JP2006234669A - Heat transfer body, test board, and testing device - Google Patents

Heat transfer body, test board, and testing device Download PDF

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JP2006234669A
JP2006234669A JP2005051428A JP2005051428A JP2006234669A JP 2006234669 A JP2006234669 A JP 2006234669A JP 2005051428 A JP2005051428 A JP 2005051428A JP 2005051428 A JP2005051428 A JP 2005051428A JP 2006234669 A JP2006234669 A JP 2006234669A
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heat transfer
cooling device
test
transfer plates
transfer body
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Atsushi Ono
淳 小野
Takahide Nishiura
孝英 西浦
Satoshi Hanamura
聡 花村
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Advantest Corp
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Advantest Corp
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Priority to JP2005051428A priority Critical patent/JP2006234669A/en
Priority to US11/217,128 priority patent/US7307438B2/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling

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  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat transfer plate enhancing reliability of connection with a cooling system and a system to be cooled. <P>SOLUTION: The heat transfer body conducting heat generated from the member to be cooled to the cooling system is provided that is provided with a plurality of heat transfer plates of layer stacked, each of which have elasticity, and an adhesion member with thermal conductivity which is prepared between each heat transfer plate and holds slidably each heat transfer plate. Each heat transfer plate is desirable to have nearly same configuration. Each heat transfer plate may include a cooling system fixing section firmly fixed to the cooling system and a plurality of stretching sections prepared by stretching from the cooling system fixing section firmly fixed to the members to be cooled independently. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、被冷却部材が発生する熱を冷却装置に伝導する伝熱体、並びに伝熱体を用いたテストボード及び試験装置に関する。   The present invention relates to a heat transfer body that conducts heat generated by a member to be cooled to a cooling device, and a test board and a test apparatus using the heat transfer body.

従来、被冷却部材が発生する熱を冷却装置に伝導し、被冷却部材を冷却するための伝熱体として、例えば熱伝導率の高い金属を用いたものが知られている。当該伝熱体を用いて被冷却部材と冷却装置とを熱的に接続することにより、被冷却部材と冷却装置との間で熱交換を行わせ、被冷却部材を冷却している。   2. Description of the Related Art Conventionally, as a heat transfer body for conducting heat generated by a member to be cooled to a cooling device and cooling the member to be cooled, for example, one using a metal having high thermal conductivity is known. By thermally connecting the member to be cooled and the cooling device using the heat transfer body, heat exchange is performed between the member to be cooled and the cooling device to cool the member to be cooled.

例えば、半導体回路等の電子デバイスを試験する試験装置においては、電子デバイスに供給するための信号を出力するテストボードに多数の集積回路が用いられており、テストボードの回路部が高温になる場合がある。当該回路部を冷却するために、従来の試験装置では、回路部を覆うように冷却装置を設け、水冷等の方法により回路部を冷却している。   For example, in a test apparatus that tests an electronic device such as a semiconductor circuit, a large number of integrated circuits are used in a test board that outputs a signal to be supplied to the electronic device, and the circuit portion of the test board becomes hot. There is. In order to cool the circuit unit, in the conventional test apparatus, a cooling device is provided so as to cover the circuit unit, and the circuit unit is cooled by a method such as water cooling.

テストボードは、電子デバイスを載置するテストヘッドとケーブルを介して接続される。また、テストボードとケーブルとは、コネクタを介して接続される。このため、テストボード側のコネクタは、冷却装置が覆う領域外に表出している必要がある。   The test board is connected to a test head on which the electronic device is placed via a cable. The test board and the cable are connected via a connector. For this reason, the connector on the test board side needs to be exposed outside the area covered by the cooling device.

関連する特許文献等は、現在認識していないため、その記載を省略する。   Since related patent documents and the like are not currently recognized, description thereof is omitted.

テストボードとテストヘッドとの間で高速に信号の授受を行う場合、テストボードとテストヘッドとの間を光ケーブルで接続することが考えられる。このような場合、テストボードには光コネクタが設けられる。   When signals are exchanged at high speed between the test board and the test head, it is conceivable to connect the test board and the test head with an optical cable. In such a case, the test board is provided with an optical connector.

光コネクタは、受光素子、光電変換素子、発光素子等を有するため発熱する。しかし、前述したように光コネクタは冷却装置が覆う領域外に表出している必要がある。このため冷却装置によって直接冷却することができない。   Since the optical connector includes a light receiving element, a photoelectric conversion element, a light emitting element, etc., it generates heat. However, as described above, the optical connector needs to be exposed outside the area covered by the cooling device. For this reason, it cannot be cooled directly by the cooling device.

このように冷却装置から離間した部材を冷却するために、上述した伝熱体を用いて、冷却装置と被冷却部材とを熱的に接続することが知られている。しかし、冷却装置と光コネクタとの高さが異なるような場合、従来の伝熱体は剛体であるため、冷却装置及び光コネクタと、伝熱体との接続が点接触となり、冷却効率が低下してしまう。また、このような場合には、冷却装置等と伝熱体との接続点に応力が生じてしまう。   In order to cool the member separated from the cooling device in this way, it is known to thermally connect the cooling device and the member to be cooled using the above-described heat transfer body. However, when the height of the cooling device and the optical connector is different, the conventional heat transfer body is a rigid body, so the connection between the cooling device and the optical connector and the heat transfer body becomes point contact, and cooling efficiency decreases. Resulting in. In such a case, stress is generated at the connection point between the cooling device and the heat transfer body.

