JP2006337385A - Pressure-sensitive device - Google Patents

Pressure-sensitive device Download PDF

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JP2006337385A
JP2006337385A JP2006257447A JP2006257447A JP2006337385A JP 2006337385 A JP2006337385 A JP 2006337385A JP 2006257447 A JP2006257447 A JP 2006257447A JP 2006257447 A JP2006257447 A JP 2006257447A JP 2006337385 A JP2006337385 A JP 2006337385A
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stress
pressure
light emitting
emitting layer
layer
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JP4611268B2 (en
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Chao-Nan Xu
超男 徐
Nobuo Kadoi
信夫 角井
Toshimitsu Fujiwara
敏光 藤原
Heihachi Irie
平八 入江
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National Institute of Advanced Industrial Science and Technology AIST
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a versatile pressure-sensitive device, having a small size. <P>SOLUTION: In the pressure-sensitive device, a projection 16a for concentrating stress is allowed to project on the upper surface of a pressure-sensitive layer 16, and a stress luminous layer 30 is integrally laminated on a surface of a touch sensor body 15 for allowing electrode layers 17a, 17b to conduct electricity by pressurization to the projection 16a for concentrating stress. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は感圧デバイス、特に、加圧するだけで発光する応力発光材料を用いた感圧デバイスに関する。   The present invention relates to a pressure-sensitive device, and more particularly to a pressure-sensitive device using a stress-stimulated luminescent material that emits light only by applying pressure.

従来の感圧デバイスとしては、圧電素子とLEDのような発光素子とを用いた無電源の圧電式発光装置がある(例えば、特許文献1参照。)。
特開2001−351416号公報
As a conventional pressure-sensitive device, there is a non-power-supply piezoelectric light-emitting device using a piezoelectric element and a light-emitting element such as an LED (for example, see Patent Document 1).
JP 2001-351416 A

しかしながら、前述の圧電式発光装置は圧電素子および発光素子の2つのデバイスを必要とするため、小型化に限界があり、適用範囲が限定されていた。さらに、前記圧電素子は静的圧力では発電せず、衝撃力を必要とするため、適用できる範囲がより一層限定されるという問題点がある。   However, since the above-described piezoelectric light emitting device requires two devices, a piezoelectric element and a light emitting element, there is a limit to downsizing and the application range is limited. Furthermore, since the piezoelectric element does not generate electricity at a static pressure and requires an impact force, there is a problem that the applicable range is further limited.

本発明は、前記問題点に鑑み、小型化で汎用性を有する感圧デバイスを提供することを目的とする。   In view of the above problems, an object of the present invention is to provide a pressure-sensitive device that is small and versatile.

本発明にかかる感圧デバイスは、前記目的を達成すべく、別の発明にかかる感圧デバイスとしては、感圧層の上面に応力集中用凸部を突設し、かつ、前記応力集中用凸部に対する加圧で電極層を導通するタッチセンサー本体の表面に、応力発光層を積層一体化した構成としてある。   In order to achieve the above object, the pressure sensitive device according to the present invention includes, as a pressure sensitive device according to another invention, a stress concentration convex portion protruding from the upper surface of the pressure sensitive layer, and the stress concentration convex portion. The stress light-emitting layer is laminated and integrated on the surface of the touch sensor body that conducts the electrode layer by applying pressure to the part.

本発明によれば、応力発光層を形成してあるので、圧電素子を必要とせず、小型化が容易である。さらに、応力発光層は加圧しただけで発光するので、従来例のような衝撃力を必要とせず、汎用性に優れた感圧デバイスが得られる。また、所定の位置を押圧すると、タッチセンサー本体が導通するとともに、応力発光層が発光して動作確認が容易となる。   According to the present invention, since the stress light emitting layer is formed, the piezoelectric element is not required, and the miniaturization is easy. Furthermore, since the stress light emitting layer emits light only by applying pressure, an impact force as in the conventional example is not required, and a pressure-sensitive device having excellent versatility can be obtained. Further, when a predetermined position is pressed, the touch sensor main body becomes conductive and the stress light emitting layer emits light, so that the operation can be easily confirmed.

