JP2007208155A - Cooling system for electronic equipment - Google Patents
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- JP2007208155A JP2007208155A JP2006027839A JP2006027839A JP2007208155A JP 2007208155 A JP2007208155 A JP 2007208155A JP 2006027839 A JP2006027839 A JP 2006027839A JP 2006027839 A JP2006027839 A JP 2006027839A JP 2007208155 A JP2007208155 A JP 2007208155A
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- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
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Abstract
Description
本発明は、小型で高性能な情報処理装置等の電子機器における高発熱電子部品を冷却するための冷却システムに関するものである。 The present invention relates to a cooling system for cooling highly heat-generating electronic components in electronic equipment such as a small and high-performance information processing apparatus.
電子機器に使用される半導体集積回路は、電子機器における取り扱い情報量の増大等からその処理速度の高速化を要求されており、高速処理を重点課題として急速に高集積化が進んできた。それに伴って半導体から発生する発熱量も増大している。一方、半導体における発熱は所定の温度以上になると半導体の持つ性能を確保する上で阻害要因となるだけでなく、半導体自体を破損してしまう問題を生じてくるため、電子機器においてこの発熱を冷却することは必須要件である。よって、装置の小型化,高性能化に対応した小型で、高性能な冷却システムの開発が期待されている。 Semiconductor integrated circuits used in electronic devices are required to increase the processing speed due to an increase in the amount of information handled in the electronic devices, and high integration has been progressing rapidly with high-speed processing as a priority issue. Along with this, the amount of heat generated from the semiconductor is also increasing. On the other hand, heat generation in semiconductors is not only an obstacle to ensuring the performance of semiconductors when the temperature exceeds a predetermined temperature, but also causes problems that damage the semiconductor itself. It is an essential requirement. Therefore, development of a small and high-performance cooling system corresponding to miniaturization and high performance of the apparatus is expected.
ついては、増大した発熱量の冷却を行うために、冷却方法の開発とともに、各冷却方法における冷却能力の向上を図る工夫が行われている。例えば、ファンで冷却風を送り込む風冷システムにおいては、ファンの形状や、回転速度の制御による冷却風量の増加や、風路の工夫などが取り組まれており、液体によって放熱位置まで熱移送する液冷システムにおいては、熱交換部や熱移送部の高熱伝導性の材質や構造の改良,熱移送の制御などで熱交換効率の向上が図られている。 Therefore, in order to cool the increased heat generation amount, along with the development of the cooling method, a device for improving the cooling capacity in each cooling method has been made. For example, in an air cooling system in which cooling air is sent by a fan, the shape of the fan, an increase in the amount of cooling air by controlling the rotation speed, and a device for the air path are being worked on. In the cooling system, the heat exchange efficiency is improved by improving the material and structure of the high heat conductivity of the heat exchange section and the heat transfer section, and controlling the heat transfer.
一方、電子機器は、従来の業務用装置から小形・高性能な携帯用,個人用の装置としても大きく発展してきている。例えば計算機の製品分野に関しても、デスクトップ型のパーソナルコンピュータ(以下、PCと称す)やノート型のPCは中央演算処理装置(以下、CPUと称す)の演算処理の高速化によって、使い勝手の良い製品を実現されてきたが、反面、発熱量の増大が問題化してきている。 On the other hand, electronic devices have been greatly developed from conventional business devices as small, high-performance portable and personal devices. For example, in the field of computer products, desktop-type personal computers (hereinafter referred to as PCs) and notebook-type PCs are easy-to-use products by speeding up the arithmetic processing of a central processing unit (hereinafter referred to as CPU). Although it has been realized, an increase in the amount of generated heat has become a problem.
近年、このPCの冷却方式としては、冷却能力に対比して小型化,静音化に優位性を持つ液冷システムが好まれて使用されるようになってきた。この液冷システムのノートPCの例として特許文献1が挙げられる。また。デスクトップPCの液冷システムの例として特許文献2が挙げられる。また、特許文献2には、液冷システムよりもさらに冷却性能の向上を追求できる冷却液の蒸発及び凝縮作用を利用して冷却を行う潜熱冷却システムの例も記載されている。さらには、潜熱冷却システムの循環型として特許文献3が挙げられる。
In recent years, as a cooling method for this PC, a liquid cooling system having an advantage in miniaturization and noise reduction in comparison with the cooling capacity has been favored and used. Patent document 1 is mentioned as an example of the notebook PC of this liquid cooling system. Also. Patent Document 2 is an example of a liquid cooling system for a desktop PC. Patent Document 2 also describes an example of a latent heat cooling system in which cooling is performed by using an evaporation and condensation action of a cooling liquid that can further improve the cooling performance as compared with the liquid cooling system. Furthermore,
特許文献1に開示されている冷却システムは、ノートPCの薄型の構造に対応した液冷システムの例であり、放熱器として表示部の背面の広い面積にわたって流路を形成した放熱板を配置し、本体側配置の発熱部との間で液を循環する構成としている。よって、放熱板は放熱効果をあげるために放熱性の良い金属材料等で構成する必要があり、携帯用途の機器でありながら軽量化の阻害要因になっている。さらには冷却性能を上げるためには、放熱板を大きくする必要が有るが、放熱板面積の増大には装置の形状から自ずと限界があり、冷却性能の増強には、外付けのヒートシンクやファンの設置等で対応していかざるを得ない状況にある。 The cooling system disclosed in Patent Document 1 is an example of a liquid cooling system corresponding to a thin structure of a notebook PC, and a radiator plate in which a flow path is formed over a wide area on the back surface of the display unit as a radiator. The liquid is circulated between the main body side arranged heat generating portion. Therefore, the heat radiating plate needs to be made of a metal material having a good heat radiating property in order to increase the heat radiating effect, which is an obstacle to weight reduction while being a portable device. Furthermore, in order to improve the cooling performance, it is necessary to enlarge the heat sink, but there is a limit to the increase in the heat sink area due to the shape of the device. There is no choice but to deal with the installation.
特許文献2に開示されている冷却システムは、デスクトップPCに搭載された液冷システムである。放熱器はフィンを設けたヒートシンクとした構造であり、ファンによってヒートシンクのフィンに向かって冷却風を吹き付ける構成とされている。デスクトップ型
PCにおいては、冷却システムの配置場所と設置空間に関する制約がノートPCよりは小さいことから、放熱器としては従来型の配管と冷却フィン構成で平面状あるいはブロック状に形成したラジエータが用いられる例もある。さらに、放熱効果を挙げるためには、放熱器に吹き付けた冷却風が暖められた後に装置内に循環することなく装置外に排出させるために放熱器を装置の外部にはみ出させて装着している。また、冷却風の流れを制御するために装置内に冷却風路を形成するダクトの設置等も工夫されている。しかし、これらは装置の小型化に対する阻害要因である。
The cooling system disclosed in Patent Document 2 is a liquid cooling system mounted on a desktop PC. The heat radiator has a structure of a heat sink provided with fins, and is configured to blow cooling air toward the fins of the heat sink by a fan. In desktop PCs, because the restrictions on the location and installation space of the cooling system are smaller than those of notebook PCs, radiators formed in a flat or block shape with conventional piping and cooling fin configuration are used as the radiator. There are also examples. Furthermore, in order to increase the heat dissipation effect, the radiator is attached to the outside of the device so that the cooling air blown to the radiator is warmed and discharged outside the device without being circulated inside the device. . In addition, in order to control the flow of cooling air, installation of a duct that forms a cooling air passage in the apparatus has been devised. However, these are obstacles to downsizing of the apparatus.
さらに特許文献2には、ヒートパイプ方式による冷却システムについても記載されている。ヒートパイプ方式は、冷媒液によって熱輸送して放熱器で冷却する液冷システムに比べて気化熱による冷却のために冷却性能に優るが、ヒートパイプ内の同一管内で蒸発・凝縮サイクルを繰り返すことからヒートパイプの下部で受熱されて蒸発した気体の上昇流路と上部で冷却されて凝縮して還流される液体の戻り流路とがヒートパイプ内で接触領域を持つことから圧力損失等により蒸発・凝縮サイクルの循環が阻害される問題が生じることがある。 Furthermore, Patent Document 2 also describes a cooling system using a heat pipe system. The heat pipe method is superior to the cooling performance due to the heat of vaporization compared to the liquid cooling system in which heat is transported by the refrigerant liquid and cooled by the radiator, but the evaporation and condensation cycle is repeated in the same pipe in the heat pipe. Since the rising channel of the gas received and evaporated at the bottom of the heat pipe from the bottom and the return channel of the liquid cooled and condensed and refluxed at the top have a contact area in the heat pipe, it evaporates due to pressure loss etc.・ There may be problems that the circulation of the condensation cycle is hindered.
この問題を解決するために、特許文献3に記載されているように、蒸発された気体と凝縮された液体の流路を分離して、ポンプによって一方向に蒸発・凝縮サイクルを行う循環型の潜熱冷却システムが開発されている。しかし、蒸発・凝縮による潜熱冷却システムにおいては冷媒液の蒸気冷媒状態の蒸気圧等によって冷媒液が漏洩しやすく高度の密封性が要求されるという課題を有している。
In order to solve this problem, as described in
電子機器における発熱部品の発熱量の増大と、電子機器の小型化要求はますます増してくるものと思われる。しかし、従来の冷却システムにおいては、冷却性能を上げることと冷却装置を小型化することの二律相反の状況にあり、大形のサーバや、デスクトップ型
PCの冷却システムと、ノート型PCの冷却システムでは異なる方式・構造の冷却システムを搭載せざるを得ない状況にある。
The amount of heat generated by heat-generating components in electronic devices and the demand for smaller electronic devices are expected to increase. However, in the conventional cooling system, there is a contradictory situation of improving the cooling performance and downsizing the cooling device, and the cooling system for large servers, desktop PCs, and notebook PCs. The system must be equipped with a cooling system with a different method and structure.
本発明の目的は、従来の液冷システムの問題を解決し、デスクトップ型PCからノート型PCとPCの形態に係わらず搭載可能とした電子機器用の小型で、高冷却性能な冷却システムを提供することにある。 The object of the present invention is to solve the problems of the conventional liquid cooling system and to provide a small and high cooling performance cooling system for electronic devices that can be mounted from a desktop PC to a notebook PC regardless of the form of the PC. There is to do.
上記目的は、電子機器における発熱体の冷却システムにおいて、内部に冷媒液の流路を有し前記発熱体に接続して受熱される受熱部材と、該受熱部材によって受熱した気液混合状態の冷媒液を駆動する第1のポンプと、該第1のポンプで駆動される前記冷媒液を冷却し液冷媒に相変化させる放熱部材と、該放熱部材によって相変化した液冷媒を貯留するタンク部と、該タンク部より液冷媒を駆動する第2のポンプとを有し、各部材を配管によって接続して循環流路を形成し、前記放熱部材と前記タンク部は上下の一体構成となし、気液混合状態の冷却液を流入する流入口を前記一体構成の上部の放熱部材に対向して配置し、液冷媒として流出する流出口を前記一体構成の下部のタンク部に対向して配置し、前記放熱部材と前記タンク部を挟んで、気液混合状態の冷媒液を駆動する前記第1のポンプを循環流路の上流側に配置し、液冷媒を駆動する前記第2のポンプを下流側に配置して構成されたことにより達成される。 An object of the present invention is to provide a cooling system for a heating element in an electronic device, a heat receiving member having a flow path of a refrigerant liquid therein and receiving heat by being connected to the heating element, and a gas-liquid mixed refrigerant received by the heat receiving member A first pump that drives the liquid; a heat radiating member that cools the refrigerant liquid driven by the first pump and changes the phase to liquid refrigerant; and a tank unit that stores the liquid refrigerant phase-changed by the heat radiating member; And a second pump for driving the liquid refrigerant from the tank part, and connecting each member by piping to form a circulation flow path. The heat radiating member and the tank part have an upper and lower integrated structure, An inflow port for injecting the liquid coolant in a liquid mixture state is disposed to face the upper radiating member of the integrated configuration, and an outflow port to flow out as a liquid refrigerant is disposed to face the lower tank portion of the integrated configuration, The heat dissipation member and the tank part are sandwiched This is achieved by arranging the first pump for driving the refrigerant liquid in the gas-liquid mixed state on the upstream side of the circulation flow path and the second pump for driving the liquid refrigerant on the downstream side. Is done.
また上記目的は、前記第1のポンプの駆動力を前記第2のポンプ駆動力より小さくしたことにより達成される。 The above-mentioned object is achieved by making the driving force of the first pump smaller than the second pump driving force.
また上記目的は、前記第1のポンプを容積型のポンプとし、前記第2のポンプを遠心型のポンプとしたことにより達成される。 The above object is achieved by using the first pump as a positive displacement pump and the second pump as a centrifugal pump.
本発明によれば、デスクトップ型PCからノート型PCとPCの形態に係わらず搭載可能とした電子機器用の小型で、高冷却性能な冷却システムを提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the small and highly cooling performance cooling system for electronic devices which can be mounted irrespective of the form of a notebook type PC and PC from a desktop type PC can be provided.
以下本発明の実施の形態について図を参照して説明する。
図1は、本発明の実施の形態を示す冷却システムの概要構成図である。
図1において、1は電子機器(図示せず)に用いられる発熱体、2はその発熱体1に接触して発熱体1を冷却するために内部に冷媒液の流路を有する受熱部材、3は受熱部材2の下流で放熱部材(後で説明)の上流に配置され、気液混合状態にある冷媒液を吸引し循環する第1のポンプ、4は冷媒液の冷却のために内部に冷媒液を通流する流路を有した放熱部材、5は放熱部材4とともに密封され一体構成としたタンク、6は放熱部材4の下流で受熱部材2の上流に配置され、タンク5より流出する冷媒液を駆動する第2のポンプ、7は各部材を接続して冷媒液の循環経路を形成する配管である。
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic configuration diagram of a cooling system showing an embodiment of the present invention.
In FIG. 1, reference numeral 1 denotes a heating element used in an electronic device (not shown), 2 denotes a heat receiving member having a refrigerant liquid flow path therein for contacting the heating element 1 and cooling the
次に各部材の詳細と、冷却システムの動作状態について以下に説明すると、図示しない電子機器は、サーバ,デスクトップ型PC、及びノート型PC等のいずれかの特定された装置に係わるものではない。 Next, the details of each member and the operation state of the cooling system will be described below. An electronic device (not shown) is not related to any specified device such as a server, a desktop PC, or a notebook PC.
図2は本発明の受熱部材2の実施例における概略構成斜視図(一部透視図)である。
図3、及び図4はともに受熱部材2の流路の構成に関して異なる実施形態を示す断面図である。
図2に示されるように、受熱部材2は冷媒液を通流するための空間部を形成して空間部を密封する枠体21を有し、枠体21に対向形成されている側辺部の一方には冷媒液の流出口22aが設けられ、他方には冷媒液の流入口22bが設けている。各々の流出口22a,流入口22bには冷媒液を循環するための配管7が接続されている。枠体21の内部の空間部には、冷媒液を分流して通流するためのほぼ並行に設置された通流壁片群23と、通流壁片群23と流出口22a,流入口22bを設けた側辺部の内壁間に冷媒液を合流あるいは分流するための空間となるヘッダ24a,24bと、を有するように構成された受熱板25を組み込んで接合され、受熱部材2として密封構成されている。
FIG. 2 is a schematic configuration perspective view (partially perspective view) in the embodiment of the heat receiving member 2 of the present invention.
3 and 4 are cross-sectional views showing different embodiments regarding the configuration of the flow path of the heat receiving member 2.
As shown in FIG. 2, the heat receiving member 2 has a frame body 21 that forms a space portion for allowing the refrigerant liquid to flow therethrough and seals the space portion, and a side portion that is formed to face the frame body 21. One is provided with a refrigerant liquid outlet 22a, and the other is provided with a refrigerant liquid inlet 22b. A pipe 7 for circulating the refrigerant liquid is connected to each of the outlet 22a and the inlet 22b. In the space inside the frame 21, a flow wall piece group 23, which is arranged substantially in parallel for diverting and flowing the refrigerant liquid, a flow wall piece group 23, an outlet 22 a, and an inlet 22 b. A heat receiving plate 25 configured to have a header 24a, 24b serving as a space for merging or diverting the refrigerant liquid between the inner walls of the side portions provided with the heat receiving plate 25 is joined and joined to form a sealed structure as the heat receiving member 2 Has been.
さらには、図3に示すように、通流壁片群23は通流する冷媒液との接触面積を広くとるために、ほぼ並行に配した壁平面を受熱部材の厚さ方向に中間部で湾曲した形状に形成している。このことにより冷媒液と通流壁片との熱伝導量を高めることができる。尚、この通流壁片群23は熱伝導性の良い受熱板25の板材質を切削加工等によって切り起した同一材質で構成させたものを使用することが好ましいが、他の構造によって流路を形成しても支障ない。 Furthermore, as shown in FIG. 3, in order to increase the contact area between the flow wall piece group 23 and the flowing refrigerant liquid, a wall plane arranged substantially in parallel is provided at the intermediate portion in the thickness direction of the heat receiving member. It is formed in a curved shape. As a result, the amount of heat conduction between the refrigerant liquid and the flow wall piece can be increased. In addition, it is preferable to use this flow wall piece group 23 made of the same material obtained by cutting the plate material of the heat receiving plate 25 having good thermal conductivity by cutting or the like. There is no problem even if it is formed.
尚、図3にみるように、この切削加工による切り起し通流壁片群23は、切削加工による切り起しのために自然な湾曲平面をなすものであり、冷媒液との伝熱接触面積を増す方法として大いなるメリットを示す。一方、切削加工による切り起し通流壁片群23の端部は加工状態によって湾曲状態や、切り起し長がばらつく可能性があり、一方向からの切り起し片では枠体21の内壁平面との間で隙間が生じて冷媒液の短絡した流路バイパスができることになる場合がある。この隙間の発生を回避するためには切削加工後に高さ位置を揃える作業等が必要になる。この問題を回避する方法として、図4にみるように、枠体
21の受熱面対向内壁平面に形成した通流壁片群23bと、受熱板25に形成された通流壁片群23aとを上下より、相互に組合せ対向配置させる構成として流路を形成すると短絡した流路バイパスが形成されることがないので、この高さ位置を揃える作業を割愛することができる。
As shown in FIG. 3, the cut and raised flow wall piece group 23 formed by the cutting process forms a natural curved plane for cutting and raising by the cutting process, and is in heat transfer contact with the refrigerant liquid. It shows great merit as a method of increasing the area. On the other hand, the end portion of the cut and raised flow wall piece group 23 by cutting may vary in the curved state and the cut and raised length depending on the processing state. There may be a case where a flow path bypass is formed in which a gap is generated between the flat surface and the refrigerant liquid is short-circuited. In order to avoid the occurrence of this gap, an operation of aligning the height position after cutting is required. As a method of avoiding this problem, as shown in FIG. 4, a flow wall piece group 23 b formed on the inner wall plane facing the heat receiving surface of the frame body 21 and a flow wall piece group 23 a formed on the heat receiving plate 25 are used. If a flow path is formed as a configuration in which a combination is disposed opposite to each other from above and below, a short-circuited flow path bypass is not formed, so that the work of aligning the height positions can be omitted.
この構造による受熱部材2は、電子機器に搭載された複数の半導体部品の発熱体1に熱的に接続して用いることで、発熱体1の発生熱を受熱部材2内部に通流する冷媒液によって蒸気冷媒への相変化を伴ないながら受熱させる。 The heat receiving member 2 having this structure is a refrigerant liquid that allows heat generated in the heat generating member 1 to flow into the heat receiving member 2 by being thermally connected to the heat generating members 1 of a plurality of semiconductor components mounted on the electronic device. Heat is received with a phase change to the vapor refrigerant.
受熱部材2において受熱した冷媒液は受熱部材2の下流で、放熱部材4の上流に位置して配置された第1のポンプ3により駆動される。この第1のポンプ3は、液冷媒と蒸気冷媒の混合状態にある冷媒液の場合でも冷媒液を駆動することができる容積型ポンプであることが好ましい。また、冷媒液の循環する力が冷媒液を駆動するポンプに駆動力によって一体的に循環させる物でなく、一旦液冷媒タンクに冷媒液を貯留する方式のため第1のポンプは蒸気冷媒液を駆動するに必要な駆動力だけを考慮すればよい。
The refrigerant liquid received by the heat receiving member 2 is driven by the
受熱部材2において受熱された冷媒液の液冷媒と蒸気冷媒の混合比率は使用される冷媒液によって異なるが、液冷媒の比率が大となる冷媒液とした装置の場合は後述する第2のポンプと同レベルの駆動力を有するポンプとすることによって、冷媒液の駆動力を2つのポンプで分配して循環させるように考慮され、蒸気冷媒の比率が大になる冷媒液とした装置の場合は蒸気冷媒の循環を阻害させない程度の補充的な駆動力を有するポンプとするように考慮されればよい。 The mixing ratio of the liquid refrigerant and the vapor refrigerant of the refrigerant liquid received by the heat receiving member 2 varies depending on the refrigerant liquid used, but in the case of an apparatus using a refrigerant liquid in which the ratio of the liquid refrigerant is large, a second pump described later. In the case of a device in which the liquid refrigerant driving force is considered to be distributed and circulated by the two pumps so that the ratio of the vapor refrigerant is large. It may be considered that the pump has a supplementary driving force that does not hinder the circulation of the vapor refrigerant.
受熱した冷媒液は第1のポンプ3で駆動され、気液混合体流入口43から放熱部材4に流入して、放熱部材4内部に配置された流路を通流しながら冷却されて蒸気冷媒とされた冷却液は液冷媒に相変化される。
The received refrigerant liquid is driven by the
図5は放熱部材4と一体のタンク5を示す概略外観斜視図である。
図6は放熱部材の枠体の一部を示す斜視図である。
図において、放熱部材4は、内部に冷却液の通流する通流壁片群41を有している。また、放熱部材4の外表面の一部には、放熱用のフィン42を有している。これらの通流壁片群41、及び放熱用のフィン42は、受熱部材2において説明した切り起し加工によるものであっても良いし、他の従来方法による放熱管等のものであっても支障ない。ただ、本発明の蒸気冷媒の冷却による液冷媒への相変化を行う放熱部材4の流路としては、放熱効果を有するフィン状の流路で支障ないために熱伝導性の良い放熱板43の材質を切削加工した切り起し片の通流壁片群41が最適な構造であるといえる。
FIG. 5 is a schematic external perspective view showing the tank 5 integrated with the heat radiating member 4.
FIG. 6 is a perspective view showing a part of the frame of the heat radiating member.
In the figure, the heat radiating member 4 has a flow wall piece group 41 through which a coolant flows. A part of the outer surface of the heat radiating member 4 has a heat radiating fin 42. The flow wall piece group 41 and the heat radiation fins 42 may be formed by the cutting and raising process described in the heat receiving member 2 or may be a heat radiation pipe or the like by another conventional method. No problem. However, as the flow path of the heat radiating member 4 that performs the phase change to the liquid refrigerant by cooling the vapor refrigerant of the present invention, the fin-shaped flow path having a heat radiating effect is not hindered. It can be said that the flow wall piece group 41 of cut and raised pieces obtained by cutting the material has an optimum structure.
さらに放熱部材4の外部表面の一部には、放熱効果をあげるための放熱用フィンを同様に切削加工によって設けることも可能である。放熱部材4の上部とタンク5の下部とは冷却液を通流できる貫通口43aを有した仕切り板43によって分割されているが、液層と蒸気層を分離するための仕切り板である必要はない。また、仕切り板43の放熱部側の表面には、蒸気冷媒と接触する通流壁片群(フィン)を形成してタンク5の筐体を放熱のための放熱板の作用として利用することも可能である。放熱部材4に外表面に形成された放熱用フィンによる冷却性能を向上するために放熱用フィンに向けてファンによって送風する構成は容易に想定される方法である。 Furthermore, a part of the outer surface of the heat radiating member 4 may be provided with a heat radiating fin for enhancing the heat radiating effect by cutting. The upper part of the heat dissipating member 4 and the lower part of the tank 5 are divided by a partition plate 43 having a through-hole 43a through which the coolant can flow, but it is necessary to be a partition plate for separating the liquid layer and the vapor layer. Absent. Further, on the surface of the partition plate 43 on the heat radiating portion side, a flow wall piece group (fin) that comes into contact with the vapor refrigerant is formed, and the casing of the tank 5 can be used as an action of the heat radiating plate for heat radiation. Is possible. In order to improve the cooling performance by the heat radiating fin formed on the outer surface of the heat radiating member 4, a configuration in which air is blown by the fan toward the heat radiating fin is an easily assumed method.
次に、放熱部材と一体構成とされたタンク部の上部に配置された放熱部材4の一側壁面には第1のポンプ3からの冷媒液の流入口43を設け、下部のタンク5の一側面壁にはタンク5から冷媒液を流出するための流出口51を設けている。この構成によって放熱部材4により冷却された冷媒液を一旦液冷媒としてタンク5に溜めて流出口51から循環されるために、タンク5の下流で、受熱部材2の上流に位置して配置された第2のポンプ6には、液冷媒のみが送られる。よって、第2のポンプ6は遠心型のポンプでも良い。
Next, an inlet 43 for the refrigerant liquid from the
第2のポンプ6により、放熱された冷媒液を受熱部材2に送り受熱部材2によって再び発熱体1の熱が受熱される。これらのサイクルを繰り返すために冷媒液を循環可能なように各部材は配管で密封接続されている。 The second pump 6 sends the radiated refrigerant liquid to the heat receiving member 2, and the heat receiving member 2 receives the heat of the heating element 1 again. In order to repeat these cycles, each member is hermetically connected by piping so that the refrigerant liquid can be circulated.
本発明によれば、容積型のポンプを第1のポンプとして受熱部材の下流に設けることで液冷媒が相変化して蒸気冷媒を含んだ場合にも冷媒液を吸い込んで駆動することで蒸発・凝縮型の冷却システムにおける問題であった受熱部材において蒸発した冷媒液の配管内の圧力損失によって冷媒液の循環を阻害することがなく、また、第2のポンプを放熱部材の下流に配置することによって放熱部材から受熱部材に液体冷媒を確実に駆動することが可能になる。これらの2つのポンプを放熱部とタンク部を挟んで配置することによって、第1のポンプにおいて駆動する蒸気冷媒と、第2のポンプにより駆動する液冷媒と、の間にタンク部の空気層を介在する構成とされている。即ち1つのポンプによる冷媒液の循環方法でないため、冷媒液の減少に対しても圧力損失等で液の循環が滞る問題が無い。さらには冷媒液の漏洩に対してもタンク内に滞留された冷媒液を補充することができるので、冷却システムに高度の密封性を要求する必要性も無い。 According to the present invention, the positive displacement pump is provided as the first pump downstream of the heat receiving member, so that even when the liquid refrigerant undergoes a phase change and contains the vapor refrigerant, the refrigerant liquid is sucked and driven to evaporate / The circulation of the refrigerant liquid is not obstructed by the pressure loss in the pipe of the refrigerant liquid evaporated in the heat receiving member, which has been a problem in the condensation type cooling system, and the second pump is arranged downstream of the heat radiating member. Thus, the liquid refrigerant can be reliably driven from the heat radiating member to the heat receiving member. By disposing these two pumps with the heat radiating part and the tank part sandwiched therebetween, an air layer in the tank part is formed between the vapor refrigerant driven by the first pump and the liquid refrigerant driven by the second pump. It is configured to intervene. That is, since the refrigerant liquid is not circulated by a single pump, there is no problem that the circulation of the liquid is delayed due to a pressure loss or the like even when the refrigerant liquid is decreased. Furthermore, since the refrigerant liquid retained in the tank can be replenished against the leakage of the refrigerant liquid, there is no need to require a high degree of sealing performance for the cooling system.
気化熱による高性能な冷却方法に対応しながら、気液混合状態の冷媒液と、液体状態の冷媒液を適切な2つのポンプと放熱部材一体のタンクによって、円滑な冷媒液の循環を達成できることから、簡素で小型な冷却システムが実現され、色々な形態の電子機器に搭載可能な冷却システムを提供できる。 The refrigerant liquid in a gas-liquid mixed state and the liquid refrigerant in a liquid state can be smoothly circulated by an appropriate two pumps and a tank integrated with a heat radiating member while supporting a high-performance cooling method using heat of vaporization. Therefore, a simple and small cooling system can be realized, and a cooling system that can be mounted on various types of electronic devices can be provided.
1…発熱体、2…受熱部材、3…第1のポンプ、4…放熱部材、5…タンク、6…第2のポンプ、7…配管。
DESCRIPTION OF SYMBOLS 1 ... Heat generating body, 2 ... Heat receiving member, 3 ... 1st pump, 4 ... Radiation member, 5 ... Tank, 6 ... 2nd pump, 7 ... Piping.
Claims (3)
各部材を配管によって接続して循環流路を形成し、
前記放熱部材と前記タンク部は上下の一体構成となし、気液混合状態の冷却液を流入する流入口を前記一体構成の上部の放熱部材に対向して配置し、液冷媒として流出する流出口を前記一体構成の下部のタンク部に対向して配置し、
前記放熱部材と前記タンク部を挟んで、気液混合状態の冷媒液を駆動する前記第1のポンプを循環流路の上流側に配置し、液冷媒を駆動する前記第2のポンプを下流側に配置して構成されたことを特徴とする電子機器用の冷却システム In a cooling system for a heating element in an electronic device, a heat receiving member that has a flow path of a refrigerant liquid therein and receives heat by being connected to the heating element, and a gas-liquid mixed refrigerant liquid received by the heat receiving member are driven. A first pump; a heat radiating member that cools the refrigerant liquid driven by the first pump and changes the phase to liquid refrigerant; a tank portion that stores the liquid refrigerant phase-changed by the heat radiating member; and the tank portion A second pump for driving the liquid refrigerant more,
Each member is connected by piping to form a circulation channel,
The heat dissipating member and the tank part have an upper and lower integrated structure, and an inflow port for injecting cooling liquid in a gas-liquid mixed state is disposed opposite to the upper heat dissipating member of the integrated structure and flows out as liquid refrigerant. Is disposed opposite the lower tank portion of the integrated structure,
The first pump that drives the refrigerant liquid in the gas-liquid mixed state is disposed on the upstream side of the circulation flow path, and the second pump that drives the liquid refrigerant is located on the downstream side with the heat radiating member and the tank portion interposed therebetween. Cooling system for electronic equipment characterized by being arranged in
前記第1のポンプの駆動力を前記第2のポンプ駆動力より小さくしたことを特徴とする電子機器用の冷却システム。 The cooling system for electronic equipment according to claim 1,
A cooling system for electronic equipment, wherein the driving force of the first pump is smaller than the driving force of the second pump.
前記第1のポンプを容積型のポンプとし、前記第2のポンプを遠心型のポンプとしたことを特徴とする電子機器用の冷却システム。
The cooling system for electronic equipment according to claim 1,
A cooling system for electronic equipment, wherein the first pump is a positive displacement pump and the second pump is a centrifugal pump.
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