JP2007234941A - Electronic device, rack therefor, humidifier therefor, and humidification method therein - Google Patents

Electronic device, rack therefor, humidifier therefor, and humidification method therein Download PDF

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JP2007234941A
JP2007234941A JP2006056042A JP2006056042A JP2007234941A JP 2007234941 A JP2007234941 A JP 2007234941A JP 2006056042 A JP2006056042 A JP 2006056042A JP 2006056042 A JP2006056042 A JP 2006056042A JP 2007234941 A JP2007234941 A JP 2007234941A
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electronic device
water
rack
absorbing member
humidity
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Kazuhiro Yoshinaga
和弘 吉永
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NEC Corp
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NEC Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a rack for electronic device, the electronic device, and a humidifier for the electronic device, wherein a humidity environment is obtained in response to individual electronic devices. <P>SOLUTION: A water absorption member 8 such as urethane, an unwoven cloth or the like, suitable for evaporating water with good water absorption properties, is equipped in a rack 1 for the electronic device having a box shape which receives a server 2 or a case of the server 2 so as to be disposed on the upstream side of ventilation. The water absorption member 8 is impregnated with water to humidify it by evaporation according to heat generation of the server 2. Further, the humidifier for the electronic device is configured to contain a humidity sensor for detecting a humidity, the water absorption member impregnated with water, and a water supplier for supplying water to the water absorption member based on a detection of the humidity sensor. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、電子機器用ラック、電子機器、電子機器用加湿装置、電子機器における加湿方法に関する。   The present invention relates to an electronic device rack, an electronic device, a humidifying device for an electronic device, and a humidifying method in the electronic device.

サーバー等の発熱の大きい電子機器は、安全に運用するために温度及び湿度の管理が重要であるが、従来のサーバー等の電子機器は、温度管理にのみ着目しており、さまざまな冷却手段が提案されている。   Management of temperature and humidity is important for safe operation of electronic devices such as servers. However, conventional electronic devices such as servers focus only on temperature management, and various cooling means are available. Proposed.

例えば、熱交換ユニットと、該熱交換ユニットに熱的に接続され、電子装置の熱伝達インターフェースに配設された少なくとも１つの冷却インターフェースと、熱交換ユニットからの熱を電子装置から離れた遠隔位置に排気するよう熱交換ユニットに熱的に接続された熱排気管とを備えた電子装置冷却システムがある。この電子装置冷却システムによれば、電子装置の配置場所を限定することなく使用可能な電子装置冷却システムが提供できる、としている（例えば特許文献１参照）。   For example, a heat exchange unit, at least one cooling interface thermally connected to the heat exchange unit and disposed in a heat transfer interface of the electronic device, and a remote location away from the electronic device for heat from the heat exchange unit There is an electronic device cooling system comprising a heat exhaust pipe thermally connected to the heat exchange unit for exhaust. According to this electronic device cooling system, an electronic device cooling system that can be used without limiting the location of the electronic device can be provided (see, for example, Patent Document 1).

また、他の例として、箱体の前面及び背面に扉を設け、天井板には換気扇を設け、少なくとも前面扉は、前面扉を閉じた際に複数の収納部に収納された電子機器と前面扉との間に冷却用空気通路となる空間を形成する張出部を有し、換気扇を駆動することにより冷却用空気通路介して冷却用空気を通流させ、前記電子機器に冷却用空気を供給する電子機器用収納用ラックがある。この電子機器用収納用ラックによれば、ラックに搭載される電子機器の奥行の長さに係わらず、搭載された各電子機器に冷却用空気を供給することが可能、としている（例えば特許文献２参照）。   As another example, doors are provided on the front and back of the box body, ventilation fans are provided on the ceiling plate, and at least the front door is connected to the electronic device housed in a plurality of housing portions when the front door is closed. It has an overhang part that forms a space to be a cooling air passage between the door and the cooling fan by driving the ventilation fan to allow the cooling air to flow through the electronic device. There is a storage rack for electronic equipment to be supplied. According to this electronic device storage rack, it is possible to supply cooling air to each mounted electronic device regardless of the depth of the electronic device mounted on the rack (for example, Patent Documents). 2).

