JP2006279504A - Method for positioning and fixing sensor substrate - Google Patents

Method for positioning and fixing sensor substrate Download PDF

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JP2006279504A
JP2006279504A JP2005095274A JP2005095274A JP2006279504A JP 2006279504 A JP2006279504 A JP 2006279504A JP 2005095274 A JP2005095274 A JP 2005095274A JP 2005095274 A JP2005095274 A JP 2005095274A JP 2006279504 A JP2006279504 A JP 2006279504A
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sensor substrate
sensor
image sensor
measurement
fixing
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Yuji Fukushima
雄二 福島
Tomonari Masuzawa
智成 増沢
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Fujinon Corp
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Fujinon Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To precisely position and fix an image sensor even if the image sensor is slantingly mounted onto a sensor substrate. <P>SOLUTION: The sensor substrate 7 onto which the image sensor 6 is mounted is fastened to an adjustor board 8 temporarily. A base plate 4 to which the sensor substrate 7 should be fixed is placed on the upper surface (support reference surface) of a base tool 5 in which an opening 5a is formed. Pins 12a-12d are brought into contact from the back of the adjusting board 8 so that the adjusting board 8 is pressed against coil springs 10a-10d provided in the base tool 5. The light reception surface of the image sensor 6 is irradiated with measurement light from a laser length measuring machine 15 moving on a measurement reference surface while the amount of movement of the pins 12a-12d is adjusted, and the distance of four points on the light reception surface is measured. The amount of movement of the pins 12a-12d is adjusted so that the measured distance coincides, and then the sensor substrate 7 is fixed to a sensor holding frame 4b of the base plate 4 by an ultraviolet curable adhesive 22. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、イメージセンサが実装されたセンサ基板を、撮影レンズが固定されるベース部材に位置決めして固定する方法に関するものである。   The present invention relates to a method of positioning and fixing a sensor substrate on which an image sensor is mounted to a base member to which a photographing lens is fixed.

ＣＣＤイメージセンサやＣＭＯＳイメージセンサ等のイメージセンサを備えた撮影装置では、撮影レンズに対してイメージセンサを高精度に位置決めして固定することが要求される。イメージセンサはセンサ基板に一体的に実装されているものの、センサ基板上の実装位置には個体差があり、製品ランクによってはセンサ基板とイメージセンサの受光面との間に±０．６°程度の傾きがある。したがって、単にセンサ基板を高精度に位置決めするだけでは必ずしもイメージセンサ自体が適切に位置決めされるわけではない。   In an imaging apparatus including an image sensor such as a CCD image sensor or a CMOS image sensor, it is required to position and fix the image sensor with respect to the imaging lens with high accuracy. Although the image sensor is mounted integrally on the sensor board, there are individual differences in the mounting position on the sensor board, and depending on the product rank, about ± 0.6 ° between the sensor board and the light receiving surface of the image sensor There is a slope. Accordingly, simply positioning the sensor substrate with high accuracy does not necessarily mean that the image sensor itself is properly positioned.

こうした事情から、イメージセンサを位置決めする際には、一般には機械的に決められた標準位置にイメージセンサを実装したセンサ基板を取り付けた後、撮影光学系を通して実際にチャート図を撮影し、イメージセンサからの撮像信号に基づいてチャート図の画像を評価しながらセンサ基板の位置調整を行っている。また、下記特許文献１記載のように、チャート図の代わりに撮影光学系を通して４本の平行光をイメージセンサに入射させて撮影を行い、得られた撮像信号に基づいて各光の入射位置の中心座標を検出するとともに各々の中心座標を用いて演算を行い、その演算結果を評価してセンサ基板の最適位置を求める手法も公知である。
特開平８−２９２１２８ For this reason, when positioning the image sensor, a sensor board with the image sensor mounted is generally mounted at a mechanically determined standard position, and then the chart diagram is actually photographed through the photographing optical system. The position of the sensor substrate is adjusted while evaluating the image of the chart based on the imaging signal from the sensor. Further, as described in Patent Document 1 below, four parallel lights are incident on an image sensor through a photographing optical system instead of a chart, and photographing is performed, and the incident position of each light is determined based on the obtained imaging signal. There is also a known method for detecting the center coordinates and performing calculations using the respective center coordinates and evaluating the calculation results to obtain the optimum position of the sensor substrate.
JP-A-8-292128

