JP2007278852A - Device and method for inspecting substrate - Google Patents

Device and method for inspecting substrate Download PDF

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JP2007278852A
JP2007278852A JP2006105802A JP2006105802A JP2007278852A JP 2007278852 A JP2007278852 A JP 2007278852A JP 2006105802 A JP2006105802 A JP 2006105802A JP 2006105802 A JP2006105802 A JP 2006105802A JP 2007278852 A JP2007278852 A JP 2007278852A
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measurement
connector
board
substrate
inspection apparatus
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Soichi Otomaru
壮一 乙丸
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Seiko Epson Corp
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Seiko Epson Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method for inspecting a substrate capable of determining immediately the quality of solder connection between a terminal part of a connector and a wiring part of the substrate without the aid of visual confirmation. <P>SOLUTION: The substrate inspection device 1 includes the terminal part 14a of the connector 14 for external connection provided on the substrate; a measuring pin 19 for confirming the solder connection state to the wiring part 11a provided on the substrate 11, to be brought into contact with the wiring part of the substrate 11 in the separable state; a measuring connector part 17 to be inserted into the connector; a measuring part 2 connected to the other end side of each cable corresponding to the measuring pin and the measuring connector part, for measuring the conduction state; and a measurement result reporting part 10 for reporting the measurement results. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、基板検査装置及び該装置を用いた基板検査方法に関し、特に基板に搭載されるコネクタの端子部と基板に設けられる配線部との半田接続の良否判定を行うための基板検査装置及び該装置を用いた基板検査方法に関するものである。   The present invention relates to a board inspection apparatus and a board inspection method using the apparatus, and more particularly to a board inspection apparatus for determining whether solder connection between a terminal portion of a connector mounted on a substrate and a wiring portion provided on the substrate is good or bad. The present invention relates to a substrate inspection method using the apparatus.

基板の導通状態の良否判定のための手段として、従来では下記特許文献１および２に示す抵抗測定装置、基板検査装置及び基板測定検査方法がある。これら文献はいずれも、基板に形成されたランドのそれぞれに当接するプローブ間に第１、第２の測定用電流を流し、それぞれの各電流に基づく電圧値によりランド間の抵抗値を演算し、この値と基準抵抗値とを比較し、良否判定を行うものである。   Conventionally, there are a resistance measurement device, a substrate inspection device, and a substrate measurement / inspection method disclosed in Patent Documents 1 and 2 below as means for determining whether the conductive state of the substrate is good or bad. In any of these documents, first and second measurement currents are passed between probes that abut each of the lands formed on the substrate, and a resistance value between the lands is calculated based on voltage values based on the respective currents. This value is compared with a reference resistance value to determine pass / fail.

特開２００４−１０１２７５号公報JP 2004-101275 A 特開２００４−２７９２７０号公報JP 2004-279270 A

上記従来の基板検査装置では、いずれも測定ポイントは、基板上に形成されたランド（導電パターン）間のみであり、基板上に実装された外部接続用のコネクタの端子部と、基板に設けた配線部との接続箇所における半田接続の良否の判定は、専ら目視確認のみに頼っており、この場合には、端子間のブリッジは確認可能であるものの、未半田状態を確認することは難しいため、実装最終工程での総合検査により始めて半田不良箇所があると判断される場合が多かった。また、部品実装後の検査であるため、接合不良があった場合には、その修復作業は極めて面倒であった。   In any of the above conventional board inspection apparatuses, the measurement points are only between lands (conductive patterns) formed on the board, and are provided on the terminal part of the connector for external connection mounted on the board and the board. Judgment of the quality of the solder connection at the connection point with the wiring part depends solely on visual confirmation. In this case, although the bridge between the terminals can be confirmed, it is difficult to confirm the unsoldered state. In many cases, it is determined that there is a defective solder portion only after comprehensive inspection in the final mounting process. In addition, since the inspection is performed after component mounting, if there is a bonding failure, the repair work is extremely troublesome.

本発明は、上記の課題を解決するものであり、その目的は、目視確認によらず、コネクタの端子部と基板の配線部との半田接続の良否を直ちに判定できるようにした基板検査装置及び基板検査方法を提供するものである。   The present invention solves the above-mentioned problems, and the object thereof is a board inspection apparatus capable of immediately determining whether solder connection between a terminal part of a connector and a wiring part of a board is good or not without visual confirmation. A substrate inspection method is provided.

