JP2007180994A - Piezoelectric oscillator - Google Patents

Piezoelectric oscillator Download PDF

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JP2007180994A
JP2007180994A JP2005378189A JP2005378189A JP2007180994A JP 2007180994 A JP2007180994 A JP 2007180994A JP 2005378189 A JP2005378189 A JP 2005378189A JP 2005378189 A JP2005378189 A JP 2005378189A JP 2007180994 A JP2007180994 A JP 2007180994A
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package body
space
electrode terminal
piezoelectric oscillator
connection electrode
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Hidekuni Terasono
英訓 寺園
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Kyocera Crystal Device Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator in which a conductive wiring pattern of an external wiring base, an external connecting electrode terminal of the piezoelectric oscillator and a metallization part are not short-circuited even if the piezoelectric oscillator is made compact and which can correspond to miniaturization. <P>SOLUTION: In the piezoelectric oscillator configured by overlappedly arranging and mechanically electrically connecting and combining a first package body in which a piezoelectric vibration element is mounted in a first space part, a lid part is arranged and adhered in the shape of closing an opening of the first space part to hermetically seal the first space part and a second package body in which an integrated circuit element is arranged in a second inner space part and the integrated circuit element is electrically connected to an external connecting electrode terminal formed at four corners of an outer mounting principal plane of a second base body, a third recessed space part is formed inside the position for forming the external connecting electrode terminal on the external mounting principal plane of the second package body, and the metallization part 15 of a GND potential is formed on the bottom in the third space part. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、携帯用通信機器等の電子機器に用いられる圧電発振器に関するものであり、特に小型化に適した圧電発振器に関する。   The present invention relates to a piezoelectric oscillator used in an electronic device such as a portable communication device, and more particularly to a piezoelectric oscillator suitable for downsizing.

従来から、携帯用通信機器等の電子機器には、電子部品の一つとして圧電発振器が用いられている。圧電発振器より生成された出力信号は、電子機器における基準クロック信号やタイミング信号等に用いられている。   Conventionally, a piezoelectric oscillator is used as one of electronic components in an electronic device such as a portable communication device. An output signal generated from the piezoelectric oscillator is used as a reference clock signal, a timing signal, or the like in an electronic device.

かかる従来の圧電発振器としては、例えば図４に示す如く、内部に図中には示されていないが、圧電振動素子４１が収容されている第１のパッケージ体４３を、第２の空間部４５内に前記の圧電振動素子４１の振動に基づいて発振出力を制御する集積回路素子４６やコンデンサ等の電子部品素子が収容されている第２のパッケージ体４２上に重ねて取着させた構造のものが知られている。このような圧電発振器をマザーボード等の外部配線基板上に載置固着させた上、第２のパッケージ体４２の外側実装主面に設けられている外部接続用電極端子４４を、外部配線基板の配線或いは電極パッドにハンダ接合することにより外部配線基板上に実装される。   As such a conventional piezoelectric oscillator, for example, as shown in FIG. 4, the first package body 43 in which the piezoelectric vibration element 41 is accommodated is not shown in the drawing, but the second space 45. An integrated circuit element 46 that controls the oscillation output based on the vibration of the piezoelectric vibration element 41 and a second package body 42 in which an electronic component element such as a capacitor is accommodated and attached. Things are known. Such a piezoelectric oscillator is mounted and fixed on an external wiring board such as a mother board, and the external connection electrode terminals 44 provided on the outer mounting main surface of the second package body 42 are connected to the wiring of the external wiring board. Or it mounts on an external wiring board by soldering to an electrode pad.

尚、第１のパッケージ体４３や第２のパッケージ体４２は、通常、セラミック材料によって形成されており、その内部や表面には配線導体が形成され、従来周知のセラミックグリーンシート積層法等を採用することにより製作される。   The first package body 43 and the second package body 42 are usually formed of a ceramic material, and a wiring conductor is formed inside or on the surface, and a conventionally known ceramic green sheet lamination method or the like is adopted. It is manufactured by doing.

又、前記集積回路素子４６の内部には、例えば、圧電振動素子４１の温度特性に応じて作成された温度補償データに基づいて圧電発振器の発振周波数を補正するための温度補償回路等が設けられており、圧電発振器を組み立てた後、上述の温度補償データを集積回路素子４６のメモリ内に格納すべく、第２のパッケージ体４２の他方の主面や外側面等には温度補償のためのデータ書込用電極端子４７が設けられていた。このデータ書込用電極端子４７に温度補償データ書込装置のプローブ針を当てて集積回路素子４６内のメモリに温度補償データを入力することにより、温度補償データが集積回路素子４６のメモリ内に格納される。   Further, inside the integrated circuit element 46, for example, a temperature compensation circuit for correcting the oscillation frequency of the piezoelectric oscillator based on the temperature compensation data created according to the temperature characteristic of the piezoelectric vibration element 41 is provided. In order to store the temperature compensation data in the memory of the integrated circuit element 46 after assembling the piezoelectric oscillator, the other main surface and the outer surface of the second package body 42 are provided for temperature compensation. A data writing electrode terminal 47 was provided. The temperature compensation data is input to the memory of the integrated circuit element 46 by applying the probe needle of the temperature compensation data writing device to the data writing electrode terminal 47 and inputting the temperature compensation data to the memory of the integrated circuit element 46. Stored.