しかしながら、上述の方法では、撮像信号に基づいて測定が行われるため、高精度な位置調整が可能になるが、撮像信号を解析するための信号処理システムが複雑化しやすく、また評価に時間がかかるなどの問題があり、デジタルカメラなどのように量産を前提にした撮影装置の位置決め手法としては最適のものとは言い難い。   However, in the above-described method, since measurement is performed based on the imaging signal, it is possible to adjust the position with high accuracy. However, the signal processing system for analyzing the imaging signal is likely to be complicated, and the evaluation takes time. Therefore, it is difficult to say that it is an optimal method for positioning an imaging device that assumes mass production, such as a digital camera.

本発明は、上記問題を解決するためのものであり、小型化した設備によりイメージセンサの位置を効率的に測定し、短時間でイメージセンサを高精度に位置決めして固定することができるセンサ基板の位置決め固定方法を提供することを目的とする。   The present invention is to solve the above-described problems, and can efficiently measure the position of an image sensor with a downsized facility, and can position and fix the image sensor with high accuracy in a short time. An object of the present invention is to provide a positioning and fixing method.

本発明は、イメージセンサが実装されたセンサ基板を、撮影レンズが固定され、撮影レンズを通った光束を通過させる開口が形成されたベース部材に位置決めして固定するにあたり、前記ベース部材を所定の支持基準面を衝にして一定姿勢で支持し、前記センサ基板を仮止めした調整板を前記ベース部材に対して進退及び回動自在な移動機構で保持させ、前記支持基準面と平行な測定基準面上の少なくとも３箇所からベース部材の前記開口を通して測定光をイメージセンサの表面に照射して前記測定基準面とイメージセンサの表面との間の距離を測定し、測定されたこれらの距離が一定となるように前記移動機構によりセンサ基板を変位させた後、センサ基板をベース部材に接着して固定することを特徴としている。また、前記少なくとも３箇所で距離を測定するにあたっては、レーザ測長器を測定基準面上で移動させながら行い、センサ基板を固定するには紫外線硬化型の接着剤を用いるのが簡便である。   The present invention positions and fixes a sensor substrate on which an image sensor is mounted to a base member on which a photographing lens is fixed and an opening through which a light beam passing through the photographing lens is formed is fixed. A measurement reference parallel to the support reference plane, which is supported in a fixed posture with the support reference plane as a counter and holding the adjustment plate temporarily fixed to the base member with a moving mechanism that can be moved forward and backward with respect to the base member. The surface of the image sensor is irradiated with measurement light from at least three locations on the surface through the opening of the base member to measure the distance between the measurement reference surface and the surface of the image sensor, and these measured distances are constant. After the sensor substrate is displaced by the moving mechanism so as to become, the sensor substrate is bonded and fixed to the base member. Further, when measuring the distance at the at least three locations, it is convenient to use an ultraviolet curable adhesive to fix the sensor substrate while moving the laser length measuring device on the measurement reference plane.

本発明によれば、測定器を用いてイメージセンサの位置を測定し、この測定値に基づいて移動機構により調整板を移動してイメージセンサを位置決めするので、大量の画像データを扱う画像処理などの手法と比較して、簡便かつ迅速にセンサ基板の位置決めを行ってその最適位置にセンサ基板を固定することができ、作業の容易化及び設備の小型化が可能となる。   According to the present invention, the position of the image sensor is measured using the measuring device, and the image sensor is positioned by moving the adjustment plate by the moving mechanism based on the measured value, so that image processing that handles a large amount of image data, etc. Compared with this method, the sensor substrate can be easily and quickly positioned and fixed at the optimum position, and the work can be facilitated and the equipment can be downsized.

