JP2006346800A - Vitrified bond grindstone and method of producing the same - Google Patents
Vitrified bond grindstone and method of producing the same Download PDFInfo
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- JP2006346800A JP2006346800A JP2005174979A JP2005174979A JP2006346800A JP 2006346800 A JP2006346800 A JP 2006346800A JP 2005174979 A JP2005174979 A JP 2005174979A JP 2005174979 A JP2005174979 A JP 2005174979A JP 2006346800 A JP2006346800 A JP 2006346800A
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- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 48
- 239000006061 abrasive grain Substances 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 239000011148 porous material Substances 0.000 claims abstract description 15
- 238000005245 sintering Methods 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 238000004898 kneading Methods 0.000 claims abstract description 6
- 230000015572 biosynthetic process Effects 0.000 claims abstract 2
- 238000000227 grinding Methods 0.000 claims description 29
- 239000012530 fluid Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 9
- 238000007711 solidification Methods 0.000 claims description 9
- 230000008023 solidification Effects 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 7
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 238000005470 impregnation Methods 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 5
- 239000010432 diamond Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 230000009969 flowable effect Effects 0.000 abstract description 5
- 230000000593 degrading effect Effects 0.000 abstract 1
- 238000007688 edging Methods 0.000 abstract 1
- 239000002075 main ingredient Substances 0.000 abstract 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
- B24D3/18—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
- B24D7/066—Grinding blocks; their mountings or supports
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
- C09K3/1418—Abrasive particles per se obtained by division of a mass agglomerated by sintering
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
本発明は、自生発刃作用が良好なビトリファイドボンド砥石及びその製造方法に関するものである。 The present invention relates to a vitrified bond grindstone with a good self-generated blade action and a method for producing the same.
IC、LSI等のデバイスが表面に複数形成されたウェーハは、裏面が研削されて所定の厚さに形成された後に、ダイシング装置等によって個々のデバイスに分割され、各種電子機器に利用されている。 A wafer on which a plurality of devices such as IC and LSI are formed on the front surface is ground into a predetermined thickness by grinding the back surface, and then divided into individual devices by a dicing apparatus or the like and used for various electronic devices. .
研削の対象となるウェーハは、シリコン、窒化珪素、ガリウム砒素、サファイア、リチウムタンタレート、炭化珪素等で形成されている。一方、研削砥石には、ビトリファイドボンド砥石、レジンボンド砥石、メタルボンド砥石等があり、これらの砥石の中からウェーハの材料に適した砥石が選択されて研削に使用される。窒化珪素、サファイア、炭化珪素は硬度が高いため、これらの材料によって形成されるウェーハを研削する際には、ビトリファイドボンド砥石やメタルボンド砥石等の、ダイヤモンド砥粒が強固に保持された構成の砥石が用いられる(例えば特許文献1参照)。 A wafer to be ground is formed of silicon, silicon nitride, gallium arsenide, sapphire, lithium tantalate, silicon carbide, or the like. On the other hand, there are vitrified bond grindstones, resin bond grindstones, metal bond grindstones, and the like as grinding grindstones. A grindstone suitable for the material of the wafer is selected from these grindstones and used for grinding. Since silicon nitride, sapphire, and silicon carbide have high hardness, when grinding a wafer formed of these materials, a grindstone with a structure in which diamond abrasive grains are firmly held, such as vitrified bond grindstone and metal bond grindstone Is used (see, for example, Patent Document 1).
しかし、ビトリファイドボンドやメタルボンドによって砥粒が強固に保持された構成の砥石には自生発刃作用が生じにくいことから、比較的短時間で目詰まりを起こし、頻繁にドレッシングを行う必要があるため、生産性が低いという問題がある。 However, since the self-generated blade action is unlikely to occur on a grindstone with a structure in which abrasive grains are firmly held by vitrified bond or metal bond, clogging occurs in a relatively short time and frequent dressing needs to be performed. There is a problem that productivity is low.
また、自生発刃作用が生じにくいことに起因して、被研削物の研削面に面焼けやムシレといった現象が生じ、被研削物の品質を低下させるという問題もある。 In addition, due to the fact that the self-generated blade action is less likely to occur, there is a problem that phenomena such as surface burn and stuffiness occur on the ground surface of the workpiece and the quality of the workpiece is reduced.
そこで、本発明が解決しようとする課題は、難削材であっても頻繁にドレッシングすることなく効率良く研削し、被研削物の品質を低下させないようにすることである。 Therefore, the problem to be solved by the present invention is to efficiently grind even difficult-to-cut materials without frequent dressing so as not to deteriorate the quality of the object to be ground.
第一の発明は、気孔を有するビトリファイドボンド砥石であって、少なくともSiO2を主成分とするビトリファイドボンド材と有機物ボンド材と砥粒と液体とを混練した流動性砥粒を樹脂で形成されたスポンジ部材に含浸させ、有機物ボンド材とスポンジ部材とを酸化させると共に砥粒を該ビトリファイドボンド材で焼結したことを特徴とする。 The first invention is a vitrified bond grindstone having pores, wherein fluidized abrasive grains obtained by kneading a vitrified bond material mainly composed of at least SiO 2 , an organic bond material, abrasive grains, and a liquid are formed of a resin. A sponge member is impregnated to oxidize the organic bond material and the sponge member and to sinter the abrasive grains with the vitrified bond material.
第二の発明は、気孔を有するビトリファイドボンド砥石の製造方法であって、少なくともSiO2を主成分とするビトリファイドボンド材と有機物ボンド材と砥粒と液体とを混練して流動性砥粒を形成し、気孔を有する樹脂で形成されたスポンジ部材に流動性砥粒を含浸させて含浸スポンジ体を構成する含浸スポンジ体形成工程と、含浸スポンジ体を構成する液体を蒸発させると共に有機物ボンド材を固化させる固化工程と、固化工程後の含浸スポンジ体を焼結して有機物ボンド材とスポンジ部材とを酸化させると共にビトリファイドボンド材によって砥粒を焼結させて気孔を有する焼結体を形成する焼結工程とから構成されることを特徴とする。 A second invention is a method for producing a vitrified bond grindstone having pores, wherein a flowable abrasive is formed by kneading at least a SiO 2 based vitrified bond material, an organic bond material, an abrasive and a liquid. And impregnating sponge body formed by impregnating fluid abrasive grains into a sponge member made of resin having pores, and forming an impregnated sponge body, and evaporating the liquid constituting the impregnated sponge body and solidifying the organic bond material Sintering to form a sintered body having pores by sintering the impregnated sponge body after the solidifying process, oxidizing the organic bond material and the sponge member, and sintering the abrasive grains by vitrified bond material It is characterized by comprising a process.
含浸スポンジ体形成工程において、砥粒は粒径2μm以下のダイヤモンド砥粒にグリーンカーボランダム、ホワイトアランダムのフィラーが混入されて構成されることが好ましい。また、含浸スポンジ体形成工程において、液体は重量比55%の水と重量比10%のアルコールとで構成され、有機物ボンド材は重量比5%のアクリル系ボンド材であることが好ましい。 In the impregnation sponge body forming step, the abrasive grains are preferably constituted by mixing diamond abrasive grains having a particle size of 2 μm or less with green carborundum or white alundum filler. In the impregnated sponge body forming step, the liquid is preferably composed of water having a weight ratio of 55% and alcohol having a weight ratio of 10%, and the organic bond material is preferably an acrylic bond material having a weight ratio of 5%.
固化工程においては、含浸スポンジ体を50°Cで2時間加熱して液体を蒸発させ、有機物ボンド材を120°Cで2時間加熱して焼結させることが好ましい。 In the solidification step, the impregnated sponge body is preferably heated at 50 ° C. for 2 hours to evaporate the liquid, and the organic bond material is preferably heated at 120 ° C. for 2 hours to be sintered.
焼結工程においては、固化工程後の含浸スポンジ体を400°Cで1時間焼結して有機物ボンド材とスポンジ部材とを酸化させ、700°Cで4時間焼結して焼結体を形成することが好ましい。 In the sintering process, the impregnated sponge body after the solidification process is sintered at 400 ° C. for 1 hour to oxidize the organic bond material and the sponge member, and sintered at 700 ° C. for 4 hours to form a sintered body. It is preferable to do.
焼結工程後は、焼結体を切削ブレードで切削して整形し、研削ホイールに固着される砥石とすることがある。 After the sintering step, the sintered body may be cut and shaped with a cutting blade to form a grindstone that is fixed to the grinding wheel.
本発明では、スポンジ部材に流動性砥粒を含浸させて焼結することにより、内部に気孔を有するビトリファイドボンド砥石が構成されるため、気孔により砥粒が脱落しやすくなり、自生発刃作用が生じやすい。したがって、目詰まりを起こしにくく、ドレッシングを頻繁に行う必要がないため、難削材でも効率良く研削することができる。また、自生発刃作用が良好であることから、被研削物の研削面に面焼けやムシレが生じず、被研削物の品質を向上させることができる。 In the present invention, a vitrified bond grindstone having pores is formed by impregnating the sponge member with fluid abrasive grains and sintering, so that the abrasive grains are easily dropped by the pores, and the self-generated blade action is achieved. Prone to occur. Therefore, clogging is unlikely to occur, and it is not necessary to perform dressing frequently, so even difficult-to-cut materials can be ground efficiently. In addition, since the self-generated blade action is good, the surface of the object to be ground is not burnt or blurred, and the quality of the object to be ground can be improved.
最初に、SiO2を主成分とするビトリファイドボンド材と、アクリル樹脂等からなる有機物ボンド材と、砥粒と、液体とを混練して流動性砥粒を形成する。砥粒としてはダイヤモンド砥粒が代表的なものとして挙げられる。グリーンカーボランダム(緑色炭化珪素質)やホワイトアランダム(白色アルミナ質)等のフィラーを混入させてもよい。液体としては水やアルコールがある。 First, a fluidized abrasive grain is formed by kneading a vitrified bond material mainly composed of SiO 2 , an organic bond material made of an acrylic resin or the like, abrasive grains, and a liquid. As an abrasive grain, a diamond abrasive grain is mentioned as a typical thing. A filler such as green carborundum (green silicon carbide) or white alundum (white alumina) may be mixed. Liquids include water and alcohol.
そして、図1に示すようにウレタン等の樹脂で形成され気孔を有するスポンジ部材1に上記流動性砥粒を含浸させて含浸スポンジ体を形成する(含浸スポンジ体形成工程)。例えば、図2に示すように、流動性砥粒2を容器3に貯めておき、その流動性砥粒2にスポンジ部材1を浸漬することによって、スポンジ部材1に流動性砥粒を含浸させる。
Then, as shown in FIG. 1, an impregnated sponge body is formed by impregnating the
次に、流動性砥粒2を含浸したスポンジ部材1を構成する液体を加熱により蒸発させ、含浸スポンジ体に含まれる有機物ボンド材を固化させる(固化工程)。そして更に、固化工程によって液体が蒸発し有機物ボンド材が固化した含浸スポンジ体を焼結し、有機物ボンド材とスポンジ部材とを酸化させると共に、ビトリファイドボンド材によって砥粒を焼結させる。そうすると、気孔を有する焼結体が形成され、この焼結体がビトリファイドボンド砥石となる。
Next, the liquid constituting the
例えば図3に示すように、形成されたビトリファイドボンド砥石4は、高速回転する切削ブレード5を切削ライン6に沿って縦横に切り込ませて個片化することにより整形され、複数のセグメント状ビトリファイドボンド砥石7となる。
For example, as shown in FIG. 3, the formed vitrified bond grindstone 4 is shaped by cutting a
そして、複数のセグメント状ビトリファイドボンド砥石7は、例えば図4に示す研削ホイール814の下面に複数固着される。そして、この研削ホイール814は、例えば図5に示す研削装置8に用いられる。
A plurality of segmented
この研削装置8は、被研削物を保持するチャックテーブル80と、チャックテーブル80に保持された被研削物に対して研削加工を施す研削手段81とを備えている。研削手段81は、ハウジング810によって回転可能に支持され垂直方向の軸心を有するスピンドル811の上端にモータ812が連結されると共に、スピンドル811の下端に設けられたホイールマウント813に研削ホイール814が装着された構成となっている。研削ホイール814には、セグメント状ビトリファイドボンド砥石7が複数固着されており、モータ812の回転によって研削ホイール814も回転する構成となっている。
The grinding apparatus 8 includes a chuck table 80 that holds an object to be ground, and a
ハウジング810は、昇降板820に連結された支持部821によって支持されており、昇降板820は、垂直方向に配設されたガイドレール822に摺接すると共に、内部のナット(図示せず)が垂直方向に配設されたボールネジ823に螺合している。ボールネジ823の一端にはパルスモータ824が連結されており、パルスモータ824の回動によってボールネジ823が回動するのに伴い昇降板820がガイドレール822にガイドされて昇降し、研削手段81も昇降する構成となっている。
The
図示の例のように表面にデバイス保護用の保護テープTが貼着されたウェーハWの裏面を研削する場合は、保護テープTが貼着された表面側がチャックテーブル80に保持される。そして、チャックテーブル80が水平方向に移動して研削手段81の直下に位置付けられ、チャックテーブル80が回転すると共に、研削ホイール814が回転しながら研削手段81が下降することにより、回転するセグメント状ビトリファイドボンド砥石7がウェーハWの裏面に接触して当該裏面が研削される。
When grinding the back surface of the wafer W having the protective tape T for protecting the device attached to the surface as in the illustrated example, the front surface side to which the protective tape T is attached is held by the chuck table 80. Then, the chuck table 80 moves in the horizontal direction and is positioned immediately below the grinding means 81. The chuck table 80 rotates, and the grinding means 81 descends while the
セグメント状ビトリファイドボンド砥石7は、スポンジ部材に流動性砥粒を含浸させ焼結して形成されているため、内部には多数の気孔が形成されている。したがって、砥粒が脱落しやすく、自生発刃作用が良好であるため、ウェーハWがサファイアや炭化珪素等の難削材により形成されている場合でも、効率良く研削することができる。また、自生発刃作用が良好であることから、ウェーハの被研削面に面焼けやムシレが生じず、ウェーハの品質を向上させることができる。
Since the segmented vitrified
なお、チャックテーブル80を研削してチャックテーブル80の上面とセグメント状ビトリファイドボンド砥石7の下面(研削面)とを一致させるセルフグラインドの場合においては、チャックテーブル80が炭化珪素等の難削材で形成されていても、チャックテーブル80を効率良く研削することができる。
In the case of self-grinding in which the chuck table 80 is ground so that the upper surface of the chuck table 80 and the lower surface (grinding surface) of the segmented vitrified
ビトリファイドボンド砥石の製造方法の例を以下に示す。まず、含浸スポンジ体形成工程においては、それぞれ体積比で、粒径が2μm以下のダイヤモンド砥粒を35%、グリーンカーボランダム、ホワイトアランダムのフィラーを5%、SiO2を主成分とするビトリファイドボンド材を60%の割合で混練し、重量比30%の粉末混練物を生成する。そして、重量比5%のアクリル系ボンド材(有機物ボンド材)、重量比55%の水、重量比10%のアルコールを混練し、重量比100%の流動性砥粒とし、この流動性砥粒をスポンジ部材に含浸させて含浸スポンジ体とする。 The example of the manufacturing method of a vitrified bond grindstone is shown below. First, in the impregnated sponge body forming step, a vitrified bond containing 35% of diamond abrasive grains each having a volume ratio of 2 μm or less, 5% of green carborundum and white alundum filler, and SiO 2 as a main component. The material is kneaded at a ratio of 60% to produce a powder kneaded product with a weight ratio of 30%. Then, an acrylic bond material (organic bond material) having a weight ratio of 5%, water having a weight ratio of 55%, and alcohol having a weight ratio of 10% are kneaded to obtain fluid abrasive grains having a weight ratio of 100%. Is impregnated into a sponge member to obtain an impregnated sponge body.
次に、固化工程では、含浸スポンジ体を50°Cで2時間加熱することにより、水及びアルコールの水分を蒸発させる。そして、120°Cで1時間加熱することにより、アクリル系ボンド材を固化させる。 Next, in the solidifying step, the impregnated sponge body is heated at 50 ° C. for 2 hours to evaporate water and alcohol. Then, the acrylic bond material is solidified by heating at 120 ° C. for 1 hour.
焼結工程では、固化工程後の含浸スポンジ体を400°Cで1時間加熱して有機物ボンド材とスポンジ部材とを酸化させる。更に、700°Cで4時間焼結して焼結体を形成する。この焼結体がビトリファイドボンド砥石となる。 In the sintering process, the impregnated sponge body after the solidification process is heated at 400 ° C. for 1 hour to oxidize the organic bond material and the sponge member. Furthermore, it sinters at 700 degreeC for 4 hours, and forms a sintered compact. This sintered body becomes a vitrified bond grindstone.
1:スポンジ部材
2:流動性砥粒
3:容器
4:ビトリファイドボンド砥石
5:切削ブレード
6:切削ライン
7:セグメント状ビトリファイドボンド砥石
8:研削装置
80:チャックテーブル
81:研削手段
810:ハウジング 811:スピンドル 812:モータ
813:ホイールマウント 814:研削ホイール
820:昇降板 821:支持部 822:ガイドレール 823:ボールネジ
824:パルスモータ
1: Sponge member 2: Flowable abrasive grain 3: Container 4: Vitrified bond grindstone 5: Cutting blade 6: Cutting line 7: Segmented vitrified bond grindstone 8: Grinding device 80: Chuck table 81: Grinding means 810:
Claims (7)
少なくともSiO2を主成分とするビトリファイドボンド材と有機物ボンド材と砥粒と液体とを混練した流動性砥粒を樹脂で形成されたスポンジ部材に含浸させ、該有機物ボンド材と該スポンジ部材とを酸化させると共に該砥粒を該ビトリファイドボンド材で焼結したビトリファイドボンド砥石。 A vitrified bond grindstone having pores,
A sponge member formed of a resin is impregnated with a fluid abrasive particle obtained by kneading at least a SiO 2 -based vitrified bond material, an organic bond material, abrasive particles, and a liquid, and the organic bond material and the sponge member are impregnated. A vitrified bond grindstone in which the abrasive grains are oxidized and sintered with the vitrified bond material.
少なくともSiO2を主成分とするビトリファイドボンド材と有機物ボンド材と砥粒と液体とを混練して流動性砥粒を形成し、気孔を有する樹脂で形成されたスポンジ部材に該流動性砥粒を含浸させて含浸スポンジ体を構成する含浸スポンジ体形成工程と、
該含浸スポンジ体を構成する液体を蒸発させると共に該有機物ボンド材を固化させる固化工程と、
該固化工程後の含浸スポンジ体を焼結して該有機物ボンド材と該スポンジ部材とを酸化させると共に該ビトリファイドボンド材によって該砥粒を焼結させて気孔を有する焼結体を形成する焼結工程と
から構成されるビトリファイドボンド砥石の製造方法。 A method for producing a vitrified bond grindstone having pores,
A fluidized abrasive is formed by kneading a vitrified bond material containing at least SiO 2 as a main component, an organic bond material, an abrasive and a liquid, and the fluid abrasive is applied to a sponge member formed of a resin having pores. An impregnation sponge body forming step of impregnating and constituting an impregnation sponge body; and
A solidification step of evaporating the liquid constituting the impregnated sponge body and solidifying the organic bond material;
Sintering the impregnated sponge body after the solidification step to oxidize the organic bond material and the sponge member and to sinter the abrasive grains with the vitrified bond material to form a sintered body having pores The manufacturing method of the vitrified bond grindstone comprised from a process.
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CN103600306A (en) * | 2013-11-21 | 2014-02-26 | 江苏苏北砂轮厂有限公司 | Ceramic grinding roll grinding wheel |
CN104149041A (en) * | 2014-07-30 | 2014-11-19 | 浙江中晶科技股份有限公司 | Method for manufacturing ceramic grinding wheel for silicon rod polishing by means of organic matter sponge in shaping mode |
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CN108381409B (en) * | 2018-04-26 | 2020-03-10 | 郑州磨料磨具磨削研究所有限公司 | Superhard resin grinding wheel for thinning gallium arsenide wafer and preparation method thereof |
CN112059930B (en) * | 2020-09-11 | 2021-11-26 | 新乡市荣锋材料科技有限公司 | Grinding block for grinding disc for alloy material processing, preparation method of grinding block and grinding disc |
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KR101231110B1 (en) | 2013-02-07 |
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