JP2007290039A - Laser beam machining method and laser beam machining device - Google Patents

Laser beam machining method and laser beam machining device Download PDF

Info

Publication number
JP2007290039A
JP2007290039A JP2007096710A JP2007096710A JP2007290039A JP 2007290039 A JP2007290039 A JP 2007290039A JP 2007096710 A JP2007096710 A JP 2007096710A JP 2007096710 A JP2007096710 A JP 2007096710A JP 2007290039 A JP2007290039 A JP 2007290039A
Authority
JP
Japan
Prior art keywords
workpiece
corner
laser beam
laser processing
stretched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007096710A
Other languages
Japanese (ja)
Other versions
JP5012147B2 (en
Inventor
Shoichi Takamatsu
章一 高松
Tsunaichi Takizawa
綱一 瀧沢
Takafumi Tsukahara
隆文 塚原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2007096710A priority Critical patent/JP5012147B2/en
Publication of JP2007290039A publication Critical patent/JP2007290039A/en
Application granted granted Critical
Publication of JP5012147B2 publication Critical patent/JP5012147B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Laser Beam Processing (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining device where, when holes are formed in an almost square sheet-shaped work having flexibility, the reduction of cost and the increase of the precision in the forming positions of the holes can be attained. <P>SOLUTION: In a state where a point P1 in a corner part A1 in a work S is fixed, tension is applied to a point P2 in a corner part A2 adjacent to the corner part A1 in a direction of a straight line passing through the point P1 and the point P2. Further, tension is applied to a point P3 in a corner part A3 and a point P4 in a corner part A4 in optional directions, so as to stretch the work S. Then, in a state where the work S is stretched, laser light is emitted to prescribed positions in the work S, so as to form holes. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、可撓性を有する略四角形シート状の被加工物に対し、レーザ光線の照射によって穴を形成するためのレーザ加工方法及びレーザ加工装置に関する。   The present invention relates to a laser processing method and a laser processing apparatus for forming a hole in a substantially rectangular sheet-like workpiece having flexibility by irradiation with a laser beam.

可撓性を有する（すなわち、自立性のない）略四角形シート状の被加工物として、例えば印刷配線板の構成部材であるプリプレグがある。印刷配線板は年々薄型化されており、そのプリプレグは、可撓性を有するシート状の部材となってきている。そのような印刷配線板の新たな製造方法も開発されており、例えば、予めプリプレグに穴を形成しておき、その穴に導電性ペースト等を埋め込んだ後、加熱プレスする方法が携帯電話機等の部品として用いられる印刷配線板に広く採用されている。   As a substantially rectangular sheet-like workpiece having flexibility (that is, having no self-supporting property), for example, there is a prepreg that is a constituent member of a printed wiring board. Printed wiring boards are becoming thinner year by year, and their prepregs have become flexible sheet-like members. A new manufacturing method of such a printed wiring board has also been developed. For example, a method of pre-forming a hole in a prepreg, embedding a conductive paste or the like in the hole, and then performing a heat press is used for a mobile phone or the like. Widely used in printed wiring boards used as parts.

上述したようなプリプレグ等、可撓性を有する略四角形シート状の被加工物に対する穴の形成は、自立性を有する板状の被加工物に対する穴の形成に用いられてきた従来の数値制御（ＮＣ）穴開け機によって行われるのが一般的である。   The formation of holes in a substantially rectangular sheet-like workpiece having flexibility such as the prepreg as described above is a conventional numerical control that has been used for forming holes in a plate-like workpiece having self-supporting properties ( NC) is generally performed by a punch.

例えば、特許文献１には、図４に示されるように、貫通穴１ａが形成された冶具板１上に、可撓性を有する略四角形シート状の被加工物Ｓを水平に載置し、冶具板１の貫通穴１ａに対応する位置にレーザ光線Ｌを照射することで被加工物Ｓに穴Ｈを形成するレーザ加工方法が記載されている。   For example, in Patent Document 1, as shown in FIG. 4, a substantially rectangular sheet-shaped workpiece S having flexibility is horizontally placed on a jig plate 1 in which a through hole 1 a is formed, A laser processing method is described in which a hole H is formed in the workpiece S by irradiating a laser beam L to a position corresponding to the through hole 1a of the jig plate 1.

