ b> D, and the upper portion of the holding part 16 of the laser holder 3, and the protrusions 12 </ b> E and 12 </ b> F of the optical base 12 and the laser holder 3 are After filling the second adhesive between the both side surfaces of the holding portion 16, ultraviolet rays are irradiated. Further, the entire optical base 2 to which the laser holder unit 3 is bonded is placed in a high temperature bath and completely cured. Thus, the first and second adhesive portions 18 and 19 are formed.

その他のコリメータレンズ４、ビームスプリッター一体型整形プリズム５、反射ミラー６、対物レンズ８、光検出器９及び検出レンズ１０の光学ベース１２への組み立てる組み立て方法は、従来と同様であるので、その説明を省略する。   The other methods of assembling the collimator lens 4, the beam splitter-integrated shaping prism 5, the reflection mirror 6, the objective lens 8, the photodetector 9, and the detection lens 10 to the optical base 12 are the same as those in the prior art. Is omitted.

ここで、第１，第２の接着剤の粘弾性の温度依存性について調べた。
その結果を図４に示す。
図４に示す第１，第２の接着剤は、それぞれ紫外線反応型エポキシ系熱硬化接着剤，アクリル系紫外線硬化型接着剤である。
図４に示すように、第１の接着剤の粘弾性は、室温から１２０℃に亘ってほぼ一定であるのに対して、第２の接着剤は、室温から温度を上昇させていくと減少していくことがわかる。
レーザホルダ部３の位置ズレを最小限に抑えるには、４０℃±１０℃の温度範囲では、第１の接着剤の粘弾性：第２の接着剤の粘弾性＝１：１乃至１：２とし、８０℃±１０℃の温度範囲では、第１の接着剤の粘弾性：第２の接着剤の粘弾性＝１：１０乃至１：３０とするように第１，第２の接着剤を選択することが望ましい。 Here, the temperature dependence of the viscoelasticity of the first and second adhesives was examined.
The result is shown in FIG.
The first and second adhesives shown in FIG. 4 are an ultraviolet-reactive epoxy thermosetting adhesive and an acrylic ultraviolet curable adhesive, respectively.
As shown in FIG. 4, the viscoelasticity of the first adhesive is substantially constant from room temperature to 120 ° C., whereas the second adhesive decreases as the temperature is increased from room temperature. I can see that
In order to minimize the positional deviation of the laser holder part 3, the viscoelasticity of the first adhesive: the viscoelasticity of the second adhesive = 1: 1 to 1: 2 in the temperature range of 40 ° C. ± 10 ° C. In the temperature range of 80 ° C. ± 10 ° C., the first and second adhesives are adjusted so that the viscoelasticity of the first adhesive: the viscoelasticity of the second adhesive = 1: 10 to 1:30. It is desirable to choose.

以上のように、光ピックアップ装置１が高温になった場合でも、第２の接着剤は、第１の接着剤よりも接着強度が弱いが、軟化するので、第１，第２の接着剤間の引っ張り力が抑制できるため、レーザホルダ部３の位置ズレを防止でき、高い信頼性が得られる。
また、熱衝撃により光ピックアップ装置１が高温状態から急冷されて低温状態になって、歪みが発生しても第２の接着剤による緩衝により、剥離は発生しない。更に、第１の接着剤による接着箇所は、１箇所であり、強度低下は生じないので、半導体レーザ素子２の光軸ずれの発生も抑制できる。 As described above, even when the optical pickup device 1 is at a high temperature, the second adhesive is weaker than the first adhesive but softens. Therefore, it is possible to prevent the laser holder portion 3 from being displaced and to obtain high reliability.
Further, even if the optical pickup device 1 is rapidly cooled from a high temperature state to a low temperature state due to a thermal shock and becomes a low temperature state, peeling does not occur due to buffering by the second adhesive. Furthermore, there is only one place to be bonded by the first adhesive, and no reduction in strength occurs, so that the optical axis shift of the semiconductor laser element 2 can also be suppressed.

本発明の実施の形態では、第１，第２の接着剤を用いてレーザホルダ部３が光学ベース１２に固定されるので、ネジ等の部品点数が低減されるため作業工数を減らすことができ、１回調整を行ったら調整が不要であり生産性を向上させた光ピックアップ装置１を得ることができる。
なお、接着剤を接着する箇所は、３箇所以上でも良いが、第１の接着剤を用いる箇所は１箇所だけである。 In the embodiment of the present invention, since the laser holder portion 3 is fixed to the optical base 12 using the first and second adhesives, the number of parts such as screws can be reduced, so that the number of work steps can be reduced. Once the adjustment is performed, it is not necessary to adjust, and the optical pickup device 1 with improved productivity can be obtained.
In addition, although the location which adhere | attaches an adhesive agent may be three or more places, the location which uses a 1st adhesive agent is only one location.