図１において、本発明を適用した位置調整装置は、図中の上面が支持基準面となるベース治具５と、イメージセンサ６を実装したセンサ基板７が仮止めされる調整板８と、調整板８の上面側に当接される４本のピン１２ａ〜１２ｄとを有する。これらのピン１２ａ〜１２ｄは、図示を省略した調整操作部からの操作入力に応じて個別に上下方向に進退移動し、一斉に移動させたときには調整板８を上下に進退させ、また一部のピンだけを移動させたときには調整板８を傾ける移動機構の一部を構成している。調整板８のサイズはセンサ基板７の外形よりも大きく、図示のようにセンサ基板７の周囲から４辺が突出するようにしてある。   In FIG. 1, a position adjusting device to which the present invention is applied includes a base jig 5 whose upper surface in the drawing is a support reference surface, an adjustment plate 8 on which a sensor substrate 7 on which an image sensor 6 is mounted is temporarily fixed, It has four pins 12 a to 12 d that are in contact with the upper surface side of the plate 8. These pins 12a to 12d are individually moved up and down in response to an operation input from an adjustment operation unit (not shown), and when moved together, the adjustment plate 8 is moved up and down. When only the pin is moved, it constitutes a part of a moving mechanism for tilting the adjustment plate 8. The size of the adjustment plate 8 is larger than the outer shape of the sensor substrate 7, and four sides protrude from the periphery of the sensor substrate 7 as shown.

ベース治具５の上面にはデジタルカメラの構成部材となるベースプレート４が載置される。ベースプレート４は、その前面側に撮影レンズを内蔵したレンズ鏡筒３が固定され、背面側にはセンサ基板７を固定するベース部材となるもので、このベースプレート４にはさらに撮影レンズを通った光束をイメージセンサ６へと通過させる開口４ａが形成されている。レンズ鏡筒３は、ベースプレート４にセンサ基板７を位置決め固定した後の別工程で固定されるが、仮想の撮影光軸３ａはベースプレート４の鏡筒取り付け面に対して垂直に設定されている。したがって、ベース治具５に前面が接するようにベースプレート４を載置したとき、撮影光軸３ａはベース治具５の支持基準面に対しても垂直となる。   On the upper surface of the base jig 5, a base plate 4 serving as a constituent member of the digital camera is placed. The base plate 4 has a lens barrel 3 with a photographing lens built in on the front side thereof and a base member for fixing the sensor substrate 7 on the back side. The base plate 4 further has a light beam passing through the photographing lens. Is formed through the image sensor 6. The lens barrel 3 is fixed in a separate process after positioning and fixing the sensor substrate 7 to the base plate 4, but the virtual photographing optical axis 3 a is set perpendicular to the lens barrel mounting surface of the base plate 4. Therefore, when the base plate 4 is placed so that the front surface is in contact with the base jig 5, the photographing optical axis 3 a is also perpendicular to the support reference plane of the base jig 5.

ベース治具５の中央には開口５ａが形成され、調整板８に仮止めされたセンサ基板７のイメージセンサ６をベース治具５の底面側から見込むことができるようにしてある。また、ベース治具５には、前述のピン１２ａ〜１２ｄに対応して４本のコイルバネ１０ａ〜１０ｄが設けられ、その上端が調整板８の前面に当接して調整板８を上方へと付勢する。   An opening 5 a is formed at the center of the base jig 5 so that the image sensor 6 of the sensor substrate 7 temporarily fixed to the adjustment plate 8 can be seen from the bottom surface side of the base jig 5. The base jig 5 is provided with four coil springs 10a to 10d corresponding to the pins 12a to 12d, and the upper end of the base jig 5 abuts against the front surface of the adjustment plate 8 so that the adjustment plate 8 is attached upward. To force.

