JP2007053125A - スイッチング素子 - Google Patents
スイッチング素子 Download PDFInfo
- Publication number
- JP2007053125A JP2007053125A JP2005235131A JP2005235131A JP2007053125A JP 2007053125 A JP2007053125 A JP 2007053125A JP 2005235131 A JP2005235131 A JP 2005235131A JP 2005235131 A JP2005235131 A JP 2005235131A JP 2007053125 A JP2007053125 A JP 2007053125A
- Authority
- JP
- Japan
- Prior art keywords
- switching element
- current
- voltage
- threshold
- metal oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 26
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000010409 thin film Substances 0.000 claims abstract description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 18
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 238000013500 data storage Methods 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 239000005751 Copper oxide Substances 0.000 claims description 6
- 229910000431 copper oxide Inorganic materials 0.000 claims description 6
- 230000002950 deficient Effects 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- 239000011232 storage material Substances 0.000 description 4
- 229910000314 transition metal oxide Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229920000914 Metallic fiber Polymers 0.000 description 2
- -1 chalcogenide compound Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 241001422033 Thestylus Species 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
- H10N70/026—Formation of switching materials, e.g. deposition of layers by physical vapor deposition, e.g. sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
- H10N70/063—Shaping switching materials by etching of pre-deposited switching material layers, e.g. lithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8833—Binary metal oxides, e.g. TaOx
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Memories (AREA)
Abstract
【解決手段】2つの電極間に、組成揺らぎを含む単一中心金属元素からなる金属酸化物薄膜が介在した可変抵抗素子を備え、該両電極間に、第1の閾値以上の電圧又は電流と、該第1の閾値の絶対値よりもその絶対値が小さい第2の閾値以下の電圧又は電流と、該第2の閾値の絶対値よりもその絶対値が小さい第3の閾値以下の電圧又は電流とを選択的に印加可能な制御回路と接続し、その絶対値が少なくとも第3の閾値以下の電位域又は電流域における電極間の抵抗特性を可逆的に1000〜10000倍変化せしめることを特徴とする、スイッチング素子。
【選択図】 図3
Description
本発明(1)は、2つの電極間に、組成揺らぎを含む単一中心金属元素からなる金属酸化物薄膜が介在した可変抵抗素子を備え、該両電極間に、第1の閾値以上の電圧又は電流と、該第1の閾値の絶対値よりもその絶対値が小さい第2の閾値以下の電圧又は電流と、該第2の閾値の絶対値よりもその絶対値が小さい第3の閾値以下の電圧又は電流とを選択的に印加可能な制御回路と接続し、その絶対値が少なくとも第3の閾値以下の電位域又は電流域における電極間の抵抗特性を可逆的に1000〜10000倍変化せしめることを特徴とする、スイッチング素子である。
また、本発明(2)は、前記組成揺らぎを含む金属酸化物が、銅酸化物CuO又は鉄酸化物Fe2O3の何れか一種であることを特徴とする本発明(1)のスイッチング素子である。
次に、本発明(3)は、前記組成揺らぎを含む金属酸化物が、酸素欠損型の銅酸化物CuO1−x(ここで、式中xは、0<x<1(但し、x=1/2のときを除く。)の関係を満たすものに限る。)であることを特徴とする本発明(1)のスイッチング素子である。
本発明(4)は、前記組成揺らぎを含む金属酸化物が、酸素欠損型の鉄酸化物Fe2O3−y(ここで、式中yは、0<y<1(但し、y=1/3のときを除く。)の関係を満たすものに限る。)であることを特徴とする本発明(1)のスイッチング素子である。
本発明(5)は、前記組成揺らぎを含む金属酸化物が、酸素過剰型の銅酸化物Cu2−zO(ここで、式中zは、1<z<2の関係を満たすものに限る。)であることを特徴とする本発明(1)のスイッチング素子である。
本発明(6)は、前記組成揺らぎを含む金属酸化物が、酸素過剰型の鉄酸化物Fe2−wO3(ここで、式中wは、0<w<2(但し、w=1/2のときを除く。)の関係を満たすものに限る。)であることを特徴とする本発明(1)のスイッチング素子である。
さらに、本発明(7)は、前記可変抵抗素子を不揮発性メモリのデータ蓄積部に用いたことを特徴とする本発明(1)〜(6)の何れか1発明のスイッチング素子である。
ここでまず、金属酸化物層にCuO1−xを採用した場合についても同様に計測してみた。この場合の素子構造としては、Ti/Pt/CuO1−xの積層構造を採用した。なお、かかる場合の成膜条件は、CuOのターゲットを使用する外は、Fe2O3の成膜の場合と同じである。
次に、酸化物層の直径が100μmである、Ti/Pt/Fe2O3/Ptの積層構造の系に対して、印可する電力として、印加電圧の掃引制御をする場合と、印加電流の掃引制御をする場合とについて、比較を試みた。
V 電圧計
Claims (7)
- 2つの電極間に、組成揺らぎを含む単一中心金属元素からなる金属酸化物薄膜が介在した可変抵抗素子を備え、該両電極間に、第1の閾値以上の電圧又は電流と、該第1の閾値の絶対値よりもその絶対値が小さい第2の閾値以下の電圧又は電流と、該第2の閾値の絶対値よりもその絶対値が小さい第3の閾値以下の電圧又は電流とを選択的に印加可能な制御回路と接続し、その絶対値が少なくとも第3の閾値以下の電位域又は電流域における電極間の抵抗特性を可逆的に1000〜10000倍変化せしめることを特徴とする、スイッチング素子。
