JP2007091390A - Device and method for manufacturing film - Google Patents

Device and method for manufacturing film Download PDF

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JP2007091390A
JP2007091390A JP2005281728A JP2005281728A JP2007091390A JP 2007091390 A JP2007091390 A JP 2007091390A JP 2005281728 A JP2005281728 A JP 2005281728A JP 2005281728 A JP2005281728 A JP 2005281728A JP 2007091390 A JP2007091390 A JP 2007091390A
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layer
base material
film
winding
substrate
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Tomoyuki Kamata
智之 鎌田
Shinji Kanazawa
真治 金澤
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a film manufacturing method having a simple configuration capable of suppressing occurrence of defects in a laminate step, and eliminating wastes of a base material. <P>SOLUTION: A first layer 9 is tightly attached to one face 7 of a sheet-like base material 3, and a second layer 15 is tightly attached to the other face13 of the sheet-like base material 3. The base material 3 having the first layer 9 and the second layer 15 are wound, and the wound base material 3 is unwound so that the first layer 9 and the second layer 15 are present on one face 7 of the base material 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、布、紙、プラスチックフィルム、金属箔等の連続走行するシート状支持体の一部、または全面に、各種塗液を適当な厚さで、均一かつ平滑に塗工するフィルム製造方法およびフィルムの製造装置に係り、特に、２層構造のフィルムの製造方法およびフィルムの製造装置に関する。   The present invention relates to a film manufacturing method in which various coating liquids are uniformly and smoothly applied to a part of or the entire surface of a continuously running sheet-like support such as cloth, paper, plastic film, metal foil and the like at an appropriate thickness. In particular, the present invention relates to a film manufacturing method and a film manufacturing apparatus having a two-layer structure.

図５は、従来の２層構造のフィルムを製造する方法を示す図である。   FIG. 5 is a diagram showing a conventional method for producing a film having a two-layer structure.

従来の方法は、まず、図５（ａ）で示しように、２種類の塗液１０１、１０３を各基材１０５、１０７の一方面にそれぞれ塗工する。続いて、図５（ｂ）に示すように、ラミネート工程１０９において、塗液１０１により生成された膜と塗液１０３により生成された膜とを互いに貼り合わせ、一方の基材１０５を除去しながら各基材１０５、１０７巻き取る。このようにして、基材１０７の一方の面に、塗液１０１と塗液１０３とで形成された膜状の層を形成する。上記方法をラミネート法という。   In the conventional method, first, as shown in FIG. 5A, two types of coating liquids 101 and 103 are applied to one side of each of the base materials 105 and 107, respectively. Subsequently, as shown in FIG. 5B, in the laminating process 109, the film generated by the coating liquid 101 and the film generated by the coating liquid 103 are bonded to each other, and one of the base materials 105 is removed. Each base material 105 and 107 is wound up. In this way, a film-like layer formed of the coating liquid 101 and the coating liquid 103 is formed on one surface of the substrate 107. The above method is called a laminating method.

上述したような、従来の方法に関連する文献として、たとえば特許文献１を掲げることができる。
特開２００５−１５７２０５号公報 For example, Patent Literature 1 can be cited as a literature related to the conventional method as described above.
JP 2005-157205 A

しかし、ラミネート(貼り合わせ)法には、ラミネート工程における不良発生ポテンシャル、工程数増加、不要基材１０５の廃棄等、無駄が多いという問題がある。   However, the laminating method has a problem that there is a lot of waste, such as a defect generation potential in the laminating process, an increase in the number of processes, and disposal of the unnecessary base material 105.

本発明は、前記問題点に鑑みてなされたものであり、ラミネート工程における不良の発生を抑制し、基材の無駄を無くすことができると共に、構成が簡素であるフィルムの製造装置およびフィルムの製造方法を提供することを目的とする。   The present invention has been made in view of the above-mentioned problems, suppresses the occurrence of defects in the laminating process, can eliminate the waste of the base material, and has a simple structure and film manufacturing apparatus and film manufacturing It aims to provide a method.

