JP2006245151A - Sealing molding method - Google Patents

Sealing molding method Download PDF

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JP2006245151A
JP2006245151A JP2005056737A JP2005056737A JP2006245151A JP 2006245151 A JP2006245151 A JP 2006245151A JP 2005056737 A JP2005056737 A JP 2005056737A JP 2005056737 A JP2005056737 A JP 2005056737A JP 2006245151 A JP2006245151 A JP 2006245151A
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sealing
substrate
sealing resin
mold
lower mold
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Yuichiro Yamada
雄一郎 山田
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a reliable sealing molding method which can keep the thickness of resin constant regardless of an error of an amount of sealing resin supplied into a metal mold, in sealing a substrate mounted with a plurality of semiconductor elements. <P>SOLUTION: In heated upper metal die 1 and lower metal die 2, the lower metal die 2 is formed with a cavity 3 and spare cavities 4. The spare cavities have a vertical moving mechanism 5 to move the bottom up and down by pressure control. By completely closing the metal mold when the sealing resin 8 is melted to a predetermined level, a substrate 10 is heated to a predetermined temperature, and the pressure inside the metal mold reaches a predetermined level; the semiconductor elements mounted on the substrate are dipped in the sealing resin and molded, and at the same time, excessive sealing resin flows into the spare cavities which are formed at one or more points in the cavity. Thereafter, the vertical moving mechanism 5 is raised by pressure control to apply predetermined molding pressure to conduct molding. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、半導体装置を製造する際に、半導体素子を実装した基板と封止樹脂を上下金型でプレスする封止成型方法に関するものである。   The present invention relates to a sealing molding method in which a substrate on which a semiconductor element is mounted and a sealing resin are pressed with upper and lower molds when a semiconductor device is manufactured.

従来の封止成型方法について、図３を用いて説明する。
図３は従来の半導体装置の封止成型方法を説明するための断面図である。
近年、携帯電子機器を中心とした製品の小型化、低コスト化に伴い、半導体装置は薄型化、小型化、低コスト化が要求されている。 A conventional sealing molding method will be described with reference to FIG.
FIG. 3 is a cross-sectional view for explaining a conventional sealing molding method of a semiconductor device.
In recent years, with the downsizing and cost reduction of products centering on portable electronic devices, semiconductor devices are required to be thinner, smaller and lower in cost.

そのため、複数個の半導体素子をマトリクス状に実装した基板を一括で樹脂封止するものが多く、一括封止した製品は各半導体装置単位に分割して半導体装置単体を形成する。
モールド部の高さを薄くしても、樹脂封止時にＡｕワイヤ１１を変形することなく、一括して樹脂封止成型する方法として、半導体素子９を実装した基板１０を半導体素子９を下方向に向けた状態で装着固定した上金型１と下金型２を用い、下金型２に備えたキャビティに均一に加圧されて供給された封止樹脂８を加熱溶融して、上下両型を型締めすることにより樹脂封止成型する方法が提案されている（例えば、特許文献１参照）。
特開２００４−２１６５５８号公報 For this reason, many substrates on which a plurality of semiconductor elements are mounted in a matrix are collectively resin-sealed, and the collectively sealed product is divided into individual semiconductor device units to form a single semiconductor device.
Even if the height of the mold part is made thin, the substrate 10 on which the semiconductor element 9 is mounted is directed downward as a method of performing resin sealing molding at once without deforming the Au wire 11 during resin sealing. Using the upper mold 1 and the lower mold 2 that are mounted and fixed in a state facing toward the top, the sealing resin 8 that is uniformly pressurized and supplied to the cavity provided in the lower mold 2 is heated and melted to A method of resin sealing molding by clamping a mold has been proposed (for example, see Patent Document 1).
JP 2004-216558 A

しかしながら、従来の封止成型方法では、以下のような課題がある。
下金型に備えたキャビティに供給された樹脂材料の量のばらつきがモールド部の高さやボイドの発生に大きく影響する。つまり、封止樹脂が多く供給された場合には、モールド部の高さが高くなり、少なく供給された場合には、樹脂へ圧力をかけにくくなるためにボイドが発生しやすくなるといった問題点がある。 However, the conventional sealing molding method has the following problems.
Variation in the amount of the resin material supplied to the cavity provided in the lower mold greatly affects the height of the mold part and the generation of voids. In other words, when a large amount of the sealing resin is supplied, the height of the mold part becomes high, and when it is supplied in a small amount, it is difficult to apply pressure to the resin, so that a void is likely to be generated. is there.