ベースプレート４の背面側には枠状に突出したセンサ保持枠４ｂが一体に形成され、このセンサ保持枠４ｂにセンサ基板７が固定される。ベースプレート４の前面にはレンズ鏡筒３が固定されることになるため、センサ基板７を固定するにあたっては、イメージセンサ６の受光面がべースプレート４の前面から一定の距離となるように、しかもイメージセンサ６の受光面が光軸３ａに対して垂直になるように位置決めする必要がある。   A sensor holding frame 4b protruding in a frame shape is integrally formed on the back side of the base plate 4, and the sensor substrate 7 is fixed to the sensor holding frame 4b. Since the lens barrel 3 is fixed to the front surface of the base plate 4, when fixing the sensor substrate 7, the light receiving surface of the image sensor 6 should be a certain distance from the front surface of the base plate 4. It is necessary to position the light receiving surface of the image sensor 6 so as to be perpendicular to the optical axis 3a.

以下、上述した位置調整装置２を用い、センサ基板７をベースプレート４に正しく位置決めして固定する工程について説明する。まず、調整板８にセンサ基板７を仮止めする。この仮止めには精度を高くする必要はないので、例えば両面テープなどを用いることも可能であり、必要に応じて調整板８にフックなどの機械的な係止保持機構を設けておいてもよい。なお、センサ基板７の背面側にコネクタ１１ａ，１１ｂが突出している場合を考慮し、調整板８には図示のように開口８ａ，８ｂを設けておく。   Hereinafter, the process of correctly positioning and fixing the sensor substrate 7 to the base plate 4 using the position adjusting device 2 described above will be described. First, the sensor substrate 7 is temporarily fixed to the adjustment plate 8. Since it is not necessary to increase the accuracy of the temporary fixing, for example, a double-sided tape or the like can be used. If necessary, a mechanical locking and holding mechanism such as a hook may be provided on the adjusting plate 8. Good. In consideration of the case where the connectors 11a and 11b protrude from the back side of the sensor substrate 7, openings 8a and 8b are provided in the adjustment plate 8 as illustrated.

ベース治具５にベースプレート４の前面が密着するように載置し、ピン１２ａ〜１２ｄを下方に押し出してベースプレート４の背面側に調整板８で保持したセンサ基板７を近づけてゆく。センサ基板７をベースプレート４のセンサ保持枠４ｂに接近させてゆくと、ベース治具５に組み付けられたコイルバネ１０ａ〜１０ｄの先端が調整板８の前面に押しつけられ、さらにピン１２ａ〜１２ｄを突出させることによって調整板８はコイルバネ１０ａ〜１０ｄを縮めながらベースプレート４に接近する。   The base plate 4 is placed so that the front surface of the base plate 4 is in close contact with the base jig 5, and the pins 12 a to 12 d are pushed downward to bring the sensor substrate 7 held by the adjustment plate 8 closer to the back surface side of the base plate 4. When the sensor substrate 7 is moved closer to the sensor holding frame 4b of the base plate 4, the tips of the coil springs 10a to 10d assembled to the base jig 5 are pressed against the front surface of the adjustment plate 8, and the pins 12a to 12d are further projected. As a result, the adjusting plate 8 approaches the base plate 4 while contracting the coil springs 10a to 10d.

