JP2006294978A - Semiconductor cooling device for vehicle - Google Patents

Semiconductor cooling device for vehicle Download PDF

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JP2006294978A
JP2006294978A JP2005115722A JP2005115722A JP2006294978A JP 2006294978 A JP2006294978 A JP 2006294978A JP 2005115722 A JP2005115722 A JP 2005115722A JP 2005115722 A JP2005115722 A JP 2005115722A JP 2006294978 A JP2006294978 A JP 2006294978A
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temperature
receiving block
heat receiving
vehicle
heat
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JP4836481B2 (en
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Tomoyoshi Makino
友由 牧野
Akio Sekimoto
暁郎 関本
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Toshiba Corp
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Toshiba Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor cooling device for vehicles capable of alarming by exactly detecting the abnormal temperature rise of a heat receiving block. <P>SOLUTION: The semiconductor cooling device for vehicles is provided with a heat receiving block 2 with a semiconductor device 1 attached thereto; a heat releasing unit 3 for releasing heat received by the heat receiving block 2 to an opened unit 4; a temperature sensor 6 attached to the heat receiving block 2; an alarm device 8; and a control unit 7 determining whether the temperature of the heat receiving block 2 is raised abnormally or not based on the detection value of the temperature sensor 6, and drives the alarm device 8 upon abnormal temperature rise to cool the semiconductor device 1 by sending cooling air 5 to the heat dissipating unit 3. In this case, a temperature sensor 6' for detecting the air temperature of the releasing unit 4 is provided at a position which becomes upstream side of the cooling air 5 with respect to the heat dissipating unit 3; and the control unit 7 determines whether the temperature of heat receiving block 2 has been raised abnormally or not, by taking the detection value of temperature sensor 6' for the releasing unit into consideration of the detection value of temperature sensor 6 for the heat receiving block 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、鉄道車両の床下に設置される半導体電力変換装置等の半導体素子を冷却するための車両用半導体冷却装置に関する。   The present invention relates to a semiconductor cooling device for a vehicle for cooling a semiconductor element such as a semiconductor power conversion device installed under a floor of a railway vehicle.

図５は車両用半導体冷却装置の第１の従来例の側面図を示しており、図６は図５のＡ方向矢視図、図７は図５のＢ−Ｂ線断面図、図８は第１の従来例の問題点の説明図、図９、図１０は第１の従来例の受熱ブロックの温度上昇特性図である。   5 shows a side view of a first conventional example of a semiconductor cooling device for a vehicle, FIG. 6 is a view taken in the direction of the arrow A in FIG. 5, FIG. 7 is a sectional view taken along line BB in FIG. FIG. 9 and FIG. 10 are temperature rise characteristics diagrams of the heat receiving block of the first conventional example.

図５乃至図７に示すように、この車両用半導体冷却装置は、半導体素子１が取り付けられる受熱ブロック２を備えており、半導体素子１で発生した熱は、受熱ブロック２を介して冷却器の放熱部３に伝達される。放熱部３は、外気に開放された開放部４に設置されており、放熱部３に冷却風５を送風することにより放熱部３の熱が開放部４に放熱され、半導体素子１が冷却される。   As shown in FIGS. 5 to 7, the vehicle semiconductor cooling device includes a heat receiving block 2 to which the semiconductor element 1 is attached, and heat generated in the semiconductor element 1 is transmitted to the cooler via the heat receiving block 2. It is transmitted to the heat radiating part 3. The heat dissipating part 3 is installed in the open part 4 that is open to the outside air. By blowing the cooling air 5 to the heat dissipating part 3, the heat of the heat dissipating part 3 is dissipated to the open part 4, and the semiconductor element 1 is cooled. The

半導体素子１が取り付けられている受熱ブロック２には温度センサ６が取り付けられており、この温度センサ６には制御ユニット７を介してアラーム装置８が接続されている。制御ユニット７は、温度センサ６の検出値により、半導体素子１の温度を受熱ブロック２を介して間接的に監視し、何らかの要因により放熱部３に目詰まり部９（図８参照）が生じて冷却性能が低下し、受熱ブロック２の温度が異常に上昇して所定温度に達した場合に、アラーム装置８を駆動してアラームを発する。   A temperature sensor 6 is attached to the heat receiving block 2 to which the semiconductor element 1 is attached, and an alarm device 8 is connected to the temperature sensor 6 via a control unit 7. The control unit 7 indirectly monitors the temperature of the semiconductor element 1 via the heat receiving block 2 based on the detection value of the temperature sensor 6, and a clogging portion 9 (see FIG. 8) is generated in the heat radiating portion 3 due to some factor. When the cooling performance is lowered and the temperature of the heat receiving block 2 is abnormally increased and reaches a predetermined temperature, the alarm device 8 is driven to generate an alarm.

