JP2007281045A - Electronic component with lead frame and its manufacturing method - Google Patents

Electronic component with lead frame and its manufacturing method Download PDF

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JP2007281045A
JP2007281045A JP2006102681A JP2006102681A JP2007281045A JP 2007281045 A JP2007281045 A JP 2007281045A JP 2006102681 A JP2006102681 A JP 2006102681A JP 2006102681 A JP2006102681 A JP 2006102681A JP 2007281045 A JP2007281045 A JP 2007281045A
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electronic component
hole
lead frame
terminal
dimension
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JP5057687B2 (en
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Susumu Kurihara
進 栗原
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Shindengen Electric Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component capable of smoothly fixing to an electronic component mounting substrate without wasting a material. <P>SOLUTION: The electronic component 10 includes a lead frame 1 having a terminal with a rectangular cross section to be inserted into and fixed to a through-hole provided on the electronic component mounting substrate. A lead frame terminal 2 is chamfered by pressing with a diagonal size of the rectangular cross section larger than an internal diameter size of the through-hole. Opposite dimensions include chamfered parts 3 corresponding to the internal diameter size of the through-hole. The chamfered part has a rolled part 4 rolled according to the internal diameter of the through-hole by extrusion pressure by the pressing. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、リードフレームを備えた電子部品であって、特に電子部品搭載基板に設けた貫通孔に端子を挿入されて固定するためのリードフレームを備えた電子部品およびその製造方法に関するものである。   The present invention relates to an electronic component including a lead frame, and more particularly to an electronic component including a lead frame for inserting and fixing a terminal into a through hole provided in an electronic component mounting substrate, and a method of manufacturing the same. .

電子部品は薄板金属をプレス加工したリードフレームを備えており、該リードフレームは、特許文献１に示されているように矩形断面形状の端子を有している。電子部品が搭載される基板には貫通孔が設けられており、当該貫通孔に電子部品の端子を挿入して、供給する半田の溶着により固定することで、電子部品は電子部品搭載基板と電気的に接続される。   The electronic component includes a lead frame obtained by pressing a thin metal plate, and the lead frame has a terminal having a rectangular cross section as disclosed in Patent Document 1. The substrate on which the electronic component is mounted is provided with a through hole, and the electronic component is electrically connected to the electronic component mounting substrate by inserting the terminal of the electronic component into the through hole and fixing it by welding the supplied solder. Connected.

特開２０００−７７５８８（図１５および[００３０]参照）JP 2000-77588 (see FIG. 15 and [0030])

しかしながら、従来の電子部品は、電子部品の端子の断面形状が矩形であることから、貫通孔に端子を挿入した後、当該電子部品を電子部品搭載基板に固定する為に、当該端子の矩形断面において対向する角の寸法、すなわち対角線寸法が貫通孔の内径寸法より小さく形成されている。   However, in the conventional electronic component, since the cross-sectional shape of the terminal of the electronic component is rectangular, in order to fix the electronic component to the electronic component mounting substrate after inserting the terminal into the through hole, The dimensions of the opposite corners, i.e., the diagonal dimension, are smaller than the inner diameter dimension of the through hole.

従って、端子と貫通孔内との間には隙間があり、貫通孔に単に挿入されただけの電子部品は、前記した隙間により電子部品搭載基板上で不安定な状態となる。すなわち、電子部品は電子部品搭載基板上で隙間寸法および貫通孔の深さ寸法の関係に応じた傾斜を有した不安定な状態で配置される。このように傾斜を有して配置される電子部品を固定する際には、わざわざ傾斜を修正して電子部品を固定する必要があり、この煩わしさが問題となっていた。   Accordingly, there is a gap between the terminal and the inside of the through hole, and the electronic component simply inserted into the through hole is in an unstable state on the electronic component mounting substrate due to the gap. That is, the electronic component is arranged in an unstable state having an inclination corresponding to the relationship between the gap dimension and the depth dimension of the through hole on the electronic component mounting substrate. Thus, when fixing an electronic component arranged with an inclination, it is necessary to bother the inclination to fix the electronic component, and this bothersomeness has been a problem.

また、特許文献１の[００３０]に示されているように、電子部品の端子に面取りを行なう場合、端子の角が削り取られることから、削り取られる端子の角が無駄になり、これも問題となっていた。   Further, as shown in [0030] of Patent Document 1, when chamfering a terminal of an electronic component, the corner of the terminal is scraped off, and the corner of the terminal to be scraped is wasted. It was.

