JP2006228854A - Substrate coating device and manufacturing method of semiconductor device - Google Patents

Substrate coating device and manufacturing method of semiconductor device Download PDF

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JP2006228854A
JP2006228854A JP2005038741A JP2005038741A JP2006228854A JP 2006228854 A JP2006228854 A JP 2006228854A JP 2005038741 A JP2005038741 A JP 2005038741A JP 2005038741 A JP2005038741 A JP 2005038741A JP 2006228854 A JP2006228854 A JP 2006228854A
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liquid supply
processing liquid
nozzle
supply nozzle
solvent
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Michiko Ishizawa
路子 石澤
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Seiko Epson Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate coating device and a manufacturing method of a semiconductor device, which comprises a standby pod to prevent contamination of a nozzle tip caused by splashing back of process liquid such as SOG liquid for suppressing occurence of failure. <P>SOLUTION: A nozzle standby pod 15 houses the tip of nozzle 13 above and makes it wait in the solvent atmosphere of a process liquid Q (here, SOG liquid) when the process liquid supply nozzle 13 moves to a standby position. A splash preventing member 16 is provided between a solvent reservoir part 152 and the tip of process liquid supply nozzle 13, within the cup 151 of the nozzle standby pod 15. The splash preventing member 16 allows most of process liquid Q flowing down from the process liquid supply nozzle 13 due to dummy discharge or liquid dropping to pass and to drop into the solvent reservoir 152, while preventing splashing back from the solvent reservoir 152. To be specific, it is an inclusion of metal, such as stainless steel, or fluororesin which is so processed in mesh or slit as to prevent splashing of process liquid while allowing it to pass. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、基板上方のノズルから処理液を供給し回転させた基板表面に塗布する基板塗布装置に係り、特に処理液供給ノズルからのパーティクル対策を図る基板塗布装置及び半導体装置の製造方法に関する。   The present invention relates to a substrate coating apparatus for supplying a processing liquid from a nozzle above a substrate and coating the surface of a rotated substrate, and more particularly to a substrate coating apparatus and a method for manufacturing a semiconductor device that take measures against particles from the processing liquid supply nozzle.

ＬＳＩ製造工程（ウェハ工程）の一つにＳＯＧ（Spin On Glass）塗布工程がある。ＳＯＧ膜は、平坦性を向上させる塗布ガラス処理として広く用いられている。一般に、ＳＯＧ塗布はスピンコート方式で達成される。すなわち、ウェハ基板上方の処理液供給ノズルからウェハ基板の中央部にＳＯＧ液（シリコン化合物を有機溶剤に混合させた液）を供給し、ウェハ基板を所定の回転数で回転させてＳＯＧ液を振り切る。これにより、ウェハ主表面に所望の膜厚を有するＳＯＧ膜を得る。その後、ベークすることで、所望の絶縁膜となる。   One of the LSI manufacturing processes (wafer processes) is an SOG (Spin On Glass) coating process. The SOG film is widely used as a coated glass treatment for improving flatness. In general, SOG coating is achieved by a spin coating method. That is, an SOG liquid (a liquid in which a silicon compound is mixed with an organic solvent) is supplied from a processing liquid supply nozzle above the wafer substrate to the center of the wafer substrate, and the wafer substrate is rotated at a predetermined rotational speed to shake off the SOG liquid. . Thereby, an SOG film having a desired film thickness is obtained on the wafer main surface. Thereafter, by baking, a desired insulating film is obtained.

処理液供給ノズルは、ウェハ基板上方にて処理液（例えばＳＯＧ液）を吐出した後、待機場所に移動する。この待機場所では処理液中の溶媒が揮発して処理液がノズル先端部で固化することを防止するための待機ポッドを備えている。待機ポッドの底部には溶剤が貯留されており、上方に位置するノズル先端は溶剤雰囲気にさらされている。これにより、ノズル先端の固化防止、ひいては固化物の剥離が原因になるパーティクル汚染の防止に寄与する（例えば、特許文献1参照）。
特開平１０−１３７６６５号公報（図５） The processing liquid supply nozzle moves to a standby place after discharging the processing liquid (for example, SOG liquid) above the wafer substrate. In this standby place, a standby pod is provided for preventing the solvent in the processing liquid from evaporating and solidifying the processing liquid at the nozzle tip. A solvent is stored at the bottom of the standby pod, and the nozzle tip located above is exposed to the solvent atmosphere. This contributes to prevention of solidification of the nozzle tip and, in turn, prevention of particle contamination caused by separation of the solidified material (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 10-137665 (FIG. 5)

待機ポッドに収納された処理液供給ノズル先端からは、供給口固化防止のためのダミー吐出や液垂れがあり、底部の溶剤貯留部に落ちて跳ね返る。処理液がＳＯＧ液の場合、跳ね返ったＳＯＧ液がポッドの内壁やノズル先端部に付着する。溶剤貯留部から遠いノズル先端部やその近傍のポッド内壁は溶剤の雰囲気が希薄で、固化したＳＯＧ結晶が堆積し易い。ノズル先端がＳＯＧ結晶等の異物で汚染されると、ノズルが基板上方の塗布位置に移動して塗布を行う際、ＳＯＧ結晶の異物剥離を起こし易い。ＳＯＧ結晶の異物剥離は、基板上にパーティクル汚染を蔓延させ、不良の原因となる。   From the front end of the processing liquid supply nozzle stored in the standby pod, there is a dummy discharge or liquid dripping to prevent the supply port from being solidified, and it falls into the solvent storage section at the bottom and rebounds. When the treatment liquid is an SOG liquid, the bounced SOG liquid adheres to the inner wall of the pod or the nozzle tip. The tip of the nozzle far from the solvent reservoir and the inner wall of the pod in the vicinity thereof have a thin solvent atmosphere, and solidified SOG crystals are likely to deposit. If the nozzle tip is contaminated with foreign matter such as SOG crystal, the SOG crystal is likely to be peeled off when the nozzle moves to the application position above the substrate for application. The removal of foreign matter from the SOG crystal causes particle contamination to spread on the substrate and causes defects.

本発明は上記のような事情を考慮してなされたもので、ＳＯＧ液等、処理液の跳ね返りによるノズル先端の汚染を防止する待機ポッドを有し、不良発生を抑制する基板塗布装置及び半導体装置の製造方法を提供しようとするものである。   The present invention has been made in view of the above circumstances, and includes a substrate coating apparatus and a semiconductor device that have a standby pod that prevents contamination of the nozzle tip due to rebound of processing liquid such as SOG liquid and suppresses the occurrence of defects. It is intended to provide a manufacturing method.

本発明に係る基板塗布装置は、被処理基板の裏面側が保持される回転台と、前記回転台を所定の回転数で回転させる駆動制御部と、前記被処理基板の回転中心上方で前記被処理基板に対し処理液を吐出する供給位置と前記被処理基板から外れた待機位置の間で移動可能な処理液供給ノズルと、前記待機位置に設けられ、前記処理液供給ノズルが前記待機位置に移動してきたときに上方で前記処理液供給ノズルの先端部を収納し前記処理液の溶剤雰囲気にて待機させるノズル待機ポッドと、前記ノズル待機ポッドのカップ底部の溶剤貯留部と、前記溶剤貯留部の過剰量を排出する排液口と、前記ノズル待機ポッドのカップ内において前記溶剤貯留部と前記処理液供給ノズル先端の間に設けられ、前記処理液供給ノズルから流下された処理液を大部分通過させて前記溶剤貯留部に落とすと共に前記溶剤貯留部からの跳ね返りを阻止する防跳部材と、を含む。   The substrate coating apparatus according to the present invention includes a turntable that holds the back side of the substrate to be processed, a drive control unit that rotates the turntable at a predetermined number of rotations, and the processing target above the rotation center of the substrate to be processed. A treatment liquid supply nozzle that is movable between a supply position that discharges the treatment liquid to the substrate and a standby position that is off the substrate to be processed, and the treatment liquid supply nozzle that is provided at the standby position and moves to the standby position. A nozzle standby pod that houses the tip of the processing liquid supply nozzle at the top and waits in the solvent atmosphere of the processing liquid, a solvent storage section at the bottom of the cup of the nozzle standby pod, and a solvent storage section A liquid discharge port for discharging an excessive amount and a treatment liquid that is provided between the solvent reservoir and the tip of the treatment liquid supply nozzle in the cup of the nozzle standby pod, and that flows down from the treatment liquid supply nozzle By partial passage including a proof 跳部 material to prevent rebound from said solvent reservoir with drops in the solvent reservoir.

上記本発明に係る基板塗布装置によれば、防跳部材は、処理液供給ノズルから流下された処理液を跳ね返すことなく大部分通過させる。かつ、溶剤貯留部からの処理液または溶剤の跳ね返りを阻止し、処理液供給ノズル先端やその近傍のカップ壁面への付着をなくする。これにより、パーティクルの原因となるノズル先端の汚染を防止する。   According to the substrate coating apparatus according to the present invention, the jump preventing member allows most of the processing liquid flowing down from the processing liquid supply nozzle to pass through without rebounding. In addition, the rebound of the processing liquid or the solvent from the solvent storage section is prevented, and adhesion to the tip of the processing liquid supply nozzle and the cup wall surface in the vicinity thereof is eliminated. This prevents contamination of the nozzle tip that causes particles.

上記本発明に係る基板塗布装置において、次のいずれかの特徴を有することにより、防跳部材の性能を発揮する有用な構成となり得る。
前記防跳部材は、前記処理液供給ノズル先端側より前記溶剤貯留部表面寄りに位置することを特徴とする。
前記防跳部材は、網目状の構成を含むことを特徴とする。
前記防跳部材は、薄い金属板または樹脂板に複数の開口を有する構成を含むことを特徴とする。
前記防跳部材は、複数の薄い長手の金属板または樹脂板を対向させたスリットの構成を含むことを特徴とする。
前記防跳部材は、各々波状に成形した複数の薄い長手の金属板または樹脂板どうし対向させ一部を接触または接近させた構成を含むことを特徴とする。
前記防跳部材は、傾斜して取り付けられていることを特徴とする。
前記防跳部材は、前記処理液供給ノズル先端に対向する所定領域に窪みを有することを特徴とする。
前記防跳部材は、二重構造となっていることを特徴とする。 The substrate coating apparatus according to the present invention can have a useful configuration that exhibits the performance of the jump-proof member by having any of the following characteristics.
The jump-proof member is located closer to the surface of the solvent storage part than the front end side of the processing liquid supply nozzle.
The jump-proof member includes a mesh-like configuration.
The jump-proof member includes a structure having a plurality of openings in a thin metal plate or resin plate.
The jump-proof member includes a slit structure in which a plurality of thin longitudinal metal plates or resin plates are opposed to each other.
The jump-proof member includes a configuration in which a plurality of thin long metal plates or resin plates each formed in a wave shape are opposed to each other and a part thereof is brought into contact with or approached.
The jump-proof member is attached with an inclination.
The jump-proof member has a recess in a predetermined region facing the tip of the processing liquid supply nozzle.
The jump-proof member has a double structure.

本発明に係る半導体装置の製造方法は、被処理基板を回転させながら処理液を塗布する半導体装置の製造方法において、処理液供給ノズルが前記被処理基板に対し処理液を吐出する工程と、処理液供給ノズルが待機位置に移動し、ノズル待機ポッドに前記処理液供給ノズルの先端部を収納して前記処理液の溶剤雰囲気にて待機させる工程と、を含み、前記処理液供給ノズルの待機中、前記ノズル待機ポッドのカップ底部の溶剤貯留部と前記処理液供給ノズル先端の間に設けられた防跳部材により、前記処理液供給ノズルから流下される処理液に関し大部分通過させて前記溶剤貯留部に落とすと共に前記溶剤貯留部からの跳ね返りを防止することを特徴とする。   The method of manufacturing a semiconductor device according to the present invention includes a step of discharging a processing liquid to the substrate to be processed by a processing liquid supply nozzle in the method of manufacturing a semiconductor device in which the processing liquid is applied while rotating the substrate to be processed. A liquid supply nozzle is moved to a standby position, and a tip of the processing liquid supply nozzle is stored in a nozzle standby pod and is allowed to stand by in a solvent atmosphere of the processing liquid, and the processing liquid supply nozzle is on standby The processing liquid flowing down from the processing liquid supply nozzle is mostly allowed to pass by the jumping prevention member provided between the solvent storage part at the bottom of the cup of the nozzle standby pod and the tip of the processing liquid supply nozzle. And is prevented from rebounding from the solvent reservoir.

本発明に係る半導体装置の製造方法によれば、ノズル待機ポッドで処理液供給ノズルから流下された処理液は溶剤貯留部へ落ちた後、防跳部材を越えて跳ね返ってくることはない。従って、溶剤貯留部からの処理液または溶剤の跳ね返りで処理液供給ノズル先端やその近傍のカップ壁面が汚染されることもなくなる。これにより、パーティクルを抑制し、基板塗布を含むウェハ製造工程の高信頼性を得る。   According to the method for manufacturing a semiconductor device according to the present invention, the processing liquid that has flowed down from the processing liquid supply nozzle by the nozzle standby pod does not bounce over the jump-proof member after dropping into the solvent storage section. Therefore, the tip of the treatment liquid supply nozzle and the cup wall surface in the vicinity thereof are not contaminated by the rebound of the treatment liquid or the solvent from the solvent reservoir. Thereby, particles are suppressed and high reliability of a wafer manufacturing process including substrate coating is obtained.

発明を実施するための形態BEST MODE FOR CARRYING OUT THE INVENTION

図１は、本発明の第１実施形態に係る基板塗布装置の要部構成を示す概観図である。スピンコート方式であり、図示しない処理室の内部に被処理基板ＷＦの回転台１１が配備されている。回転台１１は、被処理基板ＷＦの裏面を真空チャックし、駆動制御部１２によって所定の回転数で回転される。被処理基板ＷＦ周囲に設けられるドレーンカップ等は省略している。   FIG. 1 is a schematic view showing the main configuration of the substrate coating apparatus according to the first embodiment of the present invention. This is a spin coating method, and a turntable 11 for a substrate WF to be processed is provided inside a processing chamber (not shown). The turntable 11 vacuum chucks the back surface of the substrate to be processed WF, and is rotated by the drive control unit 12 at a predetermined number of rotations. A drain cup or the like provided around the substrate to be processed WF is omitted.

被処理基板ＷＦの回転中心上方には、被処理基板ＷＦに対し処理液Ｑを吐出する処理液供給ノズル１３が設けられている。処理液Ｑは例えばＳＯＧ液であり、被処理基板ＷＦにスピン塗布される。処理液供給ノズル１３は、被処理基板ＷＦに対し処理液Ｑを吐出する供給位置と、被処理基板ＷＦから外れた待機位置の間で移動可能である。   A processing liquid supply nozzle 13 that discharges the processing liquid Q to the target substrate WF is provided above the rotation center of the target substrate WF. The processing liquid Q is, for example, an SOG liquid, and is spin-coated on the substrate to be processed WF. The processing liquid supply nozzle 13 is movable between a supply position for discharging the processing liquid Q to the substrate to be processed WF and a standby position outside the substrate to be processed WF.

待機位置にはノズル待機ポッド１５が設けられている。ノズル待機ポッド１５は、処理液供給ノズル１３が待機位置に移動してきたときに上方でノズル１３の先端部を収納し処理液Ｑ（ここではＳＯＧ液）の溶剤雰囲気にて待機させる。溶剤はＳＯＧ溶剤に適した有機溶剤（アルコール類）とする。そのため、ノズル待機ポッド１５のカップ１５１底部には溶剤貯留部１５２が設けられ、溶剤貯留部１５の過剰量を排出し、溶剤貯留量を調節する排液口１５３が設けられている。   A nozzle standby pod 15 is provided at the standby position. When the processing liquid supply nozzle 13 moves to the standby position, the nozzle standby pod 15 stores the tip of the nozzle 13 at the upper side and makes it stand by in the solvent atmosphere of the processing liquid Q (here, SOG liquid). The solvent is an organic solvent (alcohol) suitable for the SOG solvent. Therefore, a solvent reservoir 152 is provided at the bottom of the cup 151 of the nozzle standby pod 15, and a drainage port 153 that discharges an excess amount of the solvent reservoir 15 and adjusts the solvent reserve is provided.

このようなノズル待機ポッド１５のカップ１５１内において溶剤貯留部１５２と処理液供給ノズル１３先端の間に、防跳部材１６が設けられている。防跳部材１６は、処理液供給ノズル１３からダミー吐出や液垂れで流下された処理液Ｑを大部分通過させて溶剤貯留部１５２に落とすと共に溶剤貯留部１５２からの跳ね返りを阻止するものである。より具体的にはステンレス等の金属製またはポリテトラフルオロエチレン等のフッ素樹脂製で、処理液を通しかつ液跳ねを阻止するための網目またはスリット形状が加工された介在物である。防跳部材１６は、僅かな処理液Ｑの付着を伴うためノズル１３先端側よりむしろ溶剤貯留部１５２表面寄りに位置することが望ましい。溶剤雰囲気の濃度が高い位置に配置した方が、防跳部材１６への付着物の定着が防げるからである。   In such a cup 151 of the nozzle standby pod 15, a jump preventing member 16 is provided between the solvent reservoir 152 and the tip of the treatment liquid supply nozzle 13. The jump preventing member 16 allows most of the processing liquid Q flowing down from the processing liquid supply nozzle 13 by dummy discharge or dripping to pass through the processing liquid Q and drop it into the solvent storage section 152 and prevent rebound from the solvent storage section 152. . More specifically, it is an inclusion made of a metal such as stainless steel or a fluororesin such as polytetrafluoroethylene and processed with a mesh or slit shape for passing the treatment liquid and preventing liquid splash. It is desirable that the anti-recoil member 16 is located closer to the surface of the solvent reservoir 152 rather than the front end side of the nozzle 13 because of a slight adhesion of the treatment liquid Q. This is because it is possible to prevent the deposits from adhering to the anti-recoil member 16 when the solvent atmosphere is arranged at a higher position.

図２（ａ），（ｂ）は、それぞれ上記図１中のノズル待機ポッド１５における、カップ１５１内の防跳部材１６に関する第１構成例を示す平面図、断面図である。ステンレス等の金属ワイヤ２１を網目状に組んだ構成となっている。これにより、処理液Ｑ（または溶剤貯留部１５２から）の跳ねや飛散を阻止する。なお、金属ワイヤ２１に代えてフッ素樹脂製の細線を網目状に組んだ構成を採用してもよい。   FIGS. 2A and 2B are a plan view and a cross-sectional view, respectively, showing a first configuration example related to the jump preventing member 16 in the cup 151 in the nozzle standby pod 15 in FIG. The metal wire 21 such as stainless steel is assembled in a mesh shape. This prevents the treatment liquid Q (or from the solvent reservoir 152) from splashing or splashing. Instead of the metal wire 21, a configuration in which fine wires made of fluororesin are assembled in a mesh shape may be adopted.

図３（ａ），（ｂ）は、それぞれ上記図１中のノズル待機ポッド１５における、カップ１５１内の防跳部材１６に関する第２構成例を示す平面図、断面図である。ステンレス等の薄い金属板３１に複数の開口３２を有する構成となっている。開口３２は、打ち抜きとせずに、開けしろ３３をある程度残し、開口端を揃えるよう仕上げている。これにより、処理液Ｑ（または溶剤貯留部１５２から）の跳ねや飛散を阻止する。なお、金属板３１に代えてフッ素樹脂板に複数の開口を有する構成を採用してもよい。   FIGS. 3A and 3B are a plan view and a cross-sectional view, respectively, showing a second configuration example relating to the jump preventing member 16 in the cup 151 in the nozzle standby pod 15 in FIG. A thin metal plate 31 such as stainless steel has a plurality of openings 32. The opening 32 is not punched, but leaves an opening 33 to some extent and finishes so that the opening ends are aligned. This prevents the treatment liquid Q (or from the solvent reservoir 152) from splashing or splashing. In addition, it may replace with the metal plate 31 and the structure which has a some opening in a fluororesin board may be employ | adopted.

図４（ａ），（ｂ）は、それぞれ上記図１中のノズル待機ポッド１５における、カップ１５１内の防跳部材１６に関する第３構成例を示す平面図、断面図である。複数の薄い長手のステンレス等の金属板４１を対向させ、スリットを構成している。対向させる金属板４１各々は溶剤貯留部１５２表面に垂直でなく少し斜めに配置し、処理液Ｑ（または溶剤貯留部１５２から）の跳ねや飛散を阻止する。金属板４１の傾斜度合いは処理液供給ノズル１３から流下される処理液Ｑの通過の抵抗が大きすぎないようを考慮すべきである。なお、金属板４１に代えてフッ素樹脂板を対向させ、上記と同様のスリットを構成してもよい。   FIGS. 4A and 4B are a plan view and a cross-sectional view showing a third configuration example relating to the jump preventing member 16 in the cup 151 in the nozzle standby pod 15 in FIG. A plurality of thin long metal plates 41 such as stainless steel face each other to form a slit. Each of the metal plates 41 to be opposed is arranged not to be perpendicular to the surface of the solvent storage unit 152 but slightly to prevent the treatment liquid Q (or from the solvent storage unit 152) from splashing or scattering. It should be considered that the inclination of the metal plate 41 is such that the resistance of passage of the processing liquid Q flowing down from the processing liquid supply nozzle 13 is not too large. In addition, it may replace with the metal plate 41 and a fluororesin board may be made to oppose, and the slit similar to the above may be comprised.

図５（ａ），（ｂ）は、それぞれ上記図１中のノズル待機ポッド１５における、カップ１５１内の防跳部材１６に関する第４構成例を示す平面図、断面図である。それぞれ波形状に成形した複数の薄い長手の金属板（例えばステンレス製）５１を対向させ、波形のピーク部分５２を接触または接近させた構成となっている。これにより、処理液Ｑ（または溶剤貯留部１５２から）の跳ねや飛散を阻止する。対向させる金属板５１各々を溶剤貯留部１５２表面に垂直でなく少し斜めに配置してもよい。なお、金属板５１に代えてフッ素樹脂板を用い、波形にして対向させて上記と同様に波形のピーク部分を接触または接近させた構成をとってもよい。   FIGS. 5A and 5B are a plan view and a cross-sectional view, respectively, showing a fourth configuration example relating to the jump preventing member 16 in the cup 151 in the nozzle standby pod 15 in FIG. A plurality of thin and long metal plates (for example, made of stainless steel) 51 each having a corrugated shape are opposed to each other, and a corrugated peak portion 52 is in contact with or close to each other. This prevents the treatment liquid Q (or from the solvent reservoir 152) from splashing or splashing. The opposing metal plates 51 may be arranged slightly obliquely rather than perpendicular to the surface of the solvent reservoir 152. A configuration may be adopted in which a fluororesin plate is used instead of the metal plate 51, and the corrugated peak portions are brought into contact with each other in the same manner as described above so as to face each other.

上記実施形態、各防跳部材の構成によれば、防跳部材１６は、処理液供給ノズル１３から流下された処理液Ｑを跳ね返すことなく大部分通過させる。かつ、溶剤貯留部１５２からの処理液Ｑまたは溶剤の跳ね返りを阻止し、処理液供給ノズル１３先端やその近傍のカップ１５１壁面への付着をなくする。これにより、パーティクルの原因となるノズル先端の汚染を防止することができる。
なお、各例示した防跳部材１６は交換可能であり、汚染が許容範囲を越えたら交換するようにすればよい。 According to the above-described embodiment and the configuration of each jumper member, the jumper member 16 allows most of the treatment liquid Q flowing down from the treatment liquid supply nozzle 13 to pass without rebounding. In addition, the rebound of the processing liquid Q or the solvent from the solvent storage unit 152 is prevented, and adhesion to the front end of the processing liquid supply nozzle 13 and the cup 151 wall in the vicinity thereof is eliminated. Thereby, contamination of the nozzle tip that causes particles can be prevented.
Note that each of the illustrated anti-reflection members 16 can be replaced, and may be replaced when the contamination exceeds an allowable range.

図６は、本発明の第２実施形態に係る基板塗布装置の要部構成を示す概観図である。前記第１実施形態と同様の箇所には図１と同一の符号を付す。前記図１に比べて異なる構成は、防跳部材の取り付け形態である。防跳部材６６として、ノズル待機ポッド１５のカップ１５１内に、溶剤貯留部１５２表面に対し傾斜をもって取り付けられている。傾斜角度θは限定されないが、θ＝２０°〜６０°程度が適当である。これにより、防跳部材６６は、処理液供給ノズル１３から流下された処理液Ｑを大部分通過させて溶剤貯留部１５２に落とすと共に溶剤貯留部１５２からの跳ね返りを阻止する。   FIG. 6 is a schematic view showing a main configuration of a substrate coating apparatus according to the second embodiment of the present invention. The same reference numerals as those in FIG. 1 are attached to the same portions as those in the first embodiment. A configuration different from that in FIG. 1 is an attachment form of the anti-reflection member. As a jump preventing member 66, it is attached in the cup 151 of the nozzle standby pod 15 with an inclination to the surface of the solvent reservoir 152. Although the inclination angle θ is not limited, it is appropriate that θ = 20 ° to 60 °. As a result, the jump preventing member 66 allows most of the processing liquid Q flowing down from the processing liquid supply nozzle 13 to pass through and drop it into the solvent storage section 152, and prevents rebound from the solvent storage section 152.

上記図６中のノズル待機ポッド１５における、カップ１５１内の防跳部材６６に関する第１構成例として、前記図２（ａ），（ｂ）の構成があげられる。すなわち、ステンレス等の金属ワイヤ２１を網目状に組んだ構成を所定角度傾斜させて取り付ける。これにより、処理液Ｑ（または溶剤貯留部１５２から）の跳ねや飛散を阻止する。もちろん、金属ワイヤ２１に代えてフッ素樹脂製の細線を網目状に組んだ構成を採用してもよい。   In the nozzle standby pod 15 in FIG. 6 described above, the first configuration example regarding the anti-recoil member 66 in the cup 151 includes the configurations shown in FIGS. 2 (a) and 2 (b). That is, a structure in which metal wires 21 such as stainless steel are assembled in a mesh shape is attached at an angle of inclination. This prevents the treatment liquid Q (or from the solvent reservoir 152) from splashing or splashing. Of course, instead of the metal wire 21, a configuration in which fine wires made of fluororesin are assembled in a mesh shape may be adopted.

また、上記図６中のノズル待機ポッド１５における、カップ１５１内の防跳部材６６に関する第２構成例として、前記図３（ａ），（ｂ）の構成があげられる。すなわち、ステンレス等の薄い金属板３１に複数の開口３２を有する構成である。開口３２は、打ち抜きとせずに、開けしろ３３をある程度残し、開口端を揃えるよう仕上げている。図示しないが、開口自体をある程度傾斜させてもよい。これにより、処理液Ｑ（または溶剤貯留部１５２から）の跳ねや飛散を阻止する。もちろん、金属板３１に代えてフッ素樹脂板に複数の開口を有する構成を採用してもよい。   In addition, as the second configuration example of the anti-collision member 66 in the cup 151 in the nozzle standby pod 15 in FIG. 6, the configurations shown in FIGS. 3A and 3B can be mentioned. That is, it is the structure which has the some opening 32 in the thin metal plates 31, such as stainless steel. The opening 32 is not punched, but leaves an opening 33 to some extent and finishes so that the opening ends are aligned. Although not shown, the opening itself may be inclined to some extent. This prevents the treatment liquid Q (or from the solvent reservoir 152) from splashing or splashing. Of course, a configuration having a plurality of openings in the fluororesin plate instead of the metal plate 31 may be adopted.

また、上記図６中のノズル待機ポッド１５における、カップ１５１内の防跳部材６６に関する第３構成例として、前記図４（ａ），（ｂ）の構成があげられる。すなわち、複数の薄い長手の金属板（例えばステンレス製）４１を対向させ、スリットを構成するものである。対向させる金属板４１各々は、相対的に溶剤貯留部１５２表面に垂直でなく少し斜めに配置する。金属板４１の傾斜度合いは処理液供給ノズル１３から流下される処理液Ｑの通過の抵抗が大きすぎないようを考慮して設定される。これにより、処理液Ｑ（または溶剤貯留部１５２から）の跳ねや飛散を阻止する。もちろん、金属板４１に代えてフッ素樹脂板を利用し、対向させて上記と同様のスリットを構成してもよい。   In addition, as the third configuration example of the anti-collision member 66 in the cup 151 in the nozzle standby pod 15 in FIG. 6, the configurations in FIGS. 4A and 4B can be mentioned. That is, a plurality of thin and long metal plates (for example, made of stainless steel) 41 are opposed to form a slit. Each of the metal plates 41 to be opposed to each other is disposed relatively obliquely rather than perpendicular to the surface of the solvent reservoir 152. The inclination of the metal plate 41 is set in consideration of the resistance of passage of the processing liquid Q flowing down from the processing liquid supply nozzle 13 not being too large. This prevents the treatment liquid Q (or from the solvent reservoir 152) from splashing or splashing. Of course, instead of the metal plate 41, a fluororesin plate may be used, and the slits similar to the above may be configured to face each other.

図７（ａ），（ｂ）は、それぞれ上記図６中のノズル待機ポッド１５における、カップ１５１内の防跳部材６６に関する第４構成例を示す平面図、断面図である。前記図５（ａ），（ｂ）と同じ符号を付して説明する。それぞれ波形状に成形した複数の薄い長手の金属板（例えばステンレス製）５１を対向させ、波形のピーク部分５２を接触または接近させた構成となっている。各金属板５１は、防跳部材６６の傾斜に合わせて僅かずつずらして対抗させる。これにより、処理液Ｑ（または溶剤貯留部１５２から）の跳ねや飛散を阻止する。もちろん、金属板５１に代えてフッ素樹脂板を用い、波形にして対向させて上記と同様に波形のピーク部分を接触または接近させた構成をとってもよい。   FIGS. 7A and 7B are a plan view and a cross-sectional view, respectively, showing a fourth configuration example related to the jump preventing member 66 in the cup 151 in the nozzle standby pod 15 in FIG. The description will be made with the same reference numerals as those in FIGS. A plurality of thin and long metal plates (for example, made of stainless steel) 51 each having a corrugated shape are opposed to each other, and a corrugated peak portion 52 is in contact with or close to each other. The respective metal plates 51 are made to oppose each other by being slightly shifted in accordance with the inclination of the anti-reflection member 66. This prevents the treatment liquid Q (or from the solvent reservoir 152) from splashing or splashing. Of course, instead of the metal plate 51, a fluororesin plate may be used, and the corrugated peak portions may be brought into contact with or approached in the same manner as described above.

上記実施形態、各防跳部材の構成によれば、防跳部材６６は、処理液供給ノズル１３から流下された処理液Ｑを跳ね返すことなく大部分通過させる。かつ、溶剤貯留部１５２からの処理液Ｑまたは溶剤の跳ね返りを阻止し、処理液供給ノズル１３先端やその近傍のカップ１５１壁面への付着をなくする。これにより、パーティクルの原因となるノズル先端の汚染を防止することができる。
なお、各例示した防跳部材６６は交換可能であり、汚染が許容範囲を越えたら交換するようにすればよい。 According to the above embodiment and the configuration of each jumper member, the jumper member 66 allows most of the processing liquid Q flowing down from the processing liquid supply nozzle 13 to pass without rebounding. In addition, the rebound of the processing liquid Q or the solvent from the solvent storage unit 152 is prevented, and adhesion to the front end of the processing liquid supply nozzle 13 and the cup 151 wall in the vicinity thereof is eliminated. Thereby, contamination of the nozzle tip that causes particles can be prevented.
Note that each of the illustrated anti-reflection members 66 can be replaced, and may be replaced when the contamination exceeds an allowable range.

図８は、本発明の第３実施形態に係る基板塗布装置の要部構成を示す概観図である。前記第１実施形態と同様の箇所には図１と同一の符号を付す。前記図１に比べて異なる構成は、防跳部材の形態である。防跳部材７６として、ノズル待機ポッド１５のカップ１５１内に、処理液供給ノズル１３先端に対向する所定領域に窪み７６１を形成した構成となっている。窪みの広さ、深さは限定されないが、処理液供給ノズル１３から流下される処理液Ｑを窪み７６１中で受け入れ、飛散せずに窪み７６１底部で処理液Ｑを大部分通過させるよう構成する。これにより、防跳部材７６は、処理液供給ノズル１３から流下された処理液Ｑを大部分通過させて溶剤貯留部１５２に落とすと共に溶剤貯留部１５２からの跳ね返りを阻止する。   FIG. 8 is a schematic view showing the main configuration of a substrate coating apparatus according to the third embodiment of the present invention. The same reference numerals as those in FIG. 1 are attached to the same portions as those in the first embodiment. A configuration different from that in FIG. 1 is a form of a jump-proof member. As the jump preventing member 76, a recess 761 is formed in a predetermined region facing the tip of the processing liquid supply nozzle 13 in the cup 151 of the nozzle standby pod 15. The width and depth of the depression are not limited, but the treatment liquid Q flowing down from the treatment liquid supply nozzle 13 is received in the depression 761, and the treatment liquid Q is mostly passed through the bottom of the depression 761 without being scattered. . As a result, the splash-proof member 76 passes most of the processing liquid Q flowing down from the processing liquid supply nozzle 13 and drops it into the solvent storage section 152, and prevents rebound from the solvent storage section 152.

図９（ａ），（ｂ）は、それぞれ上記図８中のノズル待機ポッド１５における、カップ１５１内の防跳部材７６に関する一構成例を示す平面図、断面図である。ステンレス等の金属ワイヤ９１を網目状に組んだ構成となっている。窪み７６１に相当する箇所が設けられる。これにより、処理液Ｑ（または溶剤貯留部１５２から）の跳ねや飛散を阻止する。もちろん、金属ワイヤ９１に代えてフッ素樹脂製の細線を網目状に組んだ構成で窪み７６１に相当する箇所が設けられるようにしてもよい。   FIGS. 9A and 9B are a plan view and a cross-sectional view, respectively, showing a configuration example regarding the jump preventing member 76 in the cup 151 in the nozzle standby pod 15 in FIG. The metal wire 91 such as stainless steel is assembled in a mesh shape. A portion corresponding to the depression 761 is provided. This prevents the treatment liquid Q (or from the solvent reservoir 152) from splashing or splashing. Of course, instead of the metal wire 91, a portion corresponding to the depression 761 may be provided with a configuration in which fine wires made of fluororesin are assembled in a mesh shape.

上記実施形態、各防跳部材の構成によれば、防跳部材７６は、処理液供給ノズル１３から流下された処理液Ｑを跳ね返すことなく窪み７６１底部で大部分通過させる。かつ、溶剤貯留部１５２からの処理液Ｑまたは溶剤の跳ね返りを阻止し、処理液供給ノズル１３先端やその近傍のカップ１５１壁面への付着をなくする。これにより、パーティクルの原因となるノズル先端の汚染を防止することができる。
なお、例示した防跳部材７６は交換可能であり、汚染が許容範囲を越えたら交換するようにすればよい。 According to the above embodiment and the configuration of each jumper member, the jumper member 76 allows most of the treatment liquid Q flowing down from the treatment liquid supply nozzle 13 to pass through the bottom of the recess 761 without splashing back. In addition, the rebound of the processing liquid Q or the solvent from the solvent storage unit 152 is prevented, and adhesion to the front end of the processing liquid supply nozzle 13 and the cup 151 wall in the vicinity thereof is eliminated. Thereby, contamination of the nozzle tip that causes particles can be prevented.
The illustrated anti-recoil member 76 is replaceable, and may be replaced when contamination exceeds an allowable range.

図１０は、本発明の第４実施形態に係る基板塗布装置の要部構成を示す概観図である。前記第１実施形態と同様の箇所には図１と同一の符号を付す。前記図１に比べて異なる構成は、防跳部材を二重に設けたことである。ノズル待機ポッド１５のカップ１５１内において溶剤貯留部１５２と処理液供給ノズル１３先端の間に、防跳部材８６１，８６２が離間して設けられている。防跳部材８６１，８６２互いの離間距離は、限定されないが、溶剤貯留部１５２表面から離れ過ぎないようにする。溶剤貯留部１５２表面から離れ過ぎて溶剤雰囲気が希薄になると処理液Ｑの付着が堆積し易いからである。このような構成によって、防跳部材８６１，８６２は、処理液供給ノズル１３から流下された処理液Ｑを大部分通過させて溶剤貯留部１５２に落とすと共に溶剤貯留部１５２からの跳ね返りを阻止する。   FIG. 10 is a schematic view showing the main configuration of a substrate coating apparatus according to the fourth embodiment of the present invention. The same reference numerals as those in FIG. 1 are attached to the same portions as those in the first embodiment. The configuration different from that in FIG. 1 is that the anti-reflection member is provided twice. In the cup 151 of the nozzle standby pod 15, jump prevention members 861 and 862 are provided between the solvent reservoir 152 and the tip of the treatment liquid supply nozzle 13 so as to be separated from each other. The distance between the jump preventing members 861 and 862 is not limited, but is not too far from the surface of the solvent reservoir 152. This is because if the solvent atmosphere becomes too thin from the surface of the solvent reservoir 152, adhesion of the treatment liquid Q is likely to be deposited. With such a configuration, the anti-recoil members 861 and 862 allow most of the processing liquid Q flowing down from the processing liquid supply nozzle 13 to pass through and drop into the solvent storage section 152 and prevent rebound from the solvent storage section 152.

上記図１０中のノズル待機ポッド１５における、カップ１５１内の防跳部材８６１，８６２に関する具体的な構成は、前記図２〜図５の各構成を適当に選択して適用することができる。防跳部材を二重に設けることで、処理液Ｑ（または溶剤貯留部１５２から）の跳ねや飛散を阻止する能力を向上させる。なお、防跳部材８６１，８６２は交換可能であり、汚染が許容範囲を越えたら交換するようにすればよい。   In the nozzle standby pod 15 in FIG. 10 described above, the specific configurations relating to the anti-recoil members 861 and 862 in the cup 151 can be applied by appropriately selecting the configurations in FIGS. The ability to prevent the treatment liquid Q (or from the solvent storage unit 152) from splashing or splashing is improved by providing double anti-reflection members. The anti-recoil members 861 and 862 can be replaced, and may be replaced when the contamination exceeds an allowable range.

上記各実施形態によれば、被処理基板ＷＦを回転させながら処理液Ｑを塗布する半導体装置の製造方法において有用である。処理液Ｑは、ＳＯＧ液に限らず、レジスト液、現像液、ポリイミド樹脂用薬液等に代えることが考えられる。すなわち、ノズル待機ポッド１５のカップ１５１底部の溶剤貯留部１５２と処理液供給ノズル１３先端の間に防跳部材１６，６６，７６，（８６１，８６２）いずれかが設けられる。処理液供給ノズル１３の待機中、設けられた防跳部材により、処理液供給１３ノズルから流下される処理液Ｑに関し大部分通過させて溶剤貯留部１５２に落とすと共に溶剤貯留部１５２からの跳ね返りを防止する。よって本発明の結果、ＳＯＧ液等、処理液の跳ね返りによるノズル先端の汚染を防止する待機ポッドを有し、不良発生を抑制する基板塗布装置及び半導体装置の製造方法を提供することができる。   Each of the above embodiments is useful in the method for manufacturing a semiconductor device in which the processing liquid Q is applied while rotating the target substrate WF. The processing solution Q is not limited to the SOG solution, but may be replaced with a resist solution, a developer, a polyimide resin chemical solution, or the like. That is, any one of the anti-recoil members 16, 66, 76, (861, 862) is provided between the solvent reservoir 152 at the bottom of the cup 151 of the nozzle standby pod 15 and the tip of the treatment liquid supply nozzle 13. During the standby of the processing liquid supply nozzle 13, the provided anti-reflection member allows most of the processing liquid Q flowing down from the processing liquid supply 13 nozzle to pass through and drop into the solvent storage section 152 and to bounce off from the solvent storage section 152. To prevent. Therefore, as a result of the present invention, it is possible to provide a substrate coating apparatus and a semiconductor device manufacturing method that have a standby pod that prevents contamination of the nozzle tip due to rebound of the processing liquid such as SOG liquid and suppresses the occurrence of defects.

第１実施形態に係る基板塗布装置の要部構成を示す概観図。BRIEF DESCRIPTION OF THE DRAWINGS The general-view figure which shows the principal part structure of the board | substrate coating device which concerns on 1st Embodiment. 図１中の防跳部材に関する第１構成例を示す平面、断面各図。FIG. 2 is a plan view and a cross-sectional view showing a first configuration example related to a jump-proof member in FIG. 1. 図１中の防跳部材に関する第２構成例を示す平面、断面各図。FIG. 4 is a plan view and a cross-sectional view showing a second configuration example related to a jump-proof member in FIG. 1. 図１中の防跳部材に関する第３構成例を示す平面、断面各図。FIG. 4 is a plan view and a cross-sectional view showing a third configuration example related to the jump-proof member in FIG. 1. 図１中の防跳部材に関する第４構成例を示す平面、断面各図。FIG. 5 is a plan view and a cross-sectional view showing a fourth configuration example related to the jump-proof member in FIG. 1. 第２実施形態に係る基板塗布装置の要部構成を示す概観図。FIG. 9 is an overview diagram showing a main configuration of a substrate coating apparatus according to a second embodiment. 図６中の防跳部材に関する第４構成例を示す平面、断面各図。FIGS. 7A and 7B are a plan view and a cross-sectional view showing a fourth configuration example related to a jump-proof member in FIG. 6. 第３実施形態に係る基板塗布装置の要部構成を示す概観図。FIG. 9 is an overview diagram showing a main configuration of a substrate coating apparatus according to a third embodiment. 図８中の防跳部材に関する一構成例を示す平面、断面各図。FIG. 9 is a plan view and a cross-sectional view showing an example of the configuration of the jump-proof member in FIG. 8. 第４実施形態に係る基板塗布装置の要部構成を示す概観図。The general-view figure which shows the principal part structure of the board | substrate coating device which concerns on 4th Embodiment.

符号の説明Explanation of symbols

１１…回転台、１２…駆動制御部、１３…処理液供給ノズル、１５…ノズル待機ポッド、１５１…カップ、１５２…溶剤貯留部、１５３…排液口、１６，６６，７６，８６１，８６２…防跳部材、３１，４１，５１…金属板（または樹脂板）、３２…開口、３３…開けしろ、５２…波形のピーク部分、７６１…窪み、ＷＦ…被処理基板、Ｑ…処理液。   DESCRIPTION OF SYMBOLS 11 ... Turntable, 12 ... Drive control part, 13 ... Processing liquid supply nozzle, 15 ... Nozzle standby pod, 151 ... Cup, 152 ... Solvent storage part, 153 ... Drain outlet, 16, 66, 76, 861, 862 ... Jump-proof member, 31, 41, 51 ... metal plate (or resin plate), 32 ... opening, 33 ... open, 52 ... peak portion of waveform, 761 ... depression, WF ... substrate to be processed, Q ... treatment liquid.

Claims (10)

被処理基板の裏面側が保持される回転台と、
前記回転台を所定の回転数で回転させる駆動制御部と、
前記被処理基板の回転中心上方で前記被処理基板に対し処理液を吐出する供給位置と前記被処理基板から外れた待機位置の間で移動可能な処理液供給ノズルと、
前記待機位置に設けられ、前記処理液供給ノズルが前記待機位置に移動してきたときに上方で前記処理液供給ノズルの先端部を収納し前記処理液の溶剤雰囲気にて待機させるノズル待機ポッドと、
前記ノズル待機ポッドのカップ底部の溶剤貯留部と、
前記溶剤貯留部の過剰量を排出する排液口と、
前記ノズル待機ポッドのカップ内において前記溶剤貯留部と前記処理液供給ノズル先端の間に設けられ、前記処理液供給ノズルから流下された処理液を大部分通過させて前記溶剤貯留部に落とすと共に前記溶剤貯留部からの跳ね返りを阻止する防跳部材と、
を含む基板塗布装置。 A turntable on which the back side of the substrate to be processed is held;
A drive controller for rotating the turntable at a predetermined number of revolutions;
A processing liquid supply nozzle movable between a supply position for discharging a processing liquid to the substrate to be processed and a standby position outside the substrate to be processed above the rotation center of the substrate to be processed;
A nozzle standby pod that is provided at the standby position and stores the tip of the processing liquid supply nozzle above when the processing liquid supply nozzle has moved to the standby position, and waits in a solvent atmosphere of the processing liquid;
A solvent reservoir at the bottom of the cup of the nozzle standby pod;
A drainage port for discharging an excessive amount of the solvent reservoir;
In the cup of the nozzle standby pod, provided between the solvent reservoir and the treatment liquid supply nozzle tip, the treatment liquid flowing down from the treatment liquid supply nozzle is mostly passed and dropped into the solvent reservoir and the A bounce-proof member that prevents rebound from the solvent reservoir,
A substrate coating apparatus including: 前記防跳部材は、前記処理液供給ノズル先端側より前記溶剤貯留部表面寄りに位置する請求項１記載の基板塗布装置。 The substrate coating apparatus according to claim 1, wherein the jump preventing member is located closer to a surface of the solvent storage portion than a front end side of the processing liquid supply nozzle. 前記防跳部材は、網目状の構成を含む請求項１または２記載の基板塗布装置。 The substrate coating apparatus according to claim 1, wherein the jump-proof member includes a net-like configuration. 前記防跳部材は、薄い金属板または樹脂板に複数の開口を有する構成を含む請求項１または２記載の基板塗布装置。 The substrate coating apparatus according to claim 1, wherein the jump-proof member includes a structure having a plurality of openings in a thin metal plate or resin plate. 前記防跳部材は、複数の薄い長手の金属板または樹脂板を対向させたスリットの構成を含む請求項１または２記載の基板塗布装置。 The substrate coating apparatus according to claim 1, wherein the jump-proof member includes a slit configuration in which a plurality of thin long metal plates or resin plates are opposed to each other. 前記防跳部材は、各々波状に成形した複数の薄い長手の金属板または樹脂板どうし対向させ一部を接触または接近させた構成を含む請求項１または２記載の基板塗布装置。 3. The substrate coating apparatus according to claim 1, wherein the jump-proof member includes a configuration in which a plurality of thin longitudinal metal plates or resin plates each formed in a wave shape are opposed to each other and partially contacted or approached. 前記防跳部材は、傾斜して取り付けられている請求項１〜６いずれか一つに記載の基板塗布装置。 The board | substrate coating apparatus as described in any one of Claims 1-6 in which the said jumping-proof member is inclined and attached. 前記防跳部材は、前記処理液供給ノズル先端に対向する所定領域に窪みを有する請求項１〜６ずれか一つに記載の基板塗布装置。 The substrate coating apparatus according to claim 1, wherein the jump preventing member has a depression in a predetermined region facing the tip of the processing liquid supply nozzle. 前記防跳部材は、二重構造となっている請求項１〜７いずれか一つに記載の基板塗布装置。 The substrate coating apparatus according to claim 1, wherein the jump-proof member has a double structure. 被処理基板を回転させながら処理液を塗布する半導体装置の製造方法において、
処理液供給ノズルが前記被処理基板に対し処理液を吐出する工程と、
処理液供給ノズルが待機位置に移動し、ノズル待機ポッドに前記処理液供給ノズルの先端部を収納して前記処理液の溶剤雰囲気にて待機させる工程と、を含み、
前記処理液供給ノズルの待機中、前記ノズル待機ポッドのカップ底部の溶剤貯留部と前記処理液供給ノズル先端の間に設けられた防跳部材により、前記処理液供給ノズルから流下される処理液に関し大部分通過させて前記溶剤貯留部に落とすと共に前記溶剤貯留部からの跳ね返りを防止することを特徴とする半導体装置の製造方法。 In a method for manufacturing a semiconductor device in which a processing liquid is applied while rotating a substrate to be processed.
A process liquid supply nozzle discharging the process liquid onto the substrate to be processed;
A process liquid supply nozzle is moved to a standby position, and a nozzle standby pod stores the tip of the process liquid supply nozzle and waits in a solvent atmosphere of the process liquid, and
During the standby of the processing liquid supply nozzle, the processing liquid that flows down from the processing liquid supply nozzle by a jump-proof member provided between the solvent storage part at the bottom of the cup of the nozzle standby pod and the tip of the processing liquid supply nozzle A method for manufacturing a semiconductor device, wherein the semiconductor device is passed through a large portion and dropped into the solvent storage section, and rebound from the solvent storage section is prevented.
JP2005038741A 2005-02-16 2005-02-16 Substrate coating device and manufacturing method of semiconductor device Withdrawn JP2006228854A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107372195A (en) * 2017-09-08 2017-11-24 真木农业设备（安徽）有限公司 A kind of multi-functional poultry drinking-water system
KR20200031196A (en) * 2018-09-13 2020-03-24 세메스 주식회사 Apparatus and Method for treating substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107372195A (en) * 2017-09-08 2017-11-24 真木农业设备（安徽）有限公司 A kind of multi-functional poultry drinking-water system
CN107372195B (en) * 2017-09-08 2023-11-14 殷文斐 Multifunctional chicken raising drinking water system
KR20200031196A (en) * 2018-09-13 2020-03-24 세메스 주식회사 Apparatus and Method for treating substrate
KR102134433B1 (en) 2018-09-13 2020-07-16 세메스 주식회사 Apparatus and Method for treating substrate

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