前記目的を達成するため、本発明の第１の態様に係る基板検査装置は、基板上に設けられた外部接続用のコネクタの端子部と、基板上に設けた配線部との半田状態を確認するための基板検査装置であって、前記基板の配線部に接離可能に形成された測定ピンと、前記コネクタに差込まれて前記コネクタの端子部に導通する測定用コネクタ部と、前記測定ピン及び前記測定用コネクタ部に対応する各ケーブルの他端側に接続されて、その導通状態を測定する測定部と、測定結果を知らせる測定結果報知部と、を備えたことを特徴とするものである。
本発明の第１の態様によれば、測定部の測定結果に基づいてコネクタの端子部と基板の配線部との半田状態を確認できる。 In order to achieve the object, the board inspection apparatus according to the first aspect of the present invention confirms the solder state between the terminal part of the connector for external connection provided on the board and the wiring part provided on the board. A board inspection device for measuring, wherein a measurement pin formed so as to be able to contact and separate from the wiring part of the board, a measurement connector part inserted into the connector and conducted to a terminal part of the connector, and the measurement pin And a measurement unit that is connected to the other end of each cable corresponding to the measurement connector unit and measures the conduction state thereof, and a measurement result notification unit that informs the measurement result. is there.
According to the first aspect of the present invention, the solder state between the terminal portion of the connector and the wiring portion of the substrate can be confirmed based on the measurement result of the measurement portion.

本発明の第２の態様に係る基板検査装置は、前記第１の態様において、前記測定結果報知部は、前記測定部の測定結果と基準値を比較し、比較結果に基づき前記端子部と前記配線部との半田接続位置における半田接続の良否を判定する判定手段を備えていることを特徴とするものである。   In the substrate inspection apparatus according to a second aspect of the present invention, in the first aspect, the measurement result notification unit compares the measurement result of the measurement unit with a reference value, and the terminal unit and the It is characterized by comprising a judging means for judging the quality of the solder connection at the solder connection position with the wiring part.

本発明の第２の態様によれば、前記第１の態様の作用効果に加え、前記測定部の測定結果と基準値を比較して判定するので、ボーダーラインを含む半田接続の良否判定を自動的に行うことができる。   According to the second aspect of the present invention, in addition to the function and effect of the first aspect, since the determination is made by comparing the measurement result of the measurement unit with the reference value, the quality determination of the solder connection including the border line is automatically performed. Can be done automatically.

本発明の第３の態様に係る基板検査装置は、前記第１の態様または第２の態様において、前記基板には、前記コネクタの端子部に接続される配線部から分岐されて前記基板の表面の前記測定ピンと対向する位置に一括配列された検査用のチェックパッドを備えていることを特徴とするものである。   The substrate inspection apparatus according to a third aspect of the present invention is the substrate inspection apparatus according to the first aspect or the second aspect, wherein the substrate is branched from a wiring portion connected to a terminal portion of the connector. And a check pad for inspection arranged in a lump at a position facing the measurement pin.

本発明の第３の態様によれば、前記第１の態様または第２の態様の作用効果に加え、一括配列された検査用のチェックパッドに対応して測定ピンを配列すればよいため、基板の配線パターンに左右されることなく、測定ピンの接続位置や配列が一定であり、さらに測定のための構成が簡単となる。   According to the third aspect of the present invention, in addition to the effects of the first aspect or the second aspect, the measurement pins may be arranged corresponding to the check pads for inspection arranged in a lump. The connection position and arrangement of the measurement pins are constant regardless of the wiring pattern, and the configuration for measurement is further simplified.

本発明の第４の態様に係る基板検査装置は、前記第１の態様乃至第３の態様のいずれかにおいて、前記基板を位置決め設置する設置台と、前記測定ピンを下面に突出するとともに、設置台の上部に昇降可能に配置され、下降位置で前記配線部に前記測定ピンを接触させる昇降プレートと、を備えていることを特徴とするものである。   A substrate inspection apparatus according to a fourth aspect of the present invention is the substrate inspection apparatus according to any one of the first to third aspects, wherein the substrate is positioned and installed, and the measurement pin protrudes from the lower surface and is installed. And an elevating plate which is disposed on the upper part of the table so as to be movable up and down and brings the measurement pin into contact with the wiring part at the lowered position.

