JP2006205373A - Resin molded product, resin mold motor using it and manufacturing method of them - Google Patents

Resin molded product, resin mold motor using it and manufacturing method of them Download PDF

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JP2006205373A
JP2006205373A JP2005016651A JP2005016651A JP2006205373A JP 2006205373 A JP2006205373 A JP 2006205373A JP 2005016651 A JP2005016651 A JP 2005016651A JP 2005016651 A JP2005016651 A JP 2005016651A JP 2006205373 A JP2006205373 A JP 2006205373A
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resin
filler
layer
thermal conductivity
mold
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Yuji Noda
勇次 野田
Kenjo Akiyoshi
建丞 秋吉
Takenori Harada
武徳 原田
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Yaskawa Electric Corp
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Yaskawa Electric Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin molded product which reduces the temperature rise of the resin mold motor, and the resin mold motor sealed by the resin molded product. <P>SOLUTION: After a mold 4 is internally filled with fillers 1a and 1b successively, a resin material is injected in the mold 4. The filler 1a is a high heat conductive ceramic such as Al<SB>2</SB>O<SB>3</SB>or the like and the filler 1b is a low heat conductive ceramic such as ZrO<SB>2</SB>or the like. Moreover, the filler 1 can be laminated within the mold 4 by properly vibrating the mold 4 by an ultrasonic wave or another mechanical technique at the time of filling with the filler 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、樹脂成形体およびモールドモータなど樹脂成形体の応用製品に関するものである。   The present invention relates to an application product of a resin molded body such as a resin molded body and a molded motor.

従来のモールドモータの一例として、図６に示すようなものがある。図６において、５はモールド体、６はシャフト、７は永久磁石、８は負荷側ブラケット、９は反負荷側ブラケット、１０は軸受、１１は回転検出器、１２は検出器カバーである。
モールド体５は、固定子鉄心５１と固定子巻線５２を絶縁性のモールド樹脂５３でモールドされている。回転検出器１１はシャフト６の反負荷側軸端部に取り付けられている。
このようなモールドモータでは固定子が樹脂でモールドされているため、固定子巻線で発生した熱が放出されにくくなり、モータの温度上昇が大きいという問題があった。また、回転検出器は熱に弱く、モータ使用時の固定子の発生熱が回転検出器に伝わらないようにすることが要求されている。
この熱対策として断熱材をモールド体と反負荷側ブラケットの間に挟む方法があるが、この場合、工程が増え、生産性が低下するという問題がある。
これら問題を解決する方法として、１種類以上の充填材を含んだ複合樹脂材料を用い、樹脂注形時に樹脂材料と充填材の比重差により充填材を樹脂材料内で浮上、もしくは沈降させて加熱硬化することにより、熱伝導率が互いに異なる２層以上の層を有する硬化物を得る方法がある（例えば、特許文献１）。
特開平０９−１５７４４０公報（第４項、第１図） An example of a conventional mold motor is shown in FIG. In FIG. 6, 5 is a mold body, 6 is a shaft, 7 is a permanent magnet, 8 is a load side bracket, 9 is an anti-load side bracket, 10 is a bearing, 11 is a rotation detector, and 12 is a detector cover.
In the mold body 5, the stator core 51 and the stator winding 52 are molded with an insulating mold resin 53. The rotation detector 11 is attached to the shaft end portion on the opposite side of the shaft 6.
In such a molded motor, since the stator is molded with resin, the heat generated in the stator winding is difficult to be released, and the temperature rise of the motor is large. Further, the rotation detector is vulnerable to heat, and it is required that heat generated by the stator when the motor is used not be transmitted to the rotation detector.
As a countermeasure against this heat, there is a method of sandwiching the heat insulating material between the mold body and the anti-load side bracket. However, in this case, there is a problem that the number of processes is increased and productivity is lowered.
As a method for solving these problems, a composite resin material containing one or more fillers is used, and the resin is heated by allowing the filler to float or settle in the resin material due to the specific gravity difference between the resin material and the filler during resin casting. There is a method of obtaining a cured product having two or more layers having different thermal conductivities by curing (for example, Patent Document 1).
Japanese Patent Laid-Open No. 09-157440 (4th item, FIG. 1)

しかし、特許文献１による樹脂成形体では、充填材の充填量を増やした場合、複合樹脂材料の粘度が上がり、充填材の浮上、沈降が抑制されるので、所望の構成を得ることができない、もしくは所望の構成を得るのに時間を要し、生産性が低下する。そのため、充填材の充填量には上限があり、この方法によって得られる樹脂成形体の熱伝導率は１Ｗ／ｍ・Ｋ程度と低いため、固定子によるモータの温度上昇の問題を改善することはできない。
本発明はこのような問題点に鑑みてなされたものであり、生産性を低下させることなく低熱伝導率層と高熱伝導率層を同時に得て、モータの温度上昇を低減するとともに、温度上昇を避けるべき部分への伝熱を抑えることができる樹脂成形体およびその樹脂成形体により封止された樹脂モールドモータを提供することを目的とする。 However, in the resin molded body according to Patent Document 1, when the filling amount of the filler is increased, the viscosity of the composite resin material is increased, and the floating and settling of the filler are suppressed, so that a desired configuration cannot be obtained. Alternatively, it takes time to obtain a desired configuration, and productivity is lowered. Therefore, there is an upper limit to the filling amount of the filler, and since the thermal conductivity of the resin molded body obtained by this method is as low as about 1 W / m · K, it is possible to improve the problem of motor temperature rise due to the stator. Can not.
The present invention has been made in view of such problems, and it is possible to obtain a low thermal conductivity layer and a high thermal conductivity layer at the same time without reducing the productivity, thereby reducing the temperature rise of the motor and increasing the temperature. An object of the present invention is to provide a resin molded body capable of suppressing heat transfer to a portion to be avoided and a resin molded motor sealed with the resin molded body.

上記問題を解決するため、本発明は、次のように構成したものである。
請求項１に記載の発明は、充填材と、樹脂材料とを混合してなる樹脂成形体において、 前記充填材と前記樹脂材料とが混合された混合物層と、前記樹脂材料のみの樹脂層とからなるものである。
請求項２に記載の発明は、充填材と、樹脂材料とを混合してなる樹脂成形体において、前記充填材と前記樹脂材料とが混合された混合物層が少なくとも二層からなり、前記混合物層は、前記充填材の粒度分布、充填率および材質の少なくとも一つが異なるようにしたものである。
請求項３に記載の発明は、前記混合物の層を二層とし、第一層が高熱伝導率層、第二層が低熱伝導率層としたものである。
請求項４に記載の発明は、前記高熱伝導率層の熱伝導率が５Ｗ／ｍ・Ｋ以上であり、前記低熱伝導率層の熱伝導率が１Ｗ／ｍ・Ｋ以下としたものである。
請求項５に記載の発明は、前記第一層の充填材をＡｌ２Ｏ３またはＡｌＮとし、前記第二層の充填材をＺｒＯ２またはＳｉＯ２の粒子としたものである。
請求項６に記載の発明は、前記樹脂材料をエポキシ系樹脂としたものである。
請求項７に記載の発明は、充填材と樹脂材料とを混合して樹脂成形体を製造する方法において、前記充填材を型内に少なくとも一層の状態にして装入する第１工程と、前記樹脂材料を前記型内に注入する第２工程と、前記注入した樹脂材料を前記充填材の間に浸透させて成形する第３工程とからなるものである。
請求項８に記載の発明は、前記第１工程が、前記金型に振動を与える工程を含むものである。
請求項９に記載の発明は、固定子鉄心と固定子巻線とこれらを絶縁性のモールド樹脂で成形したフレームとからなるモールド体と、前記フレームの両端部に設けた負荷側および反負荷側のブラケットと、前記両ブラケットに軸受を介して支持された回転子と、前記反負荷側のブラケットに設けた回転検出器とからなる樹脂モールドモータにおいて、前記モールド樹脂は、少なくとも二層からなり、前記負荷側に高熱伝導率層が、前記反負荷側に低熱伝導率層がそれぞれ形成されたものである。
請求項１０に記載の発明は、前記高熱伝導率層の熱伝導率が５Ｗ／ｍ・Ｋ以上であり、前記低熱伝導率層の熱伝導率が１Ｗ／ｍ・Ｋ以下としたものである。
請求項１１に記載の発明は、前記高熱伝導率層がＡｌ２Ｏ３またはＡｌＮの充填材を含んだ樹脂成形体とし、前記低熱伝導率層がＺｒＯ２またはＳｉＯ２の充填材を含んだ樹脂成形体としたものである。 In order to solve the above problems, the present invention is configured as follows.
The invention according to claim 1 is a resin molded body obtained by mixing a filler and a resin material, a mixture layer in which the filler and the resin material are mixed, and a resin layer only of the resin material; It consists of
According to a second aspect of the present invention, in the resin molded body obtained by mixing a filler and a resin material, the mixture layer in which the filler and the resin material are mixed includes at least two layers, and the mixture layer Is such that at least one of the particle size distribution, filling rate and material of the filler is different.
According to a third aspect of the present invention, there are two layers of the mixture, the first layer being a high thermal conductivity layer and the second layer being a low thermal conductivity layer.
According to a fourth aspect of the present invention, the high thermal conductivity layer has a thermal conductivity of 5 W / m · K or more, and the low thermal conductivity layer has a thermal conductivity of 1 W / m · K or less.
According to a fifth aspect of the present invention, the filler of the first layer is Al 2 O 3 or AlN, and the filler of the second layer is ZrO 2 or SiO 2 particles.
According to a sixth aspect of the present invention, the resin material is an epoxy resin.
The invention according to claim 7 is a method of manufacturing a resin molded body by mixing a filler and a resin material, the first step of charging the filler in a mold in at least one layer, It consists of a second step of injecting a resin material into the mold and a third step of infiltrating the injected resin material between the fillers and molding.
According to an eighth aspect of the present invention, the first step includes a step of applying vibration to the mold.
The invention according to claim 9 is a mold body comprising a stator core, a stator winding, and a frame obtained by molding these with an insulating mold resin, and a load side and an anti-load side provided at both ends of the frame. In the resin molded motor comprising the bracket, the rotor supported by the both brackets via bearings, and the rotation detector provided on the anti-load side bracket, the mold resin is composed of at least two layers, A high thermal conductivity layer is formed on the load side, and a low thermal conductivity layer is formed on the anti-load side.
In a tenth aspect of the present invention, the high thermal conductivity layer has a thermal conductivity of 5 W / m · K or more, and the low thermal conductivity layer has a thermal conductivity of 1 W / m · K or less.
The invention according to claim 11 is the resin in which the high thermal conductivity layer includes a filler of Al 2 O 3 or AlN and the low thermal conductivity layer includes a filler of ZrO 2 or SiO 2 . It is a molded body.

請求項１から７に記載の発明によると、高熱伝導性充填材を高密度に充填できるので、従来の注形樹脂やプリミックス成形材料を用いる方法に比べて、放熱効果を大きくすることができる。また、樹脂成形体が特性の異なる複数の層から構成されるため、例えば、断熱層を得たい場合などにおいて、工程を増やしたり、別部材を取り付けたりすることが不要になり、部品点数の削減および、生産性の向上が達成できる。
請求項８に記載の発明によると、成型金型に振動を加えることにより、充填材を、金型内部に凹凸なく敷き均すことができ、複数種類の充填材を金型内部に積層することができる。
請求項９から１１に記載の発明によると、モールド部が熱伝導率の異なる２層から構成されるため、固定子の発生熱が低熱伝導率層と接する反負荷側ブラケットから外部へ放出されにくくなるので、反負荷側ブラケットに取り付けられた回転検出器の温度上昇を抑えることができ、かつ、高熱伝導性充填材を高密度に充填しているため、従来のモールドモータに比べ放熱効果が大きく、モータの温度上昇を抑えることができ、モータの効率、性能をよくすることができる。 According to the invention described in claims 1 to 7, since the high thermal conductive filler can be filled with high density, the heat radiation effect can be increased as compared with the conventional method using casting resin or premix molding material. . In addition, since the resin molded body is composed of multiple layers with different characteristics, for example, when it is desired to obtain a heat insulation layer, it is not necessary to increase the number of processes or attach separate members, reducing the number of parts. And productivity can be improved.
According to the invention described in claim 8, by applying vibration to the molding die, the filler can be spread and leveled inside the die without unevenness, and a plurality of types of fillers are laminated inside the die. Can do.
According to the invention described in claims 9 to 11, since the mold part is composed of two layers having different thermal conductivities, the generated heat of the stator is hardly released to the outside from the anti-load side bracket in contact with the low thermal conductivity layer. Therefore, the temperature rise of the rotation detector attached to the anti-load side bracket can be suppressed, and the high heat conductive filler is filled with high density, so the heat dissipation effect is greater than that of conventional mold motors. The temperature rise of the motor can be suppressed, and the efficiency and performance of the motor can be improved.

以下、本発明の実施の形態について図を参照して説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は、本発明の第１の実施例を示す樹脂成形体の成形時の状態を模式的に示す断面図である。
図において、１は充填材、２は樹脂、３は混合物層、４は金型である。充填材１は材質の異なる１ａ、１ｂからなり、混合物層３１，３２を形成している。なお、金型４は上金型４ａと下金型４ｂからなる。
充填材１ａは低熱伝導率で嵩比重の大きいＺｒＯ２（嵩比重２．０〜４．５ｇ／ｃｃ、平均粒径１０〜５００μｍ）を、充填材１ｂは高熱伝導率で嵩比重の小さいＡｌ２Ｏ３（嵩比重１.２〜３.０ｇ／ｃｃ、平均粒径１０〜５００μｍ）を用いた。熱伝導率の相違を得る方法としては、充填材自体の物性以外に、充填密度の相違、中空と中実など充填材の形状的構成の相違などもある。
樹脂２は、機械強度が強く、電気絶縁性がよいエポキシ樹脂を用いた。
本実施例の２層構造体を有するモールド体は、まず、金型４に充填材１ａ、充填材１ｂの順で充填し、内部を満たす。つぎに樹脂２を注入する。そうすると、樹脂２が充填材の中に浸透してゆき、モールド材を作製できる。なお、充填材１ａ、充填材１ｂを充填時に、下金型４に超音波やその他機械的手法などにより適度に振動を与えることにより、充填材１ａ、充填材１ｂを図のように金型内部に積層することができる。
このとき、金型内部を占める充填材の充填量は、充填材の嵩比重と真比重の比から得ることができ、例えば、嵩比重３.０ｇ／ｃｃ、真比重３.９８ｇ／ｃｃのＡｌ２Ｏ３充填材の場合、体積分率にして約７５ｖｏｌ％の充填が可能となる。この充填率は、従来の充填材を単に混合したモールド樹脂の約５０ｖｏｌ％に比べ大きくとれるので、充填材の物性をより発揮でき、Ａｌ２Ｏ３充填材の場合では、充填率が５０ｖｏｌ％のとき熱伝導率は１Ｗ／ｍ・Ｋ程度だったのに対し、充填率が７０ｖｏｌ％以上になると熱伝導率は５Ｗ／ｍ・Ｋ以上になる。
また、樹脂材料注形時に金型を真空雰囲気に置いて行うことにより、モールド体内部の気泡を取り去ることができる。 FIG. 1 is a cross-sectional view schematically showing a state during molding of a resin molded body according to the first embodiment of the present invention.
In the figure, 1 is a filler, 2 is a resin, 3 is a mixture layer, and 4 is a mold. The filler 1 is made of different materials 1a and 1b, and forms mixture layers 31 and 32. The mold 4 includes an upper mold 4a and a lower mold 4b.
Filler 1a is ZrO 2 (bulk specific gravity 2.0-4.5 g / cc, average particle size 10-500 μm) having low thermal conductivity and large bulk specific gravity, and filler 1b is Al 2 having high thermal conductivity and small bulk specific gravity. O 3 (bulk specific gravity 1.2 to 3.0 g / cc, average particle size 10 to 500 μm) was used. In addition to the physical properties of the filler itself, the method for obtaining the difference in thermal conductivity includes a difference in packing density and a difference in shape and configuration of the filler such as hollow and solid.
As the resin 2, an epoxy resin having high mechanical strength and good electrical insulation was used.
In the mold body having the two-layer structure of the present embodiment, first, the mold 4 is filled in the order of the filler 1a and the filler 1b to fill the inside. Next, the resin 2 is injected. If it does so, resin 2 will osmose | permeate in a filler, and a mold material can be produced. When the filler 1a and the filler 1b are filled, the filler 1a and the filler 1b are placed inside the mold as shown in the figure by appropriately applying vibration to the lower mold 4 by ultrasonic waves or other mechanical methods. Can be laminated.
At this time, the filling amount of the filler occupying the inside of the mold can be obtained from the ratio of the bulk specific gravity and the true specific gravity of the filler, for example, Al having a bulk specific gravity of 3.0 g / cc and a true specific gravity of 3.98 g / cc. In the case of 2 O 3 filler, filling of about 75 vol% is possible in terms of volume fraction. This filling rate can be larger than about 50 vol% of the mold resin in which the conventional filler is simply mixed, so that the physical properties of the filler can be exhibited more. In the case of the Al 2 O 3 filler, the filling rate is 50 vol%. In some cases, the thermal conductivity was about 1 W / m · K, whereas when the filling rate was 70 vol% or more, the thermal conductivity was 5 W / m · K or more.
Further, by placing the mold in a vacuum atmosphere at the time of casting the resin material, bubbles inside the mold body can be removed.

本実施例に従えば、従来の注形樹脂やプリミックス成形材料を用いる方法に比べて、高熱伝導性充填材を高密度に充填できる製造方法であるため、従来技術に比べて放熱効果が大きい。また、特性の異なる複数種の充填材を金型内部に層状に充填した後、樹脂材料を注形することにより、例えば、断熱層を得たい場合などにおいて、工程を増やしたり、別部材を取り付けたりすることが不要になり、部品点数の削減および、生産性の向上が達成できる。
なお、本実施例では、モールド体内部で熱伝導率差を有する２層を例として挙げたが、これは、熱伝導率に限定するものではなく、他の例として、比重差、熱膨張率差、機械的強度差などを用いてもよい。
例えば、図１のように隙間なく充填材を充填する必要はなく、図２のように、樹脂材料のみで構成される層と充填材樹脂複合層間で所望の物性差を得ることもできる。さらに、図３に示すように、充填材の粒度を変えて充填量を調節することもできる。
また、充填材としてＺｒＯ２とＡｌ２Ｏ３を用いたが、ＡｌＮ、ＢＮ、ＭｇＯ、ＳｉＯ２などのセラミックス、マイカ、ガラス繊維、など種々の無機材料、および有機材料の粉末、微粒子または繊維を用いてもよく、樹脂材料としてエポキシ樹脂の他にアクリル樹脂、ポリエチレン樹脂、ポリアミド樹脂などの熱可塑性樹脂やエポキシ樹脂、不飽和ポリエステル樹脂、フェノール樹脂などの熱硬化性樹脂を用いてもよい。 According to the present embodiment, compared with the conventional method using casting resin or premix molding material, it is a manufacturing method that can be filled with a high thermal conductive filler at a high density, so the heat dissipation effect is greater than the conventional technology. . Also, after filling the mold with multiple types of fillers with different characteristics and then casting the resin material, for example, when you want to obtain a heat insulation layer, increase the number of processes or attach another member Reducing the number of parts and improving productivity.
In this example, two layers having a difference in thermal conductivity inside the mold body were taken as an example, but this is not limited to the thermal conductivity, and other examples include specific gravity difference, thermal expansion coefficient. Differences, mechanical strength differences, and the like may be used.
For example, it is not necessary to fill the filler without a gap as shown in FIG. 1, and a desired physical property difference can be obtained between a layer composed only of a resin material and a filler resin composite layer as shown in FIG. Furthermore, as shown in FIG. 3, the filling amount can be adjusted by changing the particle size of the filler.
Moreover, although ZrO 2 and Al 2 O 3 were used as fillers, various inorganic materials such as ceramics such as AlN, BN, MgO, and SiO 2 , mica and glass fibers, and powders, fine particles, or fibers of organic materials were used. In addition to the epoxy resin, a thermoplastic resin such as an acrylic resin, a polyethylene resin, or a polyamide resin, or a thermosetting resin such as an epoxy resin, an unsaturated polyester resin, or a phenol resin may be used as the resin material.

図４は本発明の第２の実施例を示す樹脂モールドモータのモールド成形時の状態を模式的に示す断面図である。図において、５はモールド体、５３はモールド樹脂である。モールド樹脂５３は、モールド樹脂（低熱伝導層）５３１およびモールド樹脂（高熱伝導層）５３２からなる。
モールド成形時に使用する金型は、従来技術のものと同一構造のものであるが、本実施例では、充填材を下金型４ｂに充填した後、上金型４ａを取り付け、樹脂材料を注形する。なお、モールド体の材料構成および成形方法は、実施例１で挙げた方法と同じであるので、説明を省略する。 FIG. 4 is a cross-sectional view schematically showing a state during molding of the resin mold motor according to the second embodiment of the present invention. In the figure, 5 is a mold body and 53 is a mold resin. The mold resin 53 includes a mold resin (low thermal conductive layer) 531 and a mold resin (high thermal conductive layer) 532.
The mold used at the time of molding has the same structure as that of the prior art. In this embodiment, after filling the lower mold 4b with the filler, the upper mold 4a is attached, and the resin material is injected. Shape. In addition, since the material structure of a mold body and the shaping | molding method are the same as the method quoted in Example 1, description is abbreviate | omitted.

図５は、本実施例の樹脂モールドモータを模式的に示した断面図であり、前述の図４のようにして作製したモールド体５を用いてモータを組立てたものである。図中の符号は、従来例を示す図６および前述の図４と同じであるため、説明を省略する。
モールド体５は、反負荷側の端部が低熱伝導率のモールド樹脂（低熱伝導層）５３１で形成されており、その他の部位は高熱伝導率のモールド樹脂（高熱伝導層）５３２で形成されている。モータ使用時に固定子巻線５２で発生する熱はモールド体５および負荷側ブラケット８を介してモータ外部へ放出される。このとき、モールド体５の低熱伝導率層５０３により、固定子巻線５２で発生した熱は反負荷側には伝わりにくく、そのため、反負荷側ブラケット９に取り付けられた回転検出器１１の温度上昇を抑えることができる。
なお、モータの温度上昇を抑える方法として空冷ファンなどの冷却装置を使用した場合の冷却効果も従来のモールドモータに比べ高まるのは言うまでもない。 FIG. 5 is a cross-sectional view schematically showing the resin mold motor of the present embodiment, in which the motor is assembled using the mold body 5 produced as shown in FIG. The reference numerals in the figure are the same as those in FIG. 6 showing the conventional example and FIG.
The mold body 5 is formed of a mold resin (low thermal conductive layer) 531 having a low thermal conductivity at the end on the side opposite to the load, and the other part is formed of a mold resin (high thermal conductive layer) 532 having a high thermal conductivity. Yes. Heat generated in the stator winding 52 when the motor is used is released to the outside of the motor through the mold body 5 and the load side bracket 8. At this time, due to the low thermal conductivity layer 503 of the molded body 5, the heat generated in the stator winding 52 is not easily transmitted to the anti-load side, and therefore, the temperature rise of the rotation detector 11 attached to the anti-load side bracket 9. Can be suppressed.
Needless to say, the cooling effect when a cooling device such as an air cooling fan is used as a method of suppressing the temperature rise of the motor is higher than that of a conventional molded motor.

本実施例に従えば、モールド部が熱伝導率の異なる２層から構成されるため、固定子の発生熱が低熱伝導率層と接する反負荷側ブラケットから外部へ放出されにくくなるので、反負荷側ブラケットに取り付けられた回転検出器の発熱を抑えることができる。また、高熱伝導性充填材を高密度に充填しているため、従来のモールドモータに比べ放熱効果が大きく、モータの温度上昇を抑えることができ、モータの効率、性能をよくすることができる。   According to this embodiment, since the mold part is composed of two layers having different thermal conductivities, the generated heat of the stator is hardly released to the outside from the anti-load side bracket in contact with the low thermal conductivity layer. Heat generation of the rotation detector attached to the side bracket can be suppressed. In addition, since the high thermal conductive filler is filled at a high density, the heat dissipation effect is greater than that of a conventional molded motor, the temperature rise of the motor can be suppressed, and the efficiency and performance of the motor can be improved.

高熱伝導率層と低熱伝導率層の組み合わせにより、不必要な部分の発熱を抑え、かつ効率よく外部へ放熱させることができるので、コイルや半導体デバイスを封止するモールド樹脂に適用できる。   The combination of the high thermal conductivity layer and the low thermal conductivity layer can suppress unnecessary heat generation and can efficiently dissipate the heat to the outside, so that it can be applied to a mold resin for sealing a coil or a semiconductor device.

本発明の第１実施例を示す樹脂成形体の成型時の断面図Sectional drawing at the time of shaping | molding of the resin molding which shows 1st Example of this invention 第１実施例の変形例を示す断面図Sectional drawing which shows the modification of 1st Example 第１実施例の他の変形例を示す断面図Sectional drawing which shows the other modification of 1st Example 本発明の第２実施例を示すモールド体の成型状態の断面図Sectional drawing of the molding state of the mold body which shows 2nd Example of this invention 図４のモールド体を樹脂モールドモータに組込んだ状態を示す断面図Sectional drawing which shows the state which assembled the mold body of FIG. 4 to the resin mold motor 従来の樹脂モールドモータを示す断面図Sectional view showing a conventional resin mold motor

符号の説明Explanation of symbols

１、１ａ、１ｂ 充填材
２ 樹脂
３、３１、３２ 混合物層
４ 金型
５ モールド体
５１ 固定子鉄心
５２ 固定子巻線
５３ モールド樹脂
５３１ モールド樹脂（低熱伝導層）
５３２ モールド樹脂（高熱伝導層）
６ シャフト
７ 永久磁石
８ 負荷側ブラケット
９ 反負荷側ブラケット
１０ 軸受
１１ 回転検出器
１２ 検出器カバー 1, 1a, 1b Filler 2 Resin 3, 31, 32 Mixture layer 4 Mold 5 Mold body 51 Stator core 52 Stator winding 53 Mold resin 531 Mold resin (low heat conduction layer)
532 Mold resin (High thermal conductivity layer)
6 Shaft 7 Permanent magnet 8 Load side bracket 9 Anti-load side bracket 10 Bearing 11 Rotation detector 12 Detector cover

Claims (11)

充填材と、樹脂材料とを混合してなる樹脂成形体において、
前記充填材と前記樹脂材料とが混合された混合物層と、前記樹脂材料のみの樹脂層とからなることを特徴とする樹脂成形体。 In a resin molded body obtained by mixing a filler and a resin material,
A resin molded body comprising a mixture layer in which the filler and the resin material are mixed, and a resin layer made only of the resin material. 充填材と、樹脂材料とを混合してなる樹脂成形体において、
前記充填材と前記樹脂材料とが混合された混合物層が少なくとも二層からなり、前記混合物層は、前記充填材の粒度分布、充填率および材質の少なくとも一つが異なることを特徴とする樹脂成形体。 In a resin molded body obtained by mixing a filler and a resin material,
A resin molded body characterized in that the mixture layer in which the filler and the resin material are mixed includes at least two layers, and the mixture layer is different in at least one of a particle size distribution, a filling rate, and a material of the filler. . 前記混合物の層が二層からなり、第一層が高熱伝導率層であり、第二層が低熱伝導率層であることを特徴とする請求項２記載の樹脂成形体。 3. The resin molded body according to claim 2, wherein the layer of the mixture comprises two layers, the first layer is a high thermal conductivity layer, and the second layer is a low thermal conductivity layer. 前記高熱伝導率層の熱伝導率が５Ｗ／ｍ・Ｋ以上であり、前記低熱伝導率層の熱伝導率が１Ｗ／ｍ・Ｋ以下であることを特徴とする請求項３記載の樹脂成形体。   The resin molded product according to claim 3, wherein the high thermal conductivity layer has a thermal conductivity of 5 W / m · K or more, and the low thermal conductivity layer has a thermal conductivity of 1 W / m · K or less. . 前記第一層の充填材がＡｌ２Ｏ３またはＡｌＮであり、前記第二層の充填材がＺｒＯ２またはＳｉＯ２の粒子であることを特徴とする請求項３または４記載の樹脂成形体。 The resin molding according to claim 3 or 4, wherein the filler of the first layer is Al 2 O 3 or AlN, and the filler of the second layer is ZrO 2 or SiO 2 particles. 前記樹脂材料がエポキシ系樹脂であることを特徴とする請求項１から５のいずれか１項に記載の樹脂成形体。   The resin molded body according to claim 1, wherein the resin material is an epoxy resin. 充填材と樹脂材料とを混合して樹脂成形体を製造する方法において、
前記充填材を型内に少なくとも一層の状態にして装入する第１工程と、前記樹脂材料を前記型内に注入する第２工程と、前記注入した樹脂材料を前記充填材の間に浸透させて成形する第３工程とからなることを特徴とする樹脂成形体の製造方法。 In a method for producing a resin molded body by mixing a filler and a resin material,
A first step of charging the filler in at least one layer in the mold; a second step of injecting the resin material into the mold; and injecting the injected resin material between the fillers. And a third step of molding the resin molded product. 前記第１工程は、前記金型に振動を与える工程を含むことを特徴とする請求項７記載の樹脂成形体の製造方法。   The method for producing a resin molded body according to claim 7, wherein the first step includes a step of applying vibration to the mold. 固定子鉄心と固定子巻線とこれらを絶縁性のモールド樹脂で成形したフレームとからなるモールド体と、前記フレームの両端部に設けた負荷側および反負荷側のブラケットと、前記両ブラケットに軸受を介して支持された回転子と、前記反負荷側のブラケットに設けた回転検出器とからなる樹脂モールドモータにおいて、
前記モールド樹脂は、少なくとも二層からなり、前記負荷側に高熱伝導率層が、前記反負荷側に低熱伝導率層がそれぞれ形成されていることを特徴とする樹脂モールドモータ。 A molded body composed of a stator core, a stator winding, and a frame formed by molding them with an insulating mold resin, load-side and anti-load-side brackets provided at both ends of the frame, and bearings on both brackets In a resin mold motor comprising a rotor supported through a rotation detector provided on the anti-load side bracket,
The resin mold motor is characterized in that the mold resin includes at least two layers, and a high thermal conductivity layer is formed on the load side and a low thermal conductivity layer is formed on the anti-load side. 前記高熱伝導率層の熱伝導率が５Ｗ／ｍ・Ｋ以上であり、前記低熱伝導率層の熱伝導率が１Ｗ／ｍ・Ｋ以下であることを特徴とする請求項９記載の樹脂モールドモータ。   10. The resin molded motor according to claim 9, wherein the high thermal conductivity layer has a thermal conductivity of 5 W / m · K or more, and the low thermal conductivity layer has a thermal conductivity of 1 W / m · K or less. . 前記高熱伝導率層はＡｌ２Ｏ３またはＡｌＮの充填材を含んだ樹脂成形体であり、前記低熱伝導率層はＺｒＯ２またはＳｉＯ２の充填材を含んだ樹脂成形体であることを特徴とする請求項９記載の樹脂モールドモータ。 The high thermal conductivity layer is a resin molded body containing an Al 2 O 3 or AlN filler, and the low thermal conductivity layer is a resin molded body containing a ZrO 2 or SiO 2 filler. The resin mold motor according to claim 9.
JP2005016651A 2005-01-25 2005-01-25 Resin molded product, resin mold motor using it and manufacturing method of them Pending JP2006205373A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11496006B2 (en) 2017-10-10 2022-11-08 Mitsubishi Electric Corporation Stator, motor, compressor, air conditioning apparatus, and method for manufacturing stator

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Publication number Priority date Publication date Assignee Title
JPS62169607A (en) * 1986-01-22 1987-07-25 Nitsukuu Kogyo Kk Vacuum molding
JPH07246625A (en) * 1994-03-10 1995-09-26 Hitachi Chem Co Ltd Manufacture of electrical apparatus
JPH08294924A (en) * 1995-04-26 1996-11-12 Hitachi Chem Co Ltd Manufacture of electric apparatus
JPH09157440A (en) * 1995-12-13 1997-06-17 Mitsubishi Electric Corp Resin composition, resin-molded motor sealed with the same, resin sealing type semiconductor device and curing of the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169607A (en) * 1986-01-22 1987-07-25 Nitsukuu Kogyo Kk Vacuum molding
JPH07246625A (en) * 1994-03-10 1995-09-26 Hitachi Chem Co Ltd Manufacture of electrical apparatus
JPH08294924A (en) * 1995-04-26 1996-11-12 Hitachi Chem Co Ltd Manufacture of electric apparatus
JPH09157440A (en) * 1995-12-13 1997-06-17 Mitsubishi Electric Corp Resin composition, resin-molded motor sealed with the same, resin sealing type semiconductor device and curing of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11496006B2 (en) 2017-10-10 2022-11-08 Mitsubishi Electric Corporation Stator, motor, compressor, air conditioning apparatus, and method for manufacturing stator

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