JP2006267644A - Image forming apparatus - Google Patents

Image forming apparatus Download PDF

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JP2006267644A
JP2006267644A JP2005086597A JP2005086597A JP2006267644A JP 2006267644 A JP2006267644 A JP 2006267644A JP 2005086597 A JP2005086597 A JP 2005086597A JP 2005086597 A JP2005086597 A JP 2005086597A JP 2006267644 A JP2006267644 A JP 2006267644A
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light
optical sensor
mounting substrate
sensor module
light emitting
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Ryuhei Shoji
龍平 庄司
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Canon Inc
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Canon Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an image forming apparatus provided with an inexpensive sensor having high detection accuracy and capable of reducing the SN ratio of stray light transmitted into a packaging substrate and detected by a light receiving element by applying light shielding coating between the packaging substrate and the optical sensor in an optical sensor module. <P>SOLUTION: In the image forming apparatus comprising the packaging substrate and the optical sensor module constituted of mounting at least one light emitting element and at least one light receiving element on the packaging substrate, the light shielding coating is applied between the packaging substrate and the optical elements in the optical sensor module. The light shielding coating consists of the same material as silk indicating an element packaged on the packaging substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、単一基板上に発光及び受光素子が併設された光センサモジュールを備えた画像形成装置に関するものである。   The present invention relates to an image forming apparatus including an optical sensor module in which light emitting and light receiving elements are provided on a single substrate.

近年の開発される画像形成装置には、高速化、高画質化の実現するために数多くのセンサが搭載されている。図2に画像形成装置の構成を示す。又、図3に画像形成装置内に設置される光学センサの一例を示す。   An image forming apparatus developed in recent years is equipped with a large number of sensors in order to realize high speed and high image quality. FIG. 2 shows the configuration of the image forming apparatus. FIG. 3 shows an example of an optical sensor installed in the image forming apparatus.

図において、101は静電潜像を形成する感光ドラム(Y、M、C、Kはイエロ、マゼンタ、シアン、ブラックを示す)、104は各感光ドラムを駆動するモータ、110は画像信号に応じて露光を行い感光ドラム101上に静電潜像を形成するレーザスキャナ、111はトナーを格納する現像器、103は現像器111より排出されたトナーを感光ドラム101上に排出する現像ローラ、100は用紙を各色の画像形成部に順次搬送する無端状の搬送ベルトである。   In the figure, 101 is a photosensitive drum for forming an electrostatic latent image (Y, M, C, and K are yellow, magenta, cyan, and black), 104 is a motor that drives each photosensitive drum, and 110 is in accordance with an image signal. A laser scanner that forms an electrostatic latent image on the photosensitive drum 101 by exposure to light, 111 a developing device that stores toner, 103 a developing roller that discharges toner discharged from the developing device 111 onto the photosensitive drum 101, 100 Is an endless conveyance belt that sequentially conveys the paper to the image forming section of each color.

又、115はモータとギア等で成る駆動手段と接続され搬送ベルト100を駆動する駆動ローラ、116は駆動ローラ115を駆動するモータ、117は用紙に転写されたトナーを溶融、固着する定着器、102は感光ドラムの基準位置を検出する基準位置センサ、112は用紙カセットから用紙を搬送するピックアップローラ、113,114は用紙を搬送ベルト100に導く搬送ローラである。   Reference numeral 115 denotes a driving roller that is connected to driving means including a motor and a gear to drive the conveying belt 100, 116 is a motor that drives the driving roller 115, 117 is a fixing device that melts and fixes the toner transferred onto the paper, Reference numeral 102 denotes a reference position sensor that detects the reference position of the photosensitive drum, 112 denotes a pickup roller that conveys the sheet from the sheet cassette, and 113 and 114 denote conveyance rollers that guide the sheet to the conveyance belt 100.

180は用紙カセット上の用紙の有り無しを検出する用紙検出センサ、160は用紙カセットより搬送された用紙がベルト上に侵入するタイミングを検出する先端レジ検出センサ、150は搬送ベルト上に現像したトナーパッチから各色間の色ずれ量又はトナーパッチの載り量を検出する色レジ色濃度検出センサ、170は用紙の搬送速度と定着器の回転速度誤差から発生する定着器前で発生する用紙のループ量を検出するループ量検出センサである。   180 is a paper detection sensor for detecting the presence or absence of paper on the paper cassette, 160 is a leading edge registration detection sensor for detecting the timing at which the paper conveyed from the paper cassette enters the belt, and 150 is the toner developed on the conveyance belt. A color registration color density detection sensor 170 for detecting a color misregistration amount between each color or a toner patch loading amount from a patch, 170 is a paper loop amount generated in front of the fixing device, which is generated from a paper conveyance speed and a fixing device rotation speed error. It is a loop amount detection sensor for detecting.

不図示の外部機器、例えばPCからプリントすべきデータがプリンタに送られ、プリンタエンジンの方式に応じた画像形成が終了しプリント可能状態となると、用紙検出センサ180によりカセット上に用紙のあることを確認した後、用紙カセットから用紙が供給され搬送ベルト100に到達し、搬送ベルト100により用紙が各色の画像形成部に順次搬送される。   When data to be printed is sent from an external device (not shown) such as a PC to the printer and image formation according to the printer engine system is completed and printing is possible, the paper detection sensor 180 indicates that there is paper on the cassette. After confirmation, the paper is supplied from the paper cassette and reaches the conveyance belt 100, and the conveyance belt 100 sequentially conveys the paper to the image forming units for each color.