本発明の第４の態様によれば、前記第１の態様乃至第３の態様のいずれかの作用効果に加え、基板検査装置の構造を簡単にして上記測定を行って各接続部における半田接続の良否を判定することが可能となる。   According to the fourth aspect of the present invention, in addition to the effect of any one of the first to third aspects, the structure of the substrate inspection apparatus is simplified and the above measurement is performed to perform solder connection at each connection portion. Can be determined.

本発明の第５の態様に係る基板検査方法は、設置台上に基板を位置決め設置し、基板上に設けられているコネクタに測定用コネクタ部を差込んで前記コネクタの端子部に導通し、次いで昇降プレートを下降させて測定ピンを基板の配線部に接触させた後に、前記測定ピン及び前記測定用コネクタ部に対応する各ケーブルの他端側に接続されている測定部によって導通状態を順次測定することで、前記端子部と前記配線部との半田接続の良否を判定することを特徴とするものである。   In the substrate inspection method according to the fifth aspect of the present invention, the substrate is positioned and installed on the installation table, and the measurement connector portion is inserted into the connector provided on the substrate to conduct to the terminal portion of the connector, Next, after the elevating plate is lowered and the measurement pin is brought into contact with the wiring portion of the substrate, the conduction state is sequentially changed by the measurement portion connected to the other end side of each cable corresponding to the measurement pin and the measurement connector portion. By measuring, the quality of the solder connection between the terminal portion and the wiring portion is determined.

本発明の第５の態様によれば、測定部の測定結果に基づいてコネクタの端子部と基板の配線部との半田状態を確認できる。そして、コネクタの端子部の基板配線部に対する半田接続位置毎に個別にその半田接続の良否が判定でき、半田不良個所も特定できるため、後の改修作業も容易となる。   According to the fifth aspect of the present invention, the solder state between the terminal portion of the connector and the wiring portion of the substrate can be confirmed based on the measurement result of the measurement portion. And since the quality of the solder connection can be individually determined for each solder connection position of the terminal portion of the connector with respect to the board wiring portion, and the location of defective solder can be specified, the subsequent repair work is facilitated.

本発明の第６の態様に係る基板検査方法は、前記第６の態様において、前記半田接続の良否を判定するための判定手段は半田接続部の電気抵抗値を測るものであり、該抵抗値が基準値を上回った状態を半田不良と判定するものであることを特徴とするものである。   The substrate inspection method according to a sixth aspect of the present invention is the substrate inspection method according to the sixth aspect, wherein the determination means for determining whether the solder connection is good or not measures an electrical resistance value of the solder connection portion. In this case, a state in which the value exceeds the reference value is determined as a solder failure.

本発明の第６の態様によれば、前記第５の態様の作用効果に加え、前記端子部と前記配線部の半田接続の良否は抵抗値の大小（抵抗値が大であることは、半田不良であり、抵抗値が小であることは半田が良好に行われている）に代替できるため、判定が確実である。   According to the sixth aspect of the present invention, in addition to the function and effect of the fifth aspect, the solder connection between the terminal portion and the wiring portion is good or bad in the resistance value (the resistance value is large Since it is possible to substitute for the fact that it is defective and the resistance value is small, soldering is performed well), the determination is reliable.

以下、本発明に係る基板検査装置の実施の形態につき、図面を参照して以下詳細に説明する。図１は本発明に係る基板検査装置の斜視図、図２は同検査装置を半ばブロック図的に示す説明図、図３は同検査装置を用いた検査手順を示すフローチャートである。   Hereinafter, embodiments of a substrate inspection apparatus according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of a substrate inspection apparatus according to the present invention, FIG. 2 is an explanatory diagram showing the inspection apparatus in a half block diagram, and FIG. 3 is a flowchart showing an inspection procedure using the inspection apparatus.

図１、図２において、本実施例の基板検査装置１は、ＣＰＵ、電源回路、複数の入出力ポートを内蔵する測定部２と、測定部２を収容した扁平四角形状のマウントベース３と、マウントベース３上に配置された基板設置台４と、マウントベース３の背面に立設された縦ガイド５と、縦ガイド５の上端にオーバハング状に配置されて前記設置台４に対面させた上部固定ブロック６と、固定ブロック６の下部において、固定ブロック６を縦通した４本のガイドポスト７により昇降可能にガイドされ、前記設置台４に対して接離可能な昇降プレート８及び図示しない昇降機構を備えている。   1 and 2, a substrate inspection apparatus 1 according to the present embodiment includes a CPU, a power supply circuit, a measurement unit 2 incorporating a plurality of input / output ports, a flat rectangular mount base 3 containing the measurement unit 2, A substrate mounting table 4 disposed on the mount base 3, a vertical guide 5 erected on the back surface of the mount base 3, and an upper portion disposed in an overhang shape on the upper end of the vertical guide 5 and facing the mounting table 4 A fixed block 6, and a lift plate 8 that is guided by four guide posts 7 vertically passing through the fixed block 6 at the lower part of the fixed block 6 and that can be brought into and out of contact with the installation table 4 and a lift (not shown) It has a mechanism.

