JP2006202827A - 半導体パッケージ - Google Patents
半導体パッケージ Download PDFInfo
- Publication number
- JP2006202827A JP2006202827A JP2005010257A JP2005010257A JP2006202827A JP 2006202827 A JP2006202827 A JP 2006202827A JP 2005010257 A JP2005010257 A JP 2005010257A JP 2005010257 A JP2005010257 A JP 2005010257A JP 2006202827 A JP2006202827 A JP 2006202827A
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- JP
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- Prior art keywords
- semiconductor package
- wave absorber
- radio wave
- semiconductor chip
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
【解決手段】 半導体チップ3を搭載した半導体パッケージ基部1と、半導体チップを密封するように半導体パッケージ基部に被せる半導体パッケージ蓋2とより構成された半導体パッケージにおいて、半導体パッケージ蓋に複数の電波吸収体片10,11が貼付されたことを特徴とする。
【選択図】図1
Description
Claims (3)
- 半導体チップを搭載した半導体パッケージ基部と、前記半導体チップを密封するように前記半導体パッケージ基部に被せる半導体パッケージ蓋とより構成された半導体パッケージにおいて、前記半導体パッケージ蓋に複数の電波吸収体片が貼付されたことを特徴とする半導体パッケージ。
- 請求項1記載の半導体パッケージにおいて、前記複数の電波吸収体片は、前記半導体パッケージ蓋の内側面に貼付されたことを特徴とする半導体パッケージ。
- 請求項1または2記載の半導体パッケージにおいて、前記複数の電波吸収体片は、前記半導体チップの動作周波数帯における実質1波長の間隔で貼付されたことを特徴とする半導体パッケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005010257A JP4490832B2 (ja) | 2005-01-18 | 2005-01-18 | 半導体パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005010257A JP4490832B2 (ja) | 2005-01-18 | 2005-01-18 | 半導体パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006202827A true JP2006202827A (ja) | 2006-08-03 |
JP4490832B2 JP4490832B2 (ja) | 2010-06-30 |
Family
ID=36960582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005010257A Expired - Fee Related JP4490832B2 (ja) | 2005-01-18 | 2005-01-18 | 半導体パッケージ |
Country Status (1)
Country | Link |
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JP (1) | JP4490832B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109887904A (zh) * | 2019-04-16 | 2019-06-14 | 中国电子科技集团公司第十三研究所 | 一种毫米波芯片的封装结构及印刷电路板 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06236935A (ja) * | 1993-02-12 | 1994-08-23 | Nippon Telegr & Teleph Corp <Ntt> | マイクロ波回路用パッケージ |
JPH11233660A (ja) * | 1998-02-17 | 1999-08-27 | Kyocera Corp | 電子部品収納用パッケージ |
JP2000299397A (ja) * | 1999-04-16 | 2000-10-24 | Nec Corp | マイクロ波集積回路用パッケージ |
JP2003224218A (ja) * | 2002-01-29 | 2003-08-08 | Mitsubishi Electric Corp | 高周波回路パッケージ |
JP2004214577A (ja) * | 2003-01-09 | 2004-07-29 | Mitsubishi Electric Corp | マイクロ波集積回路実装ケース |
-
2005
- 2005-01-18 JP JP2005010257A patent/JP4490832B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06236935A (ja) * | 1993-02-12 | 1994-08-23 | Nippon Telegr & Teleph Corp <Ntt> | マイクロ波回路用パッケージ |
JPH11233660A (ja) * | 1998-02-17 | 1999-08-27 | Kyocera Corp | 電子部品収納用パッケージ |
JP2000299397A (ja) * | 1999-04-16 | 2000-10-24 | Nec Corp | マイクロ波集積回路用パッケージ |
JP2003224218A (ja) * | 2002-01-29 | 2003-08-08 | Mitsubishi Electric Corp | 高周波回路パッケージ |
JP2004214577A (ja) * | 2003-01-09 | 2004-07-29 | Mitsubishi Electric Corp | マイクロ波集積回路実装ケース |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109887904A (zh) * | 2019-04-16 | 2019-06-14 | 中国电子科技集团公司第十三研究所 | 一种毫米波芯片的封装结构及印刷电路板 |
Also Published As
Publication number | Publication date |
---|---|
JP4490832B2 (ja) | 2010-06-30 |
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