搬送ベルト100による用紙の搬送を先端レジ検出センサ160により検出し、そのタイミングを合せて各色の画像信号が各レーザスキャナ110に送られ、感光ドラム101上に静電潜像が形成され、現像器111及び現像ローラ103により、静電潜像がトナーで現像され、図示しない転写部で用紙上に転写される。   Paper conveyance by the conveyance belt 100 is detected by a leading edge registration detection sensor 160, and image signals of each color are sent to the laser scanners 110 at the same timing to form an electrostatic latent image on the photosensitive drum 101. The electrostatic latent image is developed with toner by 111 and the developing roller 103 and is transferred onto a sheet by a transfer unit (not shown).

同図においては、K、C、M、Yの順に順次画像形成される。その後、用紙は、搬送ベルトから分離され、定着器117で熱によってトナー像が用紙上に定着され、外部へ排出される。このとき、用紙が定着器に突入する搬送速度と定着器の回転速度の違いによる用紙のループ量をループ検出センサ170にて検出し、ループ量が最小になるように、又はループ量が或る所望の値になるように定着器の速度をコントロールする。上記工程を経て、外部機器から指示された画像情報は用紙上に印刷される。   In the figure, images are sequentially formed in the order of K, C, M, and Y. Thereafter, the sheet is separated from the conveyance belt, and the toner image is fixed on the sheet by heat by the fixing device 117 and discharged to the outside. At this time, the loop amount of the paper due to the difference between the conveyance speed at which the paper enters the fixing device and the rotational speed of the fixing device is detected by the loop detection sensor 170 so that the loop amount is minimized or there is a loop amount. Control the speed of the fuser to achieve the desired value. Through the above steps, the image information instructed from the external device is printed on the paper.

又、画像形成時以外の動作として、搬送ベルト上に所望のタイミングにてトナー像を転写し、そのトナー像の色ずれ量、色濃度を色レジ色濃度検出センサ150にて検出するキャリブレーション操作も行われる。   Further, as an operation other than image formation, a calibration operation is performed in which a toner image is transferred onto a conveyance belt at a desired timing, and the color registration color density detection sensor 150 detects the color misregistration amount and color density of the toner image. Is also done.

上記で用いられるセンサ群は、より高精度な検出を行うため、光学センサを良く用いられる。又、最近のレーザービームプリンタ(LBP)に対する小型化の要求から、搭載するセンサに関しても、例えば発光部と受光部が単一基板上に実装された、小型の光センサモジュールが利用されている。( 例えば特許文献1参照)
図4、図14及び図15に、従来用いられる小型光センサモジュールの一例として色レジ色濃度検出センサの分解斜視図、側面図及び正面図を示す。
The sensor group used above often uses an optical sensor in order to perform detection with higher accuracy. Further, due to recent demands for miniaturization of laser beam printers (LBPs), for example, a small optical sensor module in which a light emitting unit and a light receiving unit are mounted on a single substrate is used as a sensor to be mounted. (For example, see Patent Document 1)
4, FIG. 14, and FIG. 15 are an exploded perspective view, a side view, and a front view of a color registration color density detection sensor as an example of a conventionally used small optical sensor module.

150は光センサを実装している実装基板、154は搬送ベルト100上に光を照射する発光素子、155は発光素子154が照射した光の搬送ベルト100からの直接反射光を受光する正反射光受光素子、153は発光素子154が照射した光の搬送ベルト100からの乱反射光を受光する乱反射光受光素子、152は外部からの光を遮断し、発光素子からの照射光及び受光素子への反射光の光路を生成するハウジング、156は外部からの光を遮断するカバー、100は搬送ベルト、157は搬送ベルト100上に転写されたトナーパッチ、158は実装基板上に実装される抵抗器、159は実装された素子を明示するシルクを示している。   150 is a mounting substrate on which an optical sensor is mounted, 154 is a light emitting element that irradiates light onto the conveyor belt 100, 155 is a specularly reflected light that receives light directly reflected from the conveyor belt 100 of light irradiated by the light emitting element 154 A light receiving element, 153 is a diffusely reflected light receiving element that receives diffusely reflected light from the conveying belt 100 of light irradiated by the light emitting element 154, and 152 is a block for blocking light from the outside, and the reflected light from the light emitting element and reflected to the light receiving element. A housing for generating an optical path of light, 156 is a cover for blocking light from the outside, 100 is a conveyor belt, 157 is a toner patch transferred onto the conveyor belt 100, 158 is a resistor mounted on a mounting substrate, 159 Indicates a silk that clearly indicates the mounted element.

色レジ色濃度検出センサは、発光素子の照射した光の反射光量から色レジ又は色濃度を検出している。つまり、トナーパッチのセンサへの進入時の発生する反射光量の変化から色レジを、又、トナーパッチに載り量による反射光量の違いから色濃度をそれぞれ検出している。正・乱両受光素子は、トナーの色毎の反射特性、使用する搬送ベルトの種類等に、用途、条件によって検出結果をそれぞれ切り替えて使用する。   The color registration color density detection sensor detects a color registration or color density from the amount of reflected light of light emitted from the light emitting element. In other words, the color registration is detected from the change in the amount of reflected light that occurs when the toner patch enters the sensor, and the color density is detected from the difference in the amount of reflected light depending on the amount applied to the toner patch. Both the positive and random light receiving elements are used by switching the detection results depending on the application and conditions according to the reflection characteristics for each color of toner, the type of transport belt to be used, and the like.