本発明の実施の形態の光ピックアップ装置を示す図である。It is a figure which shows the optical pick-up apparatus of embodiment of this invention. レーザホルダ部を載置したベース近傍の拡大図である。It is an enlarged view of the base vicinity which mounted the laser holder part. レーザホルダ部の断面図である。It is sectional drawing of a laser holder part. 第１，第２の接着剤の硬化後の粘弾性の温度依存性を示す図である。It is a figure which shows the temperature dependence of the viscoelasticity after hardening of a 1st, 2nd adhesive agent. 従来の光ピックアップ装置を示す概略図である。It is the schematic which shows the conventional optical pick-up apparatus. 従来のレーザホルダ部を示す断面図である。It is sectional drawing which shows the conventional laser holder part.

符号の説明Explanation of symbols

１…光ピックアップ装置、２…半導体レーザ素子、３…レーザホルダ部、４…コリメータレンズ、５…ビームスプリッタ一体型整形プリズム５、５Ａ…偏光分離膜、６…反射ミラー、７…１／４波長板、８…対物レンズ、９…光検出器、１０…検出レンズ、１１…筐体、１２…光学ベース、１２Ａ，１２Ｂ，１２Ｃ…垂直部，１２Ｄ，１２Ｅ，１２Ｆ…突起部、１２Ｇ，１７…貫通孔、１３…ガイドシャフト、１４…ガイド板、１５…凸部、１６…保持部、１８…第１接着部、１９…第２接着部
DESCRIPTION OF SYMBOLS 1 ... Optical pick-up apparatus, 2 ... Semiconductor laser element, 3 ... Laser holder part, 4 ... Collimator lens, 5 ... Beam splitter integrated shaping prism 5, 5A ... Polarization separation film, 6 ... Reflection mirror, 7 ... 1/4 wavelength Plate, 8 ... Objective lens, 9 ... Photodetector, 10 ... Detection lens, 11 ... Housing, 12 ... Optical base, 12A, 12B, 12C ... Vertical part, 12D, 12E, 12F ... Projection part, 12G, 17 ... Through hole, 13 ... guide shaft, 14 ... guide plate, 15 ... convex part, 16 ... holding part, 18 ... first adhesive part, 19 ... second adhesive part

Claims (1)

半導体レーザ素子を収納したレーザホルダ部と、前記レーザホルダ部を接着する少なくとも３箇所の領域を有する光学ベースと、前記半導体レーザ素子から出射されたレーザ光を装着された光ディスクに集光する対物レンズとを少なくとも備えた光ピックアップ装置において、
温度に対する粘弾性の変化が平坦な接着剤を用いて、前記３箇所の領域のうちの１箇所と前記１箇所に対向する前記レーザホルダ部の領域とが接着された第１接着部と、
温度の増加と共に粘弾性が低下する接着剤を用いて、前記３箇所の領域のうちの他の２箇所と前記他の２箇所に対向する前記レーザホルダ部の領域とが接着された第２接着部と、
を備えたことを特徴する光ピックアップ装置。

An objective lens for condensing a laser beam emitted from the laser beam emitted from the semiconductor laser element onto a mounted optical disk having a laser holder part containing the semiconductor laser element, an optical base having at least three regions for adhering the laser holder part In an optical pickup device comprising at least
Using an adhesive having a flat viscoelasticity with respect to temperature, a first adhesive portion in which one of the three regions and the region of the laser holder portion facing the one region are bonded,
Second adhesive in which the other two of the three regions and the region of the laser holder part facing the other two regions are bonded using an adhesive whose viscoelasticity decreases with increasing temperature And
An optical pickup device comprising:

JP2006120617A 2006-04-25 2006-04-25 Optical pickup device Pending JP2007294004A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010015645A (en) * 2008-07-04 2010-01-21 Hitachi Media Electoronics Co Ltd Optical pickup device and optical disk drive apparatus
JP2011008904A (en) * 2009-05-29 2011-01-13 Panasonic Corp Optical device
WO2013065418A1 (en) * 2011-11-01 2013-05-10 シャープ株式会社 Light source unit adjustment device calibration method and standard

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010015645A (en) * 2008-07-04 2010-01-21 Hitachi Media Electoronics Co Ltd Optical pickup device and optical disk drive apparatus
US8307381B2 (en) 2008-07-04 2012-11-06 Hitachi Media Electronics Co., Ltd. Optical pickup device and optical disk drive apparatus
JP2011008904A (en) * 2009-05-29 2011-01-13 Panasonic Corp Optical device
US8475016B2 (en) 2009-05-29 2013-07-02 Panasonic Corporation Optical device
WO2013065418A1 (en) * 2011-11-01 2013-05-10 シャープ株式会社 Light source unit adjustment device calibration method and standard

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