JP2006324391A - Package for storing electronic component, and electronic device - Google Patents

Package for storing electronic component, and electronic device Download PDF

Info

Publication number
JP2006324391A
JP2006324391A JP2005145212A JP2005145212A JP2006324391A JP 2006324391 A JP2006324391 A JP 2006324391A JP 2005145212 A JP2005145212 A JP 2005145212A JP 2005145212 A JP2005145212 A JP 2005145212A JP 2006324391 A JP2006324391 A JP 2006324391A
Authority
JP
Japan
Prior art keywords
electronic component
thermoelectric module
package
metal
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005145212A
Other languages
Japanese (ja)
Other versions
JP4514647B2 (en
Inventor
Yoshiaki Ueda
義明 植田
Masakazu Yasui
正和 安井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2005145212A priority Critical patent/JP4514647B2/en
Publication of JP2006324391A publication Critical patent/JP2006324391A/en
Application granted granted Critical
Publication of JP4514647B2 publication Critical patent/JP4514647B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Semiconductor Lasers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for storing an electronic component which can reduce transmission strain caused by an increase in inductance of a ground circuit of an electronic component inside the package and can also reduce the occurrence of steam inside the package, etc. <P>SOLUTION: The package A for storing an electronic component includes a thermoelectric module 5 attached to a portion of the bottom face of a metal base 1 which faces a mounting portion 1a. Since the ground circuit of the electronic component is not mediated by the thermoelectric module 5, it can be made short. Moreover, the package suffers from less influence by moisture, etc. trapped inside when the thermoelectric module 5 is attached inside the package. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、熱電モジュールを具えた電子部品を収容するための電子部品収納用パッケージに関する。   The present invention relates to an electronic component storage package for storing an electronic component including a thermoelectric module.

従来の光通信分野等で使用されるレーザーダイオード（ＬＤ），フォトダイオード（ＰＤ）等の電子部品を収納するための電子部品収納用パッケージ（以下、パッケージともいう）を例にして、その断面図を図４に示す。同図において、101は金属から成る基体、102は金属から成り、一側部に貫通孔102ａが形成され、他の側部には入出力端子103が嵌着された枠体をそれぞれ示す。104は金属から成る筒状の光ファイバ固定部材（以下、固定部材ともいう）であり、その筒内の枠体102の外側面に接合された一端側に透光性部材107ｂが接合され、その他端側に光アイソレータ109および光ファイバ111が嵌着された金属ホルダ112が接合されている。また、Ｃは電子部品（ＬＤ）、105は蓋体、106は電子部品Ｃの戴置用基台、107ａはレンズ部材、107ｂは透光性部材、104は固定部材、110は樹脂などからなる接合材であり、113はペルチェ素子の集合体である熱電モジュールである。そして、これら基体101、枠体102、入出力端子103、固定部材104、熱電モジュール113、蓋体105とで電子部品ＣをパッケージＡの内部に収納する容器が基本的に構成される。   Sectional view of an electronic component storage package (hereinafter also referred to as a package) for storing electronic components such as laser diodes (LD) and photodiodes (PD) used in the conventional optical communication field, etc. Is shown in FIG. In the figure, 101 is a base made of metal, 102 is made of metal, a through hole 102a is formed on one side, and a frame body on which an input / output terminal 103 is fitted is shown on the other side. Reference numeral 104 denotes a cylindrical optical fiber fixing member (hereinafter also referred to as a fixing member) made of metal, and a translucent member 107b is bonded to one end side bonded to the outer surface of the frame body 102 in the cylinder. A metal holder 112 having an optical isolator 109 and an optical fiber 111 fitted thereto is joined to the end side. Further, C is an electronic component (LD), 105 is a lid, 106 is a mounting base for the electronic component C, 107a is a lens member, 107b is a translucent member, 104 is a fixing member, and 110 is a resin. Reference numeral 113 denotes a thermoelectric module that is an assembly of Peltier elements. The base 101, the frame body 102, the input / output terminal 103, the fixing member 104, the thermoelectric module 113, and the lid body 105 basically constitute a container for housing the electronic component C in the package A.

このパッケージＡは、電子部品Ｃからの出射光を集光または平行光に変換するレンズ部材107ａを固定する固定ホルダ108と電子部品Ｃとが熱電モジュール113上に搭載される載置部101ａが形成された基体101を有する。基体101上面の外周部に、載置部101ａを取り囲むように枠体102が銀ロウ等のロウ材により接合される。   This package A is formed with a mounting portion 101a on which a fixing holder 108 for fixing a lens member 107a for condensing emitted light from the electronic component C or converting it into parallel light and the electronic component C are mounted on the thermoelectric module 113. The substrate 101 is provided. The frame body 102 is joined to the outer peripheral portion of the upper surface of the base 101 by a brazing material such as silver brazing so as to surround the mounting portion 101a.

また、光を集光または平行光とする機能を有する透光性部材107ｂが内部に接合されるとともに、電子部品Ｃへの戻り光を防止する光アイソレータ109および光ファイバ111が挿着された金属ホルダ112が接合固定される固定部材104の一端側が、枠体102外側面の貫通孔102ａの開口の周囲に銀ロウ等のロウ材で接合される。固定部材104は、枠体102に熱膨張係数が近似する鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金等の金属から成り、内部にレンズ部材107ｂが半田材やガラス材等により接合されて、パッケージ内部の気密性を保つ。また、光アイソレータ109および光ファイバ111がガラス材や半田材，樹脂接着剤等の接合材110により嵌着された金属ホルダ112が、固定部材104の他端側にＹＡＧレーザ溶接等により接合固定される。   In addition, a translucent member 107b having a function of condensing or collimating light is joined to the inside, and an optical isolator 109 and an optical fiber 111 for preventing return light to the electronic component C are inserted. One end side of the fixing member 104 to which the holder 112 is bonded and fixed is bonded to the periphery of the opening of the through hole 102a on the outer surface of the frame 102 with a brazing material such as silver brazing. The fixing member 104 is made of a metal such as an iron (Fe) -nickel (Ni) -cobalt (Co) alloy whose thermal expansion coefficient approximates that of the frame body 102, and the lens member 107b is bonded to the inside by a solder material, a glass material, or the like. Being kept airtight inside the package. Further, a metal holder 112 in which an optical isolator 109 and an optical fiber 111 are fitted with a bonding material 110 such as a glass material, a solder material, or a resin adhesive is bonded and fixed to the other end side of the fixing member 104 by YAG laser welding or the like. The

また、枠体102の他の側部には入出力端子103が銀ロウ等のロウ材で接合される。また、蓋体105と枠体102は、それぞれの接合面に形成された金属層を介して金（Ａｕ）−錫（Ｓｎ）合金半田等の低融点ロウ材やシーム溶接等で接合される。入出力端子103はアルミナセラミックス等の誘電体から成り、例えば、誘電体から成る平板部103ｂ上に入出力用電極103ｂ−Ａが枠体102の内外にかけて形成され、この入出力用電極103−Ａの一部を挟むように誘電体から成る立壁部103ａが平板部103ｂ上に接合されて成る。そして、パッケージの内外に電気信号を入力または出力するとともに、パッケージ内外を気密に封止する機能を有する。   An input / output terminal 103 is joined to the other side portion of the frame 102 with a brazing material such as silver brazing. Further, the lid body 105 and the frame body 102 are joined by a low melting point brazing material such as gold (Au) -tin (Sn) alloy solder, seam welding or the like through a metal layer formed on each joining surface. The input / output terminal 103 is made of a dielectric such as alumina ceramics. For example, an input / output electrode 103b-A is formed on the flat plate portion 103b made of a dielectric so as to extend inside and outside the frame 102, and the input / output electrode 103-A. A standing wall portion 103a made of a dielectric is joined to the flat plate portion 103b so as to sandwich a part of the flat plate portion 103b. In addition, an electric signal is input to or output from the inside and outside of the package, and the inside and outside of the package are hermetically sealed.

基体101は、銅（Ｃｕ）−タングステン（Ｗ）合金，鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金等の比較的高い熱伝導性を有する金属から成る。また基体101は、熱電モジュール113を支持する支持部材としての機能も有する。   The base 101 is made of a metal having a relatively high thermal conductivity such as a copper (Cu) -tungsten (W) alloy, an iron (Fe) -nickel (Ni) -cobalt (Co) alloy, or the like. The base 101 also has a function as a support member that supports the thermoelectric module 113.