本発明は、シート状の基材の一方の面に、第１の層を密着させて設ける第１の層設置工程と、前記シート状の基材の他方の面に、第２の層を密着させて設ける第２の層設置工程と、前記第１の層と前記第２の層とが設けられた基材を巻き取る巻取工程と、前記基材の一方の面に前記第１の層と前記第２の層とが存在するようにして、前記巻取工程で巻き取った基材を巻き出す巻出工程とを有するフィルムの製造方法である。   The present invention provides a first layer installation step in which a first layer is provided in close contact with one surface of a sheet-like substrate, and a second layer in close contact with the other surface of the sheet-like substrate. A second layer installing step, a winding step of winding the base material on which the first layer and the second layer are provided, and the first layer on one surface of the base material And a second step of unwinding the substrate wound in the winding step so that the second layer is present.

本発明によれば、ラミネート工程における不良の発生を抑制し、基材の無駄を無くすことができると共に、構成が簡素であるフィルムの製造装置およびフィルムの製造方法を提供することができるという効果を奏する。   According to the present invention, it is possible to suppress the occurrence of defects in the laminating process, to eliminate the waste of the base material, and to provide a film manufacturing apparatus and a film manufacturing method with a simple configuration. Play.

図１は、本発明の実施形態に係るフィルムの製造装置１の概略構成を示す図である。   FIG. 1 is a diagram showing a schematic configuration of a film manufacturing apparatus 1 according to an embodiment of the present invention.

図２は、図１におけるＩＩ部の拡大図であり、図３は、図１におけるＩＩＩ部の拡大図である。   2 is an enlarged view of a portion II in FIG. 1, and FIG. 3 is an enlarged view of a portion III in FIG.

図４は、フィルムの製造装置１の変形例を示す図である。   FIG. 4 is a diagram showing a modification of the film manufacturing apparatus 1.

フィルムの製造装置１は、図１（ａ）に示すように、可撓性を備えた所定の幅の長く薄いシート状の基材３であって、たとえば渦巻き状であって円柱状に巻かれている基材（図示せず）を、搬送方向にテンションかけ平面状に展伸させて搬送し渦巻き状で円柱状に巻き取る巻取機構５を備えている。なお前記基材３の幅方向は、図１の紙面に垂直な方向である。   As shown in FIG. 1A, a film manufacturing apparatus 1 is a long and thin sheet-like substrate 3 having a predetermined width and having flexibility, for example, a spiral shape that is wound in a cylindrical shape. A take-up mechanism 5 is provided that takes up a substrate (not shown) that is stretched in a flat shape in a conveying direction, conveys the substrate, and winds the substrate in a spiral shape. The width direction of the substrate 3 is a direction perpendicular to the paper surface of FIG.

また、フィルムの製造装置１には、前記平面状に展伸しているシート状の基材（前記巻取機構５で巻き取られる前の基材）３の一方の面７に薄い半硬化状態の膜状の第１の層（たとえば、微細な導電体を含み、異方性導電性フィルムを構成する層）９を密着させて設ける（たとえば、塗工する）第１の層設置機構１１と、前記平面状に展伸しているシート状の基材３の他方の面１３に薄い半硬化状態の膜状の第２の層（たとえば、微細な導電体を含まず、異方性導電性フィルムを構成する層）１５を密着させて設ける（たとえば、塗工する）第２の層設置機構１７とが設けられている。   In addition, the film production apparatus 1 includes a thin semi-cured state on one surface 7 of the sheet-like base material (base material before being wound up by the winding mechanism 5) 3 that extends in the planar shape. A first layer installation mechanism 11 provided in close contact (for example, coated) with a film-like first layer (for example, a layer including a fine conductor and constituting an anisotropic conductive film) 9 The second surface 13 of the sheet-like base material 3 extending in a planar shape is a thin semi-cured film-like second layer (for example, containing no fine conductor and anisotropic conductive A second layer installation mechanism 17 is provided which is provided in close contact (for example, coating) 15 (layer constituting the film).