本発明は、前記した従来の問題点を解消するために、金型内に供給される封止樹脂量の誤差に関係なく、樹脂厚みが一定で信頼性が高い半導体装置の封止成型方法を提供することを目的とする。   In order to eliminate the above-described conventional problems, the present invention provides a highly reliable semiconductor device sealing molding method in which the resin thickness is constant and reliable regardless of the error in the amount of sealing resin supplied into the mold. The purpose is to provide.

上記目的を達成するために、本発明の請求項１記載の封止成型方法は、上金型と上下可動機構を設けた１または複数の予備キャビティを備える下金型を用いて１または複数の半導体装置を実装した基板を樹脂封止する封止成型方法であって、前記上金型と前記下金型を加熱する工程と、前記下金型に設けられたキャビティに所要量以上の封止樹脂を供給する工程と、前記半導体素子の搭載面が下金型の前記キャビティが設けられた面に対向するように前記基板を前記下金型に装着する工程と、前記上金型と前記基板を装着した下金型を密着する工程と、前記封止樹脂を溶融させ前記予備キャビティに所要量を超えた分の封止樹脂を流入させる工程と、あらかじめ定められた所定の成型圧力を前記上下可動機構より前記封止樹脂に加圧する工程とを有し、常に前記キャビティ内の封止樹脂量を一定にして基板を樹脂封止することを特徴とする。   In order to achieve the above object, a sealing molding method according to claim 1 of the present invention uses one or more lower molds provided with an upper mold and one or more preliminary cavities provided with a vertically movable mechanism. A sealing molding method for resin-sealing a substrate on which a semiconductor device is mounted, the step of heating the upper mold and the lower mold, and a sealing over a required amount in a cavity provided in the lower mold A step of supplying a resin, a step of mounting the substrate on the lower mold such that a mounting surface of the semiconductor element faces a surface of the lower mold provided with the cavity, and the upper mold and the substrate A step of closely adhering a lower mold equipped with a step, a step of melting the sealing resin and flowing an amount of sealing resin exceeding a required amount into the spare cavity, and a predetermined molding pressure determined in advance Pressurizing the sealing resin from a movable mechanism It has, always substrate with a constant sealing resin amount in the cavity, characterized in that the resin sealing.

請求項２記載の封止成型方法は、請求項１記載の封止成型方法において、前記下金型に、前記基板を前記下金型から所定の高さに保持するための突出した可動ピンを備えることを特徴とする。   The sealing molding method according to claim 2 is the sealing molding method according to claim 1, wherein a protruding movable pin for holding the substrate at a predetermined height from the lower mold is provided on the lower mold. It is characterized by providing.

請求項３記載の封止成型方法は、請求項２記載の封止成型方法において、前記可動ピンの先端が、前記基板の位置決めができるとともに前記基板を前記下金型からある距離を持って保持するための段差を備えることを特徴とする。   The sealing molding method according to claim 3 is the sealing molding method according to claim 2, wherein the tip of the movable pin can position the substrate and holds the substrate at a certain distance from the lower mold. It is characterized by having a level difference for the purpose.

以上により、金型内に供給される封止樹脂量の誤差に関係なく樹脂厚みが一定で信頼性が高い半導体装置の封止成型方法を提供することができる。   As described above, it is possible to provide a method for sealing and molding a semiconductor device having a constant resin thickness and high reliability regardless of an error in the amount of sealing resin supplied into the mold.

