JP2007165554A - Substrate processor and substrate processing method - Google Patents

Substrate processor and substrate processing method Download PDF

Info

Publication number
JP2007165554A
JP2007165554A JP2005359345A JP2005359345A JP2007165554A JP 2007165554 A JP2007165554 A JP 2007165554A JP 2005359345 A JP2005359345 A JP 2005359345A JP 2005359345 A JP2005359345 A JP 2005359345A JP 2007165554 A JP2007165554 A JP 2007165554A
Authority
JP
Japan
Prior art keywords
substrate
brush
bristle bundle
liquid supply
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2005359345A
Other languages
Japanese (ja)
Inventor
Yasushi Oda
裕史 小田
Junhei Kawane
旬平 川根
Yoshikuni Takeichi
芳邦 竹市
Satoshi Yamamoto
悟史 山本
Takao Matsumoto
▲隆▼雄 松本
Masaaki Goto
正昭 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP2005359345A priority Critical patent/JP2007165554A/en
Priority to TW095140963A priority patent/TW200727358A/en
Priority to KR1020060123632A priority patent/KR100841501B1/en
Priority to CNB2006101642909A priority patent/CN100446177C/en
Publication of JP2007165554A publication Critical patent/JP2007165554A/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To secure a sufficient cleaning function while reducing damage caused on a substrate surface during cleaning. <P>SOLUTION: A substrate processor is provided with long brushes 221 respectively having a bristle bundle composed of a large number of bristles; a transfer roller for transferring a substrate B to the brushes 221 in an intersecting direction with an extending direction of the brushes 221; a support mechanism which supports each brush 221 in a state that the tip 50H of the brush bristle bundle 50 of each brush 221 is directed at the downstream side, in the transfer direction of the substrate B transferred by the transfer roller, and also, in a state that the side 50F of the brush bristle bundle 50 of each brush 221 is brought into contact with the upper face of the substrate B; and processing liquid supply nozzles 231 for respectively supplying a processing liquid to the brush bristle bundle 50 of each brush 221 supported by the support mechanism. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、液晶表示デバイス（ＬＣＤ）、プラズマ表示デバイス（ＰＤＰ）、半導体デバイス等の製造プロセスにおいて、ＬＣＤ又はＰＤＰ用ガラス基板、半導体基板、プリント基板等に対して各種の処理、例えば洗浄処理を行う基板処理装置及び基板処理方法に関する。   In the manufacturing process of a liquid crystal display device (LCD), a plasma display device (PDP), a semiconductor device, etc., the present invention performs various processes such as a cleaning process on a glass substrate for LCD or PDP, a semiconductor substrate, a printed circuit board, The present invention relates to a substrate processing apparatus and a substrate processing method.

従来から、ＬＣＤまたはＰＤＰ用ガラス基板等の基板製造ラインにおいては、例えばエッチング処理等の薬液を用いて基板処理を行う特定の処理装置の後に基板洗浄機構を配設し、基板表面に残った薄膜やパーティクル等の異物を洗浄除去することが行われている。このような基板洗浄機構を有する基板処理装置としては、例えば、特許文献１に示されるように、ローラコンベア等の搬送手段により搬送される基板に純水等の処理液を供給しつつ、該基板表面に円筒状のロールブラシを当接させるものが提案されている。   Conventionally, in a substrate production line such as a glass substrate for LCD or PDP, a thin film remaining on the substrate surface by providing a substrate cleaning mechanism after a specific processing apparatus that performs a substrate processing using a chemical solution such as an etching process. Cleaning and removing foreign matters such as particles and particles. As a substrate processing apparatus having such a substrate cleaning mechanism, for example, as shown in Patent Document 1, while supplying a processing liquid such as pure water to a substrate transported by transporting means such as a roller conveyor, the substrate The thing which makes a cylindrical roll brush contact | abut on the surface is proposed.

また、特許文献２に示されるように、搬送される基板の上面側及び下面側に、棒状ブラシを所定間隔で複数配設し、基板搬送方向に対して直交する方向に往復運動させることで基板上の埃等を除去する洗浄装置も提案されている。
特開平９−３２６３７７号公報 特開平１０−３４０９０号公報 Further, as shown in Patent Document 2, a plurality of rod-shaped brushes are arranged at predetermined intervals on the upper surface side and the lower surface side of a substrate to be transported, and the substrate is reciprocated in a direction perpendicular to the substrate transport direction. A cleaning device for removing dust and the like on the top has also been proposed.
JP 9-326377 A Japanese Patent Laid-Open No. 10-34090

しかしながら、上記特許文献１に示される基板処理装置は、ロールブラシを回転させて基板を洗浄するため、柔らかい金属膜等（例えば、Al（アルミニウム）や、Mo（モリブデン）＋Al等の金属膜等）が形成された基板表面を洗浄する場合には、当該金属膜にダメージを与えるおそれがある。   However, since the substrate processing apparatus disclosed in Patent Document 1 rotates the roll brush to clean the substrate, a soft metal film or the like (for example, a metal film such as Al (aluminum) or Mo (molybdenum) + Al) or the like. When cleaning the substrate surface on which is formed, the metal film may be damaged.

また、上記特許文献２に示される洗浄装置でも、ブラシを基板表面に当接させた状態で、基板搬送方向に対して直交する方向に往復運動させるため、柔らかい金属膜等が形成された基板表面を洗浄する場合には、当該金属膜に与えるダメージを与えるおそれがある。   Further, even in the cleaning apparatus disclosed in Patent Document 2, the surface of the substrate on which a soft metal film or the like is formed in order to reciprocate in a direction orthogonal to the substrate transport direction with the brush in contact with the substrate surface In the case of cleaning, there is a risk of damaging the metal film.

さらに、単に基板表面に与えるダメージを低減させるだけではなく、基板表面の洗浄機能を確保しなければならないため、基板表面に与えるダメージ低減と、基板表面の洗浄機能向上の両立が期待される。   Further, since it is necessary not only to reduce the damage to the substrate surface but also to ensure the cleaning function of the substrate surface, it is expected to reduce both the damage to the substrate surface and improve the cleaning function of the substrate surface.

本発明は、上記の問題を解決するためになされたものであり、洗浄時における基板表面に与えるダメージを軽減しつつ、充分な洗浄機能を確保することを目的とするものである。   The present invention has been made to solve the above-described problems, and an object of the present invention is to ensure a sufficient cleaning function while reducing damage to the substrate surface during cleaning.

本発明の請求項１に記載の発明は、多数の毛からなる毛束を有する長尺状のブラシと、
前記ブラシが延びる方向と交差する方向に、前記ブラシに対して基板を相対的に移動させる移動手段と、
前記ブラシの毛束先端部が、前記移動手段による基板移動方向の下流側に向き、前記ブラシの毛束の側部が当該基板の主面に当接する状態として、前記ブラシを支持する支持手段と、
前記支持手段によって支持される前記ブラシの毛束に対して液体を供給する液体供給手段とを備える基板処理装置である。 The invention according to claim 1 of the present invention is a long brush having a hair bundle composed of a large number of hairs;
Moving means for moving the substrate relative to the brush in a direction intersecting with the direction in which the brush extends;
A support means for supporting the brush in such a state that a front end portion of the bristle bundle of the brush faces a downstream side of the substrate moving direction by the moving means, and a side portion of the bristle bundle of the brush contacts the main surface of the substrate. ,
A substrate processing apparatus comprising: a liquid supply unit configured to supply a liquid to the bristle bundle of the brush supported by the support unit.

また、請求項４に記載の発明は、ブラシの毛束先端部を基板の移動方向下流側に向け、当該ブラシの毛束の側部が当該基板の主面に当接する状態として、前記基板を前記ブラシに対して相対的に移動させ、当該ブラシの毛束に対して液体を供給することによって前記基板を処理する基板処理方法である。   According to a fourth aspect of the present invention, the tip of the hair bundle of the brush is directed downstream in the moving direction of the substrate, and the side of the hair bundle of the brush is in contact with the main surface of the substrate. It is a substrate processing method which processes the said board | substrate by moving relatively with respect to the said brush and supplying a liquid with respect to the bristle bundle | flux of the said brush.

これらによれば、支持手段によってブラシの毛束の側部が当該基板の主面に当接する状態とすることで、毛先で基板主面を摩擦する従来方式よりも、ブラシが基板主面に対して柔軟に接触するようにして、基板主面に損傷を与えにくくしている。また、この状態で基板主面に当接しているブラシの毛束に対して、液体供給手段から液体を供給することにより、ブラシに均等な圧力を与えることができる。その結果、基板から汚染物を均一に浮かび上がらせることが可能となり、均一な洗浄効果が得られる。   According to these, by making the side part of the bristle bundle of the brush contact the main surface of the substrate by the supporting means, the brush is brought into contact with the main surface of the substrate as compared with the conventional method of rubbing the main surface of the substrate with the hair tips. On the other hand, the main surface of the substrate is hardly damaged by making a flexible contact. In addition, even pressure can be applied to the brush by supplying the liquid from the liquid supply means to the bristle bundle of the brush that is in contact with the main surface of the substrate in this state. As a result, contaminants can be evenly lifted from the substrate, and a uniform cleaning effect can be obtained.

また、請求項２に記載の発明は、請求項１に記載の基板処理装置であって、前記液体供給手段による前記液体の供給が、前記移動手段によって移動される基板の主面部分に対しては行われず、前記ブラシの毛束の側部に対してのみ行われるものである。   The invention according to claim 2 is the substrate processing apparatus according to claim 1, wherein the supply of the liquid by the liquid supply means is performed on the main surface portion of the substrate moved by the moving means. Is not performed, and is performed only on the side portion of the bristle bundle of the brush.

また、請求項５に記載の発明は、請求項４に記載の基板処理方法であって、前記液体の供給を、前記基板の主面部分に対しては行わず、前記ブラシの毛束の側部に対してのみ行うものである。   Further, the invention according to claim 5 is the substrate processing method according to claim 4, wherein the liquid is not supplied to the main surface portion of the substrate, but the brush bundle side. This is only done for parts.

これらによれば、液体供給手段による液体の供給を、基板の主面部分に対して行わず、ブラシの毛束の側部に対してのみ行うことによって、当該液体により基板主面上で液層流が形成され易くなるようにしている。   According to these, the liquid supply by the liquid supply means is not performed on the main surface portion of the substrate, but only on the side portion of the bristle bundle of the brush, whereby the liquid layer is formed on the main surface of the substrate by the liquid. A flow is easily formed.

また、請求項３に記載の発明は、請求項１又は請求項２に記載の基板処理装置であって、前記液体供給手段は、前記ブラシに対する液体供給圧を可変させる液体供給圧変更機構を備えているものである。   The invention according to claim 3 is the substrate processing apparatus according to claim 1 or 2, wherein the liquid supply means includes a liquid supply pressure changing mechanism that varies a liquid supply pressure to the brush. It is what.

この構成によれば、液体供給圧変更機構によってブラシに対する液体供給圧を可変させることで、ブラシによる基板主面に対する押圧力を簡単かつ迅速に変更することができる。   According to this configuration, by changing the liquid supply pressure with respect to the brush by the liquid supply pressure changing mechanism, it is possible to easily and quickly change the pressing force against the substrate main surface by the brush.

請求項１及び請求項４に記載の発明によれば、ブラシの毛束の側部が当該基板の主面に当接し、ブラシが基板主面に対して柔軟に接触するので、ブラシが基板主面に与えるダメージを低減することができる。これにより、セカンドレイヤー以降のデリケートな工程にも、本発明を採用することが可能である。   According to the invention described in claim 1 and claim 4, since the side portion of the bristle bundle of the brush is in contact with the main surface of the substrate and the brush is in flexible contact with the main surface of the substrate, the brush is the main substrate. Damage to the surface can be reduced. Thereby, it is possible to employ the present invention also for delicate processes after the second layer.

また、従来の回転ブラシや揺動ブラシのようなブラシ先端と基板主面との間における厳密なギャップ調整が不要になる。   In addition, strict gap adjustment between the tip of the brush and the main surface of the substrate, such as a conventional rotating brush or swing brush, is not necessary.

また、この状態で基板主面に当接しているブラシの毛束に対して、液体供給手段から液体を供給することにより、ブラシに均等な圧力を与えることができる。その結果、基板から汚染物を均一に浮かび上がらせることが可能となり、均一な洗浄効果が得られる。従って、洗浄時における基板表面に与えるダメージ軽減と、充分な洗浄機能の確保とを両立することができる。   In addition, even pressure can be applied to the brush by supplying the liquid from the liquid supply means to the bristle bundle of the brush that is in contact with the main surface of the substrate in this state. As a result, contaminants can be evenly lifted from the substrate, and a uniform cleaning effect can be obtained. Therefore, it is possible to achieve both reduction of damage to the substrate surface during cleaning and securing of a sufficient cleaning function.

さらに、従来のようにブラシの回転機構や揺動機構を必要とすることなく良好な洗浄機能を確保できるので、その分コスト低減を図ることができる。   Furthermore, since a good cleaning function can be secured without the need for a brush rotation mechanism or a swing mechanism as in the prior art, the cost can be reduced accordingly.

請求項２及び請求項５に記載の発明によれば、基板主面上において液体による液層流が形成され易くなり、基板主面を洗浄する能力を向上させることができる。   According to the second and fifth aspects of the invention, a liquid laminar flow is easily formed on the main surface of the substrate, and the ability to clean the main surface of the substrate can be improved.

請求項３に記載の発明によれば、液体供給圧変更機構によってブラシに対する液体供給圧を可変させることにより、ブラシによる基板主面に対する押圧力を簡単かつ迅速に変更することができる。   According to the third aspect of the present invention, by changing the liquid supply pressure to the brush by the liquid supply pressure changing mechanism, the pressing force of the brush against the main surface of the substrate can be changed easily and quickly.

以下、本発明の一実施形態に係る基板処理装置及び基板処理方法について図面を参照して説明する。図１は本発明の一実施形態に係る基板処理装置に備えられる基板洗浄装置の概略を示す図である。基板処理装置１に備えられる基板洗浄装置１０は、処理対象となる基板Ｂに対し薬液処理を行うブラシ洗浄室２と、ブラシ洗浄室２を通過した基板Ｂに対して濯ぎを行うリンス室３と、エアナイフ室４とを有している。また、基板Ｂは、基板Ｂの搬送方向に直交する水平方向から傾斜させた姿勢で搬送されることが好ましい。基板Ｂをこの姿勢で搬送することによって、ブラシ洗浄室２及びリンス室３において基板Ｂに対して供給される各液を下方に落としやすくして、基板Ｂの面上からの液切れを良くしている。   Hereinafter, a substrate processing apparatus and a substrate processing method according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an outline of a substrate cleaning apparatus provided in a substrate processing apparatus according to an embodiment of the present invention. The substrate cleaning apparatus 10 provided in the substrate processing apparatus 1 includes a brush cleaning chamber 2 that performs chemical treatment on the substrate B to be processed, and a rinse chamber 3 that rinses the substrate B that has passed through the brush cleaning chamber 2. And an air knife chamber 4. Moreover, it is preferable that the board | substrate B is conveyed with the attitude | position inclined from the horizontal direction orthogonal to the conveyance direction of the board | substrate B. FIG. By transporting the substrate B in this posture, the liquid supplied to the substrate B in the brush cleaning chamber 2 and the rinsing chamber 3 can be easily dropped downward, and the liquid breakage from the surface of the substrate B is improved. ing.

ブラシ洗浄室２は、例えば、エッチング工程、剥離工程等の前工程での処理を終えた基板Ｂを受け入れて搬送する搬送ローラ２１と、搬送ローラ２１によって搬送される基板Ｂの上面に接触して洗浄するブラシ２２１と、基板Ｂの下面に接触して洗浄するブラシ２２２と、基板Ｂの上面側に配設されたブラシ２２１に対して純水等の処理液（基板洗浄のために用いる各種の処理液の適用が可能。純水は一例）を供給する処理液供給ノズル（液体供給手段）２３１と、基板Ｂの下面側に配設されたブラシ２２２に対して処理液を供給する処理液供給ノズル（液体供給手段）２３２とを有している。これらブラシ２２１，２２２と、処理液供給ノズル２３１，２３２はそれぞれ複数設けられている。また、処理液供給ノズル２３１，２３２は、乾いた基板Ｂの表面をブラシ２２１，２２２が摺接することによる表面へのダメージを防止するために、ブラシ２２１，２２２よりも基板搬送方向上流側（ブラシ２２１，２２２による基板Ｂの摺接前）の位置にも配設されており、その処理液吐出方向は基板搬送方向下流側に向けられている。なお、処理液供給ノズル２３１，２３２は処理液供給源７（図４）に連結されている。   For example, the brush cleaning chamber 2 is in contact with the transport roller 21 that receives and transports the substrate B that has been processed in the previous process such as the etching process and the peeling process, and the upper surface of the substrate B that is transported by the transport roller 21. A brush 221 to be cleaned, a brush 222 to be cleaned in contact with the lower surface of the substrate B, and a treatment liquid such as pure water (various types used for substrate cleaning) are applied to the brush 221 disposed on the upper surface side of the substrate B. A treatment liquid can be applied. A treatment liquid supply for supplying a treatment liquid to a treatment liquid supply nozzle (liquid supply means) 231 for supplying pure water is an example) and a brush 222 disposed on the lower surface side of the substrate B. And a nozzle (liquid supply means) 232. A plurality of these brushes 221 and 222 and a plurality of treatment liquid supply nozzles 231 and 232 are provided. Further, the treatment liquid supply nozzles 231 and 232 are disposed upstream of the brushes 221 and 222 in the substrate transport direction (brushes) in order to prevent damage to the surface due to the brushes 221 and 222 slidingly contacting the surface of the dry substrate B. 221 and 222 are also disposed at a position before the substrate B is slidably contacted, and the processing liquid discharge direction is directed to the downstream side in the substrate transport direction. The processing liquid supply nozzles 231 and 232 are connected to the processing liquid supply source 7 (FIG. 4).

リンス室３は、ブラシ洗浄室２での処理を終えた基板Ｂに対して濯ぎ処理を行うものである。リンス室３は、ブラシ洗浄室２から基板Ｂを受け入れて搬送する搬送ローラ３１と、リンス液として純水等を基板Ｂの上面に供給するリンス液供給ノズル３２と、基板Ｂの下面にリンス液を供給するリンス液供給ノズル３３とを有する。   The rinsing chamber 3 performs a rinsing process on the substrate B that has been processed in the brush cleaning chamber 2. The rinse chamber 3 includes a transport roller 31 that receives and transports the substrate B from the brush cleaning chamber 2, a rinse liquid supply nozzle 32 that supplies pure water or the like as a rinse liquid to the upper surface of the substrate B, and a rinse liquid on the lower surface of the substrate B A rinsing liquid supply nozzle 33 for supplying

エアナイフ室４は、リンス室３から搬送されてくる基板Ｂを受け入れて搬送する搬送ローラ４１と、搬送ローラ４１により搬送される基板Ｂの上面に対してエアを吹き付けて基板Ｂの上面を乾燥させるエアナイフ４２１と、基板Ｂの下面に対してエアを吹き付けて乾燥させるエアナイフ４２２とを有する。   The air knife chamber 4 receives and transports the substrate B transported from the rinse chamber 3, and blows air onto the upper surface of the substrate B transported by the transport roller 41 to dry the upper surface of the substrate B. It has an air knife 421 and an air knife 422 that blows air against the lower surface of the substrate B to dry it.

図２は基板洗浄装置１０のブラシ洗浄室２に備えられるブラシ２２１を基板Ｂの搬送方向上流側から見た側面図である。なお、ブラシ２２２は当該ブラシ２２１と同様の構成である。ブラシ洗浄室２のブラシ２２１は、基板Ｂの面洗浄用のブラシ毛束５０と、このブラシ毛束５０が立設（植毛）されるブラシ基部５１とを有する。これらブラシ毛束５０及びブラシ基部５１からなるブラシ２２１は、基板Ｂの搬送方向に交差する方向（例えば、直交する方向又はそれに近い方向など）であって、基板Ｂの上面に平行な方向に延びる長尺状の形状とされている。また、ブラシ２２１は、基板Ｂの面に対して直交する姿勢から予め定められた角度だけブラシ毛束５０の先端５０Ｈ（図３）側を基板Ｂの搬送方向下流側に向けて、傾けた姿勢とされている。これにより、ブラシ２２１は、ブラシ毛束５０の側部５０Ｆ（ブラシ毛束５０の腹部分）が当該基板Ｂの主面に当接する状態とされる（詳細は後述）。   FIG. 2 is a side view of the brush 221 provided in the brush cleaning chamber 2 of the substrate cleaning apparatus 10 as viewed from the upstream side in the transport direction of the substrate B. The brush 222 has the same configuration as the brush 221. The brush 221 of the brush cleaning chamber 2 includes a brush hair bundle 50 for cleaning the surface of the substrate B, and a brush base 51 on which the brush hair bundle 50 is erected (planted). The brush 221 including the brush bristle bundle 50 and the brush base 51 extends in a direction that intersects the transport direction of the substrate B (for example, a direction that is orthogonal or a direction close thereto) and that is parallel to the upper surface of the substrate B. It has a long shape. Further, the brush 221 is inclined such that the tip 50H (FIG. 3) side of the bristle bundle 50 is directed downstream in the conveyance direction of the substrate B from a posture orthogonal to the surface of the substrate B. It is said that. Thus, the brush 221 is brought into a state in which the side portion 50F of the brush bristle bundle 50 (the belly part of the brush bristle bundle 50) is in contact with the main surface of the substrate B (details will be described later).

ブラシ基部５１の上面部１１１側には、支持機構（支持手段）６が設けられている。支持機構６は、支持材６０及びブラシ取り付けベース６１を有し、支持材６０によってブラシ２２１が吊止め支持され、この支持材６０によってブラシ２２１が、剛直な部材からなるブラシ取り付けベース６１に取り付けられている。ブラシ取り付けベース６１は、例えば、ブラシ洗浄室２の側壁等に固設されている。   A support mechanism (support means) 6 is provided on the upper surface 111 side of the brush base 51. The support mechanism 6 includes a support material 60 and a brush mounting base 61, and the brush 221 is supported by suspension by the support material 60. The brush 221 is attached to the brush mounting base 61 made of a rigid member by the support material 60. ing. The brush mounting base 61 is fixed to, for example, a side wall of the brush cleaning chamber 2.

また、ブラシ基部５１の高さ位置は、ブラシ毛束５０をなす各毛の径や材質（硬さ）等、基板Ｂの上面に対するブラシ毛束５０の角度（傾き）、並びに洗浄ターゲットとするパーティクルの粒径等を考慮し、洗浄すべき基板Ｂの上面に、どの程度の圧力で、またどの程度の接触面積でブラシ毛束５０の側部５０Ｆを接触させるかの観点から決定される。   In addition, the height position of the brush base 51 includes the diameter and material (hardness) of each bristles forming the bristles 50, the angle (inclination) of the bristles 50 with respect to the upper surface of the substrate B, and the particles to be cleaned. In consideration of the particle size, etc., it is determined from the viewpoint of the pressure and the contact area of the side portion 50F of the brush bristle bundle 50 on the upper surface of the substrate B to be cleaned.

なお、支持材６０は、図２に示す距離Ｇを可変させられるように、ブラシ取り付けベース６１に対して移動自在に設けられている。ブラシ取り付けベース６１に対する支持材６０の位置を調整することにより、基板Ｂ上面に対するブラシ基部５１の高さ位置を微調整する作業が可能である。例えば、ブラシ基部５１が、大型の基板に対応した長尺状である場合、ブラシ基部５１の長手方向略中央部は、下方向に撓みやすい。そのような場合には、当該撓んだ部分に近い支持材６０のブラシ取り付けベース６１に対する位置を調整することで、撓んだ部分を幾分上方向に持ち上げることが可能である。これにより、ブラシ毛束５０の側部５０Ｆの基板Ｂ上面に対する位置関係を、ブラシ２２２の長手方向において均一にすることも可能となっている。   The support member 60 is provided so as to be movable with respect to the brush mounting base 61 so that the distance G shown in FIG. By adjusting the position of the support material 60 with respect to the brush mounting base 61, it is possible to finely adjust the height position of the brush base 51 with respect to the upper surface of the substrate B. For example, when the brush base 51 has a long shape corresponding to a large substrate, the substantially central portion in the longitudinal direction of the brush base 51 is easily bent downward. In such a case, the bent portion can be lifted somewhat upward by adjusting the position of the support member 60 close to the bent portion with respect to the brush mounting base 61. Accordingly, the positional relationship of the side portion 50F of the brush bristle bundle 50 with respect to the upper surface of the substrate B can be made uniform in the longitudinal direction of the brush 222.

次に、ブラシ２２１の構造について説明する。図３は、ブラシ２２１の側断面図である。なお、ブラシ２２２も同様の構成である。ブラシ２２１は、上述したように、基板Ｂの面洗浄用のブラシ毛束５０と、このブラシ毛束５０が立設（植毛）されるブラシ基部５１とを有する。ブラシ毛束５０は、多数本の毛が、その長さ方向における略中央部に軸５２が挟み込まれ、当該軸５２を挟み込んだブラシ毛束５０部分にその上方からブラシ基部５１が被せられている。ブラシ基部５１は、断面形状が側面視で略「コ」の字状とされ、下方開口部に向けて側面視で先細り形状とされている。かかる形状のブラシ基部５１により、当該軸５２を挟み込んだブラシ毛束５０部分がブラシ基部５１の内部に収められ、ブラシ基部５１により、かしめられた状態とされている。   Next, the structure of the brush 221 will be described. FIG. 3 is a side sectional view of the brush 221. The brush 222 has the same configuration. As described above, the brush 221 includes the brush bristle bundle 50 for cleaning the surface of the substrate B and the brush base 51 on which the brush bristle bundle 50 is erected (planted). The brush bristle bundle 50 has a large number of bristles in which a shaft 52 is sandwiched at a substantially central portion in the length direction, and a brush base 51 is covered from above the brush bristle bundle 50 portion sandwiching the shaft 52. . The brush base 51 has a substantially “U” shape in cross section when viewed from the side, and has a tapered shape when viewed from the side toward the lower opening. With this shape of the brush base 51, the portion of the bristle bundle 50 sandwiching the shaft 52 is housed inside the brush base 51, and is caulked by the brush base 51.

ブラシ毛束５０をなす各毛は、例えば、ナイロン系、テフロン（登録商標）系、塩化ビニール（ＰＶＣ：Poly Vinyl Chloride）系の材質からなり、例えば、径は0.05〜0.2(mm)とされる。ブラシ毛束５０は、ブラシ基部５１から露出した部分の長さＬが、例えば、10≦Ｌ≦60(mm)とされる。   Each bristle forming the bristle bundle 50 is made of, for example, nylon, Teflon (registered trademark), or polyvinyl chloride (PVC), and has a diameter of 0.05 to 0.2 (mm), for example. . The length L of the portion of the brush hair bundle 50 exposed from the brush base 51 is, for example, 10 ≦ L ≦ 60 (mm).

また、ブラシ基部５１の基板搬送方向における幅寸法Ｗは、ブラシ毛束５０が立設（植毛）可能である限り小さい寸法であることが好ましく、具体的には、10mm以下であることが好ましい。ブラシ基部５１の長さ方向寸法は、処理対象となる基板の搬送方向に直交する方向における寸法に合わせて逐次設定される。   Further, the width dimension W in the substrate transport direction of the brush base 51 is preferably as small as possible so long as the bristle bundle 50 can be erected (planted), and specifically, it is preferably 10 mm or less. The length direction dimension of the brush base 51 is sequentially set according to the dimension in the direction orthogonal to the transport direction of the substrate to be processed.

図４は、基板Ｂに対するブラシ２２１，２２２及び処理液供給ノズル２３１，２３２の配置を示す側面図である。ブラシ２２１，２２２は、それぞれ基板Ｂの上方又は下方に配設される。   FIG. 4 is a side view showing the arrangement of the brushes 221 and 222 and the treatment liquid supply nozzles 231 and 232 with respect to the substrate B. The brushes 221 and 222 are disposed above or below the substrate B, respectively.

ブラシ２２１，２２２は、ブラシ毛束５０の先端５０Ｈ側を基板Ｂの搬送方向下流側に向けて、基板Ｂの上面又は下面に対して直交する姿勢から予め定められた傾斜角度θ１だけ傾けた姿勢とされている。そして、ブラシ２２１，２２２は、ブラシ２２１，２２２の側部５０Ｆが、基板Ｂの上面又は下面に当接する状態とされている。このブラシ２２１，２２２の傾斜角度θ１は、45°〜75°（最適な角度は60°）である。ブラシ２２１，２２２を、上記のように基板Ｂの上面又は下面に対して傾けた姿勢で配置することにより、ブラシ２２１，２２２のブラシ毛束５０と基板Ｂの各面とのギャップ調節に精度が要求されない。また、ブラシ２２１，２２２の傾斜角度θ１の設定を高い精度で行わなくても、ブラシ毛束５０の側部５０Ｆと基板Ｂの各面との間に隙間が生じたり、側部５０Ｆによって基板Ｂの各面が不必要に押圧されてしまう不具合を生じる可能性は極めて少ない。さらに、ブラシ毛束５０の先端５０Ｈで基板Ｂの上面又は下面を摩擦するよりも、ブラシ２２１，２２２の側部５０Ｆが基板Ｂの上面又は下面に対して柔軟に接触するので、基板Ｂの上面又は下面に損傷を与えにくい。 The brushes 221 and 222 are inclined by a predetermined inclination angle θ 1 from a posture orthogonal to the upper surface or the lower surface of the substrate B with the tip 50H side of the brush bristle bundle 50 facing downstream in the transport direction of the substrate B. It is assumed to be a posture. The brushes 221 and 222 are in a state in which the side portions 50F of the brushes 221 and 222 are in contact with the upper surface or the lower surface of the substrate B. The inclination angle theta 1 of the brush 221, 222 is 45 ° to 75 ° (optimal angle is 60 °). By arranging the brushes 221 and 222 so as to be inclined with respect to the upper or lower surface of the substrate B as described above, the accuracy of adjusting the gap between the brush bristle bundle 50 of the brushes 221 and 222 and each surface of the substrate B is improved. Not required. Further, even if the setting of the inclination angle θ 1 of the brushes 221 and 222 is not performed with high accuracy, a gap is generated between the side portion 50F of the bristle bundle 50 and each surface of the substrate B, or the substrate is caused by the side portion 50F. There is very little possibility of causing a problem that each surface of B is unnecessarily pressed. Furthermore, since the side portions 50F of the brushes 221 and 222 are in contact with the upper surface or the lower surface of the substrate B rather than rubbing the upper surface or the lower surface of the substrate B with the tip 50H of the brush bristle bundle 50, the upper surface of the substrate B Or, it is difficult to damage the lower surface.

処理液供給ノズル２３１，２３２は、例えば、(1)主に純水を高圧で吐出する高圧ノズル、(2)霧吹き状に液滴を圧力によって基板に供給することによって、液流体と気流体の二流体を噴射する二流体ノズル、(3)超音波振動が付与された純水を吐出する超音波ノズルなどである。処理液供給ノズル２３１，２３２は、ブラシ２２１，２２２よりも基板搬送方向下流側における基板Ｂの上方又は下方に配設される。   The processing liquid supply nozzles 231 and 232 include, for example, (1) a high-pressure nozzle that mainly discharges pure water at a high pressure, and (2) a liquid spray and a gas-fluid by supplying liquid droplets to the substrate in a sprayed manner. A two-fluid nozzle that ejects two fluids, and (3) an ultrasonic nozzle that discharges pure water to which ultrasonic vibration is applied. The processing liquid supply nozzles 231 and 232 are disposed above or below the substrate B on the downstream side of the brushes 221 and 222 in the substrate transport direction.

処理液供給ノズル２３１，２３２は、ブラシ毛束５０の側部５０Ｆに処理液が噴射（供給）されるように、配設位置及び配設角度が設定されている。これにより、この状態で基板Ｂの上面又は下面に当接しているブラシ毛束５０の側部５０Ｆに対して、処理液供給ノズル２３１，２３２から処理液を供給することにより、ブラシ２２１，２２２に均等な圧力を与えることができる。その結果、基板Ｂから汚染物を均一に浮かび上がらせることが可能となり、均一な洗浄効果が得られる。   The treatment liquid supply nozzles 231 and 232 have an arrangement position and an arrangement angle so that the treatment liquid is ejected (supplied) to the side portion 50F of the bristle bundle 50. Accordingly, the treatment liquid is supplied from the treatment liquid supply nozzles 231 and 232 to the side portion 50F of the bristle bundle 50 that is in contact with the upper surface or the lower surface of the substrate B in this state, whereby the brushes 221 and 222 are supplied. Even pressure can be applied. As a result, contaminants can be lifted uniformly from the substrate B, and a uniform cleaning effect can be obtained.

また、処理液がブラシ２２１，２２２のブラシ毛束５０を伝って基板Ｂの上面又は下面に流れ出し、基板Ｂの上面又は下面上にブラシ２２１，２２２に沿った均一の液層流が形成される。この液層流により、基板Ｂの上面又は下面上に存在する汚染物が均一的に除去される。さらに、ブラシ毛束５０の側部５０Ｆに処理液供給ノズル２３１，２３２から処理液を供給することでブラシ先端５０Ｈに小さな動きを発生させることができるので、汚染物を基板Ｂから均一に浮かび上がらせることが可能になり、均一な洗浄効果が得られる。   Further, the processing liquid flows along the bristles 50 of the brushes 221 and 222 and flows out to the upper surface or the lower surface of the substrate B, and a uniform liquid laminar flow along the brushes 221 and 222 is formed on the upper or lower surface of the substrate B. . By this liquid laminar flow, contaminants present on the upper surface or the lower surface of the substrate B are uniformly removed. Further, by supplying the processing liquid from the processing liquid supply nozzles 231 and 232 to the side portion 50F of the brush bristle bundle 50, a small movement can be generated at the brush tip 50H, so that the contaminants are evenly raised from the substrate B. And a uniform cleaning effect can be obtained.

なお、処理液供給ノズル２３１，２３２からの処理液の噴射は、(1)ブラシ毛束５０の側部５０Ｆと、基板Ｂの上面又は下面部分との両方に対して噴射してもよいが、(2)ブラシ毛束５０の側部５０Ｆに対してのみ行い、基板Ｂの上面又は下面部分に噴射しないようにした場合は、基板Ｂの各面上において処理液の液層流が形成され易くなり、基板Ｂの各面において更に高い洗浄力が得られる。   In addition, spraying of the processing liquid from the processing liquid supply nozzles 231 and 232 may be performed on both the side portion 50F of the brush bristle bundle 50 and the upper surface or the lower surface portion of the substrate B. (2) When it is performed only on the side portion 50F of the bristle bundle 50 and is not sprayed onto the upper surface or the lower surface portion of the substrate B, a liquid laminar flow of the processing liquid is easily formed on each surface of the substrate B. Thus, higher cleaning power can be obtained on each surface of the substrate B.

また、処理液供給ノズル２３１，２３２は、ブラシ２２１，２２２に供給するための処理液が貯留された処理液供給源７に連結されている。そして、処理液供給ノズル２３１，２３２と処理液供給源７との間には、処理液供給ノズル２３１，２３２からブラシ２２１，２２２に対して供給する液体の供給圧を可変できる供給ポンプ（処理液供給圧変更機構）８が設けられている。この供給ポンプ８により、処理液供給ノズル２３１，２３２からブラシ２２１，２２２に供給される処理液の供給圧を変更することによって、ブラシ２２１，２２２の側部５０Ｆによる基板Ｂの押圧力を自在に制御できるようになっている。   The processing liquid supply nozzles 231 and 232 are connected to a processing liquid supply source 7 in which processing liquids to be supplied to the brushes 221 and 222 are stored. Between the processing liquid supply nozzles 231 and 232 and the processing liquid supply source 7, a supply pump (processing liquid that can vary the supply pressure of the liquid supplied from the processing liquid supply nozzles 231 and 232 to the brushes 221 and 222. A supply pressure changing mechanism) 8 is provided. By changing the supply pressure of the treatment liquid supplied from the treatment liquid supply nozzles 231 and 232 to the brushes 221 and 222 by the supply pump 8, the pressing force of the substrate B by the side portion 50F of the brushes 221 and 222 can be freely set. It can be controlled.

図５は、ブラシ２２１，２２２及び処理液供給ノズル２３１，２３２がそれぞれ複数配設されている状態を示す側面図である。ブラシ２２１，２２２及び処理液供給ノズル２３１，２３２は、ブラシ洗浄室２にそれぞれ複数設けられ、ブラシ２２１と処理液供給ノズル２３１とが基板Ｂの搬送方向において交互に配置され、同様に、ブラシ２２２と処理液供給ノズル２３２も基板Ｂの搬送方向において交互に配置される。このように構成すれば、それぞれのブラシ及び処理液噴射により、ブラシ２２１，２２２による基板Ｂ各面からの汚れの掻き取りと、処理液供給ノズル２３１，２３２から供給される処理液による汚れ除去とを比較的時間差を設けずに連続して行うことになるため、基板Ｂの各面に対する洗浄力を高めることができる。   FIG. 5 is a side view showing a state where a plurality of brushes 221 and 222 and a plurality of treatment liquid supply nozzles 231 and 232 are arranged. A plurality of brushes 221 and 222 and treatment liquid supply nozzles 231 and 232 are provided in the brush cleaning chamber 2, and the brush 221 and the treatment liquid supply nozzle 231 are alternately arranged in the transport direction of the substrate B. Similarly, the brush 222 And the treatment liquid supply nozzle 232 are also alternately arranged in the transport direction of the substrate B. If comprised in this way, by each brush and process liquid injection, the scraping of the stain | pollution | contamination from each surface of the board | substrate B by brush 221 and 222, and the stain removal by the process liquid supplied from the process liquid supply nozzles 231 and 232, Therefore, the cleaning power for each surface of the substrate B can be increased.

続いて、本発明の他の実施形態を説明する。例えば、上記実施形態では、ブラシ部２２２の構造は、図３に示したように、ブラシ毛束５０の先端５０Ｈの下面部が水平面に平行な形状とされているが、この下面部を、図６に示すように、水平面に対して傾斜角θ２を有する形状としてもよい。そして、このブラシ毛束５０の先端５０Ｈの下面部を基板Ｂの上面又は下面に沿わせるようにする。この場合、ブラシ毛束５０は、ブラシ基部５１から露出した部分であって、最も脚の長い部分の長さＬが、10≦Ｌ≦60(mm)とされる。 Subsequently, another embodiment of the present invention will be described. For example, in the above embodiment, the structure of the brush portion 222 is such that the lower surface portion of the tip 50H of the bristle bundle 50 has a shape parallel to the horizontal plane as shown in FIG. As shown in FIG. 6, it is good also as a shape which has inclination-angle (theta) 2 with respect to a horizontal surface. And the lower surface part of the front-end | tip 50H of this bristle bundle 50 is made to follow the upper surface or lower surface of the board | substrate B. In this case, the bristle bundle 50 is a portion exposed from the brush base 51, and the length L of the longest leg is 10 ≦ L ≦ 60 (mm).

図７は、上記先端５０Ｈに傾斜角θ２を有するブラシ毛束５０からなるブラシ部２２１，２２２及び処理液供給ノズル２３１，２３２の配置を示す側面図である。上記傾斜角θ２を有するブラシ毛束５０からなるブラシ部２２１，２２２を配設する場合も、ブラシ部２２１，２２２は、ブラシ毛束５０の先端５０Ｈ側を基板Ｂの搬送方向下流側に向けて、基板Ｂの上面又は下面に対して直交する姿勢から予め定められた角度θ１だけ傾けた姿勢とされる。先端５０Ｈに傾斜角θ２を有するブラシ毛束５０からなるブラシ部２２１，２２２を、このように基板Ｂの各面に対して傾けた姿勢で配置すると、当該傾斜を有しているブラシ毛束５０は、基板Ｂの各面に対して当接したときに扇状に広がり、先端５０Ｈの厚みが薄くなるため(毛の呈（程度）が疎らになるため)、処理液がブラシ毛束５０と基板Ｂの各面との間に浸透しやすくなり、処理液による処理効率が向上する。 FIG. 7 is a side view showing the arrangement of the brush portions 221 and 222 and the treatment liquid supply nozzles 231 and 232 formed of the bristle bundle 50 having the inclination angle θ 2 at the tip 50H. Even when the brush portions 221 and 222 including the brush bristle bundle 50 having the inclination angle θ 2 are disposed, the brush portions 221 and 222 direct the tip 50H side of the brush bristle bundle 50 toward the downstream side in the conveyance direction of the substrate B. Thus, the posture is inclined by a predetermined angle θ 1 from the posture orthogonal to the upper surface or the lower surface of the substrate B. When the brush portions 221 and 222 comprising the brush bristle bundle 50 having the inclination angle θ 2 at the tip 50H are arranged in such a manner as to be inclined with respect to each surface of the substrate B, the brush bristle bundle having the inclination is arranged. 50 spreads in a fan shape when coming into contact with each surface of the substrate B, and the thickness of the tip 50H becomes thin (because the appearance (degree) of hair becomes sparse). It becomes easy to permeate between each surface of the substrate B, and the processing efficiency by the processing liquid is improved.

なお、本発明は上記実施の形態の構成に限られず種々の変形が可能である。例えば、上記各実施形態では、ブラシ２２１，２２２が基板Ｂの上面及び下面の両面に対向する位置に設けられているが、いずれか一方の面側に設けられていてもよい。   The present invention is not limited to the configuration of the above embodiment, and various modifications can be made. For example, in each of the above embodiments, the brushes 221 and 222 are provided at positions facing both the upper and lower surfaces of the substrate B, but may be provided on either one of the surfaces.

また、上記実施形態では、ブラシ２２１，２２２がブラシ洗浄室２に適用される場合を例にして説明したが、このブラシ２２１，２２２の適用はブラシ洗浄室２に限定されるものではなく、剥離処理や現像処理等の他の処理を行う処理室において、ブラシによる処理を行う場合にも適用可能である。   In the above-described embodiment, the case where the brushes 221 and 222 are applied to the brush cleaning chamber 2 has been described as an example. However, the application of the brushes 221 and 222 is not limited to the brush cleaning chamber 2, and peeling is performed. The present invention can also be applied to a case where processing is performed with a brush in a processing chamber that performs other processing such as processing or development processing.

また、上記実施形態では、ブラシ洗浄室２は、前工程用の処理室と連接させる構成として説明したが、ブラシ２２１，２２２が適用されるブラシ洗浄室２は、これに限定されることなく、広く適用が可能である。例えば、洗浄装置単体として配置され、他の前工程用単体装置(エッチング装置等)で処理された基板を洗浄するような基板洗浄機構等に適用されるものであってもよい。   In the above embodiment, the brush cleaning chamber 2 has been described as being configured to be connected to the processing chamber for the previous process, but the brush cleaning chamber 2 to which the brushes 221 and 222 are applied is not limited to this, Widely applicable. For example, it may be applied to a substrate cleaning mechanism or the like that is disposed as a single cleaning device and that cleans a substrate that has been processed by another single device for pre-process (such as an etching device).

本発明の一実施形態に係る基板処理装置に備えられる基板洗浄装置の概略を示す図である。It is a figure which shows the outline of the substrate cleaning apparatus with which the substrate processing apparatus which concerns on one Embodiment of this invention is equipped. 基板洗浄装置のブラシ洗浄室に備えられるブラシを基板の搬送方向上流側から見た側面図である。It is the side view which looked at the brush with which the brush cleaning room of a substrate cleaning device was provided from the conveyance direction upstream of a substrate. ブラシの側断面図である。It is a sectional side view of a brush. 基板に対するブラシ及び処理液供給ノズルの配置を示す側面図である。It is a side view which shows arrangement | positioning of the brush and process liquid supply nozzle with respect to a board | substrate. ブラシ及び処理液供給ノズルがそれぞれ複数配設されている状態を示す側面図である。It is a side view showing the state where a plurality of brushes and processing liquid supply nozzles are provided. ブラシの他の実施形態を示す側断面図である。It is a sectional side view which shows other embodiment of a brush. 他の実施形態に係るブラシ部及び処理液供給ノズルの配置を示す側面図である。It is a side view which shows arrangement | positioning of the brush part and process liquid supply nozzle which concern on other embodiment.

符号の説明Explanation of symbols

１ 基板処理装置
２ ブラシ洗浄室
６ 支持機構
７ 処理液供給源
８ 供給ポンプ
１０ 基板洗浄装置
２１ 搬送ローラ
５０ ブラシ毛束
５０Ｈ 先端
５０Ｆ 側部
６０ 支持材
６１ ブラシ取り付けベース
２２１，２２２ ブラシ
２３１，２３２ 処理液供給ノズル
Ｂ 基板 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Brush cleaning chamber 6 Support mechanism 7 Process liquid supply source 8 Supply pump 10 Substrate cleaning apparatus 21 Conveyance roller 50 Brush bundle 50H Tip 50F Side 60 Support material 61 Brush mounting bases 221 and 222 Brushes 231 and 232 Processing Liquid supply nozzle B Substrate

Claims (5)

多数の毛からなる毛束を有する長尺状のブラシと、
前記ブラシが延びる方向と交差する方向に、前記ブラシに対して基板を相対的に移動させる移動手段と、
前記ブラシの毛束先端部が、前記移動手段による基板移動方向の下流側に向き、前記ブラシの毛束の側部が当該基板の主面に当接する状態として、前記ブラシを支持する支持手段と、
前記支持手段によって支持される前記ブラシの毛束に対して液体を供給する液体供給手段と
を備える基板処理装置。 A long brush having a hair bundle composed of a large number of hairs;
Moving means for moving the substrate relative to the brush in a direction intersecting with the direction in which the brush extends;
A support means for supporting the brush in such a state that a front end portion of the bristle bundle of the brush faces a downstream side of the substrate moving direction by the moving means, and a side portion of the bristle bundle of the brush contacts the main surface of the substrate. ,
A substrate processing apparatus comprising: a liquid supply unit that supplies a liquid to the bristle bundle of the brush supported by the support unit. 前記液体供給手段による前記液体の供給が、前記移動手段によって移動される基板の主面部分に対しては行われず、前記ブラシの毛束の側部に対してのみ行われる請求項１に記載の基板処理装置。   The supply of the liquid by the liquid supply unit is not performed on the main surface portion of the substrate moved by the moving unit, but only on the side portion of the bristle bundle of the brush. Substrate processing equipment. 前記液体供給手段は、前記ブラシに対する液体供給圧を可変させる液体供給圧変更機構を備えている請求項１又は請求項２に記載の基板処理装置。   The substrate processing apparatus according to claim 1, wherein the liquid supply unit includes a liquid supply pressure changing mechanism that varies a liquid supply pressure with respect to the brush. ブラシの毛束先端部を基板の移動方向下流側に向け、当該ブラシの毛束の側部が当該基板の主面に当接する状態として、前記基板を前記ブラシに対して相対的に移動させ、当該ブラシの毛束に対して液体を供給することによって前記基板を処理する基板処理方法。   Directing the bristles of the brush toward the downstream side in the moving direction of the substrate, the side of the bristles of the brush is in contact with the main surface of the substrate, the substrate is moved relative to the brush, A substrate processing method for processing the substrate by supplying a liquid to the bristle bundle of the brush. 前記液体の供給を、前記基板の主面部分に対しては行わず、前記ブラシの毛束の側部に対してのみ行う請求項４に記載の基板処理方法。   The substrate processing method according to claim 4, wherein the liquid is not supplied to a main surface portion of the substrate but only to a side portion of the bristle bundle of the brush.
JP2005359345A 2005-12-13 2005-12-13 Substrate processor and substrate processing method Abandoned JP2007165554A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005359345A JP2007165554A (en) 2005-12-13 2005-12-13 Substrate processor and substrate processing method
TW095140963A TW200727358A (en) 2005-12-13 2006-11-06 Substrate processing method and substrate processing apparatus
KR1020060123632A KR100841501B1 (en) 2005-12-13 2006-12-07 Substrate processing method and substrate processing apparatus
CNB2006101642909A CN100446177C (en) 2005-12-13 2006-12-08 Substrate processing method and substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005359345A JP2007165554A (en) 2005-12-13 2005-12-13 Substrate processor and substrate processing method

Publications (1)

Publication Number Publication Date
JP2007165554A true JP2007165554A (en) 2007-06-28

Family

ID=38165944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005359345A Abandoned JP2007165554A (en) 2005-12-13 2005-12-13 Substrate processor and substrate processing method

Country Status (4)

Country Link
JP (1) JP2007165554A (en)
KR (1) KR100841501B1 (en)
CN (1) CN100446177C (en)
TW (1) TW200727358A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010137135A (en) * 2008-12-10 2010-06-24 Rasuko:Kk Cleaning method and cleaning apparatus under low environmental load
CN103240244A (en) * 2012-02-02 2013-08-14 林进诚 Surface cleaning device and method
JP2015205374A (en) * 2014-04-22 2015-11-19 Ｊｆｅスチール株式会社 Chip removing device and chip removing method
JP2016036751A (en) * 2014-08-06 2016-03-22 旭硝子株式会社 Substrate cleaning apparatus, cleaning method, and substrate manufacturing method using the same cleaning method
CN110121767A (en) * 2016-12-30 2019-08-13 应用材料公司 The spray bar of uniform liquid flow distribution on substrate designs

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010240550A (en) * 2009-04-03 2010-10-28 Dainippon Screen Mfg Co Ltd Apparatus for treating substrate
CN105185726B (en) * 2014-05-13 2018-09-21 芝浦机械电子株式会社 Substrate board treatment, substrate processing method using same, apparatus for manufacturing substrate and manufacture of substrates
KR102279523B1 (en) * 2018-01-30 2021-07-20 주식회사 케이씨텍 Brush cleaning apparatus
CN111921934B (en) * 2020-08-11 2022-06-10 深圳市汤诚科技有限公司 Based on chip is with processing production facility

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5536944A (en) 1978-09-05 1980-03-14 Citizen Watch Co Ltd Method and device for washing rectangular substrate
JP2628168B2 (en) * 1987-07-14 1997-07-09 住友シチックス株式会社 Surface treatment equipment for semiconductor wafers
JPH09326377A (en) * 1996-06-04 1997-12-16 Dainippon Screen Mfg Co Ltd Substrate treating system
US6230753B1 (en) * 1996-07-15 2001-05-15 Lam Research Corporation Wafer cleaning apparatus
JPH1034090A (en) * 1996-07-24 1998-02-10 Sharp Corp Washing device
JP3037620B2 (en) 1996-08-27 2000-04-24 株式会社タイガーカワシマ Rotating brush for seedling box washer
JP2000299302A (en) * 1999-04-13 2000-10-24 Seiko Epson Corp Cleaning device
JP4602567B2 (en) * 2000-12-15 2010-12-22 芝浦メカトロニクス株式会社 Substrate cleaning device
JP2003145060A (en) * 2001-11-15 2003-05-20 Shibaura Mechatronics Corp Cleaning brush and cleaning device
JP2005279451A (en) * 2004-03-30 2005-10-13 Dainippon Screen Mfg Co Ltd Substrate treatment apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010137135A (en) * 2008-12-10 2010-06-24 Rasuko:Kk Cleaning method and cleaning apparatus under low environmental load
CN103240244A (en) * 2012-02-02 2013-08-14 林进诚 Surface cleaning device and method
JP2015205374A (en) * 2014-04-22 2015-11-19 Ｊｆｅスチール株式会社 Chip removing device and chip removing method
JP2016036751A (en) * 2014-08-06 2016-03-22 旭硝子株式会社 Substrate cleaning apparatus, cleaning method, and substrate manufacturing method using the same cleaning method
CN110121767A (en) * 2016-12-30 2019-08-13 应用材料公司 The spray bar of uniform liquid flow distribution on substrate designs
JP2020503684A (en) * 2016-12-30 2020-01-30 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Spray bar design for uniform liquid flow distribution on substrate
JP7109445B2 (en) 2016-12-30 2022-07-29 アプライド マテリアルズ インコーポレイテッド Spray bar design for uniform liquid flow distribution on the substrate

Also Published As

Publication number Publication date
CN100446177C (en) 2008-12-24
KR20070062915A (en) 2007-06-18
TW200727358A (en) 2007-07-16
KR100841501B1 (en) 2008-06-25
CN1983516A (en) 2007-06-20

Similar Documents

Publication Publication Date Title
JP2007165554A (en) Substrate processor and substrate processing method
KR100740385B1 (en) Substrate processing apparatus and substrate processing method
JP5377037B2 (en) High-pressure liquid jet cleaning equipment for thin-film solar panels
JP4759300B2 (en) Method and apparatus for processing a wafer surface using a thin high velocity fluid layer
JP6367763B2 (en) Wafer drying apparatus and wafer drying method
JP2001246331A (en) Cleaning device
JP2007165488A (en) Bevel processing method, and bevel processor
JP2010114123A (en) Substrate processing apparatus and method
TWI283441B (en) Substrate treating device
KR101623277B1 (en) Substrate processing apparatus
JP6720659B2 (en) Substrate drainer
US20070221256A1 (en) Methods and apparatus for improving edge cleaning of a substrate
JP6060140B2 (en) Dry fingerprint cleaning device
JP2002239485A (en) Apparatus and method for cleaning substrate
JP2007201186A (en) Substrate cleaning device and substrate cleaning method
TWI559432B (en) Substrate processing device
JP2005123353A (en) Brush and washing device
JPH09306974A (en) Work holder
JP2005019991A (en) Substrate processing apparatus
JP2009032868A (en) Substrate processing apparatus
JP2004210511A (en) Device and method for processing substrate
JP2021022629A (en) Etching device
JP7353042B2 (en) brush cleaning device
JP2005028327A (en) Cleaning device
JP2989719B2 (en) Substrate cleaning apparatus and substrate cleaning method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071218

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100201

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100209

A762 Written abandonment of application

Free format text: JAPANESE INTERMEDIATE CODE: A762

Effective date: 20100217