JP2006229125A - Connection device of ic chip - Google Patents

Connection device of ic chip Download PDF

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Publication number
JP2006229125A
JP2006229125A JP2005043928A JP2005043928A JP2006229125A JP 2006229125 A JP2006229125 A JP 2006229125A JP 2005043928 A JP2005043928 A JP 2005043928A JP 2005043928 A JP2005043928 A JP 2005043928A JP 2006229125 A JP2006229125 A JP 2006229125A
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Prior art keywords
chip
substrate
pressure
pressure receiving
receiving member
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JP2005043928A
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Japanese (ja)
Inventor
Hiroshi Takabayashi
広 高林
Akihiko Komura
明彦 小村
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Canon Inc
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Canon Inc
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Priority to JP2005043928A priority Critical patent/JP2006229125A/en
Publication of JP2006229125A publication Critical patent/JP2006229125A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Abstract

<P>PROBLEM TO BE SOLVED: To provide a collective compression ACF bonding device of IC chip in surface IC packaging of an ink jet recording head. <P>SOLUTION: The connection device of an IC chip for connecting a substrate with the IC chip through adhesive comprises a compressing section composed of high pressure gas and a flexible film, a pressure receiving member having a heating function and being applied with pressure from the compressing section, and a protective film. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は基板とＩＣチップを接着剤を介して接続する接続装置に関するものである。更に本発明は、ＩＣチップを複数個搭載されたマルチチップモジュールにおいて、接着剤を加圧加熱する工程を一括処理することで生産性に優れた接続装置に関するものである。   The present invention relates to a connection device for connecting a substrate and an IC chip via an adhesive. Furthermore, the present invention relates to a connection device that is excellent in productivity by collectively processing a process of pressurizing and heating an adhesive in a multichip module in which a plurality of IC chips are mounted.

基板とＩＣチップとを接着剤を介して接続するＩＣチップの従来の接続方法について、図５〜図６を用いて説明する。   A conventional IC chip connection method for connecting a substrate and an IC chip via an adhesive will be described with reference to FIGS.

図５は従来の接続装置を示す断面図で、基板１にＩＣチップ２を接着剤３を介して接続する場合、エアーシリンダー７１等の加圧部の先端に加熱手段を有するツール８１と、加圧加熱するときに接着剤３の一部がツール８１に付着しその後の接続において均一な加圧加熱ができなくなることを防止することを目的としてＩＣチップとの間にテフロン（登録商標）やシリコーン等の樹脂フィルム９１を載置し、基板１は接合装置の支持体４に載置して加熱する接続装置が知られている。このような接続装置では基板１の耐熱特性が一般的には低いことが多いことを考慮して、支持体側の加熱温度を低めに設定し又は全く加熱しない方法が用いられる。   FIG. 5 is a cross-sectional view showing a conventional connecting device. When the IC chip 2 is connected to the substrate 1 via the adhesive 3, a tool 81 having a heating means at the tip of a pressurizing part such as an air cylinder 71, and the like are added. Teflon (registered trademark) or silicone is used between the IC chip and the IC chip for the purpose of preventing a part of the adhesive 3 from adhering to the tool 81 during pressure heating and preventing uniform pressure heating in subsequent connections. A connecting device is known in which a resin film 91 is placed and the substrate 1 is placed on a support 4 of a joining device and heated. In consideration of the fact that the heat resistance characteristics of the substrate 1 are generally low in such a connection device, a method is used in which the heating temperature on the support side is set low or not heated at all.

図６は特開平９−２１９４１７で公知の実装装置で、基板の反りを低減することを目的に、基板側の温度制御装置８２とＩＣチップ側の温度制御装置８３によって加熱し冷却しようとするものである。
特開平９−２１９４１７号公報 FIG. 6 shows a mounting apparatus known from Japanese Patent Laid-Open No. 9-219417, which is intended to be heated and cooled by a temperature control device 82 on the substrate side and a temperature control device 83 on the IC chip side for the purpose of reducing the warpage of the substrate. It is.
JP-A-9-219417

このような実装装置は、簡単な工程で複数の電極を同時に接続できるために接続コストが安く、接続時間も短いと言う特徴を持っている。更にこのような実装装置においては、接着剤の硬化温度が低いために比較的低温度の工程で信頼性の高い接続を達成することができるために、耐熱性が比較的低いデバイスにおいても信頼性の高い実装構造体を製造することが可能である。たとえばインク内の気泡の成長方向とインクの吐出方向とが同じになるタイプのインクジェット記録ヘッドの基板を長尺に形成する場合、インク吐出口は樹脂で形成されるために低温度の接続工程であり、長尺の記録ヘッドを形成するために複数個のＩＣチップを接着剤を介して接続するために、このような装置を用いることはきわめて効果的である。   Such a mounting apparatus has a feature that the connection cost is low and the connection time is short because a plurality of electrodes can be connected simultaneously by a simple process. Further, in such a mounting apparatus, since the curing temperature of the adhesive is low, a highly reliable connection can be achieved in a relatively low temperature process. It is possible to manufacture a mounting structure having a high height. For example, when forming a substrate of an ink jet recording head of a type in which the growth direction of bubbles in the ink and the ink discharge direction are the same, the ink discharge port is formed of a resin, so that it is a low temperature connection process. In order to form a long recording head, it is extremely effective to use such an apparatus for connecting a plurality of IC chips via an adhesive.

ところでこのような実装装置においては、エアーシリンダー７１等の加圧部の形状が大きくなってしまい装置を小型化できないという問題を持っている。   By the way, in such a mounting apparatus, there exists a problem that the shape of pressurization parts, such as the air cylinder 71, becomes large, and an apparatus cannot be reduced in size.

更に、特開平９−２１９４１７で公知の実装装置では、基板側とＩＣチップ側から加熱し冷却しようとするために更に装置が大型化してしまうという問題を持っている。   Furthermore, the mounting apparatus known from Japanese Patent Laid-Open No. 9-219417 has a problem that the apparatus is further increased in size because it attempts to heat and cool from the substrate side and the IC chip side.

更にインク内の気泡の成長方向とインクの吐出方向とが同じになるタイプのインクジェット記録ヘッドの基板を長尺に形成する場合に効果的な、ＩＣチップを複数個搭載されたマルチチップモジュールにおいてはＩＣチップを１個毎に処理するため、接着剤を加圧加熱する工程に時間がかかりすぎるという問題を持っている。   Furthermore, in the case of a multi-chip module equipped with a plurality of IC chips, which is effective when forming a substrate of an ink jet recording head of the type in which the growth direction of bubbles in the ink and the ink ejection direction are the same, Since each IC chip is processed, there is a problem that it takes too much time to pressurize and heat the adhesive.

本発明は上記従来例の問題点を解決するために、基板とＩＣチップとを接着剤を介して接続するＩＣチップの接続装置において、基板をバックアップするための支持体、高圧気体とフッ素系やシリコーン系の可撓性フィルムから構成された加圧部、加熱機能を有し且つ前記加圧部の圧力をＩＣチップに印加する受圧部材、前記受圧部材とＩＣチップの裏面の間に配置されて受圧部材を保護するフィルムから構成されたＩＣチップの接続装置を提供する。   In order to solve the above-described problems of the conventional example, the present invention provides an IC chip connecting apparatus for connecting a substrate and an IC chip via an adhesive, a support for backing up the substrate, a high-pressure gas and a fluorine-based A pressure part composed of a silicone-based flexible film, a pressure receiving member having a heating function and applying the pressure of the pressure part to the IC chip, and disposed between the pressure receiving member and the back surface of the IC chip. Provided is an IC chip connecting device composed of a film for protecting a pressure receiving member.

更に本発明では、前記受圧部材の前記加圧部と接触する面積を前記ＩＣチップの面積より大きく設定したＩＣチップの接続装置を提供する。   Furthermore, the present invention provides an IC chip connection device in which the area of the pressure receiving member that contacts the pressing portion is set larger than the area of the IC chip.

更に本発明では、前記受圧部材は前記ＩＣチップの配列に応じて複数個の受圧部材が平行配置されたＩＣチップの接続装置を提供する。   Furthermore, in the present invention, the pressure receiving member provides an IC chip connecting device in which a plurality of pressure receiving members are arranged in parallel according to the arrangement of the IC chips.

更に本発明では、前記接着剤は異方性導電フィルムであり、該異方性導電フィルムを前記基板に仮接着する貼付け装置と、前記ＩＣチップと前記基板とを位置合わせして仮圧着する搭載機とを、前工程につないだＩＣチップの接続装置を提供する。   Furthermore, in the present invention, the adhesive is an anisotropic conductive film, and a mounting device that temporarily bonds the anisotropic conductive film to the substrate, and a mounting that positions and temporarily presses the IC chip and the substrate. An IC chip connection device is provided in which a machine is connected to a previous process.

以上詳細に説明したように、本発明の実装装置においては、基板とＩＣチップとを接着剤を介して接続するＩＣチップの接続装置の小型化に寄与する。   As described above in detail, the mounting apparatus according to the present invention contributes to the miniaturization of the IC chip connecting apparatus for connecting the substrate and the IC chip via the adhesive.

更に本発明では、複数個のＩＣチップを同時に加圧加熱してマルチチップモジュールを一括処理する生産性の高い接続装置を提供する。   Furthermore, the present invention provides a highly productive connection device for simultaneously processing a plurality of IC chips by pressurizing and heating a plurality of IC chips simultaneously.

更に前記接着剤が異方性導電フィルムの場合に、本発明の接続装置を用いたインライン装置を提供することで、自動化、省力化が可能となり低価格の実装構造体を提供することが可能となる。   Furthermore, when the adhesive is an anisotropic conductive film, by providing an in-line device using the connection device of the present invention, it is possible to automate and save labor, and to provide a low-cost mounting structure. Become.

以下、本発明の実施例について図面を用いて説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１は本発明に関わる接続装置の構成を示す断面図で、基板１とＩＣチップ２とを接着剤３を介して接続するＩＣチップの接続装置において、前記基板１をバックアップするための支持体４、高圧気体７１とフッ素系やシリコーン系の可撓性フィルム７２から構成された加圧圧力を発生する加圧部７、加熱機能を有し且つ前記加圧部の圧力をＩＣチップに印加する受圧部材８、前記受圧部材８とＩＣチップ２の裏面の間に配置されて受圧部材を保護するフィルム９から構成される。前記受圧部材８はコンスタントヒータツールやパルスヒータツールを用いることができるが、装置の小型化を達成しうると言う点ではセラミックヒータが適している。更に前記支持体４にはコンスタントヒータやパルスヒータを内蔵し、なおかつエアーやＮ２ブロー等の冷却機構を取付けて、硬化時の基板とＩＣチップと接着剤を温度勾配がほとんど発生しないようにして、基板の反りを低減することが可能となる。更にフィルム９は従来例で示したテフロン（登録商標）やシリコーン等の樹脂フィルムでも良いが、ＩＣチップの反りを低減する目的でＳＵＳ等の金属箔フィルムを用いても良い。 FIG. 1 is a cross-sectional view showing the configuration of a connection device according to the present invention. In the IC chip connection device for connecting a substrate 1 and an IC chip 2 via an adhesive 3, a support for backing up the substrate 1 is shown. 4. Pressurizing unit 7 for generating a pressurizing pressure composed of a high-pressure gas 71 and a fluorine-based or silicone-based flexible film 72, having a heating function, and applying the pressure of the pressurizing unit to the IC chip The pressure receiving member 8 is composed of a film 9 disposed between the pressure receiving member 8 and the back surface of the IC chip 2 to protect the pressure receiving member. As the pressure receiving member 8, a constant heater tool or a pulse heater tool can be used, but a ceramic heater is suitable in that it can achieve downsizing of the apparatus. Further, the support 4 has a built-in constant heater or pulse heater, and a cooling mechanism such as air or N 2 blow is attached so that a temperature gradient hardly occurs between the substrate, the IC chip and the adhesive during curing. It is possible to reduce the warpage of the substrate. Further, the film 9 may be a resin film such as Teflon (registered trademark) or silicone shown in the conventional example, but a metal foil film such as SUS may be used for the purpose of reducing the warpage of the IC chip.

図２は本発明の更に改良された実施例を示す受圧部材８の断面図で、前記受圧部材８の前記加圧部７と接触する面積を前記ＩＣチップの面積より大きく設定すると、加圧圧力を増幅することが可能である。受圧ペース部の面積をＳ１としＩＣチップの面積をＳ２とした時、加圧圧力Ｐ１に対してＩＣチップへの印加圧力はＰ１×（Ｓ１÷Ｓ２）で表すことができ、加圧圧力を（Ｓ１÷Ｓ２）倍することが可能である。加圧部に空気、窒素等の高圧気体を用いると圧力印加部材を小型で簡易に製作することが可能であると同時に、高圧気体の圧力を受圧部に伝達するためにフッ素系やシリコーン系の可撓性フィルムから構成すると、圧力印加の均一性が高いと言う特徴がある。ところが、空気、窒素等の高圧気体は通常５ｋｇｆ／ｃｍ2 程度の固定圧力であるのに対してＩＣチップの接着に要する圧力は、ＩＣチップの電極数により大きく異なり一般的には１０ｋｇｆ〜５０ｋｇｆと高圧気体の圧力よりも高い圧力を必要とするので、本発明の改良された実施例は効果的である。 FIG. 2 is a cross-sectional view of the pressure receiving member 8 showing a further improved embodiment of the present invention. When the area of the pressure receiving member 8 in contact with the pressure member 7 is set larger than the area of the IC chip, Can be amplified. When the area of the pressure-receiving pace portion is S1 and the area of the IC chip is S2, the pressure applied to the IC chip can be expressed as P1 × (S1 ÷ S2) with respect to the pressurizing pressure P1, and the pressurizing pressure ( It is possible to multiply by S1 ÷ S2). Using a high-pressure gas such as air or nitrogen for the pressurizing part makes it possible to make the pressure application member small and simple, and at the same time, to transmit the pressure of the high-pressure gas to the pressure-receiving part, When it consists of a flexible film, it has the characteristic that the uniformity of a pressure application is high. However, high pressure gases such as air and nitrogen are usually fixed pressures of about 5 kgf / cm 2 , whereas the pressure required for IC chip bonding varies greatly depending on the number of electrodes of the IC chip and is generally 10 kgf to 50 kgf. The improved embodiment of the present invention is effective because it requires a pressure higher than that of the high pressure gas.

図３は本発明の更に改良された実施例を示す透視平面図で、前記受圧部材８は前記ＩＣチップ２の配列に応じて複数個の受圧部材が平行配置される。基板１は支持体４に載置され、前記ＩＣチップ及び受圧部材と位置合わせして複数個のＩＣチップを同時に加圧加熱してマルチチップモジュールを一括処理する。   FIG. 3 is a perspective plan view showing a further improved embodiment of the present invention. In the pressure receiving member 8, a plurality of pressure receiving members are arranged in parallel according to the arrangement of the IC chips 2. The substrate 1 is placed on a support 4 and aligned with the IC chip and the pressure receiving member, and a plurality of IC chips are simultaneously pressurized and heated to collectively process the multichip module.

図４は前記接着剤が異方性導電フィルムの場合に、本発明の接続装置を用いたインライン装置を示す構成図である。異方性導電フィルムを前記基板に仮接着する貼付け装置と、前記ＩＣチップと前記基板とを位置合わせして仮圧着する搭載機とを、前工程につないで構成される。   FIG. 4 is a block diagram showing an in-line device using the connection device of the present invention when the adhesive is an anisotropic conductive film. A pasting device that temporarily bonds the anisotropic conductive film to the substrate and a mounting machine that positions and temporarily presses the IC chip and the substrate are connected to the previous process.

本発明に関わる接続装置の構成を示す断面図。Sectional drawing which shows the structure of the connection apparatus in connection with this invention. 本発明の改良された実施例を示す受圧部材の断面図。Sectional drawing of the pressure receiving member which shows the improved Example of this invention. マルチチップモジュールにおいて効果的なように本発明の更に改良された実施例を示す透視平面図。FIG. 5 is a perspective plan view showing a further improved embodiment of the present invention that is effective in a multichip module. 本発明の接続装置を用いたインライン装置示す構成図。The block diagram which shows the in-line apparatus using the connection apparatus of this invention. 従来の接続装置の構成を示す断面図。Sectional drawing which shows the structure of the conventional connection apparatus. 従来の他の接続装置の構成を示す断面図。Sectional drawing which shows the structure of the other conventional connection apparatus.

符号の説明Explanation of symbols

１ 基板
２ ＩＣチップ
３ 接着剤
４ 支持体
５ 高圧気体
６ 可撓性フィルム
７ 加圧部
８ 受圧部材
９ フィルム
７１ エアーシリンダー
８１ ツール
８２，８３ 温度制御装置
９１ 樹脂フィルム DESCRIPTION OF SYMBOLS 1 Board | substrate 2 IC chip 3 Adhesive 4 Support body 5 High pressure gas 6 Flexible film 7 Pressurization part 8 Pressure receiving member 9 Film 71 Air cylinder 81 Tool 82,83 Temperature control apparatus 91 Resin film

Claims (4)

基板とＩＣチップとを接着剤を介して接続するＩＣチップの接続装置において、基板をバックアップするための支持体、高圧気体とフッ素系やシリコーン系の可
撓性フィルムから構成された加圧部、加熱機能を有し且つ前記加圧部の圧力をＩＣチップに印加する受圧部材、前記受圧部材とＩＣチップの裏面の間に配置されて受圧部材を保護するフィルムから構成されることを特徴とするＩＣチップの接続装置。 In an IC chip connection device for connecting a substrate and an IC chip via an adhesive, a support for backing up the substrate, a pressurizing unit composed of a high-pressure gas and a fluorine-based or silicone-based flexible film, A pressure receiving member that has a heating function and applies the pressure of the pressurizing unit to the IC chip, and a film that is disposed between the pressure receiving member and the back surface of the IC chip to protect the pressure receiving member. IC chip connection device. 前記受圧部材の前記加圧部と接触する面積を前記ＩＣチップの面積より大きく設定したことを特徴とする特許請求項１のＩＣチップの接続装置。   2. The IC chip connection device according to claim 1, wherein an area of the pressure receiving member that contacts the pressing portion is set larger than an area of the IC chip. 前記受圧部材は前記ＩＣチップの配列に応じて複数個の受圧部材が平行配置された事を特徴とする特許請求項１のＩＣチップの接続装置。   2. The IC chip connecting device according to claim 1, wherein the pressure receiving member includes a plurality of pressure receiving members arranged in parallel according to the arrangement of the IC chips. 前記接着剤は異方性導電フィルムであり、該異方性導電フィルムを前記基板に仮接着する貼付け装置と、前記ＩＣチップと前記基板とを位置合わせして仮圧着する搭載機とを、前工程につないだことを特徴とする特許請求項１のＩＣチップの接続装置。   The adhesive is an anisotropic conductive film, and a bonding device that temporarily bonds the anisotropic conductive film to the substrate, and a mounting machine that positions and temporarily press-bonds the IC chip and the substrate, 2. The IC chip connecting device according to claim 1, wherein the connecting device is connected to a process.
JP2005043928A 2005-02-21 2005-02-21 Connection device of ic chip Withdrawn JP2006229125A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012216616A (en) * 2011-03-31 2012-11-08 Internatl Business Mach Corp <Ibm> Semiconductor bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012216616A (en) * 2011-03-31 2012-11-08 Internatl Business Mach Corp <Ibm> Semiconductor bonding device

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