JP2006228657A - Thin thermal fuse, method and apparatus of manufacturing the same - Google Patents

Thin thermal fuse, method and apparatus of manufacturing the same Download PDF

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JP2006228657A
JP2006228657A JP2005043632A JP2005043632A JP2006228657A JP 2006228657 A JP2006228657 A JP 2006228657A JP 2005043632 A JP2005043632 A JP 2005043632A JP 2005043632 A JP2005043632 A JP 2005043632A JP 2006228657 A JP2006228657 A JP 2006228657A
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lead conductor
mold
resin
thermal fuse
thin thermal
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JP4508902B2 (en
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Noriyuki Katsumoto
憲幸 勝本
Hiroshi Nakajima
博司 中島
Masayuki Fukazawa
真之 深澤
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Anzen Dengu KK
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Anzen Dengu KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin thermal fuse which can be easily manufactured by reducing the number of parts, without needing heating process, and to provide an apparatus for manufacturing used for the method of manufacturing and a manufactured thin thermal fuse. <P>SOLUTION: The fusible alloy 1 of a lead conductor 2, where the fusible alloy 1 is formed in a center is located in the recess 3c of a lower mold 3. The lead conductor 2 is located in the channel-like lead conductor arranging parts 3d formed in both sides of the recess 3c. After a resin 8, which will be hardened if UV is irradiated in the recess 3c, after predetermined amount has been dropped, the upper mold 4 which penetrates the UV is put to the upper part of the lower mold 3, and closed. Either at least one of the lower mold 3 and the upper mold 4 is made of the UV-transparent material. The resin 8 is cured by irradiating the UV out of the mold, thereby curing the resin 8, and the inner ends of the fusible alloy 1 and the lead conductor 2 are molded. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、周囲温度の上昇により溶断し回路を保護する薄型温度ヒューズの製造方法およびその製造装置ならびにその製造方法、製造装置によって製造された薄型温度ヒューズに関する。   The present invention relates to a manufacturing method of a thin thermal fuse that melts and protects a circuit due to an increase in ambient temperature, a manufacturing apparatus thereof, a manufacturing method thereof, and a thin thermal fuse manufactured by the manufacturing apparatus.

従来からある一般的な温度ヒューズとしては、例えば実開昭５６−６５５５３号公報に示されるように、両端が開口した筒状のケース内に、ヒューズ素体である可溶合金を収納し、その両端に接続されたリード導体をケース外に導出し、かつケース両端の開口部を封止した構成となっている。   As a conventional general temperature fuse, for example, as shown in Japanese Utility Model Laid-Open No. 56-65553, a fusible alloy as a fuse element is housed in a cylindrical case having both ends opened. The lead conductor connected to both ends is led out of the case, and the openings at both ends of the case are sealed.

この温度ヒューズはケースの厚みがある。近年、電子機器は益々小型、薄型化の傾向にある。このため、上記温度ヒューズも薄型にすることが好ましい。   This thermal fuse has a case thickness. In recent years, electronic devices are becoming smaller and thinner. For this reason, it is preferable to make the temperature fuse thin.

薄型化を図った温度ヒューズとしては特開平１１−３５３９９５号公報に示されるものがある。   As a thermal fuse designed to be thin, there is one disclosed in Japanese Patent Application Laid-Open No. 11-353995.

この温度ヒューズは、図１９に示すように、一対の帯状リード導体２１１、２１２の先端間に低融点可溶合金２２０を接続し、可溶合金片２２０を樹脂フィルム２３１、２３２で挟む。そして、樹脂フィルム２３１、２３２の周辺を封止すると共に、各樹脂フィルム２３１、２３２と帯状リード導体２１１、２１２との間を封止する。このとき、帯状リード導体２１１、２１２の被封止部に樹脂層２４１、２４２を被覆して、樹脂フィルム２３１、２３２と帯状リード導体２１１、２１２の被封止部の樹脂層２４１、２４２との間を融着する構成となっている。
実開昭５６−６５５５３号公報 特開平１１−３５３９９５号公報 In this thermal fuse, as shown in FIG. 19, a low melting point soluble alloy 220 is connected between the tips of a pair of strip-shaped lead conductors 211 and 212, and the soluble alloy piece 220 is sandwiched between resin films 231 and 232. And while sealing the periphery of the resin films 231 and 232, between each resin film 231 and 232 and the strip | belt-shaped lead conductors 211 and 212 is sealed. At this time, the resin layers 241 and 242 are coated on the sealed portions of the strip-shaped lead conductors 211 and 212, and the resin films 231 and 232 and the resin layers 241 and 242 of the sealed portions of the strip-shaped lead conductors 211 and 212 are formed. It is configured to fuse the gaps.
Japanese Utility Model Publication No. 56-65553 Japanese Patent Laid-Open No. 11-353995

この薄型温度ヒューズは、可溶合金、リード導体のほかに、ケース部品、封止材等を必要とし、部品点数が多く、その分の部品代を要する。   This thin thermal fuse requires a case component, a sealing material, etc. in addition to a fusible alloy and a lead conductor, has a large number of components, and requires a corresponding component cost.

また、製造するにあたり、低融点可溶合金片２２０を一対の帯状リード導体２１１、２１２に対して溶接等で接続する工程に加えて、さらに、ヒートシール、超音波融着、レーザ照射等の加熱工程により、樹脂フィルム２３１と樹脂フィルム２３２とを融着し、かつ樹脂フィルム２３１、２３２と帯状リード導体２１１、２１２の被封止部の樹脂層２４１、２４２とを融着する必要があり、なおかつその際に特殊活性樹脂も樹脂フィルム２３１、２３２によって形成された内部空間に必要量を封入しなければならず、製造が煩雑である。   In addition, in addition to the process of connecting the low melting point soluble alloy piece 220 to the pair of strip-shaped lead conductors 211 and 212 by welding or the like, in addition to heating, heat sealing, ultrasonic fusion, laser irradiation, etc. According to the process, it is necessary to fuse the resin film 231 and the resin film 232, and fuse the resin films 231 and 232 and the resin layers 241 and 242 of the encapsulated portions of the strip-shaped lead conductors 211 and 212, and At that time, the special active resin also has to be sealed in a required amount in the internal space formed by the resin films 231 and 232, and the production is complicated.

本発明は上記のことに鑑み提案されたもので、その目的とするところは、部品点数を削減し、かつ加熱工程を必要とせず容易に製造し得る薄型温度ヒューズの製造方法およびその製造方法に用いられる製造装置、ならびに製造された薄型温度ヒューズを提供することにある。   The present invention has been proposed in view of the above, and an object of the present invention is to provide a manufacturing method and a manufacturing method of a thin thermal fuse that can be easily manufactured without reducing the number of components and requiring a heating process. It is an object of the present invention to provide a manufacturing apparatus to be used and a manufactured thin thermal fuse.

上記課題を解決するために、請求項１の発明は、中央部に可溶合金１が設けられたリード導体２の前記可溶合金１を、下型３の凹部３ｃ内に位置させ、前記リード導体２を前記凹部３ｃの両側に形成された溝状のリード導体配置部３ｄに位置させ、前記凹部３ｃ内にＵＶを照射すると硬化する樹脂８を所定量滴下後、前記下型３の上部にＵＶを透過する上型４を被せ型閉じし、前記下型３、上型４の少なくともいずれか一方はＵＶ透過性の材質からなり、型の外側からＵＶを照射することにより前記樹脂８を硬化させ前記可溶合金１および前記リード導体２の内端部をモールドすることを特徴とする。
請求項２の発明は、請求項１記載の薄型温度ヒューズの製造方法において、前記可溶合金１の外周部およびこの可溶合金１と前記リード導体２との各接合部周辺にロジン１ａを塗布し、各接合部周辺は、前記可溶合金１端部の外側の長さ方向領域にわたって塗布するとともに、長さ方向とほぼ直交する外側の領域にわたって広範囲に塗布したことを特徴とする。
請求項３の発明の製造装置は、中央部に樹脂８充填用の凹部３ｃが形成され、この凹部３ｃの両側に溝状のリード導体配置部３ｄがそれぞれ形成された下型３と、この下型３の上部に配置され、その両側に前記溝状のリード導体配置部３ｄ内に挿入されリード導体２を押さえる凸状のリード導体固定部４ｄが形成された上型４と、ＵＶを照射する光源１０とを備え、前記下型３または前記上型４の少なくともいずれか一方をＵＶ透過性の材質にて形成したことを特徴とする。
請求項４の発明は、請求項３記載の薄型温度ヒューズ製造装置において、前記下型３の前記各リード導体配置部３ｄに離型用突き出しピン挿入孔３ｅがそれぞれ形成され、前記下型３の下側に、上部に前記突き出しピン挿入孔３ｅ内に挿通され、上端が前記離型用突き出しピン挿入孔３ｅから突出可能な突き出しピン６が突設された離型部材５が上下動自在に配置されることを特徴とする。
請求項５の発明は、請求項１記載の薄型温度ヒューズ製造方法によって作製されたことを特徴とする。 In order to solve the above-mentioned problem, the invention of claim 1 is characterized in that the fusible alloy 1 of the lead conductor 2 provided with the fusible alloy 1 at the center is positioned in the recess 3c of the lower die 3, and the lead The conductor 2 is positioned on a groove-shaped lead conductor arrangement portion 3d formed on both sides of the concave portion 3c, and a predetermined amount of resin 8 that is cured when UV is irradiated into the concave portion 3c is dropped on the upper portion of the lower mold 3. The upper mold 4 that transmits UV is covered and the mold is closed, and at least one of the lower mold 3 and the upper mold 4 is made of a UV transparent material, and the resin 8 is cured by irradiating UV from the outside of the mold. The inner ends of the fusible alloy 1 and the lead conductor 2 are molded.
According to a second aspect of the present invention, in the method for manufacturing a thin thermal fuse according to the first aspect, the rosin 1a is applied to the outer peripheral portion of the fusible alloy 1 and the joints between the fusible alloy 1 and the lead conductor 2. And each joint part periphery was apply | coated extensively over the outer area | region substantially orthogonal to a length direction while apply | coating over the length direction area | region of the outer side of the said soluble alloy 1 edge part.
The manufacturing apparatus of the invention of claim 3 includes a lower die 3 in which a recess 3c for filling a resin 8 is formed in the central portion, and groove-shaped lead conductor placement portions 3d are formed on both sides of the recess 3c. An upper mold 4 which is arranged on the upper part of the mold 3 and has convex lead conductor fixing portions 4d which are inserted into the groove-shaped lead conductor arrangement portions 3d on both sides thereof to hold the lead conductor 2 and UV is irradiated. And a light source 10, wherein at least one of the lower mold 3 and the upper mold 4 is formed of a UV transmissive material.
According to a fourth aspect of the present invention, in the thin thermal fuse manufacturing apparatus according to the third aspect of the present invention, a release protrusion insertion hole 3e is formed in each lead conductor arrangement portion 3d of the lower mold 3, and the lower mold 3 On the lower side, a release member 5 having an upper end inserted into the protrusion pin insertion hole 3e and an upper end protruding from the release protrusion insertion hole 3e is protruded. It is characterized by being.
The invention of claim 5 is characterized by being manufactured by the thin thermal fuse manufacturing method of claim 1.

以上のように請求項１〜５記載の本発明によれば加熱工程を必要とせず、ＵＶを照射するだけで良いため、設備費を低減でき、かつ製造時間を短縮でき、容易に製造し得る。   As described above, according to the first to fifth aspects of the present invention, it is only necessary to irradiate UV without requiring a heating step. Therefore, the equipment cost can be reduced, and the manufacturing time can be shortened, which can be easily manufactured. .

また、請求項２記載のようにロジン１ａを塗布すると、直接樹脂８で覆っても溶断スペースを確保でき、直接樹脂８で覆うため、薄型温度ヒューズの封止信頼性が向上し、かつ構造が簡易であり、製造を簡略化できる。   In addition, when the rosin 1a is applied as described in claim 2, the fusing space can be secured even if it is directly covered with the resin 8, and the sealing reliability of the thin thermal fuse is improved and the structure is improved. It is simple and manufacturing can be simplified.

さらに、設備費低減に加え、ＵＶによって硬化する樹脂がケース、封止材等を兼ねるため、その分、部品点数も削減するので、この点からも組み立てが容易であるとともに、コストダウンを達成できる。   Furthermore, in addition to the reduction in equipment costs, the resin cured by UV also serves as a case, sealing material, etc., so the number of parts is reduced accordingly, so that assembly is easy and cost reduction can be achieved. .

また、型を変更するだけで簡単に任意の形状の薄型温度ヒューズを得ることができ、仕様の変更に容易に対応でき汎用性を有する。   In addition, a thin thermal fuse having an arbitrary shape can be obtained simply by changing the mold, and it can be easily adapted to a change in specifications and has versatility.

以下、図面に沿って本発明の実施例を説明する。   Embodiments of the present invention will be described below with reference to the drawings.

［実施の形態１］
図１〜図１７は本発明の第１実施例にかかる薄型温度ヒューズの製造工程を示す。 [Embodiment 1]
1 to 17 show a manufacturing process of a thin thermal fuse according to the first embodiment of the present invention.

製造にあたっては、図１に示すように、周囲にロジン１ａ（図２参照）が塗布される可溶合金１を互に離間して対向配置された一対のリードフレームからなるリード導体２、２の内端部間に溶着する。   In manufacturing, as shown in FIG. 1, the lead conductors 2 and 2 each composed of a pair of lead frames which are disposed so as to face each other with a fusible alloy 1 coated with rosin 1a (see FIG. 2). Weld between inner ends.

可溶合金１は、周囲温度の上昇に応じて可溶する棒状または帯状の金属であり、例えば、Ｓｎ，ＡｇまたはＣｕ等の一種、あるいはそれらを適宜混合したものが用いられる。周囲に塗布される特殊活性樹脂からなるロジン１ａは可溶合金１の酸化抑制等のために塗布される。   The fusible alloy 1 is a rod-like or strip-like metal that is soluble as the ambient temperature rises. For example, one kind of Sn, Ag, Cu, or the like, or a mixture of them is appropriately used. The rosin 1a made of a special active resin applied to the surroundings is applied for suppressing oxidation of the soluble alloy 1 or the like.

リード導体２はこの例では単純な平坦な帯状の板状体からなる。したがって、容易に製造でき、低コストである。リード導体２の材質としては例えばニッケルなどの金属が用いられる。   In this example, the lead conductor 2 is a simple flat belt-like plate. Therefore, it can be easily manufactured and is low in cost. As the material of the lead conductor 2, for example, a metal such as nickel is used.

図２（ａ）はロジン１ａが塗布された可溶合金１を一対のリード導体２、２間に接続した組立体の側面図、（ｂ）は平面図を示す。   2A is a side view of an assembly in which a fusible alloy 1 coated with rosin 1a is connected between a pair of lead conductors 2 and 2, and FIG. 2B is a plan view.

ロジン１ａは、固体もしくはある程度の可塑性や粘性を有し、可溶合金１の外周部および各リード導体２との接合部周辺に塗布される。各接合部周辺は可溶合金１の端部の外側に可溶合金１の長さ方向に沿った領域に塗布されている。また、長さ方向とほぼ直交する外側の領域にわたっても塗布され、広範囲にわたって塗布されている。図示例ではほぼ矩形に塗布しているが、長円形に塗布しても良い。この特殊活性樹脂の役割は低融点可溶合金の酸化抑制や可溶合金が溶断するとき表面張力を大きくし、かつリード線への濡れ性を向上させると考えられている。したがって可溶合金は溶断するまで常時、特殊活性樹脂によって覆われていることが好ましい。本発明では、このようにロジン１ａを塗布することで、樹脂８でモールドしても溶断スペースを確保できることを本発明者は発見した。その結果、直接樹脂８で可溶合金１を覆うことを可能とし、薄型温度ヒューズの封止信頼性の向上と、構造を簡易にでき、容易に製造できるようにした。   The rosin 1a is solid or has a certain degree of plasticity and viscosity, and is applied to the outer peripheral portion of the fusible alloy 1 and the periphery of the joint portion with each lead conductor 2. The periphery of each joint is applied to the region along the length direction of the fusible alloy 1 outside the end of the fusible alloy 1. Moreover, it is applied over an outer region substantially orthogonal to the length direction, and is applied over a wide range. In the illustrated example, it is applied in a substantially rectangular shape, but it may be applied in an oval shape. The role of this special active resin is considered to suppress the oxidation of the low melting point soluble alloy, increase the surface tension when the soluble alloy melts, and improve the wettability to the lead wire. Therefore, it is preferable that the fusible alloy is always covered with the special active resin until fusing. In the present invention, the present inventor has discovered that by applying the rosin 1a in this way, a fusing space can be secured even if the resin 8 is molded. As a result, it is possible to directly cover the fusible alloy 1 with the resin 8, so that the sealing reliability of the thin thermal fuse can be improved and the structure can be simplified and easily manufactured.

図３（ａ）は上記組立体が設置される下側に位置する成形用の下型３の平面図を示す。なお、右側の図はこの下型３を右側から見た側面図を示す。   Fig.3 (a) shows the top view of the lower mold | type 3 for shaping | molding located in the lower side in which the said assembly is installed. In addition, the figure on the right side shows a side view of the lower mold 3 viewed from the right side.

図３（ｂ）は下型３に組み合わせられる、上側に配置される上型４の底面図を示す。右側の図はこの上型４を右側から見た側面図を示す。   FIG. 3B shows a bottom view of the upper die 4 arranged on the upper side, which is combined with the lower die 3. The figure on the right side shows a side view of the upper mold 4 as seen from the right side.

図３（ｃ）は、下型３と、これと対向配置された上型４の斜視図を示す。   FIG.3 (c) shows the perspective view of the lower mold | type 3 and the upper mold | type 4 arrange | positioned facing this.

下型３は、図３（ａ）、（ｃ）等に示すように、全体の外形は横長のほぼ矩形をなす本体３ａからなり、その上面３ｂの中央部に必要とされる所定の深さを有し、外形がほぼ矩形状の凹部３ｃが形成されている。この凹部３ｃの中央部両側には、溝状をなし本体３ａの長さ方向に沿って延びるリード導体配置部３ｄがそれぞれ形成されている。この部分にリード導体２が配置される。   As shown in FIGS. 3 (a), 3 (c), etc., the lower mold 3 is composed of a horizontally elongated main body 3a having a predetermined depth required at the center of the upper surface 3b. A recess 3c having a substantially rectangular outer shape is formed. On both sides of the central portion of the concave portion 3c, lead conductor arrangement portions 3d that form a groove shape and extend along the length direction of the main body 3a are formed. The lead conductor 2 is disposed at this portion.

また、溝状の各リード導体配置部３ｄの内端部、すなわち凹部３ｃ側にはほぼ円形の離型用突き出しピン挿通孔３ｅがそれぞれ形成されている。   Also, a substantially circular release pin insertion hole 3e is formed on the inner end of each of the groove-shaped lead conductor placement portions 3d, that is, on the recess 3c side.

上型４は、図３（ｂ）、（ｃ）に示すように外形は下型３とほぼ同様に形成され、本体４ａの底面４ｂの中央部には下型３の凹部３ｃとほぼ対応する凹部４ｃが形成されている。この凹部４ｃは薄型温度ヒューズの厚みを一定にするために設けられる。この凹部４ｃの中央部両側には、下型３に形成された溝状のリード導体配置部３ｄ内に挿入される凸状のリード導体固定部４ｄが突設されている。   As shown in FIGS. 3B and 3C, the outer shape of the upper die 4 is substantially the same as that of the lower die 3, and the central portion of the bottom surface 4b of the main body 4a substantially corresponds to the concave portion 3c of the lower die 3. A recess 4c is formed. The recess 4c is provided to keep the thickness of the thin thermal fuse constant. On both sides of the central portion of the concave portion 4c, a convex lead conductor fixing portion 4d inserted into a groove-shaped lead conductor arrangement portion 3d formed in the lower mold 3 is projected.

上型４に用いる樹脂としてはＵＶ（紫外線）や可視光線を透過する樹脂であれば良い。例えば、ＬＣＰ（液晶高分子），ＰＰ（ポリプロピレン），ＵＨＭＷＰＥ（超高分子量ポリエチレン），ＰＭＭＡ（ポリメタクリル酸メチル），ＰＢＴ（ポリブチレンテレフタレート），フッ素樹脂，ポリアセタール，ＡＢＳ樹脂，ＰＣ（ポリカーボネート），ｍ−ＰＰＥ（変性ポリフェニレンエーテル），ＰＡＲ（ポリアリレート），ＰＥＳ（ポリエーテルスルフォン），ＰＳＦ（ポリスルフォン），ＰＰＳ（ポリフェニレンサルファイド），ＰＡ（ポリアミド），ＰＩ（ポリイミド），ＰＡＩ（ポリアミドイミド），ＰＥＩ（ポリエーテルイミド），ＰＥＥＫ（ポリエーテルエーテルケトン）またはＧＦ−ＰＥＴ（強化ポリエチレンテレフタレート）等が用いられる。なお、上記に挙げた以外にも、透明もしくは紫外線透過するような樹脂の板材，シート，フィルム等で成形型４を作製しても良い。   The resin used for the upper mold 4 may be any resin that transmits UV (ultraviolet light) or visible light. For example, LCP (liquid crystal polymer), PP (polypropylene), UHMWPE (ultra high molecular weight polyethylene), PMMA (polymethyl methacrylate), PBT (polybutylene terephthalate), fluorine resin, polyacetal, ABS resin, PC (polycarbonate), m-PPE (modified polyphenylene ether), PAR (polyarylate), PES (polyethersulfone), PSF (polysulfone), PPS (polyphenylene sulfide), PA (polyamide), PI (polyimide), PAI (polyamideimide), PEI (polyetherimide), PEEK (polyetheretherketone), GF-PET (reinforced polyethylene terephthalate) or the like is used. In addition to the above, the mold 4 may be made of a resin plate, sheet, film, or the like that is transparent or transmits ultraviolet light.

下型３も上型４と同様の材質で形成することが好ましいが、必ずしもこれに限定されるものではない。   The lower mold 3 is preferably formed of the same material as that of the upper mold 4, but is not necessarily limited thereto.

図４は下型３の所定位置に、可溶合金１が溶着されたリード導体２を配置した状態を示す。可溶合金１は凹部３ｃ内にセットされ、リード導体２はリード導体配置部３ｄにセットされる。   FIG. 4 shows a state in which the lead conductor 2 to which the fusible alloy 1 is welded is disposed at a predetermined position of the lower die 3. The fusible alloy 1 is set in the recess 3c, and the lead conductor 2 is set in the lead conductor arrangement portion 3d.

下型３の下方には、離型用突き出しピン６を有する離型部材５が組み込まれる。この離型部材５は所定の肉厚を有する板状体からなり、上面５ａの所定の位置に突き出しピン６の基部が埋設され、上面５ａから上方に向って突出した突き出しピン６は下型３に形成された離型用突出ピン挿入孔３ｅ内に挿入される。   A release member 5 having a release protrusion pin 6 is incorporated below the lower die 3. The release member 5 is formed of a plate-like body having a predetermined thickness. The base of the protruding pin 6 is embedded at a predetermined position on the upper surface 5a, and the protruding pin 6 protruding upward from the upper surface 5a is the lower mold 3. Is inserted into the mold release projecting pin insertion hole 3e.

図５は、下型３の凹部３ｃの上方に配置されたノズル７から樹脂８を凹部３ｃ内に滴下する状態を示す。ノズル７は樹脂８が充填された容器（図示せず）に接続されている。この樹脂８は変性アクリレートまたはエポキシ樹脂を主成分としたＵＶ（紫外線）硬化型の樹脂（接着剤）であり、粘性を有し、かつＵＶが照射されると硬化する。   FIG. 5 shows a state where the resin 8 is dropped into the recess 3 c from the nozzle 7 disposed above the recess 3 c of the lower mold 3. The nozzle 7 is connected to a container (not shown) filled with the resin 8. This resin 8 is a UV (ultraviolet) curable resin (adhesive) mainly composed of a modified acrylate or an epoxy resin, has viscosity, and is cured when irradiated with UV.

この過程では、下型３と離型部材５との間には隙間９が形成され、突き出しピン６の先端はリード導体２の下面と当接または若干離間した位置にある。   In this process, a gap 9 is formed between the lower mold 3 and the release member 5, and the tip of the protruding pin 6 is in contact with or slightly separated from the lower surface of the lead conductor 2.

図６は下型３の凹部３ｃ内に樹脂８を充填した状態を示す。接着材８は可溶合金１をモールドする量滴下される。凹部３ｃ内に位置する各リード導体２の内端部も樹脂８によってモールドされる。   FIG. 6 shows a state where the resin 8 is filled in the recess 3 c of the lower mold 3. The adhesive 8 is dropped in an amount for molding the soluble alloy 1. The inner end portion of each lead conductor 2 located in the recess 3 c is also molded with the resin 8.

この樹脂８は、硬化後、ケース、封止材として機能する。   This resin 8 functions as a case and a sealing material after curing.

所定の量の樹脂８を滴下した後、図７に示すように、第１の成形型３の上部に上型４を対向配置し、図８に示すように、第１の成形型３に第２の成形型４を圧着し、型閉じを行う。   After dripping a predetermined amount of the resin 8, as shown in FIG. 7, the upper mold 4 is disposed opposite to the upper part of the first mold 3, and the first mold 3 is placed on the first mold 3 as shown in FIG. 2 mold 4 is crimped and the mold is closed.

ついで、図９に示すように、ＵＶを照射する光源１０を上型４上に配置し、例えば１０秒以上ＵＶを照射する。上型４はＵＶ１１を透過するため、樹脂８はＵＶ１１により硬化する。   Next, as shown in FIG. 9, a light source 10 for irradiating UV is arranged on the upper mold 4 and irradiated with UV for 10 seconds or more, for example. Since the upper mold 4 transmits UV11, the resin 8 is cured by UV11.

硬化後、図１０に示すように、上型４を上動させ型開きし、かつ、離型部材５を押し上げる。すると、図１１に示すように、それに伴い突き出しピン６も上動し、下型３の上面３ｂから突き出しピン６の先端部が突出する。このため、樹脂８によってモールドされた可溶合金１、リード導体２を下型３から押し上げられ、下型３から硬化した樹脂８からなるモールド体を分離させることができ、外部に取出すことができる。リードフレームに余長部分があればそれを切断して除去するなどすれば薄型温度ヒューズが完成する。   After the curing, as shown in FIG. 10, the upper mold 4 is moved upward to open the mold, and the release member 5 is pushed up. Then, as shown in FIG. 11, the protrusion pin 6 also moves upward, and the tip of the protrusion pin 6 protrudes from the upper surface 3 b of the lower mold 3. For this reason, the fusible alloy 1 and the lead conductor 2 molded by the resin 8 are pushed up from the lower mold 3, and the molded body made of the resin 8 cured from the lower mold 3 can be separated and taken out to the outside. . If the lead frame has an extra length, it can be cut and removed to complete the thin thermal fuse.

図１２は取出された薄型温度ヒューズ１２の側断面を示す。硬化した樹脂８がケースとしての役割を果す。また、この薄型温度ヒューズ１２は可溶合金１が樹脂８でモールドされているため、封止材による封止の必要はない。   FIG. 12 shows a side cross section of the thin thermal fuse 12 taken out. The cured resin 8 serves as a case. Further, since the fusible alloy 1 is molded with the resin 8, the thin thermal fuse 12 does not need to be sealed with a sealing material.

この薄型温度ヒューズ１２には、例えばリチウムイオン電池のような二次電池の過充電や過放電から、この二次電池を保護する用途に用いられる。   The thin thermal fuse 12 is used for the purpose of protecting the secondary battery from overcharge and overdischarge of the secondary battery such as a lithium ion battery.

樹脂８は薄型の長方体の形状に形成されるが、その形状は、下型３および上型４の凹部３ｃ、４ｃの深さや外形等を適宜変更することにより、必要に応じ簡単に所望の形状の薄型温度ヒューズとすることができる。   The resin 8 is formed in the shape of a thin rectangular parallelepiped, but the shape can be easily desired as needed by appropriately changing the depth, outer shape, and the like of the recesses 3c and 4c of the lower mold 3 and the upper mold 4. A thin thermal fuse of the shape can be obtained.

［実施の形態２］
図１３は本発明の第２実施例を示す。この実施例では、下型３、離型部材５も上型４と同様にＵＶ１１を透過する材質にて形成したことに特徴を有している。 [Embodiment 2]
FIG. 13 shows a second embodiment of the present invention. This embodiment is characterized in that the lower mold 3 and the release member 5 are formed of a material that transmits UV 11 as in the upper mold 4.

したがって、下方にも光源１０を配置し、上下方向からそれぞれＵＶ１１を照射し、速やかに樹脂８を硬化させることができる。この実施例によれば、硬化時間を短縮することができるため、製造時間を短縮することができる。   Therefore, the light source 10 can also be arrange | positioned below, UV11 can be irradiated from an up-down direction, respectively, and the resin 8 can be hardened rapidly. According to this embodiment, since the curing time can be shortened, the manufacturing time can be shortened.

他の構成、作用等は前述の第１実施例と同様である。   Other configurations and operations are the same as those of the first embodiment.

［実施の形態３］
図１４はリード導体の一変形例の側面図、図１５はこのリード導体に可溶合金を取付けた状態、図１６は樹脂でモールドした状態を示す。 [Embodiment 3]
FIG. 14 is a side view of a modification of the lead conductor, FIG. 15 shows a state in which a soluble alloy is attached to the lead conductor, and FIG. 16 shows a state in which the lead conductor is molded with resin.

前述の実施例では平板状のリード導体２を用いていたが、この例ではリード導体２Ａの内端部に補強用の第１の折曲部２ａを形成したことに特徴を有している。   Although the flat lead conductor 2 is used in the above-described embodiment, this embodiment is characterized in that the first bent portion 2a for reinforcement is formed at the inner end portion of the lead conductor 2A.

この第１の折曲部２ａは上方に向って、かつ巾方向（長さ方向に対し直交する方向）に向って凸状に折曲され、ほぼ逆Ｕ字状に形成されている。この折曲部２ａはプレス加工により容易に形成できる。   The first bent portion 2a is bent in a convex shape in the upward direction and in the width direction (a direction orthogonal to the length direction), and is formed in a substantially inverted U shape. The bent portion 2a can be easily formed by press working.

また、リード導体２Ａの内端のほぼ中央部には互いに離間して一対の棒状の立上げ部ａ、ａが形成されている。これらの立ち上げ部ａ、ａ間に可溶合金１の端部が位置決めされ挟持される。したがってリード導体２Ａへの可溶合金１の取り付け、両者の溶着作業等を容易、かつ迅速に行うことができる。   In addition, a pair of rod-like rising portions a and a are formed at a substantially central portion of the inner end of the lead conductor 2A so as to be separated from each other. The end portion of the fusible alloy 1 is positioned and sandwiched between the rising portions a and a. Therefore, the attachment of the fusible alloy 1 to the lead conductor 2A, the welding operation of the both can be performed easily and quickly.

この可溶合金１が溶着され、かつ第１の折曲部２ａが形成されたリード導体２Ａは前述の実施例と同様、下型３の所定位置にセットし、その後、上型４を圧着し、ＵＶを照射し、型から取り出すことにより図１６に示すように、樹脂８により可溶合金１等がモールドされた薄型温度ヒューズを作製できる。   The lead conductor 2A on which the fusible alloy 1 is welded and the first bent portion 2a is formed is set at a predetermined position of the lower die 3 and then the upper die 4 is pressure-bonded as in the above-described embodiment. The thin thermal fuse in which the soluble alloy 1 or the like is molded with the resin 8 as shown in FIG.

［実施の形態４］
図１７（ａ）、（ｂ）はリード導体の他の変形例を示す。 [Embodiment 4]
FIGS. 17A and 17B show another modification of the lead conductor.

この例では、リード導体２Ｂに、前述の第１の折曲部２ａの外側に離間して第２の折曲部２ｂをさらに形成したことに特徴を有している。また、リード導体２Ｂの内端には上方に向って折曲して立ち上げられた立ち上げ部ａ’が形成され、かつ中央部には溝状の切り欠きが形成され、この部分に可溶合金１の端部が位置される。   This example is characterized in that a second bent portion 2b is further formed on the lead conductor 2B so as to be spaced outside the first bent portion 2a. In addition, a rising portion a ′ that is bent upward and formed upward is formed at the inner end of the lead conductor 2B, and a groove-shaped notch is formed in the central portion. The end of alloy 1 is located.

したがって、この例ではより強度を向上させることができる。また、この第２の折曲部２ｂの外側部分を曲げ支点としてリード導体２Ｂを下方に折り曲げ、被実装部品に取り付けることができる。   Therefore, the strength can be further improved in this example. Further, the lead conductor 2B can be bent downward and attached to the mounted component with the outer portion of the second bent portion 2b as a bending fulcrum.

この第２の折曲部２ｂは樹脂８中にモールドされることはない。   The second bent portion 2 b is not molded into the resin 8.

［実施の形態５］
図１８はリード導体２Ｃの更に他の変形例を示す。 [Embodiment 5]
FIG. 18 shows still another modification of the lead conductor 2C.

この例では第１の折曲部２ａの外側立ち上げ部ｂの外壁の中央部にほぼ三角錐状の補強部２ｃを形成したことに特徴を有している。   This example is characterized in that a substantially triangular pyramidal reinforcing portion 2c is formed at the center of the outer wall of the outer raised portion b of the first bent portion 2a.

［実施の形態６］
図１８はリード導体２Ｄの更に他の変形例を示す。 [Embodiment 6]
FIG. 18 shows still another modification of the lead conductor 2D.

この例では第１の折曲部２ａの外側立ち上げ部ｂを外側に向って傾斜させ、かつ立ち上げ部ｂの外壁の中央部にほぼ三角錐状の補強部２ｃを形成したことに特徴を有する。   In this example, the outer raised portion b of the first bent portion 2a is inclined outward, and a substantially triangular pyramidal reinforcing portion 2c is formed at the center of the outer wall of the raised portion b. Have.

補強部２ｃは内側からの打ち起こしにより形成できる。あるいは別途用意した三角錐状の別部材を溶着しても良い。   The reinforcing part 2c can be formed by raising from the inside. Alternatively, a separate member having a triangular pyramid shape may be welded.

図１８、図１９に示した上記リード導体２Ｃ、２Ｄは、ほぼ三角錐状の補強部２ｃが設けられているため、巾方向の強度を向上させることができる。また、被実装部品への取り付けにあたり、この補強部２ｃの外端を曲げ支点としてリード導体２Ｃ、２Ｄを下方に容易に折り曲げることができる。   Since the lead conductors 2C and 2D shown in FIGS. 18 and 19 are provided with a substantially triangular pyramidal reinforcing portion 2c, the strength in the width direction can be improved. Further, when attaching to the mounted component, the lead conductors 2C and 2D can be easily bent downward using the outer end of the reinforcing portion 2c as a bending fulcrum.

以上、本発明の実施形態を説明してきたが、図示された本実施の形態に限られるものでなく、本発明の精神を逸脱しない範囲で種々の設計変更等も本発明に含まれることは勿論である。   Although the embodiments of the present invention have been described above, the present invention is not limited to the illustrated embodiments, and various design changes and the like are of course included in the present invention without departing from the spirit of the present invention. It is.

例えば、下型３から薄型温度ヒューズを取り出す場合、離型部材５を用いることなく、下型３を振動させたり、斜めに傾斜ないし反転させて取り出すようにしても良い。   For example, when a thin thermal fuse is taken out from the lower die 3, the lower die 3 may be vibrated or may be taken out obliquely or inverted without using the release member 5.

また、下型３の凹部３ｃを深くし、そのほぼ中央部に可溶合金１を配置できるように、モールド体内部のほぼ中央部に可溶合金１を位置させるようにすれば、上型４に凹部を形成しなくても良い。   Further, if the fusible alloy 1 is positioned at the substantially central portion inside the mold body so that the concave portion 3c of the lower die 3 is deepened and the fusible alloy 1 can be disposed at the substantially central portion thereof, the upper die 4 is provided. It is not necessary to form a recess on the surface.

さらに、上記実施理ではＵＶによって樹脂８を硬化させる例について説明したが、可視光線によって硬化する樹脂を用いても作用効果が実質的に変わることはなく均等の範囲である。この場合、可視光線を照射すれば良い。   Furthermore, in the above-described practical example, the example in which the resin 8 is cured by UV has been described. However, even if a resin that is cured by visible light is used, the effect is not substantially changed and is in an equivalent range. In this case, visible light may be irradiated.

なお、樹脂としては、例えばウレタンアクリレート樹脂を主成分とし、ベンゾインエーテル、ベンゾフェノンアミン類を光重合開始剤として配合した２０℃における粘度が２０，０００［ｍＰａ・ｓ］のものを用いると好適である。また、光源としては、例えば超高圧水銀ランプを用いれば良い。   As the resin, it is preferable to use a resin having a viscosity of 20,000 [mPa · s] at 20 ° C. containing, for example, a urethane acrylate resin as a main component and a benzoin ether or benzophenoneamine as a photopolymerization initiator. . For example, an ultrahigh pressure mercury lamp may be used as the light source.

本発明に用いられる可溶合金とリード導体の分解側面図。The disassembled side view of the soluble alloy and lead conductor which are used for this invention. （ａ）は本発明に用いられる可溶合金とリード導体の接合状態を示す側面図、（ｂ）は平面図である。(A) is a side view which shows the joining state of the fusible alloy used for this invention, and a lead conductor, (b) is a top view. （ａ）は本発明に用いられる下型の平面図とその右側の側面図、（ｂ）は本発明に用いられる上型の底面図とその右側の側面図、（ｃ）は下型と上型の斜視図を示す。(A) is a plan view of the lower mold used in the present invention and a side view of the right side thereof, (b) is a bottom view of the upper mold used in the present invention and a side view of the right side thereof, and (c) is a lower mold and an upper side thereof. A perspective view of a mold is shown. 本発明で用いられる下型に、可溶合金を有するリード導体をセットし、その下型の下方に離型部材を組み込んだ状態を示す側断面図である。It is a sectional side view which shows the state which set the lead conductor which has a soluble alloy to the lower mold | type used by this invention, and incorporated the mold release member under the lower mold | type. 本発明に用いられる樹脂を下型の凹部に滴下する状態を示す側断面図である。It is a sectional side view which shows the state which dripped the resin used for this invention to the recessed part of a lower mold | type. 所定量樹脂を下型滴下した状態の側断面図を示す。The side sectional view in the state where a predetermined amount of resin was dropped on the lower mold is shown. 本発明の下型の上方に上型を対向配置した側断面図を示す。A side sectional view in which an upper die is disposed opposite to the upper die of the present invention is shown. 本発明の下型に上型を被せた型閉じの状態を示す側断面図である。It is side sectional drawing which shows the state of the mold closing which covered the upper mold | type on the lower mold | type of this invention. 本発明の上型側からＵＶを照射し樹脂を硬化させる状態を示す側断面図を示す。The sectional side view which shows the state which irradiates UV from the upper mold | type side of this invention and hardens resin is shown. 樹脂硬化後、上型を上動させ下型から分離させ型開きした状態を示す。After the resin is cured, the upper mold is moved up to separate from the lower mold and the mold is opened. 下型から薄型温度ヒューズを取出した状態を示す。The thin thermal fuse is removed from the lower mold. 本発明の薄型温度ヒューズの側断面図を示す。1 shows a side cross-sectional view of a thin thermal fuse of the present invention. 上下方向からそれぞれＵＶ照射を行う本発明の第２実施例を示す。2nd Example of this invention which performs UV irradiation from an up-down direction, respectively is shown. 本発明に用いられるリード導体の一変形例の側面図を示す。The side view of the modification of the lead conductor used for this invention is shown. 本発明の一変形例のリード導体に可溶合金を取付けた状態の斜視図を示す。The perspective view of the state which attached the soluble alloy to the lead conductor of the modification of this invention is shown. 可溶合金が設けられた一変形例のリード導体を樹脂でモールドした状態の平面図を示す。The top view of the state which molded the lead conductor of the modification provided with the soluble alloy with resin is shown. （ａ）は本発明に用いられるリード導体の他の変形例の側面図、（ｂ）は斜視図を示す。(A) is a side view of the other modification of the lead conductor used for this invention, (b) shows a perspective view. （ａ）は本発明に用いられるリード導体の更に他の変形例の側面図、（ｂ）は本発明に用いられるリード導体の更に別の変形例の斜視図を示す。(A) is a side view of still another modified example of the lead conductor used in the present invention, and (b) is a perspective view of still another modified example of the lead conductor used in the present invention. 従来の薄型温度ヒューズを説明するための説明図であり、（ａ）が薄型温度ヒューズの平面図、（ｂ）が（ａ）のVIII−VIII線断面図である。It is explanatory drawing for demonstrating the conventional thin temperature fuse, (a) is a top view of a thin temperature fuse, (b) is the VIII-VIII sectional view taken on the line of (a).

符号の説明Explanation of symbols

１ 可溶合金
１ａ ロジン
２、２Ａ、２Ｂ、２Ｃ、２Ｄ リード導体
３ 下型
３ａ 本体
３ｂ 上面
３ｃ 凹部
３ｄ リード導体配置部
３ｅ 離型用突き出しピン挿入孔
４ 上型
４ａ 本体
４ｂ 底面
４ｃ 凹部
４ｄ リード導体固定部
５ 離型部材
５ａ 上面
６ 突き出しピン
８ 樹脂
９ 隙間
１０ 光源
１１ ＵＶ（紫外線）
１２、１２Ａ 薄型温度ヒューズ DESCRIPTION OF SYMBOLS 1 Soluble alloy 1a Rosin 2, 2A, 2B, 2C, 2D Lead conductor 3 Lower mold | type 3a Main body 3b Upper surface 3c Recessed part 3d Lead conductor arrangement | positioning part 3e Extrusion pin insertion hole for mold release 4 Upper mold | type 4a Main body 4b Bottom face 4c Recessed part 4d Lead Conductor fixing part 5 Release member 5a Upper surface 6 Extrusion pin 8 Resin 9 Gap 10 Light source 11 UV (ultraviolet light)
12, 12A thin thermal fuse

Claims (5)

中央部に可溶合金（１）が設けられたリード導体（２）の前記可溶合金（１）を、下型（３）の凹部（３ｃ）内に位置させ、前記リード導体（２）を前記凹部（３ｃ）の両側に形成された溝状のリード導体配置部（３ｄ）に位置させ、前記凹部（３ｃ）内にＵＶを照射すると硬化する樹脂（８）を所定量滴下後、前記下型（３）の上部にＵＶを透過する上型（４）を被せ型閉じし、前記下型（３）、上型（４）の少なくともいずれか一方はＵＶ透過性の材質からなり、型の外側からＵＶを照射することにより前記樹脂（８）を硬化させ前記可溶合金（１）および前記リード導体（２）の内端部をモールドすることを特徴とする薄型温度ヒューズの製造方法。   The fusible alloy (1) of the lead conductor (2) provided with the fusible alloy (1) at the center is positioned in the recess (3c) of the lower die (3), and the lead conductor (2) is The resin is placed on groove-shaped lead conductor placement portions (3d) formed on both sides of the recess (3c), and after dropping a predetermined amount of resin (8) that cures when irradiated with UV into the recess (3c), the lower An upper mold (4) that transmits UV is placed on the upper part of the mold (3), and the mold is closed. At least one of the lower mold (3) and the upper mold (4) is made of a material that transmits UV. A method of manufacturing a thin thermal fuse, wherein the resin (8) is cured by irradiating UV from the outside and the inner ends of the fusible alloy (1) and the lead conductor (2) are molded. 請求項１記載の薄型温度ヒューズの製造方法において、前記可溶合金（１）の外周部およびこの可溶合金（１）と前記リード導体（２）との各接合部周辺にロジン（１ａ）を塗布し、各接合部周辺は、前記可溶合金（１）端部の外側の長さ方向領域にわたって塗布するとともに、長さ方向とほぼ直交する外側の領域にわたって広範囲に塗布したことを特徴とする薄型温度ヒューズの製造方法。   2. The method of manufacturing a thin thermal fuse according to claim 1, wherein a rosin (1a) is provided around an outer peripheral portion of the fusible alloy (1) and each joint portion between the fusible alloy (1) and the lead conductor (2). It was applied, and each joint portion periphery was applied over a lengthwise region outside the end portion of the fusible alloy (1), and was applied over a wide range over an outer region substantially orthogonal to the lengthwise direction. Manufacturing method of thin thermal fuse. 中央部に樹脂（８）充填用の凹部（３ｃ）が形成され、この凹部（３ｃ）の両側に溝状のリード導体配置部（３ｄ）がそれぞれ形成された下型（３）と、この下型（３）の上部に配置され、その両側に前記溝状のリード導体配置部（３ｄ）内に挿入されリード導体（２）を押さえる凸状のリード導体固定部（４ｄ）が形成された上型（４）と、ＵＶを照射する光源（１０）とを備え、
前記下型（３）または前記上型（４）の少なくともいずれか一方をＵＶ透過性の材質にて形成したことを特徴とする薄型温度ヒューズの製造装置。 A lower mold (3) in which a recess (3c) for filling a resin (8) is formed at the center, and groove-shaped lead conductor placement portions (3d) are formed on both sides of the recess (3c), A convex lead conductor fixing portion (4d) which is disposed on the upper side of the mold (3) and is inserted into the groove-shaped lead conductor arrangement portion (3d) on both sides to hold the lead conductor (2). A mold (4) and a light source (10) for irradiating UV;
An apparatus for manufacturing a thin thermal fuse, wherein at least one of the lower mold (3) and the upper mold (4) is formed of a UV transparent material. 請求項３記載の薄型温度ヒューズ製造装置において、前記下型（３）の前記各リード導体配置部（３ｄ）に離型用突き出しピン挿入孔（３ｅ）がそれぞれ形成され、前記下型（３）の下側に、上部に前記突き出しピン挿入孔（３ｅ）内に挿通され、上端が前記離型用突き出しピン挿入孔（３ｅ）から突出可能な突き出しピン（６）が突設された離型部材（５）が上下動自在に配置されることを特徴とする薄型温度ヒューズの製造装置。   4. The thin thermal fuse manufacturing apparatus according to claim 3, wherein a release pin insertion hole (3e) is formed in each lead conductor arrangement portion (3d) of the lower mold (3), and the lower mold (3). A release member having a protrusion pin (6) projecting from the protrusion pin insertion hole (3e) at the upper end and projecting from the protrusion protrusion pin insertion hole (3e) for release at the upper side. (5) A thin thermal fuse manufacturing apparatus, wherein the apparatus is arranged to be movable up and down. 請求項１記載の薄型温度ヒューズ製造方法によって作製されたことを特徴とする薄型温度ヒューズ。   A thin thermal fuse produced by the thin thermal fuse manufacturing method according to claim 1.
JP2005043632A 2005-02-21 2005-02-21 Thin thermal fuse manufacturing method, thin thermal fuse manufacturing apparatus, and thin thermal fuse Expired - Fee Related JP4508902B2 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5958734A (en) * 1982-09-27 1984-04-04 松下電器産業株式会社 Chip type fuse and method of producing same
JPH04251723A (en) * 1991-01-29 1992-09-08 Nippondenso Co Ltd Resin molding device
JPH09171751A (en) * 1995-12-20 1997-06-30 Takuo Nakajima Thermal fuse and its manufacture
JP2003036775A (en) * 2001-07-24 2003-02-07 Nec Schott Components Corp Thin temperature fuse

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5958734A (en) * 1982-09-27 1984-04-04 松下電器産業株式会社 Chip type fuse and method of producing same
JPH04251723A (en) * 1991-01-29 1992-09-08 Nippondenso Co Ltd Resin molding device
JPH09171751A (en) * 1995-12-20 1997-06-30 Takuo Nakajima Thermal fuse and its manufacture
JP2003036775A (en) * 2001-07-24 2003-02-07 Nec Schott Components Corp Thin temperature fuse

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