本発明の実施形態としては、前記応力発光層の界面に、応力集中層を設けた構成であってもよい。
本実施形態によれば、前述の効果に加え、応力集中層を介して押圧力が局部的に集中し、高い圧力で応力発光層を押圧する。このため、同一の押圧動作であっても発光の輝度が高い感圧デバイスを得られるという効果がある。
As an embodiment of the present invention, a configuration in which a stress concentration layer is provided at the interface of the stress light emitting layer may be employed.
According to the present embodiment, in addition to the above-described effects, the pressing force is locally concentrated through the stress concentration layer, and the stress light emitting layer is pressed with a high pressure. For this reason, even if it is the same pressing operation, there exists an effect that a pressure sensitive device with high brightness | luminance of light emission can be obtained.

本発明にかかる実施形態を図1ないし図10の添付図面に従って説明する。
本発明にかかる第1実施形態は、図1に示すように、タッチパッドに適用した場合であり、タッチパッド本体10に応力発光層30を積層一体化してある(図1A)。
An embodiment according to the present invention will be described with reference to the accompanying drawings of FIGS.
As shown in FIG. 1, the first embodiment according to the present invention is applied to a touch pad, and a stress light emitting layer 30 is laminated and integrated on a touch pad body 10 (FIG. 1A).

前記タッチパッド本体10は、感圧層11の表裏面に電極層12,13を積層一体化したものである。そして、任意の位置を所定の圧力で押圧することにより、感圧層11を介して電極12,13が導通する。   The touch pad body 10 is formed by laminating and integrating electrode layers 12 and 13 on the front and back surfaces of the pressure sensitive layer 11. Then, the electrodes 12 and 13 are conducted through the pressure-sensitive layer 11 by pressing an arbitrary position with a predetermined pressure.

前記応力発光層30は応力発光材料を積層して形成したものであり、前記応力発光材料は加圧するだけで発光する材料であり、例えば、特開2000−63824号公報に開示の応力発光材料が挙げられる。   The stress-stimulated luminescent layer 30 is formed by laminating a stress-stimulated luminescent material. The stress-stimulated luminescent material is a material that emits light only by pressurization. For example, the stress-stimulated luminescent material disclosed in Japanese Patent Application Laid-Open No. 2000-63824 is disclosed. Can be mentioned.

したがって、任意の位置に圧力が負荷されると、圧力が負荷された部分の直下に位置する応力発光層30の一部30aが発光するとともに(図1B参照)、前記感圧層11を介して前記電極層12,13が導通する。   Therefore, when a pressure is applied to an arbitrary position, a part 30a of the stress light emitting layer 30 located immediately below the portion where the pressure is applied emits light (see FIG. 1B), and the pressure sensitive layer 11 is interposed. The electrode layers 12 and 13 are conducted.

本実施形態によれば、応力発光層30を形成してあるので、圧電素子を必要とせず、小型化が容易である。さらに、応力発光層30は圧力が負荷されただけで発光するので、従来例のような衝撃力を必要とせず、汎用性に優れている。また、応力発光層30の任意の部分を押圧しても、導通するとともに、発光するので、操作確認が容易であるとともに、押圧位置を容易に認識できるという利点がある。   According to this embodiment, since the stress light emitting layer 30 is formed, a piezoelectric element is not required, and the miniaturization is easy. Furthermore, since the stress light emitting layer 30 emits light only when a pressure is applied, it does not require an impact force as in the conventional example and is excellent in versatility. In addition, even if an arbitrary portion of the stress-stimulated luminescent layer 30 is pressed, it is conductive and emits light, so that there are advantages that the operation confirmation is easy and the pressing position can be easily recognized.

第2実施形態は、図2に示すように、タッチパッド本体10と応力発光層30との間に応力集中層14を形成した場合である。前記応力集中層14は、応力発光層30の界面に多数の凹凸部を配置したものである。これは、応力発光層30に対する圧力が大きい程、応力発光層30の発光量および輝度が高まることに鑑み、前記凹凸部を介して接触圧を局部的に増大させるために設けられている。   In the second embodiment, as shown in FIG. 2, the stress concentration layer 14 is formed between the touch pad body 10 and the stress light emitting layer 30. The stress concentration layer 14 has a large number of concave and convex portions arranged at the interface of the stress light emitting layer 30. This is provided in order to locally increase the contact pressure through the concavo-convex portion in view of the fact that the greater the pressure applied to the stress luminescent layer 30, the higher the light emission amount and luminance of the stress luminescent layer 30.