本発明の封止成型方法によれば、上下可動機構を備えた予備キャビティを設けた下金型と上金型を密封減圧した状態で、上下可動機構を用いて予備キャビティに流入した封止樹脂に所定の成型圧力を加えた状態で、キャビティ領域の封止樹脂を加圧成型することにより、封止樹脂量に誤差があったとしてもキャビティ領域の封止樹脂量は所定の量に保つことができるため、金型内に供給される封止樹脂量の誤差に関係なく樹脂厚みが一定で信頼性が高い半導体装置の封止成型方法を提供することができ、封止樹脂が多く供給されても予備キャビティに余分な封止樹脂が流入して完全に金型を閉じることが可能なため、樹脂厚寸法精度の高い半導体装置が実現できる。   According to the sealing molding method of the present invention, the sealing resin that has flowed into the preliminary cavity using the vertical movable mechanism in a state where the lower mold and the upper mold having the preliminary cavity provided with the vertical movable mechanism are sealed and decompressed. Even if there is an error in the amount of sealing resin, the amount of sealing resin in the cavity region is kept at a predetermined amount by pressure molding the sealing resin in the cavity region with a predetermined molding pressure applied Therefore, it is possible to provide a highly reliable semiconductor device sealing molding method with a constant resin thickness regardless of an error in the amount of sealing resin supplied into the mold, and a large amount of sealing resin is supplied. However, since the excess sealing resin flows into the preliminary cavity and the mold can be completely closed, a semiconductor device with high resin thickness dimensional accuracy can be realized.

また、基板を下金型から所定の高さに保持できるよう突出した可動ピン上に装着することにより、型締めまで基板を金型からの熱で自由に伸びる状態で保持して成型することができ、半導体装置内部の残留応力低減が可能なため、信頼性の高い半導体装置の封止成型方法を提供することができる。   In addition, by mounting on the movable pin that protrudes so that the substrate can be held at a predetermined height from the lower mold, the substrate can be held and molded in a state where it can be freely extended by heat from the mold until clamping. In addition, since the residual stress inside the semiconductor device can be reduced, a highly reliable method for sealing and molding a semiconductor device can be provided.

また、可動ピンの先端が、基板の位置決めができるとともに、基板を下金型からある距離を持って保持されるような段差を有することにより、下金型に対する基板の位置規制を精度よく行うことが可能になるため、モールド部のズレが少なく信頼性の高い半導体装置の封止成型方法を提供することができる。   In addition, the tip of the movable pin can position the substrate and has a step that holds the substrate at a certain distance from the lower mold, thereby accurately regulating the position of the substrate with respect to the lower mold. Therefore, it is possible to provide a highly reliable method for sealing and molding a semiconductor device with little misalignment of the mold part.

本発明の封止成型方法は、まず、加熱した上下金型において、下金型に形成したキャビティ内にその体積に対して若干多めの封止樹脂を供給し、少なくとも１個以上の半導体素子を実装した基板を半導体素子搭載面が下向きになるように装着する。その後、金型外周部に形成した金型密封機構を作動できる距離まで上下金型を近づけ、金型内を密封して減圧する。金型内の気圧と封止樹脂の溶融状態が所定のレベルに達した後、上下金型を閉じることで上金型に基板が押され半導体素子を封止樹脂に浸しながら封止成型する。そして、この時に、キャビティに少なくとも１箇所以上設置した予備キャビティに余分な封止樹脂が流入する。そして、型締め後、予備キャビティ底面に設けられた圧力制御ができる上下可動機構を上昇させ所定の成型圧を保持した状態で硬化させるものである。   In the sealing molding method of the present invention, first, in a heated upper and lower mold, a slightly larger amount of sealing resin is supplied into the cavity formed in the lower mold, and at least one semiconductor element is formed. Mount the mounted substrate so that the semiconductor element mounting surface faces downward. Thereafter, the upper and lower molds are brought close to a distance where the mold sealing mechanism formed on the outer periphery of the mold can be operated, and the inside of the mold is sealed and decompressed. After the atmospheric pressure in the mold and the molten state of the sealing resin reach a predetermined level, the upper and lower molds are closed to push the substrate against the upper mold, thereby sealing and molding the semiconductor element in the sealing resin. At this time, excess sealing resin flows into a spare cavity installed in at least one place in the cavity. Then, after the mold clamping, the vertically movable mechanism provided on the bottom surface of the preliminary cavity and capable of controlling pressure is raised and cured while maintaining a predetermined molding pressure.

