JP2006500746A - 電気機械マイクロスイッチ装置 - Google Patents
電気機械マイクロスイッチ装置 Download PDFInfo
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- JP2006500746A JP2006500746A JP2004539309A JP2004539309A JP2006500746A JP 2006500746 A JP2006500746 A JP 2006500746A JP 2004539309 A JP2004539309 A JP 2004539309A JP 2004539309 A JP2004539309 A JP 2004539309A JP 2006500746 A JP2006500746 A JP 2006500746A
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- Prior art keywords
- inductive
- switch
- elements
- conductive
- inductive elements
- Prior art date
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- 230000001939 inductive effect Effects 0.000 claims abstract description 64
- 230000003993 interaction Effects 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 230000009471 action Effects 0.000 abstract description 3
- 230000005672 electromagnetic field Effects 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 11
- 238000004804 winding Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/005—Details of electromagnetic relays using micromechanics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H53/00—Relays using the dynamo-electric effect, i.e. relays in which contacts are opened or closed due to relative movement of current-carrying conductor and magnetic field caused by force of interaction between them
- H01H53/02—Electrodynamic relays, i.e. relays in which the interaction is between two current-carrying conductors
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (10)
- 電気的に直列に接続された少なくとも一対の誘導素子を含み、前記誘導素子は、それらに電流が流れると2つの磁場を発生させるようになっており、これら2つの磁場の間の相互作用によって、誘導素子の少なくとも一方が変位し、この少なくとも一方の誘導素子に結合された可動接点素子が変位して2つの位置の間で切り換わり、これら2つの位置のうち少なくとも一方にあるときに、少なくとも2つの導電性素子の間に電気接続を形成することを可能にする電気機械マイクロスイッチ装置。
- 前記2つの磁場は反対である請求項1に記載の電気機械マイクロスイッチ装置。
- 前記接点素子と前記誘導素子との間のキャパシタンスの値を較正させるために、前記誘導素子の上に絶縁体が設けられている請求項1または2の何れかに記載の電気機械マイクロスイッチ装置。
- 前記導電性素子は、2つの平行で別々の平面内に置き、互いに重ね合わせられている請求項1または3の何れかに記載の電気機械マイクロスイッチ装置。
- 前記導電性素子は、逆向きに巻いた電磁コイルである請求項1ないし4の何れかに記載の電気機械マイクロスイッチ装置。
- 第2の対の誘導素子が前記第1の対の誘導素子と接続され、この接続は第2の対の誘導素子のうちの1つと前記接点素子との接続によりなされている請求項1ないし5の何れかに記載の電気機械マイクロスイッチ装置。
- 前記装置はキャビティ内に配置され、このキャビティは、前記接点素子と接触するようになされた電極を備えている請求項1ないし6の何れかに記載の電気機械マイクロスイッチ装置。
- 請求項1ないし請求項7の何れかに記載の電気機械マイクロスイッチ装置を少なくとも1つ含む回路であって、前記回路の少なくとも機能部分の2つの動作モードの間で通信を発生させる回路。
- 少なくとも1つのアンテナ、少なくとも1つの増幅器、信号を処理するための処理手段を備えており、前記処理手段が少なくとも請求項8に記載された回路を備える遠距離通信電子装置。
- 2つの誘導素子の間デスクなくとも一方の位置を電気的に接続可能とする2つの位置の間で切換えることを志向する電気機械マイクロスイッチ装置を製造する方法であって、
少なくとも1つの第1の誘導素子を基板上に形成し、
前記誘導素子の上でアンダーエッチ可能な材料を堆積させ、
前記アンダーエッチ可能な材料を介して前記2つの誘導素子を接続するために導電性のリンクが配置されるように、このアンダーエッチ可能な材料の上に少なくとも1つの第2の誘電素子を形成し、
前記アンダーエッチ可能な材料の上で前記第2の誘導素子に対して結合される接点素子を形成し、
前記アンダーエッチ可能な材料をアンダーエッチするステップによる製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02292350 | 2002-09-25 | ||
PCT/IB2003/004045 WO2004030006A1 (en) | 2002-09-25 | 2003-09-15 | Micro-electromechanical switching device. |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006500746A true JP2006500746A (ja) | 2006-01-05 |
JP4294590B2 JP4294590B2 (ja) | 2009-07-15 |
Family
ID=32039222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004539309A Expired - Fee Related JP4294590B2 (ja) | 2002-09-25 | 2003-09-15 | 電気機械マイクロスイッチ装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7202763B2 (ja) |
EP (1) | EP1547111A1 (ja) |
JP (1) | JP4294590B2 (ja) |
AU (1) | AU2003260859A1 (ja) |
WO (1) | WO2004030006A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7064879B1 (en) * | 2000-04-07 | 2006-06-20 | Microsoft Corporation | Magnetically actuated microelectrochemical systems actuator |
JP2006179252A (ja) * | 2004-12-21 | 2006-07-06 | Fujitsu Component Ltd | スイッチデバイス |
JP2008535432A (ja) | 2005-04-08 | 2008-08-28 | エヌエックスピー ビー ヴィ | 低電圧memsオシレータ |
US7881693B2 (en) | 2006-10-17 | 2011-02-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR100911144B1 (ko) * | 2007-03-27 | 2009-08-06 | 삼성전자주식회사 | 2축구동 전자기 액추에이터 |
US7602267B1 (en) * | 2007-05-25 | 2009-10-13 | National Semiconductor Corporation | MEMS actuator and relay with horizontal actuation |
US7644490B1 (en) | 2007-05-25 | 2010-01-12 | National Semiconductor Corporation | Method of forming a microelectromechanical (MEMS) device |
US7598829B1 (en) | 2007-05-25 | 2009-10-06 | National Semiconductor Corporation | MEMS actuator and relay with vertical actuation |
US7902946B2 (en) * | 2008-07-11 | 2011-03-08 | National Semiconductor Corporation | MEMS relay with a flux path that is decoupled from an electrical path through the switch and a suspension structure that is independent of the core structure and a method of forming the same |
US8836454B2 (en) * | 2009-08-11 | 2014-09-16 | Telepath Networks, Inc. | Miniature magnetic switch structures |
US8432240B2 (en) * | 2010-07-16 | 2013-04-30 | Telepath Networks, Inc. | Miniature magnetic switch structures |
US8957747B2 (en) | 2010-10-27 | 2015-02-17 | Telepath Networks, Inc. | Multi integrated switching device structures |
EP2761640B1 (en) | 2011-09-30 | 2016-08-10 | Telepath Networks, Inc. | Multi integrated switching device structures |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6094116A (en) * | 1996-08-01 | 2000-07-25 | California Institute Of Technology | Micro-electromechanical relays |
US6124650A (en) * | 1999-10-15 | 2000-09-26 | Lucent Technologies Inc. | Non-volatile MEMS micro-relays using magnetic actuators |
US6229684B1 (en) * | 1999-12-15 | 2001-05-08 | Jds Uniphase Inc. | Variable capacitor and associated fabrication method |
US20020097118A1 (en) * | 2001-01-25 | 2002-07-25 | Siekkinen James W. | Current actuated switch |
US6657832B2 (en) * | 2001-04-26 | 2003-12-02 | Texas Instruments Incorporated | Mechanically assisted restoring force support for micromachined membranes |
US6646215B1 (en) * | 2001-06-29 | 2003-11-11 | Teravicin Technologies, Inc. | Device adapted to pull a cantilever away from a contact structure |
US6657525B1 (en) * | 2002-05-31 | 2003-12-02 | Northrop Grumman Corporation | Microelectromechanical RF switch |
-
2003
- 2003-09-15 JP JP2004539309A patent/JP4294590B2/ja not_active Expired - Fee Related
- 2003-09-15 AU AU2003260859A patent/AU2003260859A1/en not_active Abandoned
- 2003-09-15 WO PCT/IB2003/004045 patent/WO2004030006A1/en active Application Filing
- 2003-09-15 US US10/528,623 patent/US7202763B2/en not_active Expired - Lifetime
- 2003-09-15 EP EP03798290A patent/EP1547111A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US7202763B2 (en) | 2007-04-10 |
US20050270127A1 (en) | 2005-12-08 |
EP1547111A1 (en) | 2005-06-29 |
WO2004030006A1 (en) | 2004-04-08 |
AU2003260859A1 (en) | 2004-04-19 |
JP4294590B2 (ja) | 2009-07-15 |
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