JP2007149810A5 - - Google Patents

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Publication number
JP2007149810A5
JP2007149810A5 JP2005339877A JP2005339877A JP2007149810A5 JP 2007149810 A5 JP2007149810 A5 JP 2007149810A5 JP 2005339877 A JP2005339877 A JP 2005339877A JP 2005339877 A JP2005339877 A JP 2005339877A JP 2007149810 A5 JP2007149810 A5 JP 2007149810A5
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
insulating
wiring board
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005339877A
Other languages
Japanese (ja)
Other versions
JP2007149810A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005339877A priority Critical patent/JP2007149810A/en
Priority claimed from JP2005339877A external-priority patent/JP2007149810A/en
Publication of JP2007149810A publication Critical patent/JP2007149810A/en
Publication of JP2007149810A5 publication Critical patent/JP2007149810A5/ja
Pending legal-status Critical Current

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Claims (2)

２層以上の絶縁層を積層してなる平板状の絶縁基体と、前記絶縁層の表面に形成された３層以上の導体層と、前記絶縁基体の一方の主面に形成され、発光素子を搭載する搭載部と、前記絶縁層を貫通して形成され、前記発光素子と電気的に接続される貫通導体と、を具備してなる発光素子用配線基板であって、前記絶縁基体を透視したときに該発光素子用配線基板の一方の主面に露出した前記絶縁基体の露出部から、他方の主面に露出した前記絶縁基体の露出部が前記導体層で遮断されて見通せないことを特徴とする発光素子用配線基板。 A flat insulating substrate formed by laminating two or more insulating layers, three or more conductor layers formed on the surface of the insulating layer, and formed on one main surface of the insulating substrate. A wiring board for a light emitting element, comprising: a mounting portion to be mounted; and a through conductor formed through the insulating layer and electrically connected to the light emitting element, wherein the insulating base is seen through Sometimes, the exposed portion of the insulating base exposed on the other main surface is blocked by the conductor layer from the exposed portion of the insulating base exposed on one main surface of the wiring board for the light emitting element, and cannot be seen. A wiring board for a light emitting element. 請求項１に記載の発光素子用配線基板の前記搭載部に発光素子を搭載していることを特徴とする発光装置。 A light emitting device comprising a light emitting element mounted on the mounting portion of the light emitting element wiring board according to claim 1.
JP2005339877A 2005-11-25 2005-11-25 Wiring board for light-emitting element, and light-emitting device Pending JP2007149810A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005339877A JP2007149810A (en) 2005-11-25 2005-11-25 Wiring board for light-emitting element, and light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005339877A JP2007149810A (en) 2005-11-25 2005-11-25 Wiring board for light-emitting element, and light-emitting device

Publications (2)

Publication Number Publication Date
JP2007149810A JP2007149810A (en) 2007-06-14
JP2007149810A5 true JP2007149810A5 (en) 2008-05-22

Family

ID=38210882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005339877A Pending JP2007149810A (en) 2005-11-25 2005-11-25 Wiring board for light-emitting element, and light-emitting device

Country Status (1)

Country Link
JP (1) JP2007149810A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021426A (en) * 2007-07-12 2009-01-29 Sharp Corp Chip component type led and method of manufacturing the same
EP2017897A1 (en) * 2007-07-16 2009-01-21 ILED Photoelectronics Inc. Package structure for a high-luminance light source
WO2011002208A2 (en) * 2009-07-03 2011-01-06 서울반도체 주식회사 Light-emitting diode package
JP2011060960A (en) * 2009-09-09 2011-03-24 Toshiba Lighting & Technology Corp Light-emitting module
US8773006B2 (en) * 2011-08-22 2014-07-08 Lg Innotek Co., Ltd. Light emitting device package, light source module, and lighting system including the same
US8704433B2 (en) * 2011-08-22 2014-04-22 Lg Innotek Co., Ltd. Light emitting device package and light unit
JP7048228B2 (en) * 2017-08-23 2022-04-05 スタンレー電気株式会社 Semiconductor light emitting device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4295519B2 (en) * 2003-01-28 2009-07-15 京セラ株式会社 Light emitting element storage package and light emitting device

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