この熱電モジュール113は、熱電半導体を利用したヒートポンプとして機能し、P型半導体素子とN型半導体素子とを金属電極で接合した所謂π型直列回路を構成させて電流を流すと、ペルチェ効果によってπ型の上部で吸熱、下部で発熱が生じる現象を利用したものである。   This thermoelectric module 113 functions as a heat pump using a thermoelectric semiconductor, and when a current is passed through a so-called π-type series circuit in which a P-type semiconductor element and an N-type semiconductor element are joined by a metal electrode, This utilizes the phenomenon that heat is absorbed at the upper part of the mold and heat is generated at the lower part.

熱電モジュール113の上下面には、これらP型，N型の半導体素子どうしが電気的短絡しないように、さらに熱電モジュール113の形状を保持させるために金属電極の上下面にセラミック板が接合されている。そして、複数個のP型半導体素子およびN型半導体素子を互い違いに列設させ、これらの素子どうしが直列接合となるように金属板で電気的に接続することで大きな冷却効果を得ることができ、電子部品Ｃの作動時の温度を一定に保つ働きをさせることができる。   Ceramic plates are bonded to the upper and lower surfaces of the metal electrodes to keep the shape of the thermoelectric module 113 on the upper and lower surfaces of the thermoelectric module 113 so that the P-type and N-type semiconductor elements are not electrically short-circuited. Yes. A large cooling effect can be obtained by arranging a plurality of P-type semiconductor elements and N-type semiconductor elements in a staggered manner and electrically connecting them with a metal plate so that these elements are connected in series. The electronic component C can be kept at a constant temperature during operation.

また、枠体102は、基体101の熱膨張係数に近似するＦｅ−Ｎｉ−Ｃｏ合金やＣｕ−Ｗ合金等の金属から成り、一側部に貫通孔102ａが形成され、他側部に貫通孔または切欠き部から成る入出力端子103の取付部（図示せず）が設けられる。   The frame 102 is made of a metal such as an Fe—Ni—Co alloy or Cu—W alloy that approximates the thermal expansion coefficient of the base 101, and has a through hole 102a on one side and a through hole on the other side. Alternatively, a mounting portion (not shown) for the input / output terminal 103 including a notch portion is provided.

また、載置用基台106はアルミナ（Ａｌ２Ｏ３）質焼結体（アルミナセラミックス）や窒化アルミニウム（ＡｌＮ）質焼結体等の誘電体から成り、その上面には電子部品Ｃが載置される。 The mounting base 106 is made of a dielectric such as an alumina (Al 2 O 3 ) sintered body (alumina ceramic) or an aluminum nitride (AlN) sintered body, and an electronic component C is mounted on the upper surface thereof. Placed.

そして、枠体102の上面に、Ｆｅ−Ｎｉ−Ｃｏ合金等の金属またはアルミナセラミックス等のセラミックスから成る蓋体105を、Ａｕ−Ｓｎ合金半田等の低融点ロウ材や、あるいはシーム溶接で接合することにより、パッケージ内に電子部品Ｃを気密に収納しその動作性を良好なものとするパッケージとなる（例えば、特許文献１参照）。
特開平10−190141号公報 Then, a lid 105 made of a metal such as an Fe—Ni—Co alloy or a ceramic such as alumina ceramics is joined to the upper surface of the frame 102 by a low melting point brazing material such as Au—Sn alloy solder or seam welding. As a result, the electronic component C is hermetically stored in the package, and the operability is improved (for example, see Patent Document 1).
JP-A-10-190141

しかしながら、上記従来のパッケージにおいては、電子部品Ｃの直下に熱電モジュール113が配置されており、熱電モジュール113の上下面にセラミック板が配置されているために、電子部品Ｃと基体101との間の接地を短い距離で、かつ効果的に行なうことができず、接地回路が長くなってインダクタンスが大きくなることにより高周波信号に歪みを発生させてしまうという問題点がある。   However, in the conventional package described above, the thermoelectric module 113 is disposed immediately below the electronic component C, and the ceramic plates are disposed on the upper and lower surfaces of the thermoelectric module 113. In other words, the grounding circuit cannot be effectively grounded at a short distance, and the grounding circuit becomes long and the inductance increases, causing distortion in the high-frequency signal.

また、熱電モジュール113は、パッケージ内部の戴置部101ａに戴置される構造であるため、載置される熱電モジュール113の面積を大きくすることができず、電子部品Ｃの冷却効果を大きくしにくいという問題点がある。   Further, since the thermoelectric module 113 is mounted on the mounting portion 101a inside the package, the area of the mounted thermoelectric module 113 cannot be increased, and the cooling effect of the electronic component C is increased. There is a problem that it is difficult.

さらに、熱電モジュール113を戴置部101ａに載置するに際して、用いられる半田の固化時に半田にボイドが発生する場合があり、このとき、発生したボイド内に水分がトラップされて、蓋体105を封止後にこの水分が透光性部材107ａ，レンズ部材107ｂの表面に付着して光信号の透過率が低下するといった問題点を発生させることがあった。   Furthermore, when the thermoelectric module 113 is placed on the placement portion 101a, voids may be generated in the solder when the solder used is solidified. At this time, moisture is trapped in the generated voids, and the lid 105 is removed. After sealing, the moisture may adhere to the surfaces of the translucent member 107a and the lens member 107b, thereby causing a problem that the transmittance of the optical signal is lowered.

従って、本発明は上記の問題点に鑑みて完成されたものであり、その目的は、パッケージに載置される電子部品の接地回路においてインダクタンスの増大を抑え、また、パッケージの内部における水蒸気の発生等も抑制できる電子部品収納用パッケージおよび電子装置を提供することにある。   Accordingly, the present invention has been completed in view of the above problems, and its purpose is to suppress an increase in inductance in a ground circuit of an electronic component placed on the package, and to generate water vapor inside the package. It is an object of the present invention to provide an electronic component storage package and an electronic device that can suppress the above.

本発明の電子部品収納用パッケージは、上面に電子部品が戴置される載置部を有する金属基体と、一側部に貫通孔が形成され、前記金属基体の上面または側面に前記載置部を取り囲むように接合された枠体と、誘電体から成り、該誘電体の一端側から他端側にかけて内部に形成され、端部が露出された複数の線路導体を有するとともに、前記枠体の貫通孔に嵌着された入出力端子と、前記金属基体を貫通し外周が絶縁体で封止されているとともに一端が前記線路導体に電気的に接続された接続端子と、前記基体の下面の前記戴置部に対向する位置に取着され、電極が前記接続端子の他端に接続された熱電モジュールとを具備していることを特徴とする。   The electronic component storage package of the present invention includes a metal base having a placement portion on which an electronic component is placed on an upper surface, a through hole formed on one side, and the placement portion described above on the upper surface or side surface of the metal base. And a plurality of line conductors that are formed inside from one end side to the other end side of the dielectric body and have exposed end portions. An input / output terminal fitted in the through hole, a connection terminal penetrating the metal base and having an outer periphery sealed with an insulator, and one end electrically connected to the line conductor; and a bottom surface of the base The thermoelectric module is attached to a position facing the placement portion, and an electrode is connected to the other end of the connection terminal.

また、本発明の電子部品収納用パッケージは、上面に電子部品が戴置される載置部を有するとともに一側部に切欠きが形成された金属基体と、該金属基体の切欠きと連続するように一側部に切欠部が形成され、前記金属基体の上面または側面に前記載置部を取り囲むように接合された枠体と、誘電体から成り、該誘電体の一端側から他端側にかけておよび一端側から他端側の下面にかけて内部に形成され、端部が露出された複数の線路導体を有するとともに、前記枠体の前記切欠部および前記金属基体の前記切欠きに嵌着された入出力端子と、前記基体の下面の前記戴置部に対向する位置に取着され、電極が前記入出力端子の他端側下面の線路導体に接続された熱電モジュールとを具備していることを特徴とする。   The electronic component storage package of the present invention has a metal base having a mounting portion on which an electronic component is placed on the upper surface and a notch formed on one side, and is continuous with the notch of the metal base. As described above, a cutout portion is formed on one side, and a frame body joined so as to surround the mounting portion on the upper surface or side surface of the metal base, and a dielectric, and from one end side to the other end side of the dielectric body And has a plurality of line conductors that are formed inside from one end side to the lower surface on the other end side and whose end portions are exposed, and are fitted into the notches in the frame body and the notches in the metal base. An input / output terminal, and a thermoelectric module attached to a position on the lower surface of the base body facing the mounting portion, and an electrode connected to a line conductor on the lower surface of the other end side of the input / output terminal. It is characterized by.

また、本発明の電子部品収納用パッケージは、上記構成において好ましくは、前記金属基体の下面に、前記熱電モジュールを取り囲むように前記熱電モジュールと同じ高さの金属側壁が形成されていることを特徴とする。   In the electronic component storage package of the present invention, preferably, a metal side wall having the same height as the thermoelectric module is formed on the lower surface of the metal base so as to surround the thermoelectric module. And

また、本発明の電子装置は、上記本発明の電子部品収納用パッケージと、前記載置部に戴置されるとともに前記入出力端子の前記線路導体に接続された電子部品と、前記枠体の上面に前記戴置部を気密に封止する蓋体とを具備していることを特徴とする。   An electronic device according to the present invention includes an electronic component storage package according to the present invention, an electronic component mounted on the mounting portion and connected to the line conductor of the input / output terminal, and the frame body. And a lid that hermetically seals the mounting portion on the upper surface.

本発明の電子部品収納用パッケージは、上面に電子部品が戴置される載置部を有する金属基体と、一側部に貫通孔が形成され、前記金属基体の上面または側面に載置部を取り囲むように接合された枠体と、誘電体から成り、この誘電体の一端側から他端側にかけて内部に形成され、端部が露出された複数の線路導体を有するとともに、枠体の貫通孔に嵌着された入出力端子と、金属基体を貫通し外周が絶縁体で封止されているとともに一端が線路導体に電気的に接続された接続端子と、基体の下面の載置部に対向する位置に取着され、電極が接続端子の他端に接続された熱電モジュールとを具備していることにより、電子部品が上下面にセラミック板を具えた熱電モジュールを介して金属基体の載置部に載置されることがないので、熱電モジュールのセラミック板によって接地回路が長くなり、インダクタンスが増えて高周波信号が歪むことを抑制することができる。   An electronic component storage package according to the present invention includes a metal base having a mounting portion on which an electronic component is placed on an upper surface, a through hole formed on one side, and the mounting portion on the upper surface or side surface of the metal base. A frame body joined so as to surround the dielectric body, and has a plurality of line conductors formed inside from one end side to the other end side of the dielectric body, the end portions being exposed, and a through hole of the frame body The input / output terminal fitted to the terminal, the connection terminal penetrating through the metal base and having the outer periphery sealed with an insulator, and one end electrically connected to the line conductor, and the mounting portion on the lower surface of the base And a thermoelectric module having an electrode connected to the other end of the connection terminal, so that the electronic component is placed on the metal substrate via the thermoelectric module having ceramic plates on the upper and lower surfaces. The thermoelectric module. Ground circuit is lengthened by a ceramic plate Lumpur, it is possible to prevent the high frequency signal is distorted increasing inductance.

また熱電モジュールが金属基体の下面に取着されることにより、熱電モジュールを接合するための半田接合部にトラップされる水分がパッケージ内で結露することを皆無とすることができ、この水分が結露して透光性部材やレンズ部材の表面に発生する曇りを皆無とすることができる。   In addition, by attaching the thermoelectric module to the lower surface of the metal substrate, moisture trapped in the solder joint for joining the thermoelectric module can be prevented from condensing inside the package. Thus, the fogging generated on the surface of the translucent member or the lens member can be eliminated.

また、本発明の電子部品収納用パッケージは、熱電モジュールの電極が金属基体の下面の接続端子の他端に接続されるので、熱電モジュールからの２本のリード線がパッケージの外側に引き回されて邪魔になることがなく、よってリード線を外側に引き回すための余分なスペースを必要としなくなり、パッケージの実装面積の削減を図ることができる。   In the electronic component storage package of the present invention, since the electrode of the thermoelectric module is connected to the other end of the connection terminal on the lower surface of the metal substrate, the two lead wires from the thermoelectric module are routed to the outside of the package. Therefore, an extra space for routing the lead wires to the outside is not required, and the mounting area of the package can be reduced.

さらに、また、本発明の電子部品収納用パッケージは、上面に電子部品が戴置される載置部を有するとともに一側部に切欠きが形成された金属基体と、この金属基体の切欠きと連続するように一側部に切欠部が形成され、金属基体の上面または側面に載置部を取り囲むように接合された枠体と、誘電体からなり、この誘電体の一端側から他端側にかけておよび一端側から他端側の下面にかけて内部に形成され、端部が露出された複数の線路導体を有するとともに、枠体の切欠部および金属基体の切欠きに嵌着された入出力端子と、基体の下面の戴置部に対向する位置に取着され、電極が入出力端子の他端側下面の線路導体に接続された熱電モジュールとを具備していることにより、熱電モジュールの電極の接続部を入出力端子の下面にまとめて、パッケージの小型化を促進することができるとともに、接続端子取着用の貫通孔を金属基体に設ける必要がなく、これによりパッケージの封止性をよくできることに加えて、製造歩留りを高めることが可能となり、よって製造コストの削減も同時に実現することができる。   Furthermore, an electronic component storage package according to the present invention includes a metal base having a mounting portion on which an electronic component is placed on an upper surface and a notch formed on one side, and a notch of the metal base. A notched part is formed in one side part so as to be continuous, and is composed of a frame body joined so as to surround the mounting part on the upper surface or side surface of the metal substrate, and one end side to the other end side of the dielectric body And a plurality of line conductors that are formed inside from one end side to the lower surface on the other end side and exposed at the ends, and input / output terminals that are fitted into the notches in the frame and the notches in the metal base; The thermoelectric module is attached to a position opposite to the mounting portion on the lower surface of the base body, and the electrode is connected to the line conductor on the lower surface on the other end side of the input / output terminal. Consolidate connections on bottom of input / output terminals In addition to facilitating the downsizing of the package, it is not necessary to provide a through hole for attaching the connection terminal to the metal substrate, thereby improving the sealing performance of the package and increasing the manufacturing yield. Therefore, the manufacturing cost can be reduced at the same time.

また、本発明の電子部品収納用パッケージは、上記構成において好ましくは、金属基体の下面に、熱電モジュールを取り囲むように熱電モジュールと同じ高さの金属側壁が形成されていることから、この金属側壁によっても熱放散が行われることで、電子部品の温度を効率よく所望の温度に保つことが可能となる。   In the electronic component storage package of the present invention, the metal side wall having the same height as the thermoelectric module is preferably formed on the lower surface of the metal base so as to surround the thermoelectric module. As a result of heat dissipation, the temperature of the electronic component can be efficiently maintained at a desired temperature.

また、本発明の電子装置は、上記本発明の電子部品収納用パッケージと、載置部に載置されるとともに入出力端子の線路導体に接続された電子部品と、枠体の上面に戴置部を気密に封止する蓋体とを具備していることにより、内部に搭載する電子部品の作動時の信頼性が高い、かつ量産性に優れる電子装置とすることができる。   The electronic device of the present invention is placed on the electronic component storage package of the present invention, the electronic component mounted on the mounting portion and connected to the line conductor of the input / output terminal, and the upper surface of the frame. By providing the lid that hermetically seals the part, it is possible to provide an electronic device that has high reliability during operation of an electronic component mounted therein and excellent mass productivity.

本発明の電子部品収納用パッケージについて以下に詳細に説明する。なお、以下では電子部品収納用パッケージの一形態としてレーザーダイオード（ＬＤ）やフォトダイオード（ＰＤ）等を収納する光半導体素子収納用パッケージを例にして説明する。図１（ａ）は本発明の電子部品収納用パッケージの実施の形態の一例を示す平面図、図１（ｂ）はそのＸ−Ｘ’線における側断面図である。また、図２（ａ）は本発明の電子部品収納用パッケージの実施の形態の他の例を示す平面図、図２（ｂ）はそのＹ−Ｙ’線における側断面図、図２（ｃ）は図２（ｂ）の要部拡大断面図である。   The electronic component storage package of the present invention will be described in detail below. In the following description, as an example of an electronic component storage package, an optical semiconductor element storage package for storing a laser diode (LD), a photodiode (PD), or the like will be described. FIG. 1A is a plan view showing an example of an embodiment of an electronic component storage package according to the present invention, and FIG. 1B is a side sectional view taken along line X-X ′. 2A is a plan view showing another example of the embodiment of the electronic component storage package of the present invention, FIG. 2B is a side sectional view taken along the line YY ′, and FIG. ) Is an enlarged cross-sectional view of the main part of FIG.

同図において、１は上面に電子部品Ｃが載置される載置部１ａを有する金属基体、１ａ−Ａは載置部１ａに載置された電子部品Ｃ，レンズ部材７ａ等が載置される戴置用基台、１ｂは接続端子４が貫通する金属基体１の接続端子用の貫通孔、２は金属基体１の上面または側面に載置部１ａを取り囲むように接合された枠体、３は誘電体から成り枠体２の貫通孔２ｂに嵌着された入出力端子、３ａは入出力端子の立壁部、３ｂは入出力端子の平板部、３ｃは入出力端子３の一端側から他端側にかけて内部に形成され、端部が露出された複数の線路導体、３ｄは線路導体３ｃのうちの直流配線用の線路導体（以下、直流線路導体という）、３ｄ−Ａは直流線路導体３ｄの外側露出部、３ｄ−Ｂは直流線路導体３ｄの内側露出部、４は金属基体１の貫通孔１ｂを貫通し外周が絶縁体で封止された接続端子、５は熱電モジュール、５ａは熱電モジュールの電極および接続端子４の他端に接続された熱電モジュール５のリード線、14は金属基体１の下面に熱電モジュール５を取り囲むように形成された熱電モジュール５と同じ高さの金属側壁、14ａは金属側壁14に取り囲まれた凹部である。   In the figure, reference numeral 1 denotes a metal substrate having a mounting portion 1a on which an electronic component C is placed, and 1a-A denotes an electronic component C placed on the placing portion 1a, a lens member 7a, and the like. A mounting base, 1b is a through hole for a connection terminal of the metal substrate 1 through which the connection terminal 4 passes, 2 is a frame body joined to surround the mounting portion 1a on the upper surface or side surface of the metal substrate 1, 3 is an input / output terminal made of a dielectric material and fitted in the through-hole 2b of the frame 2, 3a is a standing wall portion of the input / output terminal, 3b is a flat plate portion of the input / output terminal, and 3c is from one end side of the input / output terminal 3. A plurality of line conductors formed inside toward the other end side and exposed at the ends, 3d is a line conductor for direct current wiring (hereinafter referred to as a direct current line conductor) of the line conductor 3c, and 3d-A is a direct current line conductor. 3d outside exposed portion, 3d-B is inside exposed portion of DC line conductor 3d, 4 is metal substrate 1 Connection terminals penetrating through the through-hole 1b and sealed on the outer periphery with an insulator, 5 is a thermoelectric module, 5a is an electrode of the thermoelectric module and the lead wire of the thermoelectric module 5 connected to the other end of the connection terminal 4, and 14 is a metal A metal side wall 14 a having the same height as the thermoelectric module 5 formed so as to surround the thermoelectric module 5 on the lower surface of the substrate 1 is a recess surrounded by the metal side wall 14.

また、図２（ａ）〜（ｃ）において、１ｃは金属基体１の一側部に形成された切欠き、２ａは金属基体１の切欠き１ｃと連続するように枠体２の一側部に形成された切欠部、３ｅは入出力端子３の他端側の下面に形成された入出力端子３の溝、３ｅ−Ａは溝３ｅに形成された導電部である。なお、図２において、その他の図１と共通する部分には同じ符合を付している。   2A to 2C, 1c is a notch formed in one side of the metal base 1, and 2a is one side of the frame 2 so as to be continuous with the notch 1c of the metal base 1. The notches 3e are formed on the lower surface of the other end of the input / output terminal 3, and the conductive portion 3e-A is formed in the groove 3e. In FIG. 2, the same reference numerals are given to other parts common to FIG.

これら金属基体１、枠体２、入出力端子３、熱電モジュール５とで、内部に電子部品Ｃを収納するための本発明の電子部品収納用パッケージＡ（以下、パッケージＡともいう）が基本的に構成される。   The metal base 1, the frame 2, the input / output terminal 3, and the thermoelectric module 5 are basically the electronic component storage package A (hereinafter also referred to as package A) of the present invention for storing the electronic component C therein. Configured.

また、図３は本発明の電子装置の断面図を示し、同図において、Ｃは電子部品、７ａはレンズ部材、１ａ−Ａは電子部品Ｃ，レンズ部材７ａ等が上面に載置された載置用基台、15は枠体２の上面に載置部１ａを気密に封止する蓋体である。その他の図１〜図２のパッケージＡと共通する部分には同じ符合を付している。なお、載置用基台１ａ−Ａは必要に応じて用いられるもので、載置用基台１ａ−Ａを用いずに電子部品Ｃ等が直接載置部１ａに載置されても構わない。   3 shows a cross-sectional view of the electronic device of the present invention, in which C is an electronic component, 7a is a lens member, 1a-A is an electronic component C, a lens member 7a and the like are placed on the top surface. A mounting base 15 is a lid that hermetically seals the mounting portion 1 a on the upper surface of the frame 2. Other parts common to the package A in FIGS. 1 to 2 are denoted by the same reference numerals. The mounting base 1a-A is used as necessary, and the electronic component C or the like may be directly mounted on the mounting portion 1a without using the mounting base 1a-A. .

本発明の金属基体１は、鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金，銅（Ｃｕ）−タングステン（Ｗ）合金，Ｃｕ−モリブデン（Ｍｏ）合金，Ｆｅ−Ｎｉ合金、Ｍｏ等の金属から成り、金属板を裁断加工する方法等により形成される。また、本発明のパッケージＡにおいては、金属基体１の下面に、熱電モジュール５を取り囲むように熱電モジュール５と同じ高さの金属側壁14が形成されていてもよい。この場合、金属基体１の下面外周部に、金属基体１と近似する熱膨張係数を有し、熱伝導率のよいＦｅ−Ｎｉ−Ｃｏ合金，Ｃｕ−Ｗ合金，Ｃｕ−Ｍｏ合金，Ｆｅ−Ｎｉ合金、Ｍｏ等から成る枠状の金属側壁14を接合する方法の他に、金属基体１の下側主面を切削加工することによって、開口を下方に有するとともに周囲に金属側壁14を備えることによって熱電モジュール５が収容される凹部14ａを形成してもよい。そして、この凹部14ａの底面の、金属基体１の載置部１ａに対向する位置に、金属側壁14と略同じ高さの熱電モジュール５が、例えば融点が232℃の錫鉛半田（95Sn5Sb）を介して取着される。   The metal substrate 1 of the present invention includes an iron (Fe) -nickel (Ni) -cobalt (Co) alloy, a copper (Cu) -tungsten (W) alloy, a Cu-molybdenum (Mo) alloy, an Fe-Ni alloy, Mo, and the like. And is formed by a method of cutting a metal plate. In the package A of the present invention, the metal side wall 14 having the same height as the thermoelectric module 5 may be formed on the lower surface of the metal base 1 so as to surround the thermoelectric module 5. In this case, a Fe—Ni—Co alloy, Cu—W alloy, Cu—Mo alloy, Fe—Ni having a thermal expansion coefficient similar to that of the metal substrate 1 and having good thermal conductivity is provided on the outer peripheral portion of the lower surface of the metal substrate 1. In addition to the method of joining the frame-shaped metal side wall 14 made of an alloy, Mo, or the like, by cutting the lower main surface of the metal substrate 1, the opening is provided below and the metal side wall 14 is provided around the periphery. You may form the recessed part 14a in which the thermoelectric module 5 is accommodated. A thermoelectric module 5 having a height substantially the same as that of the metal side wall 14 is placed, for example, with a tin-lead solder (95Sn5Sb) having a melting point of 232 ° C. at a position facing the mounting portion 1a of the metal substrate 1 on the bottom surface of the recess 14a. Is attached via.

金属側壁14は、熱電モジュール５と略同じ高さであるので、熱電モジュール５の下面および金属側壁14の下面を外部電気回路基板（図示せず）または放熱フィン等の金属部材（図示せず）に接触するようにパッケージＡを取着することができ、パッケージＡからの放熱性を良好にすることができる。この目的から、熱電モジュール５の下面と金属側壁14の下面とは外部電気回路基板または放熱フィンにそれぞれが接触し、熱伝導が阻害されない程度の略同一面となるように形成するのが好ましい。加工上の問題から多少の段差が生じる場合は、熱伝導性のグリスや樹脂を用いればよい。   Since the metal side wall 14 is substantially the same height as the thermoelectric module 5, the lower surface of the thermoelectric module 5 and the lower surface of the metal side wall 14 are connected to a metal member (not shown) such as an external electric circuit board (not shown) or a radiation fin. The package A can be attached so as to come into contact with the heat sink, and the heat dissipation from the package A can be improved. For this purpose, it is preferable that the lower surface of the thermoelectric module 5 and the lower surface of the metal side wall 14 are formed so as to be in contact with the external electric circuit board or the radiating fins and to have substantially the same surface that does not hinder heat conduction. When some level difference occurs due to processing problems, thermally conductive grease or resin may be used.

なお、金属側壁14は必須のものではなく、例えば、外部電気回路基板側に熱電モジュール５を収容するような貫通孔または凹部を設け、この中に熱電モジュール５を収容するようにパッケージＡを設置し、金属基体１の下面外周部を外部電気回路基板の接地電位に接続する等の方法とすることもできる。金属基体１の下面外周部を外部電気回路基板の接地配線に接続する場合、金属側壁14の高さ分パッケージＡの接地回路の長さが短くなり、インダクタンス成分を低減することができるという利点もある。   The metal side wall 14 is not essential. For example, a through hole or a recess for accommodating the thermoelectric module 5 is provided on the external electric circuit board side, and the package A is installed so as to accommodate the thermoelectric module 5 therein. In addition, the outer peripheral portion of the lower surface of the metal substrate 1 can be connected to the ground potential of the external electric circuit board. When the outer peripheral portion of the lower surface of the metal base 1 is connected to the ground wiring of the external electric circuit board, the length of the ground circuit of the package A is shortened by the height of the metal side wall 14 and the inductance component can be reduced. is there.

金属基体１の下面の、電子部品Ｃ等が載置される載置部１ａと対向する位置には、ペルチェ効果を応用した熱電モジュール５が錫鉛半田等を介して取着される。これにより、金属基体１の上面に戴置用基台１ａ−Ａを介して戴置された電子部品Ｃの接地回路は、熱電モジュール５を介して接続されないことにより、その長さを短くすることができ、インダクタンス成分が小さくなるので、従来発生していたインダクタンスに起因する高周波信号の歪みを低減することができる。   A thermoelectric module 5 to which the Peltier effect is applied is attached via a tin-lead solder or the like at a position on the lower surface of the metal substrate 1 that faces the placement portion 1a on which the electronic component C or the like is placed. Thereby, the ground circuit of the electronic component C placed on the upper surface of the metal base 1 via the placement base 1a-A is not connected via the thermoelectric module 5, thereby shortening its length. Since the inductance component can be reduced, the distortion of the high-frequency signal due to the inductance that has conventionally occurred can be reduced.

また電子部品Ｃが発する熱は、戴置用基台１ａ−Ａを介するも、金属基体１の水平方向に速やかに広がりながら熱電モジュール５に伝わるので、熱電モジュール５がパッケージの内部に戴置され、電子部品Ｃがその上面に取着されている場合と比べて熱抵抗が低くなり、電子部品Ｃの良好な冷却効果が得られる。よって電子部品Ｃの温度を定温とすることができ、温度上昇に起因して発生する電子部品Ｃの誤作動を防止することができる。   Further, the heat generated by the electronic component C is transferred to the thermoelectric module 5 while spreading quickly in the horizontal direction of the metal substrate 1 through the mounting base 1a-A, so that the thermoelectric module 5 is placed inside the package. Compared with the case where the electronic component C is attached to the upper surface, the thermal resistance is lowered, and a good cooling effect of the electronic component C is obtained. Therefore, the temperature of the electronic component C can be set to a constant temperature, and malfunction of the electronic component C caused by the temperature rise can be prevented.

また熱電モジュール５から延出されている２本のリード線５ａは凹部14ａの底面から戴置部１ａの周囲にかけて予め形成された貫通孔１ｂに貫通させて外周が絶縁体で封止された接続端子４を介してパッケージＡ内に導入され、入出力端子３の直流線路導体３ｄの内側露出部３ｄ−Ｂに接続されることで、熱電モジュール５として機能する。接続端子４は、例えば、外周に金属膜を有するセラミック板の上下面から突出するように２本の接続端子４が植設されてなる形態を有しており、リード線５ａは、この接続端子４の下端に電気的に接続され、さらに接続端子４の上端と入出力端子３の直流線路導体３ｄの内側露出部３ｄ−Ｂとがボンディングワイヤ等で接続されている。これにより、リード線５ａをパッケージＡの外側周囲に引き回す必要がなく、よってパッケージＡの周囲に余分なスペースを必要としないためにパッケージＡの実装面積を小さくすることができる。   Further, the two lead wires 5a extending from the thermoelectric module 5 are connected through a through hole 1b formed in advance from the bottom surface of the recess 14a to the periphery of the mounting portion 1a, and the outer periphery is sealed with an insulator. The thermoelectric module 5 is introduced into the package A through the terminal 4 and connected to the inner exposed portion 3d-B of the DC line conductor 3d of the input / output terminal 3. The connection terminal 4 has, for example, a form in which two connection terminals 4 are implanted so as to protrude from the upper and lower surfaces of a ceramic plate having a metal film on the outer periphery, and the lead wire 5a is connected to the connection terminal 4a. The upper end of the connection terminal 4 and the inner exposed portion 3d-B of the DC line conductor 3d of the input / output terminal 3 are connected by a bonding wire or the like. As a result, it is not necessary to route the lead wire 5a around the outer periphery of the package A, and therefore no extra space is required around the package A, so that the mounting area of the package A can be reduced.

また熱電モジュール５と入出力端子３との電気的接続は、図２（ｂ），図２（ｃ）に示すように、例えば入出力端子３における直流線路導体３ｄの外側露出部３ｄ−Ａがある一端側から入出力端子３の他端側の下面にかけて内部に形成され、入出力端子３の他端側の下面に形成されている２つの溝３ｅの内面に形成された導電部３ｅ−Ａに接続された内部配線を形成し、この導電部３ｅ−Ａにリード線５ａの一端を接続させても良い。   The electrical connection between the thermoelectric module 5 and the input / output terminal 3 is such that, for example, the outside exposed portion 3d-A of the DC line conductor 3d at the input / output terminal 3 is as shown in FIGS. Conductive portion 3e-A formed inside from one end side to the lower surface on the other end side of input / output terminal 3 and formed on the inner surface of two grooves 3e formed on the lower surface on the other end side of input / output terminal 3 An internal wiring connected to may be formed, and one end of the lead wire 5a may be connected to the conductive portion 3e-A.

この接続方法によれば、リード線５ａの一端を溝３ｅに差し込んでロウ付けすることができるので容易に接合でき、かつ位置ズレが発生しにくい。またこのように接合するだけで熱電モジュール５に直流電流を供給する導電路が構成されるので、パッケージＡの実装面積を小さくできるとともに、接合部のロウ材不足やメニスカスの形成不良といったロウ付け時の不良を少なくすることができる。そして、リード線５ａの接合の信頼性を飛躍的に増大させ、かつリード線５ａを極めて容易に直流線路導体３ｄに接合できるので、製造歩留りを大きく向上させるといった副次的効果を得ることもできる。   According to this connection method, since one end of the lead wire 5a can be inserted into the groove 3e and brazed, it can be easily joined and misalignment hardly occurs. In addition, since a conductive path for supplying a direct current to the thermoelectric module 5 is formed simply by joining in this way, the mounting area of the package A can be reduced, and brazing such as insufficient brazing material at the joint or poor meniscus formation. The number of defects can be reduced. And since the reliability of joining of the lead wire 5a is remarkably increased and the lead wire 5a can be joined to the DC line conductor 3d very easily, a secondary effect of greatly improving the manufacturing yield can be obtained. .

本発明のパッケージＡは、外部電気回路基板に貫通孔または凹部を設け、この中に熱電モジュール５が収容されるように設置されるのが好ましい。熱電モジュール５の周囲に金属側壁14が形成されている場合は、金属側壁14も貫通孔または凹部の中に収容されるのが好ましい。そして、少なくとも熱電モジュール５の下面は、良熱伝導物に接触するようにし、熱伝導が妨げられるような空隙を避けるようにする。好ましくは、金属側壁14の下面および周囲も良熱伝導物に接触するようにする。熱伝導性のグリスや樹脂を介して接触させてもよい。   The package A of the present invention is preferably installed so that the external electric circuit board is provided with a through hole or a recess and the thermoelectric module 5 is accommodated therein. When the metal side wall 14 is formed around the thermoelectric module 5, it is preferable that the metal side wall 14 is also accommodated in the through hole or the recess. At least the lower surface of the thermoelectric module 5 is brought into contact with a good heat conductor so as to avoid a gap that hinders heat conduction. Preferably, the lower surface and the periphery of the metal side wall 14 are also in contact with the good heat conductor. You may contact through heat conductive grease or resin.

本発明のパッケージＡをこのように設置することにより、入出力端子３の線路導体３ｃの高さを、外部電気回路基板の配線と略同じ高さにすることができるので、高周波信号をパッケージＡの内外に導通させる場合に、外部電気回路基板の配線と入出力端子３の線路導体３ｃとを接続する導線を最短距離とすることができ、高周波信号の歪みを少なくできる。さらに、外部電気回路基板の配線と線路導体３ｃとを略直線状に配置できるので、高周波信号の反射ロス等も低減できる。同様に、パッケージＡ内においても、線路導体３ｃの高さと電子部品Ｃの電極の高さとをできるだけ同じ高さにするのが好ましい。電子部品Ｃが薄型化する傾向にある現在、図２に示すような、入出力端子３が枠体の切欠部および基体の切欠きに嵌着された形態は、この点で有利な形態である。   By installing the package A of the present invention in this way, the height of the line conductor 3c of the input / output terminal 3 can be made substantially the same as the wiring of the external electric circuit board. When conducting to the inside and outside of the conductor, the conductor connecting the wiring of the external electric circuit board and the line conductor 3c of the input / output terminal 3 can be made the shortest distance, and the distortion of the high-frequency signal can be reduced. Furthermore, since the wiring of the external electric circuit board and the line conductor 3c can be arranged in a substantially straight line, the reflection loss of the high frequency signal can be reduced. Similarly, in the package A, it is preferable that the height of the line conductor 3c and the height of the electrode of the electronic component C be as high as possible. At present, when the electronic component C tends to be thinned, the form in which the input / output terminal 3 is fitted into the notch of the frame and the notch of the base body as shown in FIG. 2 is an advantageous form in this respect. .

入出力端子３は、セラミックスや樹脂等の絶縁体で形成され、セラミックスで形成する場合は、例えば、四角平板状の平板部３ｂの上面の一辺から対向する他辺にかけてメタライズ層から成る複数の線路導体３ｃおよび直流線路導体３ｄを形成し、さらに平板部３ｂの上面に線路導体３ｃの一部を挟んで四角柱状の立壁部３ａを接合し、これを高温で焼成して形成される。これによって、一端側（平板部３ｂの一辺側）から他端側（平板部３ｂの他辺側）にかけて平板部３ｂおよび立壁部３ａに挟まれた内部に形成され、線路導体３ｃの端部が立壁部３ａに挟まれずに露出された入出力端子３を得ることができる。また、入出力端子３の他端側の下面に直流線路導体３ｄを導出するには、入出力端子３の枠体２内側の内部露出部３ｄ−Ｂから導電部３ｅ−Ａにかけて平板部３ｂに導電ビアを形成して導出すればよい。そして、入出力端子３の枠体２または枠体２および金属基体１との接合部に設けられたメタライズ層を介して枠体２および／または金属基体１にロウ材等で封止される。   The input / output terminal 3 is formed of an insulator such as ceramics or resin. When the input / output terminal 3 is formed of ceramics, for example, a plurality of lines made of a metallized layer from one side of the upper surface of the rectangular flat plate portion 3b to the opposite side. The conductor 3c and the DC line conductor 3d are formed, and a rectangular columnar standing wall portion 3a is joined to the upper surface of the flat plate portion 3b with a part of the line conductor 3c interposed therebetween, and this is fired at a high temperature. Thereby, it is formed inside the flat plate portion 3b and the standing wall portion 3a from one end side (one side of the flat plate portion 3b) to the other end side (the other side of the flat plate portion 3b). The input / output terminal 3 exposed without being sandwiched between the standing wall portions 3a can be obtained. Further, in order to derive the DC line conductor 3d on the lower surface on the other end side of the input / output terminal 3, the flat plate portion 3b extends from the internal exposed portion 3d-B inside the frame 2 of the input / output terminal 3 to the conductive portion 3e-A. A conductive via may be formed and led out. Then, the frame 2 and / or the metal substrate 1 is sealed with a brazing material or the like through the metallized layer provided at the joint between the frame 2 of the input / output terminal 3 or the frame 2 and the metal substrate 1.

また、パッケージＡが光半導体素子収納用パッケージＡである場合は、例えば、枠体２の他側部にも貫通孔を設けるとともに、透光性部材７ｂが内側に取着された筒状の光ファイバ固定部材13を貫通孔の外面外周部に接合し、光ファイバ固定部材13の外側の端面には、内側に光アイソレータ９および光ファイバ11が半田やガラス材，樹脂等からなる接着剤10で接着された金属ホルダ12がＹＡＧレーザ溶接等により固定される。光ファイバ固定部材13の内部には、電子部品Ｃより出射または電子部品Ｃに入射される光信号の劣化が生じない非晶質ガラス等から成り、集光レンズとして機能するとともにパッケージＡ内部を気密に塞ぐための透光性部材７ｂが、半田または低融点ガラス等の接合材により固定される。   Further, when the package A is the optical semiconductor element storage package A, for example, a cylindrical light in which a through hole is provided in the other side portion of the frame 2 and the translucent member 7b is attached to the inside. The fiber fixing member 13 is joined to the outer peripheral portion of the outer surface of the through hole, and the optical isolator 9 and the optical fiber 11 are connected to the outer end surface of the optical fiber fixing member 13 with an adhesive 10 made of solder, glass material, resin, or the like. The bonded metal holder 12 is fixed by YAG laser welding or the like. The inside of the optical fiber fixing member 13 is made of amorphous glass or the like that does not deteriorate the optical signal emitted from the electronic component C or incident on the electronic component C, and functions as a condensing lens and is airtight in the package A. The translucent member 7b for closing the cover is fixed with a bonding material such as solder or low melting point glass.

枠体２の他側部の貫通孔に設けられる光ファイバ固定部材13は、光ファイバ11を枠体２に固定するためのものであり、貫通孔の枠体２の外側開口の周囲、または貫通孔の内面に銀ロウ等のロウ材を介して接合される。この光ファイバ固定部材13は、枠体２の熱膨張係数に近似するＦｅ−Ｎｉ−Ｃｏ合金やＣｕ−Ｗ合金等の金属からなり、Ｆｅ−Ｎｉ−Ｃｏ合金等のインゴット（塊）をプレス加工で筒状とすることにより作製される。   The optical fiber fixing member 13 provided in the through-hole on the other side of the frame body 2 is for fixing the optical fiber 11 to the frame body 2, and is provided around the outer opening of the frame body 2 in the through-hole or through the through-hole. It is joined to the inner surface of the hole via a brazing material such as silver brazing. The optical fiber fixing member 13 is made of a metal such as an Fe—Ni—Co alloy or a Cu—W alloy that approximates the thermal expansion coefficient of the frame 2, and presses an ingot such as an Fe—Ni—Co alloy. It is produced by making it cylindrical.

レンズ部材７ａおよび透光性部材７ｂは、例えば熱膨張係数が４×10−6〜12×10−6／℃（室温〜400℃）の非晶質ガラス等から成り、球状，半球状，凸レンズ状，ロッドレンズ状等とされる。そして、これらのレンズ部材７ａ，透光性部材７ｂは、電子部品Ｃからの出射光を集光したり平行光に変換したりして光ファイバ11に入力するための集光媒体として用いられる。また、レンズ部材７ａ，透光性部材７ｂは、例えば結晶軸の存在しない非晶質ガラスの場合、酸化珪素（ＳｉＯ２），酸化鉛（ＰｂＯ）を主成分とする鉛系、またはホウ酸やケイ砂を主成分とするホウケイ酸系のものを用いる。これにより、電子部品Ｃの出射光がレンズ部材７ａ，透光性部材７ｂにおいて複屈折の影響を及ぼされず、効率よく光ファイバ11に光信号を入力できる。 The lens member 7a and the translucent member 7b are made of, for example, amorphous glass having a thermal expansion coefficient of 4 × 10 −6 to 12 × 10 −6 / ° C. (room temperature to 400 ° C.), and are spherical, hemispherical, and convex lenses. Shape, rod lens shape, etc. The lens member 7a and the translucent member 7b are used as a condensing medium for condensing the emitted light from the electronic component C or converting it into parallel light and inputting it to the optical fiber 11. The lens member 7a and the translucent member 7b are, for example, amorphous glass having no crystal axis, lead based on silicon oxide (SiO 2 ), lead oxide (PbO), boric acid, Use a borosilicate based material mainly composed of silica sand. Accordingly, the light emitted from the electronic component C is not affected by birefringence in the lens member 7a and the translucent member 7b, and an optical signal can be efficiently input to the optical fiber 11.

また、透光性部材７ｂは、例えばその表面の一部に全周にわたってメタライズ層を被着し、メタライズ層と光ファイバ固定部材13の内面とをＡｕ−Ｓｎ半田等の低融点ロウ材で接合してもよい。これにより、電子部品Ｃを収納した電子装置Ｂの気密が保たれ、電子部品Ｃを長期にわたり正常かつ安定に作動させ得る。透光性部材７ｂは、その熱膨張係数が枠体２と異なっていても、光ファイバ固定部材13が熱膨張係数差による内部応力を吸収し緩和するので、結晶軸が応力のためにある方向に揃って光の屈折率の変化を起こすようなことが発生しにくい。従って、この透光性部材７ｂを用いることにより、電子部品Ｃと光ファイバ11との間の光結合効率の変動を小さく抑えることができ、安定した光信号の入出力を行なうことができる。   Further, the translucent member 7b is formed by, for example, depositing a metallized layer on a part of its surface over the entire circumference, and joining the metallized layer and the inner surface of the optical fiber fixing member 13 with a low melting point brazing material such as Au-Sn solder. May be. Thereby, the airtightness of the electronic device B in which the electronic component C is stored can be maintained, and the electronic component C can be operated normally and stably over a long period of time. In the translucent member 7b, even if its thermal expansion coefficient is different from that of the frame 2, the optical fiber fixing member 13 absorbs and relaxes the internal stress due to the difference in thermal expansion coefficient, so that the crystal axis is in the direction due to the stress. Therefore, it is difficult to cause a change in the refractive index of light. Therefore, by using the translucent member 7b, fluctuations in the optical coupling efficiency between the electronic component C and the optical fiber 11 can be suppressed, and stable input / output of optical signals can be performed.

また、レンズ部材７ａを固定する固定ホルダ８は載置用基台１ａ−Ａの熱膨張係数と近似する金属から成り、固定ホルダ８に形成された貫通孔にレンズ部材７ａが嵌着される。そして、固定ホルダ８は、電子部品Ｃとレンズ部材７ａとの光軸が一致するように調整された後に、戴置用基台１ａ−Ａの上面に半田やＹＡＧレーザ溶接等の溶接法により固定される。   The fixed holder 8 for fixing the lens member 7 a is made of a metal that approximates the thermal expansion coefficient of the mounting base 1 a -A, and the lens member 7 a is fitted into a through hole formed in the fixed holder 8. The fixing holder 8 is adjusted so that the optical axes of the electronic component C and the lens member 7a coincide with each other, and then fixed to the upper surface of the mounting base 1a-A by a welding method such as soldering or YAG laser welding. Is done.

また、蓋体15は、Ｆｅ−Ｎｉ−Ｃｏ合金等の金属やアルミナセラミックス等のセラミックスから成り、枠体２上面にＡｕ−Ｓｎ合金半田等の低融点ロウ材を介して接合されるか、もしくはシーム溶接等の溶接法により接合される。   The lid 15 is made of a metal such as an Fe-Ni-Co alloy or a ceramic such as alumina ceramic, and is joined to the upper surface of the frame 2 via a low melting point solder such as Au-Sn alloy solder, or They are joined by a welding method such as seam welding.

かくして、本発明のパッケージＡは、例えば図３に示すように、その下面側に形成された凹部14内にこの凹部14を囲む金属側壁14ａの高さと略同じ高さの熱電モジュール５が吸熱側を金属基体１の載置部１ａに対向する下面に接触させた状態で接合された後、熱電モジュール５の電極から延出されている２本のリード線５ａが入出力端子３の直流線路導体３ｄに接続端子４を介してまたは直接接合され、次いで、金属基体１の載置部１ａに戴置用基台１ａ−Ａを介して電子部品Ｃが戴置され、この電子部品Ｃ上の電極と入出力端子３上の線路導体３ｃとがボンディングワイヤ等で電気的に接続され、しかる後、枠体２上面に蓋体15を接合し、基体１と、枠体２と、入出力端子３と、熱電モジュール５とで基本的に構成されるパッケージＡの内部に電子部品Ｃを収納した製品としての電子装置Ｂとなる。   Thus, for example, as shown in FIG. 3, the package A of the present invention has a thermoelectric module 5 having a height approximately equal to the height of the metal side wall 14a surrounding the recess 14 in the recess 14 formed on the lower surface thereof. Are joined to the lower surface of the metal substrate 1 facing the mounting portion 1a, and then the two lead wires 5a extending from the electrodes of the thermoelectric module 5 are connected to the DC line conductor of the input / output terminal 3. The electronic component C is mounted on the mounting portion 1a of the metal base 1 via the mounting base 1a-A, and the electrodes on the electronic component C are bonded to the mounting base 1a. And the line conductor 3c on the input / output terminal 3 are electrically connected by a bonding wire or the like, and then a lid 15 is joined to the upper surface of the frame 2 to form the base 1, the frame 2, and the input / output terminal 3 And inside of the package A basically composed of the thermoelectric module 5 The electronic device B as a product accommodating the electronic components C.

なお、本発明は上記実施の形態および実施例に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何等支障ない。例えば、本実施の形態例では電子部品がレーザーダイオードなどの光半導体素子である場合について説明したが、本発明は無線通信用の半導体素子収納用パッケージにも適用できることは勿論であり、その際には、光ファイバーに代えて同軸ケーブルが枠体の側部に設けられることがある。   It should be noted that the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention. For example, although the case where the electronic component is an optical semiconductor element such as a laser diode has been described in the present embodiment, the present invention can be applied to a package for housing a semiconductor element for wireless communication. In some cases, a coaxial cable is provided on the side of the frame instead of the optical fiber.

（a）は本発明の電子部品収納用パッケージの実施の形態の一例を示す平面図であり、（ｂ）は（ａ）のＸ−Ｘ’線における断面図である。(A) is a top view which shows an example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing in the X-X 'line | wire of (a). （ａ）は本発明の電子部品収納用パッケージの実施の形態の他の例を示す平面図であり、（ｂ）は（ａ）のＹ−Ｙ’方向の断面図、（ｃ）は入出力端子部の断面図である。(A) is a top view which shows the other example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing of the YY 'direction of (a), (c) is input-output It is sectional drawing of a terminal part. 本発明の電子装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the electronic device of this invention. 従来の電子部品収納用パッケージの断面図である。It is sectional drawing of the conventional package for electronic component accommodation.

符号の説明Explanation of symbols

１：金属基体
１ａ：載置部
１ａ−Ａ：戴置用基台
１ｂ：接続端子用貫通孔
１ｃ：切欠き
２：枠体
２ａ：切欠部
３：入出力端子
３ａ：立壁部
３ｂ：平板部
３ｃ：線路導体
３ｄ：直流線路導体
３ｄ−Ａ：外側露出部
３ｄ−Ｂ：内側露出部
３ｅ：溝
３ｅ−Ａ：導電部
４：接続端子
５：熱電モジュール
５ａ：リード線
７ａ：レンズ部材
７ｂ：透光性部材
13：光ファイバ固定部材
14：金属側壁
14ａ：凹部
15：蓋体
Ａ：電子部品収納用パッケージ
Ｂ：電子装置
Ｃ：電子部品 DESCRIPTION OF SYMBOLS 1: Metal base | substrate 1a: Mounting part 1a-A: Mounting base 1b: Through-hole for connection terminals 1c: Notch 2: Frame 2a: Notch part 3: Input / output terminal 3a: Standing wall part 3b: Flat plate part 3c: Line conductor 3d: DC line conductor 3d-A: Outside exposed portion 3d-B: Inside exposed portion 3e: Groove 3e-A: Conductive portion 4: Connection terminal 5: Thermoelectric module 5a: Lead wire 7a: Lens member 7b: Translucent member
13: Optical fiber fixing member
14: Metal side wall
14a: recess
15: Lid A: Electronic component storage package B: Electronic device C: Electronic component

Claims (4)

上面に電子部品が戴置される載置部を有する金属基体と、一側部に貫通孔が形成され、前記金属基体の上面または側面に前記載置部を取り囲むように接合された枠体と、誘電体から成り、該誘電体の一端側から他端側にかけて内部に形成され、端部が露出された複数の線路導体を有するとともに、前記枠体の貫通孔に嵌着された入出力端子と、前記金属基体を貫通し外周が絶縁体で封止されているとともに一端が前記線路導体に電気的に接続された接続端子と、前記基体の下面の前記載置部に対向する位置に取着され、電極が前記接続端子の他端に接続された熱電モジュールとを具備していることを特徴とする電子部品収納用パッケージ。 A metal base having a placement part on which an electronic component is placed on an upper surface; a frame body in which a through hole is formed on one side and joined to surround the placement part on the upper surface or side surface of the metal base; An input / output terminal comprising a plurality of line conductors, each of which is formed inside from one end side to the other end side of the dielectric body, and whose end portions are exposed, and is fitted into the through hole of the frame body And a connection terminal penetrating the metal base and having an outer periphery sealed with an insulator and having one end electrically connected to the line conductor, and a position facing the mounting portion on the lower surface of the base. And a thermoelectric module having an electrode connected to the other end of the connection terminal. 上面に電子部品が戴置される載置部を有するとともに一側部に切欠きが形成された金属基体と、該金属基体の切欠きと連続するように一側部に切欠部が形成され、前記金属基体の上面または側面に前記載置部を取り囲むように接合された枠体と、誘電体から成り、該誘電体の一端側から他端側にかけておよび一端側から他端側の下面にかけて内部に形成され、端部が露出された複数の線路導体を有するとともに、前記枠体の前記切欠部および前記金属基体の前記切欠きに嵌着された入出力端子と、前記基体の下面の前記戴置部に対向する位置に取着され、電極が前記入出力端子の他端側下面の線路導体に接続された熱電モジュールとを具備していることを特徴とする電子部品収納用パッケージ。 A metal base having a placement part on which an electronic component is placed on the upper surface and having a notch formed on one side, and a notch formed on one side so as to be continuous with the notch of the metal base, A frame body joined so as to surround the mounting portion on the upper surface or side surface of the metal base, and a dielectric, and the inside of the dielectric body from one end side to the other end side and from one end side to the lower surface on the other end side And has a plurality of line conductors whose ends are exposed, input / output terminals fitted into the notches of the frame and the notches of the metal base, and the bottom surface of the base. A package for storing electronic parts, comprising: a thermoelectric module attached to a position facing the mounting portion, and an electrode connected to a line conductor on the lower surface of the other end side of the input / output terminal. 前記金属基体の下面に、前記熱電モジュールを取り囲むように前記熱電モジュールと同じ高さの金属側壁が形成されていることを特徴とする請求項１または請求項２記載の電子部品収納用パッケージ。 3. The electronic component storage package according to claim 1, wherein a metal side wall having the same height as the thermoelectric module is formed on the lower surface of the metal base so as to surround the thermoelectric module. 請求項1乃至請求項３のいずれかに記載の電子部品収納用パッケージと、前記載置部に戴置されるとともに前記入出力端子の前記線路導体に接続された電子部品と、前記枠体の上面に前記戴置部を気密に封止する蓋体とを具備していることを特徴とする電子装置。 An electronic component storage package according to any one of claims 1 to 3, an electronic component placed on the placement portion and connected to the line conductor of the input / output terminal, and the frame body An electronic device comprising: a lid body hermetically sealing the placement portion on an upper surface.
JP2005145212A 2005-05-18 2005-05-18 Electronic component storage package and electronic device Expired - Fee Related JP4514647B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005145212A JP4514647B2 (en) 2005-05-18 2005-05-18 Electronic component storage package and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005145212A JP4514647B2 (en) 2005-05-18 2005-05-18 Electronic component storage package and electronic device

Publications (2)

Publication Number Publication Date
JP2006324391A true JP2006324391A (en) 2006-11-30
JP4514647B2 JP4514647B2 (en) 2010-07-28

Family

ID=37543856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005145212A Expired - Fee Related JP4514647B2 (en) 2005-05-18 2005-05-18 Electronic component storage package and electronic device

Country Status (1)

Country Link
JP (1) JP4514647B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014509451A (en) * 2011-02-05 2014-04-17 レアード テクノロジーズ インコーポレイテッド Circuit assembly including thermoelectric module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864712A (en) * 1994-08-25 1996-03-08 Kyocera Corp Optical semiconductor chip housing package
JP2000510263A (en) * 1997-02-14 2000-08-08 エジッド エス．アー． Electronic or opto-electronic case with ceramic insert
JP2000349353A (en) * 1999-04-01 2000-12-15 Yamaha Corp Peltier module and module for optical communication equipped with the same
JP2001168447A (en) * 1999-12-13 2001-06-22 Sumitomo Electric Ind Ltd Laser diode optical module
JP2004006720A (en) * 2002-04-25 2004-01-08 Yamaha Corp Thermoelectric module package
JP2004145147A (en) * 2002-10-25 2004-05-20 Kyocera Corp Package for optical element storage, and optical module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864712A (en) * 1994-08-25 1996-03-08 Kyocera Corp Optical semiconductor chip housing package
JP2000510263A (en) * 1997-02-14 2000-08-08 エジッド エス．アー． Electronic or opto-electronic case with ceramic insert
JP2000349353A (en) * 1999-04-01 2000-12-15 Yamaha Corp Peltier module and module for optical communication equipped with the same
JP2001168447A (en) * 1999-12-13 2001-06-22 Sumitomo Electric Ind Ltd Laser diode optical module
JP2004006720A (en) * 2002-04-25 2004-01-08 Yamaha Corp Thermoelectric module package
JP2004145147A (en) * 2002-10-25 2004-05-20 Kyocera Corp Package for optical element storage, and optical module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014509451A (en) * 2011-02-05 2014-04-17 レアード テクノロジーズ インコーポレイテッド Circuit assembly including thermoelectric module
US9322580B2 (en) 2011-02-05 2016-04-26 Laird Technologies, Inc. Circuit assemblies including thermoelectric modules

Also Published As

Publication number Publication date
JP4514647B2 (en) 2010-07-28

Similar Documents

Publication Publication Date Title
KR101430634B1 (en) Optical Modules
JP4015440B2 (en) Optical communication module
JP6788044B2 (en) Package with built-in thermoelectric element
JP4822820B2 (en) Semiconductor element storage package and semiconductor device
JP2004214651A (en) Optical module
JP7193565B2 (en) Optical semiconductor element housing package and optical semiconductor device
JP2006237103A (en) Thermally conductive member and electronic apparatus
JP4514647B2 (en) Electronic component storage package and electronic device
JP3457916B2 (en) Optical semiconductor element storage package
JP4009110B2 (en) Optical semiconductor element storage package and optical semiconductor device
JP5705471B2 (en) Optical semiconductor element storage package and optical semiconductor device
JP2004356391A (en) Package for encasing semiconductor element and semiconductor device
JP3961388B2 (en) Optical semiconductor element storage package and optical semiconductor device
JP2020042114A (en) Optical circuit
JP6239970B2 (en) TO-CAN type package header and semiconductor device
US20230116287A1 (en) Optical module
JP3881574B2 (en) Optical semiconductor element storage package
JP6408661B2 (en) TO-CAN type package header and semiconductor device
JP3993774B2 (en) Optical semiconductor element storage package
JP2004140188A (en) Package for storing semiconductor element
JP2003179293A (en) Package for containing optical semiconductor element
JP4045110B2 (en) Package for storing semiconductor elements
JP2004294782A (en) Optical semiconductor element-housing package and optical semiconductor device
JP2020061444A (en) Optical device
JP2004152826A (en) Package for housing semiconductor device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080218

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100405

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100413

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100511

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130521

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140521

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees