JP2006294722A - Electronic component and its manufacturing method - Google Patents

Electronic component and its manufacturing method Download PDF

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Publication number
JP2006294722A
JP2006294722A JP2005110619A JP2005110619A JP2006294722A JP 2006294722 A JP2006294722 A JP 2006294722A JP 2005110619 A JP2005110619 A JP 2005110619A JP 2005110619 A JP2005110619 A JP 2005110619A JP 2006294722 A JP2006294722 A JP 2006294722A
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electronic component
conductive
conductive paste
terminal electrode
element assembly
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JP2005110619A
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Japanese (ja)
Inventor
Hiromasa Ozaki
浩正 尾崎
Hiroyasu Murayama
浩康 村山
Mitsuhiko Nakano
光彦 中野
Toshiyuki Kamaya
敏幸 釜谷
Yasushi Kajima
靖志 鹿島
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2005110619A priority Critical patent/JP2006294722A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component which has good electric characteristics even if it cannot be treated at a high temperature. <P>SOLUTION: The electronic component comprises terminal electrodes 103 formed in a necessary shape by a conductive paste on the element assembly of the component, the conductive portions 102 of the element assembly of the electronic component which are not covered by the terminal electrodes, and plating 104 which covers the terminal electrodes and the conductive portions of the element assembly. Since the plating 104 and the conductive portions 102 of the element assembly of the component are in direct contact, the electronic component becomes not affected by the electric properties of the conductive paste. Even if the element assembly of the electronic component cannot be treated at a high temperature, the electronic component with the terminals which have good and stable electric characteristics can be fabricated by using a resin curing conductive paste. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、小型で面実装用の電子部品及びその製造方法に関するものである。   The present invention relates to a small-sized electronic component for surface mounting and a manufacturing method thereof.

従来の小型の面実装用の電子部品の端子構造は、銀ペースト等の導電性ペーストにて、電子部品素体上の導電部を覆い端子電極を形成し、その端子電極上に半田食われ対策、及び半田濡れ性確保のためにめっき層を形成するという形のものである。図３は従来の電子部品の端子構造を示すものである。   The conventional terminal structure of electronic components for small surface mounting is made of a conductive paste such as silver paste that covers the conductive part on the electronic component body and forms a terminal electrode. In addition, a plating layer is formed to ensure solder wettability. FIG. 3 shows a terminal structure of a conventional electronic component.

図３において、電子部品素体１０１には、その電子部品素体上の導電部１０２を覆う形で導電性ペーストにて端子電極１０３が形成され、その端子電極上にめっき層１０４を形成して端子を構成していた。   In FIG. 3, a terminal electrode 103 is formed on the electronic component element body 101 with a conductive paste so as to cover the conductive portion 102 on the electronic component element body, and a plating layer 104 is formed on the terminal electrode. Configured terminals.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。
特開２００３−３０３７３４号公報 As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2003-303734 A

しかしながら、前記従来の構成では、それぞれの導電性ペーストを用いて端子を形成するにあたり、以下の様な課題を有していた。   However, the conventional configuration has the following problems in forming terminals using the respective conductive pastes.

端子電極形成に用いられる導電性ペーストには、大きく分類して二種類のものがある。   There are roughly two types of conductive pastes used for forming terminal electrodes.

一つは、塗布、仮乾燥を行った後、７００℃から９００℃程度の高温で焼成を行い、金属粒子同士を焼結させ形状保持、導通を確保する、焼結タイプのもの。   One is a sintered type in which after application and temporary drying, firing is performed at a high temperature of about 700 ° C. to 900 ° C. to sinter the metal particles to ensure shape retention and conduction.

もう一つの種類が、ペースト内に含まれる樹脂を、１００℃から２００℃程度の比較的低温中で、硬化収縮させ、形状保持、導通を確保する、樹脂硬化タイプのものである。   Another type is a resin-curing type in which the resin contained in the paste is cured and shrunk at a relatively low temperature of about 100 ° C. to 200 ° C. to ensure shape retention and conduction.

