JP2007251727A - Piezoelectric oscillator - Google Patents

Piezoelectric oscillator Download PDF

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JP2007251727A
JP2007251727A JP2006074077A JP2006074077A JP2007251727A JP 2007251727 A JP2007251727 A JP 2007251727A JP 2006074077 A JP2006074077 A JP 2006074077A JP 2006074077 A JP2006074077 A JP 2006074077A JP 2007251727 A JP2007251727 A JP 2007251727A
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container
wiring
recess
conductive adhesive
side wall
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JP4586753B2 (en
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Atsushi Kiyohara
厚 清原
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Miyazaki Epson Corp
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Miyazaki Epson Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a small-sized piezoelectric oscillator in which reliability of an electrical connection between a piezoelectric vibrator and a container is improved. <P>SOLUTION: The piezoelectric oscillator comprises: a container 10 which comprises a recess including a bottom wall 11 and a side wall 12 and in which wiring 14 is formed in the recess; an IC chip 20 fixed on the bottom wall 11 of the recess in the container 10 and connected with the wiring 14; a resin member 22 with which the IC chip 20 is filled so as to be covered; a conductive adhesive 25 provided on the resin member 22; a crystal vibrator 27 comprising an exciting electrode 26 connected to the conductive adhesive 25; and a lid body 38 which is disposed on an upper face of the container 10 and air-tightly seals the recess, the conductive adhesive 25 being electrically connected with the exciting electrode 26 of the crystal vibrating chip 27, and electrically connected with the wiring 14 formed on the side wall 12 of the recess in the container 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、電子機器または通信機器に用いられる表面実装型の圧電発振器に関する。   The present invention relates to a surface mount type piezoelectric oscillator used for an electronic device or a communication device.

近年、電子機器や通信機器の携帯性向上の要求から、機器の小型化が急速に進んでいる。このため、これらに用いられる水晶発振器に代表される圧電発振器にも小型化の要求がされている。
例えば、特許文献１に示すような小型化された水晶発振器が知られている。この水晶発振器は、凹状の収容器内にＩＣ（Integrated Circuit）チップが固着され、そのＩＣチップの上に絶縁体の基板を設け、この基板に水晶振動片を導電性接着剤で固着すると共に、この導電性接着剤が収容器の内壁面に設けた導通端子と電気的に接続されている構造である。 In recent years, downsizing of devices is rapidly progressing due to demands for improving portability of electronic devices and communication devices. For this reason, the piezoelectric oscillator represented by the crystal oscillator used for these is also requested | required of size reduction.
For example, a miniaturized crystal oscillator as shown in Patent Document 1 is known. In this crystal oscillator, an IC (Integrated Circuit) chip is fixed in a concave container, an insulating substrate is provided on the IC chip, and a crystal vibrating piece is fixed to the substrate with a conductive adhesive. This conductive adhesive is electrically connected to a conduction terminal provided on the inner wall surface of the container.

特開２００５−１０２１４５号公報（図１参照）Japanese Patent Laying-Open No. 2005-102145 (see FIG. 1)

しかしながら、上記従来の水晶発振器の構造では、基板と収容器の内壁面との間に隙間があり、この基板と収容器の内壁面との間を導電性接着剤で接続するために、隙間の部分は導電性接着剤で橋渡しする構造となっている。
このため、水晶発振器に振動または落下などによる衝撃が加わった場合、この隙間を橋渡しする導電性接着剤に亀裂または分断などが生じ、水晶振動片と収容器間の電気的接続の信頼性を低下させることが予想される。
本発明は上記従来の課題を解決するためになされたものであり、その目的は、圧電振動片と収容器との電気的接続の信頼性を向上させる小型化された圧電発振器を提供することにある。 However, in the above-described conventional crystal oscillator structure, there is a gap between the substrate and the inner wall surface of the container. In order to connect the substrate and the inner wall surface of the container with a conductive adhesive, The part is structured to be bridged by a conductive adhesive.
For this reason, when an impact due to vibration or dropping is applied to the crystal oscillator, the conductive adhesive that bridges this gap will crack or break, reducing the reliability of the electrical connection between the crystal resonator element and the container. It is expected that
The present invention has been made to solve the above-described conventional problems, and an object thereof is to provide a miniaturized piezoelectric oscillator that improves the reliability of electrical connection between the piezoelectric vibrating piece and the container. is there.

上記課題を解決するために、本発明の圧電発振器は、底壁と側壁を有する凹部を備え、該凹部に配線が形成された収容器と、前記収容器における前記凹部の底壁に固着され前記配線と接続されるＩＣチップと、前記ＩＣチップを覆うように充填された樹脂部材と、前記樹脂部材上に設けられた導電性接着剤と、前記導電性接着剤に接続される励振電極が設けられた圧電振動片と、前記収容器の上面に配置され前記凹部を気密に封止する蓋体と、を備え、前記導電性接着剤が前記圧電振動片の励振電極と電気的に接続されるとともに、前記収容器における前記凹部の側壁に形成された前記配線と電気的に接続されていることを特徴とする。   In order to solve the above-described problems, a piezoelectric oscillator according to the present invention includes a recess having a bottom wall and a side wall, and wiring is formed in the recess, and is fixed to the bottom wall of the recess in the container. An IC chip connected to the wiring, a resin member filled to cover the IC chip, a conductive adhesive provided on the resin member, and an excitation electrode connected to the conductive adhesive are provided. And a lid that is disposed on the upper surface of the container and hermetically seals the recess, and the conductive adhesive is electrically connected to the excitation electrode of the piezoelectric vibrating piece. And it is electrically connected with the said wiring formed in the side wall of the said recessed part in the said container.

この構成によれば、収容器の凹部に樹脂部材が充填されているため、凹部の底壁から側壁に至るまで樹脂部材が形成されている。そして、樹脂部材の上面から導電性接着剤を配置して収容器の側壁に設けた配線と接続することができ、従来のように隙間を跨ぐように導電性接着剤を配置する必要がない。このことから、圧電発振器に振動や落下などによる衝撃が加わった場合、導電性接着剤に亀裂または分断などが生ずることなく、圧電振動片と収容器との電気的接続の信頼性を向上させる小型化された圧電発振器を提供することができる。   According to this configuration, since the resin member is filled in the concave portion of the container, the resin member is formed from the bottom wall to the side wall of the concave portion. And a conductive adhesive can be arrange | positioned from the upper surface of a resin member, and it can connect with the wiring provided in the side wall of the container, and it is not necessary to arrange | position a conductive adhesive so that a clearance gap may be straddled conventionally. This makes it possible to improve the reliability of electrical connection between the piezoelectric vibrating piece and the container without cracking or breaking the conductive adhesive when an impact due to vibration or dropping is applied to the piezoelectric oscillator. A piezoelectric oscillator can be provided.

また、本発明では、前記導電性接着剤と接続される前記配線が形成された前記凹部の側壁が斜面状に形成されていることが望ましい。   Moreover, in this invention, it is desirable that the side wall of the said recessed part in which the said wiring connected with the said conductive adhesive was formed in the slope shape.

この構成によれば、凹部の側壁が斜面状に形成されていることから、側壁と樹脂部材との境界部に導電性接着剤が流れやすく、また、配線と導電性接着剤の接触面積が増大し、確実な電気的接続を果たすことができる。   According to this configuration, since the side wall of the recess is formed in a slope shape, the conductive adhesive easily flows to the boundary between the side wall and the resin member, and the contact area between the wiring and the conductive adhesive increases. Thus, a reliable electrical connection can be achieved.

本発明の圧電発振器は、底壁と側壁を有する凹部を備え、該凹部に配線が形成された収容器と、前記収容器における前記凹部の底壁に固着され前記配線と接続されるＩＣチップと、前記ＩＣチップを覆うように充填された樹脂部材と、前記樹脂部材上に形成され前記収容器における前記凹部の側壁に形成された前記配線に接続される補助配線と、前記補助配線上に設けられた導電性接着剤と、前記導電性接着剤に接続される励振電極が設けられた圧電振動片と、前記収容器の上面に配置され前記凹部を気密に封止する蓋体と、を備え、前記導電性接着剤が前記圧電振動片の励振電極と電気的に接続されるとともに、前記補助配線と電気的に接続されていることを特徴とする。   A piezoelectric oscillator according to the present invention includes a recess having a bottom wall and a side wall, and a wiring is formed in the recess, and an IC chip fixed to the bottom wall of the recess in the housing and connected to the wiring. A resin member filled to cover the IC chip, an auxiliary wiring formed on the resin member and connected to the wiring formed on a side wall of the recess in the container, and provided on the auxiliary wiring A conductive adhesive, a piezoelectric vibrating piece provided with an excitation electrode connected to the conductive adhesive, and a lid that is disposed on the upper surface of the container and hermetically seals the recess. The conductive adhesive is electrically connected to the excitation electrode of the piezoelectric vibrating piece and electrically connected to the auxiliary wiring.

この構成によれば、収容器の凹部に樹脂部材が充填されているため、凹部の底壁から側壁に至るまで樹脂部材が形成されている。そして、樹脂部材上に形成された補助配線が収容器における凹部の側壁に形成された配線に接続している。さらに、この補助配線に導電性接着剤を接続することで、収容器の側壁に設けた配線と電気的接続することができ、従来のように隙間を跨ぐように導電性接着剤を配置する必要がない。このことから、圧電発振器に振動や落下などによる衝撃が加わった場合、導電性接着剤に亀裂または分断などが生ずることなく、圧電振動片と収容器との電気的接続の信頼性を向上させる小型化された圧電発振器を提供することができる。   According to this configuration, since the resin member is filled in the concave portion of the container, the resin member is formed from the bottom wall to the side wall of the concave portion. And the auxiliary | assistant wiring formed on the resin member is connected to the wiring formed in the side wall of the recessed part in a container. Furthermore, by connecting a conductive adhesive to this auxiliary wiring, it can be electrically connected to the wiring provided on the side wall of the container, and it is necessary to dispose the conductive adhesive across the gap as in the past. There is no. This makes it possible to improve the reliability of electrical connection between the piezoelectric vibrating piece and the container without cracking or breaking the conductive adhesive when an impact due to vibration or dropping is applied to the piezoelectric oscillator. A piezoelectric oscillator can be provided.

また、本発明の圧電発振器は、前記導電性接着剤と接続される前記配線が形成された前記凹部の側壁が斜面状に形成されていることが望ましい。   In the piezoelectric oscillator according to the aspect of the invention, it is preferable that a side wall of the concave portion in which the wiring connected to the conductive adhesive is formed in a slope shape.

この構成によれば、樹脂部材上に補助配線を蒸着などで形成する際に、この補助配線と斜面状の側壁に形成された配線との境界部にまで蒸着することができ、補助配線と側壁に形成された配線とを確実に接続することができる。   According to this configuration, when the auxiliary wiring is formed on the resin member by vapor deposition or the like, the auxiliary wiring and the side wall formed on the inclined side wall can be vapor-deposited. It is possible to reliably connect the wiring formed in the above.

以下、本発明を具体化した実施形態について図面に従って説明する。本実施形態では圧電発振器として代表的な水晶発振器を例にとり説明する。
（第１の実施形態） DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. In the present embodiment, a typical crystal oscillator will be described as an example of a piezoelectric oscillator.
(First embodiment)

図１は、本実施形態の水晶発振器の構成を示す構成図であり、図１（ａ）は模式平面図、図１（ｂ）は、模式断面図である。
水晶発振器１は収容器１０内に、水晶振動片２７とＩＣチップ２０とを備えている。収容器１０はセラミックなどで形成され、底壁１１と側壁１２を有する凹部を有し、その底壁１１および側壁１２には所定の配線１４が形成されている。また、収容器１０の底面の四隅には外部との接続を可能とする外部接続端子１８が設けられ、この外部接続端子１８は収容器１０の凹部に形成された配線１４と接続するように構成されている。 1A and 1B are configuration diagrams showing the configuration of the crystal oscillator of the present embodiment. FIG. 1A is a schematic plan view, and FIG. 1B is a schematic cross-sectional view.
The crystal oscillator 1 includes a crystal vibrating piece 27 and an IC chip 20 in the container 10. The container 10 is made of ceramic or the like, has a recess having a bottom wall 11 and a side wall 12, and a predetermined wiring 14 is formed on the bottom wall 11 and the side wall 12. In addition, external connection terminals 18 that enable connection to the outside are provided at the four corners of the bottom surface of the container 10, and the external connection terminals 18 are configured to be connected to the wiring 14 formed in the recess of the container 10. Has been.

収容器１０の凹部の底壁１１に形成された配線１４には、バンプ２１を形成したＩＣチップ２０がフェイスダウンボンディングされている。そして、ＩＣチップ２０の上面を覆うまでエポキシ樹脂などの絶縁性樹脂が充填されて固化した樹脂部材２２が、収容器１０の底壁１１から側壁１２にかけて形成されている。また、この樹脂部材２２の表面は平坦に形成されている。
樹脂部材２２の上方には励振電極２６を形成した水晶振動片２７が配置され、樹脂部材２２の上に形成したＡｇペーストなどの導電性接着剤２５により水晶振動片２７が樹脂部材２２上に固着されている。また、導電性接着剤２５は収容器１０における側壁１２の角部の２辺に形成した配線１４に接続されている。このようにして、水晶振動片２７の励振電極２６とＩＣチップ２０との電気的接続がなされている。
そして、収容器１０の上部に配置された蓋体２８により、収容器１０の凹部内を減圧雰囲気または不活性ガス雰囲気に保って気密封止されている。
なお、ＩＣチップ２０には水晶振動片２７を励振させる発振回路が構成され、場合により温度補償回路、ＰＬＬ回路、記憶回路などを含んでいる。 An IC chip 20 on which bumps 21 are formed is face-down bonded to the wiring 14 formed on the bottom wall 11 of the recess of the container 10. A resin member 22 filled with an insulating resin such as an epoxy resin and solidified until the upper surface of the IC chip 20 is covered is formed from the bottom wall 11 to the side wall 12 of the container 10. Further, the surface of the resin member 22 is formed flat.
A crystal vibrating piece 27 having an excitation electrode 26 is disposed above the resin member 22, and the crystal vibrating piece 27 is fixed on the resin member 22 by a conductive adhesive 25 such as an Ag paste formed on the resin member 22. Has been. Further, the conductive adhesive 25 is connected to the wiring 14 formed on the two sides of the corner portion of the side wall 12 in the container 10. In this way, the electrical connection between the excitation electrode 26 of the crystal vibrating piece 27 and the IC chip 20 is established.
And the inside of the recessed part of the container 10 is airtightly sealed by the cover body 28 arrange | positioned at the upper part of the container 10, keeping the pressure reduction atmosphere or an inert gas atmosphere.
The IC chip 20 is configured with an oscillation circuit that excites the crystal resonator element 27, and may include a temperature compensation circuit, a PLL circuit, a memory circuit, and the like depending on circumstances.

以上、本実施形態の水晶発振器１は、収容器１０の凹部に樹脂部材２２が充填されているため、凹部の底壁１１から側壁１２に至るまで樹脂部材２２が形成されている。そして、樹脂部材２２の上面から導電性接着剤２５を配置して収容器１０の側壁１２に設けた配線１４と接続することができ、従来のように隙間を跨ぐように導電性接着剤を配置する必要がない。このことから、水晶発振器１に振動または落下などによる衝撃が加わった場合、導電性接着剤２５に亀裂または分断などが生ずることなく、水晶振動片２７と収容器１０との電気的接続の信頼性を向上させる小型化された水晶発振器１を提供することができる。
（第１の実施形態の変形例１） As described above, in the crystal oscillator 1 of the present embodiment, since the resin member 22 is filled in the recess of the container 10, the resin member 22 is formed from the bottom wall 11 to the side wall 12 of the recess. And the conductive adhesive 25 can be arrange | positioned from the upper surface of the resin member 22, and it can connect with the wiring 14 provided in the side wall 12 of the container 10, and a conductive adhesive is arrange | positioned so that a clearance gap may be straddled like before There is no need to do. Therefore, when an impact due to vibration or dropping is applied to the crystal oscillator 1, the conductive adhesive 25 is not cracked or broken, and the electrical connection reliability between the crystal resonator element 27 and the container 10 is reliable. Thus, a miniaturized crystal oscillator 1 can be provided.
(Modification 1 of the first embodiment)

次に、上記第１の実施形態の変形例１について説明する。
図２は変形例１の構成を示す模式平面図である。第１の実施形態と同じ構成部については同符号を付し、説明を省略する。
この変形例１の水晶発振器２では、収容器１０の側壁１２に形成した配線１５が、水晶振動片２７の幅方向の辺に近接する側壁１２に対向するように設けられている。そして、樹脂部材２２上に形成されたＡｇペーストなどの導電性接着剤２５が、水晶振動片２７の励振電極２６と接続されると共に、収容器１０の側壁１２に形成された配線１５と接続されている。 Next, Modification 1 of the first embodiment will be described.
FIG. 2 is a schematic plan view showing the configuration of the first modification. The same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
In the crystal oscillator 2 of the first modification, the wiring 15 formed on the side wall 12 of the container 10 is provided so as to face the side wall 12 close to the side in the width direction of the crystal vibrating piece 27. Then, a conductive adhesive 25 such as an Ag paste formed on the resin member 22 is connected to the excitation electrode 26 of the crystal vibrating piece 27 and to the wiring 15 formed on the side wall 12 of the container 10. ing.

このように、上記変形例１では、水晶振動片２７を収容器１０の凹部に配置したときに、水晶振動片２７と側壁１２との間隔が狭い場合に特に有効であり、導電性接着剤２５を少量配置しても水晶振動片２７と配線１５との接続を確実に行うことができる。
（第１の実施形態の変形例２） As described above, the first modification is particularly effective when the crystal vibrating piece 27 is disposed in the recess of the container 10 and the distance between the crystal vibrating piece 27 and the side wall 12 is narrow. Even if a small amount is placed, the crystal vibrating piece 27 and the wiring 15 can be reliably connected.
(Modification 2 of the first embodiment)

次に、第１の実施形態の変形例２について説明する。
図３は変形例２における水晶発振器の構成を示す模式断面図である。第１の実施形態と同じ構成部については同符号を付し、説明を省略する。
この変形例２の水晶発振器３は、収容器１０の凹部を形成する側壁１２の一面が凹部の上方に行くに従い開口面積を増大させるような斜面状に形成され、この斜面状の側壁１２に配線１６が形成されている。この点が第１の実施形態と異なる。そして、樹脂部材２２上に形成されたＡｇペーストなどの導電性接着剤２５が、水晶振動片２７の励振電極２６と接続されると共に、収容器１０の斜面状の側壁１２に形成された配線１６と接続されている。 Next, Modification 2 of the first embodiment will be described.
FIG. 3 is a schematic cross-sectional view showing the configuration of the crystal oscillator in the second modification. The same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
The crystal oscillator 3 of the second modified example is formed in a slope shape in which one surface of the side wall 12 forming the concave portion of the container 10 increases in the opening area as it goes above the concave portion. 16 is formed. This point is different from the first embodiment. Then, a conductive adhesive 25 such as an Ag paste formed on the resin member 22 is connected to the excitation electrode 26 of the crystal vibrating piece 27 and the wiring 16 formed on the inclined side wall 12 of the container 10. And connected.

このように、斜面状の側壁１２に配線１６が形成されていることから、側壁１２と樹脂部材２２との境界部に導電性接着剤２５が流れやすく、また、配線１６と導電性接着剤２５の接触面積が増大し、確実な電気的接続を果たすことができる。
（第２の実施形態） Thus, since the wiring 16 is formed on the sloped side wall 12, the conductive adhesive 25 easily flows to the boundary between the side wall 12 and the resin member 22, and the wiring 16 and the conductive adhesive 25. As a result, the contact area is increased and a reliable electrical connection can be achieved.
(Second Embodiment)

次に、第２の実施形態の水晶発振器について説明する。
図４は、本実施形態の水晶発振器の構成を示す構成図であり、図４（ａ）は模式平面図、図４（ｂ）は、模式断面図である。
水晶発振器４は収容器３０内に、水晶振動片４７とＩＣチップ４０とを備えている。収容器３０はセラミックなどで形成され、底壁３１と側壁３２を有する凹部を有し、その底壁３１および側壁３２には所定の配線３４が形成されている。また、収容器３０の底面の四隅には外部との接続を可能とする外部接続端子３８が設けられ、この外部接続端子３８は収容器３０の凹部に形成された配線３４と接続するように構成されている。 Next, a crystal oscillator according to a second embodiment will be described.
4A and 4B are configuration diagrams showing the configuration of the crystal oscillator according to the present embodiment. FIG. 4A is a schematic plan view, and FIG. 4B is a schematic cross-sectional view.
The crystal oscillator 4 includes a crystal vibrating piece 47 and an IC chip 40 in the container 30. The container 30 is made of ceramic or the like and has a recess having a bottom wall 31 and a side wall 32, and a predetermined wiring 34 is formed on the bottom wall 31 and the side wall 32. In addition, external connection terminals 38 that allow connection to the outside are provided at the four corners of the bottom surface of the container 30, and the external connection terminals 38 are configured to be connected to the wiring 34 formed in the recess of the container 30. Has been.

収容器３０の凹部の底壁３１に形成された配線３４には、バンプ４１を形成したＩＣチップ４０がフェイスダウンボンディングされている。そして、ＩＣチップ４０の上面を覆うまでエポキシ樹脂などの絶縁性樹脂が充填されて固化した樹脂部材４２が、収容器３０の底壁３１から側壁３２にかけて形成されている。また、この樹脂部材４２の表面は平坦に形成されている。
さらに、樹脂部材４２の表面には補助電極４３が蒸着などの方法により形成され、この補助電極４３は収容器３０の側壁３２に形成された配線３４に接続されている。
樹脂部材４２の上方には励振電極４６を形成した水晶振動片４７が配置され、補助電極４３の上に形成したＡｇペーストなどの導電性接着剤４５により水晶振動片４７が樹脂部材４２上に固着されている。このようにして、水晶振動片４７の励振電極４６とＩＣチップ４０との電気的接続がなされている。
そして、収容器３０の上部に配置された蓋体４８により、収容器３０の凹部内を減圧雰囲気または不活性ガス雰囲気に保って気密封止されている。
なお、ＩＣチップ４０には水晶振動片４７を励振させる発振回路が構成され、場合により温度補償回路、ＰＬＬ回路、記憶回路などを含んでいる。 An IC chip 40 on which bumps 41 are formed is face-down bonded to the wiring 34 formed on the bottom wall 31 of the recess of the container 30. A resin member 42 filled with an insulating resin such as an epoxy resin and solidified until the upper surface of the IC chip 40 is covered is formed from the bottom wall 31 to the side wall 32 of the container 30. Further, the surface of the resin member 42 is formed flat.
Further, an auxiliary electrode 43 is formed on the surface of the resin member 42 by a method such as vapor deposition, and the auxiliary electrode 43 is connected to a wiring 34 formed on the side wall 32 of the container 30.
A crystal vibrating piece 47 having an excitation electrode 46 formed thereon is disposed above the resin member 42, and the crystal vibrating piece 47 is fixed on the resin member 42 by a conductive adhesive 45 such as an Ag paste formed on the auxiliary electrode 43. Has been. In this way, the electrical connection between the excitation electrode 46 of the crystal vibrating piece 47 and the IC chip 40 is established.
And by the cover body 48 arrange | positioned at the upper part of the container 30, the inside of the recessed part of the container 30 is kept airtightly sealed in a pressure-reduced atmosphere or an inert gas atmosphere.
The IC chip 40 is configured with an oscillation circuit that excites the quartz crystal vibrating piece 47, and optionally includes a temperature compensation circuit, a PLL circuit, a memory circuit, and the like.

以上、本実施形態の水晶発振器４は、収容器３０の凹部に樹脂部材４２が充填されているため、凹部の底壁３１から側壁３２に至るまで樹脂部材４２が形成されている。そして、樹脂部材４２上に形成された補助配線４３が収容器３０における凹部の側壁３２に形成された配線３４に接続している。さらに、この補助配線４３に導電性接着剤４５を接続することで、収容器３０の側壁３２に設けた配線３４と電気的接続することができ、従来のように隙間を跨ぐように導電性接着剤を配置する必要がない。このことから、水晶発振器４に振動または落下などによる衝撃が加わった場合、導電性接着剤４５に亀裂または分断などが生ずることなく、水晶振動片４７と収容器３０との電気的接続の信頼性を向上させる小型化された水晶発振器４を提供することができる。
（第２の実施形態の変形例１） As described above, in the crystal oscillator 4 of the present embodiment, since the resin member 42 is filled in the concave portion of the container 30, the resin member 42 is formed from the bottom wall 31 to the side wall 32 of the concave portion. The auxiliary wiring 43 formed on the resin member 42 is connected to the wiring 34 formed on the side wall 32 of the recess in the container 30. Further, by connecting a conductive adhesive 45 to the auxiliary wiring 43, it can be electrically connected to the wiring 34 provided on the side wall 32 of the container 30, and the conductive bonding is performed so as to straddle the gap as in the prior art. There is no need to place an agent. Therefore, when an impact due to vibration or dropping is applied to the crystal oscillator 4, the conductive adhesive 45 is not cracked or broken, and the electrical connection reliability between the crystal vibrating piece 47 and the container 30 is reliable. Thus, a miniaturized crystal oscillator 4 can be provided.
(Modification 1 of 2nd Embodiment)

次に、上記第２の実施形態の変形例１について説明する。
図５は変形例１の構成を示す模式平面図である。第２の実施形態と同じ構成部については同符号を付し、説明を省略する。
この変形例の水晶発振器５では、収容器３０の側壁３２に形成した配線３５が、水晶振動片４７の幅方向の辺に近接する側壁３２に対向するように設けられている。そして、樹脂部材４２上に形成された補助配線４３が収容器３０における凹部の側壁３２に形成された配線３５に接続している。さらに、補助配線４３上に形成されたＡｇペーストなどの導電性接着剤４５が、水晶振動片４７の励振電極４６と接続されている。 Next, Modification 1 of the second embodiment will be described.
FIG. 5 is a schematic plan view showing the configuration of the first modification. The same components as those of the second embodiment are denoted by the same reference numerals, and description thereof is omitted.
In the crystal oscillator 5 of this modification, the wiring 35 formed on the side wall 32 of the container 30 is provided so as to face the side wall 32 close to the side in the width direction of the crystal vibrating piece 47. The auxiliary wiring 43 formed on the resin member 42 is connected to the wiring 35 formed on the side wall 32 of the recess in the container 30. Further, a conductive adhesive 45 such as an Ag paste formed on the auxiliary wiring 43 is connected to the excitation electrode 46 of the crystal vibrating piece 47.

このように、対向する側壁３２に配線３５を設けて、樹脂部材４２上から補助配線４３にて接続しても良く、第２の実施形態と同様の効果を得ることができる。
（第２の実施形態の変形例２） As described above, the wiring 35 may be provided on the opposite side wall 32 and connected to the auxiliary wiring 43 from above the resin member 42, and the same effect as in the second embodiment can be obtained.
(Modification 2 of the second embodiment)

次に、第２の実施形態の変形例２について説明する。
図６は変形例２における水晶発振器の構成を示す模式断面図である。第２の実施形態と同じ構成部については同符号を付し、説明を省略する。
この変形例２の水晶発振器６は、収容器３０の凹部を形成する側壁３２の一面が凹部の上方に行くに従い開口面積を増大させるような斜面状に形成され、この斜面状の側壁３２に配線３６が形成されている。この点が第２の実施形態と異なる。そして、樹脂部材４２上に形成された補助配線４３が収容器３０における凹部の側壁３２に形成された配線３６に接続している。さらに、補助配線４３上に形成されたＡｇペーストなどの導電性接着剤４５が、水晶振動片４７の励振電極４６と接続されている。 Next, Modification 2 of the second embodiment will be described.
FIG. 6 is a schematic cross-sectional view showing the configuration of the crystal oscillator in the second modification. The same components as those of the second embodiment are denoted by the same reference numerals, and description thereof is omitted.
The crystal oscillator 6 of the second modified example is formed in a slope shape in which one surface of the side wall 32 forming the concave portion of the container 30 increases the opening area as it goes above the concave portion. 36 is formed. This point is different from the second embodiment. The auxiliary wiring 43 formed on the resin member 42 is connected to the wiring 36 formed on the side wall 32 of the recess in the container 30. Further, a conductive adhesive 45 such as an Ag paste formed on the auxiliary wiring 43 is connected to the excitation electrode 46 of the crystal vibrating piece 47.

このように、斜面状の側壁３２に配線３６が形成されていることから、樹脂部材４２上に補助配線４３を蒸着などで形成する際に、この補助配線４３と斜面状の側壁３２に形成された配線３６との境界部にまで蒸着することができ、補助配線４３と側壁３２に形成された配線３６とを確実に接続することができる。   Thus, since the wiring 36 is formed on the slope-shaped side wall 32, when the auxiliary wiring 43 is formed on the resin member 42 by vapor deposition or the like, it is formed on the auxiliary wiring 43 and the slope-shaped side wall 32. Therefore, the auxiliary wiring 43 and the wiring 36 formed on the side wall 32 can be reliably connected to each other.

なお、第２の実施形態およびその変形例１，２では補助電極上に導電性接着剤を配置したが、補助電極を含み側壁の電極にまで及んで導電性接着剤を配置して電気的接続を行っても良い。   In the second embodiment and its modifications 1 and 2, the conductive adhesive is arranged on the auxiliary electrode. However, the conductive adhesive is arranged to reach the electrode on the side wall including the auxiliary electrode for electrical connection. May be performed.

また、上記実施形態では圧電振動片として水晶振動片を用いて説明したが、水晶振動片に代えてタンタル酸リチウム（ＬｉＴａＯ3）またはニオブ酸リチウム（ＬｉＮｂＯ5）などの圧電材料で形成した振動片を利用しても良い。 Further, in the above embodiment, the description has been given using the quartz crystal vibrating piece as the piezoelectric vibrating piece. However, the vibrating piece formed of a piezoelectric material such as lithium tantalate (LiTaO 3 ) or lithium niobate (LiNbO 5 ) instead of the quartz crystal vibrating piece. May be used.

第１の実施形態における水晶発振器の構成を示す構成図であり、（ａ）は模式平面図、（ｂ）は、模式断面図。It is a block diagram which shows the structure of the crystal oscillator in 1st Embodiment, (a) is a schematic plan view, (b) is a schematic cross section. 第１の実施形態の変形例１を示す模式平面図。The schematic plan view which shows the modification 1 of 1st Embodiment. 第１の実施形態の変形例２を示す模式断面図。The schematic cross section which shows the modification 2 of 1st Embodiment. 第２の実施形態における水晶発振器の構成を示す構成図であり、（ａ）は模式平面図、（ｂ）は、模式断面図。It is a block diagram which shows the structure of the crystal oscillator in 2nd Embodiment, (a) is a schematic plan view, (b) is a schematic cross section. 第２の実施形態の変形例１を示す模式平面図。The schematic plan view which shows the modification 1 of 2nd Embodiment. 第２の実施形態の変形例２を示す模式断面図。The schematic cross section which shows the modification 2 of 2nd Embodiment.

符号の説明Explanation of symbols

１，２，３，４，５，６…水晶発振器、１０…収容器、１１…底壁、１２…側壁、１４，１５，１６…配線、２０…ＩＣチップ、２２…樹脂部材、２５…導電性接着剤、２６…励振電極、２７…水晶振動片、２８…蓋体、３０…収容器、３１…底壁、３２…側壁、３４，３５，３６…配線、４０…ＩＣチップ、４２…樹脂部材、４５…導電性接着剤、４６…励振電極、４７…水晶振動片、４８…蓋体、４３…補助配線。

1, 2, 3, 4, 5, 6 ... crystal oscillator, 10 ... container, 11 ... bottom wall, 12 ... side wall, 14, 15, 16 ... wiring, 20 ... IC chip, 22 ... resin member, 25 ... conductive Adhesive agent, 26 ... excitation electrode, 27 ... crystal vibrating piece, 28 ... lid, 30 ... container, 31 ... bottom wall, 32 ... side wall, 34,35,36 ... wiring, 40 ... IC chip, 42 ... resin 45, conductive adhesive, 46, excitation electrode, 47, crystal vibrating piece, 48, lid, 43, auxiliary wiring.

Claims (4)

底壁と側壁を有する凹部を備え、該凹部に配線が形成された収容器と、
前記収容器における前記凹部の底壁に固着され前記配線と接続されるＩＣチップと、
前記ＩＣチップを覆うように充填された樹脂部材と、
前記樹脂部材上に設けられた導電性接着剤と、
前記導電性接着剤に接続される励振電極が設けられた圧電振動片と、
前記収容器の上面に配置され前記凹部を気密に封止する蓋体と、を備え、
前記導電性接着剤が前記圧電振動片の励振電極と電気的に接続されるとともに、前記収容器における前記凹部の側壁に形成された前記配線と電気的に接続されていることを特徴とする圧電発振器。 A container having a recess having a bottom wall and a side wall, and wiring formed in the recess;
An IC chip fixed to the bottom wall of the recess in the container and connected to the wiring;
A resin member filled to cover the IC chip;
A conductive adhesive provided on the resin member;
A piezoelectric vibrating piece provided with an excitation electrode connected to the conductive adhesive;
A lid disposed on the upper surface of the container and hermetically sealing the recess,
The piezoelectric is characterized in that the conductive adhesive is electrically connected to an excitation electrode of the piezoelectric vibrating piece and is electrically connected to the wiring formed on the side wall of the recess in the container. Oscillator. 請求項１に記載の圧電発振器において、
前記導電性接着剤と接続される前記配線が形成された前記凹部の側壁が斜面状に形成されていることを特徴とする圧電発振器。 The piezoelectric oscillator according to claim 1,
A piezoelectric oscillator, wherein a side wall of the recess in which the wiring connected to the conductive adhesive is formed is formed in a slope shape. 底壁と側壁を有する凹部を備え、該凹部に配線が形成された収容器と、
前記収容器における前記凹部の底壁に固着され前記配線と接続されるＩＣチップと、
前記ＩＣチップを覆うように充填された樹脂部材と、
前記樹脂部材上に形成され前記収容器における前記凹部の側壁に形成された前記配線に接続される補助配線と、
前記補助配線上に設けられた導電性接着剤と、
前記導電性接着剤に接続される励振電極が設けられた圧電振動片と、
前記収容器の上面に配置され前記凹部を気密に封止する蓋体と、を備え、
前記導電性接着剤が前記圧電振動片の励振電極と電気的に接続されるとともに、前記補助配線と電気的に接続されていることを特徴とする圧電発振器。 A container having a recess having a bottom wall and a side wall, and wiring formed in the recess;
An IC chip fixed to the bottom wall of the recess in the container and connected to the wiring;
A resin member filled to cover the IC chip;
An auxiliary wiring connected to the wiring formed on the resin member and formed on the side wall of the recess in the container;
A conductive adhesive provided on the auxiliary wiring;
A piezoelectric vibrating piece provided with an excitation electrode connected to the conductive adhesive;
A lid disposed on the upper surface of the container and hermetically sealing the recess,
The piezoelectric oscillator, wherein the conductive adhesive is electrically connected to the excitation electrode of the piezoelectric vibrating piece and is electrically connected to the auxiliary wiring. 請求項３に記載の圧電発振器において、
前記導電性接着剤と接続される前記配線が形成された前記凹部の側壁が斜面状に形成されていることを特徴とする圧電発振器。

The piezoelectric oscillator according to claim 3, wherein
A piezoelectric oscillator, wherein a side wall of the recess in which the wiring connected to the conductive adhesive is formed is formed in a slope shape.

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012075053A (en) * 2010-09-30 2012-04-12 Seiko Instruments Inc Package and piezoelectric vibrator

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62198717U (en) * 1986-06-10 1987-12-17
JP2003031954A (en) * 2001-07-16 2003-01-31 Hitachi Aic Inc Electronic component built-in type multilayer board and manufacturing method therefor
JP2005102145A (en) * 2003-08-20 2005-04-14 Nippon Dempa Kogyo Co Ltd Surface mount crystal oscillator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62198717U (en) * 1986-06-10 1987-12-17
JP2003031954A (en) * 2001-07-16 2003-01-31 Hitachi Aic Inc Electronic component built-in type multilayer board and manufacturing method therefor
JP2005102145A (en) * 2003-08-20 2005-04-14 Nippon Dempa Kogyo Co Ltd Surface mount crystal oscillator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012075053A (en) * 2010-09-30 2012-04-12 Seiko Instruments Inc Package and piezoelectric vibrator

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