- 前記組成揺らぎを含む金属酸化物が、銅酸化物CuO又は鉄酸化物Fe2O3の何れか一種であることを特徴とする請求項1記載のスイッチング素子。
- 前記組成揺らぎを含む金属酸化物が、酸素欠損型の銅酸化物CuO1−x(ここで、式中xは、0<x<1(但し、x=1/2の時を除く。)の関係を満たすものに限る。)であることを特徴とする請求項1記載のスイッチング素子。
- 前記組成揺らぎを含む金属酸化物が、酸素欠損型の鉄酸化物Fe2O3−y(ここで、式中yは、0<y<1(但し、y=1/3のときを除く。)の関係を満たすものに限る。)であることを特徴とする請求項1記載のスイッチング素子。
- 前記組成揺らぎを含む金属酸化物が、酸素過剰型の銅酸化物Cu2−zO(ここで、式中zは、1<z<2の関係を満たすものに限る。)であることを特徴とする請求項1記載のスイッチング素子。
- 前記組成揺らぎを含む金属酸化物が、酸素過剰型の鉄酸化物Fe2−wO3(ここで、式中wは、0<w<2(但し、w=1/2のときを除く。)の関係を満たすものに限る。)であることを特徴とする請求項1記載のスイッチング素子。
- 前記可変抵抗素子を不揮発性メモリのデータ蓄積部に用いたことを特徴とする請求項1〜6の何れか1項記載のスイッチング素子。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005235131A JP4854233B2 (ja) | 2005-08-15 | 2005-08-15 | スイッチング素子 |
PCT/JP2006/315629 WO2007020832A1 (ja) | 2005-08-15 | 2006-08-08 | スイッチング素子 |
US11/990,612 US7863594B2 (en) | 2005-08-15 | 2006-08-08 | Switching device |
KR1020087006186A KR100962221B1 (ko) | 2005-08-15 | 2006-08-08 | 스위칭 소자 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005235131A JP4854233B2 (ja) | 2005-08-15 | 2005-08-15 | スイッチング素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007053125A true JP2007053125A (ja) | 2007-03-01 |
JP4854233B2 JP4854233B2 (ja) | 2012-01-18 |
Family
ID=37757494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005235131A Expired - Fee Related JP4854233B2 (ja) | 2005-08-15 | 2005-08-15 | スイッチング素子 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7863594B2 (ja) |
JP (1) | JP4854233B2 (ja) |
KR (1) | KR100962221B1 (ja) |
WO (1) | WO2007020832A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008142919A1 (ja) * | 2007-05-10 | 2008-11-27 | Sharp Kabushiki Kaisha | 可変抵抗素子とその製造方法及び不揮発性半導体記憶装置 |
WO2008149808A1 (ja) * | 2007-06-07 | 2008-12-11 | Nec Corporation | スイッチ回路および半導体集積回路 |
WO2008149605A1 (ja) * | 2007-06-04 | 2008-12-11 | Nec Corporation | 抵抗変化素子およびこれを備えた半導体装置 |
JP2010040957A (ja) * | 2008-08-08 | 2010-02-18 | Fujitsu Ltd | 抵抗変化型素子および抵抗変化型素子製造方法 |
WO2010026634A1 (ja) * | 2008-09-04 | 2010-03-11 | 株式会社 東芝 | 情報記録再生装置 |
CN101459220B (zh) * | 2007-09-10 | 2013-01-23 | 三星电子株式会社 | 电阻存储器以及形成电阻存储器的方法 |
US8362456B2 (en) | 2007-04-17 | 2013-01-29 | Nec Corporation | Resistance change element and semiconductor device including the same |
JP5263160B2 (ja) * | 2007-08-22 | 2013-08-14 | 富士通株式会社 | 抵抗変化型素子 |
KR20200006282A (ko) | 2018-07-10 | 2020-01-20 | 주식회사 엘지화학 | 산화철의 제조방법 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5263856B2 (ja) * | 2006-07-26 | 2013-08-14 | 独立行政法人産業技術総合研究所 | スイッチング素子及びその製造方法 |
US8143092B2 (en) * | 2008-03-10 | 2012-03-27 | Pragati Kumar | Methods for forming resistive switching memory elements by heating deposited layers |
JP2009224403A (ja) * | 2008-03-13 | 2009-10-01 | Toshiba Corp | 情報記録素子及びそれを備えた情報記録再生装置 |
JP2012510118A (ja) | 2008-11-26 | 2012-04-26 | カルガリー・サイエンティフィック・インコーポレイテッド | アプリケーションプログラムの状態への遠隔アクセスを提供するための方法およびシステム |
US8809829B2 (en) * | 2009-06-15 | 2014-08-19 | Macronix International Co., Ltd. | Phase change memory having stabilized microstructure and manufacturing method |
KR20110054088A (ko) * | 2009-11-17 | 2011-05-25 | 삼성전자주식회사 | 비휘발성 메모리 소자 |
CN102428560B (zh) * | 2010-03-19 | 2014-07-02 | 松下电器产业株式会社 | 非易失性存储元件、其制造方法、其设计辅助方法及非易失性存储装置 |
US8634235B2 (en) | 2010-06-25 | 2014-01-21 | Macronix International Co., Ltd. | Phase change memory coding |
US9741084B2 (en) * | 2011-01-04 | 2017-08-22 | Calgary Scientific Inc. | Method and system for providing remote access to data for display on a mobile device |
KR101463782B1 (ko) * | 2011-04-06 | 2014-11-21 | 고려대학교 산학협력단 | 문턱전압 스위칭 물질을 이용한 비휘발성 메모리 소자 및 그 제조 방법 |
US8891293B2 (en) | 2011-06-23 | 2014-11-18 | Macronix International Co., Ltd. | High-endurance phase change memory devices and methods for operating the same |
WO2013024343A1 (en) | 2011-08-15 | 2013-02-21 | Calgary Scientific Inc. | Non-invasive remote access to an application program |
JP6322140B2 (ja) | 2011-09-30 | 2018-05-09 | カルガリー サイエンティフィック インコーポレイテッド | 協働遠隔アプリケーションの共用および注釈のための双方向デジタル表層を含む非連結アプリケーション拡張 |
EP2783483B1 (en) | 2011-11-23 | 2019-08-07 | Calgary Scientific Inc. | Methods and systems for collaborative remote application sharing and conferencing |
US9099633B2 (en) | 2012-03-26 | 2015-08-04 | Adesto Technologies Corporation | Solid electrolyte memory elements with electrode interface for improved performance |
US9001550B2 (en) | 2012-04-27 | 2015-04-07 | Macronix International Co., Ltd. | Blocking current leakage in a memory array |
US8964448B2 (en) * | 2012-08-09 | 2015-02-24 | Micron Technology, Inc. | Memory cells having a plurality of resistance variable materials |
US8964442B2 (en) | 2013-01-14 | 2015-02-24 | Macronix International Co., Ltd. | Integrated circuit 3D phase change memory array and manufacturing method |
US9672906B2 (en) | 2015-06-19 | 2017-06-06 | Macronix International Co., Ltd. | Phase change memory with inter-granular switching |
CN105679840B (zh) * | 2016-04-11 | 2018-07-13 | 南京大学 | 一种新型贴片式忆容器及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002537627A (ja) * | 1999-02-17 | 2002-11-05 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 情報を保存するマイクロ電子デバイスとその方法 |
WO2006028117A1 (ja) * | 2004-09-09 | 2006-03-16 | Matsushita Electric Industrial Co., Ltd. | 抵抗変化素子とその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100773537B1 (ko) | 2003-06-03 | 2007-11-07 | 삼성전자주식회사 | 한 개의 스위칭 소자와 한 개의 저항체를 포함하는비휘발성 메모리 장치 및 그 제조 방법 |
JP5263856B2 (ja) * | 2006-07-26 | 2013-08-14 | 独立行政法人産業技術総合研究所 | スイッチング素子及びその製造方法 |
-
2005
- 2005-08-15 JP JP2005235131A patent/JP4854233B2/ja not_active Expired - Fee Related
-
2006
- 2006-08-08 WO PCT/JP2006/315629 patent/WO2007020832A1/ja active Application Filing
- 2006-08-08 KR KR1020087006186A patent/KR100962221B1/ko not_active IP Right Cessation
- 2006-08-08 US US11/990,612 patent/US7863594B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002537627A (ja) * | 1999-02-17 | 2002-11-05 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 情報を保存するマイクロ電子デバイスとその方法 |
WO2006028117A1 (ja) * | 2004-09-09 | 2006-03-16 | Matsushita Electric Industrial Co., Ltd. | 抵抗変化素子とその製造方法 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8362456B2 (en) | 2007-04-17 | 2013-01-29 | Nec Corporation | Resistance change element and semiconductor device including the same |
JP2008306157A (ja) * | 2007-05-10 | 2008-12-18 | Sharp Corp | 可変抵抗素子とその製造方法及び不揮発性半導体記憶装置 |
WO2008142919A1 (ja) * | 2007-05-10 | 2008-11-27 | Sharp Kabushiki Kaisha | 可変抵抗素子とその製造方法及び不揮発性半導体記憶装置 |
WO2008149605A1 (ja) * | 2007-06-04 | 2008-12-11 | Nec Corporation | 抵抗変化素子およびこれを備えた半導体装置 |
WO2008149808A1 (ja) * | 2007-06-07 | 2008-12-11 | Nec Corporation | スイッチ回路および半導体集積回路 |
JP5402630B2 (ja) * | 2007-06-07 | 2014-01-29 | 日本電気株式会社 | スイッチ回路および半導体集積回路 |
JP5263160B2 (ja) * | 2007-08-22 | 2013-08-14 | 富士通株式会社 | 抵抗変化型素子 |