焼結タイプの導電性ペーストを用いる場合は、抵抗値等の電気特性は良好であるが、処理温度が高いため、使用可能な電子部品の種類、および工程が制限されてしまう。   When a sintered type conductive paste is used, the electrical characteristics such as resistance value are good, but since the processing temperature is high, the types of electronic components that can be used and the process are limited.

樹脂硬化タイプの導電性ペーストを用いる場合には、処理温度が低く、ほぼすべての電子部品素体に使用することが可能だが、抵抗値等の電気特性に課題がある。樹脂硬化タイプの導電性ペーストは、樹脂をバインダーとして、金属粉末同士を接触させ、導通を得るため、接触抵抗により抵抗値が高くなったり、外力によりバインダーとなっている樹脂に、変形、亀裂が発生し、金属粉末同士の接触状態が変化し、抵抗値が変動するためである。   When a resin-cured conductive paste is used, the processing temperature is low and it can be used for almost all electronic component bodies, but there are problems in electrical characteristics such as resistance. Resin-curing type conductive paste uses resin as a binder to bring metal powders into contact with each other to obtain electrical continuity. Therefore, the resistance value increases due to contact resistance, or deformation or cracks occur in the resin that is the binder due to external force. This is because the contact state between the metal powders changes and the resistance value fluctuates.

本発明は、前記従来の課題を解決するもので、高温中での処理が不可能な電子部品でも、良好な電気特性をもつ電子部品の端子を提供する事を目的とする。   An object of the present invention is to solve the above-described conventional problems and to provide a terminal of an electronic component having good electrical characteristics even for an electronic component that cannot be processed at high temperatures.

前記従来の課題を解決するために、本発明の請求項１に記載の電子部品の端子構造は、電子部品素体上に導電性ペーストで必要な形状に形成された端子電極と、前記端子電極に覆われていない電子部品素体の導電部と、前記端子電極と電子部品素体の前記導電部と共に覆うめっきとを有し、電子部品素体の導電部が、導電性ペーストを介さずに、端子電極表面のめっきと導通を得る構成とする。   In order to solve the conventional problem, a terminal structure of an electronic component according to claim 1 of the present invention includes a terminal electrode formed in a necessary shape with a conductive paste on an electronic component element body, and the terminal electrode. A conductive portion of the electronic component body that is not covered with, and plating that covers the terminal electrode and the conductive portion of the electronic component body, and the conductive portion of the electronic component body is not provided with a conductive paste. The terminal electrode surface is plated and electrically conductive.

その構成により、高温処理が不可能な電子部品素体に導電性ペーストとして、樹脂硬化タイプのものを用いた場合でも、導電性ペーストの特性に左右されない良好な電気特性をもつ端子を実現する事ができる。   This configuration realizes terminals with good electrical characteristics that are not affected by the characteristics of the conductive paste, even when a resin-cured paste is used as the conductive paste for an electronic component element that cannot be processed at high temperatures. Can do.

また、請求項２に記載の電子部品の製造方法は、電子部品素体上に導電性ペーストを塗布し端子電極を形成した後に、前記導電性ペースト硬化前に粘着性をもつ治具を端子電極の一部に押し当てて導電性ペーストを除去し電子部品素体上の導電部の全体または一部を露出させ、その後、導電性ペーストを硬化し、前記端子電極と前記導電部にめっきを施すことにより、導電性ペースト特性に左右されない良好な電気特性を有する電子部品を実現する事ができる。   According to a second aspect of the present invention, there is provided a method of manufacturing an electronic component, comprising: applying a conductive paste on an electronic component element body to form a terminal electrode; The conductive paste is removed by pressing against the part of the substrate to expose all or part of the conductive part on the electronic component body, and then the conductive paste is cured, and the terminal electrode and the conductive part are plated. Accordingly, it is possible to realize an electronic component having good electrical characteristics that are not influenced by the conductive paste characteristics.

本発明の電子部品およびその製造方法によれば、高温中での処理が不可能な電子部品素体に対しても、樹脂硬化タイプの導電性ペーストを使用しながら、良好で安定した電気特性を持つ端子を有する電子部品を実現する事ができる。   According to the electronic component of the present invention and the manufacturing method thereof, good and stable electrical characteristics can be obtained while using a resin-cured conductive paste even for an electronic component element that cannot be processed at high temperatures. An electronic component having a terminal can be realized.

以下、本発明を実施するための最良の形態について、図面を参照しながら説明する。   The best mode for carrying out the present invention will be described below with reference to the drawings.

（実施の形態１）
図１は、本発明の実施の形態１における電子部品の端子構造の断面図である。図１において、図３と同じ構成要素については同じ符号を用い、説明を省略する。 (Embodiment 1)
1 is a cross-sectional view of a terminal structure of an electronic component according to Embodiment 1 of the present invention. In FIG. 1, the same components as those in FIG.

図１において、電子部品素体１０１上の導電部１０２は、導電性ペーストによる端子電極１０３にすべて覆われておらず、一部がめっき１０４と直接接触している。   In FIG. 1, the conductive portion 102 on the electronic component body 101 is not completely covered by the terminal electrode 103 made of a conductive paste, and a part thereof is in direct contact with the plating 104.

かかる構成によれば、電子部品素体上の導電部１０２は、めっき１０４と直接接触する事により、導電性ペーストの電気特性に影響を受けなくなり、高温での処理が不可能な電子部品でも、樹脂硬化タイプの導電性ペーストを使用しながら、良好で安定した電気特性を持つ端子構造とする事ができる。   According to such a configuration, the conductive part 102 on the electronic component body is not affected by the electrical characteristics of the conductive paste by directly contacting the plating 104, and even an electronic component that cannot be processed at a high temperature, A terminal structure having good and stable electrical characteristics can be obtained while using a resin-cured conductive paste.

図２は、本発明の実施の形態１の端子形状を形成する工法を説明したものである。図２において、図１および図３と同じ構成要素については同じ符号を用い、説明を省略する。   FIG. 2 illustrates a method for forming the terminal shape according to the first embodiment of the present invention. 2, the same components as those in FIGS. 1 and 3 are denoted by the same reference numerals, and the description thereof is omitted.

図２において、図２（ａ）は電子部品素体１０１上に、導電性ペーストによる端子電極１０３を塗布した状態である。この時電子部品素体上の導電部１０２は、端子電極１０３によって覆われている。   In FIG. 2, FIG. 2A shows a state in which a terminal electrode 103 made of a conductive paste is applied on the electronic component body 101. At this time, the conductive portion 102 on the electronic component body is covered with the terminal electrode 103.

図２（ｂ）は、治具２０１を電子部品に押し当てた状態である。   FIG. 2B shows a state in which the jig 201 is pressed against the electronic component.

図２（ｃ）は押し当てた治具２０１を離した状態である。この時、治具２０１上に端子電極１０３の導電性ペーストの一部２０２が転写され、電子部品素体上の導電部１０２は露出する。この時、治具２０１の材質は弾性体で表面に適度の粘着性を持つものを使用する方が良好な結果が得られる。この状態で導電性ペーストによる端子電極１０３を硬化させる。   FIG. 2C shows a state in which the pressed jig 201 is released. At this time, a part 202 of the conductive paste of the terminal electrode 103 is transferred onto the jig 201, and the conductive portion 102 on the electronic component body is exposed. At this time, a better result can be obtained if the material of the jig 201 is an elastic body and has an appropriate adhesiveness on the surface. In this state, the terminal electrode 103 made of a conductive paste is cured.

図２（ｄ）は端子電極上にめっきを施した状態である。   FIG. 2D shows a state in which the terminal electrode is plated.

かかる工法によれば、電子部品素体上の導電部１０２は、めっき層１０４と直接接触することにより、高温での処理が不可能な電子部品素体でも、樹脂硬化タイプの導電性ペーストを使用しながら、良好で安定した電気特性を持つ端子構造を有した電子部品を実現する事ができる。   According to such a construction method, the conductive portion 102 on the electronic component body is in direct contact with the plating layer 104, so that the resin-cured conductive paste is used even for the electronic component body that cannot be processed at a high temperature. However, an electronic component having a terminal structure with good and stable electrical characteristics can be realized.