従って、本発明の目的は、材料を無駄にすることなく、かつ電子部品搭載基板に円滑に固定可能の電子部品を提供することにある。
更に、本発明の他の目的は、材料を無駄にすることなく、かつ電子部品搭載基板に円滑に固定可能の電子部品の製造方法を提供することにある。 Accordingly, an object of the present invention is to provide an electronic component that can be smoothly fixed to an electronic component mounting substrate without wasting materials.
Furthermore, another object of the present invention is to provide a method of manufacturing an electronic component that can be smoothly fixed to an electronic component mounting board without wasting materials.

本発明の電子部品は、電子部品搭載基板に設けた貫通孔に、挿入して固定するための矩形断面形状の端子を有するリードフレームを備えた電子部品において、前記貫通孔の内径寸法より矩形断面形状の対角線寸法が大きなリードフレーム端子に対してプレスによる面取り整形が行なわれ、対向寸法が前記貫通孔の内径寸法に対応する面取り部を備えており、前記面取り部は、前記プレスによる押出圧力により前記貫通孔の内径に応じて圧延された圧延部を有していることを特徴とする。   The electronic component of the present invention is an electronic component including a lead frame having a terminal having a rectangular cross-sectional shape for being inserted into and fixed to a through hole provided in the electronic component mounting substrate. A lead frame terminal having a large diagonal dimension is subjected to chamfer shaping by a press, and a chamfered portion having a facing dimension corresponding to the inner diameter of the through hole is provided. It has the rolling part rolled according to the internal diameter of the said through-hole.

更に、本発明の電子部品の製造方法は、電子部品搭載基板に設けた貫通孔に、挿入して固定するための矩形断面形状の端子を有するリードフレームを備えた電子部品の製造方法において、前記貫通孔の内径寸法より矩形断面形状の対角線寸法が大きなリードフレーム端子に対してプレスによる面取り整形を行い、当該整形による面取り部の対向寸法を前記貫通孔の内径寸法に応じて形成するとともに、前記面取り部において前記プレスによる押出圧力により前記貫通孔の内径に応じて圧延された圧延部を形成することを特徴とする。   Furthermore, the method for manufacturing an electronic component according to the present invention is the method for manufacturing an electronic component including a lead frame having a terminal having a rectangular cross-sectional shape for insertion into a through hole provided in the electronic component mounting substrate. Chamfer shaping is performed by pressing on a lead frame terminal whose diagonal dimension is larger than the inner diameter dimension of the through hole, and the facing dimension of the chamfered portion is formed according to the inner diameter dimension of the through hole. In the chamfered portion, a rolled portion that is rolled according to the inner diameter of the through hole is formed by an extrusion pressure by the press.

本発明によれば、貫通孔の内径寸法より矩形断面形状の対角線寸法が大きなリードフレーム端子に対してプレスによる面取り整形を行い、当該整形による面取り部の対向寸法を貫通孔の内径寸法に応じて形成することから、面取り部によって貫通孔に挿入された端子と貫通孔との隙間量を低減することができ、更に押出圧力により圧延された圧延部が貫通孔内で内接することにより貫通孔内のリードフレーム端子を安定した状態で保持することができる。これにより、本発明によれば、貫通孔内のリードフレームの端子を安定して保持することができることから、貫通孔に挿入されたリードフレームの傾斜をわざわざ修正して電子部品を固定する必要が無く、円滑に電子部品を電子部品搭載基板に固定することができる。更に、本発明によれば、プレスにより面取りを行なうことから材料を無駄にすることなく製造することができる。   According to the present invention, chamfer shaping is performed by pressing on a lead frame terminal having a diagonal cross-sectional dimension larger than the inner diameter dimension of the through hole, and the facing dimension of the chamfered portion is determined according to the inner diameter dimension of the through hole. By forming the chamfered portion, the gap between the terminal inserted into the through hole and the through hole can be reduced, and the rolled portion rolled by the extrusion pressure is inscribed in the through hole, so The lead frame terminal can be held in a stable state. Thus, according to the present invention, since the terminal of the lead frame in the through hole can be stably held, it is necessary to fix the inclination of the lead frame inserted into the through hole and fix the electronic component. And the electronic component can be smoothly fixed to the electronic component mounting substrate. Furthermore, according to the present invention, since chamfering is performed by pressing, the material can be manufactured without wasting it.

以下、図面を用いて、本発明のリードフレームを備えた電子部品および当該部品の製造方法の実施形態を詳細に説明するが、以下の説明では、各実施の形態に用いる図面について同一の構成要素は同一の符号を付し、かつ重複する説明は可能な限り省略する。   DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electronic component having a lead frame and a method for manufacturing the component according to the present invention will be described in detail below with reference to the drawings. In the following description, the same components are used for the drawings used in each embodiment. Are denoted by the same reference numerals, and redundant description will be omitted as much as possible.