このように、従来のサーバー等の電子機器や、電子機器を収納させる箱状のラックは、上記したように、温度管理、すなわち、冷却にのみ着目をしており、湿度の管理としては、電子機器が設置される部屋全体を専用の加湿器で行っていた。   Thus, as described above, conventional electronic devices such as servers and box-shaped racks that store electronic devices focus only on temperature management, that is, cooling. The entire room where the equipment was installed was performed with a dedicated humidifier.

特開２００５−６３４３４公報（第１頁、図１）Japanese Patent Laying-Open No. 2005-63434 (first page, FIG. 1) 特開２００４−３９６７５公報（第１頁、図１）JP 2004-39675 A (first page, FIG. 1)

しかしながら、サーバー等の電子機器が設置された部屋全体を加湿してしまうと、発熱の異なる電子機器が混在して設置してある場合、発熱が小さい装置においては結露してしまう危険性がある。   However, if the entire room in which electronic devices such as servers are installed is humidified, there is a risk that condensation occurs in an apparatus that generates little heat when electronic devices with different heat generation are installed together.

一方、発熱が大きい電子機器においては、温度上昇により機器内の内飽和水蒸気量が低下し、湿度が低くなりすぎる危険性がある。   On the other hand, in an electronic device that generates a large amount of heat, there is a risk that the amount of saturated water vapor in the device decreases due to temperature rise, and the humidity becomes too low.

そこで本発明は、このような状況に鑑みてなされたものであり、上記問題点を解決できる電子機器用ラック、電子機器、電子機器用加湿装置、電子機器における加湿方法を提供することを目的とする。   Then, this invention is made | formed in view of such a condition, and it aims at providing the humidification method in the rack for electronic devices, the electronic device, the humidifier for electronic devices, and an electronic device which can solve the said problem. To do.

上記技術課題を達成するために、本発明にかかる電子機器用ラック、電子機器、電子機器用加湿装置、電子機器における加湿方法は、下記の技術的手段を講じた。
すなわち、請求項１にかかる電子機器用ラックは、箱体状に形成され電子機器を収納させる電子機器用ラックであって、水が含浸される吸水部材が内装されてなることを特徴とする。
請求項２にかかる電子機器用ラックは、請求項１において、前記電子機器は、外部と連通する通気孔が設けられてなり、前記吸水部材は、前記通気孔近傍の当該電子機器用ラックを構成する壁面に配設されることを特徴とする。
請求項３にかかる電子機器は、筐体を備えた電子機器であって、水が含浸される吸水部材が前記筐体に内装されてなることを特徴とする。
請求項４にかかる電子機器は、請求項３において、前記電子機器は、外部と連通する通気孔が設けられてなり、前記吸水部材は、前記通気孔近傍に配設されることを特徴とする。
請求項５にかかる電子機器用加湿装置は、箱体状に形成され電子機器を収納させる電子機器用ラックまたは電子機器に内装される電子機器用加湿装置であって、湿度を検出する湿度センサーと、水が含浸される吸水部材と、前記湿度センサーの検出に基づいて前記吸水部材に給水させる給水部とを備えてなることを特徴とする。
請求項６にかかる電子機器用加湿装置は、請求項５において、前記電子機器は、外部と連通する通気孔が設けられてなり、前記吸水部材は、前記通気孔近傍に配設されることを特徴とする。
請求項７にかかる電子機器における加湿方法は、箱体状に形成され電子機器を収納させる電子機器用ラック内または電子機器内の湿度を所望の湿度に加湿する電子機器における加湿方法であって、水を気化させて所望の湿度に加湿することを特徴とする。
請求項８にかかる電子機器における加湿方法は、請求項７において、前記電子機器用ラック内または前記電子機器内の湿度を検出して、その検出結果に基づいて気化させる前記水の量を制御することを特徴とする。 In order to achieve the above technical problem, the following technical means have been adopted for the electronic equipment rack, the electronic equipment, the electronic equipment humidifying device, and the humidifying method in the electronic equipment according to the present invention.
That is, the electronic device rack according to claim 1 is an electronic device rack that is formed in a box shape and accommodates the electronic device, and is characterized in that a water-absorbing member impregnated with water is incorporated.
An electronic device rack according to a second aspect is the electronic device rack according to the first aspect, wherein the electronic device is provided with a vent hole communicating with the outside, and the water absorbing member constitutes the electronic device rack in the vicinity of the vent hole. It is arrange | positioned on the wall surface to carry out.
According to a third aspect of the present invention, there is provided an electronic device including a housing, wherein a water absorbing member impregnated with water is provided in the housing.
According to a fourth aspect of the present invention, in the electronic device according to the third aspect, the electronic device is provided with a vent hole communicating with the outside, and the water absorbing member is disposed in the vicinity of the vent hole. .
An electronic device humidifier according to claim 5 is an electronic device rack formed in a box shape to store an electronic device or an electronic device humidifier installed in an electronic device, wherein the humidity sensor detects humidity. A water absorbing member impregnated with water, and a water supply unit for supplying water to the water absorbing member based on detection of the humidity sensor.
A humidifying device for an electronic device according to a sixth aspect is the electronic device according to the fifth aspect, wherein the electronic device is provided with a vent hole communicating with the outside, and the water absorbing member is disposed in the vicinity of the vent hole. Features.
The humidifying method in the electronic device according to claim 7 is a humidifying method in the electronic device that humidifies the humidity in the electronic device rack or the electronic device that is formed in a box shape and accommodates the electronic device to a desired humidity, Water is vaporized and humidified to a desired humidity.
A humidification method for an electronic device according to an eighth aspect of the present invention is the method for humidifying an electronic device according to the seventh aspect, wherein the humidity in the electronic device rack or the electronic device is detected and the amount of water to be vaporized is controlled based on the detection result. It is characterized by that.

本発明によれば、水が含浸される吸水部材を、電子機器を収納させる箱体状の電子機器用ラックまたは電子機器の筐体に内装し、その吸水部材に水が含浸して、電子機器の発熱に応じた気化による加湿をするから、発熱が小さい装置においては結露してしまう危険性を回避し、また、発熱が大きい電子機器においては、温度上昇により機器内の内飽和水蒸気量が低下し、湿度が低くなりすぎる危険性を回避することができる。
加えて、水が気化する際の気化熱によって、電子機器用ラック内または電子機器内の温度をも下げることができる。 According to the present invention, the water-absorbing member impregnated with water is installed in a box-shaped electronic device rack or an electronic device housing in which the electronic device is accommodated, and the water-absorbing member is impregnated with water to provide the electronic device. In order to avoid the risk of condensation in devices with low heat generation, the amount of saturated water vapor in the device decreases due to temperature rise in electronic devices with large heat generation. In addition, it is possible to avoid the danger that the humidity becomes too low.
In addition, the temperature in the electronic equipment rack or the electronic equipment can be lowered by the heat of vaporization when the water is vaporized.

次に、本発明にかかる実施の形態を、図面を参照しながら説明する。   Next, embodiments according to the present invention will be described with reference to the drawings.

（実施の形態１）
実施の形態１は、複数のサーバー２を上下方向に設置させる箱状の電子機器用ラック１を例示している。 (Embodiment 1)
The first embodiment exemplifies a box-shaped electronic device rack 1 in which a plurality of servers 2 are installed in the vertical direction.

すなわち、実施の形態１にかかる電子機器用ラック１は、図１に示すように、前面に開閉扉３を設け、内部にサーバー２を載置または固定させる仕切板４が複数段設けられた箱状に形成されている。また、この開閉扉３には、吸気用スリット５が複数個設けられており、電子機器用ラック１内に通気されるようになっている。また、この吸気用スリット５と対向した壁面には排気用スリット６が設けられている。なお、本実施の形態では、通気用及び排気用にスリット状の通気孔を例示しているが、円形孔や楕円孔など特に限定されない。   That is, the electronic equipment rack 1 according to the first exemplary embodiment is a box in which an opening / closing door 3 is provided on the front surface and a plurality of partition plates 4 on which the server 2 is placed or fixed are provided, as shown in FIG. It is formed in a shape. The opening / closing door 3 is provided with a plurality of intake slits 5 so as to be ventilated in the electronic equipment rack 1. Further, an exhaust slit 6 is provided on a wall surface facing the intake slit 5. In the present embodiment, slit-like air holes are illustrated for ventilation and exhaust, but there is no particular limitation such as circular holes or elliptic holes.

そして、筐体前面から冷却のための吸気が行われるサーバー２が、その筐体前面を電子機器用ラック１の開閉扉３側にして配置される場合、仕切板４に載置または固定されたサーバー２と対向するように、その開閉扉３の裏面に吸気用スリット５と重なるように、水が含浸される吸水部７が配設されている。このように吸水部７の配置は、上記の如く、サーバー２の冷却用の吸気側に配設されることが好ましいが、この吸水部７の配置は特に限定されない。また、この仕切板４の架設方向は、本実施の形態では、水平方向に架設されるものを例示しているが、上下方向に架設しても良いものである。   Then, when the server 2 in which intake air for cooling is performed from the front surface of the housing is arranged with the front surface of the housing facing the open / close door 3 of the electronic equipment rack 1, the server 2 is placed or fixed on the partition plate 4. A water absorbing portion 7 impregnated with water is disposed on the back surface of the open / close door 3 so as to face the server 2 so as to overlap the intake slit 5. As described above, the arrangement of the water absorbing portion 7 is preferably arranged on the intake side for cooling the server 2 as described above, but the arrangement of the water absorbing portion 7 is not particularly limited. Moreover, although the installation direction of this partition plate 4 has illustrated what was installed in the horizontal direction in this Embodiment, you may install in the up-down direction.

吸水部７は、ウレタン、不織布等の、吸水性が良く水を気化させるのに適した吸水部材８と、その吸水部材８を支持させる支持部９とを備えて構成されている。   The water-absorbing part 7 includes a water-absorbing member 8 that has good water absorption and is suitable for vaporizing water, such as urethane and nonwoven fabric, and a support part 9 that supports the water-absorbing member 8.

吸水部材８は、その形状が、表裏を貫く連通孔１０が複数個設けられた帯布状に形成されている。なお、この吸水部材８の形状は、上記の形状の他、短冊状にしたり、格子状に形成させたり、また、絽や紗のような透けた織り物状に形成しても良く、特に限定されない。   The water absorbing member 8 is formed in a band-like shape in which a plurality of communication holes 10 penetrating the front and back are provided. The shape of the water-absorbing member 8 is not particularly limited, and may be a strip shape, a lattice shape, or a transparent weave shape such as a ridge or fold, in addition to the above shape. .

支持部９は、枠体状に形成されてなり、吸水部材８の端部を固定させると共に、開閉扉３の裏面に着脱可能に貼付または係合されるようになっている。この支持部９は、上記の形状の他、皿状に形成して吸水部材８の端部あるいは吸水部材８全体を固定しても良く、さらに、開閉扉３裏面の形状を吸水部材８の端部を固定可能に形設して、開閉扉３と一体成形させても良い。すなわち、吸水部材８が電子機器用ラック１内に支持されていれば良いもので、その形態は特に限定されない。   The support portion 9 is formed in a frame shape, fixes the end portion of the water absorbing member 8, and is detachably attached to or engaged with the back surface of the open / close door 3. In addition to the shape described above, the support portion 9 may be formed in a dish shape to fix the end of the water absorbing member 8 or the entire water absorbing member 8, and the shape of the back surface of the open / close door 3 is the end of the water absorbing member 8. The part may be formed so as to be fixed and integrally formed with the open / close door 3. That is, it is only necessary that the water absorbing member 8 is supported in the rack 1 for electronic equipment, and the form thereof is not particularly limited.

以上のように構成された実施の形態１にかかる電子機器用ラック１は、当該電子機器用ラック１に収納されるサーバー２の発熱量とラックの内容積（空隙部）に基づいて、吸水部材８に所要量の水を含浸する。そして、サーバー２が発熱することで、その発熱に応じて水が気化して電子機器用ラック１内を加湿する。また加湿と同時に、水が気化する際の気化熱によって、電子機器用ラック１内の温度が下がる。   The electronic device rack 1 according to the first embodiment configured as described above is based on the heat generation amount of the server 2 housed in the electronic device rack 1 and the internal volume (gap) of the rack. 8 is impregnated with the required amount of water. When the server 2 generates heat, water is vaporized according to the generated heat to humidify the inside of the electronic equipment rack 1. Simultaneously with humidification, the temperature in the electronic equipment rack 1 is lowered by heat of vaporization when water is vaporized.

実施の形態１では、電子機器用ラック１を例示しているが、サーバー２の一構成部材である筐体内に上記した吸水部７を配設しても良い。この場合、サーバー２内へ冷却のための吸気が行われる側の壁面に吸水部７（図１において二点鎖線で図示）を配設することが好ましい（吸気孔と重なるように配置することが好ましい）。   In the first embodiment, the electronic device rack 1 is illustrated, but the above-described water absorbing portion 7 may be disposed in a housing which is a constituent member of the server 2. In this case, it is preferable to dispose the water absorption part 7 (illustrated by a two-dot chain line in FIG. 1) on the wall surface on the side where the intake air for cooling is performed into the server 2 (arranged so as to overlap the intake holes). preferable).

（実施の形態２）
実施の形態２は、サーバー２、または、このサーバー２を設置させる箱状の電子機器用ラック１に設けられる電子機器用加湿装置が例示されている。
すなわち、実施の形態２にかかる電子機器用加湿装置は、図２に示すように、湿度を検出する湿度センサー１１と、水が含浸される吸水部７２と、湿度センサー１１の検出に基づいて吸水部７２に給水させる給水部１２とを備えて構成されている。 (Embodiment 2)
The second embodiment exemplifies a humidifier for electronic equipment provided in the server 2 or a box-shaped electronic equipment rack 1 in which the server 2 is installed.
That is, as shown in FIG. 2, the humidifying device for electronic equipment according to the second embodiment absorbs water based on the humidity sensor 11 that detects humidity, the water absorption part 72 that is impregnated with water, and the detection of the humidity sensor 11. A water supply unit 12 for supplying water to the unit 72 is provided.

湿度センサー１１は、湿度に応じた電気信号が出力される周知構造のもので、サーバー２内、または、電子機器用ラック１内の湿度を検出するようになっている。この湿度センサー１１の配置は、サーバー２、または、電子機器用ラック１における冷却のための排気用スリット６近傍に設けることが好ましい。   The humidity sensor 11 has a known structure that outputs an electrical signal corresponding to the humidity, and detects the humidity in the server 2 or the electronic equipment rack 1. The arrangement of the humidity sensor 11 is preferably provided in the vicinity of the exhaust slit 6 for cooling in the server 2 or the rack 1 for electronic equipment.

また、吸水部７２は、吸水部材８と、支持部９２とを備えて構成され、実施の形態１と同じように配設される。なお、吸水部材８は、実施の形態１で説明した吸水部材８と同一構成であるため詳細な説明は省略する。   In addition, the water absorption part 72 includes the water absorption member 8 and the support part 92 and is arranged in the same manner as in the first embodiment. Since the water absorbing member 8 has the same configuration as the water absorbing member 8 described in the first embodiment, detailed description thereof is omitted.

支持部９２は、実施の形態１の支持部９２と同様に、枠体状に形成されてなり、吸水部材８の端部を固定させると共に、開閉扉３の裏面に着脱可能に貼付または係合されるようになっている。さらに、この支持部９２の上部には、後述する給水部１２から延設された給水用チューブ１３が接続されており、適宜、吸水部材８へ給水が可能になっている。なお、支持部９２の下部に、水漏れを防止するための排水用チューブ（図示せず）を接続して、過度の水が供給された場合、吸水部材８から伝わってきた水を回収できるようにすることが好ましい。   The support portion 92 is formed in a frame shape, like the support portion 92 of the first embodiment, and fixes or engages the end of the water absorbing member 8 detachably on the back surface of the open / close door 3. It has come to be. Furthermore, a water supply tube 13 extending from a water supply unit 12 described later is connected to the upper portion of the support unit 92 so that water can be supplied to the water absorbing member 8 as appropriate. Note that a drainage tube (not shown) for preventing water leakage is connected to the lower portion of the support portion 92 so that when excessive water is supplied, the water transmitted from the water absorbing member 8 can be recovered. It is preferable to make it.

給水部１２は、ポンプ（図示せず）が内装されると共に給水用チューブ１３が接続された水タンク１４と、湿度センサー１１と接続され湿度センサー１１からの電気信号に基づいてポンプの吐出しを制御する制御部（図示せず）とを備えて構成される。   The water supply unit 12 includes a pump (not shown) and a water tank 14 to which a water supply tube 13 is connected, and a humidity sensor 11 that is connected to the humidity sensor 11 and discharges the pump based on an electrical signal from the humidity sensor 11. And a control unit (not shown) for controlling.

この制御部は、上記したように、湿度センサー１１からの電気信号に基づいてポンプの吐出し制御を行うが、その水の吐き出し制御（給水制御）は後述する。   As described above, the control unit performs the discharge control of the pump based on the electrical signal from the humidity sensor 11, and the water discharge control (water supply control) will be described later.

以上のように構成された実施の形態２にかかる電子機器用加湿装置は、まず、湿度センサー１１の湿度検出に基づいて、制御部が、電子機器用ラック１内またはサーバー２内の湿度が予め設定された湿度より下回っていると判断した場合、ポンプを所定時間駆動して支持部９２に給水を行い、吸水部材８に所要量の水を含浸する。   In the humidifying apparatus for electronic device according to the second embodiment configured as described above, first, based on the humidity detection of the humidity sensor 11, the control unit determines that the humidity in the electronic device rack 1 or the server 2 is in advance. When it is determined that the humidity is lower than the set humidity, the pump is driven for a predetermined time to supply water to the support portion 92 and the water absorbing member 8 is impregnated with a required amount of water.

次いで、サーバー２が発熱することで、その発熱に応じて水が気化して電子機器用ラック１内またはサーバー２内を加湿する。また加湿と同時に、水が気化する際の気化熱によって、電子機器用ラック１内またはサーバー２内の温度が下がる。   Next, when the server 2 generates heat, water is vaporized according to the generated heat to humidify the inside of the electronic equipment rack 1 or the server 2. Simultaneously with the humidification, the temperature in the electronic equipment rack 1 or the server 2 is lowered by the heat of vaporization when the water is vaporized.

そして、吸水部材８に含浸された水の量が減って、サーバー２内、または、電子機器用ラック１内の湿度が、設定された値より下がった場合、ポンプを所定時間駆動させて、所要量の水を吸水部材８へ給水する。   When the amount of water impregnated in the water absorbing member 8 decreases and the humidity in the server 2 or the electronic equipment rack 1 falls below the set value, the pump is driven for a predetermined time, An amount of water is supplied to the water absorbing member 8.

所定時間を経ても、サーバー２内、または、電子機器用ラック１内の湿度が設定された値より下がっている場合、再度、ポンプを所定時間駆動させて、所要量の水を吸水部材８へ給水する。この動作は所定の湿度になるまで繰り返される。
このようにして、電子機器用ラック１内またはサーバー２内の湿度を所望の湿度に維持する。 If the humidity in the server 2 or in the electronic equipment rack 1 has fallen below the set value even after a predetermined time has elapsed, the pump is again driven for a predetermined time to supply a required amount of water to the water absorbing member 8. Supply water. This operation is repeated until a predetermined humidity is reached.
In this way, the humidity in the electronic equipment rack 1 or the server 2 is maintained at a desired humidity.

なお、上記の水の吐き出し制御（給水制御）以外の制御としては、気化によって蒸発される分の水が補給されるように、常時、送水されるようにポンプを駆動（絞り弁による水量調整でも良い）しても良い。   As a control other than the water discharge control (water supply control) described above, the pump is driven so that water is always supplied so that the amount of water evaporated by vaporization is replenished (even by adjusting the amount of water using a throttle valve). Good).

このように本実施の形態にかかる電子機器用ラック１、サーバー２、電子機器用加湿装置は、吸気側の開閉扉３で空気を加湿しているので、電子機器用ラック１内、サーバー２内のみを効率よく加湿できる。   As described above, the electronic device rack 1, the server 2, and the electronic device humidifier according to the present embodiment humidify the air with the intake-side opening / closing door 3, and therefore, in the electronic device rack 1 and the server 2. Only can be efficiently humidified.

また、サーバー２が設置されるサーバールーム全体を過度に加湿する必要が無く、また、従来のような専用の加湿器ではなく、水の自然気化を用いて加湿しているので、ランニングコストを低減できる（消費電力はサーバー内蔵のファン、または、電子機器用ラック１内に設けたファンをまわすために必要な電力だけですませられることである）。   In addition, it is not necessary to excessively humidify the entire server room where the server 2 is installed, and since it is humidified using natural vaporization of water rather than a dedicated humidifier as in the past, running costs are reduced. Yes (power consumption is limited to the power required to turn the fan built in the server or the fan installed in the electronic equipment rack 1).

また、電子機器用ラック１の場合、電子機器用ラック１内のサーバー２だけを局所的に加湿しているので、吸気温度がサーバー２の内部温度よりも低くなり、結露する危険性を回避できる。   Further, in the case of the electronic equipment rack 1, only the server 2 in the electronic equipment rack 1 is locally humidified, so that the intake air temperature becomes lower than the internal temperature of the server 2 and the risk of condensation can be avoided. .

また、水が気化することでサーバー２内の湿度が上昇し、空気の熱伝導率が上昇しているので、サーバー２の冷却効率が改善し、冷却ファンの回転数を低下させることが可能となり、騒音を抑えることができる。
また、水の気化熱により吸気温度が下がるため、サーバー２を冷却できる。 Moreover, since the humidity in the server 2 is increased due to the vaporization of water and the thermal conductivity of the air is increased, the cooling efficiency of the server 2 can be improved and the rotation speed of the cooling fan can be reduced. Can suppress noise.
Further, since the intake air temperature decreases due to the heat of vaporization of water, the server 2 can be cooled.

以上、本発明にかかる実施の形態を説明したが、上述した実施の形態は、本発明の好適な実施の形態の一例を示すものであり、本発明はそれに限定されるものではなく、その要旨を逸脱しない範囲内において、種々変形実施が可能である。   As mentioned above, although embodiment concerning this invention was described, embodiment mentioned above shows an example of suitable embodiment of this invention, and this invention is not limited to it, The summary Various modifications can be made without departing from the scope of the invention.

例えば、箱体状に形成されサーバー２を収納させる電子機器用ラック１内またはサーバー２内の湿度を、水を気化させて所望の湿度に加湿するサーバー２における加湿方法でもよい。この場合において、電子機器用ラック１内またはサーバー２内の湿度を検出して、その検出結果に基づいて気化させる水の量を制御することが好ましい。   For example, a humidification method in the server 2 may be used in which the humidity in the electronic equipment rack 1 or the server 2 that is formed in a box shape and accommodates the server 2 is vaporized to a desired humidity. In this case, it is preferable to detect the humidity in the electronic equipment rack 1 or the server 2 and control the amount of water to be vaporized based on the detection result.

実施の形態１にかかる電子機器用ラックの模式的な横断平面図である。FIG. 3 is a schematic cross-sectional plan view of the electronic device rack according to the first exemplary embodiment; 実施の形態２にかかる電子機器用ラックの模式的な横断平面図である。FIG. 5 is a schematic cross-sectional plan view of an electronic device rack according to a second exemplary embodiment.

符号の説明Explanation of symbols

１ 電子機器用ラック
２ サーバー
３ 開閉扉
４ 仕切板
５ 吸気用スリット
６ 排気用スリット
７、７２ 吸水部
８ 吸水部材
９、９２ 支持部
１０ 連通孔
１１ 湿度センサー
１２ 給水部
１３ 給水用チューブ
１４ 水タンク DESCRIPTION OF SYMBOLS 1 Electronic equipment rack 2 Server 3 Opening / closing door 4 Partition plate 5 Intake slit 6 Exhaust slit 7, 72 Water absorption part 8 Water absorption member 9, 92 Support part 10 Communication hole 11 Humidity sensor 12 Water supply part 13 Water supply tube 14 Water tank

Claims (8)

箱体状に形成され電子機器を収納させる電子機器用ラックであって、水が含浸される吸水部材が内装されてなることを特徴とする電子機器用ラック。   An electronic device rack that is formed in a box shape and accommodates an electronic device, and includes a water absorbing member that is impregnated with water. 前記電子機器は、外部と連通する通気孔が設けられてなり、
前記吸水部材は、前記通気孔近傍の当該電子機器用ラックを構成する壁面に配設されることを特徴とする請求項１記載の電子機器用ラック。 The electronic device is provided with a vent hole communicating with the outside,
2. The rack for electronic equipment according to claim 1, wherein the water absorbing member is disposed on a wall surface constituting the rack for electronic equipment in the vicinity of the vent hole. 筐体を備えた電子機器であって、水が含浸される吸水部材が前記筐体に内装されてなることを特徴とする電子機器。   An electronic apparatus comprising a casing, wherein a water absorbing member impregnated with water is housed in the casing. 前記電子機器は、外部と連通する通気孔が設けられてなり、
前記吸水部材は、前記通気孔近傍に配設されることを特徴とする請求項３記載の電子機器。 The electronic device is provided with a vent hole communicating with the outside,
The electronic device according to claim 3, wherein the water absorbing member is disposed in the vicinity of the vent hole. 箱体状に形成され電子機器を収納させる電子機器用ラックまたは電子機器に内装される電子機器用加湿装置であって、
湿度を検出する湿度センサーと、
水が含浸される吸水部材と、
前記湿度センサーの検出に基づいて前記吸水部材に給水させる給水部と
を備えてなることを特徴とする電子機器用加湿装置。 A humidifying device for an electronic device that is formed in a box shape and accommodates an electronic device rack or an electronic device that is housed in an electronic device,
A humidity sensor that detects humidity;
A water absorbing member impregnated with water;
A humidifying device for electronic equipment, comprising: a water supply unit configured to supply water to the water absorbing member based on detection of the humidity sensor. 前記電子機器は、外部と連通する通気孔が設けられてなり、
前記吸水部材は、前記通気孔近傍に配設されることを特徴とする請求項５記載の電子機器用加湿装置。 The electronic device is provided with a vent hole communicating with the outside,
The humidifying device for electronic equipment according to claim 5, wherein the water absorbing member is disposed in the vicinity of the vent hole. 箱体状に形成され電子機器を収納させる電子機器用ラック内または電子機器内の湿度を所望の湿度に加湿する電子機器における加湿方法であって、水を気化させて所望の湿度に加湿することを特徴とする電子機器における加湿方法。   A humidification method in an electronic device that is formed in a box shape and humidifies the inside of an electronic equipment rack or an electronic equipment in which the electronic equipment is stored to a desired humidity, and vaporizes water to humidify to a desired humidity. A humidifying method in an electronic device. 前記電子機器用ラック内または前記電子機器内の湿度を検出して、その検出結果に基づいて気化させる前記水の量を制御することを特徴とする電子機器における加湿方法。   A humidification method in an electronic device, wherein the humidity in the electronic device rack or the electronic device is detected, and the amount of the water to be vaporized is controlled based on the detection result.
JP2006056042A 2006-03-02 2006-03-02 Electronic device, rack therefor, humidifier therefor, and humidification method therein Pending JP2007234941A (en)

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JP2009168345A (en) * 2008-01-16 2009-07-30 Daikin Ind Ltd Suction grille
JP2009168347A (en) * 2008-01-16 2009-07-30 Daikin Ind Ltd Suction grille
WO2013145219A1 (en) * 2012-03-29 2013-10-03 富士通株式会社 Modular datacenter and method for controlling same
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Publication number Priority date Publication date Assignee Title
JP2009168345A (en) * 2008-01-16 2009-07-30 Daikin Ind Ltd Suction grille
JP2009168347A (en) * 2008-01-16 2009-07-30 Daikin Ind Ltd Suction grille
WO2013145219A1 (en) * 2012-03-29 2013-10-03 富士通株式会社 Modular datacenter and method for controlling same
WO2013145246A1 (en) * 2012-03-29 2013-10-03 富士通株式会社 Modular data center and control method therefor
CN104204998A (en) * 2012-03-29 2014-12-10 富士通株式会社 Modular datacenter and method for controlling same
JPWO2013145219A1 (en) * 2012-03-29 2015-08-03 富士通株式会社 Modular data center and its control method
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JP2020504414A (en) * 2016-12-22 2020-02-06 アマゾン・テクノロジーズ・インコーポレーテッド Tape library rack module with environmentally isolated interior
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