JP2006341858A - Ic tag attaching method for packaged product - Google Patents
Ic tag attaching method for packaged product Download PDFInfo
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- JP2006341858A JP2006341858A JP2005167116A JP2005167116A JP2006341858A JP 2006341858 A JP2006341858 A JP 2006341858A JP 2005167116 A JP2005167116 A JP 2005167116A JP 2005167116 A JP2005167116 A JP 2005167116A JP 2006341858 A JP2006341858 A JP 2006341858A
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- tag
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- resin sheet
- transparent resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
- B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
- B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
- B65D75/366—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed and forming one compartment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2203/00—Decoration means, markings, information elements, contents indicators
- B65D2203/10—Transponders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2575/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
- B65D2575/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by association or interconnecting two or more sheets or blanks
- B65D2575/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D2575/36—One sheet or blank being recessed and the other formed or relatively stiff flat sheet material, e.g. blister packages
- B65D2575/361—Details
- B65D2575/362—Details with special means for gaining access to the contents
- B65D2575/367—Details with special means for gaining access to the contents through a preformed opening in the flat sheet, e.g. the opening being defined by weakened lines
Abstract
Description
本発明は、商品を包装した包装容器にICタグを装着して商品の管理、販売の管理等に供する包装商品に対するICタグの装着方法に関するものである。 The present invention relates to a method of attaching an IC tag to a packaged product for use in product management, sales management, etc. by mounting an IC tag on a packaging container in which the product is packaged.
比較的小型の商品を包装する包装形態としてブリスターパックが広く用いられている。ブリスターパックは吊り下げ陳列するのに適しており、陳列棚の奥行き方向に設けられた棒状のフックに複数個を吊り下げて陳列することにより多数の品種を立体的に配置することができ、商品を透明カバーから視認できる効果とコマーシャルスペースを広く展開できる効果とが得られる。 Blister packs are widely used as packaging forms for packaging relatively small products. Blister packs are suitable for hanging display, and multiple types can be arranged three-dimensionally by suspending and displaying a plurality of rod-like hooks provided in the depth direction of the display shelf. Can be seen from the transparent cover, and the commercial space can be expanded widely.
しかし、ブリスターパックは包装を分解して商品を取り出すことが容易であるため、使用済みのブリスターパックに模倣品を包装し、あたかも純正商品であるかに装って販売する事例が多発している。模倣品は純正品と外観はそっくりに作られているので、包装体の表面に記載されている説明文や記号などの間違いから模倣品であると判明することが多いが、包装体が本物であると模倣品と識別することは極めて困難である。消費者が模倣品によって痛手を蒙ることは勿論であるが、模倣品の数が多くなるほどに商品の製造者が受ける損失は大きく、製造者にとって模倣品は極めて深刻な問題となっている。 However, since blister packs are easy to disassemble and take out products, there are many cases where counterfeit products are packaged in used blister packs and sold as if they were genuine products. The counterfeit product looks exactly the same as the genuine product, so it is often found that it is a counterfeit product from mistakes such as explanations and symbols on the surface of the package, but the package is genuine. It is extremely difficult to distinguish it from counterfeits. Of course, consumers suffer from counterfeit products, but as the number of counterfeit products increases, the loss of product manufacturers increases, and counterfeit products are a very serious problem for manufacturers.
そこで、商品の包装が開梱されたことが明らかになる対策を講じることが必要となり、商品やその包装の一部が所定位置から剥がされた痕跡が残るようにした改ざん防止粘着ラベルが開梱識別の一手段として知られている(例えば、特許文献1参照)。 Therefore, it is necessary to take measures to make it clear that the product packaging has been unpacked, and an anti-tamper adhesive label that leaves a trace of the product and a part of the packaging peeled off from the specified position remains unpacked. It is known as a means for identification (see, for example, Patent Document 1).
また、商品又はその包装体にICタグを装着して純正品と模倣品とを識別する仕組みが構成され、ICタグが取り外されると、その機能が消滅する方法が提案されている。例えば、被装着物に貼着したICタグを剥がすと、ICタグを構成するICチップとアンテナとの接続が破壊されるものが知られている(特許文献2参照)。
ブリスターパックは、紙製又は樹脂製の台紙と、透明樹脂シートに商品を収容できる容積に凹部を形成した透明カバーとにより構成され、凹部に商品を収容して透明カバーの周辺部を台紙に接合して包装商品に仕上られる。台紙と透明カバーとの間の接合手段は、嵌合構造やステープル止め、接着や溶着などが適用されるが、消費者が容易に商品を取り出すことができるように台紙と透明カバーとの間の分離が容易になされる必要がある。このような構造が商品を取り出した後のブリスターパックそのものが悪用される一因ともなっている。 A blister pack is composed of a paper or resin mount and a transparent cover with a recess formed in a volume that can store the product in a transparent resin sheet. The product is accommodated in the recess and the periphery of the transparent cover is bonded to the mount. And finished in a packaged product. For the joining means between the mount and the transparent cover, a fitting structure, stapling, adhesion, welding, etc. are applied, but the product between the mount and the transparent cover can be easily taken out by the consumer. Separation needs to be done easily. Such a structure also contributes to the abuse of the blister pack itself after the product is taken out.