伝熱体は、冷却装置及び光コネクタに、例えばビスによるネジ止め等により固着されるが、集積回路等の被冷却部材は、プリント基板等のボードに半田付けされる。このような状態で、冷却装置等と伝熱体との接続点に応力が生じると、半田付け部にストレスが掛かり、接続の信頼性が劣化してしまうという問題が生じる。   The heat transfer body is fixed to the cooling device and the optical connector by, for example, screwing with screws, but a member to be cooled such as an integrated circuit is soldered to a board such as a printed circuit board. In such a state, if stress is generated at the connection point between the cooling device or the like and the heat transfer body, there is a problem that stress is applied to the soldering portion and connection reliability is deteriorated.

このため本発明は、上述した課題を解決することのできる伝熱体、テストボード、及び試験装置を提供することを目的とする。この目的は、請求の範囲における独立項に記載の特徴の組み合わせにより達成される。また従属項は本発明の更なる有利な具体例を規定する。   Therefore, an object of the present invention is to provide a heat transfer body, a test board, and a test apparatus that can solve the above-described problems. This object is achieved by a combination of features described in the independent claims. The dependent claims define further advantageous specific examples of the present invention.

上記課題を解決するために、本発明の第１の形態においては、被冷却部材が発生する熱を冷却装置に伝導する伝熱体であって、それぞれ弾性を有し、積層して設けられる複数の伝熱板と、それぞれの伝熱板の間に設けられ、それぞれの伝熱板を摺動可能に保持する、熱伝導性を有する粘着部材とを備える伝熱体を提供する。   In order to solve the above-described problem, in the first embodiment of the present invention, a plurality of heat transfer bodies that conduct heat generated by a member to be cooled to a cooling device, each having elasticity and being stacked. There is provided a heat transfer body comprising a heat transfer plate and a pressure-sensitive adhesive member provided between the heat transfer plates and slidably holding the heat transfer plates.

それぞれの伝熱板は、略同一の形状を有することが好ましい。それぞれの伝熱板は、冷却装置に固着される冷却装置固定部と、冷却装置固定部からそれぞれ延伸して設けられ、被冷却部材にそれぞれが独立して固着される複数の延伸部とを有してよい。   Each heat transfer plate preferably has substantially the same shape. Each heat transfer plate has a cooling device fixing portion that is fixed to the cooling device, and a plurality of extending portions that are respectively extended from the cooling device fixing portion and are independently fixed to the member to be cooled. You can do it.

本発明の第２の形態においては、電子デバイスを試験する試験装置であって、電子デバイスを試験するために駆動する複数の回路部と、いずれかの回路部と、他の回路部とを接続するケーブルと、それぞれの回路部とケーブルとを接続するコネクタ部と、複数の回路部の少なくとも一部を冷却する冷却装置と、冷却装置と、冷却装置が冷却する回路部に対応して設けられたコネクタ部とを熱的に接続する伝熱体とを有し、伝熱体は、それぞれ弾性を有し、積層して設けられる複数の伝熱板と、それぞれの伝熱板の間に設けられ、それぞれの伝熱板を摺動可能に固定する、熱伝導性を有する粘着部材とを有する試験装置を提供する。   In the second embodiment of the present invention, a test apparatus for testing an electronic device, which connects a plurality of circuit units that are driven to test the electronic device, one of the circuit units, and another circuit unit Cable, a connector portion for connecting each circuit portion and the cable, a cooling device for cooling at least a part of the plurality of circuit portions, a cooling device, and a circuit portion for cooling the cooling device. A heat transfer body that thermally connects the connector part, the heat transfer bodies each having elasticity, provided with a plurality of heat transfer plates provided in a stacked manner, and between each heat transfer plate, Provided is a test apparatus having an adhesive member having thermal conductivity for slidably fixing each heat transfer plate.

本発明の第３の形態においては、電子デバイスを試験する試験装置であって、電子デバイスと信号の授受を行うテストヘッドと、電子デバイスに供給するべき試験信号を生成し、テストヘッドに供給するテストボードと、テストヘッドとテストボードとを接続するケーブルとを備え、テストボードは、試験信号を生成する回路部と、回路部を冷却する冷却装置と、回路部とケーブルとの間で信号の授受を行うコネクタ部と、冷却装置とコネクタ部とを熱的に接続する伝熱体とを有し、伝熱体は、それぞれ弾性を有し、積層して設けられる複数の伝熱板と、それぞれの伝熱板の間に設けられ、それぞれの伝熱板を摺動可能に固定する、熱伝導性を有する粘着部材とを有する試験装置を提供する。   According to a third aspect of the present invention, there is provided a test apparatus for testing an electronic device, which generates a test head to be transmitted / received to / from the electronic device, a test signal to be supplied to the electronic device, and supplies the test head to the test head. A test board, and a cable connecting the test head and the test board. The test board includes a circuit unit that generates a test signal, a cooling device that cools the circuit unit, and a signal between the circuit unit and the cable. A connector part that performs transmission and reception, and a heat transfer body that thermally connects the cooling device and the connector part, the heat transfer bodies each having elasticity, and a plurality of heat transfer plates provided in a stacked manner; Provided is a test apparatus having a heat conductive adhesive member provided between heat transfer plates and slidably fixing the heat transfer plates.

ケーブルは、テストヘッドとテストボードとを光接続する光ケーブルであり、冷却装置は、回路部を覆い、内部を循環する冷却液により回路部を冷却し、コネクタ部は、冷却装置が覆う領域外に設けられ、回路部とケーブルとを光接続し、伝熱体は、冷却装置と、接続部とを熱的に接続してよい。   The cable is an optical cable that optically connects the test head and the test board. The cooling device covers the circuit unit, cools the circuit unit with coolant circulating inside, and the connector unit is outside the area covered by the cooling device. It is provided and optically connects the circuit unit and the cable, and the heat transfer body may thermally connect the cooling device and the connection unit.