さらに、フィルムの製造装置１には、図１（ｂ）に示すように、前記基材３の一方の面７に前記第１の層９と前記第２の層１５とが存在するようにして、すなわち、前記基材３の一方の面７に前記第１の層９が重なり密着して存在しこの第１の層９に第２の層１５が重なり密着して存在するようにして、前記巻取機構５で巻き上げられたシート状の基材３を平面状に巻き出す巻出機構１９が設けられている。   Further, in the film manufacturing apparatus 1, as shown in FIG. 1B, the first layer 9 and the second layer 15 are present on one surface 7 of the substrate 3. That is, the first layer 9 overlaps and is in close contact with one surface 7 of the substrate 3, and the second layer 15 overlaps and is in close contact with the first layer 9. An unwinding mechanism 19 is provided for unwinding the sheet-like substrate 3 wound up by the winding mechanism 5 in a flat shape.

前記巻出機構１９は、前記巻取機構５で巻き取られた基材３を、前記第１の層９と前記第２の層１５とが互いに密着し前記基材３がこの厚さ方向で積層されるようにしてたとえば渦巻き状で円柱状に巻き取る際に、前記巻き出しをするように構成されている。前記巻出機構１９における前記基材３の幅方向は、図１の紙面に垂直な方向である。   The unwinding mechanism 19 is configured so that the first layer 9 and the second layer 15 are in close contact with each other and the substrate 3 is in this thickness direction. For example, when it is wound up into a cylindrical shape in a spiral shape so as to be laminated, it is configured to perform the unwinding. The width direction of the base material 3 in the unwinding mechanism 19 is a direction perpendicular to the paper surface of FIG.

また、前記のフィルムの製造装置１には、前記巻取機構５で前記基材３を巻き取る際、または、前記巻取機構５で前記基材３を巻き取った後、前記各層９、１５間の密着性を高めるために、前記各層９、１５が設けられた基材３を加圧し加熱することのうちの少なくともいずれかの処理を、前記基材３に施す加圧・加熱機構（図示せず）が設けられている。   In the film manufacturing apparatus 1, when the base material 3 is wound by the winding mechanism 5, or after the base material 3 is wound by the winding mechanism 5, the layers 9, 15 are used. In order to improve the adhesion between them, a pressurizing / heating mechanism for applying at least one of the processes of pressurizing and heating the substrate 3 provided with the layers 9 and 15 to the substrate 3 (see FIG. Not shown).

なお、前記巻取機構５で巻き上げられたシート状の基材３においては、前記基材３の前記一方の面７と前記第１の層９との間よりも、前記基材３の前記他方の面１３と前記第２の層１５との間のほうが、剥離性（離形性）が良くなっている。また、前記第１の層９と前記第２の層１５との間の剥離性よりも、前記基材３の前記一方の面７と前記第１の層９との間の剥離性のほうが良くなっている。 次に、フィルムの製造装置１の動作について説明する。   Note that, in the sheet-like base material 3 wound up by the winding mechanism 5, the other side of the base material 3 is more than between the one surface 7 of the base material 3 and the first layer 9. The surface 13 and the second layer 15 have better peelability (removability). Also, the peelability between the one surface 7 of the substrate 3 and the first layer 9 is better than the peelability between the first layer 9 and the second layer 15. It has become. Next, the operation of the film manufacturing apparatus 1 will be described.

まず、図１（ａ）に示すように、可撓性を備えた所定の幅の長く薄いシート状の基材３の一方の面７に、薄い半硬化状態の膜状の第１の層９密着させて設ける。前記シート状の基材３の他方の面１３に、薄い半硬化状態の膜状の第２の層１５密着させて設ける。前記第１の層９と前記第２の層１５とが設けられた基材３を前記第１の層９と前記第２の層１５とが互いに密着し前記基材３がこの厚さ方向で積層されるようにして円柱状に巻き取る。なお、前記第１の層９と前記第２の層１５と同時に設けてもよい。   First, as shown in FIG. 1A, a thin semi-cured film-like first layer 9 is formed on one surface 7 of a long and thin sheet-like substrate 3 having a predetermined width and having flexibility. Provide close contact. A thin semi-cured film-like second layer 15 is provided in close contact with the other surface 13 of the sheet-like substrate 3. The base layer 3 provided with the first layer 9 and the second layer 15 is in close contact with the first layer 9 and the second layer 15 so that the base material 3 is in this thickness direction. It is wound up into a cylindrical shape so as to be laminated. The first layer 9 and the second layer 15 may be provided simultaneously.

続いて、図１（ｂ）に示すように、前記基材３の一方の面７に前記第１の層９と前記第２の層１５とが存在するようにして（前記基材３の一方の面に前記第１の層９が重なり密着して存在しこの第１の層９に第２の層１５が重なり密着して存在するようにして）、図１（ａ）で示す工程で巻き取った基材３を平面状に巻き出す。
ところで、前記第１の層９の上に、１つまたは複数の層を密着させて設けてもよく、前記第２の層１５の上に１つまたは複数の層を設けてもよい。この際、前記基材３の前記他方の面１３と前記第２の層１５との間の剥離性がもっとも良く、次いで、前記基材３の前記一方の面７と前記第１の層９との間の剥離性がよくなっている。したがって、図１（ｂ）に示す巻出工程では、前記基材３の前記一方の面７に、前記第１の層９、前記第１の層９に密着して設けられた１つまたは複数の層、前記第２の層１５に密着して設けられた１つまたは複数の層、前記第２の層１５の順に積層されて現れることになる。 Subsequently, as shown in FIG. 1B, the first layer 9 and the second layer 15 are present on one surface 7 of the substrate 3 (one of the substrates 3). The first layer 9 overlaps and adheres to the surface of the first layer 9 and the second layer 15 overlaps and adheres to the first layer 9), and is wound in the step shown in FIG. The taken substrate 3 is unwound in a flat shape.
By the way, one or more layers may be provided in close contact with each other on the first layer 9, and one or more layers may be provided on the second layer 15. At this time, the peelability between the other surface 13 of the substrate 3 and the second layer 15 is the best, and then the one surface 7 of the substrate 3 and the first layer 9 The peelability between is improved. Accordingly, in the unwinding step shown in FIG. 1B, one or more of the first layer 9 and the first layer 9 provided on the one surface 7 of the substrate 3 in close contact with each other. Layer, one or a plurality of layers provided in close contact with the second layer 15, and the second layer 15 in this order.

フィルムの製造装置１によれば、可撓性を備えた所定の幅の長く薄いシート状の基材３の一方の面７に、薄い半硬化状態の膜状の第１の層９設け、前記シート状の基材３の他方の面１３に、薄い半硬化状態の膜状の第２の層１５設け、前記第１の層９と前記第２の層１５とが設けられた基材３を前記第１の層９と前記第２の層１５とが互いに密着し前記基材３がこの厚さ方向で積層されるようにして円柱状に巻き取り、前記基材３の一方の面７に前記第１の層９と前記第２の層１５とが存在するようにして、前記基材３の一方の面７に前記第１の層９が重なり密着して存在しこの第１の層９に第２の層１５が重なり密着して存在するようにして、巻き取った基材３を平面状に巻き出すので、従来のようなラミネート工程が不要となり装置の構成を簡素化することができる。また、各層９、１５を正確な形態に形成することが可能となり不良の発生を抑制することができる。さらに、１つの基材３を用いて、フィルムを製造することができるので、基材３の無駄を無くすことができる。   According to the film manufacturing apparatus 1, a thin semi-cured film-like first layer 9 is provided on one surface 7 of a long and thin sheet-like substrate 3 having a predetermined width and having flexibility, On the other surface 13 of the sheet-like base material 3, a thin semi-cured film-like second layer 15 is provided, and the base material 3 provided with the first layer 9 and the second layer 15 is provided. The first layer 9 and the second layer 15 are in close contact with each other, and the base material 3 is laminated in this thickness direction so as to be wound in a columnar shape. As the first layer 9 and the second layer 15 exist, the first layer 9 overlaps and is in close contact with one surface 7 of the substrate 3. Since the wound base material 3 is unrolled in a flat shape so that the second layer 15 overlaps and is in close contact therewith, a conventional laminating step is not required and the structure of the apparatus is reduced. It is possible to simplify the. Moreover, it becomes possible to form each layer 9 and 15 in an exact form, and can suppress generation | occurrence | production of a defect. Furthermore, since a film can be manufactured using one base material 3, waste of the base material 3 can be eliminated.

また、前記基材３の前記一方の面７と前記第１の層９との間よりも、前記基材３の前記他方の面１３と前記第２の層１５との間のほうが、剥離性（離形性）が良いいので、層の確実な剥離による歩留まりの向上が可能となる。   Also, the separation between the other surface 13 of the substrate 3 and the second layer 15 is more releasable than between the one surface 7 of the substrate 3 and the first layer 9. Since (releasability) is good, the yield can be improved by the reliable peeling of the layers.

さらに、前記各層９、１５の設置を同時に行うことにより、装置の簡略化が図れる。   Further, the apparatus can be simplified by installing the layers 9 and 15 simultaneously.

本発明の実施形態に係るフィルムの製造装置の概略構成を示す図である。It is a figure which shows schematic structure of the manufacturing apparatus of the film which concerns on embodiment of this invention. 図１におけるＩＩ部の拡大図である。It is an enlarged view of the II section in FIG. 図１におけるＩＩＩ部の拡大図である。It is an enlarged view of the III section in FIG. フィルムの製造装置１の変形例を示す図である。It is a figure which shows the modification of the manufacturing apparatus 1 of a film. 従来の２層構造のフィルムを製造する方法を示す図である。It is a figure which shows the method of manufacturing the film of the conventional 2 layer structure.

符号の説明Explanation of symbols

１ フィルムの製造装置
３ 基材
５ 巻取機構
７ 一方の面
９ 第１の層
１１ 第１の層設置機構
１３ 他方の面
１５ 第２の層
１７ 第２の層設置機構
１９ 巻出機構 DESCRIPTION OF SYMBOLS 1 Film production apparatus 3 Base material 5 Winding mechanism 7 One surface 9 1st layer 11 1st layer installation mechanism 13 Other surface 15 2nd layer 17 2nd layer installation mechanism 19 Unwinding mechanism

Claims (7)

シート状の基材の一方の面に、第１の層を密着させて設ける第１の層設置工程と；
前記シート状の基材の他方の面に、第２の層を密着させて設ける第２の層設置工程と；
前記第１の層と前記第２の層とが設けられた基材を巻き取る巻取工程と；
前記基材の一方の面に前記第１の層と前記第２の層とが存在するようにして、前記巻取工程で巻き取った基材を巻き出す巻出工程と；
を有することを特徴とするフィルムの製造方法。 A first layer installation step in which the first layer is provided in close contact with one surface of the sheet-like substrate;
A second layer installation step in which a second layer is provided in close contact with the other surface of the sheet-like substrate;
A winding step of winding the base material provided with the first layer and the second layer;
An unwinding step of unwinding the substrate wound in the winding step so that the first layer and the second layer exist on one surface of the substrate;
A method for producing a film, comprising: 請求項１に記載のフィルムの製造方法において、
前記基材の前記一方の面と前記第１の層との間よりも、前記基材の前記他方の面と前記第２の層との間のほうが、剥離性が良いことを特徴とするフィルムの製造方法。 In the manufacturing method of the film of Claim 1,
A film having better releasability between the other surface of the base material and the second layer than between the one surface of the base material and the first layer. Manufacturing method. 請求項１または請求項２に記載のフィルムの製造方法において、
前記巻取工程で前記基材を巻き取る際、または、前記巻取工程で前記基材を巻き取った後、前記各層間の密着性を高めるために、前記各層が設けられた基材を加圧し加熱することのうちの少なくともいずれかの処理を、前記基材に施すことを特徴とするフィルムの製造方法。 In the manufacturing method of the film of Claim 1 or Claim 2,
When winding the base material in the winding step or after winding the base material in the winding step, the base material provided with the layers is added to improve the adhesion between the layers. A method for producing a film, wherein the substrate is subjected to at least one of pressing and heating. 請求項１〜請求項３のいずれか１項に記載のフィルムの製造方法において、
前記各層設置工程は、前記各層の設置を同時に行う工程であることを特徴とするフィルムの製造方法。 In the manufacturing method of the film of any one of Claims 1-3,
Each of the layer installation steps is a step of performing the installation of the layers simultaneously. シート状の基材を、搬送方向にテンションかけ平面状に展伸させて搬送し巻き取る巻取機構と；
前記平面状に展伸しているシート状の基材の一方の面に、第１の層を密着させて設ける第１の層設置機構と；
前記平面状に展伸しているシート状の基材の他方の面に、第２の層を密着させて設ける第２の層設置機構と；
前記基材の一方の面に前記第１の層と前記第２の層とが存在するようにして、前記巻取機構で巻き上げられたシート状の基材３を巻き出す巻出機構と；
を有することを特徴とするフィルムの製造装置。 A winding mechanism in which a sheet-like base material is tensioned in the conveying direction, spread in a flat shape, conveyed and wound;
A first layer installation mechanism in which the first layer is provided in close contact with one surface of the sheet-like base material extending in a planar shape;
A second layer installation mechanism in which a second layer is provided in close contact with the other surface of the sheet-like base material extending in a plane;
An unwinding mechanism for unwinding the sheet-like base material 3 wound up by the winding mechanism so that the first layer and the second layer are present on one surface of the base material;
An apparatus for producing a film, comprising: 請求項５に記載のフィルムの製造装置において、
前記巻取機構で前記基材を巻き取る際、または、前記巻取機構で前記基材を巻き取った後、前記各層間の密着性を高めるために、前記各層が設けられた基材を加圧し加熱することのうちの少なくともいずれかの処理を、前記基材に施す加圧・加熱機構を有することを特徴とするフィルムの製造装置。 In the film manufacturing apparatus according to claim 5,
When winding the base material with the winding mechanism or after winding the base material with the winding mechanism, the base material provided with the layers is added to improve the adhesion between the layers. An apparatus for producing a film, comprising a pressurizing / heating mechanism for applying at least one of pressing and heating to the substrate. 請求項５または請求項６に記載のフィルムの製造装置において、
前記各層設置機構は、前記各層の設置を同時に行うように構成されていることを特徴とするフィルムの製造装置。 In the film manufacturing apparatus according to claim 5 or 6,
Each of the layer installation mechanisms is configured to perform the installation of each of the layers simultaneously.
JP2005281728A 2005-09-28 2005-09-28 Device and method for manufacturing film Pending JP2007091390A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100959365B1 (en) 2009-12-30 2010-05-24 선진정밀(주) Winding machine of spring tube

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100959365B1 (en) 2009-12-30 2010-05-24 선진정밀(주) Winding machine of spring tube
WO2011081469A2 (en) * 2009-12-30 2011-07-07 선진정밀(주) Winding machine of spring tube
WO2011081469A3 (en) * 2009-12-30 2011-11-17 선진정밀(주) Winding machine of spring tube
US8938868B2 (en) 2009-12-30 2015-01-27 Sunjin Precision Co., Ltd. Spring tube winding machine

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