また、特許文献２には、図５に示されるように、可撓性を有する略四角形シート状の被加工物Ｓの両端をチャックして外側に張力をかけることにより被加工物Ｓを水平に保持し、所定の位置にレーザ光線Ｌを照射することで被加工物Ｓに穴Ｈを形成するレーザ加工方法が記載されている。
特開２００２−２４８５９３号公報 特開平１０−２９６４７３号公報 Further, in Patent Document 2, as shown in FIG. 5, the workpiece S is horizontally leveled by chucking both ends of a substantially rectangular sheet-like workpiece S having flexibility and applying tension to the outside. A laser processing method is described in which a hole H is formed in a workpiece S by holding and irradiating a predetermined position with a laser beam L.
JP 2002-248593 A JP-A-10-296473

しかしながら、特許文献１記載のレーザ加工方法にあっては、被加工物の種類毎に専用の冶具板を準備しなければならないため、低コスト化が妨げられるおそれがある。更に、被加工物に形成する穴間のピッチが小さい場合には、冶具板の貫通穴が接近し過ぎるという問題もある。   However, in the laser processing method described in Patent Document 1, it is necessary to prepare a dedicated jig plate for each type of workpiece, which may hinder cost reduction. Furthermore, when the pitch between the holes formed in the workpiece is small, there is a problem that the through holes of the jig plate are too close.

また、特許文献２記載のレーザ加工方法にあっては、張力の大きさによって、被加工物が伸びたり、或いは被加工物が湾曲するように垂れ下がったりし、その状態で穴が形成されるため、穴の形成位置の精度が低下するおそれがある。   Further, in the laser processing method described in Patent Document 2, depending on the magnitude of the tension, the workpiece is stretched or hangs down so that the workpiece is curved, and a hole is formed in that state. There is a risk that the accuracy of the hole forming position may be lowered.

そこで、本発明は、このような事情に鑑みてなされたものであり、可撓性を有する略四角形シート状の被加工物に穴を形成するに際し、低コスト化及び穴の形成位置の高精度化を図ることができるレーザ加工方法及びレーザ加工装置を提供することを目的とする。   Therefore, the present invention has been made in view of such circumstances, and when forming a hole in a substantially rectangular sheet-like workpiece having flexibility, the cost is reduced and the position of the hole is highly accurate. An object of the present invention is to provide a laser processing method and a laser processing apparatus capable of achieving the above.

上記目的を達成するために、本発明に係るレーザ加工方法は、可撓性を有する略四角形シート状の被加工物に対し、レーザ光線の照射によって穴を形成するためのレーザ加工方法であって、被加工物の第１の角部を固定した状態で、第１の角部と隣り合う第２の角部に対し、第１の角部と第２の角部とを通る直線方向に張力をかけると共に、残りの第３の角部及び第４の角部に対し、任意の方向に張力をかけることで、被加工物を張り、被加工物を張った状態で、被加工物の所定の位置にレーザ光線を照射することで、穴を形成することを特徴とする。   In order to achieve the above object, a laser processing method according to the present invention is a laser processing method for forming a hole by irradiating a laser beam to a substantially rectangular sheet-like workpiece having flexibility. In a state where the first corner of the work piece is fixed, the second corner adjacent to the first corner is tensioned in a linear direction passing through the first corner and the second corner. In addition, the work piece is stretched by applying tension to the remaining third and fourth corners in an arbitrary direction, and the work piece is stretched in a predetermined state. A hole is formed by irradiating a laser beam to the position.

このレーザ加工方法によれば、被加工物の種類毎に専用の冶具板等を準備しなくても、被加工物の伸びや湾曲等の変形を抑制して、被加工物を略平面に維持することができる。そのため、可撓性を有する略四角形シート状の被加工物に穴を形成するに際し、低コスト化及び穴の形成位置の高精度化を図ることができる。   According to this laser processing method, it is possible to keep the workpiece substantially flat by suppressing deformation of the workpiece, such as elongation and bending, without preparing a dedicated jig plate for each type of workpiece. can do. Therefore, when forming a hole in a substantially rectangular sheet-like workpiece having flexibility, it is possible to reduce the cost and increase the accuracy of the hole forming position.

本発明に係るレーザ加工方法においては、被加工物が張られた後であってレーザ光線が照射される前に、第２の角部、第３の角部及び第４の角部にかける張力を略一定とすることが好ましい。これによれば、被加工物の伸び等の変形をより一層確実に抑制することができる。   In the laser processing method according to the present invention, the tension applied to the second corner, the third corner, and the fourth corner after the workpiece is stretched and before the laser beam is irradiated. Is preferably substantially constant. According to this, deformation such as elongation of the workpiece can be more reliably suppressed.

本発明に係るレーザ加工方法においては、被加工物が張られた後であってレーザ光線が照射される前に、被加工物の周縁部を保持することが好ましい。これによれば、より一層確実に被加工物を略平面に維持することができる。   In the laser processing method according to the present invention, it is preferable to hold the peripheral portion of the workpiece after the workpiece is stretched and before the laser beam is irradiated. According to this, the workpiece can be maintained on a substantially flat surface more reliably.

