JP2006332391A - Method and device for imprinting by back pressurization - Google Patents

Method and device for imprinting by back pressurization Download PDF

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JP2006332391A
JP2006332391A JP2005154854A JP2005154854A JP2006332391A JP 2006332391 A JP2006332391 A JP 2006332391A JP 2005154854 A JP2005154854 A JP 2005154854A JP 2005154854 A JP2005154854 A JP 2005154854A JP 2006332391 A JP2006332391 A JP 2006332391A
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substrate
mold
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imprint
imprinting
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JP4595120B2 (en
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Hiroshi Hiroshima
洋 廣島
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National Institute of Advanced Industrial Science and Technology AIST
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Abstract

<P>PROBLEM TO BE SOLVED: To perform accurate imprinting even when a mold and a sample are somewhat bad in flatness, to suppress formation of an isolated noncontact area when the mold and sample come into contact with each other, and to make a pressure distribution on a contact plane between the mold and sample uniform in an easy method. <P>SOLUTION: A substrate holding member 2 holds a circumference of a thin substrate 1, a structure 7 for pressurization is arranged below the substrate 1 to freely move up and down, and the mold 4 is arranged above the substrate 1 opposite to the structure 7 for pressurization; and the structure 7 for pressurization is elevated to press the reverse surface 6 of the substrate 1, and the top surface 3 of the substrate 1 is pressed against the mold 4 above the holding position (a) of the substrate 1 for imprinting. The structure 7 for pressurization is made of a substance which is more flexible than the substrate 1 and mold 4 to achieve more uniform imprinting. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は半導体等のリソグラフィー手法の一つであるインプリントリソグラフィー装置のパターン転写機構において、裏面を加圧することによりインプリントを行う裏面加圧によるインプリント方法及びその方法実施するインプリント装置に関する。   The present invention relates to an imprint method by back surface pressurization that performs imprinting by pressurizing the back surface in a pattern transfer mechanism of an imprint lithography apparatus that is one of lithography techniques for semiconductors and the like, and an imprint apparatus that performs the method.

近年、高密度メモリやシステムＬＳＩに代表される超ＬＳＩデバイスのダウンサイジングが進展し、より微細化を行うことができる技術が要求されており、そのため半導体製造プロセスの中でリソグラフィー（転写）技術の重要性が増大している。その中でインプリントリソグラフィーは所定の回路パターンを形成したモールドを、表面にレジストが塗布された試料基板に対して押しつけ、パターンを転写する技術であって、種々の方式が提案されており、例えば図９に示されるように行われる。   In recent years, downsizing of VLSI devices represented by high-density memories and system LSIs has progressed, and a technology capable of further miniaturization has been demanded. Therefore, in the semiconductor manufacturing process, lithography (transfer) technology is required. The importance is increasing. Among them, imprint lithography is a technique for transferring a pattern by pressing a mold having a predetermined circuit pattern against a sample substrate coated with a resist on its surface, and various methods have been proposed. This is done as shown in FIG.

図９において、最初同図（ａ）に示すようにモールド材料３０の表面に、転写すべきパターンの鏡像に対応する反転パターンを電子ビームリソグラフィー等により形成することにより、表面に所定の凹凸形状３１を有するモールド３２を作成する。一方、同図（ｂ）に示すように、パターンを形成しようとするシリコン基板３３上にＰＭＭＡなどのレジスト材料を塗布し硬化させて、レジスト層３４を形成する。   In FIG. 9, a reverse pattern corresponding to a mirror image of the pattern to be transferred is first formed on the surface of the mold material 30 as shown in FIG. A mold 32 having On the other hand, as shown in FIG. 5B, a resist material such as PMMA is applied on the silicon substrate 33 on which a pattern is to be formed and cured to form a resist layer 34.

次いでこのレジスト層３４備えたシリコン基板３３全体を約２００度Ｃ程度に加熱し、レジスト層３４を若干軟化させる。この状態で図９（ｃ）に示すように、前記モールド３２の凹凸形状３１を前記レジスト層３４の所定位置に配置し、凹凸形状３１をレジスト層３４に対して押しつける。このときレジスト層３４は軟化しているので、レジスト層３４は凹凸形状３１の凹部に入り込み、レジスト層３４は凹凸形状３１とほぼ同一形状となる。この状態で全体の温度を１０５度Ｃ程度に降下させることによりレジスト層３４を硬化させ、その後モールド３２を取り去る。このようにしてレジスト層３４には、所定形状の凹凸パターンが形成される。   Next, the entire silicon substrate 33 provided with the resist layer 34 is heated to about 200 ° C., and the resist layer 34 is slightly softened. In this state, as shown in FIG. 9C, the uneven shape 31 of the mold 32 is arranged at a predetermined position of the resist layer 34, and the uneven shape 31 is pressed against the resist layer 34. At this time, since the resist layer 34 is softened, the resist layer 34 enters the concave portion of the concavo-convex shape 31, and the resist layer 34 has substantially the same shape as the concavo-convex shape 31. In this state, the resist layer 34 is cured by lowering the entire temperature to about 105 ° C., and then the mold 32 is removed. In this manner, a concavo-convex pattern having a predetermined shape is formed on the resist layer 34.

なお、インプリントリソグラフィー方式においては、上記のようなものの他、例えばモールドを石英基板等の透明材料で作成し、転写される基板上には液体状の光硬化性樹脂を塗布し、その上にモールドの凹凸を押しつけ、凹凸内に液体状の光硬化性樹脂を流入させ、この状態で透明なモールドの裏側から紫外線等を照射して樹脂を硬化させ、その後モールドを取り去ることにより所定形状の凹凸パターンを形成する方式も提案されている。   In the imprint lithography method, in addition to the above, for example, a mold is made of a transparent material such as a quartz substrate, and a liquid photo-curing resin is applied onto the substrate to be transferred. Press the mold irregularities, let the liquid photo-curing resin flow into the irregularities, and in this state, irradiate ultraviolet rays etc. from the back side of the transparent mold to cure the resin, and then remove the mold to form the irregularities of the predetermined shape A method of forming a pattern has also been proposed.

上記のようなインプリントリソグラフィー方式においては、モールドを試料基板に押しつける際の押しつけ面内の圧力分布を一様にする必要がある。面内の圧力分布を一様にするにはモールドと試料基板の平行度を高める必要があり、両者が平行ではない場合はモールド側もしくは試料側で相互の傾斜が調整されなければならない。   In the imprint lithography system as described above, it is necessary to make the pressure distribution in the pressing surface uniform when pressing the mold against the sample substrate. In order to make the in-plane pressure distribution uniform, it is necessary to increase the parallelism of the mold and the sample substrate. When the two are not parallel, the mutual inclination must be adjusted on the mold side or the sample side.

上記のようにモールドを試料基板に対して押しつけるに際して、面内の圧力分布を一様にするには、従来から、弾性体や支点を有し、支点まわりに傾斜を変える傾斜調整機構を利用することが行われている。モールド側に傾斜調整機構を使用した場合を図１０、図１１の模式図に示す。図１０においては、試料台３５にレジスト３６が塗布されたシリコン基板３７が置かれ、モールド３８が加圧機構４０によってシリコン基板３７上のレジスト３６に押しつけられる。図１０は傾斜調整機構としてピボット構造４１を利用した場合を示しており、例えば試料台３５が加圧機構４０に対して相対的に傾斜している場合、加圧機構４０によってモールド３８をレジスト３６に押しつけるとき、ピボット構造４１がこの傾きを吸収し、モールド３８はレジスト３６に対して均等な力で押圧される。図１１は前記図１０の傾斜調整機構として弾性体４２を用いたものであり、弾性体４２が傾きを吸収することができ、図１０に示すものと同様に、モールド３８はレジスト３６に対して均等な力で押圧される。   In order to make the in-plane pressure distribution uniform when pressing the mold against the sample substrate as described above, conventionally, an inclination adjusting mechanism having an elastic body and a fulcrum and changing the inclination around the fulcrum is used. Things have been done. The case where an inclination adjusting mechanism is used on the mold side is shown in the schematic diagrams of FIGS. In FIG. 10, a silicon substrate 37 coated with a resist 36 is placed on a sample stage 35, and a mold 38 is pressed against the resist 36 on the silicon substrate 37 by a pressing mechanism 40. FIG. 10 shows a case where the pivot structure 41 is used as the tilt adjusting mechanism. For example, when the sample stage 35 is tilted relative to the pressurizing mechanism 40, the mold 38 is moved to the resist 36 by the pressurizing mechanism 40. The pivot structure 41 absorbs this inclination when pressed against the resist 36, and the mold 38 is pressed against the resist 36 with an equal force. 11 uses an elastic body 42 as the tilt adjustment mechanism of FIG. 10, and the elastic body 42 can absorb the tilt. As in the case shown in FIG. Pressed with equal force.

前記の例は加圧側に傾斜調整機構を使用した例を示したが、試料側に傾斜調整機構を使用しても同様の作用を行うことができ、その例を図１２（ａ）、（ｂ）、（ｃ）の模式図に示している。同図（ａ）は試料台３５をピボット構造４３により支持した例を示し、（ｂ）は試料台３５の底面に弾性体４４を、また（ｃ）は試料台３５とシリコン基板３７の間に弾性体４４を設けた例を示している。これらの各方式のいずれにおいても、試料を移動させない場合は期待通りに傾斜調整機構が機能する。   Although the above example shows an example in which the tilt adjustment mechanism is used on the pressure side, the same action can be performed even if the tilt adjustment mechanism is used on the sample side, and examples thereof are shown in FIGS. ) And (c) are schematic views. 4A shows an example in which the sample stage 35 is supported by the pivot structure 43, FIG. 5B shows an elastic body 44 on the bottom surface of the sample stage 35, and FIG. 5C shows between the sample stage 35 and the silicon substrate 37. The example which provided the elastic body 44 is shown. In any of these methods, the tilt adjustment mechanism functions as expected when the sample is not moved.

上記のように、モールドをレジストに対して均等な力で押圧するため、ピボットや弾性体からなる傾斜調整機構を、加圧側や加圧される側に設けるものにおいて、広い面のレジストに対してモールドを複数の箇所に押しつける際には、傾斜調整機構が図１０及び図１１に示すように加圧側に設けている場合は全面に対して傾斜調整機構が作用するが、傾斜調整機構が図１２に示すように加圧される側に設けている場合には全面に対して機能させることができない。   As described above, in order to press the mold against the resist with an equal force, a tilt adjusting mechanism made of a pivot or an elastic body is provided on the pressure side or the pressure side. When the mold is pressed against a plurality of locations, if the tilt adjusting mechanism is provided on the pressure side as shown in FIGS. 10 and 11, the tilt adjusting mechanism acts on the entire surface. If it is provided on the pressurized side, it cannot function on the entire surface.

前記のように、パターンのついたモールドを基板上に塗布された熱可塑性樹脂を加熱し押し付け、冷却後離型する熱ナノインプリントや、パターンのついた透明のモールドを基板上に滴下または塗布された液状の光硬化樹脂に押し付け、モールドを透過させて光を照射し樹脂を固化させて離型しパターンを形成する光ナノインプリントの手法において、均一なインプリント実現するために、従来は、型となるモールド側や試料基板側の傾斜を調整する機構を用意する手法が用いられている（特許文献１、２）。
特許公表２００３−５１７７２７号公報 特許公開２００３−７７８６７号公報 As described above, a thermal mold was applied to a patterned mold by heating or pressing the thermoplastic resin applied on the substrate, and then releasing the mold after cooling, or a patterned transparent mold was dropped or applied on the substrate. In order to achieve uniform imprinting in the technique of optical nanoimprinting, which is pressed against a liquid photo-curing resin, irradiated through the mold and irradiated with light to solidify the resin, and then released to form a pattern, it is conventionally a mold. A method of preparing a mechanism for adjusting the inclination on the mold side or the sample substrate side is used (Patent Documents 1 and 2).
Patent publication 2003-517727 Japanese Patent Publication No. 2003-77867

傾斜調整機構はモールドと試料の平坦性がきわめて良好でなければ機能しない。また、モールドと試料の接触面での圧力分布を設計する自由度が少ない。更に、モールドと試料が接触する際に接触領域内部に孤立した非接触領域が生じる場合があり、この場合大気中のインプリントでは大気がその部分に密閉されその部分で正常なインプリントが行えない、等の問題があった。   The tilt adjustment mechanism will not work unless the mold and sample are very flat. In addition, the degree of freedom in designing the pressure distribution at the contact surface between the mold and the sample is small. Furthermore, when the mold and the sample come into contact with each other, an isolated non-contact area may be generated inside the contact area. In this case, in the atmospheric imprint, the atmosphere is sealed in that area and normal imprint cannot be performed in that area. There was a problem such as.

したがって本発明は、モールドと試料の平坦性が少々悪くても正確なインプリントを行うことができ、モールドと試料との接触時に孤立した非接触領域が生じるのを抑制し、またモールドと試料の接触面での圧力分布を簡単な手法により、且つ各種の手法によって均一化することができ、それにより試料の平坦性、傾斜に対応して精密なインプリントを行うことができるようにすることを目的とする。   Therefore, the present invention enables accurate imprinting even if the flatness of the mold and the sample is slightly worse, suppresses the formation of an isolated non-contact region when the mold and the sample are in contact, The pressure distribution on the contact surface can be made uniform by a simple method and various methods, thereby making it possible to perform a precise imprint corresponding to the flatness and inclination of the sample. Objective.

本発明は上記課題を解決するため、試料周辺を保持し試料裏面を局所的に押し上げることで試料の湾曲量を制御し、接触時に孤立した非接触領域が生じるのを抑制し、押し上げる部材の構造を工夫することで試料裏面の圧力分布を設計し、モールドと試料の接触面での圧力分布に反映させ、結果的に均一なインプリントを実現するものである。   In order to solve the above problems, the present invention controls the amount of bending of the sample by holding the periphery of the sample and locally pushing up the back surface of the sample, suppressing the occurrence of an isolated non-contact region at the time of contact, and the structure of the member to be pushed up By designing the pressure distribution on the back side of the sample, it is reflected in the pressure distribution on the contact surface between the mold and the sample, and as a result, a uniform imprint is realized.

本発明に係る裏面加圧によるインプリント方法は、より具体的には、薄い基板の周囲を保持し、前記基板の下方には上下動自在に加圧用構造体を配置し、前記基板の上方には前記加圧用構造体に対向してモールドを配置し、前記加圧用構造体を上昇させて前記基板の裏面を押圧し、基板の自由保持位置より上方で基板表面を前記モールドに押圧しインプリントすることを特徴とする。   More specifically, the imprint method by backside pressurization according to the present invention holds a periphery of a thin substrate, and a pressurizing structure is arranged below the substrate so as to be movable up and down, and above the substrate. Arranges a mold facing the pressing structure, raises the pressing structure to press the back surface of the substrate, presses the substrate surface above the free holding position of the substrate to the mold, and imprints It is characterized by doing.

また、本発明に係る他の裏面加圧によるインプリント方法は、前記裏面加圧によるインプリント方法において、前記加圧用構造体が、モールド及び基板よりも柔軟な物質からなることを特徴とする。   According to another imprint method by backside pressurization according to the present invention, in the imprint method by backside pressurization, the structure for pressurization is made of a material more flexible than a mold and a substrate.

また、本発明に係る裏面加圧によるインプリント装置は、表面にインプリントする薄い基板と、前記基板の周囲を保持する基板保持部材と、前記基板の下方に上下動自在に配置した加圧用構造体と、前記基板の上方に前記加圧用構造体に対向して配置したモールドと、前記加圧用構造体を上昇させて前記基板の裏面を押圧し、基板の自由保持位置より情報で基板表面を前記モールドに押圧してインプリントする押圧手段とを備えたことを特徴とする。   Further, the imprint apparatus by backside pressure according to the present invention includes a thin substrate that is imprinted on the front surface, a substrate holding member that holds the periphery of the substrate, and a pressurizing structure that is arranged below the substrate so as to freely move up and down. A body, a mold disposed above the substrate and facing the pressing structure, and the pressing structure is raised to press the back surface of the substrate, and the substrate surface is moved by information from a free holding position of the substrate. And pressing means for imprinting by pressing the mold.

本発明に係る裏面加圧によるインプリント装置は、前記裏面加圧によるインプリント装置において、前記加圧用構造体が、モールド及び基板よりも柔軟な物質からなることを特徴とする。   The imprint apparatus by backside pressurization according to the present invention is characterized in that in the imprint apparatus by backside pressurization, the pressing structure is made of a material that is more flexible than the mold and the substrate.

本発明に係る裏面加圧によるインプリント装置は、前記裏面加圧によるインプリント装置において、前記加圧用構造体が、頂面部分を薄く形成した弾性押圧部材の内部に、液体、気体、ゲル、エラストマーのいずれかの物質からなる変形材を収容したことを特徴とする。   The imprint apparatus by backside pressurization according to the present invention is the imprint apparatus by backside pressurization, wherein the pressurizing structure has a liquid, gas, gel, It is characterized by containing a deformable material made of any material of elastomer.

本発明に係る裏面加圧によるインプリント装置は、前記裏面加圧によるインプリント装置において、前記加圧用構造体が、前記柔軟性部材を下面から押圧する押し棒を備え、前記押し棒は押圧先端部が凸状曲面をなすことを特徴とする。   The imprint apparatus by back surface pressing according to the present invention is the imprint apparatus by back surface pressing, wherein the pressing structure includes a pressing bar that presses the flexible member from the bottom surface, and the pressing bar is a pressing tip. The portion has a convex curved surface.

本発明に係る裏面加圧によるインプリント装置は、前記裏面加圧によるインプリント装置において、前記加圧用構造体が、リニアアクチュエータ、モータ、ボイスコイル、ピエゾ素子等の電動アクチュエータ、気体圧力や液体圧力等の流体アクチュエータのいずれかにより移動することを特徴とする。   The imprint apparatus by backside pressurization according to the present invention is the imprint apparatus by backside pressurization, wherein the pressurizing structure is an electric actuator such as a linear actuator, a motor, a voice coil, a piezo element, a gas pressure or a liquid pressure. It moves by either of fluid actuators, such as.

本発明に係る裏面加圧によるインプリント装置は、前記裏面加圧によるインプリント装置において、作動時における前記加圧用構造体と基板間の荷重を計測する荷重計測装置を備えることを特徴とする。   The imprint apparatus by backside pressurization according to the present invention is characterized in that in the imprint apparatus by backside pressurization, a load measuring device for measuring a load between the pressing structure and the substrate during operation is provided.

本発明に係る裏面加圧によるインプリント装置は、前記裏面加圧によるインプリント装置において、前記加圧用構造体の加圧部分の位置を計測する位置計測装置を備えたことを特徴とする。   The imprint apparatus by backside pressurization according to the present invention is characterized in that in the imprint apparatus by backside pressurization, a position measuring device for measuring the position of the pressurizing portion of the pressurizing structure is provided.

本発明に係る裏面加圧によるインプリント装置は、前記裏面加圧によるインプリント装置において、前記加圧用構造体の基板を加圧する面に圧力分布を変化させる手段を備えたことを特徴とする。   The imprint apparatus by backside pressurization according to the present invention is characterized in that in the imprint apparatus by backside pressurization, there is provided means for changing the pressure distribution on the surface of the pressurizing structure that presses the substrate.

本発明に係る裏面加圧によるインプリント装置は、前記裏面加圧によるインプリント装置において、前記加圧用構造体の基板を加圧する面に圧力分布を変化させる手段が、該加圧する面の表面または裏面に形成した凹凸であることを特徴とする。   The imprinting device by backside pressure according to the present invention is the imprinting device by backside pressing, wherein the means for changing the pressure distribution on the surface of the pressing structure that presses the substrate is the surface of the pressing surface or It is characterized by unevenness formed on the back surface.

本発明に係る裏面加圧によるインプリント装置は、前記裏面加圧によるインプリント装置において、前記加圧用構造体の基板を加圧する面が、微小な力により傾斜が可変となるように設定していることを特徴とする。   The imprint apparatus by backside pressurization according to the present invention is such that, in the imprint apparatus by backside pressurization, the surface of the pressurizing structure that presses the substrate is set so that the inclination is variable by a minute force. It is characterized by being.

本発明によると、モールドと試料の平坦性が少々悪くても正確なインプリントを行うことができ、モールドと試料との接触時に孤立した非接触領域が生じるのを抑制し、またモールドと試料の接触面での圧力分布を簡単な手法により、且つ各種の手法によって均一化することができ、それにより試料の平坦性、傾斜に対応して精密なインプリントを行うことができるようにすることができる。また、モールド側には均一インプリントするための機構を用意する必要がないために、アライメント等の他の機能をモールド側に容易に設計・構築することが可能となる。また、モールド側の傾斜調整が1mrad程度で良いために、簡単な半固定の傾斜調整機構を用意するか、場合によっては傾斜調整機構が全く不要となり、モールドを単に昇降させる機能だけを用意すれば良くなるため、モールド側の機構の単純化を図ることができる。   According to the present invention, accurate imprinting can be performed even if the flatness of the mold and the sample is slightly worse, and it is possible to suppress the occurrence of an isolated non-contact region when the mold and the sample are in contact with each other. The pressure distribution on the contact surface can be made uniform by simple methods and various methods, thereby enabling precise imprinting corresponding to the flatness and inclination of the sample. it can. Further, since there is no need to prepare a mechanism for uniform imprinting on the mold side, other functions such as alignment can be easily designed and constructed on the mold side. In addition, since the mold side tilt adjustment may be about 1 mrad, a simple semi-fixed tilt adjustment mechanism is prepared, or in some cases, the tilt adjustment mechanism is not required at all, and only a function for raising and lowering the mold is prepared. Therefore, the mold side mechanism can be simplified.

また、裏面加圧構造体の材料選択や構造の微少変更によりインプリント時の圧力分布設計を行なうことができ、使用する基板が理想的な平坦性を有していなくても均一な加圧が可能となる。更に、基板を湾曲する際の湾曲量により最終的な圧力分布を調整することも可能であり、大気中インプリントの場合、湾曲により大気の挟み込みを回避でき、欠陥のないインプリントが実現可能となる。また、液状の樹脂を利用したインプリントの場合、湾曲により液状の樹脂の効果的な外方への排出が起こり、基板とモールドを全面にわたり近接させることができるため、均一なインプリントが実現可能になる。   In addition, pressure distribution design during imprinting can be performed by selecting the material of the back surface pressurization structure and making minor structural changes, and even if the substrate used does not have ideal flatness, uniform pressurization can be achieved. It becomes possible. Furthermore, it is possible to adjust the final pressure distribution by the amount of bending when the substrate is bent. In the case of atmospheric imprinting, it is possible to avoid the trapping of the atmosphere by bending and to realize imprints without defects. Become. In addition, in the case of imprinting using liquid resin, the liquid resin is effectively discharged outward due to bending, and the substrate and mold can be brought close to each other, so that uniform imprinting can be realized. become.

本発明は、広範な条件で均一なインプリントを可能とするため、薄い基板の周囲を保持し、前記基板の下方には上下動自在に加圧用構造体を配置し、前記基板の上方には前記加圧用構造体に対向してモールドを配置し、前記加圧用構造体を上昇させて前記基板の裏面を押圧し、基板の保持位置より上方で基板表面を前記モールドに押圧しインプリントすることによって実現する。   In the present invention, in order to enable uniform imprinting over a wide range of conditions, a periphery of a thin substrate is held, and a pressurizing structure is arranged below the substrate so as to be movable up and down, and above the substrate. A mold is disposed opposite to the pressing structure, the pressing structure is raised and the back surface of the substrate is pressed, and the substrate surface is pressed onto the mold and imprinted above the holding position of the substrate. Realized by.

図１（ｂ）は本発明の基本構成とインプリント作動時の作用を示した模式断面図であり、基板１の周囲を基板保持部材２によって保持し、基板１の表面３にはモールド４のパターン形成面５を当設させる。また基板１の裏面６には、前記モールド４の基板１に対する当設部分に対向して加圧構造体７の押圧面９を押しつける。モールド４は前記加圧構造体７とは独立して上下動可能な可動部材８の下面に固定される。   FIG. 1B is a schematic cross-sectional view showing the basic configuration of the present invention and the operation during imprint operation. The periphery of the substrate 1 is held by a substrate holding member 2, and the surface 3 of the substrate 1 has a mold 4. The pattern forming surface 5 is provided. Further, the pressing surface 9 of the pressing structure 7 is pressed against the back surface 6 of the substrate 1 so as to face the portion of the mold 4 that is in contact with the substrate 1. The mold 4 is fixed to the lower surface of the movable member 8 that can move up and down independently of the pressure structure 7.

本発明は上記のような構成を採用することにより、例えば図１（ａ）に示すように、最初に基板１を支持していたときの基板１の自由保持状態での支持線ａが水平であって、その垂直の作用線がｃであるとき、基板１の表面３にインプリントするモールド４の加圧軸線ｂが、図１（ａ）に示すように垂直作用線ｃに対して角度αだけ傾いていたとき、基板１に対して押圧する加圧構造体７の押圧力によって、加圧構造体７とモールド４に挟持された基板部分は、図１（ａ）に示すように基板の弾性変形により同じ角度だけ傾斜して追従した状態でインプリントされる。   In the present invention, by adopting the above-described configuration, for example, as shown in FIG. 1A, when the substrate 1 is first supported, the support line a in the free holding state of the substrate 1 is horizontal. When the vertical action line is c, the pressing axis b of the mold 4 imprinted on the surface 3 of the substrate 1 has an angle α with respect to the vertical action line c as shown in FIG. The substrate portion sandwiched between the pressing structure 7 and the mold 4 by the pressing force of the pressing structure 7 that presses against the substrate 1 when tilted only as shown in FIG. Imprinting is performed in the state of following the same angle with an elastic deformation.

上記のような基板１の周辺支持を行い、基板１の表面３側では可動部材８とともにモールド４が降下し、基板１の裏面６側では加圧構造体７が上昇してその間で基板１を挟んでインプリントを行う作動によって、基板１の支持線ａに対して直角な作用線ｃに対してα傾斜しているときでも、基板１の弾性によってその傾斜に追従することができ、同様の原理によって図１（ｃ）に示すように、同図（ａ）とは逆方向に加圧軸線ｂが−αだけ相対的に傾斜しているときも、基板１がその傾斜に追従できるため、正確なインプリントを行うことができる。   The periphery of the substrate 1 is supported as described above, and the mold 4 is lowered together with the movable member 8 on the front surface 3 side of the substrate 1, and the pressing structure 7 is raised on the back surface 6 side of the substrate 1. By the operation of performing imprinting while sandwiching, even when the α is inclined with respect to the action line c perpendicular to the support line a of the substrate 1, the inclination can be followed by the elasticity of the substrate 1. As shown in FIG. 1C according to the principle, the substrate 1 can follow the inclination even when the pressing axis b is inclined relative to −α in the opposite direction to that shown in FIG. Accurate imprinting can be performed.

上記実施例においては加圧構造体７がほとんど弾性変形を行わない材質であっても、基板１の表面３側に固定して配置されるモールド４と、裏面６側に上下動自在に配置されて基板１を局所的に加圧する加圧構造体７とを正確に同一加圧軸線ｂ上に配置しておくことにより、例え基板１の支持線ａに対して直角に配置されていない場合でも、基板１の裏面６側から加圧構造体７を押し上げて、モールド４と加圧構造体７間で基板１を挟み込むことによって正確なインプリントを行うことができる。   In the above embodiment, even if the pressurizing structure 7 is made of a material that hardly undergoes elastic deformation, it is disposed so as to be movable up and down on the mold 4 fixed on the front surface 3 side of the substrate 1 and on the back surface 6 side. By arranging the pressurizing structure 7 that pressurizes the substrate 1 locally on the same pressurizing axis b, even if it is not arranged at right angles to the support line a of the substrate 1 By pressing up the pressure structure 7 from the back surface 6 side of the substrate 1 and sandwiching the substrate 1 between the mold 4 and the pressure structure 7, accurate imprinting can be performed.

但し、基板１がほぼ均一な平板状であるときには、加圧構造体７がほとんど弾性変形を行わない材質であっても上記作動によって正確なインプリントを行うことができるが、例えば図２（ｂ）に示すように基板１の一部が突出した略かまぼこ状に変形しているときには、図１に示す態様でインプリントを行っても、例えば図２（ａ）のモールドを透明平板として実験を行った例で示されるように、突出部の先端のみが接触し均一なインプリントを行うことができない。このような基板の場合は、例えば図２（ｃ）に示すように、加圧構造体７を傾斜可能に支持して押圧を行っても、突出部のみが接触する状態には変わりなく、上記問題を解決することができない。このような問題はモールドやほとんど弾性変形を行わない材質の構造体の表面が平坦でない場合も起こりうる。   However, when the substrate 1 has a substantially uniform flat plate shape, even if the pressing structure 7 is made of a material that hardly undergoes elastic deformation, accurate imprinting can be performed by the above operation. For example, FIG. 2), when the imprinting is performed in the form shown in FIG. 1, for example, the mold shown in FIG. 2A is used as a transparent flat plate. As shown in the performed example, only the tip of the projecting portion is in contact, and uniform imprinting cannot be performed. In the case of such a substrate, for example, as shown in FIG. 2 (c), even if the pressing structure 7 is supported so as to be tilted and pressed, only the projecting portions are in contact with each other. The problem cannot be solved. Such a problem can also occur when the surface of the mold or a structure made of a material that hardly undergoes elastic deformation is not flat.

それに対して、図２（ｄ）に示すように加圧構造体７を弾性体で形成するときには、基板１の前記突出部がモールド４によって加圧構造体７側に押圧される結果、基板１の変形によって突出部が弾性を有する加圧構造体７側に膨出し、モールド４側はほぼ平坦面となる。それにより基板１の表面３に対して正確なインプリントを行うことができる。なお、上記の実験はモールドを平板とし、また基板も１枚の板で形成した状態を示したが、実際のインプリント時には図２（ｅ）に示すように、モールド下面にパターン９が形成され、基板１の表面には液体または固体の樹脂１０が塗布されるが、上記態様は同様である。   On the other hand, when the pressurizing structure 7 is formed of an elastic body as shown in FIG. 2 (d), the projecting portion of the substrate 1 is pressed toward the pressurizing structure 7 by the mold 4. Due to this deformation, the protruding portion bulges toward the pressure structure 7 having elasticity, and the mold 4 side becomes a substantially flat surface. As a result, accurate imprinting can be performed on the surface 3 of the substrate 1. Although the above experiment shows a state in which the mold is a flat plate and the substrate is formed of a single plate, a pattern 9 is formed on the lower surface of the mold as shown in FIG. A liquid or solid resin 10 is applied to the surface of the substrate 1, and the above-described aspect is the same.

前記のように、周囲を固定した基板１の上下を挟むように、上方からモールド４を、下方から加圧構造体７を移動させるとき、モールド４の下面と加圧構造体７の上面とが平行でないときの上記のような問題を解決するためには、例えば図３（ａ）に示すように、加圧構造体７を押し棒１１と押圧部材１２の２部材で形成し、押圧部材１２は柔軟性のある樹脂やゴム等の所定の弾性力を備えた部材で形成する。図３（ａ）に示す例においては押し棒１１の先端を平坦にした例を示したが、この部分を例えば図３（ｂ）に示すように例えば球面等の凸状曲面をなすように形成し、傾斜面への対応をより柔軟に行うことができる。前記押し棒の押圧先端部は前記柔軟性部材との接触ないし接続部分において微少移動や変形等により前記柔軟性部材の傾斜を可能ならしめる構造であれば、種々の形状にすることができる。   As described above, when the mold 4 is moved from above and the pressurizing structure 7 is moved from below so as to sandwich the upper and lower sides of the substrate 1 whose periphery is fixed, the lower surface of the mold 4 and the upper surface of the pressurizing structure 7 are In order to solve the above-mentioned problem when not parallel, for example, as shown in FIG. 3A, the pressing structure 7 is formed by two members of the pressing rod 11 and the pressing member 12, and the pressing member 12. Is formed of a member having a predetermined elastic force such as a flexible resin or rubber. In the example shown in FIG. 3A, an example in which the tip of the push rod 11 is flattened is shown, but this portion is formed so as to form a convex curved surface such as a spherical surface as shown in FIG. 3B, for example. In addition, it is possible to flexibly cope with the inclined surface. The pressing tip of the push rod can be formed in various shapes as long as the structure allows the flexible member to be inclined by slight movement or deformation at the contact or connection portion with the flexible member.

図３（ｂ）に示した加圧構造体７を用いてインプリントを行うときには、同図（ｃ）に示すようになされる。即ち、周囲を基板保持部材２で固定した基板１に対して上側にモールド４、下側に前記弾性材料からなる押圧部材１２を配置したとき、例えばモールド４が加圧構造体７及び基板１に対して傾いていたときにおいて、その状態で加圧構造体７及びモールド４を基板１側に移動させてインプリントを行うと、押圧部材１２の弾性によってモールド及び基板の傾斜やうねりが吸収され、基板１の表面３に対してモールド４のパターン形成面５が全面にわたって均等な力で押圧されるため、正確なインプリントを行うことができる。   When imprinting is performed using the pressurizing structure 7 shown in FIG. 3B, the printing is performed as shown in FIG. That is, when the mold 4 is arranged on the upper side and the pressing member 12 made of the elastic material is arranged on the lower side with respect to the substrate 1 whose periphery is fixed by the substrate holding member 2, for example, the mold 4 is attached to the pressing structure 7 and the substrate 1. When the pressure structure 7 and the mold 4 are moved to the substrate 1 side in this state and the imprint is performed, the mold and the substrate are inclined and waved by the elasticity of the pressing member 12, Since the pattern forming surface 5 of the mold 4 is pressed against the surface 3 of the substrate 1 over the entire surface with uniform force, accurate imprinting can be performed.

上記のような加圧構造体７の弾性材料からなる押圧部材１２は、前記のような押圧部材１２全体を弾性材料で形成する以外に、例えば図４に示すように形成しても良い。即ち図４（ａ）に示す加圧構造体７においては、内部に押圧室１４を備えた押圧部材１２を、少なくともその頂面部分１５では、その部分を薄く形成する等によって弾性を有するように作製する。押圧室１４内には例えば液体、気体、ゲル、エラストマー等の物質のように、前記頂面部分１５よりも柔らかい材料からなる変形材１６を、硬質の蓋部材１７で閉鎖した状態とし、蓋部材１７の下面に前記図３（ａ）と同様の押し棒１１を当接して下方からこの押圧部材１２を基板１に対して押圧可能とする。   The pressing member 12 made of the elastic material of the pressurizing structure 7 as described above may be formed as shown in FIG. 4, for example, in addition to forming the entire pressing member 12 as described above with an elastic material. That is, in the pressurizing structure 7 shown in FIG. 4A, the pressing member 12 provided with the pressing chamber 14 is provided with elasticity at least at the top surface portion 15 by forming the portion thinly. Make it. In the pressing chamber 14, a deformable material 16 made of a material softer than the top surface portion 15, such as a substance such as liquid, gas, gel, or elastomer, is closed with a hard lid member 17, and the lid member A pressing rod 11 similar to that shown in FIG. 3A is brought into contact with the lower surface of 17 so that the pressing member 12 can be pressed against the substrate 1 from below.

このような加圧構造体７を用いる場合においても前記図３（ｂ）と同様に、例えば図４（ｂ）に示すようにその先端を球面とした押し棒１３とすることにより、傾斜面への対応をより柔軟に行うことができるようになる。この加圧構造体７を用いてインプリントするときにおいて、前記図３（ｃ）と同様の状態の図４（ｃ）に示すようにモールド４が基板１に対して傾斜しているとき、同図（ｄ）に示すように基板１をモールド４と押圧部材１２で挟むように加圧構造体７を基板１の裏面から押し上げるとき、モールド４の傾斜に対応して変形材１６が変形するため頂面が傾き、基板１の表面３とモールド４のパターン形成面５とは密着し、正確なインプリント行うことができる。なお、変形材１６としては種々の物質を用いることができ、前記ゲル状物資の他、柔軟性袋等に収納した液体、気体等も用いることができる。なお、上記のような加圧構造体については、その接触面の形状をモールドの形状に適合するように設定するほか、更にはモールド間での圧力分布に適合するようにモールドとは異なった種々の形状に設定することができる。   Even in the case where such a pressure structure 7 is used, as shown in FIG. 3B, for example, as shown in FIG. Can be handled more flexibly. When imprinting using the pressure structure 7, when the mold 4 is inclined with respect to the substrate 1 as shown in FIG. 4C in the same state as FIG. When the pressurizing structure 7 is pushed up from the back surface of the substrate 1 so that the substrate 1 is sandwiched between the mold 4 and the pressing member 12 as shown in FIG. The top surface is inclined, the surface 3 of the substrate 1 and the pattern forming surface 5 of the mold 4 are in close contact, and accurate imprinting can be performed. Note that various materials can be used as the deformable material 16, and in addition to the gel-like material, a liquid, a gas, or the like stored in a flexible bag or the like can also be used. For the pressure structure as described above, the shape of the contact surface is set so as to be adapted to the shape of the mold, and further, various types different from the mold so as to be adapted to the pressure distribution between the molds. It can be set to the shape.

また、前記図４に示すような加圧構造体７における押圧部材１２の頂面部分１５を、モールドのパターンの状態、押圧条件等によって押圧面の周辺の圧力が弱くなる傾向、或いは逆に強くなる傾向が生じるので、その特性に合わせて例えば図５（ａ）に示すように周辺部分に突起２２を形成してこの部分の基板を他の部分より強くモールドに当接するようにし、或いは図５（ｂ）に示すように周辺部分の内側を薄く、中心側を厚く形成して、予め頂面部分の周辺領域の弾性特性及び押圧面全体における圧力分布状態を変化させるようにしても良い。その他、加圧用構造体の基板を、加圧する面上で圧力分布を変化させるには、例えば頂面の中心部分に突起を設け、或いは裏面に薄い部分を形成する等、更に種々の態様で実施することができる。   Further, the pressure on the top surface portion 15 of the pressing member 12 in the pressurizing structure 7 as shown in FIG. 4 tends to weaken the pressure around the pressing surface depending on the state of the mold pattern, pressing conditions, or the like. According to the characteristics, for example, as shown in FIG. 5A, a protrusion 22 is formed in the peripheral portion so that the substrate of this portion is in contact with the mold more strongly than the other portion, or FIG. As shown in (b), the inner side of the peripheral portion may be made thinner and the center side thicker, so that the elastic characteristics of the peripheral region of the top surface portion and the pressure distribution state in the entire pressing surface may be changed in advance. In addition, in order to change the pressure distribution on the surface to be pressurized of the substrate of the structure for pressurization, for example, a protrusion is provided at the central portion of the top surface, or a thin portion is formed on the back surface. can do.

本発明は前記のように、加圧構造体７を基板１の裏面側に配置し、基板１を押し上げて基板１の上方に配置しているモールド４に基板１を押し付けるようにしてインプリントを行うようにしたものであるが、その際に裏面側に配置する加圧構造体７の少なくとも押圧面部分を柔らかい材料で形成すると、以下に述べるような作用効果を奏する。即ち、例えば図６（ａ）に示すようにモールド４は通常堅い材料で形成されており、一方加圧構造体７の表面部分が堅い材料で形成されているときにおいて、基板１の製作誤差等により表面及び裏面が平坦ではないとき、加圧構造体７が基板１の裏面に当接すると基板１の裏面の凸部分にのみ接触し、他の部分に接触しないため、図示実施例では基板の中心部分が主として押圧され、特に図示実施例では基板１の表面側も中心部分が凸状となっていることもあり、モールド４の周辺部分Ａが接触しないかインプリントの圧力が小さく、中心部分のみ、或いは中心部分が過剰な圧力でインプリントがなされることとなる。   In the present invention, as described above, the pressure structure 7 is disposed on the back side of the substrate 1, and the substrate 1 is pushed up to press the substrate 1 against the mold 4 disposed above the substrate 1. In this case, if at least the pressing surface portion of the pressurizing structure 7 disposed on the back surface side is formed of a soft material, the following effects can be obtained. That is, for example, as shown in FIG. 6 (a), the mold 4 is usually formed of a hard material. On the other hand, when the surface portion of the pressure structure 7 is formed of a hard material, the manufacturing error of the substrate 1 and the like. When the pressure structure 7 is in contact with the back surface of the substrate 1 when the front surface and the back surface are not flat, only the convex portion on the back surface of the substrate 1 is contacted and not the other portion. The central portion is mainly pressed, and in particular, in the illustrated embodiment, the central portion may be convex on the surface side of the substrate 1 so that the peripheral portion A of the mold 4 does not contact or the imprinting pressure is small, and the central portion Or the central portion is imprinted with excessive pressure.

それに対して、例えば図６（ｂ）に示すように加圧構造体７が柔らかい材料であるときには、加圧構造体７の表面が基板１裏面の凹凸に沿って変形し、それにより加圧構造体７が基板１を押し上げる力が基板１の裏面に均等に作用する。そのため、同図（ｃ）に示すようなインプリント時には、加圧構造体７が強い力で基板をモールド４側に押し上げ、またモールドもそれに対向して相対的に基板１を下方に押圧するので、図示するように加圧構造体７が基板１を変形させてモールド１に対して均等な力でインプリントすることとなる。したがって基板の変形にかかわらず、均等なインプリントが可能となる。   On the other hand, for example, as shown in FIG. 6B, when the pressure structure 7 is a soft material, the surface of the pressure structure 7 is deformed along the unevenness of the back surface of the substrate 1, thereby The force by which the body 7 pushes up the substrate 1 acts evenly on the back surface of the substrate 1. Therefore, at the time of imprinting as shown in FIG. 5C, the pressing structure 7 pushes the substrate toward the mold 4 with a strong force, and the mold also presses the substrate 1 relatively opposite to the mold. As shown in the figure, the pressing structure 7 deforms the substrate 1 and imprints the mold 1 with an equal force. Therefore, even imprinting is possible regardless of the deformation of the substrate.

本発明は、特に加圧構造体を基板の裏面から基板を押し上げるようにしてモールド１に押圧し、インプリントを行うようにしたものであるが、基板を押し上げることにより次のような作用をなす。即ち、インプリント作業を大気中で行おうとしたとき、図７（ａ）に示すように基板１の周囲に強い拘束力が無くほぼ自由支持されており、且つ基板１が波打つように形成されていて、特に中心部分が窪んでいる状態の時には、加圧構造体７が前記のように柔らかい材料であって基板１の裏面に密着していても、加圧構造体７によって基板１をモールド４側に押し上げてインプリントしようとしたときには、図中破線楕円形で囲んでいる中心部分Ｂに大気が挟まれて密閉され、この部分のインプリントに欠陥が発生する。   In the present invention, the pressurizing structure is pressed against the mold 1 so as to push up the substrate from the back surface of the substrate and imprinting is performed. . That is, when the imprint operation is performed in the atmosphere, as shown in FIG. 7 (a), there is no strong restraining force around the substrate 1, and the substrate 1 is formed to wave. In particular, when the central portion is depressed, even if the pressure structure 7 is a soft material as described above and is in close contact with the back surface of the substrate 1, the substrate 1 is molded into the mold 4 by the pressure structure 7. When imprinting is performed by pushing up to the side, the air is sandwiched and sealed in the central portion B surrounded by a broken-line ellipse in the drawing, and a defect occurs in the imprint of this portion.

それに対して、図７（ｂ）に示すように、基板１の周囲を基板保持部材２で保持し、柔らかい材料からなる加圧構造体７を基板１の裏面から基板の自由保持状態よりも上方に押し上げると、基板の波打ち状態が解消して加圧構造体７の中心部分が最も高い凸状となって、その表面が上方のモールド４に押し付けられるため、その過程で前記のような同図（ａ）に示す中心部分の密封空間が形成されることが無くなり、前記のようなインプリントにおける欠陥の発生を防止することができる。   On the other hand, as shown in FIG. 7B, the periphery of the substrate 1 is held by the substrate holding member 2, and the pressurizing structure 7 made of a soft material is placed above the free holding state of the substrate from the back surface of the substrate 1. When the substrate is pushed up, the corrugated state of the substrate is eliminated and the central portion of the pressure structure 7 becomes the highest convex shape, and the surface thereof is pressed against the upper mold 4. The sealed space in the central portion shown in (a) is not formed, and the occurrence of defects in the imprint as described above can be prevented.

また、図７に示すようなインプリントを液状の樹脂を用いて行うときには、図７（ａ）に対応する図８（ａ）のように中心部分Ｂに液状の樹脂が挟まれて密封されることとなり、基板とモールドが近接できなくなるためこの部分の膜厚が極端に大きくなってしまう。それに対して前記図７（ｂ）に対応する図８（ｂ）に示すように、基板１の周囲を基板保持部材２で保持し、柔らかい材料からなる加圧構造体７を基板１の裏面から押し上げると、基板の波打ち状態が解消して加圧構造体７の中心部分が最も高い凸状となることは前記と同様であり、この状態で基板１の表面が上方のモールド４に押し付けられるため、その過程で中心部の液状の樹脂は周囲に押し出され、最終的に前記のような液状の樹脂の密封が無い状態でモールド１に押し当てられてインプリントがなされる。   Further, when imprinting as shown in FIG. 7 is performed using a liquid resin, the liquid resin is sandwiched and sealed in the central portion B as shown in FIG. 8A corresponding to FIG. 7A. In other words, since the substrate and the mold cannot be brought close to each other, the film thickness of this portion becomes extremely large. On the other hand, as shown in FIG. 8B corresponding to FIG. 7B, the periphery of the substrate 1 is held by the substrate holding member 2, and the pressurizing structure 7 made of a soft material is removed from the back surface of the substrate 1. When pushed up, the undulating state of the substrate is eliminated and the central portion of the pressure structure 7 becomes the highest convex shape, as described above. In this state, the surface of the substrate 1 is pressed against the upper mold 4. In the process, the liquid resin at the center is pushed out to the periphery, and finally pressed against the mold 1 without sealing the liquid resin as described above, and imprinting is performed.

上記のような本発明について、故意にモールドと基板の平行性を悪くして均一インプリントを阻害する状況でインプリントのテストを行なったところ、1mrad程度の平行性が確保されるだけでも均一な加圧が可能なことが確かめられた。また、加圧構造体にゲルを封入することにより、単一材料の加圧構造体よりも均一性が良好な加圧が可能となることを確認した。   Regarding the present invention as described above, when imprinting was performed in a situation where the imprinting was intentionally deteriorated and the uniform imprinting was inhibited, it was uniform even if the parallelism of about 1 mrad was ensured. It was confirmed that pressurization was possible. Moreover, it was confirmed that by applying the gel to the pressurizing structure, pressurization having better uniformity than the pressurizing structure of a single material can be performed.

また、上記のような加圧構造体７を上方に移動し基板をモールドに加圧するに際しては種々の手法を採用することができるが、例えばリニアアクチュエータ、モータ、ボイスコイル、ピエゾ素子等の電動アクチュエータ、更には気体圧力や液体圧力等の流体アクチュエータ等を利用することができる。更に、インプリントの作動に際しては、基板を裏面から加圧する加圧構造体の機構と試料間の荷重を計測するための荷重計測装置を設けると、より正確なインプリントを行うことができる。また、裏面加圧機構の加圧部分の位置を計測するための位置計測装置を用いると、更に正確なインプリント制御が可能となる。   In addition, various methods can be employed for moving the pressurizing structure 7 as described above to pressurize the substrate to the mold. For example, an electric actuator such as a linear actuator, a motor, a voice coil, or a piezoelectric element. Furthermore, fluid actuators such as gas pressure and liquid pressure can be used. Further, when imprinting is performed, more accurate imprinting can be performed by providing a mechanism of a pressure structure that pressurizes the substrate from the back surface and a load measuring device for measuring the load between the samples. Further, when a position measuring device for measuring the position of the pressing portion of the back surface pressing mechanism is used, more accurate imprint control can be performed.

本発明の実施例の説明図である。It is explanatory drawing of the Example of this invention. インプリントの各種態様を示す図である。It is a figure which shows the various aspects of imprint. 本発明の他の実施例の説明図である。It is explanatory drawing of the other Example of this invention. 本発明の更に他の実施例の説明図である。It is explanatory drawing of other Example of this invention. 本発明の更に各種の実施の態様を示す図である。It is a figure which shows the various various embodiment of this invention. 本発明による作用を示す図である。It is a figure which shows the effect | action by this invention. 本発明によるインプリントを大気中で行うときに作用を示す図である。It is a figure which shows an effect | action when imprinting by this invention is performed in air | atmosphere. 本発明によるインプリントを液体中で行うときに作用を示す図である。It is a figure which shows an effect | action when performing the imprint by this invention in a liquid. 従来から行われているインプリントの説明図である。It is explanatory drawing of the imprint conventionally performed. 従来例のインプリント時の説明図である。It is explanatory drawing at the time of the imprint of a prior art example. 他の従来例のインプリント時の説明図である。It is explanatory drawing at the time of the imprint of another prior art example. 更に他の従来例のインプリント時の説明図である。It is explanatory drawing at the time of the imprint of another prior art example.

符号の説明Explanation of symbols

１ 基板
２ 基板保持部材
３ 表面
４ モールド
５ パターン形成面
６ 裏面
７ 加圧構造体
８ 可動部材
９ 押圧面 DESCRIPTION OF SYMBOLS 1 Substrate 2 Substrate holding member 3 Front surface 4 Mold 5 Pattern formation surface 6 Back surface 7 Pressure structure 8 Movable member 9 Press surface

Claims (12)

薄い基板の周囲を保持し、
前記基板の下方には上下動自在に加圧用構造体を配置し、
前記基板の上方には前記加圧用構造体に対向してモールドを配置し、
前記加圧用構造体を上昇させて前記基板の裏面を押圧し、基板の自由保持位置より上方で基板表面を前記モールドに押圧しインプリントすることを特徴とする裏面加圧によるインプリント方法。 Hold around the thin substrate,
A pressurizing structure is arranged below the substrate so as to be movable up and down,
A mold is disposed above the substrate so as to face the pressing structure,
An imprinting method by backside pressing, wherein the pressing structure is raised to press the backside of the substrate, and the substrate surface is pressed against the mold above the free holding position of the substrate for imprinting. 前記加圧用構造体は、モールド及び基板よりも柔軟な物質からなることを特徴とする請求項１記載の裏面加圧によるインプリント方法。   2. The imprint method according to claim 1, wherein the pressing structure is made of a material that is more flexible than the mold and the substrate. 表面にインプリントする薄い基板と、
前記基板の周囲を保持する基板保持部材と、
前記基板の下方に上下動自在に配置した加圧用構造体と、
前記基板の上方に前記加圧用構造体に対向して配置したモールドと、
前記加圧用構造体を上昇させて前記基板の裏面を押圧し、基板の自由保持位置より上方で基板表面を前記モールドに押圧してインプリントする押圧手段とを備えたことを特徴とする裏面加圧によるインプリント装置。 A thin substrate imprinted on the surface;
A substrate holding member for holding the periphery of the substrate;
A pressurizing structure disposed below the substrate so as to be movable up and down;
A mold disposed above the substrate and facing the structure for pressurization;
And a pressing means for pressing the back surface of the substrate by raising the pressing structure and pressing the substrate surface against the mold above the free holding position of the substrate for imprinting. Imprint device by pressure. 前記加圧用構造体は、モールド及び基板よりも柔軟な物質からなることを特徴とする請求項３記載の裏面加圧によるインプリント装置。   4. The imprint apparatus according to claim 3, wherein the pressing structure is made of a material that is more flexible than the mold and the substrate. 前記加圧用構造体は、頂面部分を薄く形成した弾性押圧部材の内部に、液体、気体、ゲル、エラストマーのいずれかの物質からなる変形材を収容したことを特徴とする請求項３記載の裏面加圧によるインプリント装置。   The said structure for pressurization has accommodated the deformation material which consists of a substance of either a liquid, gas, a gel, and an elastomer in the inside of the elastic press member which formed the top part thinly. Imprint device by backside pressure. 前記加圧用構造体は、前記柔軟性部材を下面から押圧する押し棒を備え、
前記押し棒は押圧先端部が凸状曲面をなすことを特徴とする請求項４記載の裏面加圧によるインプリント装置。 The structure for pressurization includes a push bar that presses the flexible member from the lower surface,
5. The imprint apparatus according to claim 4, wherein the push rod has a convex curved surface at a pressing tip. 前記加圧用構造体は、リニアアクチュエータ、モータ、ボイスコイル、ピエゾ素子等の電動アクチュエータ、気体圧力や液体圧力等の流体アクチュエータのいずれかにより移動することを特徴とする請求項３記載の裏面加圧によるインプリント装置。   4. The back surface pressurization according to claim 3, wherein the pressurizing structure is moved by any one of a linear actuator, an electric actuator such as a motor, a voice coil, and a piezo element, and a fluid actuator such as a gas pressure and a liquid pressure. By imprint device. インプリント作動時における前記加圧用構造体と基板間の荷重を計測する荷重計測装置を備えることを特徴とする請求項３記載の裏面加圧によるインプリント装置。   4. The imprint apparatus according to claim 3, further comprising a load measuring device that measures a load between the pressing structure and the substrate during the imprint operation. 前記加圧用構造体の加圧部分の位置を計測する位置計測装置を備えたことを特徴とする請求項３記載の裏面加圧によるインプリント装置。   The imprint apparatus according to claim 3, further comprising a position measuring device that measures a position of a pressing portion of the pressing structure. 前記加圧用構造体の基板を加圧する面に圧力分布を変化させる手段を備えたことを特徴とする請求項３記載の裏面加圧によるインプリント装置。   4. The imprint apparatus according to claim 3, further comprising means for changing a pressure distribution on a surface of the pressing structure that presses the substrate. 前記加圧用構造体の基板を加圧する面に圧力分布を変化させる手段は、該加圧する面の表面または裏面に形成した凹凸であることを特徴とする請求項１１記載の裏面加圧によるインプリント装置。   12. The imprint by back surface pressurization according to claim 11, wherein the means for changing the pressure distribution on the surface of the pressing structure for pressing the substrate is unevenness formed on the front surface or the back surface of the pressing surface. apparatus. 前記加圧用構造体の基板を加圧する面が、微小な力により傾斜が可変となるように設定していることを特徴とする請求項３記載の裏面加圧によるインプリント装置。   4. The imprint apparatus according to claim 3, wherein the surface of the pressing structure that presses the substrate is set so that the inclination is variable by a minute force.
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