CN101459220B (zh) * | 2007-09-10 | 2013-01-23 | 三星电子株式会社 | 电阻存储器以及形成电阻存储器的方法 |
JP2010040957A (ja) * | 2008-08-08 | 2010-02-18 | Fujitsu Ltd | 抵抗変化型素子および抵抗変化型素子製造方法 |
US8416606B2 (en) | 2008-09-04 | 2013-04-09 | Kabushiki Kaisha Toshiba | Information recording and reproducing device |
WO2010026634A1 (ja) * | 2008-09-04 | 2010-03-11 | 株式会社 東芝 | 情報記録再生装置 |
JP5318107B2 (ja) * | 2008-09-04 | 2013-10-16 | 株式会社東芝 | 情報記録再生装置 |
KR20200006282A (ko) | 2018-07-10 | 2020-01-20 | 주식회사 엘지화학 | 산화철의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR100962221B1 (ko) | 2010-06-11 |
JP4854233B2 (ja) | 2012-01-18 |
WO2007020832A1 (ja) | 2007-02-22 |
US20100012911A1 (en) | 2010-01-21 |
US7863594B2 (en) | 2011-01-04 |
KR20080052590A (ko) | 2008-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4854233B2 (ja) | スイッチング素子 | |
US8441837B2 (en) | Variable resistance nonvolatile memory device | |
TWI515726B (zh) | 摻雜氮之氧化鎂內的電阻開關 | |
Ielmini et al. | Thermochemical resistive switching: materials, mechanisms, and scaling projections | |
US8525142B2 (en) | Non-volatile variable resistance memory device and method of fabricating the same | |
US8054674B2 (en) | Variable resistive element, manufacturing method for same, and non-volatile semiconductor memory device | |
US7796416B2 (en) | Variable resistance element, its manufacturing method and semiconductor memory device comprising the same | |
US7777215B2 (en) | Resistive memory structure with buffer layer | |
CN101106171B (zh) | 包括可变电阻材料的非易失存储器 | |
US8310857B2 (en) | Method for manufacturing a resistive switching memory cell comprising a nickel oxide layer operable at low-power and memory cells obtained thereof | |
US8957399B2 (en) | Nonvolatile memory element and nonvolatile memory device | |
JP2009135206A (ja) | メモリセル | |
US20220085104A1 (en) | Selection device and memory device using the same | |
JP5263856B2 (ja) | スイッチング素子及びその製造方法 | |
KR102464065B1 (ko) | 스위칭 소자, 이의 제조 방법, 스위칭 소자를 선택 소자로서 포함하는 저항 변화 메모리 장치 | |
JP7080178B2 (ja) | 不揮発性記憶装置、及び駆動方法 | |
Balakrishnan et al. | A low power non-volatile memory element based on copper in deposited silicon oxide | |
Gogoi et al. | A comparative study on the forming methods of chalcogenide memristors to optimize the resistive switching performance | |
Chang et al. | Investigation on the abnormal resistive switching induced by ultraviolet light exposure based on HfOx film | |
Yoon et al. | Analysis of copper ion filaments and retention of dual-layered devices for resistance random access memory applications | |
Goux et al. | Self-limited filament formation and low-power resistive switching in CuxTe1-x/Al2O3/Si CBRAM cell | |
CN103022346B (zh) | 电阻式存储器 | |
CN101599531B (zh) | 一种电阻型随机存储器的存储单元及其制备方法 | |
Wang et al. | Ultra-large resistance ratio of silver programmable metallization cell with stacked silicon oxide films | |
KR101781002B1 (ko) | 저항 변화 메모리 소자 및 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070314 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071030 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110117 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111020 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111025 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141104 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4854233 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141104 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |