JP2007250902A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2007250902A5 JP2007250902A5 JP2006073375A JP2006073375A JP2007250902A5 JP 2007250902 A5 JP2007250902 A5 JP 2007250902A5 JP 2006073375 A JP2006073375 A JP 2006073375A JP 2006073375 A JP2006073375 A JP 2006073375A JP 2007250902 A5 JP2007250902 A5 JP 2007250902A5
- Authority
- JP
- Japan
- Prior art keywords
- processing result
- substrate
- data
- processing
- moving average
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (26)
前記被処理基板の処理ごとに得られる運転データとその被処理基板の状態を測定して得られる処理結果データを収集するデータ収集工程と，
前記データ収集工程にて収集した前記処理結果データを用いて，予め設定されたデータ数の移動平均を求めて移動平均処理結果データを得る移動平均処理工程と，
前記データ収集工程にて収集した前記運転データと前記移動平均処理工程にて得た前記移動平均処理結果データを用いて多変量解析を行い，前記運転データと前記移動平均処理結果データとの相関関係を求める解析工程と，
前記解析工程にて求めた前記相関関係に基づいて，この相関関係を求めたときの被処理基板以外の被処理基板を処理した際に得られる運転データから処理結果を予測する予測工程と，
を有すること特徴とする基板処理装置の処理結果の予測方法。 A method for predicting a processing result from operation data of the substrate processing apparatus in a process of processing a substrate to be processed in a processing chamber of the substrate processing apparatus,
A data collection step for collecting operation data obtained for each processing of the substrate to be processed and processing result data obtained by measuring the state of the substrate to be processed;
Using the processing result data collected in the data collection step, a moving average processing step of obtaining a moving average processing result data by obtaining a moving average of a preset number of data;
Multivariate analysis is performed using the operation data collected in the data collection step and the moving average processing result data obtained in the moving average processing step, and a correlation between the operation data and the moving average processing result data An analysis process for obtaining
Based on the correlation obtained in the analysis step, a prediction step for predicting a processing result from operation data obtained when processing a substrate to be processed other than the substrate to be processed when the correlation is obtained;
A method for predicting a processing result of a substrate processing apparatus, comprising:
前記グループごとに，そのグループに属する処理結果データのみを用いて，予め設定されたデータ数の移動平均を求めて移動平均処理結果データを得ることを特徴とする請求項１に記載の基板処理装置の処理結果の予測方法。 In the moving average processing step, when the processing result data includes processing result data before and after maintenance of the substrate processing apparatus, the processing result data is grouped into sections divided by the maintenance,
2. The substrate processing apparatus according to claim 1, wherein, for each group, the moving average processing result data is obtained by obtaining a moving average of a preset number of data using only the processing result data belonging to the group. Method of predicting the processing result .
前記着目する処理結果データ以前のデータ数が前記予め設定されたデータ数になるまでは，前記着目する処理結果データ以前のすべての処理結果データを用いて平均値を求め，その平均値を前記着目する処理結果データに対応する移動平均処理結果データとし，
前記着目する処理結果データ以前のデータ数が前記予め設定されたデータ数以上になると，前記着目する処理結果データ以前の直近の処理結果データを前記予め設定されたデータ数だけ用いてこれらのデータの平均値を求め，その平均値を前記着目する処理結果データに対応する移動平均処理結果データとすることを特徴とする請求項３に記載の基板処理装置の処理結果の予測方法。 The moving average processing step includes
Until the number of data before the target processing result data reaches the preset number of data, an average value is obtained using all the processing result data before the target processing result data, and the average value is calculated as the target value. The moving average processing result data corresponding to the processing result data to be
When the number of data before the target processing result data is equal to or greater than the preset number of data, the most recent processing result data before the target processing result data is used by the preset number of data. 4. The method for predicting a processing result of a substrate processing apparatus according to claim 3, wherein an average value is obtained and the average value is used as moving average processing result data corresponding to the processing result data of interest.
前記上限予測誤差範囲の下限の閾値と，前記上限予測誤差範囲の上限の閾値とで挟まれる範囲を予測許容範囲としたときに，前記予測工程にて得られた前記被処理基板の状態の予測値が，前記予測許容範囲内にある場合は，前記被処理基板の状態は正常であると判断し，
前記予測値が前記予測許容範囲を外れていても，前記上限予測誤差範囲又は前記下限予測誤差範囲に含まれる場合には，前記被処理基板の状態は前記被処理基板を測定して得られるその実測値に基づいて判断し，
前記予測値が前記予測許容範囲を外れており，さらに前記上限予測誤差範囲又は前記下限予測誤差範囲からも外れている場合は，前記被処理基板の状態は正常でないと判断することを特徴とする請求項１〜７のいずれかに記載の基板処理装置の処理結果の予測方法。 In order to manage the processing result, a management value range set with a constant width around the target value of the processing result, and an upper limit prediction error range set with a constant width around the upper limit threshold of the management value range And a lower limit prediction error range set with a constant width around the lower limit threshold of the control value range,
Prediction of the state of the substrate to be processed obtained in the prediction step when a range between the lower limit threshold of the upper limit prediction error range and the upper limit threshold of the upper limit prediction error range is a prediction allowable range When the value is within the predicted allowable range, it is determined that the state of the substrate to be processed is normal,
Even if the predicted value is out of the prediction allowable range, if it is included in the upper limit prediction error range or the lower limit prediction error range, the state of the substrate to be processed is obtained by measuring the substrate to be processed. Judgment based on actual measurements,
When the predicted value is out of the prediction allowable range and further out of the upper limit prediction error range or the lower limit prediction error range, it is determined that the state of the substrate to be processed is not normal. A method for predicting a processing result of the substrate processing apparatus according to claim 1.
前記被処理基板の処理ごとに得られる運転データとその被処理基板の状態を測定して得られる処理結果データを収集するデータ収集手段と，
前記データ収集手段が収集した前記処理結果データを用いて，予め設定されたデータ数の移動平均を求めて移動平均処理結果データを得る移動平均処理手段と，
前記データ収集手段が収集した前記運転データと前記移動平均処理手段が得た前記移動平均処理結果データを用いて多変量解析を行い，前記運転データと前記移動平均処理結果データとの相関関係を求める解析手段と，
前記解析手段が求めた前記相関関係に基づいて，この相関関係を求めたときの被処理基板以外の被処理基板を処理した際に得られる運転データから処理結果を予測する予測手段と，
を有すること特徴とする基板処理装置の処理結果の予測装置。 A prediction device for predicting a processing result from operation data of the substrate processing apparatus in a process of processing a substrate to be processed in a processing chamber of the substrate processing apparatus,
Data collection means for collecting operation data obtained for each processing of the substrate to be processed and processing result data obtained by measuring the state of the substrate to be processed;
Using the processing result data collected by the data collection means, moving average processing means for obtaining a moving average processing result data by obtaining a moving average of a preset number of data;
A multivariate analysis is performed using the driving data collected by the data collecting means and the moving average processing result data obtained by the moving average processing means, and a correlation between the driving data and the moving average processing result data is obtained. Analysis means;
A predicting means for predicting a processing result from operation data obtained when processing a substrate to be processed other than the substrate to be processed when the correlation is obtained based on the correlation obtained by the analyzing means;
An apparatus for predicting a processing result of a substrate processing apparatus, comprising:
前記グループごとに，そのグループに属する処理結果データのみを用いて，予め設定されたデータ数の移動平均を求めて移動平均処理結果データを得ることを特徴とする請求項１４に記載の基板処理装置の処理結果の予測装置。 The moving average processing means, when the processing result data includes processing result data before and after maintenance of the substrate processing apparatus, groups the processing result data into sections divided by the maintenance;
15. The substrate processing apparatus according to claim 14, wherein, for each group, using only processing result data belonging to the group, a moving average of a preset number of data is obtained to obtain moving average processing result data. Processing result prediction device.
前記着目する処理結果データ以前のデータ数が前記予め設定されたデータ数になるまでは，前記着目する処理結果データ以前のすべての処理結果データを用いて平均値を求め，その平均値を前記着目する処理結果データに対応する移動平均処理結果データとし，
前記着目する処理結果データ以前のデータ数が前記予め設定されたデータ数以上になると，前記着目する処理結果データ以前の直近の処理結果データを前記予め設定されたデータ数だけ用いてこれらのデータの平均値を求め，その平均値を前記着目する処理結果データに対応する移動平均処理結果データとすることを特徴とする請求項１６に記載の基板処理装置の処理結果の予測装置。 The moving average processing means includes
Until the number of data before the target processing result data reaches the preset number of data, an average value is obtained using all the processing result data before the target processing result data, and the average value is calculated as the target value. The moving average processing result data corresponding to the processing result data to be
When the number of data before the target processing result data is equal to or greater than the preset number of data, the most recent processing result data before the target processing result data is used as many as the preset number of data. 17. The apparatus for predicting a processing result of a substrate processing apparatus according to claim 16, wherein an average value is obtained and the average value is used as moving average processing result data corresponding to the processing result data of interest.
前記上限予測誤差範囲の下限の閾値と，前記上限予測誤差範囲の上限の閾値とで挟まれる範囲を予測許容範囲としたときに，前記予測工程にて得られた前記被処理基板の状態の予測値が，前記予測許容範囲内にある場合は，前記被処理基板の状態は正常であると判断し，
前記予測値が前記予測許容範囲を外れていても，前記上限予測誤差範囲又は前記下限予測誤差範囲に含まれる場合には，前記被処理基板の状態は前記被処理基板を測定して得られるその実測値に基づいて判断し，
前記予測値が前記予測許容範囲を外れており，さらに前記上限予測誤差範囲又は前記下限予測誤差範囲からも外れている場合は，前記被処理基板の状態は正常でないと判断することを特徴とする請求項１４〜２０のいずれかに記載の基板処理装置の処理結果の予測装置。 In order to manage the processing result, a management value range set with a constant width around the target value of the processing result, and an upper limit prediction error range set with a constant width around the upper limit threshold of the management value range And a lower limit prediction error range set with a constant width around the lower limit threshold of the control value range,
Prediction of the state of the substrate to be processed obtained in the prediction step when a range between the lower limit threshold of the upper limit prediction error range and the upper limit threshold of the upper limit prediction error range is a prediction allowable range When the value is within the predicted allowable range, it is determined that the state of the substrate to be processed is normal,
Even if the predicted value is out of the prediction allowable range, if it is included in the upper limit prediction error range or the lower limit prediction error range, the state of the substrate to be processed is obtained by measuring the substrate to be processed. Judgment based on actual measurements,
When the predicted value is out of the prediction allowable range and further out of the upper limit prediction error range or the lower limit prediction error range, it is determined that the state of the substrate to be processed is not normal. 21. A processing result prediction apparatus for a substrate processing apparatus according to claim 14.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006073375A JP4675266B2 (en) | 2006-03-16 | 2006-03-16 | Prediction method and prediction apparatus for processing result of substrate processing apparatus |
| US11/684,298 US7630064B2 (en) | 2006-03-16 | 2007-03-09 | Prediction method and apparatus for substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006073375A JP4675266B2 (en) | 2006-03-16 | 2006-03-16 | Prediction method and prediction apparatus for processing result of substrate processing apparatus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007250902A JP2007250902A (en) | 2007-09-27 |
| JP2007250902A5 true JP2007250902A5 (en) | 2009-03-05 |
| JP4675266B2 JP4675266B2 (en) | 2011-04-20 |
Family
ID=38594862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006073375A Expired - Fee Related JP4675266B2 (en) | 2006-03-16 | 2006-03-16 | Prediction method and prediction apparatus for processing result of substrate processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4675266B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7967995B2 (en) * | 2008-03-31 | 2011-06-28 | Tokyo Electron Limited | Multi-layer/multi-input/multi-output (MLMIMO) models and method for using |
| JP6643202B2 (en) | 2016-07-21 | 2020-02-12 | 株式会社日立ハイテクノロジーズ | Plasma processing apparatus and analysis method for analyzing plasma processing data |
| JP6875224B2 (en) * | 2017-08-08 | 2021-05-19 | 株式会社日立ハイテク | Plasma processing equipment and semiconductor equipment manufacturing system |
| JP7038563B2 (en) * | 2018-02-15 | 2022-03-18 | 東京エレクトロン株式会社 | Board processing equipment, flow control method and flow control program |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3630931B2 (en) * | 1996-08-29 | 2005-03-23 | 富士通株式会社 | Plasma processing apparatus, process monitoring method, and semiconductor device manufacturing method |
| JP4365109B2 (en) * | 2003-01-29 | 2009-11-18 | 株式会社日立ハイテクノロジーズ | Plasma processing equipment |
| JP2005033090A (en) * | 2003-07-10 | 2005-02-03 | Sharp Corp | Device status discrimination system and manufacturing process stabilization system in manufacturing process |
-
2006
- 2006-03-16 JP JP2006073375A patent/JP4675266B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102699302B (en) | Bleed-out forecasting system and forecasting method of slab continuous casting crystallizer | |
| JP2017532049A5 (en) | ||
| JP5840342B2 (en) | Insulation degradation diagnosis method for insulation materials | |
| CN108956111B (en) | Abnormal state detection method and detection system for mechanical part | |
| CN103439342A (en) | Infrared nondestructive testing method based on thermal image time sequence characteristics | |
| CN113986630A (en) | Touch performance test method and system of touch screen | |
| JP2013018482A5 (en) | ||
| CN104181883A (en) | Method for processing abnormal data of real-time data acquisition system in real time | |
| RU2542869C2 (en) | System, method and device to measure and transmit working conditions of electrolytic cell | |
| CN107843426A (en) | The monitoring method and monitoring device of bearing residual life | |
| CN108760546A (en) | A kind of fatigue crack growth rate measurement method based on Infrared Thermography Technology | |
| CN106844901B (en) | Structural part residual strength evaluation method based on multi-factor fusion correction | |
| CN106500754A (en) | The detection method of sensor and the detection means of sensor | |
| CN114965924A (en) | Sewage pollutant concentration detection system | |
| JP2009187175A (en) | Analysis device of batch process data, and abnormality detection/quality estimation device using the same | |
| JP2008224638A5 (en) | ||
| JP2007250902A5 (en) | ||
| JP2010231338A (en) | Apparatus and method for analyzing factor | |
| CN103228763B (en) | Coke oven monitoring method, and monitoring system | |
| CN116839681A (en) | Multi-sensor-based asphalt stirring equipment monitoring method and system | |
| CN105158147B (en) | A kind of device and method for being used to test sealing ring material aging | |
| TWI628021B (en) | Method for extracting intelligent features for predicting precision of electrical discharge machine and predicting method | |
| CN117574176A (en) | BIPV photovoltaic glass production process optimization method | |
| KR101886210B1 (en) | Measuring instrument reliability evaluation apparatus and operating method thereof | |
| JP2009076772A (en) | Process monitoring method |