特開2001−194838号公報JP 2001-194838 A

しかしながら、これまでモジュール構成では、発光素子が照射する光が実装基板上に透過し、その透過光(以下、「迷光」と記す)が実装基板上を伝播し、受光素子にまで達してしまう。   However, until now, in the module configuration, light emitted from the light emitting element is transmitted on the mounting substrate, and the transmitted light (hereinafter referred to as “stray light”) propagates on the mounting substrate and reaches the light receiving element.

図16に迷光を併記した光センサモジュールの正面図を示す。   FIG. 16 shows a front view of the optical sensor module with stray light.

図16における破線の矢印は迷光を示している。図に示すように実装基板が導波路を形成し迷光が受光素子まで到達する。そのため、受光素子が実装基板内の迷光をも搬送ベルトからの反射光として検出してしまいセンサの精度を低下させてしまう問題があった。   A broken arrow in FIG. 16 indicates stray light. As shown in the figure, the mounting substrate forms a waveguide, and stray light reaches the light receiving element. For this reason, there is a problem that the light receiving element detects stray light in the mounting substrate also as reflected light from the conveyor belt, thereby reducing the accuracy of the sensor.

図17にトナーパッチがセンサの検出領域を通過した時の検出光量のイメージ図を示す。ここでは、反射率の小さい搬送ベルトから反射率の高い(例えば、イエロー)トナーパッチへと検出対象が変化した場合を示す。図中(1)は搬送ベルトからの反射光量を、(2)は受光素子が検出する光量を示す。又、図中(i)はパッチを検出の閾値を示す。   FIG. 17 shows an image diagram of the detected light amount when the toner patch passes through the detection area of the sensor. Here, a case where the detection target is changed from a conveyance belt having a low reflectance to a toner patch having a high reflectance (for example, yellow) is shown. In the figure, (1) indicates the amount of light reflected from the conveyor belt, and (2) indicates the amount of light detected by the light receiving element. Also, (i) in the figure indicates a threshold for detecting a patch.

図より明らかなように、理想的な検出波形(1)と実際の検出波形(2)では、パッチの検出タイミングが異なってしまう。又、パッチに対する反射率も異なってくるため(図中P)、色濃度に関しても誤差を生じてしまう。実装基板と光センサの間に、遮光特性のある部材を挿入する方法もあるが、コストの増加に繋がる、又、センサのリード線を挿入する部品挿入穴近傍は遮光部材を配置することができない。   As is apparent from the figure, the patch detection timing differs between the ideal detection waveform (1) and the actual detection waveform (2). Further, since the reflectance with respect to the patch is different (P in the figure), an error is also caused with respect to the color density. There is also a method of inserting a member having a light shielding characteristic between the mounting substrate and the optical sensor, but this leads to an increase in cost, and the light shielding member cannot be disposed in the vicinity of the component insertion hole for inserting the lead wire of the sensor. .

本発明は、以上の点に鑑み、光センサモジュールの実装基板と光学センサとの間に遮光塗料を塗布することにより、実装基板中に透過した迷光による、受光素子による検出光量のS/N比を低減させ、低コストで検知精度の高いセンサを備える画像形成装置を提供することにある。   In view of the above points, the present invention applies a light-shielding coating material between a mounting substrate of an optical sensor module and an optical sensor, so that an S / N ratio of a light amount detected by a light receiving element due to stray light transmitted through the mounting substrate. It is an object of the present invention to provide an image forming apparatus including a sensor with high detection accuracy at low cost.

上記目的を達成するため、請求項1記載の発明は、実装基板と、前記実装基板上に少なくとも1つ以上の発光素子並びに受光素子の光学素子が搭載された光センサモジュールを有する画像形成装置において、前記光センサモジュールの前記実装基板と光学素子の間に遮光塗料を塗布することを特徴とする。   In order to achieve the above object, an invention according to claim 1 is an image forming apparatus having a mounting substrate and an optical sensor module in which at least one light emitting element and an optical element of a light receiving element are mounted on the mounting substrate. A light-shielding paint is applied between the mounting substrate and the optical element of the optical sensor module.

請求項2記載の発明は、請求項1記載の発明において、前記遮光塗料は、前記実装基板上の実装素子記載シルクと同材料であることを特徴とする。   According to a second aspect of the present invention, in the first aspect of the present invention, the light-shielding paint is made of the same material as the mounting element description silk on the mounting substrate.

本発明によれば、光センサモジュールの実装基板と発光、受光素子間に実装素子を表記するシルクと同材料の遮光塗料を塗布することにより、遮光処理によるコストの増加を抑圧し、且つ、実装基板内に存在する迷光を受光素子により検出することを防止でき、光センサモジュールの検出精度を向上させることができる。   According to the present invention, by applying a light-shielding paint made of the same material as silk that represents a mounting element between the mounting substrate of the optical sensor module and the light-emitting and light-receiving elements, the increase in cost due to the light-shielding treatment is suppressed and the mounting is performed. The stray light existing in the substrate can be prevented from being detected by the light receiving element, and the detection accuracy of the optical sensor module can be improved.

以下に本発明の実施の形態を添付図面に基いて詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<実施の形態1>
本実施の形態では、光センサモジュールの実装基板とそれに実装された光センサとの間に遮光部材を設けていない場合の遮光塗料へ塗布する場合について説明する。
<Embodiment 1>
In the present embodiment, a case where the light-shielding paint is applied when no light-shielding member is provided between the mounting substrate of the optical sensor module and the optical sensor mounted thereon will be described.

