JP2007013717A - Adjusting method of piezo oscillator - Google Patents

Adjusting method of piezo oscillator Download PDF

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JP2007013717A
JP2007013717A JP2005193006A JP2005193006A JP2007013717A JP 2007013717 A JP2007013717 A JP 2007013717A JP 2005193006 A JP2005193006 A JP 2005193006A JP 2005193006 A JP2005193006 A JP 2005193006A JP 2007013717 A JP2007013717 A JP 2007013717A
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semiconductor integrated
integrated component
oscillator
piezoelectric
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Masayasu Miyanaga
当康 宮良
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Kyocera Crystal Device Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To efficiently utilize a semiconductor integrated component constituting a piezo oscillator during a manufacturing process about a structure of the piezo oscillator corresponding to the miniaturization of an integrated circuit (IC) semiconductor component to be mounted on a temperature compensating oscillator and its adjusting method. <P>SOLUTION: In the adjusting method of a piezo oscillator composed of a piezoelectric vibrator in which an exciting electrode is formed on a piezoelectric element plate and a semiconductor integrated component forming an oscillator circuit, switching functions are switched between during data communication and during a state other than data communication to adjust an adjusting signal to be connected to an adjusting terminal of the semiconductor integrated component when temperature compensation data is written or read to/from a memory of the semiconductor integrated component, adjusting signal switching is an adjusting signal of a temperature compensating piezo oscillator and is composed of a set of a combination an AFC and an SCLK and/or a combination of a UTL and a DIO, and the efficiency of functions of the semiconductor integrated component is increased by switching processing and terminal sharing. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

小型化する圧電発振器や温度補償型発振器に実装する集積回路（ＩＣ）半導体集積部品の小型化に対応した圧電発振器の構造と、その調整方法に関するものである。   The present invention relates to a structure of a piezoelectric oscillator corresponding to miniaturization of an integrated circuit (IC) semiconductor integrated component mounted on a piezoelectric oscillator to be miniaturized or a temperature compensated oscillator, and an adjustment method thereof.

水晶振動子などの圧電振動子を用いた圧電発振器は、携帯電話などの通信装置や、パーソナルコンピュータといった各種の電子機器で広く使用されている。そして、電子機器の小型化に伴い、他の種々の電子部品と同様、圧電発振器に関しても、プリント配線板における部品実装密度を高めるべく小型化の工夫が様々成されている。   Piezoelectric oscillators using piezoelectric vibrators such as quartz vibrators are widely used in communication devices such as mobile phones and various electronic devices such as personal computers. With the miniaturization of electronic devices, various contrivances for miniaturization have been made to increase the component mounting density on the printed wiring board for the piezoelectric oscillator as well as other various electronic components.

従来から用いられる圧電発振器は、積層基板に発振回路用印刷パターンを配置し、この積層基板の同一平面上に発振回路を構成するコンデンサ、抵抗、集積回路などの半導体集積部品と気密封止された圧電振動子を搭載し圧電発振器を構成する形態（例えば、特許文献１）であったり、圧電振動子と圧電発振器を収納する容器基板の表裏に配置する形態（例えば、特許文献２）にした圧電発振器が使用されていた。   Conventionally used piezoelectric oscillators have a printed circuit pattern for an oscillation circuit arranged on a multilayer substrate, and are hermetically sealed with semiconductor integrated components such as capacitors, resistors, and integrated circuits that constitute the oscillation circuit on the same plane of the multilayer substrate. Piezoelectric oscillators that have a piezoelectric oscillator mounted and configured as a piezoelectric oscillator (for example, Patent Document 1) or that are arranged on the front and back of a container substrate that houses the piezoelectric vibrator and the piezoelectric oscillator (for example, Patent Document 2). An oscillator was used.

要するに、１つのパッケージ内に圧電振動子と半導体集積部品を収容する場合には、パッケージ内でそれらを横に並べて配置するよりも、上下に重ねて配置した方が小型化を実現する上で有利であることから、最近では基板の表裏に圧電振動子と半導体集積部品を配置する形態が主に成っているのが現状である。そして、昨今では、更に小型化を実現するために、半導体集積部品に圧電振動子を直接搭載し一体化し容器中に収納した形態（例えば、特許文献３）を持つ発明にも至っている現状にある。   In short, when the piezoelectric vibrator and the semiconductor integrated component are accommodated in one package, it is more advantageous to realize miniaturization by arranging the piezoelectric vibrator and the semiconductor integrated component in the package so as to overlap each other than arranging them side by side. For this reason, the current situation is that the piezoelectric vibrator and the semiconductor integrated component are arranged mainly on the front and back of the substrate. In recent years, in order to achieve further miniaturization, the present invention has led to an invention having a form (for example, Patent Document 3) in which a piezoelectric vibrator is directly mounted on a semiconductor integrated component, integrated, and stored in a container. .