本発明に係るレーザ加工方法においては、被加工物の周縁部の保持は、真空吸着によって行われることが好ましい。これによれば、より一層確実且つ容易に被加工物を略平面に維持することができる。   In the laser processing method according to the present invention, it is preferable that the peripheral edge of the workpiece is held by vacuum suction. According to this, a workpiece can be maintained on a substantially flat surface more reliably and easily.

また、上記目的を達成するために、本発明に係るレーザ加工装置は、可撓性を有する略四角形シート状の被加工物に対し、レーザ光線の照射によって穴を形成するためのレーザ加工装置であって、被加工物の第１の角部を固定した状態で、第１の角部と隣り合う第２の角部に対し、第１の角部と第２の角部とを通る直線方向に張力をかけると共に、残りの第３の角部及び第４の角部に対し、任意の方向に張力をかけることで、被加工物を張り、被加工物を張った状態で、被加工物の所定の位置にレーザ光線を照射することで、穴を形成することを特徴とする。   In order to achieve the above object, a laser processing apparatus according to the present invention is a laser processing apparatus for forming a hole by irradiating a laser beam to a substantially rectangular sheet-like workpiece having flexibility. A straight direction passing through the first corner and the second corner with respect to the second corner adjacent to the first corner with the first corner of the workpiece fixed. The work piece is stretched by applying tension to the remaining third and fourth corners in any direction, and the work piece is stretched. A hole is formed by irradiating a predetermined position with a laser beam.

本発明に係るレーザ加工装置においては、被加工物が張られた後であってレーザ光線が照射される前に、第２の角部、第３の角部及び第４の角部にかける張力を略一定とすることが好ましい。   In the laser processing apparatus according to the present invention, the tension applied to the second corner, the third corner, and the fourth corner after the workpiece is stretched and before the laser beam is irradiated. Is preferably substantially constant.

本発明に係るレーザ加工装置においては、被加工物が張られた後であってレーザ光線が照射される前に、被加工物の周縁部を保持することが好ましい。   In the laser processing apparatus according to the present invention, it is preferable to hold the peripheral portion of the workpiece after the workpiece is stretched and before the laser beam is irradiated.

本発明に係るレーザ加工装置においては、前記被加工物の前記周縁部の保持は、真空吸着によって行われることが好ましい。   In the laser processing apparatus according to the present invention, it is preferable that the peripheral portion of the workpiece is held by vacuum suction.

本発明によれば、可撓性を有する略四角形シート状の被加工物に穴を形成するに際し、低コスト化及び穴の形成位置の高精度化を図ることができる。   According to the present invention, when forming a hole in a substantially rectangular sheet-like workpiece having flexibility, it is possible to reduce the cost and increase the accuracy of the hole forming position.

以下、本発明の好適な実施形態について、図面を参照して詳細に説明する。   DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

図１〜３に示されるように、レーザ加工装置１０は、可撓性を有する略四角形シート状の被加工物Ｓに対し、レーザ光線Ｌの照射によって穴Ｈを形成するためのものである。レーザ加工装置１０は、被加工物Ｓを張る展張装置１１と、被加工物Ｓの周縁部を保持する仮固定枠１２と、レーザ光線Ｌを出射するレーザヘッド１３と、を備えている。   As shown in FIGS. 1 to 3, the laser processing apparatus 10 is for forming a hole H by irradiating a laser beam L to a substantially rectangular sheet-shaped workpiece S having flexibility. The laser processing apparatus 10 includes a stretching device 11 that stretches the workpiece S, a temporary fixing frame 12 that holds the peripheral edge of the workpiece S, and a laser head 13 that emits a laser beam L.

展張装置１１は、図１に示されるように、被加工物Ｓの角部Ａ１の点Ｐ１を固定した状態で、角部Ａ１と隣り合う（隣接する）角部Ａ２の点Ｐ２に対し、点Ｐ１と点Ｐ２とを通る直線（図１における一点鎖線）方向に張力（テンション）をかけると共に、残りの角部Ａ３の点Ｐ３及び角部Ａ４の点Ｐ４に対し、任意の方向に張力（テンション）をかけることで、被加工物Ｓを張る（展張する）。つまり、点Ｐ１は固定点（固定端）であり、点Ｐ３，Ｐ４は自由点（自由端）である。これにより、被加工物Ｓは、弛みのない良好な平面状態で保持されることになる。なお、点Ｐ２〜Ｐ４にかける張力の向きは、被加工物Ｓを張る向き（すなわち、被加工物Ｓを広げる向き）である。   As shown in FIG. 1, the stretching device 11 has a point P2 of a corner A2 adjacent to (adjacent to) the corner A1 in a state where the point P1 of the corner A1 of the workpiece S is fixed. Tension (tension) is applied in the direction of a straight line (dotted line in FIG. 1) passing through P1 and point P2, and tension (tension) is applied to point P3 of corner portion A3 and point P4 of corner portion A4 in any direction. ), The workpiece S is stretched (stretched). That is, the point P1 is a fixed point (fixed end), and the points P3 and P4 are free points (free end). As a result, the workpiece S is held in a good flat state without slack. Note that the direction of the tension applied to the points P2 to P4 is the direction in which the workpiece S is stretched (that is, the direction in which the workpiece S is expanded).