このようにして調整板８を移動させる間に、図２に示すように、ベース治具５の下面側から開口５ａを通してレーザ測長器１５からの測定光をイメージセンサ６の受光面に照射し、その反射光に基づいてイメージセンサ６の受光面までの距離を測定する。レーザ測長器１５は、ベース治具５の支持基準面から一定距離離れ、かつ支持基準面に対して平行なガイドプレート１６上に移動自在に支持され、モータ１７ａ，１７ｂの駆動により測定基準面上をＸＹ方向に移動させることができる。   While moving the adjustment plate 8 in this way, as shown in FIG. 2, the measurement light from the laser length measuring device 15 is applied to the light receiving surface of the image sensor 6 from the lower surface side of the base jig 5 through the opening 5a. The distance to the light receiving surface of the image sensor 6 is measured based on the reflected light. The laser length measuring device 15 is movably supported on a guide plate 16 that is spaced apart from the support reference surface of the base jig 5 and parallel to the support reference surface, and is driven by motors 17a and 17b. The top can be moved in the XY directions.

モータ１７ａ，１７ｂはコントローラ１８からのコマンドにより駆動され、例えば図３に示すように、イメージセンサ６の受光面の中で有効画素領域２３から外れた四隅の測定点Ａ１〜Ａ４を測定する位置にレーザ測長器１５を順次に移動させる。その移動プログラムは予めコントローラ１８に用意されており、コントローラ８はレーザ測長器１５を順次に移動させながら測定点Ａ１〜Ａ４までの距離を測定する。測定して得た距離信号はコントローラ１８に入力され、各々の距離データが表示器１９にデジタル表示される。なお、レーザ測長器１５はガイドプレート１６の上に一定高さだけ突出しているから、レーザ測長器１５は自身のセンサヘッド前面からイメージセンサ６の受光面までの距離を測長する。したがって、厳密にはレーザ測長器１５をガイドプレート１６に沿って移動させたときのセンサヘッド前面の軌跡を含む面が測定基準面となるが、ガイドプレート１６の上面からレーザ測長器１５のセンサヘッド前面までの高さは既知であるから、便宜的にはガイドプレート１６の上面を測定基準面とみなしても差し支えない。   The motors 17a and 17b are driven by commands from the controller 18, and as shown in FIG. 3, for example, the measurement points A1 to A4 at the four corners outside the effective pixel region 23 are measured on the light receiving surface of the image sensor 6. The laser length measuring device 15 is moved sequentially. The movement program is prepared in the controller 18 in advance, and the controller 8 measures the distance to the measurement points A1 to A4 while moving the laser length measuring device 15 sequentially. The distance signal obtained by the measurement is input to the controller 18, and each distance data is digitally displayed on the display 19. Since the laser length measuring device 15 protrudes on the guide plate 16 by a certain height, the laser length measuring device 15 measures the distance from the front surface of its own sensor head to the light receiving surface of the image sensor 6. Therefore, strictly speaking, the surface including the locus of the front surface of the sensor head when the laser length measuring device 15 is moved along the guide plate 16 becomes the measurement reference surface, but the surface of the laser length measuring device 15 extends from the upper surface of the guide plate 16. Since the height to the front surface of the sensor head is known, for convenience, the upper surface of the guide plate 16 may be regarded as the measurement reference surface.

調整板８を移動させるための移動機構を構成する４本のピン１２ａ〜１２ｄは、調整操作部からの操作入力に応じて一斉にまたは個別にその突出量を変えることができるようになっている。したがって、測定点Ａ１〜Ａ４までの全ての距離が一定範囲内に収まるように４本のピン１２ａ〜１２ｄを出入りさせて調整板８の位置調整を行えば、センサ基板７上でのイメージセンサ６の実装位置精度にかかわらず、イメージセンサ６の受光面をガイドプレート１６に対して正確に位置決めすることができる。ガイドプレート６は、ベース治具５の支持基準面に平行であり、また支持基準面からの距離は予め決められているから、以上の調整によりイメージセンサ６はベースプレート４に対して正確に位置決めされるようになる。   The four pins 12a to 12d constituting the moving mechanism for moving the adjustment plate 8 can change the protruding amount at the same time or individually according to the operation input from the adjustment operation unit. . Therefore, if the position of the adjustment plate 8 is adjusted by moving the four pins 12a to 12d so that all the distances to the measurement points A1 to A4 are within a certain range, the image sensor 6 on the sensor substrate 7 is adjusted. Regardless of the mounting position accuracy, the light receiving surface of the image sensor 6 can be accurately positioned with respect to the guide plate 16. Since the guide plate 6 is parallel to the support reference surface of the base jig 5 and the distance from the support reference surface is determined in advance, the image sensor 6 is accurately positioned with respect to the base plate 4 by the above adjustment. Become so.