それぞれの前記伝熱板は、略同一の形状を有してよい。それぞれの伝熱板は、冷却装置に固着される冷却装置固定部と、冷却装置固定部からそれぞれ延伸して設けられ、被冷却部材にそれぞれが独立して固着される複数の延伸部とを有してよい。コネクタ部は、ケーブルに接続される複数の光コネクタと、複数の光コネクタと回路部との間の信号の授受を行う複数の送信モジュール、受信モジュール、又は送受信モジュールとを有し、複数の延伸部は、複数の送信モジュール、受信モジュール、又は送受信モジュールに対応して設けられ、対応する送信モジュール、受信モジュール、又は送受信モジュールにそれぞれ熱的に接続されてよい。   Each of the heat transfer plates may have substantially the same shape. Each heat transfer plate has a cooling device fixing portion that is fixed to the cooling device, and a plurality of extending portions that are respectively extended from the cooling device fixing portion and are independently fixed to the member to be cooled. You can do it. The connector unit includes a plurality of optical connectors connected to the cable, and a plurality of transmission modules, reception modules, or transmission / reception modules that exchange signals between the plurality of optical connectors and the circuit unit. The units may be provided corresponding to a plurality of transmission modules, reception modules, or transmission / reception modules, and may be thermally connected to the corresponding transmission modules, reception modules, or transmission / reception modules, respectively.

本発明の第４の形態においては、電子デバイスに供給する信号を生成するテストボードであって、信号を生成する回路部と、回路部を冷却する冷却装置と、回路部とケーブルとの間で信号の授受を行うコネクタ部と、冷却装置とコネクタ部とを熱的に接続する伝熱体とを有し、伝熱体は、それぞれ弾性を有し、積層して設けられる複数の伝熱板と、それぞれの伝熱板の間に設けられ、それぞれの伝熱板を摺動可能に固定する、熱伝導性を有する粘着部材とを有するテストボードを提供する。   According to a fourth aspect of the present invention, there is provided a test board that generates a signal to be supplied to an electronic device, and includes a circuit unit that generates a signal, a cooling device that cools the circuit unit, and a circuit unit and a cable. A plurality of heat transfer plates provided with a connector portion for transmitting and receiving signals and a heat transfer body for thermally connecting the cooling device and the connector portion, each heat transfer body having elasticity And a heat conductive adhesive member provided between the heat transfer plates and slidably fixing the heat transfer plates.

なお、上記の発明の概要は、本発明の必要な特徴の全てを列挙したものではなく、これらの特徴群のサブコンビネーションもまた、発明となりうる。   The above summary of the invention does not enumerate all the necessary features of the present invention, and sub-combinations of these feature groups can also be the invention.

以下、発明の実施の形態を通じて本発明を説明するが、以下の実施形態は特許請求の範囲にかかる発明を限定するものではなく、また実施形態の中で説明されている特徴の組み合わせの全てが発明の解決手段に必須であるとは限らない。   Hereinafter, the present invention will be described through embodiments of the invention. However, the following embodiments do not limit the invention according to the scope of claims, and all combinations of features described in the embodiments are included. It is not necessarily essential for the solution of the invention.

図１は、本発明の実施形態に係る試験装置１００の構成の一例を示す図である。試験装置１００は、半導体回路等の電子デバイス３００を試験する装置であって、メインフレーム１０、複数のケーブルユニット１６、及びテストヘッド１２を備える。本例においてメインフレーム１０とテストヘッド１２との間の信号の伝送は、光ケーブル１４を用いて行われる。   FIG. 1 is a diagram illustrating an example of a configuration of a test apparatus 100 according to an embodiment of the present invention. The test apparatus 100 is an apparatus for testing an electronic device 300 such as a semiconductor circuit, and includes a main frame 10, a plurality of cable units 16, and a test head 12. In this example, transmission of signals between the main frame 10 and the test head 12 is performed using the optical cable 14.

テストヘッド１２は、電子デバイス３００を載置し、電子デバイス３００と信号の授受を行う。例えばテストヘッド１２は、光ケーブル１４及びケーブルユニット１６を介してメインフレーム１０と接続され、メインフレーム１０から受け取る制御信号に基づいて、電子デバイス３００に試験パターンを印加する。またテストヘッド１２は、複数の電子デバイス３００と信号の授受を行ってよい。   The test head 12 places the electronic device 300 and exchanges signals with the electronic device 300. For example, the test head 12 is connected to the main frame 10 via the optical cable 14 and the cable unit 16, and applies a test pattern to the electronic device 300 based on a control signal received from the main frame 10. The test head 12 may exchange signals with a plurality of electronic devices 300.

メインフレーム１０は、制御信号を生成しテストヘッド１２に供給する。メインフレーム１０は、図２において後述する複数のテストボード２０を有する。それぞれのテストボード２０は、それぞれの機能に応じた制御信号を生成する。またそれぞれのテストボード２０には、複数のコネクタが設けられており、当該コネクタを介して、対応するケーブルユニット１６と接続する。本例において、それぞれのコネクタは、光ファイバケーブル用のコネクタである。   The main frame 10 generates a control signal and supplies it to the test head 12. The main frame 10 has a plurality of test boards 20 described later in FIG. Each test board 20 generates a control signal corresponding to each function. Each test board 20 is provided with a plurality of connectors, and is connected to the corresponding cable unit 16 via the connectors. In this example, each connector is a connector for an optical fiber cable.

複数のケーブルユニット１６は、複数のテストボード２０と対応して設けられる。それぞれのケーブルユニット１６は、一端が対応するテストボード２０のコネクタに接続され、他端がテストヘッド１２に接続される。つまり、それぞれのケーブルユニット１６は、テストボード２０とテストヘッド１２とを光接続し、制御信号をテストヘッド１２へ伝送する。   The plurality of cable units 16 are provided corresponding to the plurality of test boards 20. Each cable unit 16 has one end connected to the corresponding connector of the test board 20 and the other end connected to the test head 12. That is, each cable unit 16 optically connects the test board 20 and the test head 12 and transmits a control signal to the test head 12.

図２は、テストボード２０の構成の一例を示す。テストボード２０は、回路基板２２、冷却装置２４、コネクタ部２７、及び伝熱体３０を有する。回路基板２２には、集積回路等を有する回路部（図示せず）が形成され、当該回路部は、テストヘッド１２に伝送するべき信号を生成し、またテストヘッド１２から受け取る信号を処理する。また、当該回路部は、コネクタ２６を介してケーブルユニット１６と信号の授受を行う。   FIG. 2 shows an example of the configuration of the test board 20. The test board 20 includes a circuit board 22, a cooling device 24, a connector unit 27, and a heat transfer body 30. A circuit part (not shown) having an integrated circuit or the like is formed on the circuit board 22, and the circuit part generates a signal to be transmitted to the test head 12 and processes a signal received from the test head 12. The circuit unit exchanges signals with the cable unit 16 via the connector 26.

冷却装置２４は、当該回路部の少なくとも一部を覆うように、回路基板２２に設けられる。例えば冷却装置２４は、当該回路部の全てを覆うように設けられてよく、回路部のうちの発熱量が多い領域を覆うように設けられていてもよい。冷却装置２４は、例えば内部を循環する冷媒により、回路部を冷却する。また冷却装置２４は、ビス３２等により、回路基板２２の表面に固定される。   The cooling device 24 is provided on the circuit board 22 so as to cover at least a part of the circuit unit. For example, the cooling device 24 may be provided so as to cover all of the circuit unit, or may be provided so as to cover a region of the circuit unit that generates a large amount of heat. The cooling device 24 cools the circuit unit with, for example, a refrigerant circulating inside. The cooling device 24 is fixed to the surface of the circuit board 22 with screws 32 or the like.

コネクタ部２７は、テストボード２０の回路部と、ケーブルユニット１６との間の信号の授受を行う。コネクタ部２７は、モジュール３８、ケーブルユニット１６と接続されるコネクタ２６、及びコネクタ２６を回路基板２２の側面に固定し、モジュール３８とコネクタ２６とを光学的に接続するコネクタ保持部２８を有する。本例においてコネクタ２６は光コネクタである。また、モジュール３８は、コネクタ２６と、テストボード２０の回路部との間の信号の授受を行う送信モジュール、受信モジュール、又は送受信モジュールである。また、コネクタ部２７が設けられる回路基板２２の領域３４は、冷却装置２４に覆われていない。例えば、冷却装置２４は、コネクタ部２７が設けられる回路基板２２の領域に対応する領域が切り欠かれていてよい。   The connector unit 27 exchanges signals between the circuit unit of the test board 20 and the cable unit 16. The connector unit 27 includes a module 38, a connector 26 connected to the cable unit 16, and a connector holding unit 28 that fixes the connector 26 to the side surface of the circuit board 22 and optically connects the module 38 and the connector 26. In this example, the connector 26 is an optical connector. The module 38 is a transmission module, a reception module, or a transmission / reception module that exchanges signals between the connector 26 and the circuit unit of the test board 20. Further, the region 34 of the circuit board 22 where the connector portion 27 is provided is not covered with the cooling device 24. For example, the cooling device 24 may have a cutout region corresponding to the region of the circuit board 22 where the connector portion 27 is provided.

伝熱体３０は、一端がコネクタ部２７のモジュール３８に接続され、他端が冷却装置２４に接続され、モジュール３８が発生する熱を冷却装置２４に伝導する。ここで、冷却装置２４の上面の位置が、モジュール３８の上面の位置より高い場合には、冷却装置２４において、伝熱体３０が接続される領域３６は、他の領域に比べ、回路基板２２の表面に近い位置に設けられることが好ましい。つまり、領域３６の上面の高さは、冷却装置２４の他の領域の上面の高さより低いことが好ましい。例えば、領域３６の上面の高さは、モジュール３８の上面の高さと略等しい。このような構成により、冷却装置２４と離間して設けられたコネクタ部２７を冷却することができる。   One end of the heat transfer body 30 is connected to the module 38 of the connector portion 27 and the other end is connected to the cooling device 24, and the heat generated by the module 38 is conducted to the cooling device 24. Here, when the position of the upper surface of the cooling device 24 is higher than the position of the upper surface of the module 38, in the cooling device 24, the region 36 to which the heat transfer body 30 is connected is compared with other regions. It is preferable that it is provided at a position close to the surface. That is, the height of the upper surface of the region 36 is preferably lower than the height of the upper surface of the other region of the cooling device 24. For example, the height of the upper surface of the region 36 is substantially equal to the height of the upper surface of the module 38. With such a configuration, it is possible to cool the connector portion 27 that is provided apart from the cooling device 24.

図３は、伝熱体３０及びその周辺の拡大図である。前述したように、コネクタ部２７は、それぞれのコネクタ２６と回路部との間の信号の授受を行う複数のモジュール３８を有する。モジュール３８は、例えば受光素子、発光素子、光電変換素子等を含む回路である。それぞれのモジュール３８は、冷却装置２４に覆われていない回路基板２２の領域３４に設けられる。   FIG. 3 is an enlarged view of the heat transfer body 30 and its surroundings. As described above, the connector unit 27 includes a plurality of modules 38 that exchange signals between the respective connectors 26 and the circuit unit. The module 38 is a circuit including, for example, a light receiving element, a light emitting element, a photoelectric conversion element, and the like. Each module 38 is provided in a region 34 of the circuit board 22 that is not covered by the cooling device 24.

複数のモジュール３８の上面には、熱伝導のための金属板４４が設けられる。伝熱体３０は、それぞれのモジュール３８に設けられた金属板４４と、冷却装置２４とを熱的に接続する。伝熱体３０は、例えばビス４０及びビス４２により、モジュール３８及び冷却装置２４に固着される。このとき、ビス４０は、伝熱体３０、金属板４４、及びモジュール３８を一括して固定してよい。   A metal plate 44 for heat conduction is provided on the upper surfaces of the plurality of modules 38. The heat transfer body 30 thermally connects the metal plate 44 provided in each module 38 and the cooling device 24. The heat transfer body 30 is fixed to the module 38 and the cooling device 24 by, for example, screws 40 and screws 42. At this time, the screw 40 may fix the heat transfer body 30, the metal plate 44, and the module 38 together.

図４は、伝熱体３０及びその周辺の断面図である。本例におけるモジュール３８は送信モジュールであり、集積回路５８及び発光素子３９を有する。また、モジュール３８が受信モジュールである場合、モジュール３８は、発光素子３９に代えて受光素子を有し、送受信モジュールである場合、モジュール３８は、集積回路５８、発光素子３９、及び受光素子を有する。前述したように、伝熱体３０は、一端がモジュール３８の上面に固着され、他端が冷却装置２４の上面に固着される。また、集積回路５８及び発光素子３９は、伝熱体３０の当該端部と熱的に接続される。このような場合、伝熱体３０のそれぞれの端部が固着される面の高さは等しいことが好ましいが、設計上の問題等により、それぞれの面の高さを等しくできない場合がある。また、冷却装置２４に冷却水等の冷媒を循環させた場合に、冷却装置２４の上面の高さが変動してしまう場合もある。本例における伝熱体３０は、当該高さの違いにより接続点に生じる応力を低減し、伝熱体３０の接続信頼性を向上させた構成を有する。このような構成により、モジュール３８における集積回路５８や発光素子３９等の発熱体を冷却することができる。次に、伝熱体３０の構成について説明する。   FIG. 4 is a cross-sectional view of the heat transfer body 30 and its surroundings. The module 38 in this example is a transmission module, and includes an integrated circuit 58 and a light emitting element 39. When the module 38 is a receiving module, the module 38 has a light receiving element instead of the light emitting element 39. When the module 38 is a transmission / reception module, the module 38 has an integrated circuit 58, a light emitting element 39, and a light receiving element. . As described above, one end of the heat transfer body 30 is fixed to the upper surface of the module 38, and the other end is fixed to the upper surface of the cooling device 24. Further, the integrated circuit 58 and the light emitting element 39 are thermally connected to the end portion of the heat transfer body 30. In such a case, it is preferable that the heights of the surfaces to which the respective end portions of the heat transfer body 30 are fixed are equal, but the heights of the respective surfaces may not be equal due to a design problem or the like. In addition, when a coolant such as cooling water is circulated through the cooling device 24, the height of the upper surface of the cooling device 24 may fluctuate. The heat transfer body 30 in this example has a configuration in which the stress generated at the connection point due to the difference in height is reduced and the connection reliability of the heat transfer body 30 is improved. With such a configuration, the heating elements such as the integrated circuit 58 and the light emitting element 39 in the module 38 can be cooled. Next, the configuration of the heat transfer body 30 will be described.

図５は、伝熱体３０の断面の拡大図である。伝熱体３０は、複数の伝熱板４６、及び粘着部材４８を有する。複数の伝熱板４６は、それぞれ弾性を有し、積層して設けられる。それぞれの伝熱板４６は、例えば弾性を有するように十分に薄く形成された銅等の金属板であってよい。   FIG. 5 is an enlarged view of a cross section of the heat transfer body 30. The heat transfer body 30 includes a plurality of heat transfer plates 46 and an adhesive member 48. The plurality of heat transfer plates 46 have elasticity and are provided in a stacked manner. Each heat transfer plate 46 may be a metal plate such as copper formed sufficiently thin so as to have elasticity, for example.

粘着部材４８は、それぞれの伝熱板４６の間に設けられ、それぞれの伝熱板４６を摺動可能に保持する。また、粘着部材４８は、高い熱伝導性を有することが好ましい。つまり、それぞれの伝熱板４６は、垂直方向に積層され、それぞれ水平方向に摺動可能に保持される。粘着部材４８は、例えば高熱伝導率の金属粒子が混入されたグリスであってよい。   The adhesive member 48 is provided between the heat transfer plates 46 and holds the heat transfer plates 46 so as to be slidable. The adhesive member 48 preferably has high thermal conductivity. That is, the respective heat transfer plates 46 are stacked in the vertical direction and are slidably held in the horizontal direction. The adhesive member 48 may be, for example, grease mixed with metal particles having high thermal conductivity.

このような構成により、伝熱体３０が固着される面の高さが異なる場合であっても、伝熱体３０の湾曲により応力を分散し、接続点にかかるストレスを低減することができる。つまり、伝熱体３０を、コネクタ部２７及び冷却装置２４の接続面に接触させた場合、当該接続面の高さの違いに応じて、それぞれの伝熱板４６が摺動し、湾曲による応力を分散する。そして、伝熱板４６が摺動した状態で、ビス等により固着されるため、モジュール３８と、回路基板２２との半田付け部にかかるストレスを低減した状態で、伝熱板４６を固着することができる。このため、半田付け部の接続信頼性を向上させることができる。   With such a configuration, even when the height of the surface to which the heat transfer body 30 is fixed is different, the stress is dispersed by the curvature of the heat transfer body 30, and the stress applied to the connection point can be reduced. That is, when the heat transfer body 30 is brought into contact with the connection surface of the connector portion 27 and the cooling device 24, each heat transfer plate 46 slides according to the difference in height of the connection surface, and stress due to bending. To distribute. Since the heat transfer plate 46 is slid and fixed by screws or the like, the heat transfer plate 46 is fixed in a state where stress applied to the soldering portion between the module 38 and the circuit board 22 is reduced. Can do. For this reason, the connection reliability of a soldering part can be improved.

また、図５においては、粘着部材４８が全体に塗布されているが、粘着部材４８の熱伝導率は、銅板等を用いた伝熱板４６の熱伝導率より低いため、他の例においては、伝熱板４６の表面の一部に粘着部材４８が塗布されていてもよい。また、粘着部材４８は、できるだけ薄く塗布されることが好ましい。また、粘着部材４８は、非固形化の材料で形成されることが好ましい。また、粘着部材４８は、伝熱体３０の外部に拡散しないように形成されることが好ましい。   Further, in FIG. 5, the adhesive member 48 is applied to the whole, but the thermal conductivity of the adhesive member 48 is lower than the thermal conductivity of the heat transfer plate 46 using a copper plate or the like. The adhesive member 48 may be applied to a part of the surface of the heat transfer plate 46. The adhesive member 48 is preferably applied as thin as possible. In addition, the adhesive member 48 is preferably formed of a non-solid material. Further, the adhesive member 48 is preferably formed so as not to diffuse outside the heat transfer body 30.

図６（ａ）及び図６（ｂ）は、伝熱体３０が有する伝熱板４６の上面図の例を示す。図６（ａ）に示すように、伝熱板４６は、上面が略長方形であってよい。また、それぞれの伝熱板４６は、略同一の形状を有し、それぞれの端部には、被冷却部材及び冷却装置に固着するためのビス穴５０及びビス穴５２が設けられる。   FIG. 6A and FIG. 6B show examples of top views of the heat transfer plate 46 included in the heat transfer body 30. As shown in FIG. 6A, the upper surface of the heat transfer plate 46 may be substantially rectangular. Each heat transfer plate 46 has substantially the same shape, and a screw hole 50 and a screw hole 52 for fixing to a member to be cooled and a cooling device are provided at each end.

それぞれの伝熱板４６に設けられるビス穴５０及びビス穴５２は、伝熱板４６が長手方向に摺動した場合であっても、複数の伝熱板４６を一括して固着できる形状を有することが好ましい。例えば、伝熱板４６の長手方向におけるビス穴５０及びビス穴５２の幅は、伝熱板４６の短手方向におけるビス穴５０及びビス穴５２の幅より大きくてよい。   The screw holes 50 and the screw holes 52 provided in the respective heat transfer plates 46 have a shape that allows a plurality of heat transfer plates 46 to be fixed together even when the heat transfer plates 46 slide in the longitudinal direction. It is preferable. For example, the widths of the screw holes 50 and the screw holes 52 in the longitudinal direction of the heat transfer plate 46 may be larger than the widths of the screw holes 50 and the screw holes 52 in the short direction of the heat transfer plate 46.

また、図６（ｂ）に示すように、伝熱板４６は、冷却装置２４に固着されるべき冷却装置固定部５４、及び複数の被冷却部材に固着されるべき複数の延伸部５６を有していてもよい。複数の延伸部５６は、冷却装置固定部５４からそれぞれ延伸して設けられており、それぞれが離間して設けられる。つまり、複数の延伸部５６は櫛状に設けられる。そして、複数の延伸部５６は、それぞれが独立して、対応する被冷却部材に固着される。   Further, as shown in FIG. 6B, the heat transfer plate 46 has a cooling device fixing portion 54 to be fixed to the cooling device 24 and a plurality of extending portions 56 to be fixed to a plurality of members to be cooled. You may do it. The plurality of extending portions 56 are provided so as to extend from the cooling device fixing portion 54, and are provided separately from each other. That is, the plurality of extending portions 56 are provided in a comb shape. The plurality of extending portions 56 are independently fixed to the corresponding members to be cooled.

このような構成により、複数の被冷却部材と冷却装置２４とを一括して熱的に接続することができる。また、複数の延伸部５６が離間して設けられることにより、複数の被冷却部材の上面の高さが異なる場合であっても、高低差を吸収することができる。例えば、図３に示したように、複数の延伸部５６は、コネクタ部２７が有する複数のモジュール３８に対応して設けられ、対応するモジュール３８にそれぞれ熱的に接続される。   With such a configuration, the plurality of members to be cooled and the cooling device 24 can be thermally connected together. Moreover, even if it is a case where the height of the upper surface of a several to-be-cooled member differs by providing the several extending | stretching part 56 apart, a height difference can be absorbed. For example, as shown in FIG. 3, the plurality of extending portions 56 are provided corresponding to the plurality of modules 38 included in the connector portion 27, and are thermally connected to the corresponding modules 38, respectively.

以上、本発明を実施の形態を用いて説明したが、本発明の技術的範囲は上記実施の形態に記載の範囲には限定されない。上記実施の形態に、多様な変更または改良を加えることが可能であることが当業者に明らかである。その様な変更または改良を加えた形態も本発明の技術的範囲に含まれ得ることが、特許請求の範囲の記載から明らかである。   As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

例えば、図３において伝熱体３０は、テストボード２０における回路部とコネクタ部２７とを熱的に接続するために用いられているが、伝熱体３０は、試験装置１００の他の箇所にも用いることができる。つまり、試験装置１００は、電子デバイスを試験するために駆動する複数の回路部と、これらの回路部を接続するケーブルと、それぞれの回路部とケーブルとを接続するコネクタ部と、複数の回路部の少なくとも一部を冷却する冷却装置とを備えており、伝熱体３０は、冷却装置と、当該冷却装置が冷却する回路部に対応して設けられたコネクタ部とを熱的に接続する。例えば、伝熱体３０は、テストヘッド１２において用いられていてもよい。   For example, in FIG. 3, the heat transfer body 30 is used to thermally connect the circuit section and the connector section 27 in the test board 20, but the heat transfer body 30 is connected to other parts of the test apparatus 100. Can also be used. That is, the test apparatus 100 includes a plurality of circuit units that are driven to test an electronic device, a cable that connects these circuit units, a connector unit that connects each circuit unit and the cable, and a plurality of circuit units. The heat transfer body 30 thermally connects the cooling device and a connector unit provided corresponding to the circuit unit that is cooled by the cooling device. For example, the heat transfer body 30 may be used in the test head 12.

以上から明らかなように、本発明によれば、冷却装置及び被冷却装置との接続信頼性を向上させた伝熱板を提供することができる。   As is apparent from the above, according to the present invention, it is possible to provide a heat transfer plate with improved connection reliability with the cooling device and the device to be cooled.

本発明の実施形態に係る試験装置１００の構成の一例を示す図である。It is a figure which shows an example of a structure of the test apparatus 100 which concerns on embodiment of this invention. テストボード２０の構成の一例を示す図である。2 is a diagram illustrating an example of a configuration of a test board 20. FIG. 伝熱体３０及びその周辺の拡大図を示す。The enlarged view of the heat exchanger 30 and its periphery is shown. 伝熱体３０及びその周辺の断面図を示す。Sectional drawing of the heat-transfer body 30 and its periphery is shown. 伝熱体３０の断面の拡大図を示す。The enlarged view of the cross section of the heat-transfer body 30 is shown. 図６（ａ）及び図６（ｂ）は、伝熱体３０の上面図の例を示す。6A and 6B show examples of top views of the heat transfer body 30. FIG.

符号の説明Explanation of symbols

１０・・・メインフレーム、１２・・・テストヘッド、１４・・・光ケーブル、１６・・・ケーブルユニット、２０・・・テストボード、２２・・・回路基板、２４・・・冷却装置、２６・・・コネクタ、２７・・・コネクタ部、２８・・・コネクタ保持部、３０・・・伝熱体、３２・・・ビス、３４、３６・・・領域、３８・・・モジュール、３９・・・発光素子、４０、４２・・・ビス、４４・・・金属板、４６・・・伝熱板、４８・・・粘着部材、５０、５２・・・ビス穴、５４・・・冷却装置固定部、５６・・・延伸部、５８・・・集積回路、１００・・・試験装置、３００・・・電子デバイス DESCRIPTION OF SYMBOLS 10 ... Main frame, 12 ... Test head, 14 ... Optical cable, 16 ... Cable unit, 20 ... Test board, 22 ... Circuit board, 24 ... Cooling device, 26. ..Connector, 27... Connector portion, 28... Connector holding portion, 30... Heat transfer body, 32... Screw, 34, 36. Light emitting element, 40, 42 ... screw, 44 ... metal plate, 46 ... heat transfer plate, 48 ... adhesive member, 50, 52 ... screw hole, 54 ... cooling device fixing Part, 56 ... extension part, 58 ... integrated circuit, 100 ... test equipment, 300 ... electronic device

Claims (10)