尚、実施例では半導体素子を樹脂で封止した電子部品を例に説明を行なう。   In the embodiment, an electronic component in which a semiconductor element is sealed with resin will be described as an example.

本発明の電子部品１０はリードフレーム１を備えており、当該リードフレーム１は複数の端子２を有しており、当該端子２の断面形状は図１に示すようにプレスによって面取り形成された面取り部４を有している。この面取り部４の特徴を説明するに先立ち、電子部品の概要を図２を用いて説明する。   The electronic component 10 of the present invention includes a lead frame 1, the lead frame 1 has a plurality of terminals 2, and the cross-sectional shape of the terminals 2 is chamfered by pressing as shown in FIG. 1. Part 4. Prior to describing the features of the chamfered portion 4, an outline of the electronic component will be described with reference to FIG.

電子部品は、図２の概要図に示すように、リードフレーム１の端子２の一方端が樹脂３で封止されている。樹脂３内には、図示しない半導体装素子が組み込まれており、樹脂３内において半導体素子および端子２の一方端が電気的に接続され、電気回路が構成される。   In the electronic component, as shown in the schematic diagram of FIG. 2, one end of the terminal 2 of the lead frame 1 is sealed with a resin 3. A semiconductor device (not shown) is incorporated in the resin 3, and one end of the semiconductor element and the terminal 2 is electrically connected in the resin 3 to form an electric circuit.

前記した電子部品を電子部品搭載基板に搭載するとき、リードフレーム１の各端子２を電子部品搭載基板に設けられた貫通孔にそれぞれ挿入し、供給される半田の溶着により電子部品が電子部品搭載基板に固定される。   When mounting the above-described electronic component on the electronic component mounting board, each terminal 2 of the lead frame 1 is inserted into a through hole provided in the electronic component mounting board, and the electronic component is mounted by welding the supplied solder. Fixed to the substrate.

ここで、本発明の電子部品１０の特徴的な構成を図１を用いて説明する。
本発明の電子部品１０は、リードフレーム１の断面形状において、図１に示すように、対向する位置に面取り部４を備えている。面取り部４には、後述する複数の圧延部５を有しており、当該圧延部５は所定の間隔を有して配置されている。尚、本発明の電子部品１０は、図１に示すようにリードフレーム１の細部に特徴があるため、電子部品の概要を説明するために用いた図２の概要図には本発明の特徴が省略されている。 Here, a characteristic configuration of the electronic component 10 of the present invention will be described with reference to FIG.
As shown in FIG. 1, the electronic component 10 of the present invention includes a chamfered portion 4 at a position facing the cross-sectional shape of the lead frame 1. The chamfered portion 4 has a plurality of rolling portions 5 to be described later, and the rolled portions 5 are arranged with a predetermined interval. Since the electronic component 10 of the present invention is characterized by the details of the lead frame 1 as shown in FIG. 1, the outline diagram of FIG. 2 used for explaining the outline of the electronic component has the feature of the present invention. It is omitted.

ここで、リードフレームについて説明する。
本実施例のリードフレーム１はスタンピングリードフレームであり、銅などの導電性の平板に対し、プレスによる打ち抜き加工を行なうことで形成される。打ち抜き加工には、所定形状で打ち抜くための打ち抜き金型が用いられており、当該金型を用いて前記平板を打ち抜くことで、同一形状のリードフレームを効率的に製造することができる。 Here, the lead frame will be described.
The lead frame 1 of this embodiment is a stamping lead frame, and is formed by punching a conductive flat plate such as copper with a press. For the punching process, a punching die for punching in a predetermined shape is used, and a lead frame having the same shape can be efficiently manufactured by punching the flat plate using the die.

尚、形成されるリードフレームの端子の断面は、平板の厚さ寸法と打ち抜き加工によるせん断位置とで決まる矩形形状を有しており、打ち抜き後のリードフレームは、矩形断面形状において対向する角の寸法（対角線寸法）が電子部品搭載基板の貫通孔の内径寸法よりも大きくなるように形成されている。これは後述する面取りプレスにより、打ち抜き後のリードフレームに面取り整形が行なわれることを見越しているためである。   In addition, the cross section of the terminal of the lead frame to be formed has a rectangular shape determined by the thickness dimension of the flat plate and the shearing position by punching, and the lead frame after punching has a corner having an opposite corner in the rectangular cross sectional shape. The dimension (diagonal line dimension) is formed to be larger than the inner diameter dimension of the through hole of the electronic component mounting substrate. This is because it is anticipated that chamfering will be performed on the lead frame after punching by a chamfering press described later.

ここで、本発明の特徴である面取りプレスを詳細に説明する。
本発明の面取りプレスは、打ち抜き後のリードフレームに対し面取り整形するためであり、当該面取りプレスにより、図１に示すように、リードフレーム１の端子２は、貫通孔の内径寸法に応じて、台形状の面取り部４が形成される。本発明の電子部品の製造方法は、打ち抜き後のリードフレーム１の端子の角をプレスにより面取りすることから、切削による面取りのように削り取りがなく、材料を有効的に活用することができる。 Here, the chamfering press which is a feature of the present invention will be described in detail.
The chamfering press of the present invention is for chamfering and shaping the lead frame after punching, and the chamfering press allows the terminal 2 of the lead frame 1 to have an inner diameter dimension of the through hole as shown in FIG. A trapezoidal chamfered portion 4 is formed. In the method of manufacturing an electronic component according to the present invention, the corners of the terminals of the lead frame 1 after punching are chamfered by pressing, so that the material can be effectively used without chamfering like chamfering by cutting.

更に詳細に本発明の面取りプレスを説明すると、本発明の面取りプレスは面取りプレス用の金型を用いており、当該金型を用いて打ち抜き後のリードフレーム１の矩形断面形状における各角を押圧する（図３参照）。これにより、押圧された各角に面取り部４が形成される。このとき押圧された角は圧力が逃げ易い方向に向かって圧延しており、圧延した部位（台形状の面取り部４の上底の両端）に圧延部５が形成される。   The chamfering press of the present invention will be described in more detail. The chamfering press of the present invention uses a mold for chamfering press, and presses each corner in the rectangular cross-sectional shape of the lead frame 1 after punching using the mold. (See FIG. 3). Thereby, the chamfered part 4 is formed in each pressed corner. The corners pressed at this time are rolled in a direction in which the pressure easily escapes, and the rolled portion 5 is formed at the rolled portion (both ends of the upper bottom of the trapezoidal chamfered portion 4).

面取りプレスにより形成される圧延部５は、図１に示すように、面取り部４の両端で突出しており、該圧延部５によりリードフレーム１は貫通孔に内接し易くなる。また、面取りプレスの押圧量を制御して圧延部５の突出量を適宜調整し、各圧延部５を貫通孔に内接させることにより、内接する圧延部５により均一的にリードフレーム１が支持されることから、リードフレーム１が貫通孔内で傾斜することなく、自立することができる。   As shown in FIG. 1, the rolled part 5 formed by the chamfering press protrudes at both ends of the chamfered part 4, and the lead frame 1 is easily inscribed in the through hole by the rolled part 5. Also, the lead frame 1 is uniformly supported by the inscribed rolling part 5 by controlling the pressing amount of the chamfering press to appropriately adjust the protruding amount of the rolling part 5 and inscribing each rolling part 5 to the through hole. Therefore, the lead frame 1 can stand on its own without tilting in the through hole.

前記したように、本発明は、貫通孔の内径寸法よりも対角線寸法が大きなリードフレーム１の端子に面取りプレスを施すことにより、貫通孔の内径寸法に応じた面取り部４を形成し、当該面取り部４の両端で突出し、貫通孔の内径に応じて圧延された圧延部５を形成する。これにより、本発明は、リードフレーム１の端子を切削することなく、材料を無駄にすることなく有効的に活用することができ、かつ面取り部４の両端で突出する圧延部５が貫通孔に内接することにより、均一的にリードフレーム１を支持することができ、リードフレーム１の傾斜を修正する必要がなく、効率的に電子部品を電子部品搭載基板に固定することができる。   As described above, the present invention forms a chamfered portion 4 corresponding to the inner diameter dimension of the through hole by chamfering the terminals of the lead frame 1 having a diagonal dimension larger than the inner diameter dimension of the through hole. Projecting at both ends of the portion 4, a rolled portion 5 is formed that is rolled according to the inner diameter of the through hole. As a result, the present invention can effectively utilize the material without wasting the terminals of the lead frame 1 without cutting the terminals, and the rolling portions 5 protruding at both ends of the chamfered portion 4 are formed in the through holes. By inscribed, the lead frame 1 can be supported uniformly, and it is not necessary to correct the inclination of the lead frame 1, and the electronic component can be efficiently fixed to the electronic component mounting substrate.

前記した実施例では、半導体素子を樹脂封止した電子部品を例に説明したが、これに限る必要はなく、リードフレームを備えた電子部品であればよく、コンデンサや抵抗などの各種電子部品に本発明を適用することができる。   In the above-described embodiment, the electronic component in which the semiconductor element is resin-sealed has been described as an example. However, the present invention is not limited to this, and any electronic component including a lead frame may be used. The present invention can be applied.

前記した実施例では、本発明の電子部品１０は、４つの面取り部４を備えた例で説明を行なったが、これに限るに必要はなく抜き打ちプレス後のリードフレームの断面形状に応じて、その数を適宜変更してもよい。   In the above-described embodiment, the electronic component 10 of the present invention has been described with an example having four chamfered portions 4, but the present invention is not limited to this, and according to the cross-sectional shape of the lead frame after punching press, You may change the number suitably.

本発明の電子部品の特徴を示す断面図である。It is sectional drawing which shows the characteristic of the electronic component of this invention. リードフレームの概念構成を示す図である。It is a figure which shows the conceptual structure of a lead frame. 面取りプレスの施工を示す図である。It is a figure which shows construction of a chamfering press.

符号の説明Explanation of symbols

１ リードフレーム
２ 端子
３ 樹脂
４ 面取り部
５ 圧延部
１０ 電子部品 1 Lead frame 2 Terminal 3 Resin 4 Chamfered part 5 Rolled part 10 Electronic component

Claims (2)

電子部品搭載基板に設けた貫通孔に、挿入して固定するための矩形断面形状の端子を有するリードフレームを備えた電子部品において、
前記貫通孔の内径寸法より矩形断面形状の対角線寸法が大きなリードフレーム端子に対してプレスによる面取り整形が行なわれ、対向寸法が前記貫通孔の内径寸法に対応する面取り部を備えており、
前記面取り部は、前記プレスによる押出圧力により前記貫通孔の内径に応じて圧延された圧延部を有していることを特徴とする電子部品。 In an electronic component including a lead frame having a terminal having a rectangular cross section for insertion and fixing into a through hole provided in the electronic component mounting substrate,
Chamfering is performed by pressing on a lead frame terminal having a diagonal dimension larger than the inner diameter dimension of the through hole, and a facing dimension is provided with a chamfered portion corresponding to the inner diameter dimension of the through hole.
The electronic part according to claim 1, wherein the chamfered portion includes a rolled portion that is rolled according to an inner diameter of the through hole by an extrusion pressure by the press. 電子部品搭載基板に設けた貫通孔に、挿入して固定するための矩形断面形状の端子を有するリードフレームを備えた電子部品の製造方法において、
前記貫通孔の内径寸法より矩形断面形状の対角線寸法が大きなリードフレーム端子に対してプレスによる面取り整形を行い、当該整形による面取り部の対向寸法を前記貫通孔の内径寸法に応じて形成するとともに、前記面取り部において前記プレスによる押出圧力により前記貫通孔の内径に応じて圧延された圧延部を形成することを特徴とする電子部品の製造方法。 In a method for manufacturing an electronic component including a lead frame having a terminal having a rectangular cross-sectional shape for insertion and fixing into a through hole provided in the electronic component mounting substrate,
Chamfer shaping is performed by pressing on a lead frame terminal having a larger diagonal dimension than the inner diameter dimension of the through hole, and the opposite dimension of the chamfered portion is formed according to the inner diameter dimension of the through hole. A method of manufacturing an electronic component, comprising forming a rolled portion that is rolled in accordance with an inner diameter of the through-hole in the chamfered portion by an extrusion pressure by the press.
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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2019244482A1 (en) * 2018-06-19 2019-12-26 富士電機株式会社 Semiconductor device manufacturing method and semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
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JPS5839046A (en) * 1981-08-31 1983-03-07 Rohm Co Ltd Electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839046A (en) * 1981-08-31 1983-03-07 Rohm Co Ltd Electronic part

Cited By (5)

* Cited by examiner, † Cited by third party
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WO2019244482A1 (en) * 2018-06-19 2019-12-26 富士電機株式会社 Semiconductor device manufacturing method and semiconductor device
JPWO2019244482A1 (en) * 2018-06-19 2021-01-07 富士電機株式会社 Manufacturing method of semiconductor devices and semiconductor devices
EP3703122A4 (en) * 2018-06-19 2021-01-13 Fuji Electric Co., Ltd. Semiconductor device manufacturing method and semiconductor device
US11295997B2 (en) 2018-06-19 2022-04-05 Fuji Electric Co., Ltd. Semiconductor device manufacturing method and semiconductor device
JP7099524B2 (en) 2018-06-19 2022-07-12 富士電機株式会社 Manufacturing method of semiconductor device and semiconductor device

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