JP2007088031A - Circuit board - Google Patents

Circuit board Download PDF

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JP2007088031A
JP2007088031A JP2005271990A JP2005271990A JP2007088031A JP 2007088031 A JP2007088031 A JP 2007088031A JP 2005271990 A JP2005271990 A JP 2005271990A JP 2005271990 A JP2005271990 A JP 2005271990A JP 2007088031 A JP2007088031 A JP 2007088031A
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conductive plate
circuit board
board
welding
area
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JP4677865B2 (en
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Haruo Shirataki
治夫 白滝
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NEC Saitama Ltd
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NEC Saitama Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board which can reduce or eliminate the occurrence of solder balls at the time of welding a metal piece by electric resistance welding on a conductive plate soldered to the main body of the board. <P>SOLUTION: The circuit board 1 includes the main body 2 of the board, and a connection tab 3 for connecting the main body 2 of the board to other electric component. On the top face of the main body 2 of the board, a wiring pattern 4 is formed for causing each electronic component mounted on the main body 2 of the board to conduct. In the end of the wiring pattern 4, lands 5 are formed. To the lands 5, the conductive plate 6 is soldered. The connection tab 3 is welded on the conductive plate 6. In an area of the main body 2 of the board corresponding to an area A with which welding rods (electrodes) are to be brought into contact at the time of welding the connection tab 3, through-holes 7 (shown by dotted lines in Figure) are arranged. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、基板本体に形成されたランド部に導電プレートが半田付けされ、この導電プレート上に金属片が溶接された構造の回路基板に関する。例えば、携帯端末装置の電池パックに内蔵されている回路基板の構造に関する。   The present invention relates to a circuit board having a structure in which a conductive plate is soldered to a land portion formed on a substrate body, and a metal piece is welded on the conductive plate. For example, the present invention relates to the structure of a circuit board built in a battery pack of a mobile terminal device.

携帯電話機をはじめとする携帯端末装置は、その駆動源として電池パックを搭載している。電池パックは、樹脂製の容器に、電池本体と、この電池本体と接続される保護回路基板とが内蔵されているのが一般的である。   Mobile terminal devices such as mobile phones are equipped with a battery pack as a drive source. In general, a battery pack includes a battery main body and a protection circuit board connected to the battery main body in a resin container.

図５は、この保護回路基板の端部の斜視図を示す。   FIG. 5 is a perspective view of the end portion of the protection circuit board.

この図に示すように、保護回路基板１００は、電池本体からの過放電や電池本体への過充電を防止するための保護回路を構成する種々の電子部品（図示せず）を搭載した基板本体１０１と、基板本体１０１を電池本体に接続するための金属製の接続タブ１０２（端子板とも呼ばれる。）とを有する。基板本体１０１の表面には、各電子部品を導通させる配線パターン１０３が形成されており、配線パターン１０３に形成されたランド部１０４に導電プレート１０５が半田付けされ、この導電プレート１０５上に、電池本体に接続するための接続タブ１０２が溶接されている（特許文献１参照）。   As shown in this figure, the protection circuit board 100 is a board body on which various electronic components (not shown) constituting a protection circuit for preventing overdischarge from the battery body and overcharging to the battery body are mounted. 101 and a metal connection tab 102 (also referred to as a terminal plate) for connecting the substrate body 101 to the battery body. On the surface of the substrate main body 101, a wiring pattern 103 for conducting each electronic component is formed. A conductive plate 105 is soldered to a land portion 104 formed in the wiring pattern 103, and a battery is formed on the conductive plate 105. A connection tab 102 for connecting to the main body is welded (see Patent Document 1).