前記マウントベース３の前部側には電源ボタン、及び測定スタートボタンなどの前記測定部２に接続された操作部９を構成する各種操作ボタン９ａ並びに前記測定部２に接続された表示部１０を構成する窓部１０ａが形成されている。前記設置台４上には被測定物となる基板１１が複数の位置決めピン１２を介して位置決め設置される。   On the front side of the mount base 3, various operation buttons 9a constituting the operation unit 9 connected to the measurement unit 2, such as a power button and a measurement start button, and a display unit 10 connected to the measurement unit 2 are provided. The window part 10a to comprise is formed. A substrate 11 to be measured is positioned and installed on the installation table 4 via a plurality of positioning pins 12.

基板１１の前部中央には、その接続端側に開口した雌コネクタ１４が設けられている。そして、この雌コネクタ１４の後部側に突出する複数の端子部である端子ピン１４ａが基板１１側に設けた複数の配線部１１ａと半田接続される。図２において、符号１５は半田接続位置を示している。なお配線部１１ａは、基板１１上に搭載される図示しない各素子に接続しているとともに、本実施例ではその一部が分岐されて、基板１１の一側部に一列に配列された検査用のチェックパッド１６に接続されている。図２では、端子ピン１２ａが合計６ピンある場合を例示しており、従ってチェックパッド１６は一列に６つ配置されている。   In the center of the front portion of the substrate 11, a female connector 14 opened on the connection end side is provided. And the terminal pin 14a which is a some terminal part which protrudes in the rear part side of this female connector 14 is solder-connected with the some wiring part 11a provided in the board | substrate 11 side. In FIG. 2, reference numeral 15 denotes a solder connection position. Note that the wiring portion 11a is connected to each element (not shown) mounted on the substrate 11, and in this embodiment, a part of the wiring portion 11a is branched and is arranged in a row on one side of the substrate 11. Connected to the check pad 16. FIG. 2 exemplifies a case where there are a total of 6 terminal pins 12a. Accordingly, six check pads 16 are arranged in a row.

前記雌コネクタ１４の差込位置には雄コネクタ１７が差込まれる。雄コネクタ１７は、前記端子ピンと１４ａと同一配列の導通部１７ａを備えている。この雄コネクタ１７は、フラットケーブル１８及び前記マウントベース３の後部に設けた図示しない接続用スロットを介して前記測定部２の一方の入力ポートに接続されている。   A male connector 17 is inserted into the insertion position of the female connector 14. The male connector 17 includes a conducting portion 17a in the same arrangement as the terminal pins and 14a. The male connector 17 is connected to one input port of the measurement unit 2 via a flat cable 18 and a connection slot (not shown) provided at the rear portion of the mount base 3.

また、前記チェックパッド１６の形成位置に対応して昇降プレート８の一側部下端には６つの測定ピン１９が突設されている。各測定ピン１９はフラットケーブル２０及びマウントベース３の後部に設けた図示しない接続用スロットを介して前記測定部２の他方の入力ポートに接続されている。   Corresponding to the position where the check pad 16 is formed, six measuring pins 19 protrude from the lower end of one side of the elevating plate 8. Each measurement pin 19 is connected to the other input port of the measurement unit 2 through a flat cable 20 and a connection slot (not shown) provided at the rear of the mount base 3.

なお、図２において、符号２１はプレート８と測定ピン１９間に介在された圧縮コイルバネである。該圧縮コイルバネ２１は、昇降プレート９を下降させて測定ピン１９をチェックパッド１６に接触させた際にバネ２１のたわみにより接触圧力を均一とすることで、各測定ピン１９の対応するチェックパッド１６への接触圧力差に伴う測定誤差を吸収するものである。   In FIG. 2, reference numeral 21 denotes a compression coil spring interposed between the plate 8 and the measurement pin 19. The compression coil spring 21 makes the contact pressure uniform by the deflection of the spring 21 when the elevating plate 9 is lowered to bring the measurement pin 19 into contact with the check pad 16, so that the corresponding check pad 16 of each measurement pin 19. It absorbs the measurement error due to the contact pressure difference.