本実施の形態に係る画像形成装置の構成は従来例に同様であるため説明を省略する。   Since the configuration of the image forming apparatus according to the present embodiment is the same as that of the conventional example, the description thereof is omitted.

本実施の形態における光センサモジュールの構成を図1及び図5を用いて説明する。   The structure of the optical sensor module in this embodiment will be described with reference to FIGS.

図1は搬送ベルト100の一部を併記した光センサモジュールの側面図を示す。図5は光センサモジュールの斜視図を示す。   FIG. 1 is a side view of an optical sensor module in which a part of the conveyance belt 100 is shown. FIG. 5 shows a perspective view of the optical sensor module.

図において、150は光学センサ等を実装する実装基板、151は遮光特性を有する塗料、100は搬送ベルト、154は搬送ベルト100上に光を照射する発光LED、153は発光LED154が照射した光の搬送ベルト100からの乱反射光を受光する乱反射光受光LED、155は発光LED154が照射した光の搬送ベルト100からの直接反射光を受光する正反射光受光LEDである。   In the figure, 150 is a mounting substrate on which an optical sensor or the like is mounted, 151 is a paint having a light shielding characteristic, 100 is a conveyor belt, 154 is a light emitting LED that irradiates light on the conveyor belt 100, and 153 is a light emitted by the light emitting LED 154. A diffusely reflected light receiving LED 155 for receiving irregularly reflected light from the conveyor belt 100 is a specularly reflected light receiving LED for receiving directly reflected light from the conveyor belt 100 of light emitted by the light emitting LED 154.

又、152は外部からの光を遮断し、発光LEDからの照射光及び、受光LEDへの反射光の光路を生成するハウジング、156は外部からの光を遮断するカバー、157は搬送ベルト100上に転写されたトナーパッチ、158は実装基板上に実装された抵抗器、159は実装された抵抗器を明示するシルク、210〜212はそれぞれ実装された乱反射光受光LED、発光LED、正反射光受光LEDを明示するシルクを示している。   Reference numeral 152 denotes a housing that blocks light from the outside, and generates an optical path for irradiation light from the light emitting LED and reflected light to the light receiving LED, 156 is a cover that blocks light from the outside, and 157 is on the conveyor belt 100. 158 is a resistor mounted on a mounting substrate, 159 is a silk that clearly indicates the mounted resistor, 210 to 212 are a diffusely reflected light receiving LED, a light emitting LED, and a specularly reflected light, respectively. The silk which shows light-receiving LED is shown.

遮光性塗料は、例えばシルク印刷工程と同じように、塗料塗布工程として実装基板作成時に所望領域へ塗布する。これにより実装基板−光センサ間の遮光処理を、特別な遮光部材等の設置なしに行うことができる。又、部材を必要としない点からコスト的にも有利になる可能性がある。   The light-shielding paint is applied to a desired region at the time of creating a mounting substrate as a paint application process, for example, as in the silk printing process. Thereby, the light shielding process between the mounting substrate and the optical sensor can be performed without installing a special light shielding member or the like. Further, there is a possibility that it is advantageous in terms of cost because no member is required.

実装面上に遮光性塗料151を塗布することにより、発光LEDから照射される光が実装基板150中に透過すること及び迷光の実装基板面への透過を防止している。   By applying the light-shielding paint 151 on the mounting surface, the light emitted from the light emitting LED is transmitted into the mounting substrate 150 and the transmission of stray light to the mounting substrate surface is prevented.

以上のように、本実施形態のような制御を行うことにより、迷光による受光LEDの検出精度の低下を抑圧することができ、色レジや色濃度の検出を高精度に行うことが可能になる。   As described above, by performing the control as in the present embodiment, it is possible to suppress a decrease in detection accuracy of the light receiving LED due to stray light, and it is possible to detect color registration and color density with high accuracy. .

本実施の形態では、実装基板−光センサ間の遮光処理を行う遮光性塗料151と、実装素子の明記するシルクを別材料としたが、どちらも遮光塗料にしても構わない。又、本実施の形態では、色レジ色濃度検出センサに本構成を用いたが、光学センサを用いて紙先端を検出する先端レジ検出センサ、又、用紙を検出する用紙検出センサに本構成を用いても無論構わない。   In this embodiment, the light-shielding paint 151 that performs light-shielding treatment between the mounting substrate and the optical sensor and the silk that is clearly specified by the mounting element are made of different materials, but both may be light-shielding paints. In this embodiment, this configuration is used for the color registration color density detection sensor. However, this configuration is used for the leading edge registration detection sensor that detects the leading edge of the paper using an optical sensor, and the detection sensor for detecting the paper. Of course, you can use it.

又、本実施の形態では、発光LED及び受光LEDの全てに接する実装基板面に対して、遮光性塗料151を塗布したが、受光LEDに接する実装基板面のみ(図6の光センサ構成(図中の番号に対する説明は図1に同じである))、発光LEDに接する実装基板面のみ(図7の光センサ構成(図中の番号に対する説明は図1に同じである))に遮光性塗料151を塗布する構成にしても良い。   In this embodiment, the light-shielding paint 151 is applied to the mounting substrate surface that contacts all of the light-emitting LEDs and the light-receiving LEDs, but only the mounting substrate surface that contacts the light-receiving LEDs (the optical sensor configuration in FIG. The explanation for the numbers in the figure is the same as in FIG. 1)), and only the surface of the mounting substrate in contact with the light emitting LED (the photosensor configuration in FIG. 7 (the explanation for the numbers in the figure is the same as in FIG. 1)). 151 may be applied.

<実施の形態2>
本発明の実施の形態2について説明する。
<Embodiment 2>
A second embodiment of the present invention will be described.

本実施の形態に係る画像形成装置の構成は従来例に同様であるため説明を省略する。   Since the configuration of the image forming apparatus according to the present embodiment is the same as that of the conventional example, the description thereof is omitted.

本実施の形態では、実装基板面−光センサ間に遮光部材が設けられている点が実施の形態1と異なる。   The present embodiment is different from the first embodiment in that a light shielding member is provided between the mounting substrate surface and the optical sensor.

本実施の形態における光センサモジュールの構成に関して図8及び図9を用いて説明する。   The structure of the optical sensor module in this embodiment will be described with reference to FIGS.

図8は本実施の形態における光センサモジュールの断面図、図9は本実施の形態における実装面から見た光センサモジュールの断面図である。図8及び図9共に発光LEDのみを示す。図示しないが、受光LEDに対しても同構成を採っている。   FIG. 8 is a cross-sectional view of the optical sensor module in the present embodiment, and FIG. 9 is a cross-sectional view of the optical sensor module as viewed from the mounting surface in the present embodiment. 8 and 9 show only the light emitting LED. Although not shown, the same configuration is adopted for the light receiving LED.

図において、150は光学センサ等を実装する実装基板、151は遮光特性を有するシルク、154は搬送ベルト100上に光を照射する発光LED、152は外部からの光を遮断し、発光LEDからの照射光及び受光LEDへの反射光の光路を生成するハウジング、201は発光LEDのリード線、200は発光LEDのリード線を挿入する部品挿入穴を示している。   In the figure, 150 is a mounting substrate on which an optical sensor or the like is mounted, 151 is a silk having a light shielding characteristic, 154 is a light emitting LED that irradiates light onto the conveyor belt 100, 152 is a light emitting LED that blocks external light, A housing for generating an optical path of the irradiated light and reflected light to the light receiving LED, 201 a light emitting LED lead wire, and 200 a component insertion hole for inserting the light emitting LED lead wire.

図中、実線の矢印は発光LEDより照射された伝搬光、破線の矢印は、ハウジングやLED自身により反射した散乱光を示す。シルク151は遮光特性を持つよう黒色のインクを用いている。又、黒色のインクは不図示の実装された素子を明示するシルクにも用いられている。本実施の形態では、図に示すように、シルクを実装基板−発光LED間に設置したハウジングの途切れているリード線近傍に塗布する。   In the figure, solid arrows indicate propagation light emitted from the light emitting LED, and broken arrows indicate scattered light reflected by the housing or the LED itself. The silk 151 uses black ink so as to have a light shielding property. The black ink is also used for silk that clearly shows the mounted element (not shown). In the present embodiment, as shown in the figure, silk is applied in the vicinity of a broken lead wire of a housing installed between the mounting substrate and the light emitting LED.

上記領域にシルク151を塗布することにより、発光LED後方に伝播した散乱光の実装基板内への透過を防止している。   By applying silk 151 to the region, transmission of scattered light propagating behind the light emitting LED into the mounting substrate is prevented.

以上のように、本実施の形態のような制御を行うことにより、迷光による受光LEDの検出精度の低下を抑圧することができ、色レジや色濃度の検出を高精度に行うことが可能になる。   As described above, by performing the control as in the present embodiment, it is possible to suppress a decrease in detection accuracy of the light receiving LED due to stray light, and to perform color registration and color density detection with high accuracy. Become.

本実施の形態では、遮光塗料として黒色のインクを塗布したが、透過率が低い塗料を用いるものであれば特に黒色出なくても良い。又、本実施の形態では、色レジ色濃度検出センサに本構成を用いたが、光学センサを用いて紙先端を検出する先端レジ検出センサ、又、用紙を検出する用紙検出センサに本構成を用いても無論構わない。   In the present embodiment, black ink is applied as the light-shielding paint, but it is not particularly necessary to produce black if a paint having low transmittance is used. In this embodiment, this configuration is used for the color registration color density detection sensor. However, this configuration is used for the leading edge registration detection sensor that detects the leading edge of the paper using an optical sensor, and the detection sensor for detecting the paper. Of course, you can use it.

<実施の形態3>
本発明の実施の形態3を説明する。
<Embodiment 3>
Embodiment 3 of the present invention will be described.

本実施の形態に係る画像形成装置の構成は従来例に同様であるため説明を省略する。   Since the configuration of the image forming apparatus according to the present embodiment is the same as that of the conventional example, the description thereof is omitted.

本実施の形態では、実装基板面−光センサ間に遮光部材を光センサのリード線近傍以外に設けられている点、光センサが縦型である点が実施の形態1と異なる。   This embodiment is different from the first embodiment in that a light shielding member is provided between the mounting substrate surface and the optical sensor other than the vicinity of the lead wire of the optical sensor, and that the optical sensor is a vertical type.

本実施の形態における光センサモジュールの構成を図10及び図11を用いて説明する。   The structure of the optical sensor module in this embodiment will be described with reference to FIGS.

図10は本実施の形態における光センサモジュールの断面図、図11は本実施の形態における実装面から見た光センサモジュールの断面図である。図10及び図11共に発光LEDのみを示す。図示しないが、受光LEDに対しても同構成を採っている。   FIG. 10 is a cross-sectional view of the optical sensor module in the present embodiment, and FIG. 11 is a cross-sectional view of the optical sensor module as viewed from the mounting surface in the present embodiment. 10 and 11 show only the light emitting LED. Although not shown, the same configuration is adopted for the light receiving LED.

図において、150は光学センサ等を実装する実装基板、151は遮光特性を有するシルク、154は搬送ベルト100上に光を照射する角型の発光LED、152は外部からの光を遮断し、発光LEDからの照射光及び受光LEDへの反射光の光路を生成するハウジング、201は発光LEDのリード線、200は発光LEDのリード線を挿入する部品挿入穴を示している。   In the figure, 150 is a mounting substrate on which an optical sensor or the like is mounted, 151 is a silk having a light shielding property, 154 is a square light emitting LED that irradiates light onto the conveyor belt 100, and 152 is a light emitting device that blocks light from the outside. A housing for generating an optical path for irradiation light from the LED and reflected light to the light receiving LED, 201 indicates a lead wire of the light emitting LED, and 200 indicates a component insertion hole for inserting the lead wire of the light emitting LED.

ハウジング152に空けられたリード線実装用の窓は、発光LEDの実装時の組立性等の理由から、実装基板の部品挿入穴に比べて系が大きくなってしまう。そのため、ハウジングの窓から見える実装基板面から発光LEDの散乱光は基板内に透過してしまう。   The lead wire mounting window vacated in the housing 152 has a larger system than the component insertion hole of the mounting board for reasons such as assembling when the light emitting LED is mounted. Therefore, the scattered light of the light emitting LED is transmitted into the substrate from the mounting substrate surface seen from the window of the housing.

図中、実線の矢印は発光LEDより照射された伝搬光、破線の矢印は、ハウジングやLED自身により反射した散乱光を示す。シルク151は遮光特性を持つよう黒色のインクを用いている。又、黒色のインクは不図示の実装された素子を明示するシルクにも用いられている。   In the figure, solid arrows indicate propagation light emitted from the light emitting LED, and broken arrows indicate scattered light reflected by the housing or the LED itself. The silk 151 uses black ink so as to have a light shielding property. The black ink is also used for silk that clearly shows the mounted element (not shown).

本実施の形態では、図に示すように、シルクをハウジングに空けられたリード線挿入用の窓から 見える実装基板面上に塗布する。本実施の形態に用いたような発光LEDを用いた場合、リード線が発光LEDの下方に位置するため、実装基板がLEDの放射光を受け易い。そのため、より十分な遮光処理が必要となる。   In the present embodiment, as shown in the figure, silk is applied on the surface of the mounting substrate that can be seen from the lead wire insertion window opened in the housing. When the light emitting LED as used in the present embodiment is used, the lead wire is positioned below the light emitting LED, so that the mounting substrate is likely to receive the emitted light of the LED. Therefore, a more sufficient light shielding process is required.

本実施の形態では、実装基板面−光センサ間への遮光部材の設置、且つ、僅かに残った実装基板面に対してシルク151を塗布することにより、発光LEDからの光の実装基板内への透過を防止している。   In the present embodiment, a light shielding member is installed between the mounting substrate surface and the optical sensor, and silk 151 is applied to the slightly remaining mounting substrate surface, so that light from the light-emitting LED enters the mounting substrate. Is prevented from passing through.

以上のように、本実施の形態のような制御を行うことにより、僅かなシルクの塗布のみで、迷光による受光LEDの検出精度の低下を抑圧することができ、色レジや色濃度の検出を高精度に行うことが可能になる。   As described above, by performing the control as in the present embodiment, it is possible to suppress a decrease in detection accuracy of the light receiving LED due to stray light with only a small amount of silk application, and to detect color registration and color density. It becomes possible to carry out with high precision.

本実施の形態では、遮光塗料して黒色のインクを塗布したが、透過率が低い塗料を用いるものであれば特に黒色でなくても良い。又、本実施の形態では、色レジ色濃度検出センサに本構成を用いたが、光学センサを用いて紙先端を検出する先端レジ゛
検出センサ、又、用紙を検出する用紙検出センサに本構成を用いても無論構わない。
In this embodiment, black ink is applied as a light-shielding paint. However, black ink is not particularly required as long as a paint having low transmittance is used. In this embodiment, this configuration is used for the color registration color density detection sensor. However, this configuration is used for the leading edge registration detection sensor that detects the leading edge of the paper using an optical sensor, and the detection sensor for detecting the paper. Of course, you can use

<実施の形態4>
本発明の実施の形態4について説明する。
<Embodiment 4>
Embodiment 4 of the present invention will be described.

本実施の形態に係る画像形成装置の構成は従来例に同様であるため説明を省略する。   Since the configuration of the image forming apparatus according to the present embodiment is the same as that of the conventional example, the description thereof is omitted.

本実施の形態では、光学センサが遮光のためのハウジングに埋め込まれたタイプのセンサモジュールである点が実施の形態1と異なる。   The present embodiment is different from the first embodiment in that the optical sensor is a type of sensor module embedded in a light shielding housing.

本実施の形態における光センサモジュールの構成に関して図12及び図13を用いて説明する。図12は本実施の形態における光センサモジュールの分解斜視図、図13は本実施の形態におけるモジュール側面から見た光センサモジュールの断面図である。図13は発光LEDのみを示す。図示しないが、受光LEDに対しても同構成を採っている。   The structure of the optical sensor module in this embodiment will be described with reference to FIGS. FIG. 12 is an exploded perspective view of the photosensor module in the present embodiment, and FIG. 13 is a cross-sectional view of the photosensor module viewed from the side of the module in the present embodiment. FIG. 13 shows only the light emitting LED. Although not shown, the same configuration is adopted for the light receiving LED.

図において、150は光学センサ等を実装する実装基板、151は遮光特性を有するシルク、154は搬送ベルト100上に光を照射する発光LED、153は発光LED154が照射した光の搬送ベルト100からの乱反射光を受光する乱反射光受光LED、152は外部からの光を遮断し、発光LEDからの照射光及び受光LEDへの反射光の光路を生成するハウジング、201は発光LEDのリード線、200は発光LEDのリード線を挿入する部品挿入穴を示している。   In the figure, 150 is a mounting substrate on which an optical sensor or the like is mounted, 151 is a silk having a light-shielding property, 154 is a light emitting LED that irradiates light on the conveyor belt 100, 153 is light emitted from the conveyor belt 100 by the light emitting LED 154 A diffusely reflected light receiving LED 152 that receives diffusely reflected light, 152 is a housing that blocks light from the outside and generates an optical path of irradiated light from the light emitting LED and reflected light to the light receiving LED, 201 is a lead wire of the light emitting LED, and 200 is The component insertion hole which inserts the lead wire of light emitting LED is shown.

尚、本実施の形態では、発光LED、受光LEDを各1つ埋め込まれたセンサとしているが、2つ以上搭載されていても構わない。   In this embodiment, a sensor in which one light emitting LED and one light receiving LED are embedded is used, but two or more sensors may be mounted.

図中、実線の矢印は発光LEDより照射された伝搬光を示す。シルク151は遮光特性を持つよう黒色のインクを用いている。又、黒色のインクは不図示の実装された素子を明示するシルクにも用いられている。   In the figure, solid arrows indicate propagating light emitted from the light emitting LED. The silk 151 uses black ink so as to have a light shielding property. The black ink is also used for silk that clearly shows the mounted element (not shown).

本実施の形態で用いた埋め込み型の光センサでは、ハウジングにて光路をLED前方のみに絞り込んでいるため直接光は実装基板上に伝搬しない。しかしながら、発光LED154内部にて反射散乱した光が発光LED後方に伝搬する。そのため、発光LED後方に回り込んだ散乱光は実装基板内への透過し受光LEDにノイズ光として伝搬してしまう。本実施の形態では、図に示すように、シルクを発光LEDの後部を覆うように実装基板上に塗布する。   In the embedded optical sensor used in the present embodiment, the light path is narrowed down only in front of the LED by the housing, so that direct light does not propagate on the mounting substrate. However, the light reflected and scattered inside the light emitting LED 154 propagates behind the light emitting LED. Therefore, the scattered light that has traveled to the rear of the light emitting LED is transmitted into the mounting substrate and propagates as noise light to the light receiving LED. In the present embodiment, as shown in the figure, silk is applied on the mounting substrate so as to cover the rear part of the light emitting LED.

本実施の形態では、上記シルクの塗布により、発光LEDからの光の実装基板内への透過を防止している。   In the present embodiment, the application of the silk prevents the light from the light emitting LED from being transmitted into the mounting substrate.

以上のように、本実施の形態のような制御を行うことにより、僅かなシルクの塗布のみで、迷光による受光LEDの検出精度の低下を抑圧することができ、色レジや色濃度の検出を高精度に行うことが可能になる。   As described above, by performing the control as in the present embodiment, it is possible to suppress a decrease in detection accuracy of the light receiving LED due to stray light with only a small amount of silk application, and to detect color registration and color density. It becomes possible to carry out with high precision.

本実施の形態では、遮光塗料して黒色のインクを塗布したが、透過率が低い塗料を用いるものであれば特に黒色出なくても良い。又、本実施の形態では、色レジ色濃度検出センサに本構成を用いたが、光学センサを用いて紙先端を検出する先端レジ検出センサ、又、用紙を検出する用紙検出センサに本構成を用いても無論構わない。   In this embodiment, black ink is applied as a light-shielding paint. However, black paint is not particularly required if a paint having a low transmittance is used. In this embodiment, this configuration is used for the color registration color density detection sensor. However, this configuration is used for the leading edge registration detection sensor that detects the leading edge of the paper using an optical sensor, and the detection sensor for detecting the paper. Of course, you can use it.

本発明の実施の形態1に係る光センサモジュールの側面図である。It is a side view of the optical sensor module which concerns on Embodiment 1 of this invention. 本発明に係る画像形成装置を説明する図である。1 is a diagram illustrating an image forming apparatus according to the present invention. 本発明の実施の形態における用紙搬送系とそれに付随する光センサモジュールを説明する図である。It is a figure explaining the paper conveyance system in an embodiment of the invention, and an optical sensor module accompanying it. 本発明の実施の形態に係る光センサモジュールの分解斜視図である。It is a disassembled perspective view of the optical sensor module which concerns on embodiment of this invention. 本発明の実施の形態1に係る光センサモジュールの斜視図である。1 is a perspective view of an optical sensor module according to Embodiment 1 of the present invention. 本発明の実施の形態1に係る光センサモジュールの側面図の一例である。It is an example of the side view of the optical sensor module which concerns on Embodiment 1 of this invention. 本発明の実施の形態1に係る光センサモジュールの側面図の一例である。It is an example of the side view of the optical sensor module which concerns on Embodiment 1 of this invention. 本発明の実施の形態2に係る光センサモジュールの側面図である。It is a side view of the optical sensor module which concerns on Embodiment 2 of this invention. 本発明の実施の形態2に係る光センサモジュールの実装基板面側から見た断面図である。It is sectional drawing seen from the mounting substrate surface side of the optical sensor module which concerns on Embodiment 2 of this invention. 本発明の実施の形態3に係る光センサモジュールの側面図である。It is a side view of the optical sensor module which concerns on Embodiment 3 of this invention. 本発明の実施の形態3に係る光センサモジュールの実装基板面側から見た断面図である。It is sectional drawing seen from the mounting substrate surface side of the optical sensor module which concerns on Embodiment 3 of this invention. 本発明の実施の形態4に係る光センサモジュールの分解斜視図である。It is a disassembled perspective view of the optical sensor module which concerns on Embodiment 4 of this invention. 本発明の実施の形態4に係る光センサモジュール側面から見たの断面図である。It is sectional drawing seen from the optical sensor module side surface which concerns on Embodiment 4 of this invention. 従来例における光センサモジュールの側面図である。It is a side view of the optical sensor module in a prior art example. 従来例における光センサモジュールの斜視図である。It is a perspective view of the optical sensor module in a prior art example. 従来例における光センサモジュールの正面図である。It is a front view of the optical sensor module in a prior art example. 従来例における光センサモジュールの検出した反射光量の一例を示す図である。It is a figure which shows an example of the reflected light quantity which the optical sensor module in a prior art example detected.

符号の説明Explanation of symbols

100 搬送ベルト
150 実装基板
151 遮光塗料
152 ハウジング
153 乱反射光受光LED
154 発光LED
155 正反射光受光LED
156 カバー
157 トナーパッチ
DESCRIPTION OF SYMBOLS 100 Conveying belt 150 Mounting board 151 Light shielding paint 152 Housing 153 Diffuse reflection light receiving LED
154 LED
155 Regular reflection light receiving LED
156 Cover 157 Toner patch

Claims (2)

実装基板と、前記実装基板上に少なくとも1つ以上の発光素子並びに受光素子の光学素子が搭載された光センサモジュールを有する画像形成装置において、
前記光センサモジュールの前記実装基板と光学素子の間に遮光塗料を塗布することを特徴とする画像形成装置。
In an image forming apparatus having a mounting substrate and an optical sensor module on which at least one light emitting element and an optical element of a light receiving element are mounted on the mounting substrate.
An image forming apparatus, wherein a light-shielding paint is applied between the mounting substrate and the optical element of the optical sensor module.
前記遮光塗料は、前記実装基板上の実装素子記載シルクと同材料であることを特徴とする請求項1記載の画像形成装置。   The image forming apparatus according to claim 1, wherein the shading paint is made of the same material as the mounting element description silk on the mounting substrate.
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JP2010266698A (en) * 2009-05-15 2010-11-25 Casio Electronics Co Ltd Image forming apparatus with color fading function
CN102681380A (en) * 2011-03-15 2012-09-19 欧姆龙株式会社 Toner density sensor and image forming apparatus
JP2015111130A (en) * 2015-01-05 2015-06-18 キヤノン株式会社 Spectral colorimetric device and image forming apparatus including the same
US9116489B2 (en) 2012-05-11 2015-08-25 Canon Kabushiki Kaisha Image forming apparatus for storing sampling values and method therefor
US9164454B2 (en) 2012-05-11 2015-10-20 Canon Kabushiki Kaisha Image forming apparatus for performing registration and density correction control
US9304083B2 (en) 2014-01-29 2016-04-05 Canon Kabushiki Kaisha Optical detection device and image forming apparatus including the same
CN105700308A (en) * 2014-12-10 2016-06-22 佳能株式会社 Optical apparatus and image forming apparatus including the optical apparatus
US9389564B2 (en) 2012-05-11 2016-07-12 Canon Kabushiki Kaisha Image forming apparatus for performing registration and density correction control
US9594337B2 (en) 2012-05-11 2017-03-14 Canon Kabushiki Kaisha Image forming apparatus for detecting misregistration amount and density

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010266698A (en) * 2009-05-15 2010-11-25 Casio Electronics Co Ltd Image forming apparatus with color fading function
CN102681380A (en) * 2011-03-15 2012-09-19 欧姆龙株式会社 Toner density sensor and image forming apparatus
US9116489B2 (en) 2012-05-11 2015-08-25 Canon Kabushiki Kaisha Image forming apparatus for storing sampling values and method therefor
US9164454B2 (en) 2012-05-11 2015-10-20 Canon Kabushiki Kaisha Image forming apparatus for performing registration and density correction control
US9389564B2 (en) 2012-05-11 2016-07-12 Canon Kabushiki Kaisha Image forming apparatus for performing registration and density correction control
US9594337B2 (en) 2012-05-11 2017-03-14 Canon Kabushiki Kaisha Image forming apparatus for detecting misregistration amount and density
US9304083B2 (en) 2014-01-29 2016-04-05 Canon Kabushiki Kaisha Optical detection device and image forming apparatus including the same
CN105700308A (en) * 2014-12-10 2016-06-22 佳能株式会社 Optical apparatus and image forming apparatus including the optical apparatus
US9904226B2 (en) 2014-12-10 2018-02-27 Canon Kabushiki Kaisha Optical apparatus and image forming apparatus including the optical apparatus
JP2015111130A (en) * 2015-01-05 2015-06-18 キヤノン株式会社 Spectral colorimetric device and image forming apparatus including the same

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