このように、基板本体に形成されたランド部に導電プレートが半田付けされ、この導電プレート上に金属片が溶接された構造の回路基板が従来より知られている。
特開２００４−３０４０１９号公報 As described above, a circuit board having a structure in which a conductive plate is soldered to a land portion formed on a substrate body and a metal piece is welded onto the conductive plate is conventionally known.
JP 2004-304019 A

上述したような回路基板において、接続タブ１０２を溶接する場合には、電気抵抗溶接が行なわれている。具体的には、図６に示すように、半田付けされた導電プレート１０５上に接続タブ１０２の端部を重ね、接続タブ１０２の上面を２つの棒状の電極１０６Ａ，１０６Ｂ（溶接棒とも呼ばれる。）によって押圧して、電極間に大電流を流す。そして、電流が流れることによって各電極１０６Ａ，１０６Ｂが接触する部分の下側の金属にジュール熱が発生し、この接触部分の下側の金属が溶融し、溶接される。   In the circuit board as described above, when the connection tab 102 is welded, electric resistance welding is performed. Specifically, as shown in FIG. 6, the end of the connection tab 102 is overlaid on the soldered conductive plate 105, and the upper surface of the connection tab 102 is formed with two rod-like electrodes 106A and 106B (also called welding rods). ) To cause a large current to flow between the electrodes. Then, when current flows, Joule heat is generated in the lower metal portion where the electrodes 106A and 106B come into contact, and the lower metal portion of the contact portion is melted and welded.

この溶接の際、発生した熱は導電プレート１０５の半田付け部分へと伝わる。この熱は半田の融点よりも高いため、溶接の熱により半田が溶かされ、膨張し、半田が飛び散る。この結果、図７に示すように、導電プレート１０５の周辺に半田ボール１０７が出来る。   The generated heat is transferred to the soldered portion of the conductive plate 105 during the welding. Since this heat is higher than the melting point of the solder, the solder is melted and expanded by the heat of welding, and the solder is scattered. As a result, solder balls 107 are formed around the conductive plate 105 as shown in FIG.

この半田ボールが生じた場合は、半田付け部分の品質や接続状態が悪化していることがある。また、半田ボールが出来ている回路基板を電子機器内に組み込んだ際に、万一、半田ボールが自由に移動できるようになると短絡（電気ショート）が生じることもある。このような不具合は電子機器自体の品質低下を招きかねない。したがって、半田ボールの発生の抑制が必要となる。   When this solder ball is generated, the quality and connection state of the soldered portion may be deteriorated. In addition, when a circuit board on which solder balls are made is incorporated in an electronic device, if the solder balls can move freely, a short circuit (electric short) may occur. Such a defect may lead to deterioration of the quality of the electronic device itself. Therefore, it is necessary to suppress the generation of solder balls.

上述したように、半田ボールは、溶接時に溶接棒（電極）と接触している部分の下側に発生した熱が導電プレート下部の半田付け部分へと伝わり、半田が再溶解して発生している。   As described above, the solder ball is generated when the heat generated on the lower side of the portion in contact with the welding rod (electrode) at the time of welding is transferred to the soldering portion below the conductive plate, and the solder is remelted. Yes.

このため、半田ボール発生の抑制策としては、特許文献１に示されるように、導電プレート下部の半田付け部分であって溶接棒（電極）の接触位置に対応する部分に半田が無い様にする方法が考えられている。   For this reason, as a measure for suppressing the generation of solder balls, as shown in Patent Document 1, there is no solder in the soldering portion below the conductive plate and corresponding to the contact position of the welding rod (electrode). A method is considered.

しかし、導電プレートを半田付けするためのランド部が十分な大きさで無い限り、溶接時に溶接棒の下方に半田が無いように、半田付け時の半田の広がりを確実に抑える事は困難であり、特に小型の基板にはこの方法をとることは出来ない。   However, unless the land for soldering the conductive plate is sufficiently large, it is difficult to reliably suppress the spread of solder during soldering so that there is no solder below the welding rod during welding. In particular, this method cannot be used for small substrates.

そこで本発明は、上述した従来例の問題点に鑑み、接続タブを導電プレートに溶接する時に、導電プレートを半田付けしている基板上の半田が過度に加熱されることを防止することにより、小型の基板であっても、半田ボールを減らす、あるいは、無くすことができる回路基板の構造を提供することを目的としている。   Therefore, in view of the above-described problems of the conventional example, the present invention prevents the solder on the substrate on which the conductive plate is soldered from being excessively heated when welding the connection tab to the conductive plate. An object of the present invention is to provide a circuit board structure that can reduce or eliminate solder balls even if the board is small.

本発明の回路基板は、基板本体上に導電プレートが半田付けされ、この導電プレート上に金属片が、電気抵抗溶接により、２つの電極で金属片上面を押圧しつつ溶接されたものである。そして、電気抵抗溶接時の各電極が接触する金属片上のエリアＡにそれぞれ対応する、基板本体上のエリアＢ内にそれぞれ、基板本体を貫通する穴が配置されている。このエリアＢにおける穴は１つでも良いし、複数でも構わない。   In the circuit board of the present invention, a conductive plate is soldered on a substrate body, and a metal piece is welded to the conductive plate while pressing the upper surface of the metal piece with two electrodes by electric resistance welding. And the hole which penetrates a board | substrate body is each arrange | positioned in the area B on a board | substrate body corresponding to the area A on the metal piece which each electrode contacts at the time of electrical resistance welding, respectively. There may be one or more holes in this area B.

上記の導電プレートは、基板本体上に形成されたランド部に半田付けされており、このランド部は、基板本体上のエリアＢを避けて形成されていることが好ましい。   The conductive plate is soldered to a land portion formed on the substrate body, and the land portion is preferably formed so as to avoid the area B on the substrate body.

このような回路基板では、電気抵抗溶接時の棒状電極の下に当たる位置に、貫通穴を設けているので、溶接時に電極の接触部分から導電プレート下部へと伝わった熱が貫通穴によって放熱される。このため、半田付け部分が過度に加熱されずに済み、半田ボールの発生を減らす、あるいは無くすことができる。   In such a circuit board, since a through hole is provided at a position that contacts under the rod-shaped electrode during electric resistance welding, heat transmitted from the contact portion of the electrode to the lower part of the conductive plate during welding is dissipated by the through hole. . For this reason, the soldering portion is not excessively heated, and the generation of solder balls can be reduced or eliminated.

また、基板本体に設ける貫通穴は、基板本体の他の穴加工時に合わせて形成できるため、製造時間の増加が無くコストの上昇を抑えることができる。   Further, since the through hole provided in the substrate body can be formed in accordance with other holes in the substrate body, manufacturing time does not increase and cost increase can be suppressed.

以上説明したように本発明によれば、基板本体に形成されたランド部に導電プレートが半田付けされ、この導電プレート上に金属片が電気抵抗溶接される構造の回路基板において、金属片の電気抵抗溶接時に半田ボールの発生を減らす、或いは無くす事が出来る。   As described above, according to the present invention, in the circuit board having a structure in which the conductive plate is soldered to the land portion formed on the substrate body and the metal piece is electrically resistance-welded on the conductive plate, It is possible to reduce or eliminate the generation of solder balls during resistance welding.

以下、本発明の実施の形態について図面を参照して説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は本発明の実施形態による回路基板の上面図を示している。   FIG. 1 shows a top view of a circuit board according to an embodiment of the present invention.

この図に示すように、回路基板１は、種々の電子部品（図示せず）を搭載した基板本体２と、基板本体２を他の電気部品に接続するための金属片（例えばニッケル、アルミニウム、銅など）である接続タブ３とを有する。基板本体２はたとえばガラスエポキシ樹脂から長板状に形成されている。基板本体２の上面には、各電子部品を導通させる配線パターン４が形成されている。   As shown in this figure, a circuit board 1 includes a board body 2 on which various electronic components (not shown) are mounted, and metal pieces (for example, nickel, aluminum, etc.) for connecting the board body 2 to other electrical components. And a connection tab 3 which is copper or the like. The substrate body 2 is formed in a long plate shape from glass epoxy resin, for example. On the upper surface of the substrate body 2, a wiring pattern 4 is formed for conducting each electronic component.

配線パターン４の端部にはランド部５が形成されている。ランド部５には、ニッケル、アルミニウム、銅などの導電プレート６が半田付けされている。そして、この導電プレート６上に接続タブ３が溶接されている。   Land portions 5 are formed at the ends of the wiring pattern 4. A conductive plate 6 made of nickel, aluminum, copper or the like is soldered to the land portion 5. The connection tab 3 is welded onto the conductive plate 6.

接続タブ３を溶接する場合は、図６に示した電気抵抗溶接と同様に、導電プレート６上に配置された接続タブ３の上面を２つの電極（溶接棒）によって押圧しつつ、電極間に電流を流す方法をとっている。   When the connection tab 3 is welded, the upper surface of the connection tab 3 arranged on the conductive plate 6 is pressed by two electrodes (welding rods) as in the case of the electric resistance welding shown in FIG. The method of flowing current is taken.

図１において、符号Ａは、接続タブ３を溶接する際に溶接棒（電極）が接触したエリアを示している。本発明では、基板本体２の、エリアＡに対応するエリア内に、スルーホール７（図１中の点線部）が配置されている。   In FIG. 1, a symbol A indicates an area where a welding rod (electrode) is in contact when the connection tab 3 is welded. In the present invention, a through hole 7 (dotted line portion in FIG. 1) is arranged in an area corresponding to area A of the substrate body 2.

さらに、基板本体２の構造について詳述する。図２（ａ）は基板本体２の上面図を、図２（ｂ）は図２（ａ）のＸ−Ｘ線断面の拡大図を示している。   Further, the structure of the substrate body 2 will be described in detail. 2A is a top view of the substrate body 2, and FIG. 2B is an enlarged view of a cross section taken along line XX of FIG. 2A.

図２において、基板本体２の表面に配線パターン４が形成され、さらに、この配線パターン４を覆うようにレジスト８がコーティングされている。配線パターン４の端部には、導電プレート６（図１参照）を半田付けするためのランド部５が配置されている。このランド部５は、レジスト８を除去して配線パターン４の金属面を露出させることで形成されている。   In FIG. 2, a wiring pattern 4 is formed on the surface of the substrate body 2, and a resist 8 is coated so as to cover the wiring pattern 4. A land portion 5 for soldering the conductive plate 6 (see FIG. 1) is disposed at the end of the wiring pattern 4. The land portion 5 is formed by removing the resist 8 and exposing the metal surface of the wiring pattern 4.

そして、基板本体２の、図１で示した接続タブ上の溶接棒（電極）が接触するエリアに対応するエリアＢ（図２中の二点鎖線）内に、スルーホール７が配置されている。このスルーホール７は、基板本体１の製作時に別のスルーホールと共に加工でき、基板本体２の上下面を貫通している。本実施形態では、エリアＢ内に配置されるスルーホール７の数は２個としている。   And the through hole 7 is arrange | positioned in the area B (two-dot chain line in FIG. 2) corresponding to the area which the welding rod (electrode) on the connection tab shown in FIG. . The through hole 7 can be processed together with another through hole when the substrate body 1 is manufactured, and penetrates the upper and lower surfaces of the substrate body 2. In the present embodiment, the number of through holes 7 arranged in the area B is two.

ランド部５は、半田付けによる接続強度を確保するのに十分な面積であり、溶接棒（電極）の接触部に対応するエリアＢに半田が広がらないように、このエリアＢを十分に避けて配置されている。また、本実施形態では、導電プレート６（図１参照）を配線パターン４上に半田付けする際にセルフアライメント効果が期待できるよう、導電プレート６の両端部に対応してランド部５が配置されている。   The land portion 5 has a sufficient area for securing the connection strength by soldering, and this area B should be sufficiently avoided so that the solder does not spread into the area B corresponding to the contact portion of the welding rod (electrode). Has been placed. In the present embodiment, the land portions 5 are arranged corresponding to both ends of the conductive plate 6 so that a self-alignment effect can be expected when the conductive plate 6 (see FIG. 1) is soldered onto the wiring pattern 4. ing.

図３は本実施形態の回路基板を組み立てる様子を示し、図４は電気抵抗溶接時の様子を示している。   FIG. 3 shows a state of assembling the circuit board of the present embodiment, and FIG. 4 shows a state during electric resistance welding.

図３に示すように、基板本体２上に形成されたランド部５に半田９を塗布し、導電プレート６を半田付けする。このとき、接続タブ３上の電極（溶接棒）１０Ａ，１０Ｂの接触位置の下側に当たる基板本体２の表面には、レジスト８がコーティングされているので、半田９は存在しない。   As shown in FIG. 3, the solder 9 is applied to the land portion 5 formed on the substrate body 2, and the conductive plate 6 is soldered. At this time, since the resist 8 is coated on the surface of the substrate main body 2 that contacts the lower side of the contact position of the electrodes (welding rods) 10A and 10B on the connection tab 3, the solder 9 does not exist.

そして、導電プレート６の上面に接続タブ３の端部を重ね置き、接続タブ３の上面を２本の電極（溶接棒）１０Ａ，１０Ｂによって押圧しながら、電気抵抗溶接を行なう（図４参照）。このとき、接続タブ３上に接触させる電極（溶接棒）１０Ａ，１０Ｂの位置は、基板本体２に設けられた２箇所のスルーホールエリア（図２に示すエリアＢ）に対応する位置にある。   Then, the end of the connection tab 3 is placed on the upper surface of the conductive plate 6, and electric resistance welding is performed while pressing the upper surface of the connection tab 3 with two electrodes (welding bars) 10A and 10B (see FIG. 4). . At this time, the positions of the electrodes (welding rods) 10A and 10B to be brought into contact with the connection tab 3 are positions corresponding to two through-hole areas (area B shown in FIG. 2) provided in the substrate body 2.

電気抵抗溶接の際、電極１０Ａ，１０Ｂの下部は温度が上昇するが、導電プレート６の下部へ伝わった熱はスルーホール７によって放熱される。このため、導電プレート６を半田付けしているランド部５上の半田９が過度に加熱されることなく、半田ボールの発生が無くなる。また、導電プレート６を半田付けした時に万一ランド部５上の半田９が広がって導電プレート６の下面に存在していても、電極（溶接棒）１０Ａ，１０Ｂの接触位置に対応する部分の半田への溶接時の熱はスルーホール７によって放熱されるため、半田は再溶解せず、半田ボールの発生は抑制できる。   During electrical resistance welding, the temperature of the lower portions of the electrodes 10 </ b> A and 10 </ b> B rises, but the heat transmitted to the lower portion of the conductive plate 6 is dissipated through the through holes 7. For this reason, the solder 9 on the land portion 5 to which the conductive plate 6 is soldered is not excessively heated and the generation of solder balls is eliminated. Further, even if the solder 9 on the land portion 5 spreads and exists on the lower surface of the conductive plate 6 when the conductive plate 6 is soldered, the portion corresponding to the contact position of the electrodes (welding rods) 10A and 10B Since heat at the time of welding to the solder is dissipated through the through hole 7, the solder is not remelted, and the generation of solder balls can be suppressed.

以上説明した本実施形態では、図２に示されるようにエリアＢ内に配置されるスルーホール７の数は２個としているが、本発明はこの数に限定されず、一個でも、あるいは三個以上であってもよい。さらに、スルーホール７の穴形状は丸以外でもよい。   In the present embodiment described above, the number of through holes 7 arranged in the area B is two as shown in FIG. 2, but the present invention is not limited to this number, and one or three. It may be the above. Furthermore, the hole shape of the through hole 7 may be other than round.

また、スルーホール７の加工方法は、ドリルでも、打ち抜きでも、その他、機械的加工手段、あるいは、エッチング等の化学的手段によるものでも同様の効果を得られる。   The through hole 7 can be processed by drilling, punching, mechanical processing means, or chemical means such as etching.

また、スルーホール７は、溶接電極の接触エリアとほぼ同等のエリア内に配置されていても良いし、実際に溶接した際に生じるナゲットの径内に位置されていても良い。スルーホール７は、前記エリアやナゲット径内に完全に入らなくとも、若干外れていても良い。   Further, the through hole 7 may be disposed in an area substantially equivalent to the contact area of the welding electrode, or may be positioned within the diameter of the nugget generated when the welding is actually performed. The through hole 7 may not be completely within the area or nugget diameter but may be slightly removed.

本発明の実施形態による回路基板を示す上面図である。It is a top view which shows the circuit board by embodiment of this invention. （ａ）は図１に示した回路基板における基板本体の上面図、（ｂ）は（ａ）のＸ−Ｘ線断面の拡大図である。(A) is a top view of the board | substrate body in the circuit board shown in FIG. 1, (b) is an enlarged view of the XX line cross section of (a). 本実施形態の回路基板を組み立てる様子を縦断面で示した図である。It is the figure which showed a mode that the circuit board of this embodiment was assembled in the longitudinal cross-section. 本実施形態の回路基板を組み立てる際の電気抵抗溶接時の様子を示す斜視図である。It is a perspective view which shows the mode at the time of the electrical resistance welding at the time of assembling the circuit board of this embodiment. 従来の回路基板の端部を示す斜視図である。It is a perspective view which shows the edge part of the conventional circuit board. 従来の回路基板を構成している接続タブの電気抵抗溶接時の様子を接続タブ端面側からみた図である。It is the figure which looked at the mode at the time of the electrical resistance welding of the connection tab which comprises the conventional circuit board from the connection tab end surface side. 従来の回路基板において接続タブを溶接した際に発生する半田ボールを示す上面図である。It is a top view which shows the solder ball generate | occur | produced when a connection tab is welded in the conventional circuit board.

符号の説明Explanation of symbols

１ 回路基板
２ 基板本体
３ 接続タブ
４ 配線パターン
５ ランド部
６ 導電プレート
７ スルーホール
８ レジスト
９ 半田
１０Ａ，１０Ｂ 電極（溶接棒）
Ａ 接続タブ上の、溶接棒の接触エリア
Ｂ 基板本体上の、溶接棒接触エリアに対応するエリア DESCRIPTION OF SYMBOLS 1 Circuit board 2 Board body 3 Connection tab 4 Wiring pattern 5 Land part 6 Conductive plate 7 Through hole 8 Resist 9 Solder 10A, 10B Electrode (welding rod)
A Contact area of the welding rod on the connection tab B Area on the board body corresponding to the contact area of the welding rod

Claims (3)

基板本体上に導電プレートが半田付けされ、該導電プレート上に金属片が、電気抵抗溶接により、２つの電極で金属片上面を押圧しつつ溶接された回路基板において、
電気抵抗溶接時の各電極が接触する前記金属片上のエリアＡにそれぞれ対応する、前記基板本体上のエリアＢ内にそれぞれ、前記基板本体を貫通する穴が配置されていることを特徴とする回路基板。 In a circuit board in which a conductive plate is soldered on a substrate body and a metal piece is welded while pressing the upper surface of the metal piece with two electrodes by electric resistance welding,
A circuit is provided in which holes penetrating the substrate body are arranged in the area B on the substrate body corresponding to the area A on the metal piece with which each electrode is in contact with each electrode during electrical resistance welding. substrate. 前記各エリアＢにおいて前記穴が複数配置されている、請求項１に記載の回路基板。   The circuit board according to claim 1, wherein a plurality of the holes are arranged in each area B. 前記導電プレートは、前記基板本体上に形成されたランド部に半田付けされており、該ランド部が、前記基板本体上の前記エリアＢを避けて形成されている、請求項１又は２に記載の回路基板。   The conductive plate is soldered to a land portion formed on the substrate body, and the land portion is formed so as to avoid the area B on the substrate body. Circuit board.
JP2005271990A 2005-09-20 2005-09-20 Circuit board Expired - Fee Related JP4677865B2 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004304019A (en) * 2003-03-31 2004-10-28 Mitsumi Electric Co Ltd Connection pattern structure of circuit board, and circuit board
JP2004348980A (en) * 2003-05-19 2004-12-09 Sony Corp Structure of terminal member
JP2005158883A (en) * 2003-11-21 2005-06-16 Rohm Co Ltd Circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004304019A (en) * 2003-03-31 2004-10-28 Mitsumi Electric Co Ltd Connection pattern structure of circuit board, and circuit board
JP2004348980A (en) * 2003-05-19 2004-12-09 Sony Corp Structure of terminal member
JP2005158883A (en) * 2003-11-21 2005-06-16 Rohm Co Ltd Circuit board

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