次に、以上の検査装置１を用いて基板１１における半田接続の良否判定手順を図３を用いて説明する。まず、最初に基板１１を設置台４上に位置決め設置し、雄コネクタ１７を雌コネクタ１４に差込んで両者を接続した上で、昇降機構を駆動して昇降プレート８を下降させ、各測定ピン１９をチェックパッド１６に接触させる（ステップＳＴ１〜ＳＴ３）。   Next, a procedure for determining the quality of solder connection on the substrate 11 using the above-described inspection apparatus 1 will be described with reference to FIG. First, the board 11 is first positioned and installed on the installation table 4, the male connector 17 is inserted into the female connector 14, the two are connected, and then the elevating mechanism is driven to lower the elevating plate 8, and each measurement pin 19 is brought into contact with the check pad 16 (steps ST1 to ST3).

接触確認後は、スタートボタンを押すことにより（ステップＳＴ４、ＳＴ５）、測定部２ではピン番号１（図２には対応する番号を数値で記載している）から順に測定動作（ステップＳＴ６）を行う。この測定動作は、一例として、電気抵抗値検出によって行われる。この抵抗値検出の手順としては、測定部２に接続された測定用電源部から第１、第２レベルの測定用電流を流し、これによって得られる第１、第２の電圧測定値の差分を第１、第２レベルの電流値間の差分で除した値を抵抗値として算出し、この算出された抵抗値と基準抵抗値とを比較し（ステップＳＴ６）、この値が基準値より大きい場合を半田不良と判定する（ステップＳＴ７）。そして、半田不良の場合には、その判定結果を表示部１０に表示するとともに、ピン番号とともに一時記憶する（ステップＳＴ７、ＳＴ８）。   After confirming the contact, by pressing the start button (steps ST4 and ST5), the measuring unit 2 performs the measurement operation (step ST6) in order from the pin number 1 (the corresponding numbers are shown numerically in FIG. 2). Do. As an example, this measurement operation is performed by detecting an electric resistance value. As a procedure for detecting the resistance value, first and second level measurement currents are supplied from the measurement power supply unit connected to the measurement unit 2, and the difference between the first and second voltage measurement values obtained thereby is calculated. A value obtained by dividing the difference between the current values of the first and second levels is calculated as a resistance value, the calculated resistance value is compared with a reference resistance value (step ST6), and this value is larger than the reference value Is determined as a solder defect (step ST7). If the solder is defective, the determination result is displayed on the display unit 10 and temporarily stored together with the pin number (steps ST7 and ST8).

これに対し、ステップＳＴ６でＮｏ、すなわち基準値よりも小さい場合には、半田は良好に行われたと判断され、次のピン番号の測定を同様に行う（ステップＳＴ１０）。図１、図２に示したごとく、６つの端子ピン１４ａを備えている場合には、測定開始後に同一測定動作が６回繰返されることになる。   On the other hand, if No in step ST6, that is, if it is smaller than the reference value, it is determined that the soldering has been performed satisfactorily, and the next pin number is similarly measured (step ST10). As shown in FIGS. 1 and 2, when the six terminal pins 14a are provided, the same measurement operation is repeated six times after the measurement is started.

このようにして全数の測定が終了すると（ステップＳＴ９でＹｅｓ）、半田不良に対応するエラーの有無を判定し、エラーがあった場合には、ステップＳＴ８で一時記憶されたそのピン番号を呼込み、これをラベル印刷し（ステップＳＴ１２，１３）、その後データをクリア（ステップＳＴ1４）してから作業を終了する。またエラーがなかった場合には、そのままデータをクリア（ステップＳＴ1４）してから作業を終了する。   When all the measurements are completed in this way (Yes in step ST9), it is determined whether or not there is an error corresponding to the solder failure. If there is an error, the pin number temporarily stored in step ST8 is called in, This is printed with a label (steps ST12 and ST13), after which the data is cleared (step ST14) and the operation is terminated. If there is no error, the data is cleared as it is (step ST14), and the operation is finished.

印刷作業は測定部２のプリントポートに接続した図示しないラベル印刷プリンタ等で行い、印刷後は、ラベルを剥がして、前記雌コネクタ１４上に貼付ければ、改修時において、どの位置の半田が接続不良であるのかが一目瞭然であるため、改修作業も簡単となる。   Printing is performed by a label printer or the like (not shown) connected to the print port of the measuring unit 2, and after printing, if the label is peeled off and stuck on the female connector 14, the solder at which position is connected at the time of repair Since it is obvious at a glance whether it is defective or not, the repair work is also easy.

なお、以上の実施形態では、説明の簡略化のために６つの端子部を備えたコネクタについて説明したが、さらに多くの端子部を備えたコネクタの半田接続の良否判定も同様にして行うことができる。   In the above embodiment, the connector having six terminal portions has been described for the sake of simplification of description. However, the quality determination of the solder connection of the connector having more terminal portions can be similarly performed. it can.

また、基板上に設置されたコネクタが例えばメモリーカードスロットなどであれば、これにはめ込まれる雄コネクタとしてメモリーカード構造を用いることができることは勿論である。   Of course, if the connector installed on the substrate is, for example, a memory card slot or the like, the memory card structure can be used as a male connector to be inserted into this.

本発明に係る基板検査装置の斜視図。The perspective view of the board | substrate inspection apparatus which concerns on this invention. 同検査装置を半ばブロック図的に示す説明図。Explanatory drawing which shows the inspection apparatus in a half block diagram. 同検査装置を用いた検査手順を示すフローチャート。The flowchart which shows the test | inspection procedure using the same test | inspection apparatus.

符号の説明Explanation of symbols

１ 基板検査装置、２ 測定部、３ マウントベース、４ 設置台、５ 縦ガイド、６ 上部支持ブロック、７ ガイドポスト、８ 昇降プレート、９ 操作部、９ａ 押しボタン、１０ 表示部、１０ａ 表示窓、１１ 基板、 １１ａ 配線部、１２ 位置決めピン、１４ コネクタ（雌コネクタ） １４ａ 端子ピン、１５ 半田、１６ チェックパッド、 １７ コネクタ（雄コネクタ）、１７ａ 導電部、１８、２０ フラットケーブル、 １９ 測定ピン、２１ バネ   DESCRIPTION OF SYMBOLS 1 Board inspection apparatus, 2 Measurement part, 3 Mount base, 4 Installation stand, 5 Vertical guide, 6 Upper support block, 7 Guide post, 8 Lifting plate, 9 Operation part, 9a Push button, 10 Display part, 10a Display window, DESCRIPTION OF SYMBOLS 11 Board | substrate, 11a Wiring part, 12 Positioning pin, 14 Connector (female connector) 14a Terminal pin, 15 Solder, 16 Check pad, 17 Connector (male connector), 17a Conductive part, 18, 20 Flat cable, 19 Measuring pin, 21 Spring

Claims (6)