このブリスターパックに従来技術に係る改ざん防止粘着ラベルや剥離分解ICタグを適用することは難しい。透明カバーを台紙から一部を剥がして商品を取り出し、透明カバーを元に戻すとぴったり同一位置に貼り合わすことができるので、改ざん防止粘着ラベルでは剥離したことの痕跡が明らかにし難い。また、剥離分解ICタグの場合では、ICタグそのものを貼着位置から剥がした場合に分解が生じるので、透明カバーと台紙との接合構造であるブリスターパックに適用しがたい。 It is difficult to apply a falsification-preventing adhesive label and a peel-disassembly IC tag according to the prior art to this blister pack. When the transparent cover is partly peeled off from the mount and the product is taken out and the transparent cover is returned to its original position, it can be attached at exactly the same position. Therefore, the tamper-proof adhesive label makes it difficult to reveal the trace of peeling. Further, in the case of the peel-disassembly IC tag, since the decomposition occurs when the IC tag itself is peeled off from the sticking position, it is difficult to apply to a blister pack having a joint structure between a transparent cover and a mount.
本発明が目的とするところは、ブリスターパックの透明カバーと台紙とを分離させたときICタグの機能が停止するようにして模倣品や偽造品を防止する包装商品に対するICタグの装着方法を提供することにある。 An object of the present invention is to provide a method of attaching an IC tag to a packaged product that prevents counterfeit or counterfeit products by stopping the function of the IC tag when the transparent cover and mount of the blister pack are separated. There is to do.
上記目的を達成するための本願第1発明は、台紙上に配した商品を透明樹脂シートに形成した凹部内に収容して透明樹脂シートの周辺部を前記台紙に接合してなるブリスターパックに、ICチップとそれに接続ラインで接続されたアンテナとを備えたICタグを装着する包装商品に対するICタグの装着方法であって、前記透明樹脂シートと前記台紙との接合面に、前記ICタグのアンテナ又は接続ライン部分を配してなることを特徴とする。 The first invention of the present application for achieving the above object is a blister pack in which a product arranged on a mount is accommodated in a recess formed in a transparent resin sheet and a peripheral portion of the transparent resin sheet is joined to the mount. An IC tag mounting method for a packaged product on which an IC tag including an IC chip and an antenna connected to the IC chip by a connection line is mounted, wherein the antenna of the IC tag is attached to a joint surface between the transparent resin sheet and the mount. Alternatively, a connection line portion is provided.
上記装着方法によれば、透明樹脂シートと台紙との接合面にICタグのアンテナ部分又は接続ライン部分を配しているので、透明樹脂シートを台紙から剥がすと、薄膜状に形成されているアンテナ又は接続ラインは破断し、ICタグの機能が停止するので、ICタグの動作を確認することにより、ブリスターパックが開梱されたものか否かを判定することができる。 According to the mounting method, since the antenna portion or the connection line portion of the IC tag is arranged on the joint surface between the transparent resin sheet and the mount, the antenna formed in a thin film shape when the transparent resin sheet is peeled off from the mount. Alternatively, since the connection line is broken and the function of the IC tag is stopped, it is possible to determine whether or not the blister pack has been opened by checking the operation of the IC tag.
また、本願第2発明は、台紙上に配した商品を透明樹脂シートに形成した凹部内に収容して透明樹脂シートの周辺部を前記台紙に接合し、台紙の前記凹部と対応する部位に商品取り出し用のミシン目が形成されてなるブリスターパックに、ICチップとそれに接続ラインで接続されたアンテナとを備えたICタグを装着する包装商品に対するICタグの装着方法であって、前記台紙に形成されたミシン目を横断するように前記ICタグのアンテナ又は接続ライン部分を配してなることを特徴とする。 In the second invention of the present application, the product arranged on the mount is accommodated in a recess formed in the transparent resin sheet, the peripheral portion of the transparent resin sheet is joined to the mount, and the product is placed at a portion corresponding to the recess of the mount. A method of attaching an IC tag to a packaged product in which an IC tag having an IC chip and an antenna connected to the blister pack formed with a perforation for removal is attached to the blister pack, formed on the mount The antenna or connection line portion of the IC tag is arranged so as to cross the perforated line.