このように、展張装置１１は、可撓性を有する略四角形シート状の被加工物Ｓを弛みのない良好な平面状態で保持する機構を有しているため、被加工物Ｓに反りや歪みがある場合であっても良好な平面状態での被加工物Ｓの中空保持を実現することができる。このような良好な平面状態での被加工物Ｓの中空保持は、次の理由により極めて重要である。すなわち、レーザ光線Ｌの照射によって被加工物Ｓに穴Ｈを形成する際に問題となるのは、穴Ｈの形成位置の精度の低下や穴径のばらつきであり、これらの問題は、中空保持された被加工物Ｓの平面状態に影響され易いという理由である。   As described above, the stretching device 11 has a mechanism for holding the flexible, substantially quadrilateral sheet-like workpiece S in an excellent flat state without sagging, so that the workpiece S is warped or distorted. Even if there is, it is possible to realize the hollow holding of the workpiece S in a good planar state. The hollow holding of the workpiece S in such a good planar state is extremely important for the following reason. That is, problems that occur when the hole H is formed in the workpiece S by irradiation with the laser beam L are a decrease in the accuracy of the formation position of the hole H and a variation in hole diameter. This is because it is easily influenced by the planar state of the processed workpiece S.

このとき、被加工物Ｓに張力がかかり過ぎると、レーザ光線Ｌの照射の前後で被加工物Ｓの伸縮が大きくなり、穴Ｈの形成位置の精度の低下や穴径のばらつきを招くおそれがある。そのため、展張装置１１で略平面を作製した後、張力をかける装置の動きを固定して、張力のかかり過ぎを防止することが好ましい。つまり、被加工物Ｓの伸び等の変形をより一層確実に抑制するために、被加工物Ｓが張られた後であってレーザ光線Ｌが照射される前に、点Ｐ２〜Ｐ４にかける張力を略一定とすることが好ましい。   At this time, if too much tension is applied to the workpiece S, the workpiece S expands and contracts before and after the irradiation with the laser beam L, and the accuracy of the formation position of the hole H and the variation in hole diameter may be caused. is there. For this reason, it is preferable to prevent the tension from being applied excessively by preparing a substantially flat surface with the stretching device 11 and then fixing the movement of the device to which tension is applied. That is, in order to more reliably suppress deformation such as elongation of the workpiece S, tension applied to the points P2 to P4 after the workpiece S is stretched and before the laser beam L is irradiated. Is preferably substantially constant.

仮固定枠１２は、図２に示されるように、略四角形環状に形成されており、被加工物Ｓの周縁部を真空吸着によって保持する。つまり、より一層確実且つ容易に被加工物Ｓを略平面に維持するために、被加工物Ｓが張られた後であってレーザ光線Ｌが照射される前に、被加工物Ｓの周縁部を真空吸着によって保持することが好ましい。なお、被加工物Ｓの周縁部の保持は、真空吸着ではなくチャッキングによって行われてもよい。   As shown in FIG. 2, the temporary fixing frame 12 is formed in a substantially quadrangular ring shape, and holds the peripheral edge of the workpiece S by vacuum suction. In other words, in order to maintain the workpiece S in a substantially flat surface more reliably and easily, the peripheral portion of the workpiece S after the workpiece S is stretched and before the laser beam L is irradiated. Is preferably held by vacuum adsorption. In addition, holding | maintenance of the peripheral part of the to-be-processed object S may be performed not by vacuum suction but by chucking.