したがって、本実施形態によれば、応力発光層30の任意の位置に圧力が負荷されると、押圧位置の直下に位置する応力発光層30の一部30bが前記押圧位置を中心とする円内で散点状に発光するとともに(図1B参照)、前記感圧層11を介して前記電極層12,13が導通する。   Therefore, according to the present embodiment, when pressure is applied to an arbitrary position of the stress light emitting layer 30, a part 30b of the stress light emitting layer 30 located immediately below the pressing position is in a circle centered on the pressing position. As shown in FIG. 1B, the electrode layers 12 and 13 are conducted through the pressure-sensitive layer 11.

本実施形態によれば、第1実施形態の効果に加え、輝度の高い光を確保できるという利点がある。   According to this embodiment, in addition to the effect of the first embodiment, there is an advantage that light with high luminance can be secured.

第3実施形態は、図3に示すように、タッチセンサーに適用した場合であり、タッチセンサー本体15に応力発光層30を積層一体化した場合である。前記タッチセンサー本体15は、感圧層16の上面に突設した応力集中用凸部16aの両側に電極17a,17bの配置するとともに、前記電極17a,17bの上面に配置した絶縁層18を介して応力発光層30を積層一体化してある。そして、前記電極17a,17bはタッチ検出回路19にそれぞれ接続されている。なお、前記応力発光層30は、第1実施形態と同様であるので、説明を省略する。   As shown in FIG. 3, the third embodiment is a case where it is applied to a touch sensor, and is a case where a stress light emitting layer 30 is laminated and integrated on the touch sensor main body 15. The touch sensor body 15 has electrodes 17a and 17b arranged on both sides of a stress concentration convex portion 16a projecting from the upper surface of the pressure sensitive layer 16, and an insulating layer 18 arranged on the upper surfaces of the electrodes 17a and 17b. The stress light emitting layer 30 is laminated and integrated. The electrodes 17a and 17b are connected to the touch detection circuit 19, respectively. The stress-stimulated luminescent layer 30 is the same as that in the first embodiment, and a description thereof will be omitted.

したがって、前記応力集中用凸部16aの直上に位置する応力発光層30を押し下げると、前記応力発光層30が発光するとともに、圧縮された前記応力集中用凸部16aを介して前記電極17a,17bが導通し、タッチ検出回路19に押圧信号が出力される。
本実施形態よれば、所定の応力集中用凸部16aを押圧しないと、押圧信号が出力されないので、誤操作を防止できるという利点がある。
Accordingly, when the stress light emitting layer 30 located immediately above the stress concentration convex portion 16a is pushed down, the stress light emitting layer 30 emits light, and the electrodes 17a and 17b pass through the compressed stress concentration convex portion 16a. Is conducted, and a pressing signal is output to the touch detection circuit 19.
According to the present embodiment, if the predetermined stress concentration convex portion 16a is not pressed, a pressing signal is not output, and thus there is an advantage that an erroneous operation can be prevented.

第4実施形態は、図4に示すように、第3実施形態と同様、タッチセンサーに適用した場合である。
すなわち、前記タッチセンサー本体15は、感圧層16の上面に突設した応力集中用凸部16aが電極17aの貫通孔から突出している。さらに、前記電極17aに積層した絶縁層18を介して電極17b,応力発光層30が順次積層一体化されている。そして、前記電極17a,17bはタッチ検出回路19にそれぞれ接続されている。なお、前記応力発光層30は、第1実施形態と同様であるので、説明を省略する。
As shown in FIG. 4, the fourth embodiment is a case where the fourth embodiment is applied to a touch sensor as in the third embodiment.
That is, in the touch sensor main body 15, the stress concentration convex portion 16a protruding from the upper surface of the pressure-sensitive layer 16 protrudes from the through hole of the electrode 17a. Further, the electrode 17b and the stress light emitting layer 30 are sequentially laminated and integrated through the insulating layer 18 laminated on the electrode 17a. The electrodes 17a and 17b are connected to the touch detection circuit 19, respectively. The stress-stimulated luminescent layer 30 is the same as that in the first embodiment, and a description thereof will be omitted.

したがって、前記応力集中用凸部16aの直上に位置する応力発光層30を押し下げると、前記応力発光層30が発光するとともに、圧縮された前記応力集中用凸部16aを介して前記電極17a,17bが導通し、タッチ検出回路19に押圧信号が出力され、位置情報が得られる。   Accordingly, when the stress light emitting layer 30 located immediately above the stress concentration convex portion 16a is pushed down, the stress light emitting layer 30 emits light, and the electrodes 17a and 17b pass through the compressed stress concentration convex portion 16a. Is conducted, a pressing signal is output to the touch detection circuit 19, and position information is obtained.

第5実施形態は、図5に示すように、前述の実施形態が押圧力で信号を直接出力する場合であるのに対し、応力集中層14に積層一体化した応力発光層30を図示しない駆動手段で押圧し、生じた光を受光素子20で受光する場合である。受光素子20としては、例えば、フォトダイオードあるいはフォトトランジスタが挙げられる。   As shown in FIG. 5, the fifth embodiment is a case where a signal is directly output by a pressing force, whereas the stress light emitting layer 30 laminated and integrated with the stress concentration layer 14 is not illustrated. This is a case where light received by the means is received by the light receiving element 20. Examples of the light receiving element 20 include a photodiode or a phototransistor.

第5実施形態の具体例としては、例えば、図6に示すように、リニアスイッチに適用した場合がある。
すなわち、圧電アクチュエータ(あるいは静電アクチュエータ)21に応力発光層30を積層一体化する一方、前記応力発光層30の近傍に受光素子20を配置した場合である。
As a specific example of the fifth embodiment, there is a case where it is applied to a linear switch as shown in FIG.
That is, the stress light emitting layer 30 is laminated and integrated on the piezoelectric actuator (or electrostatic actuator) 21, while the light receiving element 20 is disposed in the vicinity of the stress light emitting layer 30.

したがって、圧電アクチュエータ21に電圧を印加して駆動させると、前記圧電アクチュエータ21が変形し、前記応力発光層30を押圧して発光させ、その光を受光素子20が受光して信号を出力する。本実施形態によれば、入力と出力とがリニアであるため、印加する電圧に応じて発光量が変化し、出力が変化するリニアスイッチが得られる。   Therefore, when the piezoelectric actuator 21 is driven by applying a voltage, the piezoelectric actuator 21 is deformed, presses the stress light emitting layer 30 to emit light, and the light receiving element 20 receives the light and outputs a signal. According to the present embodiment, since the input and the output are linear, a linear switch in which the light emission amount changes according to the applied voltage and the output changes can be obtained.

第5実施形態の他の具体例としては、例えば、図7に示すように、周波数検出スイッチに適用した場合がある。
すなわち、共振点を有するダイヤフラム(あるいは圧電アクチュエータ)22に導電パターン23を設け、さらに、応力発光層30を積層一体化する一方、前記応力発光層30の近傍に受光素子20を配置した場合である。
As another specific example of the fifth embodiment, for example, as shown in FIG. 7, it may be applied to a frequency detection switch.
That is, the conductive pattern 23 is provided on the diaphragm (or piezoelectric actuator) 22 having the resonance point, and the stress light emitting layer 30 is laminated and integrated, while the light receiving element 20 is disposed in the vicinity of the stress light emitting layer 30. .

そして、導電パターン23を介して前記ダイヤフラム22に電圧を印加すると、所定の共振周波数に達した時に前記ダイヤフラム22が共振し、前記応力発光層30を押圧して発光させ、その光を受光素子20が受光して信号を出力する。したがって、所定の周波数を検出して信号を出力する周波数検出スイッチが得られる。   When a voltage is applied to the diaphragm 22 through the conductive pattern 23, the diaphragm 22 resonates when a predetermined resonance frequency is reached, and the stress light emitting layer 30 is pressed to emit light, and the light is received by the light receiving element 20. Receives light and outputs a signal. Therefore, a frequency detection switch that detects a predetermined frequency and outputs a signal is obtained.

第6実施形態は、図8に示すように、液量検出デバイスに適用した場合である。
すなわち、流体中に立設した支持プレート24の片面に応力発光層30を積層一体化したものである。前記応力発光層30が発光した場合に、その光を検出する受光素子(図示せず)が前記応力発光層30の近傍に配置されている。
The sixth embodiment is a case where the present invention is applied to a liquid amount detection device as shown in FIG.
That is, the stress light emitting layer 30 is laminated and integrated on one surface of the support plate 24 erected in the fluid. When the stress light emitting layer 30 emits light, a light receiving element (not shown) for detecting the light is disposed in the vicinity of the stress light emitting layer 30.

したがって、流体の圧力によって支持プレート24が押し曲げられた場合に、押圧力が応力発光層30に負荷され、前記応力発光層30が発光する。特に、流体の流速が速くなればなる程、支持プレート24に対する圧力が増大し、応力発光層30の発光位置が支持プレート24の基部に移動するとともに、輝度が高くなり、流速等を測定することができる。
なお、本実施形態では、支持プレートの両面に応力発光層を形成しておけば、流体の流れが逆方向に変化したときも検出できるという利点がある。
Therefore, when the support plate 24 is pushed and bent by the pressure of the fluid, the pressing force is applied to the stress light emitting layer 30, and the stress light emitting layer 30 emits light. In particular, the higher the fluid flow rate, the greater the pressure on the support plate 24, the light emission position of the stress light emitting layer 30 moves to the base of the support plate 24, the brightness increases, and the flow rate and the like are measured. Can do.
In addition, in this embodiment, if the stress light emitting layer is formed on both surfaces of the support plate, there is an advantage that it is possible to detect even when the flow of the fluid changes in the opposite direction.

第7実施形態は、図9に示すように、衝撃力検知デバイスに適用した場合である。
すなわち、過度の衝撃力が作用した場合に塑性変形する球殻25内に、球体26を転動自在に収納するとともに、前記球殻25の外周面を応力発光層30で被覆した場合である。
本実施形態よれば、前記衝撃力検知デバイスに外部から衝撃力が作用すると、球体26が球殻25に衝突して塑性変形させる。このため、球殻25の塑性変形した部分が応力発光層30を押圧して発光させ、過度の衝撃力が負荷されたという履歴を発光現象で表示する。
The seventh embodiment is a case where the present invention is applied to an impact force detection device as shown in FIG.
That is, this is a case where the spherical body 26 is slidably accommodated in the spherical shell 25 which is plastically deformed when an excessive impact force is applied, and the outer peripheral surface of the spherical shell 25 is covered with the stress light emitting layer 30.
According to this embodiment, when an impact force is applied from the outside to the impact force detection device, the sphere 26 collides with the spherical shell 25 and plastically deforms. Therefore, the plastically deformed portion of the spherical shell 25 presses the stress light emitting layer 30 to emit light, and a history that an excessive impact force is applied is displayed by a light emitting phenomenon.

本実施形態の利用方法としては、例えば、高価な電子機器等を輸送する際に取り付けておき、輸送途中で前記電子機器が破損したのか、あるいは、輸送前から破損していたのかを判別するための器具として利用する方法がある。   As a method of using the present embodiment, for example, it is attached when transporting an expensive electronic device or the like, and it is determined whether the electronic device is damaged during transportation or whether it has been damaged before transportation. There is a method of using it as an instrument.

第8実施形態は、図10に示すように、ICカード27に応力発光層30を積層一体化した場合である。
本実施形態によれば、ICカード27に密封したIC(図示せず)が破損する程度の外力が負荷された場合に、応力発光層30が発光してICが破損したことを使用者に知らせることができる。
In the eighth embodiment, as shown in FIG. 10, the stress light emitting layer 30 is laminated and integrated on the IC card 27.
According to the present embodiment, when an external force to the extent that an IC (not shown) sealed on the IC card 27 is damaged is applied, the stress light emitting layer 30 emits light and informs the user that the IC is damaged. be able to.

前述の第6,7,8実施形態においては、必要に応じ、応力発光層30の界面に応力集中層を設けて光の輝度を高めてもよい。   In the sixth, seventh, and eighth embodiments described above, if necessary, a stress concentration layer may be provided at the interface of the stress light emitting layer 30 to increase the luminance of light.

本発明によれば、応力発光層を形成してあるので、圧電素子を必要とせず、小型化が容易である。さらに、従来例のような衝撃力を必要とせず、加圧しただけで発光するので、汎用性に優れた感圧デバイスが得られるという効果がある。   According to the present invention, since the stress light emitting layer is formed, the piezoelectric element is not required, and the miniaturization is easy. Furthermore, since an impact force as in the conventional example is not required and light is emitted only by applying pressure, there is an effect that a pressure-sensitive device having excellent versatility can be obtained.

本発明にかかる感圧デバイスは、前述の実施形態に限らず、他の感圧デバイスにも適用できる。   The pressure-sensitive device according to the present invention is not limited to the above-described embodiment, and can be applied to other pressure-sensitive devices.

本発明にかかる第1実施形態を示し、図Aは断面図、図Bは動作状態を示す断面図および部分平面図である。1 shows a first embodiment according to the present invention, FIG. A is a sectional view, and FIG. B is a sectional view and a partial plan view showing an operation state. 本発明にかかる第2実施形態を示し、図Aは断面図、図Bは動作状態を示す断面図および部分平面図である。A 2nd embodiment concerning the present invention is shown, and Drawing A is a sectional view and Drawing B is a sectional view and a partial top view showing an operation state. 本発明にかかる第3実施形態の動作状態を示す断面図である。It is sectional drawing which shows the operation state of 3rd Embodiment concerning this invention. 本発明にかかる第4実施形態の動作状態を示す断面図である。It is sectional drawing which shows the operation state of 4th Embodiment concerning this invention. 本発明にかかる第5実施形態の動作状態を示す断面図である。It is sectional drawing which shows the operation state of 5th Embodiment concerning this invention. 第5実施形態の具体例を示す概略図である。It is the schematic which shows the specific example of 5th Embodiment. 第5実施形態の他の具体例を示す概略図である。It is the schematic which shows the other specific example of 5th Embodiment. 本発明にかかる第6実施形態の動作を示す断面図である。It is sectional drawing which shows operation | movement of 6th Embodiment concerning this invention. 本発明にかかる第7実施形態の断面図である。It is sectional drawing of 7th Embodiment concerning this invention. 本発明にかかる第8実施形態を示す断面図である。It is sectional drawing which shows 8th Embodiment concerning this invention.

符号の説明Explanation of symbols

10:タッチパッド本体
11:感圧層
12,13:電極
14:応力集中層
15:タッチセンサー本体
16:感圧層
16a:応力集中用凸部
17a,17b:電極
18:絶縁層
20:受光素子
21:圧電アクチュエータ
22:ダイヤフラム
23:導電パターン
24:支持プレート
25:球殻
26:球体
27:ICカード
30:応力発光層
DESCRIPTION OF SYMBOLS 10: Touch pad main body 11: Pressure sensitive layer 12, 13: Electrode 14: Stress concentration layer 15: Touch sensor main body 16: Pressure sensitive layer 16a: Stress concentration convex part 17a, 17b: Electrode 18: Insulating layer 20: Light receiving element 21: Piezoelectric actuator 22: Diaphragm 23: Conductive pattern 24: Support plate 25: Spherical shell 26: Spherical body 27: IC card 30: Stress light emitting layer

Claims (2)

感圧層の上面に応力集中用凸部を突設し、かつ、前記応力集中用凸部に対する加圧で電極層を導通するタッチセンサー本体の表面に、応力発光層を積層一体化したことを特徴とする感圧デバイス。   The stress light-emitting layer is laminated and integrated on the surface of the touch sensor main body, in which the stress concentration convex portion protrudes from the upper surface of the pressure-sensitive layer, and the electrode layer is conducted by pressurizing the stress concentration convex portion. Characteristic pressure sensitive device. 前記応力発光層の界面に、応力集中層を設けたことを特徴とする請求項1に記載の感圧デバイス。   The pressure-sensitive device according to claim 1, wherein a stress concentration layer is provided at an interface of the stress light emitting layer.
JP2006257447A 2006-09-22 2006-09-22 Pressure sensitive device Expired - Lifetime JP4611268B2 (en)

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US8079733B2 (en) 2007-12-29 2011-12-20 Brother Kogyo Kabushiki Kaisha Indicator and indicator-structure
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KR20180044050A (en) * 2016-10-21 2018-05-02 경북대학교 산학협력단 Strain measurement sensor capable displaying strain and method of manufacturing the same
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JPH0536331U (en) * 1991-10-18 1993-05-18 イナバゴム株式会社 Pressure sensor
JPH07319365A (en) * 1994-05-24 1995-12-08 Canon Inc Office processor
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8079733B2 (en) 2007-12-29 2011-12-20 Brother Kogyo Kabushiki Kaisha Indicator and indicator-structure
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KR20180044050A (en) * 2016-10-21 2018-05-02 경북대학교 산학협력단 Strain measurement sensor capable displaying strain and method of manufacturing the same
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WO2021153023A1 (en) * 2020-01-31 2021-08-05 ソニーグループ株式会社 Substrate and semiconductor package

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