こうして調整板８を移動調節した後、その調節状態を保ったままで図２に示すようにセンサ基板７とセンサ保持枠４ｂの上端との間に紫外線硬化型の接着剤２２を充填し、紫外線を照射して硬化させる。これによりセンサ基板７がセンサ保持枠４ｂに固着され、イメージセンサ６の受光面は光軸３ａ方向で支持基準面から一定の距離となる位置に、しかも支持基準面に対して平行に保たれるようになる。そして、センサ基板７に対してイメージセンサ６の受光面が０．６°程度傾いて実装されていたとしても、上記手法を用いてセンサ基板７をベースプレート４に固着することにより支持基準面に対するイメージセンサ６の受光面の傾きを±０．２°以内に抑えることができる。もちろん、この値はレーザ測長器１５の分解能を高めることによって、さらに小さく抑えることも可能である。   After the adjustment plate 8 is moved and adjusted in this manner, the ultraviolet curable adhesive 22 is filled between the sensor substrate 7 and the upper end of the sensor holding frame 4b as shown in FIG. Irradiate to cure. As a result, the sensor substrate 7 is fixed to the sensor holding frame 4b, and the light receiving surface of the image sensor 6 is held at a position at a certain distance from the support reference surface in the direction of the optical axis 3a and parallel to the support reference surface. It becomes like this. Even if the light receiving surface of the image sensor 6 is mounted with an inclination of about 0.6 ° with respect to the sensor substrate 7, the image with respect to the support reference surface is secured by fixing the sensor substrate 7 to the base plate 4 using the above method. The inclination of the light receiving surface of the sensor 6 can be suppressed within ± 0.2 °. Of course, this value can be further reduced by increasing the resolution of the laser length measuring device 15.

以上、図示の形態に基づいて本発明について説明してきたが、組み立て精度に応じてレーザ測長器１５による測定点を増減したり、またレーザ測長器１５を光軸３ａと平行な軸の回りに回転して各測定点に移動させる構成を採ることも可能である。また、センサ基板７を仮止めする調整板８の移動機構についても、ピン１２ａ〜１２ｄを送りネジで進退させたり、これらのピンの本数を３本にしたり、あるいはリンク機構などを用いて調整板８を進退させたり傾けたりすることも可能である。なお、レーザ測長器の代わりに測定基準面上で移動自在にした顕微鏡を用い、測定点Ａ１〜Ａ４にピント合わせを行ったときのピント合わせ量を測定基準面から測定点までの距離に対応する測定値として検出することも可能である。さらに、本発明は一般のデジタルカメラのみならず、イメージセンサを内蔵した携帯電話器やＰＤＡなどの他の携帯型機器にも等しく適用することができる。   As described above, the present invention has been described based on the illustrated form. However, the number of measurement points by the laser length measuring device 15 is increased or decreased according to the assembly accuracy, and the laser length measuring device 15 is rotated around an axis parallel to the optical axis 3a. It is also possible to adopt a configuration in which it is rotated and moved to each measurement point. The moving mechanism of the adjusting plate 8 that temporarily fixes the sensor substrate 7 is also adjusted by using the feed mechanism to move the pins 12a to 12d back and forth, or by using three links. It is also possible to move 8 forward and backward or tilt it. Use a microscope that can be moved on the measurement reference plane instead of the laser measuring instrument, and the focus amount when focusing on the measurement points A1 to A4 corresponds to the distance from the measurement reference plane to the measurement point. It is also possible to detect it as a measured value. Furthermore, the present invention can be equally applied not only to a general digital camera but also to other portable devices such as a cellular phone and a PDA with a built-in image sensor.

本発明を適用した位置調整装置の構成を示す説明図である。It is explanatory drawing which shows the structure of the position adjustment apparatus to which this invention is applied. 位置調整装置の断面図である。It is sectional drawing of a position adjustment apparatus. イメージセンサの測定位置を示す説明図である。It is explanatory drawing which shows the measurement position of an image sensor.

符号の説明Explanation of symbols

３ レンズ鏡筒
４ ベースプレート
４ａ 開口
４ｂ センサ保持枠
５ ベース冶具
６ イメージセンサ
７ センサ基板
８ 調整板
１０ａ〜１０ｄ コイルバネ
１２ａ〜１２ｄ ピン
１５ レーザ測長器
１６ ガイドプレート
２２ 接着剤
DESCRIPTION OF SYMBOLS 3 Lens barrel 4 Base plate 4a Opening 4b Sensor holding frame 5 Base jig 6 Image sensor 7 Sensor board 8 Adjustment plate 10a-10d Coil spring 12a-12d Pin 15 Laser length measuring device 16 Guide plate 22 Adhesive

Claims (2)

イメージセンサが実装されたセンサ基板を、撮影レンズが固定され、撮影レンズを通った光束を通過させる開口が形成されたベース部材に位置決めして固定する方法において、
前記ベース部材を所定の支持基準面を衝にして一定姿勢で支持し、前記センサ基板を仮止めした調整板を前記ベース部材に対して進退及び回動自在な移動機構で保持させ、前記支持基準面と平行な測定基準面上の少なくとも３箇所からベース部材の前記開口を通して測定光をイメージセンサの表面に照射して前記測定基準面とイメージセンサの表面との間の距離を測定し、測定されたこれらの距離が一定となるように前記移動機構によりセンサ基板を変位させた後、センサ基板をベース部材に接着して固定することを特徴とするセンサ基板の位置決め固定方法。 In a method of positioning and fixing a sensor substrate on which an image sensor is mounted to a base member on which an imaging lens is fixed and an opening through which a light beam passes through the imaging lens is formed,
The base member is supported in a fixed posture with a predetermined support reference surface as an impact, and the adjustment plate temporarily fixing the sensor substrate is held by a moving mechanism that can move forward and backward with respect to the base member. The measurement light is irradiated onto the surface of the image sensor from at least three locations on the measurement reference plane parallel to the surface through the opening of the base member, and the distance between the measurement reference plane and the surface of the image sensor is measured. A method of positioning and fixing a sensor substrate, comprising: displacing the sensor substrate by the moving mechanism so that these distances are constant, and then fixing the sensor substrate by adhering to the base member. 前記少なくとも３箇所での距離の測定は、レーザ測長器を測定基準面上で移動させながら行われることを特徴とする請求項１記載のセンサ基板の位置決め固定方法。

2. The method for positioning and fixing a sensor substrate according to claim 1, wherein the measurement of the distance at the at least three locations is performed while moving the laser length measuring device on the measurement reference plane.

JP2005095274A 2005-03-29 2005-03-29 Method for positioning and fixing sensor substrate Pending JP2006279504A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012049621A (en) * 2010-08-24 2012-03-08 Fuji Mach Mfg Co Ltd Image surface adjustment method of camera device, and image surface adjustment device
CN103516967A (en) * 2012-06-18 2014-01-15 三星电机株式会社 Apparatus for manufacturing camera module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012049621A (en) * 2010-08-24 2012-03-08 Fuji Mach Mfg Co Ltd Image surface adjustment method of camera device, and image surface adjustment device
CN103516967A (en) * 2012-06-18 2014-01-15 三星电机株式会社 Apparatus for manufacturing camera module

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