JP2007277478A - Adhesive for connecting circuits - Google Patents
Adhesive for connecting circuits Download PDFInfo
- Publication number
- JP2007277478A JP2007277478A JP2006108584A JP2006108584A JP2007277478A JP 2007277478 A JP2007277478 A JP 2007277478A JP 2006108584 A JP2006108584 A JP 2006108584A JP 2006108584 A JP2006108584 A JP 2006108584A JP 2007277478 A JP2007277478 A JP 2007277478A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- circuit connection
- connection
- circuit
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は、回路基板同士またはＩＣチップ等の電子部品と配線基板の接続に用いられる回路接続用接着剤に関する。 The present invention relates to an adhesive for circuit connection used for connecting circuit boards to each other or an electronic component such as an IC chip and a wiring board.
図１に示したように回路基板同士またはＩＣチップ等の電子部品と回路基板の接続とを電気的に接続する際には、接着剤または導電粒子を分散させた異方導電接着剤が用いられている。すなわち、これらの接着剤を相対向する回路間に介在させ、相対向する回路を加熱、加圧により接続後、加圧方向に導電性を持たせることにより電気的接続をおこなうことができ、従来の接着剤はエポキシ樹脂をベース樹脂とした回路接続用接着剤が提案されている。（例えば、特許文献１参照）エポキシ樹脂をベース樹脂とした従来の接着剤を用いたものは、高温高湿試験、熱衝撃試験等の信頼性試験を行うとＩＣチップと接続基板の熱膨張率差に基づく内部応力によって、接続部において接続抵抗の増大や接着剤の剥離が生じるという問題がある。対策として熱膨張係数を低下させるために、回路接続用接着剤中に無機質充填材として溶融シリカ、結晶質シリカ、ケイ酸カルシウム、アルミナ、炭酸カルシウム等の紛体を混入・分散する手法がある（例えば特許文献２参照）。 As shown in FIG. 1, when electrically connecting circuit boards or electronic components such as IC chips and circuit boards, an adhesive or an anisotropic conductive adhesive in which conductive particles are dispersed is used. ing. In other words, these adhesives are interposed between opposing circuits, and the opposing circuits can be connected by heating and pressurization, and then electrically connected by providing conductivity in the pressurizing direction. As the adhesive, an adhesive for circuit connection using an epoxy resin as a base resin has been proposed. (For example, refer to Patent Document 1) When a conventional adhesive using an epoxy resin as a base resin is subjected to a reliability test such as a high-temperature and high-humidity test or a thermal shock test, the thermal expansion coefficient of the IC chip and the connection substrate Due to the internal stress based on the difference, there is a problem that the connection resistance is increased and the adhesive is peeled off at the connection portion. In order to reduce the coefficient of thermal expansion as a countermeasure, there is a method of mixing and dispersing powders such as fused silica, crystalline silica, calcium silicate, alumina, calcium carbonate as an inorganic filler in the adhesive for circuit connection (for example, Patent Document 2).
しかしながら、昨今のＩＣチップの小型化に伴いバンプ間スペースが狭くなることによる狭ピッチ品の開発のため、従来の回路接続用接着剤では高温高湿の条件下で高電圧を印加する試験を行うと、絶縁抵抗が低下してしまうという懸念があった。これは、高温時の吸湿により接着剤中の導電性粒子が動きやすくなることが主原因であると考えられる。 However, in order to develop a narrow-pitch product due to the space between bumps becoming narrower with the recent miniaturization of IC chips, conventional adhesives for circuit connection are tested to apply a high voltage under high temperature and high humidity conditions. There was a concern that the insulation resistance would decrease. This is considered to be mainly due to the fact that the conductive particles in the adhesive easily move due to moisture absorption at a high temperature.
無機質充填材には低吸湿率のものもあり、これまでは低吸湿率の無機質充填材を用いて熱膨張係数を低下させること及び吸湿率を低下させる２つの目的で接着剤作製時、配合量の最適化はされてはいなかった。本発明は接続抵抗の増大、接着剤の剥離の発生を抑制し、かつ接着剤の吸湿率を低下させることにより絶縁抵抗の低下を防ぐことを目的とし、低吸湿材料の配合量が最適化された回路接続用接着剤を提供する。 Some inorganic fillers have a low moisture absorption rate. So far, the amount of the inorganic filler used to reduce the coefficient of thermal expansion using an inorganic filler with a low moisture absorption rate and the blending amount at the time of adhesive preparation for the purpose of reducing the moisture absorption rate. Was not optimized. The present invention aims to prevent the decrease of insulation resistance by increasing the connection resistance, suppressing the occurrence of peeling of the adhesive, and reducing the moisture absorption rate of the adhesive, and the blending amount of the low hygroscopic material is optimized. An adhesive for connecting a circuit is provided.
すなわち本発明は、以下に関する。
１．相対向する回路間に介在させ、相対向する回路を加熱、加圧により接続する回路接続用接着剤であって、前記回路接続用接着剤は接着剤成分と低吸湿材料を含有し、当該低吸湿材料の含有量が、２０〜６０重量％である回路接続用接着剤。
２．ＤＳＣ（示差走査熱量計）による発熱量が、５０〜１５０Ｊ／ｇの範囲である項１記載の回路接続用接着剤。
３．低吸湿材料が、シリカ微粒子である項１または項２記載の回路接続用接着剤。
４．接着剤成分が、エポキシ樹脂と硬化剤を含む項１乃至項３いずれかに記載の回路接続用接着剤。
５．さらに導電性粒子を０．１〜３０体積％含有する項１乃至項４いずれかに記載の回路接続用接着剤。
That is, the present invention relates to the following.
1. An adhesive for circuit connection interposed between opposing circuits and connecting the opposing circuits by heating and pressurization, wherein the adhesive for circuit connection contains an adhesive component and a low moisture-absorbing material. The adhesive for circuit connection whose content of a hygroscopic material is 20 to 60 weight%.
2. Item 2. The adhesive for circuit connection according to Item 1, wherein the calorific value by DSC (differential scanning calorimeter) is in the range of 50 to 150 J / g.
3.
4). Item 4. The adhesive for circuit connection according to any one of Items 1 to 3, wherein the adhesive component contains an epoxy resin and a curing agent.
5). Item 5. The adhesive for circuit connection according to any one of Items 1 to 4, further comprising 0.1 to 30% by volume of conductive particles.
本発明の回路接続用接着剤によれば、信頼性試験後において生じる接続抵抗の増大、接着剤の剥離の発生を抑制でき、かつ吸湿率を低下させることで絶縁抵抗の低下を防ぐことがでる。したがって、本発明の回路接続用接着剤はファインピッチ化したＬＣＤパネルとＩＣチップ、ＩＣチップとプリント基板とを接続時の加圧方向にのみ電気的に接続するために好適に用いることができる。 According to the adhesive for circuit connection of the present invention, it is possible to suppress the increase in connection resistance and the occurrence of peeling of the adhesive that occur after the reliability test, and to prevent the insulation resistance from being lowered by reducing the moisture absorption rate. . Therefore, the adhesive for circuit connection of the present invention can be suitably used to electrically connect the fine pitch LCD panel and the IC chip, and the IC chip and the printed board only in the pressing direction at the time of connection.
本発明の回路接続用接着剤中に含有させる低吸湿材料としては、シリコーンゴムやシリカが好ましく使用できる。この中でも特に熱膨張係数を低下させる、弾性率を上げる等の観点からシリカ微粒子が好ましい。また、その平均粒径は接続部での導通不良を防止する目的で、３μｍ以下にするのが好ましい。また、接続時の樹脂の流動性の低下及びチップのパッシベーション膜のダメージを防ぐ目的で球状フィラを用いることが好ましい。配合量は２０〜６０重量％であることが好ましい。２０重量％未満であると高温高湿の条件下で高電圧を印加すると絶縁抵抗が低下してしまう懸念があり、６０重量％を超えると接着剤の排除性低下に基づく導通不良や接着性の低下を招いてしまうためである。 Silicone rubber and silica can be preferably used as the low moisture absorption material contained in the adhesive for circuit connection of the present invention. Among these, silica fine particles are particularly preferable from the viewpoint of decreasing the thermal expansion coefficient and increasing the elastic modulus. The average particle size is preferably 3 μm or less for the purpose of preventing poor conduction at the connection. In addition, it is preferable to use a spherical filler for the purpose of preventing a decrease in fluidity of the resin at the time of connection and damage to the passivation film of the chip. The blending amount is preferably 20 to 60% by weight. If it is less than 20% by weight, there is a concern that the insulation resistance is lowered when a high voltage is applied under high temperature and high humidity conditions. This is because it causes a decrease.
本発明の回路接続用接着剤成分は熱によって硬化する反応性樹脂を含有することが好ましく。反応性樹脂としては、少なくともエポキシ樹脂及び硬化剤からなる樹脂が好ましく用いられる。反応性樹脂としては、エポキシ樹脂とイミダゾール系、ヒドラジド系、三フッ素ホウ素−アミン錯体、スルホニウム塩、アミンイミド、ポリアミンの塩、ジシアンジアミド等の潜在性硬化剤の混合物の他、ラジカル反応性樹脂と有機過酸化物の混合物が用いられる。 The adhesive component for circuit connection of the present invention preferably contains a reactive resin that is cured by heat. As the reactive resin, a resin comprising at least an epoxy resin and a curing agent is preferably used. Examples of the reactive resin include a mixture of an epoxy resin and an imidazole-based, hydrazide-based, trifluoroboron-amine complex, sulfonium salt, amine imide, polyamine salt, dicyandiamide, and other radical curing resins and organic peroxides. A mixture of oxides is used.
本発明の回路接続用接着剤はＤＳＣ（示差走査熱量計）での発熱量が５０〜１５０Ｊ／ｇが好ましく、より好ましくは６０〜１２５Ｊ／ｇである。発熱量は５０Ｊ／ｇを下回ると接着剤の硬化性が不十分であり、接着性及び接続信頼性の低下を引き起こす問題を生じる。また、発熱量が１５０Ｊ／ｇを上回ると接着剤の硬化収縮力及び弾性率の増大によって内部応力が増大し、回路同士を接続した際、回路基板がそり、接続信頼性の低下や電子部品の特性低下を引き起こす問題を生じる。ＤＳＣは測定温度範囲内で発熱、吸熱のない標準資料との温度差をたえず打ち消すように熱量を供給または除去するゼロ方位を測定原理とするものであり、測定装置が市販されているため、それを用いて測定できる。回路用接着剤の反応は発熱反応であり、一定の速度で試料を昇温していくと試料が反応し熱量が発生する。その発熱量をチャートに出力し、ベースラインを基準として発熱曲線とベースラインで囲まれた面積を求め、これを発熱量とする。室温から３００℃程度まで１０℃／分の昇温速度で測定し、上記した発熱量を求める。 The adhesive for circuit connection of the present invention preferably has a calorific value of 50 to 150 J / g, more preferably 60 to 125 J / g in DSC (differential scanning calorimeter). When the calorific value is less than 50 J / g, the curability of the adhesive is insufficient, which causes a problem in that the adhesiveness and connection reliability are lowered. Also, if the calorific value exceeds 150 J / g, the internal stress increases due to the increase in the curing shrinkage force and elastic modulus of the adhesive, and when the circuits are connected to each other, the circuit board is warped and the connection reliability is reduced. This causes a problem that causes characteristic deterioration. DSC is based on the zero azimuth that supplies or removes heat so that the temperature difference from the standard data that does not generate heat or endotherm within the measurement temperature range is constantly canceled. Can be measured. The reaction of the circuit adhesive is an exothermic reaction. When the temperature of the sample is increased at a constant rate, the sample reacts to generate heat. The calorific value is output to a chart, the area surrounded by the calorific curve and the base line is obtained with the baseline as a reference, and this is defined as the calorific value. Measurement is performed at a temperature increase rate of 10 ° C./min from room temperature to about 300 ° C., and the above-described calorific value is obtained.
本発明において用いられるエポキシ樹脂としては、エピクロルヒドリンとビスフェノールＡやＦ、ＡＤから誘導されるビスフェノール型エポキシ樹脂、エピクロルヒドリンとフェノールノボラックやクレゾールノボラックから誘導されるエポキシノボラック樹脂やナフタレン環を含んだ骨格を有するナフタレン系エポキシ樹脂、グリシジルアミン、グリシジルエーテル、ビフェニル、脂環式等の１分子内に２個以上のグリシジル基を有する各種のエポキシ化合物を単独にあるいは２種以上混合して用いることが可能である。これらのエポキシ樹脂は不純物イオン（Ｎａ＋、Ｃｌ−等）や加水分解性塩素等を３００ｐｐｍ以下に低減した高純度品をもちいることがエレクロンマイグレーション防止のために好ましい。 The epoxy resin used in the present invention has a skeleton containing a bisphenol type epoxy resin derived from epichlorohydrin and bisphenol A, F or AD, an epoxy novolak resin derived from epichlorohydrin and phenol novolak or cresol novolac, or a naphthalene ring. Various epoxy compounds having two or more glycidyl groups in one molecule such as naphthalene epoxy resin, glycidylamine, glycidyl ether, biphenyl, and alicyclic can be used alone or in admixture of two or more. . These epoxy resins preferably use high-purity products in which impurity ions (Na + , Cl −, etc.), hydrolyzable chlorine and the like are reduced to 300 ppm or less, in order to prevent electroclonic migration.
本発明の回路接続用接着剤には、フィルム形成性をより容易にするためにフェノキシ樹脂、ポリエステル樹脂、ポリアミド樹脂等の熱可塑性樹脂を配合することもできる。これらのフィルム形成性高分子は反応性樹脂の硬化時の応力緩和に効果がある。特にフェノキシ樹脂はエポキシ樹脂と構造が類似しているためエポキシ樹脂との相溶性、接着性に優れるなどの特長を有するので好ましい。 The adhesive for circuit connection of the present invention can be blended with a thermoplastic resin such as a phenoxy resin, a polyester resin, or a polyamide resin in order to make film forming easier. These film-forming polymers are effective for stress relaxation when the reactive resin is cured. In particular, the phenoxy resin is preferable because it has a similar structure to the epoxy resin and thus has features such as excellent compatibility with the epoxy resin and excellent adhesion.
本発明でのフィルム形成は少なくともエポキシ樹脂、シリコーン微粒子、潜在性硬化剤からなる接着剤組成物を有機溶剤に溶解あるいは分散により液状化して、表面処理を施した基材上に塗布し、硬化剤の活性温度以下で溶剤を除去することにより行われる。この時用いる溶剤は芳香族炭化水素系と含酸素系の混合剤が材料の溶解性を向上させるため好ましい。 In the present invention, the film is formed by liquefying an adhesive composition composed of at least an epoxy resin, silicone fine particles, and a latent curing agent in an organic solvent, and applying the solution on a surface-treated substrate. This is done by removing the solvent below the activation temperature. As the solvent used at this time, an aromatic hydrocarbon-based and oxygen-containing mixture is preferable because it improves the solubility of the material.
本発明の回路接続用接着剤にはＩＣチップのバンプや基板電極間の高さばらつきを吸収して異方導電性を積極的に付与する目的で導電粒子を混入、分散させることもできる。本発明において導電粒子は、例えば、Ａｕ、Ａｇ、Ｃｕやはんだ等の金属の粒子であり、ポリスチレン等の高分子の球状の核材にＮｉ、Ｃｕ、Ａｕ、はんだ等の導電層を設けたものが好ましい。さらに、導電性の粒子の表面にＳｎ、Ａｕ、はんだ等の表面層を形成することもできる。粒径は基板電極の最小間隔よりも小さいことが必要で、基板電極の高さばらつきがある場合、高さばらつきよりも大きいことが好ましく、１〜１０μｍが好ましい。また、接着剤に分散される導電粒子量は０．１〜３０体積％であり、好ましくは０．２〜１５体積％である。 In the adhesive for circuit connection of the present invention, conductive particles can also be mixed and dispersed for the purpose of positively imparting anisotropic conductivity by absorbing height variations between bumps of IC chips and substrate electrodes. In the present invention, the conductive particles are, for example, metal particles such as Au, Ag, Cu, and solder, and a polymer spherical core material such as polystyrene is provided with a conductive layer such as Ni, Cu, Au, and solder. Is preferred. Furthermore, a surface layer such as Sn, Au, or solder can be formed on the surface of the conductive particles. The particle size needs to be smaller than the minimum distance between the substrate electrodes. When there is a variation in the height of the substrate electrodes, it is preferably larger than the variation in height, and preferably 1 to 10 μm. The amount of conductive particles dispersed in the adhesive is 0.1 to 30% by volume, preferably 0.2 to 15% by volume.
（実施例１）
（シリカ微粒子を含有する回路接続用接着剤の作製）
非晶シリカ１００重量部を重量比でトルエン／酢酸エチル＝５０／５０の混合溶剤１００重量部に超音波をかけながら分散してシリカ微粒子Ａを得た。固形分重量比としてフェノキシ樹脂２８．２ｇ、エポキシ樹脂１３．９ｇ、マイクロカプセル型潜在性硬化剤１６．１ｇ、シランカップリング剤０．６ｇ、上記で得られたシリカ微粒子Ａを３０重量％となるように配合し、さらに導電粒子を６体積％分散してフィルム塗工溶液を得、ＰＥＴフィルムに塗布し、７０℃、５分間の熱風乾燥により着剤層の厚みが２０μｍのフィルム状回路接続用接着剤を得た。
Example 1
(Production of adhesive for circuit connection containing silica fine particles)
Silica fine particles A were obtained by dispersing 100 parts by weight of amorphous silica in 100 parts by weight of a mixed solvent of toluene / ethyl acetate = 50/50 by weight while applying ultrasonic waves. The solid content weight ratio is 28.2 g of phenoxy resin, 13.9 g of epoxy resin, 16.1 g of microcapsule type latent curing agent, 0.6 g of silane coupling agent, and 30% by weight of silica fine particles A obtained above. In addition, 6% by volume of conductive particles are dispersed to obtain a film coating solution, which is applied to a PET film, and dried with hot air at 70 ° C. for 5 minutes for connecting a film-like circuit having a thickness of 20 μm as an adhesive layer. An adhesive was obtained.
（実施例２）
（シリカ微粒子を含有する回路接続用接着剤の作製）
実施例１と同様にして固形分重量比としてフェノキシ樹脂２８．２ｇ、エポキシ樹脂１３．９ｇ、マイクロカプセル型潜在性硬化剤１６．１ｇ、シランカップリング剤０．６ｇ、実施例１で作製したシリカ微粒子Ａを５０重量％となるように配合し、さらに導電粒子を６体積％分散してフィルム塗工溶液を得、ＰＥＴフィルムに塗布し、７０℃、５分間の熱風乾燥により着剤層の厚みが２０μｍのフィルム状回路接続用接着剤を得た。
(Example 2)
(Production of adhesive for circuit connection containing silica fine particles)
In the same manner as in Example 1, 28.2 g of phenoxy resin, 13.9 g of epoxy resin, 16.1 g of microcapsule type latent curing agent, 0.6 g of silane coupling agent, and the silica prepared in Example 1 were used in the same manner as in Example 1. The fine particle A is blended so as to be 50% by weight, and the conductive particles are further dispersed by 6% by volume to obtain a film coating solution, which is applied to a PET film, and dried by hot air at 70 ° C. for 5 minutes to obtain the thickness of the adhesive layer. Obtained an adhesive for connecting a film-like circuit having a thickness of 20 μm.
（比較例１）
（シリカ微粒子を含有しない回路接続用接着剤の作製）
フィルム形成材として、フェノキシ樹脂（ビフェニル誘導体のグリシジルエーテル化変性物とビスフェノールフルオレン型骨格及びビスフェノールＡ／ビスフェノールＦ型骨格）を用いた。反応性樹脂としてナフタレン骨格型エポキシ樹脂、ゴム変性エポキシ樹脂を用いた。硬化剤としてマイクロカプセル型潜在性硬化剤を含有する液状エポキシ（ビスフェノールＦ型液状エポキシ樹脂、ナフタレン型エポキシ樹脂、マイクロカプセル化されたアミン系硬化剤）を用いた。導電粒子としてポリスチレン系核体の表面に厚み０．２μｍのＮｉ層を設け、このＮｉ層の外側に厚み０．０４μｍのＡｕ層を形成した平均粒径３μｍの導電粒子を作製して用いた。固形分重量比でフェノキシ樹脂２８．２ｇ、エポキシ樹脂１３．９ｇ、マイクロカプセル型潜在性硬化剤１６．１ｇ、シランカップリング剤（グリシドキシプロピルトリメトキシシラン）０．６ｇとなるように配合し、さらに導電粒子を６体積％分散してフィルム塗工溶液を得た。ついで、この溶液を厚み５０μｍの片面を表面処理したＰＥＴ（ポリスチレンテレフタレート）フィルムに塗布し、７０℃、５分間の熱風乾燥により接着剤層の厚みが２０μｍのフィルム状回路接続用接着剤を得た。
(Comparative Example 1)
(Preparation of adhesive for circuit connection not containing silica fine particles)
A phenoxy resin (a glycidyl etherification modified product of a biphenyl derivative and a bisphenol fluorene type skeleton and a bisphenol A / bisphenol F type skeleton) was used as a film forming material. Naphthalene skeleton type epoxy resin and rubber-modified epoxy resin were used as reactive resins. A liquid epoxy (bisphenol F type liquid epoxy resin, naphthalene type epoxy resin, microencapsulated amine type curing agent) containing a microcapsule type latent curing agent was used as a curing agent. Conductive particles having an average particle diameter of 3 μm, in which a Ni layer having a thickness of 0.2 μm was provided on the surface of the polystyrene core as conductive particles and an Au layer having a thickness of 0.04 μm formed on the outside of the Ni layer, were used. Blended so that the solid weight ratio is 28.2 g of phenoxy resin, 13.9 g of epoxy resin, 16.1 g of microcapsule type latent curing agent, and 0.6 g of silane coupling agent (glycidoxypropyltrimethoxysilane). Further, 6% by volume of conductive particles were dispersed to obtain a film coating solution. Next, this solution was applied to a PET (polystyrene terephthalate) film having a surface treated with a surface of 50 μm, and dried with hot air at 70 ° C. for 5 minutes to obtain an adhesive for film-like circuit connection having an adhesive layer thickness of 20 μm. .
（比較例２）
（シリカ微粒子を含有する回路接続用接着剤の作製）
実施例１と同様にして固形分重量比としてフェノキシ樹脂２８．２ｇ、エポキシ樹脂１３．９ｇ、マイクロカプセル型潜在性硬化剤１６．１ｇ、シランカップリング剤０．６ｇ、実施例１で作製したシリカ微粒子Ａを７０重量％となるように配合し、さらに導電粒子を６体積％分散してフィルム塗工溶液を得、ＰＥＴフィルムに塗布し、７０℃、５分間の熱風乾燥により着剤層の厚みが２０μｍのフィルム状回路接続用接着剤を得た。
(Comparative Example 2)
(Production of adhesive for circuit connection containing silica fine particles)
In the same manner as in Example 1, 28.2 g of phenoxy resin, 13.9 g of epoxy resin, 16.1 g of microcapsule type latent curing agent, 0.6 g of silane coupling agent, and the silica prepared in Example 1 were used in the same manner as in Example 1. The fine particle A is blended so as to be 70% by weight, and further the conductive particles are dispersed by 6% by volume to obtain a film coating solution, which is applied to a PET film, and dried by hot air at 70 ° C. for 5 minutes. Obtained an adhesive for film-like circuit connection of 20 μm.
（接続抵抗用試験体の作製）
作成したフィルム状回路接続用接着剤４種類を用いて、金バンプ（面積：５０×５０μｍ、バンプ高さ１５μｍ、）付チップ（１．７×１７ｍｍ、厚み５００μｍ）とＩＣチップ電極に対応したＩＴＯ回路電極を有するガラス基板への接続を以下に示すように行った。フィルム状回路接続用接着剤（３×２０ｍｍ）をＩＴＯ処理ガラス基板（電極高さ：０．２μｍ、厚み：０．７ｍｍ）に８０℃、１．０ＭＰａ（１０ｋｇｆ／ｃｍ２）で貼り付けた後、ＰＥＴフィルムを剥離し、ＩＣチップのバンプとＩＴＯガラス基板の位置合わせ（仮接続）を行った。次いで、１９０℃７５ｇ／バンプ、１０秒の条件でチップ上方から過熱、加圧を行い、本接続を行った。
(Preparation of connection resistance test piece)
Using the four types of adhesives for film-like circuit connection created, a chip (1.7 × 17 mm, thickness 500 μm) with gold bumps (area: 50 × 50 μm, bump height 15 μm) and ITO corresponding to IC chip electrodes Connection to a glass substrate having circuit electrodes was made as shown below. After affixing an adhesive for film-like circuit connection (3 × 20 mm) to an ITO-treated glass substrate (electrode height: 0.2 μm, thickness: 0.7 mm) at 80 ° C. and 1.0 MPa (10 kgf / cm 2 ) The PET film was peeled off, and the IC chip bump and the ITO glass substrate were aligned (temporary connection). Next, overheating and pressurization were performed from above the chip under the conditions of 190 ° C. and 75 g / bump for 10 seconds to perform the main connection.
（絶縁抵抗用試験体の作製）
作成したフィルム状回路接続用接着剤４種類を用いて、金バンプ（面積：５０×９０μｍ、スペース１０μｍ）付チップ（１．３×１０．２ｍｍ、厚み５００μｍ）とＩＣチップ電極に対応したＩＴＯ回路電極を有するガラス基板への接続を以下に示すように行った。フィルム状回路接続用接着剤（２．５×１２ｍｍ）をＩＴＯ処理ガラス基板（電極高さ：０．２μｍ、厚み：０．７ｍｍ）に８０℃、１．０ＭＰａ（１０Ｋｇｆ／ｃｍ２）で貼り付けた後、ＰＥＴフィルムを剥離し、ＩＣチップのバンプとＩＴＯガラス基板の位置合わせ（仮接続）を行った。次いで、１８０℃７５ｇ／バンプ、１０秒の条件でチップ上方から過熱、加圧を行い、本接続を行った。
(Preparation of test specimen for insulation resistance)
Using the four kinds of adhesives for film-like circuit connection created, a chip (1.3 × 10.2 mm, thickness 500 μm) with gold bumps (area: 50 × 90 μm, space 10 μm) and an ITO circuit corresponding to an IC chip electrode Connection to a glass substrate with electrodes was made as follows. A film-like circuit connection adhesive (2.5 × 12 mm) is attached to an ITO-treated glass substrate (electrode height: 0.2 μm, thickness: 0.7 mm) at 80 ° C. and 1.0 MPa (10 kgf / cm 2 ). After that, the PET film was peeled off, and the bumps of the IC chip and the ITO glass substrate were aligned (temporary connection). Next, overheating and pressurization were performed from above the chip under conditions of 180 ° C. and 75 g / bump for 10 seconds to perform the main connection.
（吸湿率試験体の作製）
作製したフィルム状回路接続用接着剤４種類を各５０ｍｇ程度量り、以下に示すように半硬化、硬化品を作成した。０．５ｃｍ３まで折畳んだ後、ホットプレート上で（条件：１００℃−３０ｍｉｎ、２１０℃−２０ｍｉｎ）硬化処理を行った。
(Preparation of moisture absorption rate specimen)
About 4 mg of each of the prepared adhesives for film-like circuit connection was weighed by about 50 mg, and semi-cured and cured products were prepared as shown below. After folding to 0.5 cm 3, curing treatment was performed on a hot plate (conditions: 100 ° C.-30 min, 210 ° C.-20 min).
（特性評価方法）
接続抵抗：株式会社アドバンテスト製マルチメータＴＲ６８４８を用いて、隣接回路間の抵抗を１ｍＡの定電流で測定した。
絶縁抵抗：金バンプスペース１０μｍの電極３２個分にＤＣ３０Ｖを連続印加し、楠本化成株式会社製絶縁劣化特性評価システムＳＩＲ１１を用いて測定した。
吸湿率：ザルトリウス株式会社製精密天秤を用いて、試験前の初期重量を基準とし、２００ｈｒ試験した後の重量から吸湿率を算出した。試験条件は４０℃／９０％ＲＨとした。
接続部分の外観観察：金属顕微鏡で、接続部分の浮き（剥離）の有無を確認した。剥離のないものを「○」とし、剥離の程度が軽いものを「△」、剥離の程度が重いものを「×」とした。
信頼性評価：上記接続抵抗測定品に関して、恒温恒湿試験８５℃／８５％ＲＨの条件で１０００ｈｒ試験した。
絶縁性評価：上記絶縁抵抗に関して、８５℃／８５％ＲＨの条件下で２５０ｈｒ試験した。
上記結果を表１に示した。
(Characteristic evaluation method)
Connection resistance: Resistance between adjacent circuits was measured with a constant current of 1 mA using a multimeter TR6848 manufactured by Advantest Corporation.
Insulation resistance: DC30V was continuously applied to 32 electrodes having a gold bump space of 10 μm and measured using an insulation deterioration characteristic evaluation system SIR11 manufactured by Enomoto Kasei Co., Ltd.
Moisture absorption rate: Using a precision balance manufactured by Sartorius Co., Ltd., the moisture absorption rate was calculated from the weight after the 200 hr test, based on the initial weight before the test. The test conditions were 40 ° C./90% RH.
Appearance observation of connection part: The presence or absence of floating (peeling) of the connection part was confirmed with a metal microscope. The case where there was no peeling was indicated as “◯”, the case where the degree of peeling was light, “Δ”, and the case where the degree of peeling was heavy, “X”.
Reliability evaluation: The connection resistance measurement product was subjected to a 1000 hr test under the condition of a constant temperature and humidity test of 85 ° C./85% RH.
Insulation evaluation: The insulation resistance was tested for 250 hours under the conditions of 85 ° C./85% RH.
The results are shown in Table 1.
比較例１に対し、実施例１、実施例２は接続抵抗、絶縁抵抗、吸水率、外観ともに同等または良好な結果を示した。また、発熱量も６０〜１２５Ｊ／ｇの範囲で良好な結果であった。これに対して、比較例２は吸湿率以外において比較例１よりも劣る結果となった。また、発熱量も４０Ｊ／ｇと範囲外であった。これは、シリカ微粒子の配合量が多すぎたために接続部での接着剤の排除性低下に基づく導通不良や接着性の低下が発生したためと考察する。 In contrast to Comparative Example 1, Examples 1 and 2 showed the same or good results in connection resistance, insulation resistance, water absorption, and appearance. Moreover, the calorific value was also good in the range of 60 to 125 J / g. On the other hand, Comparative Example 2 was inferior to Comparative Example 1 except for the moisture absorption rate. The calorific value was also out of the range of 40 J / g. It is considered that this is because the blending amount of the silica fine particles is too large, resulting in a poor conduction and a decrease in adhesiveness due to a decrease in the elimination of the adhesive at the connection portion.
１：回路接続用接着剤
２：シリカ微粒子
３：ガラス基板
４：ＩＴＯ回路電極
５：導電粒子
６：金バンプ
７：ＩＣチップ
1: Adhesive for circuit connection 2: Silica fine particle 3: Glass substrate 4: ITO circuit electrode 5: Conductive particle 6: Gold bump 7: IC chip
Claims (5)
The adhesive for circuit connection according to any one of claims 1 to 4, further comprising 0.1 to 30% by volume of conductive particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006108584A JP2007277478A (en) | 2006-04-11 | 2006-04-11 | Adhesive for connecting circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006108584A JP2007277478A (en) | 2006-04-11 | 2006-04-11 | Adhesive for connecting circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2007277478A true JP2007277478A (en) | 2007-10-25 |
Family
ID=38679257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006108584A Pending JP2007277478A (en) | 2006-04-11 | 2006-04-11 | Adhesive for connecting circuits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007277478A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5051221B2 (en) * | 2007-10-31 | 2012-10-17 | 日立化成工業株式会社 | Circuit member connection structure and circuit member connection method |
-
2006
- 2006-04-11 JP JP2006108584A patent/JP2007277478A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5051221B2 (en) * | 2007-10-31 | 2012-10-17 | 日立化成工業株式会社 | Circuit member connection structure and circuit member connection method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100932045B1 (en) | Curable resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component bonding body | |
| JP3885896B2 (en) | Repairable electrode connecting adhesive composition and electrode connecting connecting member comprising the composition | |
| JP2009194359A (en) | Adhesive film for circuit connection, and connection structure of circuit member and method of connecting circuit member using the same | |
| TWI593774B (en) | Anisotropic conductive film and semiconductor device bonded by the same | |
| JP4978493B2 (en) | Circuit connection material, connection structure and manufacturing method thereof | |
| JP2009041019A (en) | Curable resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body | |
| JP2009242508A (en) | Adhesive and bonded body | |
| KR100989535B1 (en) | Adhesive material | |
| WO2009145005A1 (en) | Adhesive film | |
| JP2007056209A (en) | Adhesive for circuit connection | |
| JP4433564B2 (en) | Adhesive for circuit connection | |
| JP2003049145A (en) | Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same | |
| JP2002327162A (en) | Anisotropically conductive adhesive composition, method for connecting circuit terminal and connection structure of the circuit terminal | |
| JP2008308682A (en) | Circuit connection material | |
| JP5493327B2 (en) | Resin composition for sealing filling, semiconductor device and method for manufacturing the same | |
| JP4867805B2 (en) | Adhesive for electrode connection | |
| JP2006028521A (en) | Addhesive for circuit connection | |
| JP2010024384A (en) | Anisotropically electroconductive composition | |
| KR101955749B1 (en) | Composition for use of an anisotropic conductive film, an anisotropic conductive film thereof and a semiconductor device using the same | |
| JP2007277478A (en) | Adhesive for connecting circuits | |
| JPH02288019A (en) | Anisotropic conductive film | |
| JP4626495B2 (en) | Adhesive for circuit connection | |
| JP2009299079A (en) | Connecting member for circuit, and circuit board | |
| JP2009161684A (en) | Adhesive composition for use in circuit connection, and connection structure of circuit member and connecting method of circuit member by using the adhesive composition | |
| JP4032974B2 (en) | Method of connecting adhesive film for circuit connection and adhesive film for circuit connection |