基板上に設けられた外部接続用のコネクタの端子部と、基板上に設けた配線部との半田状態を確認するための基板検査装置であって、
前記基板の配線部に接離可能に形成された測定ピンと、
前記コネクタに差込まれて前記コネクタの端子部に導通する測定用コネクタ部と、
前記測定ピン及び前記測定用コネクタ部に対応する各ケーブルの他端側に接続されて、その導通状態を測定する測定部と、
測定結果を知らせる測定結果報知部と、を備えたことを特徴とする基板検査装置。 A board inspection apparatus for confirming a solder state between a terminal part of an external connection connector provided on a board and a wiring part provided on the board,
A measuring pin formed so as to be able to contact and separate from the wiring part of the substrate;
A connector part for measurement inserted into the connector and conducted to the terminal part of the connector;
Connected to the other end side of each cable corresponding to the measurement pin and the connector part for measurement, a measurement part for measuring the conduction state;
A board inspection apparatus comprising: a measurement result notifying unit for informing a measurement result. 請求項１に記載の基板検査装置において、前記測定結果報知部は、前記測定部の測定結果と基準値を比較し、比較結果に基づき前記端子部と前記配線部との半田接続位置における半田接続の良否を判定する判定手段を備えていることを特徴とする基板検査装置。   The board inspection apparatus according to claim 1, wherein the measurement result notification unit compares a measurement result of the measurement unit with a reference value, and based on the comparison result, solder connection at a solder connection position between the terminal unit and the wiring unit. A substrate inspection apparatus comprising a determination means for determining whether the product is good or bad. 請求項１または２に記載の基板検査装置において、前記基板には、前記コネクタの端子部に接続される配線部から分岐されて前記基板の表面の前記測定ピンと対向する位置に一括配列された検査用のチェックパッドを備えていることを特徴とする基板検査装置。   3. The board inspection apparatus according to claim 1, wherein the board is inspected by being branched from a wiring part connected to the terminal part of the connector and collectively arranged at a position facing the measurement pin on the surface of the board. A board inspection apparatus comprising a check pad for use. 請求項１から３いずれか１項に記載の基板検査装置において、前記基板を位置決め設置する設置台と、前記測定ピンを下面に突出するとともに、設置台の上部に昇降可能に配置され、下降位置で前記配線部に前記測定ピンを接触させる昇降プレートと、を備えていることを特徴とする基板検査装置。   4. The substrate inspection apparatus according to claim 1, wherein the substrate is positioned and installed, and the measurement pin protrudes from the lower surface and is arranged to be moved up and down on the upper portion of the installation table. And a lift plate for bringing the measurement pin into contact with the wiring portion. 設置台上に基板を位置決め設置し、基板上に設けられているコネクタに測定用コネクタ部を差込んで前記コネクタの端子部に導通し、次いで昇降プレートを下降させて測定ピンを基板の配線部に接触させた後に、前記測定ピン及び前記測定用コネクタ部に対応する各ケーブルの他端側に接続されている測定部によって導通状態を順次測定することで、前記端子部と前記配線部との半田接続の良否を判定することを特徴とする基板検査方法。   Position the board on the installation base, insert the measurement connector part into the connector provided on the board and conduct it to the terminal part of the connector, then lower the lifting plate to place the measurement pin on the wiring part of the board After the contact, the measurement state is sequentially measured by the measurement unit connected to the other end side of each cable corresponding to the measurement pin and the measurement connector unit, the terminal unit and the wiring unit A method for inspecting a board, comprising: determining whether solder connection is good or bad. 請求項５に記載の基板検査方法において、前記半田接続の良否を判定するための判定手段は半田接続部の電気抵抗値を測るものであり、該抵抗値が基準値を上回った状態を半田不良と判定するものであることを特徴とする基板検査方法。   6. The substrate inspection method according to claim 5, wherein the determination means for determining whether the solder connection is good or not measures an electric resistance value of the solder connection portion, and indicates that the state in which the resistance value exceeds a reference value is a defective solder. A method for inspecting a substrate, characterized in that:
JP2006105802A 2006-04-07 2006-04-07 Device and method for inspecting substrate Pending JP2007278852A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009264817A (en) * 2008-04-23 2009-11-12 Yokogawa Electric Corp Diagnostic board of semiconductor testing device
JP2012042473A (en) * 2010-08-20 2012-03-01 Siemens Ag Measuring system for down conductor of wind turbine blade
CN102854434A (en) * 2012-08-28 2013-01-02 昆山艾博机器人***工程有限公司 Vertical wiring harness conduction mechanism
JP2020012688A (en) * 2018-07-17 2020-01-23 トヨタ自動車株式会社 Inspection device and inspection method
CN114325488A (en) * 2021-12-29 2022-04-12 北京朝阳隆华电线电缆有限公司 Wire harness fault inspection bench and wire harness fault detection method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009264817A (en) * 2008-04-23 2009-11-12 Yokogawa Electric Corp Diagnostic board of semiconductor testing device
JP2012042473A (en) * 2010-08-20 2012-03-01 Siemens Ag Measuring system for down conductor of wind turbine blade
US9046566B2 (en) 2010-08-20 2015-06-02 Siemens Aktiengesellschaft Measuring system for a down conductor of a wind turbine blade
CN102854434A (en) * 2012-08-28 2013-01-02 昆山艾博机器人***工程有限公司 Vertical wiring harness conduction mechanism
JP2020012688A (en) * 2018-07-17 2020-01-23 トヨタ自動車株式会社 Inspection device and inspection method
JP7135523B2 (en) 2018-07-17 2022-09-13 株式会社デンソー Inspection device and inspection method
CN114325488A (en) * 2021-12-29 2022-04-12 北京朝阳隆华电线电缆有限公司 Wire harness fault inspection bench and wire harness fault detection method
CN114325488B (en) * 2021-12-29 2024-03-12 北京朝阳隆华电线电缆有限公司 Wire harness fault inspection bench and wire harness fault detection method

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