また、上述の第１のパッケージ体４３と第２のパッケージ体４２との接続は、第２のパッケージ体４２の第２の空間部４５を囲繞する側壁部頂面上に形成された第１のパッケージ体接続用電極端子４８と、この第１のパッケージ体接続用電極端子４８と相対する第１のパッケージ体４３の他方の主面上の位置に第２のパッケージ体接続用電極端子４９とを、ハンダ等の導電性材料で固着することにより行われている。   In addition, the connection between the first package body 43 and the second package body 42 described above is the first package formed on the top surface of the side wall portion surrounding the second space 45 of the second package body 42. A package body connection electrode terminal 48 and a second package body connection electrode terminal 49 at a position on the other main surface of the first package body 43 opposite to the first package body connection electrode terminal 48. This is done by fixing with a conductive material such as solder.

更に、上述したような圧電発振器において、内部の圧電振動素子４１の発振動作を安定化させるために、外部接続用電極端子４４が形成されている第２のパッケージ体４２の外側実装主面にメタライズパターン５０を形成したものも考案されている。   Further, in the piezoelectric oscillator as described above, in order to stabilize the oscillation operation of the internal piezoelectric vibration element 41, the outer package main surface of the second package body 42 in which the external connection electrode terminal 44 is formed is metalized. A device in which a pattern 50 is formed has also been devised.

上述したような圧電発振器については、下記の先行技術文献に開示されている。
特開２００４−１２９０９０号公報 特開２００２−１２４８３２号公報 The piezoelectric oscillator as described above is disclosed in the following prior art documents.
JP 2004-129090 A JP 2002-124832 A

尚、出願人は前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を、本件出願時までに発見するに至らなかった。   In addition, the applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the above prior art document information.

しかしながら、上述した従来の圧電発振器において、圧電発振器をマザーボード等の外部配線基板上に実装させた場合、圧電発振器を構成する第２のパッケージ体の外側実装主面上に形成された各外部接続用電極端子と、同一主面上に形成されたメタライズ部とが、圧電発振器実装時の外部配線基板に塗布されているハンダ等の可塑性又は熱可塑性の導電性接合材の不必要な流出のために短絡する可能性があるという欠点を有していた。又、仮に外部接続用電極端子とメタライズ部との間の同一主面上に、短絡を防止するための手段を設けた場合でも、外部接続用電極端子とメタライズ部とが同一主面に形成されている形態は変わらないので、実装基板側の導配線パターンや実装基板表面を導電性接合材が伝ってしまい短絡事故が起こってしまう虞がある。また、圧電発振器の小型化が進むに従い、外部接続用電極端子とメタライズ部との間隔も狭くなり、より短絡事故が発生する可能性が高くなってしまう。   However, in the conventional piezoelectric oscillator described above, when the piezoelectric oscillator is mounted on an external wiring substrate such as a mother board, each external connection formed on the outer mounting main surface of the second package body constituting the piezoelectric oscillator. The electrode terminal and the metallized portion formed on the same main surface are used for unnecessary outflow of plastic or thermoplastic conductive bonding material such as solder applied to the external wiring board when the piezoelectric oscillator is mounted. It had the disadvantage that it could be short-circuited. Even if a means for preventing a short circuit is provided on the same main surface between the external connection electrode terminal and the metallized portion, the external connection electrode terminal and the metallized portion are formed on the same main surface. Therefore, there is a possibility that the conductive bonding material is transmitted through the conductive wiring pattern on the mounting substrate side or the surface of the mounting substrate, and a short circuit accident occurs. Further, as the size of the piezoelectric oscillator is further reduced, the distance between the external connection electrode terminal and the metallized portion is narrowed, and the possibility of occurrence of a short circuit accident is increased.

本発明は上記欠点に鑑み考え出されたものであり、従ってその目的は、圧電発振器が小型化されても、マザーボード等の導配線パターン及び外部接続用電極端子とメタライズ部が短絡することがなく小型化対応可能な圧電発振器を提供することにある。   The present invention has been conceived in view of the above-described drawbacks. Therefore, even if the piezoelectric oscillator is miniaturized, the conductive wiring pattern such as a mother board and the electrode terminal for external connection and the metallized portion are not short-circuited. An object of the present invention is to provide a piezoelectric oscillator that can be miniaturized.

本発明の圧電発振器は、絶縁性の第１の基体の一方の主面には凹形状の第１の空間部が形成され、この第１の空間部内には圧電振動素子が搭載され、この圧電振動素子は第１の基板の他方の主面に形成した第２のパッケージ体接続用電極端子と電気的に接続されており、蓋体が第１の空間部を囲繞する第１の側壁部の第１の空間部開口側端面に、第１の空間部開口部を塞ぐ形態で配置固着されて、第１の空間部を気密封止した第１のパッケージ体と、
絶縁性の第２の基体の一方の主面には凹形状の第２の空間部が形成され、この第２の空間部内には少なくとも発振回路が形成された集積回路素子が配置され、この集積回路素子は第２の空間部を囲繞する第２の側壁部の第２の空間部開口側端面に形成された第１のパッケージ体接続用電極端子と電気的に接続されており、更に集積回路素子は第２の基体の外側実装主面の四隅に形成した外部接続用電極端子とも電気的に接続された第２のパッケージ体とが、重ねて配置されており、
第１のパッケージ体接続用電極端子と第２のパッケージ体接続用電極端子とを機械的及び電気的に接続固着してなる圧電発振器において、
上記第２のパッケージ体の外側実装主面の外部接続用電極端子形成位置より内側に、第２のパッケージ外側に向かって開口する凹形状の第３の空間部が形成されており、且つこの第３の空間部内底面にはＧＮＤ電位となるメタライズ部が形成されていることを特徴とする。 In the piezoelectric oscillator of the present invention, a concave first space is formed on one main surface of the insulating first base, and a piezoelectric vibration element is mounted in the first space. The vibration element is electrically connected to the second package body connection electrode terminal formed on the other main surface of the first substrate, and the lid body has a first side wall portion surrounding the first space portion. A first package body that is arranged and fixed to the end face on the first space opening side in a form that closes the first space opening, and hermetically seals the first space;
A concave second space is formed on one main surface of the insulating second base, and an integrated circuit element in which at least an oscillation circuit is formed is disposed in the second space. The circuit element is electrically connected to the first package body connection electrode terminal formed on the second space portion opening side end surface of the second side wall portion surrounding the second space portion, and further to the integrated circuit The element is arranged so as to overlap the second package body electrically connected to the external connection electrode terminals formed at the four corners of the outer mounting main surface of the second base,
In the piezoelectric oscillator formed by mechanically and electrically connecting and fixing the first package body connecting electrode terminal and the second package body connecting electrode terminal,
A concave third space opening toward the outside of the second package is formed inside the external connection electrode terminal forming position on the outer mounting main surface of the second package body. A metallized portion having a GND potential is formed on the inner bottom surface of the space 3.

また、本発明の圧電発振器は、上記構成において、該メタライズ部の開口部側全面がアルミナによってコーティングされていることも特徴とする。   The piezoelectric oscillator according to the present invention is characterized in that, in the above configuration, the entire surface of the metallized portion on the opening side is coated with alumina.

上述したような本発明の圧電発振器によれば、該第２のパッケージ体の他方の主面の該外部接続用電極端子形成位置より内側に、該第２のパッケージ外側に向かって開口する凹形状の第３の空間部が形成されており、且つ該第３の空間部内底面にはＧＮＤ電位となるメタライズ部が形成されていることから、仮に圧電発振器の実装時に導電性接合材が外部接続用電極端子形成領域より流出しても、第３の空間部内に形成したメタライズ部に流出した導電性接合材が付着することがなく、メタライズ部が外部接続用電極端子又は外部基板の導配線パターンと短絡する可能性が著しく低くすることができる。   According to the piezoelectric oscillator of the present invention as described above, the concave shape opened toward the outside of the second package inside the external connection electrode terminal forming position on the other main surface of the second package body. The third space portion is formed, and a metallized portion having a GND potential is formed on the inner bottom surface of the third space portion, so that the conductive bonding material is used for external connection when the piezoelectric oscillator is mounted. Even if it flows out from the electrode terminal forming region, the conductive bonding material that has flowed out does not adhere to the metallized portion formed in the third space portion, and the metalized portion is connected to the electrode terminal for external connection or the conductive wiring pattern of the external substrate. The possibility of a short circuit can be significantly reduced.

また、上記構成において本発明の圧電発振器は、メタライズ部の開口部側全面が絶縁性のアルミナによってコーティングされていることから、ＧＮＤ電位となるメタライズ部が外部より完全に保護されることにより、第３の空間部内に形成したメタライズ部に流出した導電性接合材によるメタライズ部と外部接続用電極端子又は外部基板の導配線パターンとの短絡防止を確実とすることが可能となり、圧電発振器の更なる小型化が要求されても電気的短絡が起こることがない信頼性の高い圧電発振器を得る事が可能となる。   In the above-described configuration, the piezoelectric oscillator according to the present invention is coated with insulating alumina on the entire surface of the metallized portion on the opening side, so that the metallized portion having the GND potential is completely protected from the outside. It is possible to reliably prevent a short circuit between the metallized portion by the conductive bonding material flowing into the metallized portion formed in the space 3 and the electrode terminal for external connection or the conductive wiring pattern of the external substrate. It is possible to obtain a highly reliable piezoelectric oscillator that does not cause an electrical short circuit even when downsizing is required.

以下、本発明を添付図面に基づいて詳細に説明する。尚、各図においての同一の符号は同じ対象を示すものとする。又、各図では、説明を明りょうにするため部品或いは構造体の一部を図示せず、更に図示した寸法も一部誇張している。特に各図面の厚み寸法は著しく誇張して図示している。   Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object. Moreover, in each figure, in order to clarify explanation, a part of a part or a structure is not shown, and the illustrated dimension is also exaggerated in part. In particular, the thickness dimension of each drawing is greatly exaggerated.

図１は、本発明に係る圧電発振器の実施形態を、図２の仮想切断線Ｘ−Ｘ’線で切断した場合の概略断面図であり、図２は、図１記載の圧電発振器を外側実装主面（第２のパッケージ体１０の凹形状の第３の空間部２０が形成されている面）側から見た外観平面図である。また、図３は、図１記載の圧電発振器を外部配線基板３０上に実装させた形態を示す断面図である。   FIG. 1 is a schematic cross-sectional view of an embodiment of a piezoelectric oscillator according to the present invention cut along a virtual cutting line XX ′ in FIG. 2, and FIG. 2 is an external mounting of the piezoelectric oscillator shown in FIG. It is the external appearance top view seen from the main surface (surface in which the concave 3rd space part 20 of the 2nd package body 10 is formed) side. FIG. 3 is a cross-sectional view showing a form in which the piezoelectric oscillator shown in FIG. 1 is mounted on the external wiring board 30.

図１に示す圧電発振器１は、集積回路素子６を収容する第２のパッケージ体１０の外部実装主面に外部接続用電極端子１９が設けられ、第２のパッケージ体１０を構成する第２の基体上に形成された第２の空間部８内には集積回路素子６が搭載されている。また、集積回路素子６を収容する第２の空間部８を囲繞する形態の第２の側壁部１３の外側面には、温度補償データ等の各種制御データを集積回路素子６のメモリ内に格納するためのデータ書込用電極端子１１が形成されている。更に、図１に示すように第２の側壁部１３の上面には、圧電振動素子５が収容されている第１のパッケージ体２を載置して固定した構造を有している。また、第２のパッケージ体１０の第２の空間部８内底面と、搭載された集積回路素子６間には熱硬化性樹脂１４が注入されており、集積回路素子６の回路形成面（下面）を保護している。   The piezoelectric oscillator 1 shown in FIG. 1 is provided with an external connection electrode terminal 19 on the external mounting main surface of the second package body 10 that houses the integrated circuit element 6, and the second package body 10 is configured as the second package body 10. An integrated circuit element 6 is mounted in the second space 8 formed on the substrate. Various control data such as temperature compensation data is stored in the memory of the integrated circuit element 6 on the outer surface of the second side wall portion 13 that surrounds the second space 8 that accommodates the integrated circuit element 6. Data writing electrode terminals 11 are formed for this purpose. Further, as shown in FIG. 1, the first package body 2 in which the piezoelectric vibration element 5 is accommodated is placed and fixed on the upper surface of the second side wall portion 13. Further, a thermosetting resin 14 is injected between the inner bottom surface of the second space 8 of the second package body 10 and the mounted integrated circuit element 6, and the circuit forming surface (lower surface) of the integrated circuit element 6 is injected. ) Is protected.

第１のパッケージ体２は、例えば、ガラス−セラミック、アルミナセラミックス等のセラミック材料から成る第１の基体と、第１の基体と同様のセラミック材料から成る第１の側壁部３、４２アロイやコバール、リン青銅等の金属から成る蓋体４とから成る。又、第１の基体の一方の主面辺縁部全周に第１の側壁部３を取着させ第１の空間部７を形成し、その第１の側壁部３の頂面上に蓋体４を第１の空間部７開口部を覆う形態で載置し、第１の側壁部３頂面と蓋体４とを固着させることによって第１の空間部７内を気密に封止された第１のパッケージ体２が構成される。   The first package body 2 includes, for example, a first base made of a ceramic material such as glass-ceramic and alumina ceramic, and first side wall portions 3 and 42 made of a ceramic material similar to the first base, and alloy and kovar. And a lid 4 made of a metal such as phosphor bronze. Further, the first side wall 3 is attached to the entire periphery of the edge of one main surface of the first base to form the first space 7, and a lid is formed on the top surface of the first side wall 3. The body 4 is placed so as to cover the opening of the first space 7, and the top of the first side wall 3 and the lid 4 are fixed so that the inside of the first space 7 is hermetically sealed. The first package body 2 is configured.

第１のパッケージ体２は上述したように、第１の基体の一方の主面と第１の側壁部３の内面と蓋体４の下面とで囲まれる第１の空間部７内に、圧電振動素子５を収容して気密封止されており、第１の空間部７内底面には圧電振動素子５に形成している励振用電極に接続される一対の圧電振動素子搭載用電極パッド等が、第１のパッケージ体２の外底面には、後述する第２のパッケージ体１０を構成する第２の側壁部１３に形成されている第１のパッケージ体接続用電極端子１８に電気的且つ機械的に接続される複数個の第２のパッケージ体接続用電極端子１７がそれぞれ設けられ、これらの電極パッドや電極端子類は、第１のパッケージ体２表面に形成した配線パターンや、パッケージ体内部に埋設されているビアホール等を介して、対応するパッド又は端子同士、相互に電気的に接続されている。また、第１のパッケージ体２の外底面に形成される第２のパッケージ体接続用電極端子１７は、第１のパッケージ体２の外底面の４つの角部近傍にそれぞれ１個ずつ形成されている。また、第２のパッケージ体１０を構成する第２の側壁部頂面に形成された第１のパッケージ体接続用電極端子１８も、第２の側壁部頂面の４つの角部にそれぞれ１個ずつ形成され、第１のパッケージ体２の第２のパッケージ体接続用電極端子１７と、第２のパッケージ体接続用電極端子１７と相対する位置にある第２のパッケージ体１０の第２のパッケージ体接続用電極端子１８とは、ハンダ等の導電性接合材により電気的且つ機械的に接合されている。このように内部に各種素子を各々搭載した第１のパッケージ２と第２のパッケージ体１０と接続固着することで、圧電発振器１が構成されている。   As described above, the first package body 2 is piezoelectric in the first space portion 7 surrounded by one main surface of the first base, the inner surface of the first side wall portion 3, and the lower surface of the lid body 4. The vibrating element 5 is accommodated and hermetically sealed, and a pair of piezoelectric vibrating element mounting electrode pads connected to an excitation electrode formed on the piezoelectric vibrating element 5 on the inner bottom surface of the first space 7. However, the first package body 2 is electrically connected to the first package body connection electrode terminal 18 formed on the second side wall portion 13 constituting the second package body 10 described later on the outer bottom surface of the first package body 2. A plurality of second package body connection electrode terminals 17 that are mechanically connected are provided, and these electrode pads and electrode terminals are formed by wiring patterns formed on the surface of the first package body 2 or package bodies. Respond via via holes embedded inside. Pads or terminals of being mutually electrically connected. The second package body connection electrode terminals 17 formed on the outer bottom surface of the first package body 2 are formed one by one near the four corners of the outer bottom surface of the first package body 2. Yes. The first package body connection electrode terminals 18 formed on the top surface of the second side wall portion constituting the second package body 10 are also provided at four corners on the top surface of the second side wall portion. The second package body 10 and the second package body connection electrode terminal 17 of the first package body 2 and the second package body 10 of the second package body 10 at positions opposite to the second package body connection electrode terminal 17. The body connection electrode terminal 18 is electrically and mechanically joined by a conductive joining material such as solder. In this way, the piezoelectric oscillator 1 is configured by connecting and fixing the first package 2 and the second package body 10 each having various elements mounted therein.

第１のパッケージ体２の第１の空間部７内に搭載されている圧電振動素子５は、例えば、圧電振動素子５を構成する圧電材として水晶を使用してある場合、人工水晶結晶体より所定のカットアングルで切り出し外形加工を施した矩形平板状の水晶素板の両主面に一対の励振用電極を被着・形成して成り、外部からの変動電圧が一対の励振用電極を介して圧電素板に印加されると、カットアングルに基づく振動モードにより圧電素板が振動を起こす。尚、圧電振動素子５の主材料としては水晶の他に、圧電効果を奏するものであれば、タンタル酸リチウム、ニオブ酸リチウムや圧電セラミック等の他の圧電材を使用しても良い。   The piezoelectric vibration element 5 mounted in the first space portion 7 of the first package body 2 is, for example, from an artificial crystal crystal when a crystal is used as the piezoelectric material constituting the piezoelectric vibration element 5. A pair of excitation electrodes are deposited and formed on both main surfaces of a rectangular flat crystal base plate cut out at a predetermined cut angle and subjected to external shape processing, and externally varying voltages are passed through the pair of excitation electrodes. When applied to the piezoelectric element plate, the piezoelectric element plate vibrates in a vibration mode based on the cut angle. As the main material of the piezoelectric vibration element 5, in addition to quartz, other piezoelectric materials such as lithium tantalate, lithium niobate, and piezoelectric ceramic may be used as long as they have a piezoelectric effect.

ここで第１のパッケージ体２の蓋体４を第２のパッケージ体接続用電極端子１７や第２のパッケージ体接続用電極端子１８を介して、後述する外部接続用電極端子１９のうちのＧＮＤ電極端子に電気的に接続させておけば、圧電発振器の使用の際に、金属製の蓋体４がＧＮＤ電位に接続されて電磁シールド機能が付与されることと成るため、圧電振動素子５や集積回路素子６を外部からの不要な電気的作用（ノイズ等）から良好に保護することができる。   Here, the lid 4 of the first package body 2 is connected to the GND of the external connection electrode terminals 19 to be described later via the second package body connection electrode terminals 17 and the second package body connection electrode terminals 18. If it is electrically connected to the electrode terminal, when the piezoelectric oscillator is used, the metallic lid 4 is connected to the GND potential to provide an electromagnetic shielding function. The integrated circuit element 6 can be satisfactorily protected from unnecessary external electrical effects (noise, etc.).

そして、上述した第１のパッケージ体２が取着される、集積回路素子６を収容する第２のパッケージ体１０の主面外周形状は矩形を成しており、ガラス布基材エポキシ樹脂やポリカーボネイト，エポキシ樹脂，ポリイミド樹脂等の樹脂材料やガラス−セラミック、アルミナセラミックス等のセラミック材料等によって概略平板状を成すように形成されている。   And the main surface outer peripheral shape of the 2nd package body 10 which accommodates the integrated circuit element 6 to which the 1st package body 2 mentioned above is attached has comprised the rectangle, glass cloth base material epoxy resin or polycarbonate , A resin material such as epoxy resin or polyimide resin, or a ceramic material such as glass-ceramic or alumina ceramic.

また、集積回路素子６が搭載されている第２のパッケージ体１０は、その外側実装主面上の４つの角部近傍にそれぞれ外部接続用電極端子１９（電源電圧端子、ＧＮＤ端子、発振出力端子、発振制御端子）が形成されている。また、第２のパッケージ体１０の第２の空間部底面の中央域にはフリップチップ型の集積回路素子６が、第２の側壁部１３の長辺側の外側側面中央部にはデータ書込用電極端子１１が設けられている。   Further, the second package body 10 on which the integrated circuit element 6 is mounted has external connection electrode terminals 19 (power supply voltage terminal, GND terminal, oscillation output terminal) in the vicinity of the four corners on the outer mounting main surface. Oscillation control terminal). Further, the flip chip type integrated circuit element 6 is provided in the central region of the bottom surface of the second space portion of the second package body 10, and data writing is performed in the central portion of the outer side surface on the long side of the second side wall portion 13. An electrode terminal 11 is provided.

集積回路素子６を収容する第２のパッケージ体１０の外側実装主面上に設けられている４つの外部接続用電極端子１９は、圧電発振器を外部配線基板３０の電極パッド３１に接続するための電極端子として機能するものであり、圧電発振器を外部配線基板３０上に搭載する際、外部配線基板３０の回路配線とハンダ等の導電性接合材３２を介して電気的に接続されている。更に、上述した集積回路素子６を収容する第２のパッケージ体１０の中央域には、複数個の集積回路素子接続用電極パッドが設けられており、これら集積回路素子接続用電極パッドに、集積回路素子６のパッケージ接続用電極パッドをハンダや導電接着材等の導電性接合材を介して電気的、及び機械的に接続させることによって集積回路素子６が第２の空間部８内の所定位置に取着される。   Four external connection electrode terminals 19 provided on the outer mounting main surface of the second package body 10 that accommodates the integrated circuit element 6 are used to connect the piezoelectric oscillator to the electrode pads 31 of the external wiring board 30. It functions as an electrode terminal, and when the piezoelectric oscillator is mounted on the external wiring board 30, it is electrically connected to the circuit wiring of the external wiring board 30 via a conductive bonding material 32 such as solder. Further, a plurality of integrated circuit element connection electrode pads are provided in the central region of the second package body 10 that accommodates the integrated circuit element 6 described above, and these integrated circuit element connection electrode pads are integrated. The integrated circuit element 6 is placed in a predetermined position in the second space 8 by electrically and mechanically connecting the package connection electrode pad of the circuit element 6 via a conductive bonding material such as solder or a conductive adhesive. To be attached.

また、集積回路素子６は、その回路形成面（下面）に、周囲の温度状態を検知する感温素子、圧電振動素子５の温度特性を補償する温度補償データを格納するメモリ、メモリ内の温度補償データに基づいて圧電振動素子５の振動特性を温度変化に応じて補正する温度補償回路、先の温度補償回路に接続されて所定の発振出力を生成する発振回路等が設けられており、この発振回路で生成された発振出力は、外部に出力された後、例えば、クロック信号等の基準信号として利用される。   Further, the integrated circuit element 6 has, on its circuit forming surface (lower surface), a temperature sensing element for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristics of the piezoelectric vibration element 5, and a temperature in the memory. A temperature compensation circuit that corrects the vibration characteristics of the piezoelectric vibration element 5 in accordance with the temperature change based on the compensation data, an oscillation circuit that is connected to the previous temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the oscillation circuit is output to the outside and then used as a reference signal such as a clock signal.

尚、上述した集積回路素子６と第２の空間部８内底面及び側面との間にはエポキシ樹脂等から成る熱硬化性樹脂１４が介在されており、この熱硬化性樹脂１４は集積回路素子６の下面と側面の一部を被覆するように被着されている。   A thermosetting resin 14 made of an epoxy resin or the like is interposed between the above-described integrated circuit element 6 and the inner bottom surface and side surface of the second space 8. 6 is attached so as to cover a part of the lower surface and side surface of 6.

これにより、集積回路素子６を収容する第２のパッケージ体１０に対する集積回路素子６の取着強度が向上されるとともに、集積回路素子６の回路形成面が熱硬化性樹脂１４によって良好に被覆され、回路形成面の電子回路が大気中の水分等によって腐食されるのを有効に防止することができる。   Accordingly, the attachment strength of the integrated circuit element 6 to the second package body 10 that accommodates the integrated circuit element 6 is improved, and the circuit forming surface of the integrated circuit element 6 is satisfactorily covered with the thermosetting resin 14. It is possible to effectively prevent the electronic circuit on the circuit forming surface from being corroded by moisture in the atmosphere.

ここで、本発明の特徴部分は図１〜図３に示すように、第２のパッケージ体１０の外側実装主面の外部接続用電極端子１９の形成位置より内側に、第２のパッケージ体１０外側に向かって開口する凹形状の第３の空間部２０が形成されており、且つ第３の空間部２０内底面にはＧＮＤ電位となるメタライズ部１５が形成されていることから、外部接続用電極端子１９とＧＮＤ電位となるメタライズ部１５が、外部接続用電極端子１９と外部配線基板３０の電極パッド３１との導通固着に使用する導電性接合材の流出により、電気的に短絡する虞のない圧電発振器を得ることが可能となる。   Here, as shown in FIG. 1 to FIG. 3, the characteristic part of the present invention is that the second package body 10 is located on the inner side of the external connection electrode terminal 19 on the outer mounting main surface of the second package body 10. A concave third space portion 20 that opens toward the outside is formed, and a metallized portion 15 having a GND potential is formed on the inner bottom surface of the third space portion 20. There is a possibility that the metallized portion 15 which becomes the GND potential with the electrode terminal 19 may be electrically short-circuited due to the outflow of the conductive bonding material used for conductive fixation between the external connection electrode terminal 19 and the electrode pad 31 of the external wiring board 30. It is possible to obtain a piezoelectric oscillator that does not.

更に、メタライズ部１５の開口部側全面に絶縁性のアルミナコーティング１６が形成されていることから、ＧＮＤ電位となるメタライズ部１５が完全に保護されることにより、万が一に導電性接合材が第３の空間部内にまで流出した場合においても、外部接続用電極端子１９とメタライズ部１５との短絡防止を確実とすることが可能となり、圧電発振器の更なる小型化が要求されても電気的短絡が起こることがない電気的信頼性の高い圧電発振器を得る事が可能となる。   Furthermore, since the insulating alumina coating 16 is formed on the entire opening side of the metallized part 15, the metallized part 15 having the GND potential is completely protected. Even if it flows into the space portion, it is possible to reliably prevent the external connection electrode terminal 19 and the metallized portion 15 from being short-circuited, and even if the piezoelectric oscillator is required to be further reduced in size, an electrical short-circuit can occur. It is possible to obtain a piezoelectric oscillator with high electrical reliability that does not occur.

尚、本発明は上述の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。例えば、上述の実施形態においては、メタライズ部の開口部側表面全面に形成する保護コートとして、アルミナによるコートを開示したが、メタライズ部表面を流出した導電性接合材より電気的に絶縁できるのであれば、アルミナに限定することはなく、他の材質のコートでも本発明の技術的範囲に含まれることは言うまでも無い。   In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. For example, in the above-described embodiment, a coating made of alumina is disclosed as a protective coating formed on the entire surface of the opening of the metallized portion. However, it can be electrically insulated from the conductive bonding material that has flowed out of the surface of the metalized portion. For example, it is not limited to alumina, and it goes without saying that coats of other materials are also included in the technical scope of the present invention.

図１は、本発明の実施形態にかかる圧電発振器を、図２記載の仮想切断線Ｘ−Ｘ’で切断した場合の概略断面図である。FIG. 1 is a schematic cross-sectional view of the piezoelectric oscillator according to the embodiment of the present invention cut along a virtual cutting line X-X ′ shown in FIG. 2. 図２は、図１記載の圧電発振器を、第２のパッケージ体１０の外側実装主面側から見た外観平面図である。FIG. 2 is an external plan view of the piezoelectric oscillator shown in FIG. 1 as viewed from the outer mounting main surface side of the second package body 10. 図３は、本発明の実施形態にかかる圧電発振器を、外部配線基板に実装した形態を示す概略断面図である。FIG. 3 is a schematic cross-sectional view showing a form in which the piezoelectric oscillator according to the embodiment of the present invention is mounted on an external wiring board. 図４は、従来の圧電発振器の概略断面図である。FIG. 4 is a schematic sectional view of a conventional piezoelectric oscillator.

符号の説明Explanation of symbols

１・・・圧電発振器
２・・・第１のパッケージ体
３・・・第１の側壁部
４・・・蓋体
５・・・圧電振動素子
６・・・集積回路素子
７・・・第１の空間部
８・・・第２の空間部
１０・・・第２のパッケージ体
１１・・・データ書込用電極端子
１３・・・第２の側壁部
１４・・・熱硬化性樹脂
１５・・・メタライズ部
１６・・・アルミナ
１７・・・第２のパッケージ体接続用電極端子
１８・・・第１のパッケージ体接続用電極端子
１９・・・外部接続用電極端子
２０・・・第３の空間部
３０・・・外部配線基板
３１・・・電極パッド
３２・・・導電性接合材 DESCRIPTION OF SYMBOLS 1 ... Piezoelectric oscillator 2 ... 1st package body 3 ... 1st side wall part 4 ... Cover body 5 ... Piezoelectric vibration element 6 ... Integrated circuit element 7 ... 1st 8 ... 2nd space 10 ... 2nd package body 11 ... Electrode terminal for data writing 13 ... 2nd side wall 14 ... Thermosetting resin 15. ..Metalized portion 16... Alumina 17... Second package body connection electrode terminal 18... First package body connection electrode terminal 19... External connection electrode terminal 20. 30 ... External wiring board 31 ... Electrode pad 32 ... Conductive bonding material

Claims (2)

絶縁性の第１の基体の一方の主面には凹形状の第１の空間部が形成され、該第１の空間部内には圧電振動素子が搭載され、該圧電振動素子は該基板の他方の主面に形成した第２のパッケージ接続用電極端子と電気的に接続されており、金属製の蓋体が、該第１の空間部を囲繞する第１の側壁部の該第１の空間部開口側頂面に、該第１の空間部開口部を塞ぐ形態で配置固着されて、該第１の空間部を気密封止した第１のパッケージ体と、
絶縁性の第２の基体の一方の主面には凹形状の第２の空間部が形成され、該第２の空間部内には少なくとも発振回路が形成された集積回路素子が配置され、該集積回路素子は該第２の空間部を囲繞する第２の側壁部の該第２の空間部開口側端面に形成された第１のパッケージ接続用電極端子と電気的に接続されており、更に該集積回路素子は該第２の基体の外側実装主面の四隅に形成した外部接続用電極端子とも電気的に接続された第２のパッケージ体とを、
該第１のパッケージ接続用電極端子と該第２のパッケージ接続用電極端子とを機械的及び電気的に接続固着してなる圧電発振器において、
該第２のパッケージ体の該外側実装主面の該外部接続用電極端子形成位置より内側に、該第２のパッケージ体外側に向かって開口する凹形状の第３の空間部が形成されており、且つ該第３の空間部内底面にはＧＮＤ電位のメタライズ部が形成されていることを特徴とする圧電発振器。 A concave first space is formed on one main surface of the insulating first base, and a piezoelectric vibration element is mounted in the first space, and the piezoelectric vibration element is disposed on the other side of the substrate. The first space in the first side wall portion that is electrically connected to the second package connection electrode terminal formed on the main surface of the first side wall and surrounds the first space portion. A first package body that is disposed and fixed on the top surface of the portion opening side so as to close the first space portion opening and hermetically seals the first space portion;
A concave second space is formed on one main surface of the insulating second base, and an integrated circuit element in which at least an oscillation circuit is formed is disposed in the second space. The circuit element is electrically connected to a first package connection electrode terminal formed on an end surface of the second space portion opening side of the second side wall portion surrounding the second space portion, and The integrated circuit element includes a second package body electrically connected to external connection electrode terminals formed at the four corners of the outer mounting main surface of the second substrate.
In the piezoelectric oscillator formed by mechanically and electrically connecting and fixing the first package connection electrode terminal and the second package connection electrode terminal,
A concave third space that opens toward the outside of the second package body is formed inside the external connection electrode terminal forming position on the outer mounting main surface of the second package body. In addition, a piezoelectric oscillator characterized in that a GND potential metallized portion is formed on the inner bottom surface of the third space. 該メタライズ部の開口部側全面がアルミナによってコーティングされていることを特徴とする請求項１記載の圧電発振器。   2. The piezoelectric oscillator according to claim 1, wherein the entire surface of the metallized portion on the opening side is coated with alumina.
JP2005378189A 2005-12-28 2005-12-28 Piezoelectric oscillator Pending JP2007180994A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009246696A (en) * 2008-03-31 2009-10-22 Nippon Dempa Kogyo Co Ltd Crystal oscillator for surface mounting

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009246696A (en) * 2008-03-31 2009-10-22 Nippon Dempa Kogyo Co Ltd Crystal oscillator for surface mounting

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