JP2007051337A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2007051337A5 JP2007051337A5 JP2005237505A JP2005237505A JP2007051337A5 JP 2007051337 A5 JP2007051337 A5 JP 2007051337A5 JP 2005237505 A JP2005237505 A JP 2005237505A JP 2005237505 A JP2005237505 A JP 2005237505A JP 2007051337 A5 JP2007051337 A5 JP 2007051337A5
- Authority
- JP
- Japan
- Prior art keywords
- target
- backing plate
- sputtering
- sputter
- target assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 238000005477 sputtering target Methods 0.000 claims description 2
Description
上記課題を解決するために、請求項1記載のスパッタ電極は、スパッタリング用のターゲットと、このターゲットのスパッタ面の背面側にボンディング材を介して接合されたバッキングプレートとを有するターゲット組立体を備え、このターゲット組立体を、バッキングプレートのターゲットより外側に延出した部分を介してスパッタ電極本体に取付自在であるスパッタ電極であって、前記バッキングプレートのスパッタ電極本体への取付箇所がそれぞれ位置する水平面に対し直交する方向に沿って、ターゲット組立体の中央領域に引張力または押圧力のいずれか一方を加える反り矯正手段を設けたことを特徴とする。
In order to solve the above problems, a sputtering electrode according to claim 1 includes a target assembly including a sputtering target and a backing plate bonded to the back side of the sputtering surface of the target via a bonding material. , the target assembly, a sputter electrode via a portion extending outward from the target backing plate is freely mounted on the sputter electrode body, located attachment points each to sputter electrodes main body of the backing plate A warp correcting means for applying either a tensile force or a pressing force is provided in the central region of the target assembly along a direction perpendicular to the horizontal plane.
Claims (1)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005237505A JP2007051337A (en) | 2005-08-18 | 2005-08-18 | Sputtering electrode and sputtering apparatus provided with the sputtering electrode |
TW95125492A TWI393797B (en) | 2005-08-18 | 2006-07-12 | Sputtering electrodes and sputtering devices with sputtering electrodes |
CN 200610111086 CN1916231A (en) | 2005-08-18 | 2006-08-18 | Sputtering electrode and sputtering device possessing sputtering electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005237505A JP2007051337A (en) | 2005-08-18 | 2005-08-18 | Sputtering electrode and sputtering apparatus provided with the sputtering electrode |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007051337A JP2007051337A (en) | 2007-03-01 |
JP2007051337A5 true JP2007051337A5 (en) | 2008-08-14 |
Family
ID=37737294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005237505A Pending JP2007051337A (en) | 2005-08-18 | 2005-08-18 | Sputtering electrode and sputtering apparatus provided with the sputtering electrode |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2007051337A (en) |
CN (1) | CN1916231A (en) |
TW (1) | TWI393797B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201009101A (en) * | 2008-06-17 | 2010-03-01 | Shincron Co Ltd | Bias sputtering apparatus |
JP5734612B2 (en) * | 2010-10-04 | 2015-06-17 | 株式会社アルバック | Cathode unit and deposition system |
JP5726633B2 (en) * | 2011-05-20 | 2015-06-03 | 株式会社アルバック | Target device |
CN104690487A (en) * | 2013-12-09 | 2015-06-10 | 有研亿金新材料股份有限公司 | Method for adhesively connecting target and backboard |
KR20210016189A (en) * | 2019-08-01 | 2021-02-15 | 삼성디스플레이 주식회사 | Sputtering apparatus and sputtering method using the same |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4879017A (en) * | 1988-11-29 | 1989-11-07 | Dae Ryung Vacumm Co. Ltd. | Multi-rod type magnetron sputtering apparatus |
DE68913466T2 (en) * | 1988-12-21 | 1994-09-01 | Toshiba Kawasaki Kk | Sputtering target and process for its production. |
CA2108673A1 (en) * | 1991-04-19 | 1992-10-20 | John Marshall | Method and apparatus for linear magnetron sputtering |
JP2555004B2 (en) * | 1993-12-30 | 1996-11-20 | アネルバ株式会社 | Sputtering equipment |
CA2218736A1 (en) * | 1995-05-11 | 1996-11-14 | Steven D. Hurwitt | Sputtering apparatus with isolated coolant and sputtering target therefor |
JPH111770A (en) * | 1997-06-06 | 1999-01-06 | Anelva Corp | Sputtering apparatus and sputtering method |
JP3390338B2 (en) * | 1998-02-02 | 2003-03-24 | 鹿児島日本電気株式会社 | Target electrode for sputtering equipment |
WO2000028104A1 (en) * | 1998-11-06 | 2000-05-18 | Scivac | Sputtering apparatus and process for high rate coatings |
JP4717186B2 (en) * | 2000-07-25 | 2011-07-06 | 株式会社アルバック | Sputtering equipment |
JP2004143535A (en) * | 2002-10-24 | 2004-05-20 | Bridgestone Corp | Method for depositing carbon thin film |
JP4246547B2 (en) * | 2003-05-23 | 2009-04-02 | 株式会社アルバック | Sputtering apparatus and sputtering method |
-
2005
- 2005-08-18 JP JP2005237505A patent/JP2007051337A/en active Pending
-
2006
- 2006-07-12 TW TW95125492A patent/TWI393797B/en active
- 2006-08-18 CN CN 200610111086 patent/CN1916231A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2007051337A5 (en) | ||
USD542628S1 (en) | Mounting plate | |
USD570801S1 (en) | Transducer mounting bracket | |
JP2011506807A5 (en) | ||
USD532756S1 (en) | Electrode layer | |
USD535264S1 (en) | Electrode layer | |
USD592206S1 (en) | Electronic device mount | |
USD530192S1 (en) | Adhesive backed clip | |
USD580445S1 (en) | Mounting bracket for flat panel display | |
USD532757S1 (en) | Electrode layer | |
USD547237S1 (en) | Traction stud backer plate | |
BRMU8402004U (en) | Reed arrangement | |
EP2014188A3 (en) | Metallic double-sided element and slide fastener | |
MX345711B (en) | Thin mirror with truss backing and mounting arrangement therefor. | |
JP2013542028A5 (en) | ||
JP2020508793A5 (en) | ||
USD596587S1 (en) | Control panel | |
JP2019169231A5 (en) | ||
USD937784S1 (en) | Plate of electrical control panel | |
USD555246S1 (en) | Dental unit | |
USD533847S1 (en) | Electrode layer | |
USD534134S1 (en) | Electrode layer | |
TW200710250A (en) | Sputtering electrode and the sputtering apparatus equipped the electrode | |
USD577867S1 (en) | Turnout blanket | |
USD534775S1 (en) | Mounting for a plaster trowel |