本発明にかかる電子部品およびその製造方法は、高温中での処理が不可能な電子部品素体に対しても、良好な電気特性を持つ端子を形成する事が可能になるので、高性能、または信頼性を要する電子部品などの端子構造等として有用である。   The electronic component and the manufacturing method thereof according to the present invention can form a terminal having good electrical characteristics even for an electronic component element that cannot be processed at high temperatures. Alternatively, it is useful as a terminal structure of an electronic component or the like that requires reliability.

本発明の実施の形態１における電極構造の断面図Sectional drawing of the electrode structure in Embodiment 1 of this invention 本発明の実施の形態１を形成するための工程図Process drawing for forming Embodiment 1 of the present invention 従来の電子部品の電極構造の断面図Sectional view of the electrode structure of a conventional electronic component

符号の説明Explanation of symbols

１０１ 電子部品素体
１０２ 電子部品素体上の導電部
１０３ 導電性ペーストにて形成された端子電極
１０４ めっき層
２０１ 治具
２０２ 治具に転写された導電性ペースト DESCRIPTION OF SYMBOLS 101 Electronic component body 102 Conductive part on electronic component body 103 Terminal electrode formed with conductive paste 104 Plating layer 201 Jig 202 Conductive paste transferred to jig

Claims (2)

電子部品素体上に導電性ペーストで必要な形状に形成された端子電極と、前記端子電極に覆われていない電子部品素体の導電部と、
前記端子電極と電子部品素体の前記導電部と共に覆うめっきとを備えた電子部品。 A terminal electrode formed in a necessary shape with a conductive paste on the electronic component body, and a conductive portion of the electronic component body not covered with the terminal electrode;
An electronic component comprising the terminal electrode and plating covering the conductive part of the electronic component element body. 電子部品素体上に導電性ペーストを塗布し端子電極を形成した後に、
前記導電性ペースト硬化前に粘着性をもつ治具を端子電極の一部に押し当てて導電性ペーストを除去し電子部品素体上の導電部の全体または一部を露出させ、その後、導電性ペーストを硬化し、前記端子電極と前記導電部にめっきを施して端子を形成する電子部品の製造方法。 After applying the conductive paste on the electronic component body and forming the terminal electrode,
Before the conductive paste is cured, an adhesive jig is pressed against a part of the terminal electrode to remove the conductive paste to expose all or a part of the conductive part on the electronic component body, and then conductive A method of manufacturing an electronic component, comprising: curing a paste and plating the terminal electrode and the conductive portion to form a terminal.
JP2005110619A 2005-04-07 2005-04-07 Electronic component and its manufacturing method Pending JP2006294722A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015186780A1 (en) * 2014-06-04 2015-12-10 株式会社村田製作所 Electronic component and method for producing same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08335529A (en) * 1995-06-07 1996-12-17 Tokin Corp Thin-film chip parts
JP2001076957A (en) * 1999-09-08 2001-03-23 Murata Mfg Co Ltd Ceramic electronic component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08335529A (en) * 1995-06-07 1996-12-17 Tokin Corp Thin-film chip parts
JP2001076957A (en) * 1999-09-08 2001-03-23 Murata Mfg Co Ltd Ceramic electronic component

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015186780A1 (en) * 2014-06-04 2015-12-10 株式会社村田製作所 Electronic component and method for producing same
CN105849831A (en) * 2014-06-04 2016-08-10 株式会社村田制作所 Electronic component and method for producing same
US20170032887A1 (en) * 2014-06-04 2017-02-02 Murata Manufacturing Co., Ltd. Electronic component and manufacturing method for the same
JPWO2015186780A1 (en) * 2014-06-04 2017-04-20 株式会社村田製作所 Electronic component and manufacturing method thereof
US11227715B2 (en) 2014-06-04 2022-01-18 Murata Manufacturing Co., Ltd. Electronic component

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