すなわち、図９に示す如く、受熱ブロック２の温度Ｔは、開放部４の空気温度をＴ１とすると、通常は実線で示すような曲線１０に沿って上昇するが、放熱部３の冷却性能が低下すると、破線で示すような曲線１１に沿って上昇する。その上昇分ΔＴによって、受熱ブロック２が予め設定した所定温度Ｔ２に達すると、アラーム装置８が作動してアラームを発する。これにより、メンテナンス員が半導体冷却装置のメンテナンスを行い、半導体素子１を異常温度による不具合が生じないように保護している。   That is, as shown in FIG. 9, the temperature T of the heat receiving block 2 usually rises along the curve 10 as shown by the solid line when the air temperature of the opening 4 is T1, but the cooling performance of the heat radiating unit 3 is high. If it falls, it will rise along the curve 11 as shown with a broken line. When the heat receiving block 2 reaches a predetermined temperature T2 set in advance by the increase ΔT, the alarm device 8 is activated to generate an alarm. As a result, the maintenance staff performs maintenance of the semiconductor cooling device, and protects the semiconductor element 1 so as not to cause problems due to abnormal temperatures.

図１１は車両用半導体冷却装置の第２の従来例の側面図、図１２は第２の従来例の密閉部内の温度上昇特性図である。なお、第１の従来例と同一又は類似の部分には同一の符号を付してあり、重複する説明は省略してある。   FIG. 11 is a side view of a second conventional example of the semiconductor cooling device for a vehicle, and FIG. 12 is a temperature rise characteristic diagram in the sealed portion of the second conventional example. In addition, the same code | symbol is attached | subjected to the part which is the same as that of a 1st prior art example, or is similar, and the overlapping description is abbreviate | omitted.

図１１に示すように、この車両用半導体冷却装置は、半導体素子１を稼働する電子部品１２と、電子部品１２が発した熱を放散させる送風機１３とが密閉部１４内に密閉され、密閉部１４の周囲が外気に開放された開放部４となっている。送風機１３には送風機１３を稼働する電源ユニット１５が接続され、この電源ユニット１５には制御ユニット７が接続されている。   As shown in FIG. 11, in this vehicle semiconductor cooling device, an electronic component 12 that operates the semiconductor element 1 and a blower 13 that dissipates heat generated by the electronic component 12 are sealed in a sealed portion 14. The periphery of 14 is an open portion 4 that is open to the outside air. A power supply unit 15 that operates the blower 13 is connected to the blower 13, and a control unit 7 is connected to the power supply unit 15.

送風機１３は、密閉部１４内の空気温度が電子部品１２の許容温度を超えないようにするためのもので、車両用半導体冷却装置が稼働されている間は常時稼働されている。車両用半導体冷却装置の稼働が開始されると、図１２に示すように、密閉部１４内の空気温度Ｔ’は、破線で示すような曲線１７に沿って上昇し、電子部品の許容温度Ｔ４に近づく。しかし、送風機１３により密閉部１４内の空気が攪拌されるため、密閉部１４内の空気温度Ｔが電子部品１２の許容温度Ｔ４に到達することはないので、電子部品１２に不具合が生じることはない。   The blower 13 is for keeping the air temperature in the sealed portion 14 from exceeding the allowable temperature of the electronic component 12 and is always operated while the vehicle semiconductor cooling device is being operated. When the operation of the vehicular semiconductor cooling device is started, as shown in FIG. 12, the air temperature T ′ in the sealed portion 14 rises along the curve 17 as shown by the broken line, and the allowable temperature T4 of the electronic component. Get closer to. However, since the air in the sealed part 14 is agitated by the blower 13, the air temperature T in the sealed part 14 does not reach the allowable temperature T4 of the electronic component 12. Absent.

上記第１の従来例の車両用半導体冷却装置では、次のような問題点が有った。すなわち、図１０に示すように、開放部４の空気温度が低い（Ｔ３とする）冬季等においては、受熱ブロック２の温度Ｔが、曲線１０よりも低い曲線１８に沿って上昇する。第１の従来例の車両用半導体冷却装置では、受熱ブロック２のみに温度センサ６が取り付けられているため、放熱部３の目詰まり等で冷却性能が低下して受熱ブロック２の温度がΔＴ上昇したとしても、破線で示す曲線１９が所定温度Ｔ２に到達しないので、アラーム装置８が作動しない。   The semiconductor cooling device for a vehicle according to the first conventional example has the following problems. That is, as shown in FIG. 10, in the winter season when the air temperature of the opening 4 is low (T3), the temperature T of the heat receiving block 2 rises along the curve 18 that is lower than the curve 10. In the first conventional semiconductor cooling device for a vehicle, since the temperature sensor 6 is attached only to the heat receiving block 2, the cooling performance is lowered due to clogging of the heat radiating section 3 and the temperature of the heat receiving block 2 is increased by ΔT. Even if it does, since the curve 19 shown with a broken line does not reach the predetermined temperature T2, the alarm device 8 does not operate.

そのため、半導体素子１の適切な保護が図れないと共に、開放部４の空気温度が高い夏季等にアラーム装置８の作動が集中し、メンテナンスが必要な車両用半導体冷却装置が急増して代替装置が足りなくなり、車両の運行に影響を及ぼすことが有った。   For this reason, the semiconductor device 1 cannot be properly protected, and the operation of the alarm device 8 is concentrated in summer when the air temperature of the opening 4 is high, so that the number of semiconductor cooling devices for vehicles that require maintenance increases rapidly and alternative devices become available. There was a shortage, which could affect the operation of the vehicle.

また、第２の従来例の車両用半導体冷却装置では、次のような問題点が有った。すなわち、図１２に示すように、開放部４の空気温度が低い冬季等においては、密閉部１４内の空気温度Ｔ’は実線で示すような曲線２０に沿って上昇する。この場合、送風機１３を稼働しなくても、密閉部１４内の空気温度Ｔ’が電子部品１２の許容温度Ｔ４に到達することはない。送風機１３は、その稼働時間で寿命が計算されており、稼働時間を短くすることで長寿命化し、信頼性が向上するとともにランニングコストを低減することができる。   The second conventional semiconductor cooling device for a vehicle has the following problems. That is, as shown in FIG. 12, in the winter season when the air temperature of the open part 4 is low, the air temperature T ′ in the sealed part 14 rises along the curve 20 as shown by the solid line. In this case, even if the blower 13 is not operated, the air temperature T ′ in the sealed portion 14 does not reach the allowable temperature T4 of the electronic component 12. The life of the blower 13 is calculated based on its operating time, and shortening the operating time can prolong the service life, improve the reliability, and reduce the running cost.

本発明は上記事情に鑑みてなされたものであり、第１の目的は、受熱ブロックの温度が異常に上昇したのを正確に検出してアラームを発することができる車両用半導体冷却装置を提供することにある。   The present invention has been made in view of the above circumstances, and a first object thereof is to provide a vehicular semiconductor cooling device capable of accurately detecting that the temperature of the heat receiving block has risen abnormally and issuing an alarm. There is.

また、第２の目的は、密閉部内の空気を攪拌する送風機を長寿命化することができる車両用半導体冷却装置を提供することにある。   Moreover, the 2nd objective is to provide the semiconductor cooling device for vehicles which can prolong the lifetime of the air blower which stirs the air in a sealed part.

上記目的を達成するために、第１の発明は、半導体素子が取り付けられる受熱ブロックと、この受熱ブロックが受熱した熱を外気に開放された開放部に放熱させる放熱部と、前記受熱ブロックに取り付けられた温度センサと、アラーム装置と、前記温度センサの検出値に基づいて前記受熱ブロックの温度が異常に上昇したか否かを判定し、前記受熱ブロックの温度が異常に上昇した場合には前記アラーム装置を駆動する制御ユニットとを備え、前記放熱部に冷却風を送風することにより前記半導体素子を冷却するようにした車両用半導体冷却装置であって、前記放熱部に対して前記冷却風の風上側となる位置に前記開放部の空気温度を検出する温度センサが設けられ、前記制御ユニットは、前記受熱ブロックの温度センサの検出値に前記開放部の温度センサの検出値を加味して前記受熱ブロックの温度が異常に上昇したか否かを判定することを特徴としている。   In order to achieve the above object, a first invention includes a heat receiving block to which a semiconductor element is attached, a heat radiating part for radiating heat received by the heat receiving block to an open part opened to the outside air, and the heat receiving block attached to the heat receiving block. The temperature sensor, the alarm device, and whether the temperature of the heat receiving block has abnormally increased based on the detected value of the temperature sensor, and if the temperature of the heat receiving block has abnormally increased, And a control unit for driving the alarm device, wherein the semiconductor element is cooled by blowing cooling air to the heat dissipating part, wherein the cooling air is supplied to the heat dissipating part. A temperature sensor for detecting the air temperature of the open portion is provided at a position on the windward side, and the control unit opens the open value to a detection value of the temperature sensor of the heat receiving block. Temperature of the heat receiving block in consideration of the detected value of the temperature sensor is characterized by determining whether the abnormally elevated.

また、第２の発明は、半導体素子と、前記半導体素子を稼働する電子部品と、前記電子部品が発した熱を放散させる送風機とが密閉部内に密閉され、前記密閉部の周囲が外気に開放された開放部である車両用半導体冷却装置であって、前記開放部の空気温度を検出する温度センサが設けられ、前記開放部の空気温度が、前記密閉部内の空気温度を前記電子部品の許容温度に近くする値に達した場合に前記送風機を稼働する制御ユニットを備えたことを特徴としている。   According to a second aspect of the present invention, a semiconductor element, an electronic component that operates the semiconductor element, and a blower that dissipates heat generated by the electronic component are sealed in a sealed portion, and the periphery of the sealed portion is open to the outside air. A semiconductor cooling device for a vehicle that is an open part, and a temperature sensor that detects an air temperature of the open part is provided, and the air temperature of the open part determines the air temperature in the sealed part to allow the electronic component. A control unit is provided that operates the blower when a value close to the temperature is reached.

第１の発明の車両用半導体冷却装置によれば、開放部の空気温度に左右されることなく受熱ブロックの温度が異常に上昇したのを正確に検出することが可能となり、メンテナンスが必要な状態になったときに確実にアラームを発することができるため、信頼性が向上する。   According to the vehicle semiconductor cooling device of the first aspect of the present invention, it is possible to accurately detect that the temperature of the heat receiving block has risen abnormally without being influenced by the air temperature of the open portion, and a state requiring maintenance. Since the alarm can be surely issued when it becomes, the reliability is improved.

第２の発明の車両用半導体冷却装置によれば、開放部の空気温度が低い場合には送風機が稼働されないため、送風機の寿命を延ばすことができ、ランニングコストが低減する。   According to the semiconductor cooling device for a vehicle of the second invention, since the blower is not operated when the air temperature in the open portion is low, the life of the blower can be extended and the running cost is reduced.

以下、本発明の一実施形態を図面に基づいて説明する。図１は本発明の第１の実施形態の車両用半導体冷却装置の側面図である。なお、以下の各実施形態において、上記従来技術と同一又は類似の部分には同一の符号を付してあり、重複する説明は省略してある。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a semiconductor cooling device for a vehicle according to a first embodiment of the present invention. In the following embodiments, the same or similar parts as those in the prior art are given the same reference numerals, and duplicate descriptions are omitted.

本実施形態は、上記第１の従来例を改良したものであり、放熱部３に対して冷却風５の風上側となる位置に開放部４の空気温度を検出する温度センサ６’が設けられている。そして、制御ユニット７は、受熱ブロック２の温度センサ６の検出値に開放部４の温度センサ６’の検出値を加味して受熱ブロック２の温度が異常に上昇したか否かを判定するようにしている。   The present embodiment is an improvement of the first conventional example, and a temperature sensor 6 ′ for detecting the air temperature of the open portion 4 is provided at a position on the upstream side of the cooling air 5 with respect to the heat radiating portion 3. ing. Then, the control unit 7 determines whether or not the temperature of the heat receiving block 2 has abnormally increased by adding the detection value of the temperature sensor 6 ′ of the opening 4 to the detection value of the temperature sensor 6 of the heat receiving block 2. I have to.

開放部４の空気温度が低い冬季等において、放熱部３の冷却性能が正常の時には、受熱ブロック２の温度は、図１０に示す従来例と同じく曲線１８に沿って上昇するが、放熱部３の目詰まり等により冷却性能が低下すると、受熱ブロック２の温度は曲線１９に沿って異常に上昇する。このとき、受熱ブロック２の温度が所定温度Ｔ２に達していなくても、制御ユニット７は異常を認識してアラーム装置８を駆動するので、半導体冷却装置にメンテナンスを行うことができる。よって、信頼性が向上するものである。   In the winter season when the air temperature of the open part 4 is low and the cooling performance of the heat radiating part 3 is normal, the temperature of the heat receiving block 2 rises along the curve 18 as in the conventional example shown in FIG. When the cooling performance decreases due to clogging or the like, the temperature of the heat receiving block 2 abnormally rises along the curve 19. At this time, even if the temperature of the heat receiving block 2 does not reach the predetermined temperature T2, the control unit 7 recognizes the abnormality and drives the alarm device 8, so that the semiconductor cooling device can be maintained. Therefore, reliability is improved.

次に、本発明の第２の実施形態を説明する。図２、図３は本発明の第２の実施形態の車両用半導体冷却装置の側面図である。   Next, a second embodiment of the present invention will be described. 2 and 3 are side views of a vehicle semiconductor cooling device according to a second embodiment of the present invention.

本実施形態では、冷却風５が車両の走行により生じる走行風であり、図２に示すように、車両が一方向に走行する際に放熱部３に対して走行風５の風上側となる位置に開放部４の空気温度を検出する温度センサ６’が設けられているだけでなく、放熱部３に対して走行風５の風下側となる位置にも開放部４の空気温度を検出する温度センサ６’’が設けられている。   In the present embodiment, the cooling wind 5 is a traveling wind generated by the traveling of the vehicle, and as shown in FIG. 2, a position that is the windward side of the traveling wind 5 with respect to the heat radiating unit 3 when the vehicle travels in one direction. Is not only provided with a temperature sensor 6 ′ for detecting the air temperature of the opening part 4, but also for detecting the air temperature of the opening part 4 at a position on the leeward side of the traveling wind 5 with respect to the heat radiating part 3. A sensor 6 '' is provided.

このように構成すると、図３に示すように、車両が反対方向に走行して走行風５が逆向きになる際に、風上側となる温度センサ６’’の検出値を用いることで、放熱部３の温度の影響を受けることなく、開放部４の温度を正確に検出することができる。したがって、車両がどちらの方向に走行する場合でも、受熱ブロック２の温度上昇を正確に検出することができるので、信頼性が向上する。   With this configuration, as shown in FIG. 3, when the vehicle travels in the opposite direction and the traveling wind 5 turns in the opposite direction, the detection value of the temperature sensor 6 ″ on the windward side is used to radiate heat. The temperature of the open part 4 can be accurately detected without being affected by the temperature of the part 3. Therefore, even when the vehicle travels in either direction, the temperature rise of the heat receiving block 2 can be accurately detected, so that the reliability is improved.

次に、本発明の第３の実施形態を説明する。図４は本発明の第３の実施形態の車両用半導体冷却装置の側面図である。   Next, a third embodiment of the present invention will be described. FIG. 4 is a side view of a vehicle semiconductor cooling device according to a third embodiment of the present invention.

本実施形態は、上記第２の従来例を改良したものであり、開放部４に空気温度を検出する温度センサ６’’’が設けられ、制御ユニット７は、開放部４の空気温度が、密閉部１４内の空気温度を電子部品１２の許容温度に近くするような値に達した場合に送風機１３を駆動する。   The present embodiment is an improvement of the second conventional example, in which a temperature sensor 6 ′ ″ for detecting the air temperature is provided in the opening portion 4, and the control unit 7 is configured such that the air temperature of the opening portion 4 is When the air temperature in the sealed portion 14 reaches a value that brings the temperature close to the allowable temperature of the electronic component 12, the blower 13 is driven.

このように構成することで、図１２に示すように、開放部４の空気温度が低く（Ｔ３）、密閉部１４の空気温度が曲線２０に沿って上昇するような場合には、送風機１３が稼働されない。したがって、送風機の寿命を延ばすことができ、信頼性が向上するとともにランニングコストが低減する。   With this configuration, as shown in FIG. 12, when the air temperature of the opening portion 4 is low (T3) and the air temperature of the sealing portion 14 rises along the curve 20, the blower 13 is Not working. Therefore, the life of the blower can be extended, reliability is improved, and running cost is reduced.

以上、具体例を挙げて本発明の一実施形態について説明したが、本発明は上記の各実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲で上記の各実施形態に種々の改変を施すことができる。   The embodiments of the present invention have been described above with specific examples. However, the present invention is not limited to the above-described embodiments, and various modifications can be made to the above-described embodiments without departing from the gist of the present invention. Can be modified.

本発明の第１の実施形態の車両用半導体冷却装置の側面図である。It is a side view of the semiconductor cooling device for vehicles of a 1st embodiment of the present invention. 本発明の第２の実施形態の車両用半導体冷却装置の側面図である。It is a side view of the semiconductor cooling device for vehicles of a 2nd embodiment of the present invention. 本発明の第２の実施形態の車両用半導体冷却装置の側面図である。It is a side view of the semiconductor cooling device for vehicles of a 2nd embodiment of the present invention. 本発明の第３の実施形態の車両用半導体冷却装置の側面図である。It is a side view of the semiconductor cooling device for vehicles of the 3rd embodiment of the present invention. 車両用半導体冷却装置の第１の従来例の側面図である。It is a side view of the 1st prior art example of the semiconductor cooling device for vehicles. 図５のＡ方向矢視図である。It is an A direction arrow directional view of FIG. 図５のＢ−Ｂ線断面図である。FIG. 6 is a sectional view taken along line B-B in FIG. 5. 第１の従来例の問題点の説明図である。It is explanatory drawing of the problem of a 1st prior art example. 第１の従来例の受熱ブロックの温度上昇特性図である。It is a temperature rise characteristic view of the heat receiving block of the first conventional example. 第１の従来例の受熱ブロックの温度上昇特性図である。It is a temperature rise characteristic view of the heat receiving block of the first conventional example. 車両用半導体冷却装置の第２の従来例の側面図である。It is a side view of the 2nd prior art example of the semiconductor cooling device for vehicles. 第２の従来例の密閉部内の温度上昇特性図である。It is a temperature rise characteristic figure in the sealed part of the 2nd conventional example.

符号の説明Explanation of symbols

１ 半導体素子
２ 受熱ブロック
３ 放熱部
４ 開放部
５ 冷却風
６、６’、６’’、６’’’ 温度センサ
７ 制御ユニット
８ アラーム装置
１２ 電子部品
１３ 送風機
１４ 密閉部
DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Heat receiving block 3 Heat radiating part 4 Opening part 5 Cooling air 6, 6 ', 6'',6''' Temperature sensor 7 Control unit 8 Alarm device 12 Electronic component 13 Blower 14 Sealing part

Claims (3)

半導体素子が取り付けられる受熱ブロックと、この受熱ブロックが受熱した熱を外気に開放された開放部に放熱させる放熱部と、前記受熱ブロックに取り付けられた温度センサと、アラーム装置と、前記温度センサの検出値に基づいて前記受熱ブロックの温度が異常に上昇したか否かを判定し、前記受熱ブロックの温度が異常に上昇した場合には前記アラーム装置を駆動する制御ユニットとを備え、前記放熱部に冷却風を送風することにより前記半導体素子を冷却するようにした車両用半導体冷却装置であって、
前記放熱部に対して前記冷却風の風上側となる位置に前記開放部の空気温度を検出する温度センサが設けられ、前記制御ユニットは、前記受熱ブロックの温度センサの検出値に前記開放部の温度センサの検出値を加味して前記受熱ブロックの温度が異常に上昇したか否かを判定することを特徴とする車両用半導体冷却装置。 A heat receiving block to which a semiconductor element is attached; a heat radiating portion that radiates heat received by the heat receiving block to an open portion that is open to the outside air; a temperature sensor attached to the heat receiving block; an alarm device; and It is determined whether or not the temperature of the heat receiving block has abnormally increased based on a detection value, and includes a control unit that drives the alarm device when the temperature of the heat receiving block has abnormally increased, and the heat radiating unit A semiconductor cooling device for a vehicle that cools the semiconductor element by blowing cooling air on the vehicle,
A temperature sensor for detecting the air temperature of the open portion is provided at a position on the upstream side of the cooling air with respect to the heat radiating portion, and the control unit is configured to detect a value of the open portion in a detection value of the temperature sensor of the heat receiving block. A vehicle semiconductor cooling device for determining whether or not the temperature of the heat receiving block has risen abnormally in consideration of a detection value of a temperature sensor. 前記冷却風が車両の走行により生じる走行風であり、車両が一方向に走行する際に前記放熱部に対して前記走行風の風上側となる位置と風下側となる位置とにそれぞれ前記開放部の空気温度を検出する温度センサが設けられ、前記制御ユニットは、車両の走行方向に応じて風上側となる温度センサの検出値を用いて前記受熱ブロックの温度が異常に上昇したか否かを判定することを特徴とする請求項１記載の車両用半導体冷却装置。   The cooling wind is a traveling wind generated by the traveling of the vehicle, and when the vehicle travels in one direction, the opening portion is located at a position on the windward side and a position on the leeward side of the traveling wind with respect to the heat radiating portion. A temperature sensor for detecting the air temperature of the heat receiving block is provided, and the control unit determines whether or not the temperature of the heat receiving block has risen abnormally using the detected value of the temperature sensor on the windward side according to the traveling direction of the vehicle. The semiconductor cooling device for a vehicle according to claim 1, wherein the determination is made. 半導体素子と、前記半導体素子を稼働する電子部品と、前記電子部品が発した熱を放散させる送風機とが密閉部内に密閉され、前記密閉部の周囲が外気に開放された開放部である車両用半導体冷却装置であって、前記開放部の空気温度を検出する温度センサが設けられ、前記開放部の空気温度が、前記密閉部内の空気温度を前記電子部品の許容温度に近くする値に達した場合に前記送風機を稼働する制御ユニットを備えたことを特徴とする車両用半導体冷却装置。
A vehicle in which a semiconductor element, an electronic component that operates the semiconductor element, and a blower that dissipates heat generated by the electronic component are sealed in a sealed portion, and the periphery of the sealed portion is an open portion that is open to the outside air The semiconductor cooling device is provided with a temperature sensor that detects an air temperature of the open portion, and the air temperature of the open portion has reached a value that brings the air temperature in the sealed portion close to an allowable temperature of the electronic component. A semiconductor cooling device for a vehicle, comprising a control unit for operating the blower.
JP2005115722A 2005-04-13 2005-04-13 Semiconductor cooling device for vehicle Expired - Fee Related JP4836481B2 (en)

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WO2013046309A1 (en) 2011-09-27 2013-04-04 トヨタ自動車株式会社 Cooling device problem detection device and problem detection method
JP2016072473A (en) * 2014-09-30 2016-05-09 三菱電機株式会社 Cooling abnormality detection system
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WO2013046309A1 (en) 2011-09-27 2013-04-04 トヨタ自動車株式会社 Cooling device problem detection device and problem detection method
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EP2618646A3 (en) * 2012-01-20 2017-01-25 Hitachi, Ltd. Cooler of power converting device for railroad vehicle
JP2016072473A (en) * 2014-09-30 2016-05-09 三菱電機株式会社 Cooling abnormality detection system
CN111526693A (en) * 2019-02-01 2020-08-11 株洲中车时代电气股份有限公司 Radiator of converter

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