しかし上述する従来の技術の基本となるのは、圧電振動子や収納容器、あるいは集積回路と言った要素部品の小型化があって初めて実現するものであるが、これらの要素部品を現状寸法より更に小型にすることは非常に難しい課題がある。一例としては圧電振動子の小型化は製造上と特性上の課題があり、容器についても同様に製造上の課題がある。また、集積回路に関しては、高機能と高精度化する発振器を構成する上で特に温度補償型発振器については周波数変動を極力低減するために、集積回路としての機能的な面と接続用電極の端子数を考えても集積回路の小型化が難しいのが現状にある。   However, the basics of the above-described conventional technology are realized only when there is a reduction in the size of element parts such as piezoelectric vibrators, storage containers, or integrated circuits. Furthermore, there is a very difficult problem to reduce the size. As an example, downsizing of the piezoelectric vibrator has problems in manufacturing and characteristics, and the container also has problems in manufacturing. In addition, regarding the integrated circuit, in order to reduce the frequency fluctuation as much as possible especially in the case of a temperature-compensated oscillator in configuring a highly functional and highly accurate oscillator, the functional surface of the integrated circuit and the terminal of the connection electrode In reality, it is difficult to reduce the size of an integrated circuit even when considering the number.

それに対して、集積回路の接続用電極端子数を機能的に共用した発明（例えば、特許文献４）が提案されている。その概要は図１に示すものであるが、例えばＴＣＸＯの集積回路として従来では個別の電極端子として配置したものを、共有できる範囲で電極端子を削減し全体から見た集積回路を小型化した技術である。
特開２０００−０７７９４４号公報 特開平０７−１０６９０１号公報 特開２０００−１９６３６０号公報 特開平１１−１３６０３２号公報 なお、出願人は、本願明細書に記載した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を本件の出願時までに発見するに至らなかった。 On the other hand, the invention (for example, patent document 4) which functionally shared the number of electrode terminals for connection of an integrated circuit is proposed. The outline is shown in FIG. 1. For example, a technology in which a conventional TCXO integrated circuit arranged as an individual electrode terminal is reduced in size so that it can be shared and the integrated circuit viewed from the whole is downsized. It is.
JP 2000-077944 A Japanese Patent Application Laid-Open No. 07-106901 JP 2000-196360 A In addition, the applicant has discovered prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the prior art document information described in the present specification. I did not.

しかしながら、上述する従来の圧電発振器で、特に圧電振動子と半導体集積部品を一体化しても、それでも容器の外形寸法は圧電発振器の小型化の限界に近づきつつあるのが現状にある。この背景には、特に昨今の携帯端末が極小型化、極薄型化になっているのが理由にある。今までは、携帯端末として代表されるのが携帯電話機であったが、現在ではパーソナルコンピュータも携帯して持ち運べるほどに小型化しており、そのコンピュータの通信端末として、カード状の通信ボードが普及している。   However, even with the above-described conventional piezoelectric oscillator, in particular, even if the piezoelectric vibrator and the semiconductor integrated component are integrated, the outer dimensions of the container are still approaching the limit of miniaturization of the piezoelectric oscillator. This is because, in particular, recent mobile terminals are extremely small and thin. Until now, mobile phones have been represented as mobile terminals, but now they are small enough to carry and carry personal computers, and card-like communication boards have become popular as communication terminals for such computers. ing.

これらの通信ボードには、上述する携帯電話機より更に小型化、薄型化の要求を求められることから、これら通信ボードに搭載する圧電発振器にも同様に極小型化と極薄型化の要求が強まっている。   Since these communication boards are required to be smaller and thinner than the above-described mobile phones, the demand for miniaturization and ultrathinness is also increasing in the piezoelectric oscillators mounted on these communication boards. Yes.

圧電発振器の構成部品のひとつである半導体集積部品に関しては、上述する従来技術に示す例えば特許文献４にあるような、圧電発振器を駆動する半導体集積部品の電極端子を減らした技術が開示されている。しかしながら、工場の生産工程においては、圧電発振器の構成部品やその端子接続が変わったことにより生産のフローや製造工程における各種測定工程を容易に変更することは難しく、更にはひとつの製造工程を複数種の生産製品で共有している場合には、殆ど対応できなくなるという生産効率上の問題を発生することになる。   As for the semiconductor integrated component which is one of the components of the piezoelectric oscillator, there is disclosed a technology in which the electrode terminals of the semiconductor integrated component for driving the piezoelectric oscillator are reduced, as disclosed in, for example, Patent Document 4 shown in the related art described above. . However, in the production process of the factory, it is difficult to easily change the production flow and various measurement processes in the manufacturing process due to changes in the components of the piezoelectric oscillator and its terminal connections. In the case of sharing with various kinds of production products, there arises a problem in production efficiency that it becomes almost impossible to cope.

上述するこれらの問題を解決するために本発明は、圧電素板に励振用電極を形成した圧電振動子と、発振回路を形成した半導体集積部品とから成る圧電発振器の調整方法において、温度補償データを前記半導体集積部品のメモリに書込みまたは、読込み時に、前記半導体集積部品の調整用端子と接続する調整用信号をデータ通信時とデータ通信時以外の状態で機能を切り換えて調整する圧電発振器の調整方法で、調整用信号の切り換えは、温度補償型圧電発振器の調整用信号であり、ＡＦＣとＳＣＬＫの組合せおよび／または、ＵＴＬとＤＩＯの組合せを組とする構成から成ることを特徴とする圧電発振器の調整方法である。   In order to solve these problems described above, the present invention provides a method for adjusting a piezoelectric oscillator comprising a piezoelectric vibrator in which an excitation electrode is formed on a piezoelectric base plate and a semiconductor integrated component in which an oscillation circuit is formed. Of a piezoelectric oscillator that adjusts an adjustment signal to be connected to an adjustment terminal of the semiconductor integrated component by switching the function in a state other than during data communication and during data communication when writing to or reading from the memory of the semiconductor integrated component The switching of the adjustment signal is a signal for adjustment of a temperature-compensated piezoelectric oscillator, and comprises a combination of a combination of AFC and SCLK and / or a combination of UTL and DIO. This is the adjustment method.

要するに本願発明者は、温度補償型圧電発振器（ＴＣＸＯ）を構成する半導体集積部品が、圧電発振器の中で最も多機能であることからこの半導体集積部品を駆動し、クロック源となる圧電振動子との接続や、温度補償を行うためのメモリ回路や圧電振動子の温度補償特性を補正するための調整端子など、多数の電極を有することに対して、温度補償型圧電発振器を駆動する半導体集積部品の端子の一部を共有した、例えば特許文献４に開示する技術の半導体集積部品を用いた場合であっても、スイッチング処理により共有端子によりまとめられている半導体集積部品の機能を効率良く切り分けられることに着眼したものである。   In short, the inventor of the present application drives the semiconductor integrated component since the semiconductor integrated component constituting the temperature-compensated piezoelectric oscillator (TCXO) has the most functions among the piezoelectric oscillators, and a piezoelectric vibrator serving as a clock source Integrated circuit that drives a temperature-compensated piezoelectric oscillator for having a large number of electrodes, such as a memory circuit for temperature compensation, a memory circuit for temperature compensation, and an adjustment terminal for correcting the temperature compensation characteristics of a piezoelectric vibrator Even when a semiconductor integrated component of the technology disclosed in Patent Document 4, for example, sharing a part of the terminals is used, the functions of the semiconductor integrated components combined by the shared terminals can be efficiently separated by switching processing. In particular, it focuses on that

特に温度補償型圧電発振器を駆動する半導体集積部品では、圧電発振器を駆動するのに必要なユーザ側で使用される基本的な機能端子と、製造メーカ側で必要とする調整用端子を共有化した半導体集積部品を使用する場合には、大変効率の良いスイッチング処理方法を実験的に発見したことで、従来に挙げる課題を解決するものである。   In particular, in semiconductor integrated parts that drive temperature-compensated piezoelectric oscillators, basic functional terminals used on the user side required to drive the piezoelectric oscillator and adjustment terminals required on the manufacturer side are shared. In the case of using a semiconductor integrated component, an extremely efficient switching processing method has been experimentally discovered to solve the conventional problems.

本発明により温度補償型圧電発振器を構成する半導体集積部品を小型化したものを利用することができ、更には従来の製造工程と同じ設備も使用することができることから、製造工程を大幅に変更することなく生産工程を確立することができることにより、圧電発振器の小型化を推進すると共に、製造工程の設備の共有も行えることから、製造コストの低減と多品種を同一の生産工程で共有することができる。   According to the present invention, it is possible to use a miniaturized semiconductor integrated part constituting the temperature compensated piezoelectric oscillator, and furthermore, the same equipment as the conventional manufacturing process can be used, so that the manufacturing process is greatly changed. Since the production process can be established without reducing the size of the piezoelectric oscillator and sharing the manufacturing process equipment, it is possible to reduce manufacturing costs and share multiple products in the same production process. it can.

以下、図面に従ってこの発明の実施例を説明する。なお、各図において同一の符号は同様の対象を示すものとする。図１は従来の半導体集積部品に構成される機能端子と、その端子の中から一部の機能だけをひとつの端子に共有して構成する半導体集積部品の端子の構成を図示したものである。図中に示す端子は以下の機能を持つものである。なお、従来と本発明の両者の場合の端子機能を記載する。   Embodiments of the present invention will be described below with reference to the drawings. In each figure, the same numerals indicate the same objects. FIG. 1 illustrates a configuration of a functional terminal configured in a conventional semiconductor integrated component and a terminal of a semiconductor integrated component configured by sharing only a part of functions among the terminals. The terminals shown in the figure have the following functions. In addition, the terminal function in both the conventional case and the present invention will be described.

従来の場合の端子機能は８端子として、ＡＦＣ：周波数可変電圧入力、Ｖｄｄ：電源、ＧＮＤ：接地端子、ＯＵＴ：周波数出力、ＣＳ：データ通信用１(Chip Select)、ＵＴＬ：アナログ電圧入出力、ＤＩＯ：データ通信用２(Data Input Output)、ＳＣＬＫ：データ通信用３(Clock)であるのに対して、本発明では６端子であるＶＡＦＣ：データ通信用３(Clock)／周波数可変電圧入力、Ｖｄｄ：電源、ＧＮＤ：接地端子、ＯＵＴ：周波数出力、ＣＳ：データ通信用１(Chip Select)、ＡＤＩＯ：データ通信用２(Data Input Outut)／アナログ電圧入出力、となっている。   Conventional terminal functions are 8 terminals, AFC: frequency variable voltage input, Vdd: power supply, GND: ground terminal, OUT: frequency output, CS: 1 for data communication (Chip Select), UTL: analog voltage input / output, DIO: 2 for data communication (Data Input Output), SCLK: 3 for data communication (Clock), but in the present invention, VAFC: 3 for data communication (Clock) / frequency variable voltage input, Vdd: power supply, GND: ground terminal, OUT: frequency output, CS: data communication 1 (Chip Select), ADIO: data communication 2 (Data Input Outut) / analog voltage input / output.

その結果、図２に示すような端子の構成と共有端子をまとめる考え方から、従来の機能を満足しながらも、スイッチによる切り換えにより従来と同じ半導体集積部品の機能を満足することができるものである。この端子の削減については、従来技術の中で既に説明があるが、本願発明者は図３の切り換え手段動作タイミングを実験的に工夫することで、最良の条件を得たものである。   As a result, from the concept of combining the terminal configuration and the shared terminal as shown in FIG. 2, the function of the same semiconductor integrated component as before can be satisfied by switching with a switch while satisfying the conventional function. . Although the reduction of this terminal has already been described in the prior art, the present inventor has obtained the best conditions by experimentally devising the switching means operation timing of FIG.

