JP2007143192A - 弾性表面波デバイスの製造方法 - Google Patents
弾性表面波デバイスの製造方法 Download PDFInfo
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- JP2007143192A JP2007143192A JP2007037572A JP2007037572A JP2007143192A JP 2007143192 A JP2007143192 A JP 2007143192A JP 2007037572 A JP2007037572 A JP 2007037572A JP 2007037572 A JP2007037572 A JP 2007037572A JP 2007143192 A JP2007143192 A JP 2007143192A
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- acoustic wave
- surface acoustic
- wave device
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- piezoelectric substrate
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 239000000463 material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 25
- 230000001902 propagating effect Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 239000011888 foil Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
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Abstract
【解決手段】圧電体基板1と、この圧電体基板1の表面に設けられた櫛形トランスデューサ2とからなる弾性表面波デバイスにおいて、弾性表面波デバイスの裏面に設けられる不用波対策用の複数の溝5に対して、隣り合う溝の間隔を一端側7から他端側8に向けて狭くなるように設定したのである。この構成により、溝の延伸方向と弾性表面波の伝搬方向との交差角がそれぞれの溝によって変わることとなり、各溝に対する不要波の反射条件を不均一化できるので、弾性表面波デバイスの特性を向上させることができる。
【選択図】図3
Description
2 櫛形トランスデューサ
5 溝
Claims (1)
- 弾性表面波デバイスを形成する圧電体からなるウェハの表面に複数個の弾性表面波デバイスを形成する電極を設ける第1の工程と、前記ウェハの表面に個片分割用のハーフカット溝を設ける第2の工程と、前記ウェハの裏面側を研削することにより個片に分割して前記弾性表面波デバイスを得る第3の工程とを備え、前記第3の工程は自転する研削ホイルに対して前記ウェハを回転させながら裏面を当接させて研削することにより前記ウェハを個片に分割するとともに、前記弾性表面波デバイスの裏面に弾性表面波の伝搬方向に対して交差する方向に複数の溝を並設し、前記隣り合う溝の間隔を一端側から他端側に向けて狭くなるように形成した弾性表面波デバイスの製造方法。
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JP2007037572A JP4492623B2 (ja) | 2004-03-15 | 2007-02-19 | 弾性表面波デバイスの製造方法 |
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JP2004072563 | 2004-03-15 | ||
JP2007037572A JP4492623B2 (ja) | 2004-03-15 | 2007-02-19 | 弾性表面波デバイスの製造方法 |
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JP2004326189A Division JP2005303980A (ja) | 2004-03-15 | 2004-11-10 | 弾性表面波デバイスおよびその形成方法 |
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JP2007143192A true JP2007143192A (ja) | 2007-06-07 |
JP4492623B2 JP4492623B2 (ja) | 2010-06-30 |
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JP2007037572A Active JP4492623B2 (ja) | 2004-03-15 | 2007-02-19 | 弾性表面波デバイスの製造方法 |
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JP (1) | JP4492623B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009104438A1 (ja) * | 2008-02-18 | 2009-08-27 | 株式会社 村田製作所 | 弾性波装置及びその製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60153616A (ja) * | 1984-01-24 | 1985-08-13 | Toshiba Corp | 弾性表面波素子の製造方法 |
JPH02179108A (ja) * | 1988-12-29 | 1990-07-12 | Japan Radio Co Ltd | 弾性表面波素子の基板加工方法 |
JPH06326541A (ja) * | 1993-05-11 | 1994-11-25 | Seiko Epson Corp | 弾性表面波素子の分割方法 |
JPH09213662A (ja) * | 1996-01-31 | 1997-08-15 | Toshiba Corp | ウェーハの分割方法及び半導体装置の製造方法 |
JPH09309049A (ja) * | 1996-05-23 | 1997-12-02 | Nippon Steel Corp | 半導体ウエハの高精度研削方法 |
JPH1170447A (ja) * | 1997-08-28 | 1999-03-16 | Nippon Seiko Kk | 工作物の面の研削方法 |
JP2000114903A (ja) * | 1998-09-30 | 2000-04-21 | Toko Inc | 表面弾性波素子の製造方法 |
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2007
- 2007-02-19 JP JP2007037572A patent/JP4492623B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60153616A (ja) * | 1984-01-24 | 1985-08-13 | Toshiba Corp | 弾性表面波素子の製造方法 |
JPH02179108A (ja) * | 1988-12-29 | 1990-07-12 | Japan Radio Co Ltd | 弾性表面波素子の基板加工方法 |
JPH06326541A (ja) * | 1993-05-11 | 1994-11-25 | Seiko Epson Corp | 弾性表面波素子の分割方法 |
JPH09213662A (ja) * | 1996-01-31 | 1997-08-15 | Toshiba Corp | ウェーハの分割方法及び半導体装置の製造方法 |
JPH09309049A (ja) * | 1996-05-23 | 1997-12-02 | Nippon Steel Corp | 半導体ウエハの高精度研削方法 |
JPH1170447A (ja) * | 1997-08-28 | 1999-03-16 | Nippon Seiko Kk | 工作物の面の研削方法 |
JP2000114903A (ja) * | 1998-09-30 | 2000-04-21 | Toko Inc | 表面弾性波素子の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009104438A1 (ja) * | 2008-02-18 | 2009-08-27 | 株式会社 村田製作所 | 弾性波装置及びその製造方法 |
JP5077714B2 (ja) * | 2008-02-18 | 2012-11-21 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
US8461940B2 (en) | 2008-02-18 | 2013-06-11 | Murata Manufacturing Co., Ltd. | Elastic wave device and method for manufacturing the same |
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JP4492623B2 (ja) | 2010-06-30 |
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