以下、本発明の封止成型方法における実施の形態について、図１，図２を参照しながら具体的に説明する。
図１は本発明の封止成型方法における基板装着工程を説明するための工程断面図、図２は本発明の封止成型方法における樹脂封止工程を説明するための工程断面図である。 Hereinafter, an embodiment of the sealing molding method of the present invention will be specifically described with reference to FIGS.
FIG. 1 is a process cross-sectional view for explaining a substrate mounting process in the sealing molding method of the present invention, and FIG. 2 is a process cross-sectional view for explaining a resin sealing process in the sealing molding method of the present invention.

まず、図１（ａ）に示すように、上金型１と下金型２を加熱する（加熱装置は図示せず）。この下金型２には、キャビティ３と予備キャビティ４が形成されている。予備キャビティ４底部は圧力制御による上下可動機構５になっており、成型前は所定の位置に下げておく。また、下金型２には、基板を下金型２から所定の高さに保持できるように突出した可動ピン６も設置しており、下金型２周囲にはシール材７が設置されている。   First, as shown to Fig.1 (a), the upper metal mold | die 1 and the lower metal mold | die 2 are heated (a heating apparatus is not shown in figure). The lower mold 2 is formed with a cavity 3 and a spare cavity 4. The bottom of the preliminary cavity 4 is a vertically movable mechanism 5 by pressure control, and is lowered to a predetermined position before molding. The lower mold 2 is also provided with a movable pin 6 protruding so that the substrate can be held at a predetermined height from the lower mold 2, and a sealing material 7 is provided around the lower mold 2. Yes.

次に、図１（ｂ）に示すように、キャビティ３内にキャビティ体積に対して若干多めの封止樹脂８を供給する。
次に、図１（ｃ）に示すように、少なくとも１個以上の半導体素子９を実装した基板１０を、半導体素子搭載面が下向きになるように下金型から所定の高さに保持できるよう突出した可動ピン６上に装着固定する。 Next, as shown in FIG. 1B, a slightly larger amount of sealing resin 8 is supplied into the cavity 3 with respect to the cavity volume.
Next, as shown in FIG. 1C, the substrate 10 on which at least one semiconductor element 9 is mounted can be held at a predetermined height from the lower mold so that the semiconductor element mounting surface faces downward. It is fixed on the protruding movable pin 6.

次に、図２（ａ）に示すように、下金型２外周部に形成したシール材７で金型密封機構を作動できる距離まで上下金型を近づけ、金型内を密封し減圧する。
同時に、上金型１を基板１０に押し当てることにより基板１０を加熱する。 Next, as shown in FIG. 2 (a), the upper and lower molds are brought close to a distance where the mold sealing mechanism can be operated with the sealing material 7 formed on the outer periphery of the lower mold 2, and the inside of the mold is sealed and decompressed.
At the same time, the substrate 10 is heated by pressing the upper mold 1 against the substrate 10.

次に、図２（ｂ）に示すように、封止樹脂８が所定のレベルまで溶融し、基板１０が所定の温度まで加熱され、金型内の気圧が所定のレベルに達した段階で金型を完全に閉じる。   Next, as shown in FIG. 2B, when the sealing resin 8 is melted to a predetermined level, the substrate 10 is heated to a predetermined temperature, and the atmospheric pressure in the mold reaches the predetermined level, the mold is Close the mold completely.

その際、基板１０に実装された半導体素子３は封止樹脂中に浸漬されてモールドされるとともに、キャビティ３（封止樹脂８が封止された領域）の少なくとも１箇所以上に設置した予備キャビティ４に余分な封止樹脂８が流入する。   At that time, the semiconductor element 3 mounted on the substrate 10 is immersed and molded in a sealing resin, and a spare cavity is installed in at least one of the cavities 3 (regions where the sealing resin 8 is sealed). Excess sealing resin 8 flows into 4.

なお、可動ピン６はバネ等の弾性体で保持しているため上金型１の動きに連動して動く機構である。
次に、図２（ｃ）に示すように、予備キャビティ４の底部の上下可動機構５を圧力制御により上昇させ、封止樹脂に所定の成型圧力（６ＭＰａ〜１５ＭＰａ）をかけ、所定の時間（３０ｓｅｃ〜１２０ｓｅｃ）キュアする。 The movable pin 6 is a mechanism that moves in conjunction with the movement of the upper mold 1 because it is held by an elastic body such as a spring.
Next, as shown in FIG. 2C, the vertical movable mechanism 5 at the bottom of the preliminary cavity 4 is raised by pressure control, a predetermined molding pressure (6 MPa to 15 MPa) is applied to the sealing resin, and a predetermined time ( 30 sec to 120 sec).

次に、図２（ｄ）に示すように、所定の時間のキュア後製品を金型から取り出す。
以上のように、上下可動機構を備えた予備キャビティを設けた下金型と上金型を密封減圧した状態で、上下可動機構を用いて予備キャビティに流入した封止樹脂に所定の成型圧力を加えて、キャビティ領域の封止樹脂を加圧成型することにより、封止樹脂量に誤差があったとしてもキャビティ領域の封止樹脂量は所定の量に保つことができるため、金型内に供給される封止樹脂量の誤差に関係なく樹脂厚みが一定で信頼性が高い半導体装置の封止成型方法を提供することができる。 Next, as shown in FIG. 2D, the product after curing for a predetermined time is taken out from the mold.
As described above, a predetermined molding pressure is applied to the sealing resin flowing into the preliminary cavity using the vertical movable mechanism in a state where the lower mold and the upper mold having the preliminary cavity provided with the vertical movable mechanism are sealed and decompressed. In addition, by press molding the sealing resin in the cavity region, the amount of sealing resin in the cavity region can be kept at a predetermined amount even if there is an error in the amount of sealing resin. It is possible to provide a highly reliable sealing method for a semiconductor device with a constant resin thickness regardless of an error in the amount of sealing resin supplied.

また、基板を下金型から所定の高さに保持できるよう突出した可動ピン上に装着することにより、型締めまで基板を金型からの熱で自由に伸びる状態で保持して成型することができ、半導体装置内部の残留応力低減が可能なため、信頼性の高い半導体装置の封止成型方法を提供することができる。   In addition, by mounting on the movable pin that protrudes so that the substrate can be held at a predetermined height from the lower mold, the substrate can be held and molded in a state where it can be freely extended by heat from the mold until clamping. In addition, since the residual stress inside the semiconductor device can be reduced, a highly reliable method for sealing and molding a semiconductor device can be provided.

また、可動ピンの先端が、基板の位置決めができるとともに基板を下金型からある距離を持って保持されるような段差を有することにより、下金型に対する基板の位置規制を精度よく行うことが可能になるため、モールド部のズレが少なく信頼性の高い半導体装置の封止成型方法を提供することができる。   In addition, the position of the substrate with respect to the lower mold can be regulated accurately by having a step that allows the tip of the movable pin to position the substrate and hold the substrate at a certain distance from the lower mold. Therefore, it is possible to provide a highly reliable method for sealing and molding a semiconductor device with little misalignment of the mold part.

本発明にかかる封止成型方法は、金型内に供給される封止樹脂量の誤差に関係なく樹脂厚みが一定で信頼性が高い半導体装置の封止成型方法を提供することができ、半導体素子を実装した基板と封止樹脂を上下金型でプレスする封止成型方法等に有用である。   The sealing molding method according to the present invention can provide a semiconductor device sealing molding method having a constant resin thickness and high reliability regardless of an error in the amount of sealing resin supplied into the mold. It is useful for a sealing molding method in which a substrate on which an element is mounted and a sealing resin are pressed with upper and lower molds.

本発明の封止成型方法における基板装着工程を説明するための工程断面図Process sectional drawing for demonstrating the board | substrate mounting process in the sealing molding method of this invention 本発明の封止成型方法における樹脂封止工程を説明するための工程断面図Process sectional drawing for demonstrating the resin sealing process in the sealing molding method of this invention 従来の半導体装置の封止成型方法を説明するための断面図Sectional drawing for demonstrating the sealing molding method of the conventional semiconductor device

符号の説明Explanation of symbols

１ 上金型
２ 下金型
３ キャビティ
４ 予備キャビティ
５ 上下可動機構
６ 可動ピン
７ シール材
８ 封止樹脂
９ 半導体素子
１０ 基板
１１ Ａｕワイヤ DESCRIPTION OF SYMBOLS 1 Upper die 2 Lower die 3 Cavity 4 Preliminary cavity 5 Vertical moving mechanism 6 Movable pin 7 Sealing material 8 Sealing resin 9 Semiconductor element 10 Substrate 11 Au wire

Claims (3)

上金型と上下可動機構を設けた１または複数の予備キャビティを備える下金型を用いて１または複数の半導体装置を実装した基板を樹脂封止する封止成型方法であって、
前記上金型と前記下金型を加熱する工程と、
前記下金型に設けられたキャビティに所要量以上の封止樹脂を供給する工程と、
前記半導体素子の搭載面が下金型の前記キャビティが設けられた面に対向するように前記基板を前記下金型に装着する工程と、
前記上金型と前記基板を装着した下金型を密着する工程と、
前記封止樹脂を溶融させ前記予備キャビティに所要量を超えた分の封止樹脂を流入させる工程と、
あらかじめ定められた所定の成型圧力を前記上下可動機構より前記封止樹脂に加圧する工程と
を有し、常に前記キャビティ内の封止樹脂量を一定にして基板を樹脂封止することを特徴とする封止成型方法。 A sealing molding method of resin-sealing a substrate on which one or more semiconductor devices are mounted using a lower die having one or more preliminary cavities provided with an upper die and a vertically movable mechanism,
Heating the upper mold and the lower mold;
Supplying a sealing resin of a required amount or more to a cavity provided in the lower mold;
Attaching the substrate to the lower mold such that the mounting surface of the semiconductor element faces the surface of the lower mold on which the cavity is provided;
A step of closely attaching the upper mold and the lower mold mounted with the substrate;
Melting the sealing resin and flowing the sealing resin in an amount exceeding a required amount into the preliminary cavity; and
And pressurizing the sealing resin with a predetermined molding pressure determined in advance from the vertical movable mechanism, and always sealing the substrate with a constant amount of sealing resin in the cavity. Sealing molding method. 前記下金型に、前記基板を前記下金型から所定の高さに保持するための突出した可動ピンを備えることを特徴とする請求項１記載の封止成型方法。   The sealing molding method according to claim 1, wherein the lower mold includes a protruding movable pin for holding the substrate at a predetermined height from the lower mold. 前記可動ピンの先端が、前記基板の位置決めができるとともに前記基板を前記下金型からある距離を持って保持するための段差を備えることを特徴とする請求項２記載の封止成型方法。   The sealing molding method according to claim 2, wherein a tip of the movable pin includes a step for positioning the substrate and holding the substrate at a certain distance from the lower mold.
JP2005056737A 2005-03-02 2005-03-02 Sealing molding method Withdrawn JP2006245151A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207302A (en) * 2013-04-12 2014-10-30 Ｔｏｗａ株式会社 Compression resin encapsulation method of electronic component, and compression resin encapsulation device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207302A (en) * 2013-04-12 2014-10-30 Ｔｏｗａ株式会社 Compression resin encapsulation method of electronic component, and compression resin encapsulation device

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