レーザヘッド１３は、図３に示されるように、仮固定枠１２によって良好な平面状態で被加工物Ｓを中空保持した状態で（すなわち、被加工物Ｓを張った状態で）、被加工物Ｓの所定の位置に向けてレーザ光線Ｌを出射し、被加工物Ｓの所定の位置にレーザ光線Ｌを照射することで、穴Ｈを形成する。レーザ光線Ｌとしては、波長が９．３μｍ〜９．４μｍの遠赤外線である炭酸ガスレーザ、紫外線であるＵＶ−ＹＡＧレーザ、エキシマレー等が用いられる。なお、レーザ光線Ｌの照射は、被加工物Ｓ及びレーザヘッド１３の少なくとも一方を移動させながら行われるが、一般的には、被加工物Ｓを移動させ、レーザヘッド１３を固定する方法が採用される。   As shown in FIG. 3, the laser head 13 is in a state where the work piece S is held in a hollow state by the temporary fixing frame 12 in a favorable plane state (that is, in a state where the work piece S is stretched). The laser beam L is emitted toward a predetermined position of S, and the hole H is formed by irradiating the predetermined position of the workpiece S with the laser beam L. As the laser beam L, a carbon dioxide gas laser that is a far infrared ray having a wavelength of 9.3 μm to 9.4 μm, a UV-YAG laser that is an ultraviolet ray, an excimer ray, or the like is used. The irradiation with the laser beam L is performed while moving at least one of the workpiece S and the laser head 13. In general, a method of moving the workpiece S and fixing the laser head 13 is adopted. Is done.

次に、レーザ加工装置１０において実施されるレーザ加工方法について説明する。   Next, a laser processing method performed in the laser processing apparatus 10 will be described.

まず、図１に示されるように、展張装置１１を用いて、被加工物Ｓの角部Ａ１の点Ｐ１を固定した状態で、角部Ａ１と隣り合う角部Ａ２の点Ｐ２に対し、点Ｐ１と点Ｐ２とを通る直線方向に張力をかけると共に、残りの角部Ａ３の点Ｐ３及び角部Ａ４の点Ｐ４に対し、任意の方向に張力をかけることで、被加工物Ｓを張る。これにより、被加工物Ｓは、弛みのない良好な平面状態で保持されることになる。   First, as shown in FIG. 1, with the stretching device 11, the point P1 of the corner A1 of the workpiece S is fixed, and the point P2 of the corner A2 adjacent to the corner A1 is pointed. The workpiece S is stretched by applying tension in the arbitrary direction to the point P3 of the remaining corner A3 and the point P4 of the corner A4 while applying tension in the linear direction passing through P1 and the point P2. As a result, the workpiece S is held in a good flat state without slack.

展張装置１１で略平面を作製した後、張力をかける装置の動きを固定して、張力のかかり過ぎを防止し、図２に示されるように、仮固定枠１２を用いて、被加工物Ｓの周縁部を真空吸着によって保持する。   After producing a substantially flat surface with the stretching device 11, the movement of the device for applying tension is fixed to prevent excessive tension, and the work piece S is used with a temporary fixing frame 12 as shown in FIG. 2. Is held by vacuum suction.

仮固定枠１２によって良好な平面状態で被加工物Ｓを中空保持した状態で、図３に示されるように、レーザヘッド１３を用いて、被加工物Ｓの所定の位置に向けてレーザ光線Ｌを出射し、被加工物Ｓの所定の位置にレーザ光線Ｌを照射することで、穴Ｈを形成する。   As shown in FIG. 3, the laser beam L is directed toward a predetermined position of the workpiece S using the laser head 13 in a state where the workpiece S is held in a hollow state by the temporary fixing frame 12 in a hollow state. , And a laser beam L is applied to a predetermined position of the workpiece S to form a hole H.

以上説明したように、レーザ加工装置１０、及びそれにおいて実施されるレーザ加工方法によれば、被加工物Ｓの種類毎に専用の冶具板等を準備しなくても、被加工物Ｓの伸びや湾曲等の変形を抑制して、被加工物Ｓを略平面に維持することができる。そのため、可撓性を有する略四角形シート状の被加工物Ｓに穴Ｈを形成するに際し、低コスト化及び穴Ｈの形成位置の高精度化を図ることができる。   As described above, according to the laser processing apparatus 10 and the laser processing method implemented therein, the elongation of the workpiece S can be achieved without preparing a dedicated jig plate or the like for each type of the workpiece S. It is possible to keep the workpiece S substantially flat by suppressing deformation such as bending and bending. Therefore, when forming the hole H in the workpiece S having a substantially rectangular sheet shape having flexibility, it is possible to reduce the cost and increase the accuracy of the position where the hole H is formed.

［実施例１］
厚さが５０μｍ、寸法が３４０ｍｍ×５１０ｍｍのガラス布エポキシプリプレグ（日立化成工業（株）製、商品名ＧＥＡ−６７９ＦＧ）を準備し、図１に示されるように、ガラス布エポキシプリプレグを張った（各点Ｐ２〜Ｐ４における張力は、図１における矢印の向きに約１０Ｎであった）。そして、３４０ｍｍ方向のピッチが２９０ｍｍ、５１０ｍｍ方向のピッチが４００ｍｍになる設計値に基づいて、レーザ光線の照射によってφ１５０μｍの穴を４個形成した。 [Example 1]
A glass cloth epoxy prepreg (trade name GEA-679FG, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 50 μm and dimensions of 340 mm × 510 mm was prepared, and a glass cloth epoxy prepreg was stretched as shown in FIG. The tension at each of the points P2 to P4 was about 10 N in the direction of the arrow in FIG. Then, based on the design value that the pitch in the 340 mm direction is 290 mm and the pitch in the 510 mm direction is 400 mm, four holes of φ150 μm are formed by laser beam irradiation.

［実施例２］
図１に示されるように、実施例１と同様のガラス布エポキシプリプレグを張った後（各点Ｐ２〜Ｐ４における張力は、図１における矢印の向きに約１０Ｎであった）、図２に示されるように、仮固定枠を用いてガラス布エポキシプリプレグの周縁部を保持した。そして、３４０ｍｍ方向のピッチが２９０ｍｍ、５１０ｍｍ方向のピッチが４００ｍｍになる設計値に基づいて、レーザ光線の照射によってφ１５０μｍの穴を４個形成した。 [Example 2]
As shown in FIG. 1, after stretching the same glass cloth epoxy prepreg as in Example 1 (the tension at each point P2 to P4 was about 10 N in the direction of the arrow in FIG. 1), it was shown in FIG. As described above, the peripheral edge of the glass cloth epoxy prepreg was held using a temporary fixing frame. Then, based on the design value that the pitch in the 340 mm direction is 290 mm and the pitch in the 510 mm direction is 400 mm, four holes of φ150 μm are formed by laser beam irradiation.

［比較例１］
図３に示されるように、実施例１と同様のガラス布エポキシプリプレグの両端（対向する二辺）をチャックして、重力による垂れ下がりを防止するために外側に２ｋｇ重（１９．６Ｎ）の張力をかけることによりガラス布エポキシプリプレグを水平に保持した。そして、３４０ｍｍ方向のピッチが２９０ｍｍ、５１０ｍｍ方向のピッチが４００ｍｍになる設計値に基づいて、レーザ光線の照射によってφ１５０μｍの穴を４個形成した。 [Comparative Example 1]
As shown in FIG. 3, both ends (opposite sides) of the same glass cloth epoxy prepreg as in Example 1 are chucked, and a tension of 2 kg (19.6 N) is applied to the outside to prevent drooping due to gravity. To hold the glass cloth epoxy prepreg horizontally. Then, based on the design value that the pitch in the 340 mm direction is 290 mm and the pitch in the 510 mm direction is 400 mm, four holes of φ150 μm are formed by laser beam irradiation.

実施例１，２及び比較例１における穴の形成位置の精度を二次元寸法測定機で測定し、４００ｍｍピッチでの設計値と実測値との差を形成位置の精度として算出した。その結果を表１に示す。   The accuracy of the hole formation position in Examples 1 and 2 and Comparative Example 1 was measured with a two-dimensional dimension measuring machine, and the difference between the design value and the actual measurement value at a pitch of 400 mm was calculated as the accuracy of the formation position. The results are shown in Table 1.

Figure 2007290039
Figure 2007290039

表１に示されるように、実施例１，２における穴の形成位置の精度は７５μｍ，５０μｍであるのに対し、比較例１における穴の形成位置の精度は５００μｍであった。これにより、比較例１における穴の形成位置の精度に比べ、実施例１，２における穴の形成位置の精度が高いことが明らかとなった。   As shown in Table 1, the accuracy of the hole formation position in Examples 1 and 2 was 75 μm and 50 μm, whereas the precision of the hole formation position in Comparative Example 1 was 500 μm. As a result, it became clear that the accuracy of the hole forming position in Examples 1 and 2 was higher than the accuracy of the hole forming position in Comparative Example 1.

本発明に係るレーザ加工装置の一実施形態における展張装置を示す概略図である。It is the schematic which shows the extending | stretching apparatus in one Embodiment of the laser processing apparatus which concerns on this invention. 本発明に係るレーザ加工装置の一実施形態における仮固定枠を示す概略図である。It is the schematic which shows the temporary fixing frame in one Embodiment of the laser processing apparatus which concerns on this invention. 本発明に係るレーザ加工装置の一実施形態におけるレーザヘッドを示す概略図である。It is the schematic which shows the laser head in one Embodiment of the laser processing apparatus which concerns on this invention. 従来のレーザ加工方法を示す概略図である。It is the schematic which shows the conventional laser processing method. 従来のレーザ加工方法を示す概略図である。It is the schematic which shows the conventional laser processing method.

符号の説明Explanation of symbols

１０…レーザ加工装置、Ｓ…被加工物、Ａ１…角部（第１の角部）、Ａ２…角部（第２の角部）、Ａ３…角部（第３の角部）、Ａ４…角部（第４の角部）、Ｌ…レーザ光線、Ｈ…穴。   DESCRIPTION OF SYMBOLS 10 ... Laser processing apparatus, S ... Workpiece, A1 ... Corner | angular part (1st corner | angular part), A2 ... Corner | angular part (2nd corner | angular part), A3 ... Corner | angular part (3rd corner | angular part), A4 ... Corner (fourth corner), L ... laser beam, H ... hole.

Claims (8)

可撓性を有する略四角形シート状の被加工物に対し、レーザ光線の照射によって穴を形成するためのレーザ加工方法であって、
前記被加工物の第１の角部を固定した状態で、前記第１の角部と隣り合う第２の角部に対し、前記第１の角部と前記第２の角部とを通る直線方向に張力をかけると共に、残りの第３の角部及び第４の角部に対し、任意の方向に張力をかけることで、前記被加工物を張り、前記被加工物を張った状態で、前記被加工物の所定の位置に前記レーザ光線を照射することで、前記穴を形成することを特徴とするレーザ加工方法。 A laser processing method for forming a hole by irradiating a laser beam on a substantially rectangular sheet-shaped workpiece having flexibility,
A straight line passing through the first corner and the second corner with respect to a second corner adjacent to the first corner with the first corner of the workpiece fixed. While applying tension in the direction and applying tension in any direction to the remaining third corner and fourth corner, the workpiece is stretched and the workpiece is stretched. A laser processing method, wherein the hole is formed by irradiating a predetermined position of the workpiece with the laser beam. 前記被加工物が張られた後であって前記レーザ光線が照射される前に、前記第２の角部、前記第３の角部及び前記第４の角部にかける張力を略一定とすることを特徴とする請求項１記載のレーザ加工方法。   The tension applied to the second corner, the third corner, and the fourth corner is substantially constant after the workpiece is stretched and before the laser beam is irradiated. The laser processing method according to claim 1. 前記被加工物が張られた後であって前記レーザ光線が照射される前に、前記被加工物の周縁部を保持することを特徴とする請求項１又は２記載のレーザ加工方法。   3. The laser processing method according to claim 1, wherein a peripheral portion of the workpiece is held after the workpiece is stretched and before the laser beam is irradiated. 前記被加工物の前記周縁部の保持は、真空吸着によって行われることを特徴とする請求項３記載のレーザ加工方法。   4. The laser processing method according to claim 3, wherein the holding of the peripheral portion of the workpiece is performed by vacuum suction. 可撓性を有する略四角形シート状の被加工物に対し、レーザ光線の照射によって穴を形成するためのレーザ加工装置であって、
前記被加工物の第１の角部を固定した状態で、前記第１の角部と隣り合う第２の角部に対し、前記第１の角部と前記第２の角部とを通る直線方向に張力をかけると共に、残りの第３の角部及び第４の角部に対し、任意の方向に張力をかけることで、前記被加工物を張り、前記被加工物を張った状態で、前記被加工物の所定の位置に前記レーザ光線を照射することで、前記穴を形成することを特徴とするレーザ加工装置。 A laser processing apparatus for forming a hole by irradiating a laser beam on a substantially rectangular sheet-shaped workpiece having flexibility,
A straight line passing through the first corner and the second corner with respect to a second corner adjacent to the first corner with the first corner of the workpiece fixed. While applying tension in the direction and applying tension in any direction to the remaining third corner and fourth corner, the workpiece is stretched and the workpiece is stretched. The laser processing apparatus, wherein the hole is formed by irradiating the laser beam to a predetermined position of the workpiece. 前記被加工物が張られた後であって前記レーザ光線が照射される前に、前記第２の角部、前記第３の角部及び前記第４の角部にかける張力を略一定とすることを特徴とする請求項５記載のレーザ加工装置。   The tension applied to the second corner, the third corner, and the fourth corner is substantially constant after the workpiece is stretched and before the laser beam is irradiated. The laser processing apparatus according to claim 5. 前記被加工物が張られた後であって前記レーザ光線が照射される前に、前記被加工物の周縁部を保持することを特徴とする請求項５又は６記載のレーザ加工装置。   The laser processing apparatus according to claim 5 or 6, wherein a peripheral portion of the workpiece is held after the workpiece is stretched and before the laser beam is irradiated. 前記被加工物の前記周縁部の保持は、真空吸着によって行われることを特徴とする請求項７記載のレーザ加工装置。   The laser processing apparatus according to claim 7, wherein the peripheral edge of the workpiece is held by vacuum suction.
JP2007096710A 2006-03-31 2007-04-02 Laser processing method and laser processing apparatus Expired - Fee Related JP5012147B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007096710A JP5012147B2 (en) 2006-03-31 2007-04-02 Laser processing method and laser processing apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006097899 2006-03-31
JP2006097899 2006-03-31
JP2007096710A JP5012147B2 (en) 2006-03-31 2007-04-02 Laser processing method and laser processing apparatus

Publications (2)

Publication Number Publication Date
JP2007290039A true JP2007290039A (en) 2007-11-08
JP5012147B2 JP5012147B2 (en) 2012-08-29

Family

ID=38761162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007096710A Expired - Fee Related JP5012147B2 (en) 2006-03-31 2007-04-02 Laser processing method and laser processing apparatus

Country Status (1)

Country Link
JP (1) JP5012147B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010100727A1 (en) * 2009-03-04 2010-09-10 三菱電機株式会社 Laser machining apparatus, laser machining method, machining control apparatus and machining control method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10296473A (en) * 1997-02-06 1998-11-10 Matsushita Electric Ind Co Ltd Laser beam machine and method for laser beam machining
JP2001205487A (en) * 2000-01-19 2001-07-31 Matsushita Electric Ind Co Ltd Holding device for work and method of holding for work
JP2001232490A (en) * 2000-02-23 2001-08-28 Hitachi Via Mechanics Ltd Laser beam machine
JP2002273631A (en) * 2001-03-15 2002-09-25 Matsushita Electric Ind Co Ltd Method and device for holding and positioning work

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10296473A (en) * 1997-02-06 1998-11-10 Matsushita Electric Ind Co Ltd Laser beam machine and method for laser beam machining
JP2001205487A (en) * 2000-01-19 2001-07-31 Matsushita Electric Ind Co Ltd Holding device for work and method of holding for work
JP2001232490A (en) * 2000-02-23 2001-08-28 Hitachi Via Mechanics Ltd Laser beam machine
JP2002273631A (en) * 2001-03-15 2002-09-25 Matsushita Electric Ind Co Ltd Method and device for holding and positioning work

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010100727A1 (en) * 2009-03-04 2010-09-10 三菱電機株式会社 Laser machining apparatus, laser machining method, machining control apparatus and machining control method
CN102216023A (en) * 2009-03-04 2011-10-12 三菱电机株式会社 Laser machining apparatus, laser machining method, machining control apparatus and machining control method
KR101251084B1 (en) 2009-03-04 2013-04-05 미쓰비시덴키 가부시키가이샤 Laser machining apparatus, laser machining method, machining control apparatus and machining control method
JP5230796B2 (en) * 2009-03-04 2013-07-10 三菱電機株式会社 Laser processing apparatus, laser processing method, processing control apparatus, and processing control method
CN102216023B (en) * 2009-03-04 2014-05-07 三菱电机株式会社 Laser machining apparatus, laser machining method, machining control apparatus and machining control method

Also Published As

Publication number Publication date
JP5012147B2 (en) 2012-08-29

Similar Documents

Publication Publication Date Title
US8023112B2 (en) Alignment apparatus and fabrication apparatus for planar member and alignment method and fabrication method for planar member
JP6278451B2 (en) Marking device and pattern generation device
TWI453368B (en) X-ray position measuring device, position measuring method of X-ray position measuring device, and position measuring method of X-ray position measuring device
JP2010114347A (en) Exposure device
JP4562488B2 (en) Metal mask position alignment method and apparatus
JP5012147B2 (en) Laser processing method and laser processing apparatus
JP5500248B2 (en) Laser processing equipment
JP2008109026A (en) Semiconductor wafer and manufacturing method for the same
JP2007220987A (en) Retainer of plane board
JP2008182002A (en) Device and method for processing substrate, and method for manufacturing display component
JP2006274360A (en) Metal mask, and method and device for positional alignment of the same
WO2016147977A1 (en) Image-rendering device
JP2014035349A (en) Exposure device, method for manufacturing flat panel display, and device manufacturing method
JP2006276398A (en) Exposure device
JP5114986B2 (en) Drilling method
KR102554316B1 (en) Apparatus for treating plate and method for treating plate
JP2006292864A (en) Fixture for body to be drawn
JP2006110607A (en) Laser beam machining apparatus
KR20120008356A (en) Laser manufacturing apparatus
JP2003080386A (en) Laser machining device
JP2006093604A (en) Proximity exposure apparatus
JP4778031B2 (en) Laser processing machine
JP6406005B2 (en) Tool holder and groove processing device
JP5253217B2 (en) Substrate alignment method, substrate alignment apparatus, laser processing apparatus and solar panel manufacturing method
JP2013230480A (en) Method and device for holding rectangular sheet

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100401

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110302

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111006

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111018

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111219

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120508

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120521

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150615

Year of fee payment: 3

R151 Written notification of patent or utility model registration

Ref document number: 5012147

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150615

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150615

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees