JP2007243378A5 - - Google Patents

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JP2007243378A5
JP2007243378A5 JP2006060561A JP2006060561A JP2007243378A5 JP 2007243378 A5 JP2007243378 A5 JP 2007243378A5 JP 2006060561 A JP2006060561 A JP 2006060561A JP 2006060561 A JP2006060561 A JP 2006060561A JP 2007243378 A5 JP2007243378 A5 JP 2007243378A5
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piezoelectric
piezoelectric vibrator
lower substrates
manufacturing
frame
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JP4978030B2 (en
JP2007243378A (en
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両主面に励振電極が設けられた圧電振動片と枠体が一体に形成された中間圧電板と、前記中間圧電板の上面及び下面にそれぞれ接合される上側及び下側基板とを有し、
前記中間圧電板と前記上側及び下側基板とにより画定されるキャビティ内に前記圧電振動片が保持され、
前記上側及び下側基板と前記中間圧電板と互いに気密に接合され、
前記各励振電極は、前記枠体に設けられる前記上側及び下側基板との接続部に引き出し電極を介してそれぞれ接続され、
前記上側及び下側基板それぞれの前記接続部と対応する位置に、前記上側及び下側基板の少なくともいずれか一方に設けられた外部接続端子と電気的に接続された基板スルーホールが設けられ、各基板スルーホールのそれぞれに導電接合材を埋設することにより前記各励振電極と前記外部接続端子とが導通される構造の圧電振動子であって、
前記枠体の各接続部が、前記枠体を貫通して形成された枠体スルーホールによって反対側に形成された前記励振電極と導通することを特徴とする圧電振動子。
A piezoelectric vibrating piece provided with excitation electrodes on both main surfaces, an intermediate piezoelectric plate integrally formed with a frame, and upper and lower substrates respectively joined to the upper surface and the lower surface of the intermediate piezoelectric plate;
The piezoelectric vibrating piece is held in a cavity defined by the intermediate piezoelectric plate and the upper and lower substrates,
Wherein said upper and lower substrates and the intermediate piezoelectric plate is bonded to the gas-tight manner to each other,
Each of the excitation electrodes is connected to a connection portion with the upper and lower substrates provided in the frame body via an extraction electrode, respectively.
Substrate through holes electrically connected to external connection terminals provided on at least one of the upper and lower substrates are provided at positions corresponding to the connection portions of the upper and lower substrates, respectively. A piezoelectric vibrator having a structure in which each excitation electrode and the external connection terminal are electrically connected by embedding a conductive bonding material in each of the substrate through holes,
Each connection part of the said frame is connected with the said excitation electrode formed in the other side by the frame through-hole formed through the said frame, The piezoelectric vibrator characterized by the above-mentioned.
両主面に励振電極が設けられた圧電振動片と枠体とが一体に形成された中間圧電板と、
前記中間圧電板の上面及び下面にそれぞれ接合される上側及び下側基板とを有し、
前記中間圧電板と前記上側及び下側基板とにより画定されるキャビティ内に前記圧電振動片が保持され、
前記上側及び下側基板と前記中間圧電板と互いに気密に接合され、
前記各励振電極は、前記枠体に設けられる前記上側及び下側基板のいずれかとの接続部に引き出し電極を介してそれぞれ接続され、
前記上側及び下側基板の少なくとも一方の前記接続部と対応する位置に、前記上側及び下側基板の少なくとも一方に設けられた外部接続端子と電気的に接続された基板スルーホールが設けられ、
前記基板スルーホールに導電接合材を埋設することにより前記各励振電極と前記外部接続端子とが導通される構造の圧電振動子であって、
前記枠体の一方の前記接続部が、前記枠体を貫通して形成された枠体スルーホールによって反対側に形成された一方の前記励振電極と導通し、他方の前記接続部は、前記枠体を貫通して形成された偶数個の枠体スルーホールを往復することにより他方の前記励振電極側と導通することを特徴とする圧電振動子。
An intermediate piezoelectric plate in which a piezoelectric vibrating piece provided with excitation electrodes on both main surfaces and a frame are integrally formed;
An upper and lower substrate respectively bonded to the upper and lower surfaces of the intermediate piezoelectric plate;
The piezoelectric vibrating piece is held in a cavity defined by the intermediate piezoelectric plate and the upper and lower substrates,
Wherein the upper and lower substrates and the intermediate piezoelectric plate is joined hermetically to each other,
Each of the excitation electrodes is connected to a connection portion with any one of the upper and lower substrates provided on the frame via an extraction electrode,
A substrate through hole electrically connected to an external connection terminal provided in at least one of the upper and lower substrates is provided at a position corresponding to the connection portion of at least one of the upper and lower substrates,
A piezoelectric vibrator having a structure in which each excitation electrode and the external connection terminal are electrically connected by embedding a conductive bonding material in the substrate through-hole,
One of the connection portions of the frame body is electrically connected to one of the excitation electrodes formed on the opposite side by a frame body through-hole formed through the frame body, and the other connection portion is connected to the frame A piezoelectric vibrator characterized in that it is electrically connected to the other excitation electrode side by reciprocating through an even number of through holes formed through the body.
請求項1または2に記載の圧電振動子において、
前記中間圧電板と、上側及び下側基板が水晶からなることを特徴とする圧電振動子。
The piezoelectric vibrator according to claim 1 or 2,
The piezoelectric vibrator, wherein the intermediate piezoelectric plate and the upper and lower substrates are made of quartz.
請求項1または2に記載の圧電振動子において、
前記上側及び下側基板がガラス材料またはシリコンからなることを特徴とする圧電振動子。
The piezoelectric vibrator according to claim 1 or 2,
The piezoelectric vibrator characterized in that the upper and lower substrates are made of glass material or silicon.
枠体と一体に形成された圧電振動片の上面及び下面のそれぞれに励振電極を形成し、前記枠体に各励振電極に接続する引き出し電極をそれぞれ形成し、各引き出し電極から前記枠体を貫通する枠体スルーホールをそれぞれ形成し、この枠体スルーホールを介して前記引き出し電極に接続する接続部をそれぞれ形成して中間圧電板を形成する工程と、
前記中間圧電板の上面側に設けられた前記接合部と対応する基板スルーホールを形成して、前記中間圧電板の上面に接合される上側基板を形成する工程と、
前記中間圧電板の下面側に設けられた前記接合部と対応する基板スルーホールを形成して、前記中間圧電板の下面側に接合する下側基板を形成する工程と、
記中間圧電板と前記上側及び下側基板とを、それらにより画定されるキャビティ内に前記圧電振動片が保持されるように重ね合わせ、それらを加圧して気密に接合する工程と、
前記上側及び下側基板の各基板スルーホールに導電接合材を埋設する工程と、を有することを特徴とする圧電振動子の製造方法。
Excitation electrodes are formed on each of the upper and lower surfaces of the piezoelectric vibrating piece formed integrally with the frame, and extraction electrodes connected to the respective excitation electrodes are formed on the frame, and the frame is penetrated from each extraction electrode. Forming each frame through-hole, and forming an intermediate piezoelectric plate by forming each connection portion connected to the extraction electrode through the frame through-hole;
Forming a substrate through hole corresponding to the bonding portion provided on the upper surface side of the intermediate piezoelectric plate, and forming an upper substrate bonded to the upper surface of the intermediate piezoelectric plate;
Forming a substrate through hole corresponding to the bonding portion provided on the lower surface side of the intermediate piezoelectric plate, and forming a lower substrate bonded to the lower surface side of the intermediate piezoelectric plate ;
And said upper and lower substrates before and Symbol intermediate piezoelectric plate, wherein the cavity defined by their superposition to the piezoelectric vibrating piece is held, and bonding the airtight pressurized them,
And a step of embedding a conductive bonding material in each substrate through hole of the upper and lower substrates.
請求項5に記載の圧電振動子の製造方法において、
複数の前記中間圧電板を有する中間圧電ウェハを形成する工程と、
複数の前記上側基板を前記中間圧電ウェハの中間圧電板に対応させて配設した上側ウェハを形成する工程と、
複数の前記下側基板を前記中間圧電ウェハの中間圧電板に対応させて配設した下側ウェハを形成する工程と、
記中間圧電ウェハの上下面に前記上側及び下側ウェハを重ね合わせ、それらを加圧して一体に接合してウェハ積層体とする工程と、
前記上側及び下側ウェハの各スルーホールに導電接合材を埋設する工程と、
前記ウェハ積層体を切断して圧電振動子を個片化する工程と、を有することを特徴とする圧電振動子の製造方法。
In the manufacturing method of the piezoelectric vibrator according to claim 5,
Forming an intermediate piezoelectric wafer having a plurality of said intermediate piezoelectric plates;
Forming an upper wafer in which a plurality of the upper substrates are arranged corresponding to the intermediate piezoelectric plates of the intermediate piezoelectric wafer;
Forming a lower wafer in which a plurality of the lower substrates are arranged corresponding to the intermediate piezoelectric plate of the intermediate piezoelectric wafer ;
Before SL superposing the upper and lower web wafer on the upper and lower surfaces of the intermediate piezoelectric wafer, a step of a wafer laminated body are bonded to one body by pressurizing them,
Burying a conductive bonding material in each through hole of the upper and lower wafers;
And a step of cutting the wafer laminate to divide the piezoelectric vibrator into individual pieces.
請求項5または6に記載の圧電振動子の製造方法において、
前記上側及び下側基板を形成するそれぞれの工程に、前記上側及び下側基板のそれぞれに設けたスルーホールに前記導電接合材を埋設する工程を含むことを特徴とする圧電振動子の製造方法。
In the manufacturing method of the piezoelectric vibrator according to claim 5 or 6,
A method of manufacturing a piezoelectric vibrator, wherein each step of forming the upper and lower substrates includes a step of burying the conductive bonding material in a through hole provided in each of the upper and lower substrates.
請求項5〜7のいずれか一項に記載の圧電振動子の製造方法において、
前記プラズマ処理が、CF4、Ar、またはN2ガスを用いて、酸素不介在の雰囲気内で行われることを特徴とする圧電振動子の製造方法。
In the manufacturing method of the piezoelectric vibrator according to any one of claims 5 to 7,
A method for manufacturing a piezoelectric vibrator, wherein the plasma treatment is performed in an oxygen-free atmosphere using CF 4, Ar, or N 2 gas.
請求項5〜7のいずれか一項に記載の圧電振動子の製造方法において、
前記プラズマ処理が、O2ガス、CF4とO2との混合ガス、またはN2とO2との混合ガスを用いて、酸素介在の雰囲気内で行われることを特徴とする圧電振動子の製造方法。
In the manufacturing method of the piezoelectric vibrator according to any one of claims 5 to 7,
A method of manufacturing a piezoelectric vibrator, wherein the plasma treatment is performed in an oxygen-mediated atmosphere using an O2 gas, a mixed gas of CF4 and O2, or a mixed gas of N2 and O2.
請求項5〜9のいずれか一項に記載の圧電振動子の製造方法において、
前記中間圧電板の上下面に上側及び下側基板を重ね合わせ、常温で加圧して気密に接合することを特徴とする圧電振動子の製造方法。
In the manufacturing method of the piezoelectric vibrator according to any one of claims 5 to 9,
A method of manufacturing a piezoelectric vibrator, comprising: superposing upper and lower substrates on the upper and lower surfaces of the intermediate piezoelectric plate and pressurizing at an ordinary temperature for airtight bonding.
請求項5〜9のいずれか一項に記載の圧電振動子の製造方法において、
前記中間圧電板の上下面に上側及び下側基板を重ね合わせ、加熱した状態で加圧して気密に接合することを特徴とする圧電振動子の製造方法。
In the manufacturing method of the piezoelectric vibrator according to any one of claims 5 to 9,
A method of manufacturing a piezoelectric vibrator, wherein upper and lower substrates are superposed on the upper and lower surfaces of the intermediate piezoelectric plate, and are heated and pressed in an airtight manner.
請求項5〜11のいずれか一項に記載の圧電振動子の製造方法において、
前記中間圧電板の上下面に上側及び下側基板を重ね合わせ、N2雰囲気で加圧して気密に接合することを特徴とする圧電振動子の製造方法。
In the manufacturing method of the piezoelectric vibrator according to any one of claims 5 to 11,
A method of manufacturing a piezoelectric vibrator, comprising: superposing upper and lower substrates on the upper and lower surfaces of the intermediate piezoelectric plate, and pressurizing in an N2 atmosphere for airtight bonding.
請求項5〜11のいずれか一項に記載の圧電振動子の製造方法において、
前記中間圧電板の上下面に上側及び下側基板を重ね合わせ、減圧雰囲気で加圧して気密に接合することを特徴とする圧電振動子の製造方法。
In the manufacturing method of the piezoelectric vibrator according to any one of claims 5 to 11,
A method of manufacturing a piezoelectric vibrator, comprising: superposing upper and lower substrates on the upper and lower surfaces of the intermediate piezoelectric plate, and pressurizing in a reduced pressure atmosphere to airtightly bond.
請求項5〜13のいずれか一項に記載の圧電振動子の製造方法において、
前記中間圧電板の上下面に上側及び下側基板を重ね合わせて仮接合した後、それにより一体化された積層体の上下面を加圧して気密に接合することを特徴とする圧電振動子の製造方法。
In the manufacturing method of the piezoelectric vibrator according to any one of claims 5 to 13,
The upper and lower substrates are superposed on the upper and lower surfaces of the intermediate piezoelectric plate and temporarily bonded, and then the upper and lower surfaces of the integrated laminate are pressed and airtightly bonded. Production method.
JP2006060561A 2006-03-07 2006-03-07 Piezoelectric device Expired - Fee Related JP4978030B2 (en)

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JP2011095918A Division JP2011151857A (en) 2011-04-22 2011-04-22 Piezoelectric vibrator, electronic device, and electronic equipment
JP2011196493A Division JP5408213B2 (en) 2011-09-08 2011-09-08 Vibrator

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