被冷却部材が発生する熱を冷却装置に伝導する伝熱体であって、
それぞれ弾性を有し、積層して設けられる複数の伝熱板と、
それぞれの前記伝熱板の間に設けられ、それぞれの前記伝熱板を摺動可能に保持する、熱伝導性を有する粘着部材と
を備える伝熱体。 A heat transfer body that conducts heat generated by the member to be cooled to the cooling device,
A plurality of heat transfer plates each having elasticity and provided by being laminated;
A heat transfer body provided with a heat conductive adhesive member provided between the heat transfer plates and slidably holding the heat transfer plates. それぞれの前記伝熱板は、略同一の形状を有する
請求項１に記載の伝熱体。 The heat transfer body according to claim 1, wherein each of the heat transfer plates has substantially the same shape. それぞれの前記伝熱板は、
前記冷却装置に固着される冷却装置固定部と、
前記冷却装置固定部からそれぞれ延伸して設けられ、前記被冷却部材にそれぞれが独立して固着される複数の延伸部と
を有する請求項２に記載の伝熱体。 Each of the heat transfer plates is
A cooling device fixing part fixed to the cooling device;
The heat transfer body according to claim 2, further comprising: a plurality of extending portions that are respectively extended from the cooling device fixing portion and are independently fixed to the member to be cooled. 電子デバイスを試験する試験装置であって、
前記電子デバイスを試験するために駆動する複数の回路部と、
いずれかの前記回路部と、他の前記回路部とを接続するケーブルと、
それぞれの前記回路部と前記ケーブルとを接続するコネクタ部と、
前記複数の回路部の少なくとも一部を冷却する冷却装置と、
前記冷却装置と、前記冷却装置が冷却する前記回路部に対応して設けられた前記コネクタ部とを熱的に接続する伝熱体と
を有し、
前記伝熱体は、
それぞれ弾性を有し、積層して設けられる複数の伝熱板と、
それぞれの前記伝熱板の間に設けられ、それぞれの前記伝熱板を摺動可能に固定する、熱伝導性を有する粘着部材と
を有する試験装置。 A test apparatus for testing an electronic device,
A plurality of circuit portions that are driven to test the electronic device;
A cable connecting any one of the circuit units and the other circuit unit;
A connector part for connecting the circuit part and the cable;
A cooling device for cooling at least a part of the plurality of circuit units;
A heat transfer body that thermally connects the cooling device and the connector portion provided corresponding to the circuit portion that is cooled by the cooling device;
The heat transfer body is
A plurality of heat transfer plates each having elasticity and provided by being laminated;
A test apparatus having a heat conductive adhesive member provided between the heat transfer plates and slidably fixing the heat transfer plates. 電子デバイスを試験する試験装置であって、
前記電子デバイスと信号の授受を行うテストヘッドと、
前記電子デバイスに供給するべき試験信号を生成し、前記テストヘッドに供給するテストボードと、
前記テストヘッドと前記テストボードとを接続するケーブルと
を備え、
前記テストボードは、
前記試験信号を生成する回路部と、
前記回路部を冷却する冷却装置と、
前記回路部と前記ケーブルとの間で信号の授受を行うコネクタ部と、
前記冷却装置と前記コネクタ部とを熱的に接続する伝熱体と
を有し、
前記伝熱体は、
それぞれ弾性を有し、積層して設けられる複数の伝熱板と、
それぞれの前記伝熱板の間に設けられ、それぞれの前記伝熱板を摺動可能に固定する、熱伝導性を有する粘着部材と
を有する試験装置。 A test apparatus for testing an electronic device,
A test head for exchanging signals with the electronic device;
A test board for generating a test signal to be supplied to the electronic device and supplying the test signal to the test head;
A cable for connecting the test head and the test board;
The test board is
A circuit unit for generating the test signal;
A cooling device for cooling the circuit unit;
A connector part for transferring signals between the circuit part and the cable;
A heat transfer member that thermally connects the cooling device and the connector portion;
The heat transfer body is
A plurality of heat transfer plates each having elasticity and provided by being laminated;
A test apparatus comprising: a heat conductive adhesive member provided between the heat transfer plates and slidably fixing the heat transfer plates. 前記ケーブルは、前記テストヘッドと前記テストボードとを光接続する光ケーブルであり、
前記冷却装置は、前記回路部を覆い、内部を循環する冷却液により前記回路部を冷却し、
前記コネクタ部は、前記冷却装置が覆う領域外に設けられ、前記回路部と前記ケーブルとを光接続し、
前記伝熱体は、前記冷却装置と、前記コネクタ部とを熱的に接続する
請求項５に記載の試験装置。 The cable is an optical cable that optically connects the test head and the test board;
The cooling device covers the circuit unit, cools the circuit unit with a coolant circulating inside, and
The connector part is provided outside the area covered by the cooling device, optically connects the circuit part and the cable,
The test apparatus according to claim 5, wherein the heat transfer body thermally connects the cooling device and the connector unit. それぞれの前記伝熱板は、略同一の形状を有する
請求項５に記載の試験装置。 The test apparatus according to claim 5, wherein each of the heat transfer plates has substantially the same shape. それぞれの前記伝熱板は、
前記冷却装置に固着される冷却装置固定部と、
前記冷却装置固定部からそれぞれ延伸して設けられ、前記コネクタ部にそれぞれが独立して固着される複数の延伸部と
を有する請求項６に記載の試験装置。 Each of the heat transfer plates is
A cooling device fixing part fixed to the cooling device;
The test apparatus according to claim 6, further comprising: a plurality of extending portions that are respectively extended from the cooling device fixing portion and are independently fixed to the connector portion. 前記コネクタ部は、
前記ケーブルに接続される複数の光コネクタと、
前記複数の光コネクタと前記回路部との間の信号の授受を行う複数の送信モジュール、受信モジュール、又は送受信モジュールと
を有し、
前記複数の延伸部は、前記複数の送信モジュール、前記受信モジュール、又は前記送受信モジュールに対応して設けられ、対応する前記送信モジュール、前記受信モジュール、又は前記送受信モジュールにそれぞれ熱的に接続される
請求項８に記載の試験装置。 The connector part is
A plurality of optical connectors connected to the cable;
A plurality of transmission modules for receiving and transmitting signals between the plurality of optical connectors and the circuit unit, a reception module, or a transmission / reception module;
The plurality of extending portions are provided corresponding to the plurality of transmission modules, the reception module, or the transmission / reception module, and are thermally connected to the corresponding transmission module, the reception module, or the transmission / reception module, respectively. The test apparatus according to claim 8. 電子デバイスに供給する信号を生成するテストボードであって、
前記信号を生成する回路部と、
前記回路部を冷却する冷却装置と、
前記回路部と外部のケーブルとの間で信号の授受を行うコネクタ部と、
前記冷却装置と前記コネクタ部とを熱的に接続する伝熱体と
を有し、
前記伝熱体は、
それぞれ弾性を有し、積層して設けられる複数の伝熱板と、
それぞれの前記伝熱板の間に設けられ、それぞれの前記伝熱板を摺動可能に固定する、熱伝導性を有する粘着部材と
を有するテストボード。 A test board for generating a signal to be supplied to an electronic device,
A circuit unit for generating the signal;
A cooling device for cooling the circuit unit;
A connector part for transferring signals between the circuit part and an external cable;
A heat transfer member that thermally connects the cooling device and the connector portion;
The heat transfer body is
A plurality of heat transfer plates each having elasticity and provided by being laminated;
A test board having a heat conductive adhesive member provided between the heat transfer plates and slidably fixing the heat transfer plates.
JP2005051428A 2005-02-25 2005-02-25 Heat transfer body, test board, and testing device Pending JP2006234669A (en)

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