そして、従来品と本発明の端子数を減らした半導体集積部品を兼用する上で、図４に示すようなタイミングチャートを端子機能を共有化することで動作させることで、圧電素板に励振用電極を形成した圧電振動子と、発振回路を形成した半導体集積部品とから成る圧電発振器の調整方法において、温度補償データを前記半導体集積部品のメモリに書込みまたは、読込み時に、前記半導体集積部品の調整用端子と接続する調整用信号をデータ通信時とデータ通信時以外の状態で機能を切り換えて調整する圧電発振器の調整方法で、調整用信号の切り換えは、温度補償型圧電発振器の調整用信号であり、ＡＦＣとＳＣＬＫの組合せおよび／または、ＵＴＬとＤＩＯの組合せを組とする構成から成る圧電発振器の調整方法を得たものである。   In addition, when combining the conventional product and the semiconductor integrated component with a reduced number of terminals according to the present invention, the timing chart as shown in FIG. 4 is operated by sharing the terminal function, thereby exciting the piezoelectric element plate. In a method for adjusting a piezoelectric oscillator comprising a piezoelectric vibrator having an electrode and a semiconductor integrated part having an oscillation circuit, the temperature adjustment data is adjusted to the semiconductor integrated part when the temperature compensation data is written to or read from the memory of the semiconductor integrated part. This is a method for adjusting the piezoelectric oscillator that adjusts the adjustment signal to be connected to the terminal for switching between functions during data communication and other than during data communication. The adjustment signal can be switched using the adjustment signal of the temperature-compensated piezoelectric oscillator. There is obtained a method for adjusting a piezoelectric oscillator having a configuration in which a combination of AFC and SCLK and / or a combination of UTL and DIO is set.

要するに、図４のタイミングチャート図から分かるように、従来品はデータの書込時では、ＣＳ，ＳＫ，ＤＩＯ（ＵＴＬ）は単機能の調整端子として使用するのに対して、本発明では（１）ＶＡＦＣはＡＦＣ端子、ＣＬＯＣＫ端子の機能を共有し、通常動作時にはＡＦＣ端子として機能し、データ通信時にはクロック端子として機能する。（２）ＡＤＩＯはＵＴＬ端子、ＤＩＯ端子の機能を共有し、通常動作時にはＵＴＬ端子（アナログ電圧入出力端子）として機能し、データ通信時にはデータ入出力端子として機能する。このように、（１）と（２）則ち、通常動作時とデータ通信（書込）時の切替はＣＳ信号線の状態（ＨｉｇｈかＬｏｗ）によって切替えることによって、端子の数を減らせたものである。なお、ここではデータ通信時とは読込時も想定している。   In short, as can be seen from the timing chart of FIG. 4, in the conventional product, CS, SK, DIO (UTL) are used as single-function adjustment terminals when writing data, whereas in the present invention (1 ) The VAFC shares the functions of the AFC terminal and the CLOCK terminal, functions as an AFC terminal during normal operation, and functions as a clock terminal during data communication. (2) ADIO shares the functions of the UTL terminal and DIO terminal, functions as a UTL terminal (analog voltage input / output terminal) during normal operation, and functions as a data input / output terminal during data communication. As described above, (1) and (2), that is, switching between normal operation and data communication (writing) can be performed by switching according to the state of CS signal line (High or Low), thereby reducing the number of terminals. It is. Here, the data communication is also assumed to be a reading time.

本願発明者は、温度補償型圧電発振器（ＴＣＸＯ）を構成する半導体集積部品が、圧電発振器の中で最も多機能であることからこの半導体集積部品を駆動し、クロック源となる圧電振動子との接続や、温度補償を行うためのメモリ回路や圧電振動子の温度補償特性を補正するための調整端子など、多数の電極を有することに対して、温度補償型圧電発振器を駆動する半導体集積部品の端子の一部を共有した、例えば特許文献４に開示する技術の半導体集積部品を用いた場合であっても、スイッチング（ＩＣ４０５３相当の機能素子を用いて）処理により共有端子によりまとめられている半導体集積部品の機能を効率良く切り分けられることに着眼し、特に温度補償型圧電発振器を駆動する半導体集積部品では、圧電発振器を駆動するのに必要なユーザ側で使用される基本的な機能端子と、製造メーカ側で必要とする調整用端子を共有化した半導体集積部品を使用する場合には、大変効率の良いスイッチング処理方法を実験的に発見したことで、従来に挙げる課題を解決するものである。   The inventor of the present application drives the semiconductor integrated component since the semiconductor integrated component constituting the temperature compensated piezoelectric oscillator (TCXO) has the most functions among the piezoelectric oscillators. A semiconductor integrated component that drives a temperature-compensated piezoelectric oscillator in contrast to having a large number of electrodes, such as connection, a memory circuit for temperature compensation, and an adjustment terminal for correcting the temperature compensation characteristics of a piezoelectric vibrator. Even in the case of using a semiconductor integrated component of the technology disclosed in, for example, Patent Document 4 that shares a part of the terminal, a semiconductor that is grouped by the shared terminal by switching (using a functional element equivalent to IC4053) Focused on efficient separation of the functions of integrated components, especially for semiconductor integrated components that drive temperature compensated piezoelectric oscillators. Experimentally discovered a very efficient switching method when using semiconductor integrated parts that share basic function terminals used on the user side and adjustment terminals required by the manufacturer. This solves the conventional problems.