上記装着方法によれば、ミシン目から台紙の一部を破断して商品を取り出すと、ミシン目を横断しているアンテナ又は接続ラインも破断し、ICタグの機能が停止するので、ICタグの動作を確認することにより、ブリスターパックが開梱されたものか否かを判定することができる。 According to the above mounting method, when part of the mount is broken from the perforation and the product is taken out, the antenna or connection line crossing the perforation is also broken and the function of the IC tag is stopped. By confirming the operation, it can be determined whether or not the blister pack is unpacked.
また、本願第3発明は、台紙上に配した商品を透明樹脂シートに形成した凹部内に収容して透明樹脂シートの周辺部を前記台紙に接合し、台紙の前記凹部と対応する部位に商品取り出し用のミシン目が形成されてなるブリスターパックに、ICチップとそれに接続ラインで接続されたアンテナとを備えたICタグを装着する包装商品に対するICタグの装着方法であって、前記透明樹脂シートと前記台紙との接合面に前記アンテナの一部を配すると共に、台紙に形成されたミシン目を横断するようにアンテナ又は接続ライン部分を配してなることを特徴とする。 In the third invention of the present application, the product arranged on the mount is accommodated in a recess formed in the transparent resin sheet, the periphery of the transparent resin sheet is joined to the mount, and the product is placed at a position corresponding to the recess of the mount. A method of attaching an IC tag to a packaged product in which an IC tag having an IC chip and an antenna connected to a blister pack formed with a perforation for removal is attached to the blister pack, the transparent resin sheet A part of the antenna is arranged on the joint surface between the antenna and the mount, and an antenna or a connection line portion is arranged so as to cross the perforation formed on the mount.
上記装着方法によれば、ミシン目を破断させて商品を取り出した場合であっても、透明樹脂シートを台紙から剥がして商品を取り出した場合であっても、アンテナ又は接続ラインが破断するので、いずれの方法で商品を取り出してもICタグの機能が停止する。従って、ICタグの動作を確認することにより、ブリスターパックが開梱されたものか否かを判定することができる。 According to the above mounting method, even when the product is taken out by breaking the perforation, even when the product is taken out by removing the transparent resin sheet from the mount, the antenna or the connection line breaks, The function of the IC tag stops even if the product is taken out by any method. Therefore, by confirming the operation of the IC tag, it can be determined whether or not the blister pack is unpacked.
上記各装着方法において、台紙が透明シートと同質のシート材で形成され、台紙と透明樹脂シートとが周縁部で嵌合接着されたクラムシェル構造に構成されたブリスターパックである場合、透明樹脂シートと台紙とは嵌合構造及び溶着によって接合されるので、接合部分を剥がすと、薄膜形成されたアンテナ又は接続ラインに破断あるいは損傷が生じてICタグの機能を停止させることができる。 In each of the above mounting methods, when the mount is a blister pack formed of a clam shell structure in which the mount is formed of the same sheet material as the transparent sheet, and the mount and the transparent resin sheet are fitted and bonded at the periphery, the transparent resin sheet Since the board and the mount are bonded together by a fitting structure and welding, if the bonded portion is peeled off, the antenna or connection line formed with a thin film is broken or damaged, and the function of the IC tag can be stopped.
本発明によれば、ブリスターパックから商品を取り出すと、装着されているICタグの機能が停止するので、正規商品を取り出した後のブリスターパックに不正に製造された模倣商品を収納してもICタグは機能せず、パッケージが正規のものであっても惑わされることなく模倣商品と判別することが可能となる。 According to the present invention, when the product is taken out from the blister pack, the function of the mounted IC tag is stopped. Therefore, even if the improperly manufactured product is stored in the blister pack after the regular product is taken out, The tag does not function, and even if the package is genuine, it can be determined as a counterfeit product without being confused.
図1は、本発明の第1の実施形態に係るブリスターパックAを示すもので、透明樹脂シート2に形成した凹部2aに商品10を収容し、透明樹脂シート2の周辺部を台紙3に接合し、台紙3に形成した吊り下げ穴3aを陳列棚のフックに通して吊り下げ陳列できるように構成されている。
FIG. 1 shows a blister pack A according to a first embodiment of the present invention, in which a
前記台紙3上には、図2に示すようにシート状に形成されたICタグ1が貼着され、商品管理、在庫管理等に必要な情報が記録されている。ICタグ1は、透明フィルム上にスクリーン印刷や蒸着等の手段によってコイル状にアンテナ6が形成され、アンテナ6の両端から延出形成された接続ライン8にICチップ7が接続されている。ICチップ7はメモリや制御回路等を集積回路として構成したもので、リーダ/ライタから出力される電波をアンテナ6で受信することにより誘起する微小電力により動作し、メモリに記録された情報を応答信号としてアンテナ6からリーダ/ライタに向けて送信するパッシブタグに構成されている。
On the
上記ICタグ1は、その透明フィルム部分が台紙3の表面全体を被覆する被覆層を兼ねるものであっても、図示するように透明樹脂シート2の外形寸法と略同等寸法であってもよいが、アンテナ6又はICチップ7とアンテナ6との接続ライン8が透明樹脂シート2を台紙3に接合する接合部位に位置するように配置される。
The
ブリスターパックAによって包装された商品10は、透明樹脂シート2を台紙3から剥がすことにより取り出すことができるので、ブリスターパックAに損傷を与えないように透明樹脂シート2を剥がして商品10を取り出し、偽物商品を収納して包装状態を元の状態にした模造品が出回ることが多発している。しかし、本構成では、透明樹脂シート2と台紙3との接合を剥がすと、接合部位に位置するアンテナ6又は接続ライン8が破断するのでICタグ1の機能は停止するので、ブリスターパックAが一度開梱されたことが判定できる。
Since the
包装された商品は外観が同じであり、しかも包装体が正規のものであると、目視だけでは模倣品などの不正なものであると判断できない。本構成のように開梱によりICタグ1の機能が停止するように構成されていると、リーダ/ライタからブリスターパックAにアクセスすることにより、外観が正規品であっても実体が模倣品などの不正な商品であることを見破ることができる。
If the packaged products have the same appearance and the package is a regular one, it cannot be determined that the package is an illegal product such as a counterfeit product by visual inspection alone. If the function of the
図3(a)は、本発明の第2の実施形態に係るブリスターパックBの表面側の平面図を示すもので、商品10を取り出すことを容易にするために、図3(b)に示す、台紙3の裏側にミシン目9が設けられている。その他の構成は先のブリスターパックAと同一として、その説明は省略する。
FIG. 3A is a plan view of the surface side of the blister pack B according to the second embodiment of the present invention, and is shown in FIG. A
このようにミシン目9が設けられているブリスターパックBの場合では、ミシン目9を横断するようにアンテナ6又は接続ライン8の部位が位置するようにICタグ1を貼着すると、商品10を取り出すためにミシン目9を破断させると、アンテナ6又は接続ライン8もミシン目9と共に破断するのでICタグ1の機能は停止する。
In the case of the blister pack B in which the
ミシン目9はそれを破断させると開梱したことが見つかりやすいので、不正な行為を行う意図で商品10を取り出すときに、修復が可能な透明樹脂シート2と台紙3との接合を剥がす場合があるので、より確実には、ミシン目9に加えて第1の実施形態の構成に示したように、透明樹脂シート2と台紙3との接合部位にもアンテナ6の一部が位置するように構成するのが望ましい。
Since it is easy to find that the
以上の説明の通り本発明によれば、ブリスターパックから商品を取り出すと、装着されているICタグの機能が停止するので、正規商品を取り出した後のブリスターパックに不正に製造された模倣商品など付勢に製造された商品を収納してもICタグは機能せず、パッケージが正規のものであっても外観に惑わされることなく模倣商品など不正商品と判別することが可能となり、有効な模倣品対策を講じることができる。 As described above, according to the present invention, when the product is taken out from the blister pack, the function of the attached IC tag stops, so that the imitation product illegally manufactured in the blister pack after taking out the regular product, etc. IC tags do not function even when energized manufactured products are stored, and even if the package is genuine, it is possible to discriminate it from unauthorized products such as counterfeit products without being misled by the appearance, and effective imitation We can take measures against goods.
1 ICタグ
2 透明樹脂シート
2a 凹部
3 台紙
6 アンテナ
7 ICチップ
8 接続ライン
9 ミシン目
A、B ブリスターパック
DESCRIPTION OF
Claims (4)
前記透明樹脂シートと前記台紙との接合面に、前記ICタグのアンテナ又は接続ライン部分を配してなることを特徴とする包装商品に対するICタグの装着方法。 A product arranged on the mount is housed in a recess formed in a transparent resin sheet, and a blister pack formed by joining the peripheral portion of the transparent resin sheet to the mount is provided with an IC chip and an antenna connected to it by a connection line. A method of attaching an IC tag to a packaged product to which an IC tag provided is provided,
An IC tag mounting method for a packaged product, wherein an antenna or a connection line portion of the IC tag is arranged on a joint surface between the transparent resin sheet and the mount.
前記台紙に形成されたミシン目を横断するように前記ICタグのアンテナ又は接続ライン部分を配してなることを特徴とする包装商品に対するICタグの装着方法。 The product arranged on the mount is accommodated in a recess formed in the transparent resin sheet, and the periphery of the transparent resin sheet is joined to the mount, and a perforation for taking out the product is formed at a portion corresponding to the recess of the mount. A method of attaching an IC tag to a packaged product in which an IC tag having an IC chip and an antenna connected to the blister pack is attached to the blister pack,
An IC tag mounting method for a packaged product, wherein an antenna or a connection line portion of the IC tag is arranged so as to cross a perforation formed on the mount.
前記透明樹脂シートと前記台紙との接合面に前記アンテナの一部を配すると共に、台紙に形成されたミシン目を横断するようにアンテナ又は接続ライン部分を配してなることを特徴とする包装商品に対するICタグの装着方法。 The product arranged on the mount is accommodated in a recess formed in the transparent resin sheet, and the periphery of the transparent resin sheet is joined to the mount, and a perforation for taking out the product is formed at a portion corresponding to the recess of the mount. A method of attaching an IC tag to a packaged product in which an IC tag having an IC chip and an antenna connected to the blister pack is attached to the blister pack,
A package characterized in that a part of the antenna is arranged on a joint surface between the transparent resin sheet and the mount, and an antenna or a connection line portion is arranged so as to cross a perforation formed on the mount. How to attach IC tags to products.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005167116A JP2006341858A (en) | 2005-06-07 | 2005-06-07 | Ic tag attaching method for packaged product |
US11/448,119 US20060283748A1 (en) | 2005-06-07 | 2006-06-07 | Method of installing IC tag in packaged commodity |
CNA2006100916352A CN1876509A (en) | 2005-06-07 | 2006-06-07 | Method of installing ic tag in packaged commodity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005167116A JP2006341858A (en) | 2005-06-07 | 2005-06-07 | Ic tag attaching method for packaged product |
Publications (1)
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JP2006341858A true JP2006341858A (en) | 2006-12-21 |
Family
ID=37509113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005167116A Pending JP2006341858A (en) | 2005-06-07 | 2005-06-07 | Ic tag attaching method for packaged product |
Country Status (3)
Country | Link |
---|---|
US (1) | US20060283748A1 (en) |
JP (1) | JP2006341858A (en) |
CN (1) | CN1876509A (en) |
Cited By (3)
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WO2008117544A1 (en) * | 2007-03-28 | 2008-10-02 | Nec Corporation | Packaged object managing device, packaged object management device manufacturing apparatus, packaged object management device manufacturing method, and packaged object management method |
CN102502073A (en) * | 2011-10-09 | 2012-06-20 | 常熟市华海电子有限公司 | Chip packaging tray |
WO2017057458A1 (en) * | 2015-09-30 | 2017-04-06 | サトーホールディングス株式会社 | Container and container opening state determination method |
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IL176712A0 (en) * | 2006-07-05 | 2007-10-31 | Michael Cohen Alloro | Medication dispenser |
WO2008115722A1 (en) * | 2007-03-16 | 2008-09-25 | University Of Pittsburgh - Of The Commonwealth System Of Higher Education | Security for blister packs |
GB0723894D0 (en) * | 2007-12-06 | 2008-01-16 | Quantrelle Packaging Solutions | Display packaging |
GB0916840D0 (en) * | 2009-09-24 | 2009-11-04 | Bromley Roger | Container and opening means |
ITUB20154184A1 (en) * | 2014-10-28 | 2017-04-01 | Gianluca Simonetti | DISPOSABLE CONTAINER FOR PRECIOUS |
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-
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- 2006-06-07 CN CNA2006100916352A patent/CN1876509A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008117544A1 (en) * | 2007-03-28 | 2008-10-02 | Nec Corporation | Packaged object managing device, packaged object management device manufacturing apparatus, packaged object management device manufacturing method, and packaged object management method |
CN102502073A (en) * | 2011-10-09 | 2012-06-20 | 常熟市华海电子有限公司 | Chip packaging tray |
WO2017057458A1 (en) * | 2015-09-30 | 2017-04-06 | サトーホールディングス株式会社 | Container and container opening state determination method |
JPWO2017057458A1 (en) * | 2015-09-30 | 2018-09-06 | サトーホールディングス株式会社 | Container and container opening state judgment method |
Also Published As
Publication number | Publication date |
---|---|
CN1876509A (en) | 2006-12-13 |
US20060283748A1 (en) | 2006-12-21 |
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