その結果、温度補償型圧電発振器を構成する半導体集積部品を小型化したものを利用することができ、更には従来の製造工程と同じ設備も使用することができることから、製造工程を大幅に変更することなく生産工程を確立することができることにより、圧電発振器の小型化を推進すると共に、製造工程の設備の共有も行えることから、製造コストの低減と多品種を同一の生産工程で共有することができる。   As a result, the semiconductor integrated parts constituting the temperature-compensated piezoelectric oscillator can be downsized, and furthermore, the same equipment as the conventional manufacturing process can be used, which greatly changes the manufacturing process. Since the production process can be established without reducing the size of the piezoelectric oscillator and sharing the manufacturing process equipment, it is possible to reduce manufacturing costs and share multiple products in the same production process. it can.

従来の半導体集積部品を構成する端子の一部をまとめることで、端子数を減らした事例を示した図である。It is the figure which showed the example which reduced the number of terminals by putting together a part of terminal which comprises the conventional semiconductor integrated component. 図１で示す端子数を減らした端子構成で、機能を確保する上で共有する機能を動作させるための切り換えの概念を示した図である。It is the figure which showed the concept of the switching for operating the function shared in ensuring the function by the terminal structure which reduced the number of terminals shown in FIG. 実際の製造工程で用いる切り換え手段を示す概念図である。It is a conceptual diagram which shows the switching means used in an actual manufacturing process. 従来品と本発明とでのタイミングチャートを比較したチャート図である。It is the chart which compared the timing chart with a conventional product and this invention.

Claims (2)

圧電素板に励振用電極を形成した圧電振動子と、発振回路を形成した半導体集積部品とから成る圧電発振器の調整方法において、
温度補償データを前記半導体集積部品のメモリに書込みまたは、読込み時に、前記半導体集積部品の調整用端子と接続する調整用信号をデータ通信時とデータ通信時以外の状態で機能を切り換えて調整することを特徴とする圧電発振器の調整方法。 In a method for adjusting a piezoelectric oscillator comprising a piezoelectric vibrator in which an excitation electrode is formed on a piezoelectric base plate and a semiconductor integrated part in which an oscillation circuit is formed,
When the temperature compensation data is written to or read from the memory of the semiconductor integrated component, the adjustment signal connected to the adjustment terminal of the semiconductor integrated component is adjusted by switching the function in a state other than during data communication and during data communication. A method for adjusting a piezoelectric oscillator characterized by the above. 請求項１記載の調整用信号の切り換えは、温度補償型圧電発振器の調整用信号であり、ＡＦＣとＳＣＬＫの組合せおよび／または、ＵＴＬとＤＩＯの組合せを組とする構成から成ることを特徴とする圧電発振器の調整方法。
The switching of the adjustment signal according to claim 1 is an adjustment signal for the temperature-compensated piezoelectric oscillator, and comprises a combination of a combination of AFC and SCLK and / or a combination of UTL and DIO. Adjustment method of piezoelectric oscillator.
JP2005193006A 2005-06-30 2005-06-30 Adjusting method of piezo oscillator Withdrawn JP2007013717A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008289139A (en) * 2007-04-20 2008-11-27 Panasonic Corp Ic for control of temperature-compensated crystal oscillator
JP2013059136A (en) * 2012-12-28 2013-03-28 Seiko Epson Corp Piezoelectric device, electronic apparatus, and input and output method of data of piezoelectric device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008289139A (en) * 2007-04-20 2008-11-27 Panasonic Corp Ic for control of temperature-compensated crystal oscillator
JP2013059136A (en) * 2012-12-28 2013-03-28 Seiko Epson Corp Piezoelectric device, electronic apparatus, and input and output method of data of piezoelectric device

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